Display module and manufacturing method thereof

Abstract

The present application discloses a display module and its preparation method. The display module includes: a light-emitting substrate, including a substrate, a first driving circuit layer and a light-emitting layer arranged in sequence, the light-emitting layer including a plurality of light-emitting units, and the light-emitting units are electrically connected to the first driving circuit layer; a microfluidic functional layer, arranged on the side of the light-emitting layer away from the substrate, the microfluidic functional layer including a plurality of light-emitting pixel areas and a plurality of channel pixel areas, the light-emitting pixel areas have assembly grooves, the channel pixel areas do not have assembly grooves, and each light-emitting pixel area is arranged adjacent to at least one channel pixel area; the assembly groove runs through the microfluidic functional layer, and the opening of the assembly groove is arranged away from the light-emitting substrate, a quantum dot layer is arranged in the assembly groove, and the assembly groove is arranged in alignment with the light-emitting unit. Through the above arrangement, the problems of the difficulty in preparing the quantum dot layer of the display module in the related art, low preparation efficiency, complex process, and difficulty in achieving full-color display can be solved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module and a method for preparing the same. Background Art

[0002] In the field of display technology, the main pursuit is full-color display. The current mainstream methods mainly include direct display technology of red, green and blue primary colors and the use of ultraviolet or blue Micro LEDs as excitation light sources to excite quantum dots in the color conversion layer to achieve full-color display.

[0003] At present, the main methods for preparing quantum dot color conversion layers are: ① using inkjet printing technology to deposit quantum dots on a pre-deposited patterned area to prepare a color conversion layer; ② photolithography to prepare a color conversion layer; ③ nanoimprint technology to prepare a color conversion layer.

[0004] In the related art, display modules have problems such as difficulty in preparing the quantum dot layer, low preparation efficiency, complex process flow, and difficulty in achieving full-color display. Summary of the Invention

[0005] This application mainly provides a display module and a preparation method thereof to solve the problems in related technologies such as difficulty in preparing the quantum dot layer of the display module, low preparation efficiency, complex process, and difficulty in achieving full-color display.

[0006] To solve the above technical problems, a technical solution adopted in this application is to provide a display module, comprising:

[0007] A light-emitting substrate comprises a substrate, a first driving circuit layer and a light-emitting layer arranged in sequence; the light-emitting layer comprises a plurality of light-emitting units, and the light-emitting units are electrically connected to the first driving circuit layer;

[0008] A microfluidic functional layer is disposed on a side of the light-emitting layer away from the substrate; the microfluidic functional layer includes a plurality of light-emitting pixel regions and a plurality of channel pixel regions, the light-emitting pixel regions having assembly grooves, and the channel pixel regions not having assembly grooves; each light-emitting pixel region is disposed adjacent to at least one channel pixel region; the assembly grooves penetrate the microfluidic functional layer, and the openings of the assembly grooves are disposed away from the light-emitting substrate; a quantum dot layer is disposed within the assembly grooves;

[0009] Wherein, the assembly groove is arranged in alignment with the light emitting unit.

[0010] The microfluidic functional layer includes a second driving circuit layer, a first insulating layer, a first flat layer, a microfluidic electrode layer, a second insulating layer, and a hydrophobic layer arranged in sequence; the second driving circuit layer is arranged on a side of the hydrophobic layer close to the light-emitting substrate; the second driving circuit layer includes a plurality of thin-film transistors, and the microfluidic electrode layer is connected to the thin-film transistor vias;

[0011] The assembly groove sequentially passes through the hydrophobic layer, the second insulating layer, the microfluidic electrode layer, the first flat layer, the first insulating layer and the second driving circuit layer.

[0012] The second insulating layer is a light-impermeable layer, and / or the hydrophobic layer is a light-impermeable layer, and / or the first flat layer is a light-impermeable layer, and / or the first insulating layer is a light-impermeable layer.

[0013] Wherein, the microfluidic functional layer further includes a black matrix layer, and the assembly groove penetrates the black matrix layer;

[0014] The projection of the black matrix layer on the substrate does not overlap with the projection of the light-emitting unit on the substrate and they both cover the substrate.

[0015] The black matrix layer is located between the hydrophobic layer and the second insulating layer, and covers the surface of the second insulating layer away from the substrate.

[0016] Among them, the multiple light-emitting pixel areas and the multiple channel pixel areas are distributed in multiple rows, each row of the light-emitting pixel areas is arranged adjacent to at least one row of the channel pixel areas, and each row of the channel pixel areas forms a transport channel for the quantum dot solution.

[0017] Wherein, along the column direction, multiple rows of the light-emitting pixel regions and multiple rows of the channel pixel regions are alternately arranged.

[0018] Wherein, the display module further includes an encapsulation layer, and the encapsulation layer is provided on a side of the microfluidic functional layer away from the substrate;

[0019] The light-emitting layer includes the light-emitting unit and a second flat layer, wherein the second flat layer covers the light-emitting unit and the first driving circuit layer; the light-emitting side of the light-emitting unit is arranged toward the microfluidic functional layer.

[0020] Wherein, the light emitting unit is a light emitting diode;

[0021] Alternatively, the light emitting unit is an organic light emitting diode.

[0022] To solve the above technical problems, another technical solution adopted in this application is to provide a method for preparing a display module, comprising:

[0023] A light-emitting substrate is provided; wherein the light-emitting substrate comprises a substrate, a first driving circuit layer and a light-emitting layer arranged in sequence; the light-emitting layer comprises a plurality of light-emitting units, and the light-emitting units are electrically connected to the first driving circuit layer;

[0024] A microfluidic functional layer is prepared on a side of the light-emitting layer away from the substrate; wherein the microfluidic functional layer includes a plurality of light-emitting pixel regions and a plurality of channel pixel regions, the light-emitting pixel regions have assembly grooves, and the channel pixel regions do not have assembly grooves; each of the light-emitting pixel regions is disposed adjacent to at least one of the channel pixel regions; the assembly grooves are aligned with the light-emitting units, the assembly grooves penetrate the microfluidic functional layer, and the openings of the assembly grooves are disposed away from the light-emitting substrate;

[0025] Disposing a quantum dot solution on a surface of the microfluidic functional layer away from the substrate, and driving the quantum dot solution to move into the assembly groove;

[0026] An encapsulation layer is prepared on a side of the microfluidic functional layer away from the light-emitting substrate.

[0027] The beneficial effects of the present application are as follows: Different from the prior art, the present application discloses a display module and a preparation method thereof. The display module includes: a light-emitting substrate, including a substrate, a first drive circuit layer, and a light-emitting layer arranged in sequence, the light-emitting layer including a plurality of light-emitting units, and the light-emitting units are electrically connected to the first drive circuit layer; a microfluidic functional layer, arranged on a side of the light-emitting layer away from the substrate, the microfluidic functional layer including a plurality of light-emitting pixel areas and a plurality of channel pixel areas, the light-emitting pixel areas having assembly grooves, the channel pixel areas not having assembly grooves, and each light-emitting pixel area being arranged adjacent to at least one channel pixel area; the assembly groove passes through the microfluidic functional layer, and the opening of the assembly groove is arranged away from the light-emitting substrate, a quantum dot layer is arranged in the assembly groove, and the assembly groove is arranged in alignment with the light-emitting units. By arranging a microfluidic functional layer on one side of the light-emitting layer of the light-emitting substrate, the microfluidic functional layer and the light-emitting substrate are integrated into a display module, and the microfluidic functional layer is arranged to have a structure including multiple light-emitting pixel areas and multiple channel pixel areas. During the preparation of the display module, the channel pixel area of ​​the microfluidic functional layer can be directly used to transport the quantum dot solution to the assembly groove of the adjacent light-emitting pixel area, so as to directly form a quantum dot layer in the assembly groove of the light-emitting pixel area, thereby reducing the difficulty of preparing the quantum dot layer, improving the preparation efficiency, and making it easier to achieve full-color display. This solves the problems of difficulty in preparing the quantum dot layer of the display module in the related art, low preparation efficiency, complex process, and difficulty in achieving full-color display. At the same time, by making the microfluidic functional layer part of the display module, there is no need to use a separate transfer substrate to transfer the quantum dot solution to the light-emitting substrate, which saves process flow and cost and is conducive to improving the preparation efficiency of the display module. Moreover, the assembly groove is aligned with the light-emitting unit, so that the light emitted by the light-emitting unit can be irradiated into the quantum dot layer in the assembly groove, exciting the quantum dot layer to emit light of different colors, thereby facilitating the display module to achieve full-color display. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. Those skilled in the art can also derive other drawings based on these drawings without inventive work, among which:

[0029] Figure 1 1 is a schematic top view of a display module according to the first embodiment of the present application;

[0030] Figure 2 1 is a schematic top view of another embodiment of the display module provided in the first embodiment of the present application;

[0031] Figure 3 yes Figure 1 A schematic cross-sectional view of an embodiment of a display module is provided;

[0032] Figure 4 yes Figure 1 A schematic cross-sectional view of another embodiment of the display module is provided;

[0033] Figure 5 yes Figure 1 A schematic cross-sectional view of another embodiment of the display module is provided;

[0034] Figure 6 yes Figure 1 A schematic cross-sectional view of another embodiment of the provided display module;

[0035] Figure 7 1 is a flow chart of an embodiment of a method for manufacturing a display module according to a second embodiment of the present application;

[0036] Figure 8 yes Figure 7 A schematic structural diagram corresponding to step S1 of an embodiment of the provided method for preparing a display module;

[0037] Figure 9 yes Figure 7 A structural schematic diagram corresponding to another embodiment of step S1 of the provided method for preparing a display module;

[0038] Figure 10 yes Figure 7 A schematic structural diagram corresponding to step S2 of an embodiment of the provided method for preparing a display module;

[0039] Figure 11 yes Figure 7 A schematic structural diagram corresponding to another embodiment of step S2 of the provided method for preparing a display module;

[0040] Figure 12 yes Figure 7 A structural schematic diagram corresponding to another embodiment of step S2 of the provided method for preparing a display module;

[0041] Figure 13 yes Figure 7 A structural schematic diagram corresponding to step S2 of another embodiment of the provided method for preparing a display module;

[0042] Figure 14 yes Figure 7 A structural schematic diagram corresponding to step S3 of an embodiment of the provided method for preparing a display module;

[0043] Figure 15 yes Figure 7 A structural schematic diagram corresponding to another embodiment of step S3 of a method for preparing a display module is provided.

[0044] Figure Number:

[0045] 100, display module; 1, light-emitting substrate; 11, substrate; 12, first drive circuit layer; 13, light-emitting layer; 131, light-emitting unit; 132, second flat layer; 133, first electrode; 134, second electrode; 135, light-emitting functional layer; 2, microfluidic functional layer; 21, second drive circuit layer; 211, gate metal layer; 212, gate insulating layer; 213, active layer; 214, source and drain metal layer; 22, first insulating layer; 23, first A flat layer; 231, vias; 24, microfluidic electrode layer; 25, second insulating layer; 26, hydrophobic layer; 27, black matrix layer; 3, luminescent pixel area; 31, assembly groove; 32, first sub-luminescent pixel area; 33, second sub-luminescent pixel area; 34, third sub-luminescent pixel area; 4, channel pixel area; 5, quantum dot layer; 51, first sub-quantum dot layer; 52, second sub-quantum dot layer; 53, third sub-quantum dot layer; 6, encapsulation layer; 7, quantum dot solution. DETAILED DESCRIPTION

[0046] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0047] The terms "first", "second" and "third" in the embodiments of the present application are only used for descriptive purposes and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first", "second" and "third" may explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but may optionally also include steps or units that are not listed, or may optionally also include other steps or units inherent to these processes, methods, products or devices.

[0048] References to "embodiments" herein mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0049] See Figures 1 to 6 , Figure 1 1 is a schematic top view of a display module according to the first embodiment of the present application. Figure 2 1 is a schematic top view of another embodiment of the display module provided in the first embodiment of the present application. Figure 3 yes Figure 1 A cross-sectional schematic diagram of an embodiment of a display module is provided. Figure 4 yes Figure 1 A cross-sectional schematic diagram of another embodiment of the display module is provided. Figure 5 yes Figure 1 A cross-sectional schematic diagram of another embodiment of the display module is provided. Figure 6 yes Figure 1 A cross-sectional schematic diagram of another embodiment of a display module is provided.

[0050] See also Figures 1 to 6 The first embodiment of the present application provides a display module 100 , which includes a light-emitting substrate 1 and a microfluidic functional layer 2 , wherein the microfluidic functional layer 2 is disposed on one side of the light-emitting substrate 1 .

[0051] For details, see Figures 3 to 6The light-emitting substrate 1 includes a substrate 11, a first driving circuit layer 12, and a light-emitting layer 13, which are arranged in sequence. The light-emitting layer 13 is arranged on a side of the first driving circuit layer 12 away from the substrate 11. The light-emitting layer 13 includes a plurality of light-emitting units 131, which are electrically connected to the first driving circuit layer 12. The first driving circuit layer 12 is used to drive the light-emitting units 131 to emit light.

[0052] Specifically, in some embodiments, the light emitting unit 131 may be a light emitting diode (LED); or, see Figure 3 and Figure 4 In some embodiments, the light emitting unit 131 may be a Micro LED (Micro Light Emitting Diode), or, in some embodiments, see Figure 5 and Figure 6 The light emitting unit 131 may be an OLED (Organic Light Emitting Diode). For example, in one embodiment, the light emitting unit 131 is a blue Micro LED or a blue OLED, which can emit blue light.

[0053] See also Figures 3 to 6 The microfluidic functional layer 2 is arranged on the side of the light-emitting layer 13 of the light-emitting substrate 1 away from the substrate 11. The microfluidic functional layer 2 includes a plurality of light-emitting pixel areas 3 and a plurality of channel pixel areas 4. Each light-emitting pixel area 3 is arranged adjacent to at least one channel pixel area 4. The light-emitting pixel area 3 has an assembly groove 31, in which a quantum dot layer 5 is arranged, and the channel pixel area 4 does not have an assembly groove 31. Specifically, the assembly groove 31 is arranged in alignment with the light-emitting unit 131, and the assembly groove 31 passes through the microfluidic functional layer 2, and the opening of the assembly groove 31 is arranged away from the light-emitting substrate 1, that is, the opening of the assembly groove 31 is located on the surface of the microfluidic functional layer 2 away from the substrate 11. In a specific embodiment, the number of the assembly grooves 31 of the light-emitting pixel area 3 is equal to the number of the light-emitting units 131, and the assembly grooves 31 of the multiple light-emitting pixel areas 3 are arranged in a one-to-one correspondence with the multiple light-emitting units 131.

[0054] It can be understood that by setting a microfluidic functional layer 2 on one side of the light-emitting layer 13 of the light-emitting substrate 1, the microfluidic functional layer 2 and the light-emitting substrate 1 are integrated into a display module 100, and the microfluidic functional layer 2 is set to include a plurality of light-emitting pixel areas 3 and a plurality of channel pixel areas 4, each light-emitting pixel area 3 is adjacent to at least one channel pixel area 4, and the light-emitting pixel area 3 has an assembly groove 31, and the channel pixel area 4 does not have a structure of an assembly groove 31. During the preparation of the display module 100, the channel pixel area 4 of the microfluidic functional layer 2 can be directly used to transport the quantum dot solution into the assembly groove 31 of the adjacent light-emitting pixel area 3, and the quantum dot solution is cured and other treatments are performed to directly form a quantum dot layer 5 in the assembly groove 31 of the light-emitting pixel area 3, so as to facilitate The difficulty of preparing the quantum dot layer 5 is reduced, the preparation efficiency is improved, and full-color display is more easily achieved. This solves the problem of the difficulty, low preparation efficiency, and complex process of preparing the quantum dot layer 5 of the display module 100 in the related art, which makes it difficult to achieve full-color display. At the same time, the microfluidic functional layer 2 is included as part of the display module 100, eliminating the need for a separate transfer substrate to transfer the quantum dot solution to the light-emitting substrate 1, saving process flow and costs, and facilitating the improvement of the preparation efficiency of the display module 100. Moreover, the alignment of the assembly groove 31 and the light-emitting unit 131 allows the light emitted by the light-emitting unit 131 to irradiate the quantum dot layer 5 in the assembly groove 31, stimulating the quantum dot layer 5 to emit light of different colors, thereby facilitating the display module 100 to achieve full-color display. Through the above arrangement, the structure of the display module 100 can be simplified, and the preparation efficiency and display performance of the display module 100 can be improved.

[0055] For details, see Figures 3 to 6 In some embodiments, the microfluidic functional layer 2 includes a second drive circuit layer 21, a first insulating layer 22, a first planar layer 23, a microfluidic electrode layer 24, a second insulating layer 25, and a hydrophobic layer 26, which are sequentially arranged. The second drive circuit layer 21 is disposed on the side of the hydrophobic layer 26 that is closer to the light-emitting substrate 1. In one specific embodiment, the second drive circuit layer 21 is disposed on the surface of the light-emitting layer 13 of the light-emitting substrate 1 that is away from the substrate 11, and the hydrophobic layer 26 is disposed on the surface of the second insulating layer 25 that is away from the substrate 11. The assembly groove 31 of the light-emitting pixel area 3 sequentially penetrates the hydrophobic layer 26, the second insulating layer 25, the microfluidic electrode layer 24, the first planar layer 23, the first insulating layer 22, and the second drive circuit layer 21, exposing a portion of the surface of the light-emitting layer 13 that is away from the substrate 11. Specifically, the microfluidic electrode layer 24 can be a transparent electrode layer, for example, ITO (indium tin oxide).

[0056] The second driving circuit layer 21 includes multiple thin film transistors, and the microfluidic electrode layer 24 is connected to the thin film transistors through vias 231, so that the microfluidic electrode layer 24 is driven and controlled by the multiple thin film transistors of the second driving circuit layer 21, so as to drive the quantum dot solution located in the microfluidic functional layer 2 away from the surface of the substrate 11 from the channel pixel area 4 to the light-emitting pixel area 3 during the preparation of the display module 100, so as to transport the quantum dot solution into the assembly groove 31 and form a quantum dot layer 5 in the assembly groove 31.

[0057] For details, see Figures 3 to 6 In some embodiments, the thin film transistor of the second driving circuit layer 21 includes a gate metal layer 211, a gate insulating layer 212, an active layer 213 and a source-drain metal layer 214 stacked in sequence, the gate insulating layer 212 is arranged on the side of the gate metal layer 211 away from the substrate 11 and covers the gate metal layer 211 and the light-emitting layer 13, the active layer 213 is arranged corresponding to the position of the gate metal layer 211 and partially covers the gate insulating layer 212, the source-drain metal layer 214 is arranged on the side of the active layer 213 away from the substrate 11 and covers part of the active layer 213 and the gate insulating layer 212. Specifically, the source-drain metal layer 214 includes a source electrode (not marked in the figure) and a drain electrode (not marked in the figure) arranged at intervals, and a portion of the active layer 213 is exposed at the interval between the source electrode and the drain electrode. In one embodiment, the first insulating layer 22 is provided on the surface of the source / drain metal layer 214 away from the substrate 11 and covers the source / drain metal layer 214, the active layer 213 and the gate insulating layer 212. The first flat layer 23, the microfluidic electrode layer 24 and the second insulating layer 25 are sequentially covered on the side of the first insulating layer 22 away from the substrate 11. In one embodiment, as Figures 3 to 6 As shown, the assembly groove 31 sequentially penetrates the hydrophobic layer 26 , the second insulating layer 25 , the microfluidic electrode layer 24 , the first flat layer 23 , the first insulating layer 22 and the gate insulating layer 212 of the thin film transistor, and exposes a portion of the light-emitting layer 13 away from the surface of the substrate 11 .

[0058] The surface of the first planar layer 23 facing away from the substrate 11 is planar and has a via 231 extending through the first planar layer 23 and the first insulating layer 22, exposing a portion of the source and drain metal layer 214. Specifically, the microfluidic electrode layer 24 is disposed on the surface of the first planar layer 23 facing away from the substrate 11, covering the sidewalls of the via 231 and contacting the source and drain metal layer 214, thereby electrically connecting the microfluidic electrode layer 24 to the thin-film transistor.

[0059] In one embodiment, see Figures 3 to 6, the hydrophobic layer 26 is provided on the surface of the second insulating layer 25 away from the substrate 11, and the hydrophobic layer 26 can extend to the sidewalls of the assembly groove 31. For example, the hydrophobic layer 26 can completely cover the sidewalls of the assembly groove 31, or can also partially cover the sidewalls of the assembly groove 31. It can be understood that the first flat layer 23 is provided on the side of the first insulating layer 22 away from the substrate 11, so that the surfaces of the first flat layer 23, the microfluidic electrode layer 24 and the second insulating layer 25 away from the substrate 11 are all flat, and the hydrophobic layer 26 is provided on the surface of the second insulating layer 25 away from the substrate 11. In the process of preparing the display module 100, it is easy to improve the transportation efficiency of the quantum dot solution in the channel pixel area 4 on the surface of the microfluidic functional layer 2 away from the substrate 11, ensure that the quantum dot solution can be transported to the right place, improve the preparation efficiency of the quantum dot layer 5, and thus help improve the preparation efficiency of the display module 100.

[0060] In some embodiments, see Figures 3 and 4 , the microfluidic functional layer 2 also includes a black matrix layer 27, and the assembly groove 31 of the light-emitting pixel area 3 passes through the black matrix layer 27, and the projection of the black matrix layer 27 on the substrate 11 does not overlap with the projection of the light-emitting unit 131 on the substrate 11 and they jointly cover the substrate 11. It can be understood that by providing a black matrix layer 27 in the microfluidic functional layer 2, and the projection of the black matrix layer 27 on the substrate 11 does not overlap with the projection of the light-emitting unit 131 on the substrate 11 and they jointly cover the substrate 11, the black matrix layer 27 can block or absorb the light irradiated from the light-emitting unit 131 of the light-emitting substrate 1 to the microfluidic functional layer 2 except for the position of the assembly groove 31. The black matrix layer 27 has a better light-shielding effect, ensuring that the display module 100 can only emit light at the position of the assembly groove 31 of the light-emitting pixel area 3, thereby improving the luminous efficiency, reducing light scattering or loss, and avoiding crosstalk between light from different light-emitting pixel areas 3, which is beneficial to improving the display effect of the display module 100 and improving the user experience. Specifically, in one embodiment, as Figure 3 As shown, the light emitting unit 131 may be a Micro LED. In another embodiment, as shown in FIG. Figure 4 As shown, the light emitting unit 131 may be an OLED.

[0061] In one embodiment, see Figures 3 and 4The black matrix layer 27 is located between the hydrophobic layer 26 and the second insulating layer 25. Specifically, the black matrix layer 27 covers the surface of the second insulating layer 25 away from the substrate 11. The assembly groove 31 sequentially penetrates the hydrophobic layer 26, the black matrix layer 27, the second insulating layer 25, the microfluidic electrode layer 24, the first planar layer 23, the first insulating layer 22, and the gate insulating layer 212 of the thin film transistor, and exposes a portion of the surface of the light-emitting layer 13 away from the substrate 11. The black matrix layer 27 is disposed between the hydrophobic layer 26 and the second insulating layer 25 to better block or absorb light irradiated by the light-emitting unit 131 to the microfluidic functional layer 2 except at the location of the assembly groove 31. This effectively ensures that light is emitted from the display module 100 only at the location of the assembly groove 31 in the light-emitting pixel area 3, thereby improving the display effect of the display module 100.

[0062] In other embodiments, the black matrix layer 27 may also be disposed at other locations on the microfluidic functional layer 2. For example, the black matrix layer 27 may also be disposed between the second insulating layer 25 and the microfluidic electrode layer 24. The specific location of the black matrix layer 27 may be designed as needed, as long as the black matrix layer 27 can block or absorb light irradiated from the light-emitting unit 131 to the microfluidic functional layer 2 except for the assembly groove 31, thereby ensuring that the display module 100 can only emit light at the assembly groove 31 of the light-emitting pixel area 3. This application does not limit this.

[0063] In other embodiments, Figure 5 and Figure 6 As shown, the microfluidic functional layer 2 of the display module 100 may also not include the black matrix layer 27, and the first insulating layer 22 may be directly set as an opaque layer, and the first insulating layer 22 plays a light-shielding role, and / or, the first flat layer 23 may be set as an opaque layer, and the first flat layer 23 plays a light-shielding role; and / or, the second insulating layer 25 may be set as an opaque layer, and the second insulating layer 25 plays a light-shielding role, and / or, the hydrophobic layer 26 may be set as an opaque layer, and the hydrophobic layer 26 plays a light-shielding role. Specifically, in a specific embodiment, as Figure 5 As shown, the light emitting unit 131 of the display module 100 may be a Micro LED. In another embodiment, as shown in FIG. Figure 6 As shown, the light emitting unit 131 of the display module 100 may be an OLED.

[0064] It can be understood that since the assembly groove 31 passes through the microfluidic functional layer 2 along the thickness direction of the display module 100, the assembly groove 31 is arranged in alignment with the light-emitting unit 131, and by setting the first insulating layer 22 and / or the first flat layer 23 and / or the second insulating layer 25 and / or the hydrophobic layer 26 as an opaque layer, the microfluidic functional layer 2 located on one side of the light-emitting substrate 1 only has light passing through the assembly groove 31 position, and the light at other positions except the assembly groove 31 is blocked or absorbed by the first insulating layer 22 and / or the first flat layer 23 and / or the second insulating layer 25 and / or the hydrophobic layer 26, ensuring that the display module 100 can only emit light at the assembly groove 31 position, thereby improving the luminous efficiency, reducing light scattering or loss, and avoiding crosstalk between light from different light-emitting pixel areas 3, which is beneficial to improving the display effect of the display module 100 and enhancing the user experience. At the same time, by directly setting the first insulating layer 22 and / or the first flat layer 23 and / or the second insulating layer 25 and / or the hydrophobic layer 26 as an opaque layer, there is no need to set a separate light-shielding layer, such as the black matrix layer 27. This is conducive to simplifying the preparation process of the display module 100 and saving preparation costs. At the same time, it can also reduce the thickness of the display module 100, improve the quality of the display module 100, and meet more usage requirements.

[0065] In one specific embodiment, the first insulating layer 22, the first planar layer 23, the second insulating layer 25, and the hydrophobic layer 26 can all be configured as light-impermeable layers. Alternatively, the first insulating layer 22 and / or the first planar layer 23 and / or the second insulating layer 25 and / or the hydrophobic layer 26 can be configured as light-impermeable layers in addition to the black matrix layer 27. This configuration can more effectively prevent crosstalk between light from different pixels and light scattering or loss, more effectively ensuring that light is emitted only from the assembly groove 31 of the light-emitting pixel region 3 of the display module 100, thereby improving the display quality of the display module 100. The specific design can be as needed and is not limited in this application.

[0066] In some embodiments, as Figures 3 to 6As shown, the light-emitting layer 13 of the light-emitting substrate 1 includes a second flat layer 132 and a plurality of light-emitting units 131. The light-emitting units 131 are arranged on the side of the substrate 11 close to the microfluidic functional layer 2. Specifically, the light-emitting units 131 are arranged on the surface of the first driving circuit layer 12 close to the microfluidic functional layer 2. The second flat layer 132 covers the light-emitting units 131 and the first driving circuit layer 12. By covering the second flat layer 132 on the side of the light-emitting units 131 away from the substrate 11, the second flat layer 132 can be used to encapsulate and protect the light-emitting units 131 to prevent damage to the light-emitting units 131 and extend the service life of the light-emitting units 131. In addition, the surface of the second flat layer 132 away from the substrate 11 is flat, which makes it easier to prepare the microfluidic functional layer 2 on the surface of the second flat layer 132 of the light-emitting substrate 1 away from the substrate 11, thereby improving the preparation efficiency of the display module 100 and improving the display performance of the display module 100.

[0067] Specifically, the light emitting unit 131 includes a first electrode 133, a second electrode 134 and a light emitting functional layer 135. The first electrode 133 and the second electrode 134 may be the anode and cathode of the light emitting unit 131, respectively. Figure 3 and Figure 4 In some embodiments, the light-emitting unit 131 is a Micro LED, the first electrode 133 and the second electrode 134 are disposed on the surface of the first driving circuit layer 12 away from the substrate 11, the light-emitting functional layer 135 is disposed on the side of the first electrode 133 and the second electrode 134 away from the substrate 11, and the first electrode 133 and the second electrode 134 are electrically connected to the first driving circuit layer 12 respectively. Figure 5 and Figure 6 In some embodiments, the light-emitting unit 131 is an OLED, the first electrode 133 is arranged on the surface of the first driving circuit layer 12 away from the substrate 11, and is electrically connected to the first driving circuit layer 12, the light-emitting functional layer 135 is arranged between the first electrode 133 and the second electrode 134, and the second electrode 134 is located on the side of the light-emitting functional layer 135 away from the first electrode 133. Specifically, the light-emitting functional layer 135 is an organic light-emitting layer 13.

[0068] See also Figure 1 and Figure 2In some embodiments, the multiple light-emitting pixel areas 3 and the multiple channel pixel areas 4 of the microfluidic functional layer 2 of the display module 100 are distributed in multiple rows, and each row of light-emitting pixel areas 3 is adjacent to at least one row of channel pixel areas 4, and each row of channel pixel areas 4 serves as a delivery channel for the quantum dot solution. That is, each row of light-emitting pixel areas 3 can be adjacent to only one row of channel pixel areas 4. For example, along the column direction, a row of channel pixel areas 4 can be disposed on one side of a row of light-emitting pixel areas 3. Alternatively, each row of light-emitting pixel areas 3 can be adjacent to multiple rows of channel pixel areas 4. For example, a row of light-emitting pixel areas 3 can be adjacent to two rows of channel pixel areas 4, and the two rows of channel pixel areas 4 are disposed on opposite sides of the light-emitting pixel areas 3, respectively. Each row of channel pixel areas 4 forms a delivery channel, which delivers the quantum dot solution to the assembly groove 31 of the corresponding light-emitting pixel area 3 to facilitate the formation of the quantum dot layer 5.

[0069] Specifically, such as Figure 1 As shown, in one embodiment, multiple rows of light-emitting pixel areas 3 and multiple rows of channel pixel areas 4 are alternately distributed along the column direction. The number of light-emitting pixel areas 3 can be equal to the number of channel pixel areas 4. During the preparation of the display module 100, a row of channel pixel areas 4 adjacent to each row of light-emitting pixel areas 3 can transport the quantum dot solution to the assembly groove 31 of the corresponding light-emitting pixel area 3, so as to form the quantum dot layer 5 in the assembly groove 31. Each light-emitting pixel area 3 has a corresponding channel pixel area 4 that transports the quantum dot solution to its assembly groove 31 to form the quantum dot layer 5. Multiple rows of channel pixel areas 4 can simultaneously transport the quantum dot solution to the corresponding multiple rows of light-emitting pixel areas 3, which is conducive to improving the transportation efficiency and thus improving the preparation efficiency of the display module 100.

[0070] In another embodiment, Figure 2As shown, two rows of light-emitting pixel areas 3 can be arranged between two adjacent rows of channel pixel areas 4, that is, each row of light-emitting pixel areas 3 can be arranged adjacent to a row of channel pixel areas 4. During the preparation process of the display module 100, after the microfluidic functional layer 2 is prepared and formed, the quantum dot solution can be transported from the same row of channel pixel areas 4 to the assembly grooves 31 of the two adjacent rows of light-emitting pixel areas 3. Specifically, a row of channel pixel areas 4 can first transport the quantum dot solution to the assembly grooves 31 of one of the adjacent rows of light-emitting pixel areas 3. After transporting the quantum dot solution to the assembly grooves 31 of the row of light-emitting pixel areas 3, the quantum dot solution can be transported to the assembly grooves 31 of the other adjacent row of light-emitting pixel areas 3. That is, the timing of transporting the quantum dot solution to the assembly grooves 31 of the two adjacent rows of light-emitting pixel areas 3 to the row of channel pixel areas 4 is different. It can be understood that by setting two rows of luminous pixel areas 3 between two adjacent rows of channel pixel areas 4, the two rows of luminous pixel areas 3 located on both sides of the same row of channel pixel areas 4 can share the row of channel pixel areas 4 as a transmission channel, which is beneficial to reducing the number of rows of channel pixel areas 4, thereby improving the distribution rate of the luminous pixel areas 3 of the display module 100, and further beneficial to improving the pixel aperture ratio of the display module 100 and improving the display performance of the display module 100.

[0071] like Figure 1 and Figure 2 As shown, in a specific embodiment, the shapes of the light-emitting pixel area 3 and the channel pixel area 4 are both rectangular. In other embodiments, the shapes of the light-emitting pixel area 3 and the channel pixel area 4 can be any shape such as a rectangle, a rhombus, a square, a regular hexagon, etc. The light-emitting pixel area 3 and the channel pixel area 4 may not be distributed in multiple rows and can be designed as needed, as long as it is ensured that the quantum dot solution can be transported to the assembly groove 31 of the light-emitting pixel area 3 through the channel pixel area 4.

[0072] In some embodiments, the luminous pixel area 3 of the microfluidic functional layer 2 includes multiple first sub-luminous pixel areas 32, multiple second sub-luminous pixel areas 33 and multiple third sub-luminous pixel areas 34, and the first sub-luminous pixel area 32 is provided with a first sub-quantum dot layer 51 in the assembly groove 31, the second sub-quantum dot layer 52 is provided in the assembly groove 31 of the second sub-luminous pixel area 33, and the third sub-quantum dot layer 53 is provided in the assembly groove 31 of the third sub-luminous pixel area 34; the color of the first sub-quantum dot layer 51 is the first color, the color of the second sub-quantum dot layer 52 is the second color, and the color of the third sub-quantum dot layer 53 is the third color.

[0073] like Figure 1 and Figure 2As shown, in a specific embodiment, within each row of light-emitting pixel areas 3, the colors of the quantum dot layers 5 in the assembly grooves 31 of each three adjacent light-emitting pixel areas 3 are different. Specifically, each three adjacent light-emitting pixel areas 3 can be the first sub-light-emitting pixel area 32, the second sub-light-emitting pixel area 33, and the third sub-light-emitting pixel area 34, respectively. The quantum dot layers 5 in the assembly grooves 31 of the first sub-light-emitting pixel area 32, the second sub-light-emitting pixel area 33, and the third sub-light-emitting pixel area 34 are respectively the first sub-quantum dot layer 51, the second sub-quantum dot layer 52, and the third sub-quantum dot layer 53, wherein the colors of the first sub-quantum dot layer 51, the second sub-quantum dot layer 52, and the third sub-quantum dot layer 53 are respectively the first color, the second color, and the third color. The first sub-quantum dot layer 51, the second sub-quantum dot layer 52, and the third sub-quantum dot layer 53 can be excited by the light emitted by the light-emitting unit 131 to emit light of different colors.

[0074] In one specific embodiment, the first color, the second color and the third color can be red, green and blue respectively; in another specific embodiment, the third sub-quantum dot layer 53 can also be a colorless quantum dot layer 5. For example, the light-emitting unit 131 is set to a blue Micro LED or a blue OLED, and the blue light emitted by the light-emitting unit 131 can be directly emitted through the colorless third sub-quantum dot layer 53, so that the third sub-quantum dot layer 53 can emit blue light, so that the display module 100 can achieve full-color display.

[0075] See also Figures 3 to 6 In some embodiments, the display module 100 further includes an encapsulation layer 6, which is disposed on the side of the microfluidic functional layer 2 remote from the light-emitting substrate 1. Specifically, the encapsulation layer 6 is disposed on the surface of the hydrophobic layer 26 of the microfluidic functional layer 2 remote from the substrate 11. The encapsulation layer 6 is a light-transmitting layer to ensure that light emitted by the quantum dot layer 5 within the assembly groove 31 can be emitted through the encapsulation layer 6. The encapsulation layer 6 can provide encapsulation and protection for the display module 100, preventing harmful substances such as oxygen and water vapor from entering the display module 100, thereby helping to extend the service life of the display module 100.

[0076] See Figures 7 to 15 , Figure 7 FIG. 1 is a flow chart of an embodiment of a method for manufacturing a display module according to a second embodiment of the present application. Figure 8 yes Figure 7 The structural diagram corresponding to step S1 of the display module manufacturing method provided is as follows: Figure 9 yes Figure 7 A structural schematic diagram corresponding to another embodiment of step S1 of the method for preparing a display module is provided. Figure 10 yes Figure 7 The structural diagram corresponding to step S2 of the display module manufacturing method provided is as follows: Figure 11 yes Figure 7 A structural schematic diagram corresponding to another embodiment of step S2 of the method for preparing a display module is provided. Figure 12 yes Figure 7 A structural schematic diagram corresponding to another embodiment of step S2 of the method for preparing a display module is provided. Figure 13 yes Figure 7 The structural diagram corresponding to step S2 of another embodiment of the method for preparing the display module provided is as follows: Figure 14 yes Figure 7 A structural diagram corresponding to step S3 of an embodiment of the display module manufacturing method provided, Figure 15 yes Figure 7 A structural schematic diagram corresponding to another embodiment of step S3 of a method for preparing a display module is provided.

[0077] See also Figures 7 to 15 The second embodiment of the present application provides a method for preparing a display module 100, which is used to prepare any one of the display modules 100 described above. Specifically, in some embodiments, as shown in FIG. Figure 7 As shown, the manufacturing method of the display module 100 includes:

[0078] S1: Provide a light-emitting substrate 1.

[0079] Specifically, first, a light-emitting substrate 1 is provided. The light-emitting substrate 1 includes a substrate 11, a first drive circuit layer 12, and a light-emitting layer 13, which are arranged in sequence. The light-emitting layer 13 is arranged on a side of the first drive circuit layer 12 away from the substrate 11. The light-emitting layer 13 includes a plurality of light-emitting units 131. The light-emitting units 131 are electrically connected to the first drive circuit layer 12, and the first drive circuit layer 12 is used to drive the light-emitting units 131 to emit light.

[0080] Specifically, in some embodiments, the light emitting unit 131 may be a light emitting diode (LED); or, see Figure 8 In some embodiments, the light emitting unit 131 may be a Micro LED (Micro Light Emitting Diode), or, in some embodiments, see Figure 9 The light emitting unit 131 may be an OLED (Organic Light Emitting Diode). For example, in one embodiment, the light emitting unit 131 is a blue Micro LED or a blue OLED, which can emit blue light.

[0081] Specifically, such as Figures 8 and 9As shown, the light-emitting layer 13 of the light-emitting substrate 1 includes a second flat layer 132 and a plurality of light-emitting units 131. The light-emitting units 131 are arranged on the side of the substrate 11 close to the microfluidic functional layer 2. Specifically, the light-emitting units 131 are arranged on the surface of the first driving circuit layer 12 close to the microfluidic functional layer 2. The second flat layer 132 covers the light-emitting units 131 and the first driving circuit layer 12. By covering the second flat layer 132 on the side of the light-emitting units 131 away from the substrate 11, the second flat layer 132 can be used to encapsulate and protect the light-emitting units 131 to prevent damage to the light-emitting units 131 and extend the service life of the light-emitting units 131. In addition, the surface of the second flat layer 132 away from the substrate 11 is flat, which makes it easier to prepare the microfluidic functional layer 2 on the surface of the second flat layer 132 of the light-emitting substrate 1 away from the substrate 11 in subsequent processes, thereby improving the production efficiency of the display module 100 and improving the display performance of the display module 100.

[0082] Specifically, the light emitting unit 131 includes a first electrode 133, a second electrode 134 and a light emitting functional layer 135. The first electrode 133 and the second electrode 134 may be the anode and cathode of the light emitting unit 131, respectively. Figure 8 In some embodiments, the light-emitting unit 131 is a Micro LED, the first electrode 133 and the second electrode 134 are disposed on the surface of the first driving circuit layer 12 away from the substrate 11, the light-emitting functional layer 135 is disposed on the side of the first electrode 133 and the second electrode 134 away from the substrate 11, and the first electrode 133 and the second electrode 134 are electrically connected to the first driving circuit layer 12 respectively. Figure 9 In some embodiments, the light-emitting unit 131 is an OLED, the first electrode 133 is arranged on the surface of the first driving circuit layer 12 away from the substrate 11, and is electrically connected to the first driving circuit layer 12, the light-emitting functional layer 135 is arranged between the first electrode 133 and the second electrode 134, and the second electrode 134 is located on the side of the light-emitting functional layer 135 away from the first electrode 133. Specifically, the light-emitting functional layer 135 is an organic light-emitting layer 13.

[0083] S2: preparing a microfluidic functional layer 2 on the side of the light-emitting layer 13 away from the substrate 11 .

[0084] For details, see Figures 10 to 13A microfluidic functional layer 2 is prepared on the side of the light-emitting layer 13 of the light-emitting substrate 1 away from the substrate 11, wherein the microfluidic functional layer 2 includes a plurality of light-emitting pixel areas 3 and a plurality of channel pixel areas 4, and the light-emitting pixel area 3 is arranged adjacent to at least one channel pixel area 4. The light-emitting pixel area 3 has an assembly groove 31, and the assembly groove 31 is arranged in alignment with the light-emitting unit 131 of the light-emitting substrate 1, and the channel pixel area 4 does not have an assembly groove 31. The assembly groove 31 passes through the microfluidic functional layer 2, and the opening of the assembly groove 31 is arranged away from the light-emitting substrate 1, that is, the opening of the assembly groove 31 is located on the surface of the microfluidic functional layer 2 away from the substrate 11. In a specific embodiment, the number of the assembly grooves 31 of the light-emitting pixel area 3 is equal to the number of the light-emitting units 131, and the assembly grooves 31 of the multiple light-emitting pixel areas 3 are arranged in a one-to-one correspondence with the multiple light-emitting units 131.

[0085] It can be understood that by preparing a microfluidic functional layer 2 on the side of the light-emitting layer 13 of the light-emitting substrate 1 away from the substrate 11, the microfluidic functional layer 2 is integrated with the light-emitting substrate 1, and the microfluidic functional layer 2 is configured to include a plurality of light-emitting pixel areas 3 and a plurality of channel pixel areas 4. Each light-emitting pixel area 3 is adjacent to at least one channel pixel area 4, and the light-emitting pixel area 3 has an assembly groove 31, while the channel pixel area 4 does not have a structure of an assembly groove 31. In the subsequent process, the channel pixel area 4 of the microfluidic functional layer 2 can be directly used to transport the quantum dot solution 7 into the assembly groove 31 of the light-emitting pixel area 3 adjacent thereto (see Figure 14 and Figure 15 ), by curing the quantum dot solution 7, etc., to directly form the quantum dot layer 5 in the assembly groove 31 of the light-emitting pixel area 3 (see Figures 3 to 6 ), which is convenient for reducing the difficulty of preparing the quantum dot layer 5, improving the preparation efficiency, and being more convenient for achieving full-color display, and solves the problems in the related art that the quantum dot layer 5 of the display module 100 is difficult to prepare, has low preparation efficiency, is complex in process, and is difficult to achieve full-color display; at the same time, the prepared microfluidic functional layer 2 is a part of the prepared display module 100, and there is no need to use a separate transfer substrate to transfer the quantum dot solution 7 to the light-emitting substrate 1, which saves process flow and cost, and is conducive to improving the preparation efficiency of the display module 100; and the assembly groove 31 is aligned with the light-emitting unit 131 of the light-emitting substrate 1. In the subsequent process, the light emitted by the light-emitting unit 131 can be irradiated into the quantum dot layer 5 prepared in the assembly groove 31, and the quantum dot layer 5 is stimulated to emit light of different colors, which is convenient for the prepared display module 100 to achieve full-color display.

[0086] For details, see Figures 10 to 13In some embodiments, the microfluidic functional layer 2 includes a second drive circuit layer 21, a first insulating layer 22, a first planar layer 23, a microfluidic electrode layer 24, a second insulating layer 25, and a hydrophobic layer 26, arranged in sequence. The second drive circuit layer 21 is disposed on the side of the hydrophobic layer 26 that is closest to the light-emitting substrate 1. In one specific embodiment, the second drive circuit layer 21 is disposed on the surface of the light-emitting layer 13 of the light-emitting substrate 1 that is away from the substrate 11, and the hydrophobic layer 26 covers the surface of the second insulating layer 25 that is away from the substrate 11. The assembly groove 31 of the light-emitting pixel region 3 sequentially penetrates the hydrophobic layer 26, the second insulating layer 25, the microfluidic electrode layer 24, the first planar layer 23, the first insulating layer 22, and the second drive circuit layer 21, exposing a portion of the surface of the light-emitting layer 13 that is away from the substrate 11. Specifically, the assembly groove 31 exposes the surface of the second planar layer 132 that is away from the substrate 11, corresponding to the position of the light-emitting unit 131. Specifically, the microfluidic electrode layer 24 can be a transparent electrode layer, for example, ITO (indium tin oxide).

[0087] The second driving circuit layer 21 includes a plurality of thin film transistors. The microfluidic electrode layer 24 is connected to the thin film transistors through the vias 231. The microfluidic electrode layer 24 is driven and controlled by the plurality of thin film transistors of the second driving circuit layer 21. In the subsequent process, the quantum dot solution 7 located on the microfluidic functional layer 2 away from the surface of the substrate 11 is driven to be transported from the channel pixel area 4 to the light-emitting pixel area 3, so as to transport the quantum dot solution 7 to the assembly groove 31, thereby forming a quantum dot layer 5 in the assembly groove 31 (see Figures 3 to 6 ).

[0088] For details, see Figures 10 to 13 In some embodiments, the thin film transistor of the second driving circuit layer 21 includes a gate metal layer 211, a gate insulating layer 212, an active layer 213 and a source-drain metal layer 214 stacked in sequence, the gate insulating layer 212 is arranged on the side of the gate metal layer 211 away from the substrate 11 and covers the gate metal layer 211 and the light-emitting layer 13, the active layer 213 is arranged corresponding to the position of the gate metal layer 211 and partially covers the gate insulating layer 212, the source-drain metal layer 214 is arranged on the side of the active layer 213 away from the substrate 11 and covers part of the active layer 213 and the gate insulating layer 212. Specifically, the source-drain metal layer 214 includes a source electrode (not marked in the figure) and a drain electrode (not marked in the figure) arranged at intervals, and a portion of the active layer 213 is exposed at the interval between the source electrode and the drain electrode. In one embodiment, the first insulating layer 22 is provided on the surface of the source / drain metal layer 214 away from the substrate 11 and covers the source / drain metal layer 214, the active layer 213 and the gate insulating layer 212. The first flat layer 23, the microfluidic electrode layer 24 and the second insulating layer 25 are sequentially covered on the side of the first insulating layer 22 away from the substrate 11. In one embodiment, as Figures 10 to 13As shown, the assembly groove 31 sequentially penetrates the hydrophobic layer 26 , the second insulating layer 25 , the microfluidic electrode layer 24 , the first flat layer 23 , the first insulating layer 22 and the gate insulating layer 212 of the thin film transistor, and exposes a portion of the second flat layer 132 away from the surface of the substrate 11 .

[0089] The surface of the first planar layer 23 facing away from the substrate 11 is planar and has a via 231 extending through the first planar layer 23 and the first insulating layer 22, exposing a portion of the source and drain metal layer 214. Specifically, the microfluidic electrode layer 24 is disposed on the surface of the first planar layer 23 facing away from the substrate 11, covering the sidewalls of the via 231 and contacting the source and drain metal layer 214, thereby electrically connecting the microfluidic electrode layer 24 to the thin-film transistor.

[0090] In one embodiment, see Figures 10 to 13 The hydrophobic layer 26 is provided on the surface of the second insulating layer 25 away from the substrate 11. The hydrophobic layer 26 can extend to the sidewalls of the assembly groove 31. For example, the hydrophobic layer 26 can completely cover the sidewalls of the assembly groove 31, or can also partially cover the sidewalls of the assembly groove 31. It can be understood that the first flat layer 23 is provided on the side of the first insulating layer 22 away from the substrate 11, so that the surfaces of the first flat layer 23, the microfluidic electrode layer 24 and the second insulating layer 25 away from the substrate 11 are all flat. The hydrophobic layer 26 is provided on the surface of the second insulating layer 25 away from the substrate 11. In the subsequent process, it is easy to improve the transportation efficiency of the quantum dot solution 7 in the channel pixel area 4 on the surface of the microfluidic functional layer 2 away from the substrate 11, ensure that the quantum dot solution 7 can be transported to the right place, improve the preparation efficiency of the quantum dot layer 5, and thus help improve the preparation efficiency of the display module 100.

[0091] In some embodiments, see Figure 10 and Figure 12The microfluidic functional layer 2 also includes a black matrix layer 27. The assembly groove 31 of the light-emitting pixel area 3 penetrates the black matrix layer 27. The projection of the black matrix layer 27 on the substrate 11 does not overlap with the projection of the light-emitting unit 131 on the substrate 11 and they jointly cover the substrate 11. It can be understood that by setting a black matrix layer 27 in the microfluidic functional layer 2, and the projection of the black matrix layer 27 on the substrate 11 does not overlap with the projection of the light-emitting unit 131 on the substrate 11 and they jointly cover the substrate 11, after the display module 100 is prepared in the subsequent process, the black matrix layer 27 can block or absorb the light irradiated from the light-emitting unit 131 of the light-emitting substrate 1 to the microfluidic functional layer 2 except for the assembly groove 31 position. The black matrix layer 27 has a better light-shielding effect, ensuring that the prepared display module 100 can only emit light at the assembly groove 31 position of the light-emitting pixel area 3, thereby improving the luminous efficiency, reducing light scattering or loss, and avoiding crosstalk between light from different light-emitting pixel areas 3, which is beneficial to improving the display effect of the prepared display module 100 and improving the user experience. Specifically, in one embodiment, if Figure 10 As shown, the light emitting unit 131 may be a Micro LED. In another embodiment, as shown in FIG. Figure 12 As shown, the light emitting unit 131 may be an OLED.

[0092] In one embodiment, see Figures 10 to 12 The black matrix layer 27 is located between the hydrophobic layer 26 and the second insulating layer 25. Specifically, the black matrix layer 27 covers the surface of the second insulating layer 25 away from the substrate 11. The assembly groove 31 sequentially penetrates the hydrophobic layer 26, the black matrix layer 27, the second insulating layer 25, the microfluidic electrode layer 24, the first planar layer 23, the first insulating layer 22, and the gate insulating layer 212 of the thin film transistor, and exposes a portion of the surface of the light-emitting layer 13 away from the substrate 11. The black matrix layer 27 is disposed between the hydrophobic layer 26 and the second insulating layer 25. After the display module 100 is fabricated in subsequent manufacturing processes, it effectively blocks or absorbs light irradiated by the light-emitting unit 131 to the microfluidic functional layer 2 except at the assembly groove 31. This effectively ensures that light is emitted from the display module 100 only at the assembly groove 31 in the light-emitting pixel region 3, thereby improving the display effect of the display module 100.

[0093] In other embodiments, the black matrix layer 27 may also be disposed at other positions of the microfluidic functional layer 2. For example, the black matrix layer 27 may also be disposed between the second insulating layer 25 and the microfluidic electrode layer 24. The specific location of the black matrix layer 27 may be designed as needed, and this application does not limit this.

[0094] In other embodiments, Figure 11 and Figure 13As shown, the microfluidic functional layer 2 of the display module 100 may also not include the black matrix layer 27, and the first insulating layer 22 may be directly set as a light-proof layer, and / or the first flat layer 23 may be set as a light-proof layer, and / or the second insulating layer 25 may be set as a light-proof layer, and / or the hydrophobic layer 26 may be set as a light-proof layer, and the first insulating layer 22 and / or the first flat layer 23 and / or the second insulating layer 25 and / or the hydrophobic layer 26 may play a light-shielding role. Specifically, in a specific embodiment, as Figure 11 As shown, the light emitting unit 131 of the display module 100 may be a Micro LED. In another embodiment, as shown in FIG. Figure 13 As shown, the light emitting unit 131 of the display module 100 may be an OLED.

[0095] It can be understood that since the assembly groove 31 passes through the microfluidic functional layer 2 along the thickness direction of the display module 100, the assembly groove 31 is arranged in alignment with the light-emitting unit 131. By setting the first insulating layer 22 and / or the first flat layer 23 and / or the second insulating layer 25 and / or the hydrophobic layer 26 as an opaque layer, after the display module 100 is prepared in the subsequent process, the microfluidic functional layer 2 located on one side of the light-emitting substrate 1 only has light passing through the assembly groove 31 position, and the light at other positions except the assembly groove 31 is blocked or absorbed by the first insulating layer 22 and / or the first flat layer 23 and / or the second insulating layer 25 and / or the hydrophobic layer 26, ensuring that the prepared display module 100 can only emit light at the assembly groove 31 position, thereby improving the luminous efficiency, reducing light scattering or loss, and avoiding crosstalk between light from different light-emitting pixel areas 3, which is beneficial to improving the display effect of the prepared display module 100 and enhancing the user experience. At the same time, by directly setting the first insulating layer 22 and / or the first flat layer 23 and / or the second insulating layer 25 and / or the hydrophobic layer 26 as an opaque layer, there is no need to set a separate light-shielding layer, such as the black matrix layer 27. This is beneficial to simplify the preparation process of the display module 100 and save preparation costs. At the same time, the thickness of the prepared display module 100 can also be reduced, thereby improving the quality of the display module 100 and meeting more usage requirements.

[0096] In one specific embodiment, the first insulating layer 22, the first flat layer 23, the second insulating layer 25, and the hydrophobic layer 26 can all be configured as light-impermeable layers. Alternatively, the first insulating layer 22 and / or the first flat layer 23 and / or the second insulating layer 25 and / or the hydrophobic layer 26 can be configured as light-impermeable layers in addition to the black matrix layer 27. This configuration can more effectively prevent crosstalk between light from different pixels and light scattering or loss, more effectively ensuring that the prepared display module 100 only emits light at the assembly groove 31 of the light-emitting pixel region 3, thereby improving the display effect of the display module 100. The specific design can be as needed and is not limited in this application.

[0097] S3 : placing a quantum dot solution 7 on the surface of the microfluidic functional layer 2 away from the substrate 11 , and driving the quantum dot solution 7 to move into the assembly groove 31 .

[0098] For details, see Figure 14 and Figure 15 A quantum dot solution 7 is disposed on the surface of the microfluidic functional layer 2 away from the substrate 11. In one embodiment, the quantum dot solution 7 is disposed on the surface of the hydrophobic layer 26 away from the substrate 11. The second driving circuit layer 21 drives and controls the microfluidic electrode layer 24, which in turn drives the quantum dot solution 7 to move on the surface of the microfluidic functional layer 2 away from the substrate 11, thereby transporting the quantum dot solution 7 to the assembly groove 31 of the light-emitting pixel area 3 via the channel pixel area 4. By directly using the microfluidic electrode layer 24 of the microfluidic functional layer 2 to drive the quantum dot solution 7 to move within the channel pixel area 4, the quantum dot solution 7 can be directly transported to the assembly groove 31, thereby facilitating the formation of the quantum dot layer 5 in the assembly groove 31 (see Figures 3 to 6 ), which reduces the difficulty of preparing the quantum dot layer 5, improves the preparation efficiency, and is more convenient for achieving full-color display. It solves the problem in the related art that the quantum dot layer 5 of the display module 100 is difficult to prepare, has low preparation efficiency, is complex in process, and is difficult to achieve full-color display.

[0099] Specifically, in some embodiments, see Figure 1 and Figure 2The plurality of light-emitting pixel regions 3 and the plurality of channel pixel regions 4 are distributed in multiple rows, each row of light-emitting pixel regions 3 is adjacent to at least one row of channel pixel regions 4, and each row of channel pixel regions 4 serves as a delivery channel for the quantum dot solution 7. That is, each row of light-emitting pixel regions 3 can be adjacent to only one row of channel pixel regions 4. For example, along the column direction, a row of channel pixel regions 4 can be disposed on one side of a row of light-emitting pixel regions 3. Alternatively, each row of light-emitting pixel regions 3 can be adjacent to multiple rows of channel pixel regions 4. For example, a row of light-emitting pixel regions 3 can be adjacent to two rows of channel pixel regions 4, and the two rows of channel pixel regions 4 are disposed corresponding to opposite sides of the light-emitting pixel regions 3. Each row of channel pixel regions 4 forms a delivery channel, which facilitates the delivery of the quantum dot solution 7 from the delivery channel to the assembly groove 31 of the corresponding light-emitting pixel region 3, so as to form the quantum dot layer 5.

[0100] Specifically, in one embodiment, Figure 1 As shown, multiple light-emitting pixel regions 3 and multiple channel pixel regions 4 are alternately distributed along the column direction. The number of light-emitting pixel regions 3 can be equal to the number of channel pixel regions 4. A row of channel pixel regions 4 adjacent to each row of light-emitting pixel regions 3 can transport the quantum dot solution 7 to the assembly groove 31 of the corresponding light-emitting pixel region 3, so as to form a quantum dot layer 5 in the assembly groove 31. Each light-emitting pixel region 3 has a corresponding channel pixel region 4 that transports the quantum dot solution 7 to its assembly groove 31 to form a quantum dot layer 5. Multiple rows of channel pixel regions 4 can simultaneously transport the quantum dot solution 7 to the corresponding multiple rows of light-emitting pixel regions 3, which is conducive to improving the transportation efficiency and thus improving the production efficiency of the display module 100.

[0101] In another embodiment, Figure 2 As shown, two rows of light-emitting pixel areas 3 may be provided between two adjacent rows of channel pixel areas 4. That is, each row of light-emitting pixel areas 3 may be provided adjacent to a row of channel pixel areas 4, and the quantum dot solution 7 may be delivered from the same row of channel pixel areas 4 to the assembly grooves 31 of the two adjacent rows of light-emitting pixel areas 3. Specifically, a row of channel pixel areas 4 may first deliver the quantum dot solution 7 to the assembly grooves 31 of one adjacent row of light-emitting pixel areas 3. After delivering the quantum dot solution 7 to the assembly grooves 31 of the first row of light-emitting pixel areas 3, the quantum dot solution 7 may be delivered to the assembly grooves 31 of the second adjacent row of light-emitting pixel areas 3. That is, the timing of delivering the quantum dot solution 7 to the assembly grooves 31 of the two adjacent rows of light-emitting pixel areas 3 to the first row of channel pixel areas 4 is different. It can be understood that by setting two rows of luminous pixel areas 3 between two adjacent rows of channel pixel areas 4, the two rows of luminous pixel areas 3 located on both sides of the same row of channel pixel areas 4 can share the row of channel pixel areas 4 as a transmission channel, which is beneficial to reducing the number of rows of channel pixel areas 4, thereby improving the distribution rate of the luminous pixel areas 3 of the display module 100, and further beneficial to improving the pixel aperture ratio of the display module 100 and improving the display performance of the display module 100.

[0102] like Figure 1 and Figure 2 As shown, in a specific embodiment, the shapes of the luminescent pixel area 3 and the channel pixel area 4 are both rectangular. In other embodiments, the shapes of the luminescent pixel area 3 and the channel pixel area 4 can be any shape such as a rectangle, a rhombus, a square, a regular hexagon, etc. The luminescent pixel area 3 and the channel pixel area 4 may not be distributed in multiple rows and can be designed as needed, as long as it is ensured that the quantum dot solution 7 can be transported to the assembly groove 31 of the luminescent pixel area 3 through the channel pixel area 4.

[0103] Specifically, in some embodiments, after the step of driving the quantum dot solution 7 to move into the assembly tank 31 in step S3, the method further includes:

[0104] The quantum dot solution 7 in the assembly groove 31 is solidified to form the quantum dot layer 5 .

[0105] Specifically, after the quantum dot solution 7 is transported into the assembly groove 31 of the light-emitting pixel area 3 by using the channel pixel area 4 of the microfluidic functional layer 2, the quantum dot solution 7 in the assembly groove 31 can be solidified or subjected to other treatments to remove the solvent in the quantum dot solution 7, and finally a quantum dot layer 5 (such as Figures 3 to 6 As shown), so that the quantum dot layer 5 in the assembly groove 31 can emit light under the excitation of the light emitted by the light-emitting unit 131, so that the prepared display module 100 can realize the image display function and realize full-color display.

[0106] In some embodiments, the luminescent pixel area 3 of the microfluidic functional layer 2 includes multiple first sub-luminescent pixel areas 32, multiple second sub-luminescent pixel areas 33 and multiple third sub-luminescent pixel areas 34. Specifically, in the process of using the channel pixel area 4 to transport the quantum dot solution 7 into the assembly groove 31 of the corresponding luminescent pixel area 3, the first color quantum dot solution 7 can be first transported into the assembly groove 31 of the first sub-luminescent pixel area 32 to form a first sub-quantum dot layer 51 in the assembly groove 31 of the first sub-luminescent pixel area 32. Thereafter, the second color quantum dot solution 7 and the third color quantum dot solution 7 are transported in turn to form a second sub-quantum dot layer 52 of the second color and a third sub-quantum dot layer 53 of the third color in the assembly grooves 31 of the second sub-luminescent pixel area 33 and the third sub-quantum dot area 34, respectively. In one specific embodiment, the first color, the second color and the third color can be red, green and blue, respectively. In another specific embodiment, the third sub-quantum dot layer 53 can be colorless. For example, the light-emitting unit 131 is set to a blue Micro LED or a blue OLED. The blue light emitted by the light-emitting unit 131 can be directly emitted through the colorless third sub-quantum dot layer 53, so that the third sub-quantum dot layer 53 can emit blue light, so that the prepared display module 100 can achieve full-color display.

[0107] In a specific embodiment, after each delivery of a quantum dot solution 7 of one color, a cleaning liquid can be delivered to each row of channel pixel areas 4 to clean the delivery channel and clean the quantum dot solutions 7 of the remaining colors remaining on the surface of the channel pixel area 4, so as to avoid the residual quantum dot solution 7 of the previous color affecting the quantum dot solution 7 being delivered during the delivery of the next color of quantum dot solution 7, thereby affecting the display performance of the prepared display module 100.

[0108] S4: preparing an encapsulation layer 6 on the side of the microfluidic functional layer 2 away from the light-emitting substrate 1 .

[0109] Specifically, after forming the quantum dot layer 5 within the assembly groove 31 of the microfluidic functional layer 2, an encapsulation layer 6 is formed on the side of the microfluidic functional layer 2 facing away from the light-emitting substrate 1. Specifically, the encapsulation layer 6 can be formed on the surface of the hydrophobic layer 26 of the microfluidic functional layer 2 facing away from the substrate 11. The encapsulation layer 6 is a light-transmitting layer to ensure that light emitted by the quantum dot layer 5 within the assembly groove 31 can be emitted through the encapsulation layer 6. The encapsulation layer 6 can encapsulate and protect the display module 100, preventing harmful substances such as oxygen and water vapor from entering the display module 100, thereby helping to extend the service life of the display module 100.

[0110] The above description is merely an embodiment of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A display module, characterized in that: include: A light-emitting substrate comprises a substrate, a first driving circuit layer and a light-emitting layer arranged in sequence; the light-emitting layer comprises a plurality of light-emitting units, and the light-emitting units are electrically connected to the first driving circuit layer; A microfluidic functional layer is disposed on a side of the light-emitting layer away from the substrate, serving as part of the display module; the microfluidic functional layer includes a plurality of light-emitting pixel regions and a plurality of channel pixel regions, the light-emitting pixel regions having assembly grooves, while the channel pixel regions do not have assembly grooves; each light-emitting pixel region is disposed adjacent to at least one channel pixel region; the assembly grooves penetrate the microfluidic functional layer, and the openings of the assembly grooves are disposed away from the light-emitting substrate; a quantum dot layer is disposed within the assembly grooves; Wherein, the assembly groove is arranged in alignment with the light emitting unit.

2. The display module according to claim 1, wherein: The microfluidic functional layer includes a second driving circuit layer, a first insulating layer, a first flat layer, a microfluidic electrode layer, a second insulating layer, and a hydrophobic layer arranged in sequence; the second driving circuit layer is arranged on a side of the hydrophobic layer close to the light-emitting substrate; the second driving circuit layer includes a plurality of thin-film transistors, and the microfluidic electrode layer is connected to the thin-film transistor vias; The assembly groove sequentially passes through the hydrophobic layer, the second insulating layer, the microfluidic electrode layer, the first flat layer, the first insulating layer and the second driving circuit layer.

3. The display module according to claim 2, wherein: The second insulating layer is a light-impermeable layer, and / or the hydrophobic layer is a light-impermeable layer, and / or the first flat layer is a light-impermeable layer, and / or the first insulating layer is a light-impermeable layer.

4. The display module according to claim 2, wherein: The microfluidic functional layer further includes a black matrix layer, and the assembly groove penetrates the black matrix layer; The projection of the black matrix layer on the substrate does not overlap with the projection of the light-emitting unit on the substrate and they both cover the substrate.

5. The display module according to claim 4, wherein: The black matrix layer is located between the hydrophobic layer and the second insulating layer, and covers a surface of the second insulating layer away from the substrate.

6. The display module according to claim 1, wherein: The plurality of light-emitting pixel areas and the plurality of channel pixel areas are distributed in multiple rows, each row of the light-emitting pixel areas is adjacent to at least one row of the channel pixel areas, and each row of the channel pixel areas forms a transport channel for the quantum dot solution.

7. The display module according to claim 6, wherein: Along the column direction, multiple rows of the light-emitting pixel regions and multiple rows of the channel pixel regions are alternately arranged.

8. The display module according to claim 1, wherein: The display module further includes an encapsulation layer, which is provided on a side of the microfluidic functional layer away from the substrate; The light-emitting layer includes the light-emitting unit and a second flat layer, wherein the second flat layer covers the light-emitting unit and the first driving circuit layer; the light-emitting side of the light-emitting unit is arranged toward the microfluidic functional layer.

9. The display module according to any one of claims 1 to 8, wherein: The light emitting unit is a light emitting diode; Alternatively, the light emitting unit is an organic light emitting diode.

10. A method for preparing a display module, characterized in that: include: A light-emitting substrate is provided; wherein the light-emitting substrate comprises a substrate, a first driving circuit layer and a light-emitting layer arranged in sequence; the light-emitting layer comprises a plurality of light-emitting units, and the light-emitting units are electrically connected to the first driving circuit layer; A microfluidic functional layer is prepared on a side of the light-emitting layer away from the substrate; wherein the microfluidic functional layer includes a plurality of light-emitting pixel regions and a plurality of channel pixel regions, the light-emitting pixel regions have assembly grooves, and the channel pixel regions do not have assembly grooves; each of the light-emitting pixel regions is disposed adjacent to at least one of the channel pixel regions; the assembly grooves are aligned with the light-emitting units, the assembly grooves penetrate the microfluidic functional layer, and the openings of the assembly grooves are disposed away from the light-emitting substrate; Disposing a quantum dot solution on a surface of the microfluidic functional layer away from the substrate, and driving the quantum dot solution to move into the assembly groove; retaining the microfluidic functional layer as a part of the display module; An encapsulation layer is prepared on a side of the microfluidic functional layer away from the light-emitting substrate.

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