Patch testing device of Bluetooth chip

Abstract

The invention discloses a Bluetooth chip mounting test device, and relates to the technical field of chip mounting, the Bluetooth chip mounting test device comprises a chassis and a discharging assembly, the discharging assembly is arranged in the middle of the chassis, and the discharging assembly comprises a storage box, a storage chamber, a partition groove, a telescopic rod, a partition plate, an insertion groove, a push rod, a detection plate, a sorting groove, a pull rod, a sorting plate and a through opening. A storage box is connected to the middle of the chassis, a storage chamber is arranged in the middle of the storage box, a partition groove is formed in the upper portion of the storage chamber, a telescopic rod is connected into the partition groove, and a partition plate is connected to the right end of the telescopic rod. During use, chips can be detected before mounting, unqualified products can be screened out from qualified products, the quality of the mounted chips is ensured, then the qualified chips are intermittently transferred and mounted, a circuit board can be automatically centered and clamped during use, the circuit board can be detected in the transportation process after mounting, and the production efficiency is improved. And the circuit boards are sorted according to the detection result.

Description

Technical Field

[0001] The invention relates to the technical field of chip patch technology, in particular to a patch testing device for a Bluetooth chip. Background Art

[0002] In the production process of Bluetooth headsets, a chip mounter is usually needed to mount the Bluetooth chip onto the circuit board. The chip mounter, also known as a "mounting machine" or "surface mount system" (Surface Mount System), is configured after the dispensing machine or screen printer in the production line. It is a device that accurately places surface mount components on the PCB pads by moving the mounting head. There are two types: manual and fully automatic.

[0003] Existing placement machines usually do not test the chips before mounting Bluetooth chips. Instead, they transfer the circuit boards to the testing site for overall testing and then sorting after the mounting is completed. This may result in defective chips being mounted on the circuit board during mounting.

[0004] Therefore, in view of this, the existing structure and defects are studied and improved, and a patch test device for a Bluetooth chip is proposed. Summary of the invention

[0005] The purpose of the present invention is to provide a patch testing device for a Bluetooth chip to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a patch testing device for a Bluetooth chip, comprising a chassis and a discharging assembly, wherein a discharging assembly is arranged in the middle of the chassis, and the discharging assembly comprises a storage box, a storage chamber, a partition groove, a telescopic rod, a partition plate, a slot, a push rod, a detection plate, a sorting groove, a pull rod, a sorting plate and a through opening, a storage box is connected to the middle of the chassis, and a storage chamber is arranged in the middle of the storage box, a partition groove is opened at the upper part of the storage chamber, and a telescopic rod is connected in the partition groove, a partition plate is connected at the right end of the telescopic rod, a slot is opened in the middle of the storage chamber, and a push rod is connected in the slot, a detection plate is connected at the right end of the push rod, a sorting groove is arranged at the lower part of the storage chamber, and a pull rod is connected in the sorting groove, a sorting plate is connected at the right end of the pull rod, and a through opening is opened at the left part of the sorting plate.

[0007] Furthermore, a slope is provided at the right end of the partition plate, and the partition plate is slidably engaged with the storage chamber through a partition groove, the detection plate is slidably engaged with the storage chamber through a slot, and a slope is provided on one side of the sorting plate.

[0008] Furthermore, the discharging assembly also includes a rotating trough, a feeding motor and a feeding wheel. A rotating trough is arranged below the storage chamber, a feeding motor is connected to the front of the storage box, and a feeding wheel is connected to the output end of the feeding motor. The feeding wheel is rotatably connected to the rotating trough through the feeding motor.

[0009] Furthermore, the discharging assembly also includes a discharging trough, a lifting rod and a suction cup. The discharging trough is symmetrically opened on the outer circumference of the feeding wheel, and the discharging trough is connected with a lifting rod, and the other end of the lifting rod is connected with a suction cup.

[0010] Furthermore, a driving motor is connected to the left portion of the upper surface of the chassis, and a conveyor belt is arranged above the chassis, a pad is arranged in the middle of the conveyor belt, and a tin storage box is arranged on the right side of the pad, a tin storage cavity is symmetrically opened in the tin storage box, and a tin spraying tube is arranged in the tin storage cavity.

[0011] Furthermore, the driving motor forms a transmission structure with a belt, a pulley and a conveyor belt, and the pad is in close contact with the conveyor belt. The tin storage box is close to the inner surface of the conveyor belt, and the tin spraying tubes are symmetrically distributed about the tin storage box.

[0012] Furthermore, a pump body is connected below the tin spraying tube, a clamping assembly is arranged on the surface of the conveyor belt, and detection cards are symmetrically arranged on the front and rear sides of the right part of the conveyor belt, and a dividing plate is arranged below the detection card, a defective product bin is arranged at the right rear part of the chassis, and a finished product bin is arranged at the right front part of the chassis.

[0013] Furthermore, the clamping assembly includes a power-on rod, a bottom frame, a clamping spring and a clamping plate. The power-on rods are symmetrically connected to the front and rear sides of the conveyor belt, and the bottom frame is connected between the power-on rods. The clamping springs are symmetrically connected to the middle part of the inner wall of the bottom frame, and the other end of the clamping spring is connected to the clamping plate. The power-on rod is slidably connected to the detection card.

[0014] Furthermore, the clamping assembly also includes a card cavity, a limiting spring, a card block, a card rod, a card slot and an electromagnetic sheet. A card cavity is opened on the upper inner wall of the bottom frame, and a limiting spring is connected to the card cavity. One end of the limiting spring is connected to a card block, and one side of the card block is connected to a card rod. A card slot is opened on one side of the card cavity, and an electromagnetic sheet is connected to the card slot.

[0015] Furthermore, the clamping assembly also includes a slide groove, a tension spring, a support plate, a sliding rod, a sliding cavity and an electromagnetic block. A slide groove is opened on the lower surface of the bottom frame, and a tension spring is connected to the slide groove. One end of the tension spring is connected to the support plate, and one side of the support plate is connected to the sliding rod. A sliding cavity is opened on one side of the slide groove, and the sliding cavity is connected to the electromagnetic block.

[0016] The present invention provides a patch testing device for a Bluetooth chip, which has the following beneficial effects: when in use, the chip can be tested before mounting, and unqualified products can be screened out from qualified products to ensure the quality of the mounted chips, and then the qualified chips can be intermittently transported and mounted; when in use, the circuit board can be automatically centered and clamped, and after mounting, the circuit board can be tested during transportation, and the circuit boards can be sorted according to the test results.

[0017] 1. When the present invention is in use, the chips are first stacked with their front side facing downward in the storage chamber, and the partition plate can provide support for the chips. When the chips are mounted, the telescopic rod and the push rod successively drive the partition plate and the detection plate to move back and forth left and right. When the partition plate slides out of the storage chamber, the detection plate can receive and detect the fallen chips. After the chip falls on the detection plate, the telescopic rod immediately drives the partition plate back to its position to separate the chips above to avoid interference with the detection. After the detection is completed, the push rod drives the detection plate to move left, and the chip can fall onto the sorting plate. Then the push rod drives the detection plate to reset, and at the same time the telescopic rod drives the partition plate to move left again, so that the next chip falls for detection. After the chip falls onto the sorting plate, if the chip is qualified, the pull rod drives the sorting plate to move right to move the through port. When the chip moves to the bottom of the chip, the chip can fall from the opening. If the chip is unqualified, the pull rod drives the sorting plate to move to the left. When the right part of the sorting plate moves into the storage chamber, the chip can slide along the inclined surface on the right part of the sorting plate to the right part of the sorting slot and leave the storage box from the right end of the sorting slot to complete the chip sorting. The chip falls from the storage chamber into the discharge slot, and the suction cup adsorbs the chip. Then the feeding motor drives the feeding wheel to rotate intermittently in the rotating slot. When the chip moves to the bottom of the feeding wheel, the lifting rod can drive the suction cup to descend. After the chip is mounted on the circuit board, the suction cup is released and the lifting rod drives the suction cup back to the discharge slot to complete the mounting. In summary, the chip can be inspected and sorted before mounting to avoid mounting defective chips on the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall main structure of a patch testing device for a Bluetooth chip of the present invention;

[0019] Figure 2 A schematic diagram of the cross-sectional front view of a material storage box of a patch testing device for a Bluetooth chip of the present invention;

[0020] Figure 3 A schematic diagram of a half-cut three-dimensional structure of a material storage box of a patch testing device for a Bluetooth chip according to the present invention;

[0021] Figure 4 A schematic diagram of the three-dimensional structure of a sorting board of a patch testing device for a Bluetooth chip according to the present invention;

[0022] Figure 5It is a schematic diagram of the conveyor belt side view structure of a patch testing device for a Bluetooth chip of the present invention;

[0023] Figure 6 A schematic diagram of the cross-sectional front view of a tin storage box of a patch testing device for a Bluetooth chip according to the present invention;

[0024] Figure 7 The present invention is a schematic diagram of the cross-sectional side view of the bottom frame of a patch testing device for a Bluetooth chip.

[0025] In the figure: 1, chassis; 2, driving motor; 3, conveyor belt; 4, discharging assembly; 401, storage box; 402, storage chamber; 403, rotating trough; 404, feeding motor; 405, feeding wheel; 406, discharging trough; 407, lifting rod; 408, suction cup; 409, dividing slot; 410, telescopic rod; 411, dividing plate; 412, slot; 413, push rod; 414, detection plate; 415, sorting slot; 416, pull rod; 417, sorting plate; 418, through port; 5, pad; 6, tin storage box; 7, tin storage cavity; 8. Tin spraying tube; 9. Pump body; 10. Clamping assembly; 1001. Power rod; 1002. Bottom frame; 1003. Clamping spring; 1004. Clamping plate; 1005. Card cavity; 1006. Limiting spring; 1007. Card block; 1008. Card rod; 1009. Card slot; 1010. Electromagnetic sheet; 1011. Slide slot; 1012. Tension spring; 1013. Support plate; 1014. Slide rod; 1015. Slide cavity; 1016. Electromagnetic block; 11. Detection card; 12. Material dividing plate; 13. Defective product warehouse; 14. Finished product warehouse. DETAILED DESCRIPTION

[0026] See also Figures 1 to 7 The present invention provides a technical solution: a patch test device for a Bluetooth chip, comprising a chassis 1 and a discharging assembly 4, wherein the discharging assembly 4 is arranged in the middle of the chassis 1, and the discharging assembly 4 comprises a storage box 401, a storage chamber 402, a partition groove 409, a telescopic rod 410, a partition plate 411, a slot 412, a push rod 413, a detection plate 414, a sorting groove 415, a pull rod 416, a sorting plate 417 and a through port 418, a storage box 401 is connected to the middle of the chassis 1, and a storage chamber 402 is arranged in the middle of the storage box 401, and a storage chamber 402 is arranged in the middle of the storage box 401. A partition groove 409 is provided at the upper portion of the material chamber 402, and a telescopic rod 410 is connected in the partition groove 409, and a partition plate 411 is connected to the right end of the telescopic rod 410; a slot 412 is provided in the middle portion of the storage chamber 402, and a push rod 413 is connected in the slot 412, and a detection plate 414 is connected to the right end of the push rod 413; a sorting groove 415 is provided at the lower portion of the storage chamber 402, and a pull rod 416 is connected in the sorting groove 415, a sorting plate 417 is connected to the right end of the pull rod 416, and a through opening 418 is provided on the left portion of the sorting plate 417.

[0027] See also Figures 1 to 4 , a slope is arranged on the right end of the partition plate 411, and the partition plate 411 is slidably engaged with the storage chamber 402 through the partition groove 409, the detection plate 414 is slidably engaged with the storage chamber 402 through the slot 412, and a slope is arranged on one side of the sorting plate 417, the discharging assembly 4 also includes a rotating groove 403, a feeding motor 404 and a feeding wheel 405, a rotating groove 403 is arranged below the storage chamber 402, a feeding motor 404 is connected to the front of the storage box 401, and a feeding wheel 405 is connected to the output end of the feeding motor 404, and the feeding wheel 405 is rotatably connected to the rotating groove 403 through the feeding motor 404, the discharging assembly 4 also includes a discharging groove 406, a lifting rod 407 and a suction cup 408, and the discharging groove 406 is symmetrically opened on the outer periphery of the feeding wheel 405, and the lifting rod 407 is connected inside the discharging groove 406, and the lifting rod 407 is connected to the lifting rod 407. A suction cup 408 is connected to the other end of the rod 407, a driving motor 2 is connected to the left portion of the upper surface of the chassis 1, and a conveyor belt 3 is arranged above the chassis 1, a pad 5 is arranged in the middle of the conveyor belt 3, and a tin storage box 6 is arranged on the right side of the pad 5, a tin storage cavity 7 is symmetrically opened in the tin storage box 6, and a tin spraying tube 8 is arranged in the tin storage cavity 7, the driving motor 2 forms a transmission structure with the conveyor belt 3 through a belt and a pulley, and the pad 5 is in contact with the conveyor belt 3, the tin storage box 6 is close to the inner surface of the conveyor belt 3, and the tin spraying tube 8 is symmetrically distributed about the tin storage box 6, and a pump body 9 is connected below the tin spraying tube 8, a clamping assembly 10 is arranged on the surface of the conveyor belt 3, and detection cards 11 are symmetrically arranged on the front and rear sides of the right part of the conveyor belt 3, and a material dividing plate 12 is arranged below the detection card 11, a defective product warehouse 13 is arranged at the right rear part of the chassis 1, and a finished product warehouse 14 is arranged at the right front part of the chassis 1;

[0028] The specific operation is as follows. When in use, first stack the chip with the front side facing downward in the storage chamber 402, and the partition plate 411 can provide support for the chip. When pasting, the telescopic rod 410 and the push rod 413 successively drive the partition plate 411 and the detection plate 414 to move back and forth left and right. When the partition plate 411 slides out of the storage chamber 402, the detection plate 414 can receive and detect the fallen chip. After the chip falls on the detection plate 414, the telescopic rod 410 immediately drives the partition plate 411 back to its original position to separate the chip above to avoid interference with the detection. After the detection is completed, the push rod 413 drives the detection plate 414 to move left, and the chip can fall onto the sorting plate 417, and then the push rod 413 drives the detection plate 414 to reset, and at the same time the telescopic rod 410 drives the partition plate 411 to move left again, so that the next chip falls for detection. After the chip falls on the sorting plate 417, if the chip is qualified, the pull rod 416 drives the sorting plate 417 to move right, and the opening 4 18 moves to the bottom of the chip, and the chip can fall from the opening 418. If the chip is unqualified, the pull rod 416 drives the sorting plate 417 to move to the left. When the right part of the sorting plate 417 moves into the storage chamber 402, the chip can slide along the inclined surface of the right part of the sorting plate 417 to the right part of the sorting slot 415, and leave the storage box 401 from the right end of the sorting slot 415, completing the chip sorting. The chip falls from the storage chamber 402 into the discharge slot 406, and the suction cup 408 cleans the chip. After the chip is adsorbed, the feeding motor 404 drives the feeding wheel 405 to rotate intermittently in the rotating groove 403. When the chip moves to the bottom of the feeding wheel 405, the lifting rod 407 can drive the suction cup 408 to descend. After the chip is mounted on the circuit board, the suction cup 408 is released from adsorption and the lifting rod 407 drives the suction cup 408 back to the discharge groove 406 to complete the mounting. In summary, the chips can be inspected and sorted before mounting to avoid mounting defective chips on the circuit board.

[0029] See also Figures 5 to 7The driving motor 2 forms a transmission structure with the conveyor belt 3 through a belt and a pulley, and the pad 5 is in contact with the conveyor belt 3, the tin storage box 6 is close to the inner surface of the conveyor belt 3, and the tin spraying tube 8 is symmetrically distributed about the tin storage box 6, the clamping assembly 10 includes a power rod 1001, a bottom frame 1002, a clamping spring 1003 and a clamping plate 1004, the front and rear sides of the conveyor belt 3 are symmetrically connected with the power rod 1001, and the bottom frame 1002 is connected between the power rods 1001, the middle part of the inner wall of the bottom frame 1002 is symmetrically connected with the clamping spring 1003, and the other end of the clamping spring 1003 is connected with the clamping plate 1004, the power rod 1001 is engaged and slidably connected with the detection card 11, the clamping assembly 10 also includes a card cavity 1005, a limiting spring 1006, a card block 1007, a card rod 1008, a card slot 1009 and an electromagnetic sheet 1010, and the bottom frame 1002 is connected to the inner wall of the bottom frame 1002. A card cavity 1005 is provided at the upper part of the wall, and a limiting spring 1006 is connected in the card cavity 1005, a card block 1007 is connected at one end of the limiting spring 1006, and a card rod 1008 is connected at one side of the card block 1007, a card slot 1009 is provided at one side of the card cavity 1005, and an electromagnetic sheet 1010 is connected in the card slot 1009, and the clamping assembly 10 also includes a slide slot 1011, a tension spring 1012, and a support plate 101 3. Slide rod 1014, slide cavity 1015 and electromagnetic block 1016. A slide groove 1011 is provided on the lower surface of the bottom frame 1002, and a tension spring 1012 is connected to the slide groove 1011. One end of the tension spring 1012 is connected to a support plate 1013, and one side of the support plate 1013 is connected to the slide rod 1014. A slide cavity 1015 is provided on one side of the slide groove 1011, and an electromagnetic block 1016 is connected to the slide cavity 1015.

[0030] The specific operation is as follows. When in use, the circuit board can be placed in the bottom frame 1002. When placing the circuit board, the circuit board can press the card block 1007 into the card cavity 1005 through the inclined surface of the card block 1007 and compress the limiting spring 1006. When the circuit board enters the lower part of the bottom frame 1002, the circuit board can press the clamping plate 1004 to move and compress the clamping spring 1003. After the circuit board contacts the support plate 1013, the card block 1007 can rebound under the action of the limiting spring 1006 to limit the upper surface of the circuit board. The support plate 1013 can provide support for the circuit board and limit the lower surface of the circuit board, thereby cooperating with the card block 1007 to The circuit board is restricted in the bottom frame 1002 to prevent it from falling, and the clamping spring 1003 can evenly apply pressure to the edge of the circuit board through the pressure plate, so as to center it, and avoid failure of mounting due to deviation of the circuit board during mounting. In summary, the circuit board can be restricted and centered during use, and failure of mounting due to deviation of the circuit board can be avoided. After the circuit board is placed in the bottom frame 1002, the driving motor 2 drives the conveyor belt 3 to operate intermittently. When the bottom frame 1002 moves to the bottom of the storage box 401, the conveyor belt 3 stops mounting. During mounting, the pad 5 can provide support for the bottom frame 1002 to prevent the bottom frame 1002 from being subjected to force to pull the conveyor belt 3 Stretch, after the mounting is completed, the conveyor belt 3 drives the bottom frame 1002 to continue to move. During the movement, the bottom frame 1002 drives the circuit board to pass over the tin storage box 6, and the pump body 9 can extract the tin liquid in the tin storage cavity 7 and spray it out through the tin spraying tube 8 to cover the lower surface of the circuit board and make the top of the tin liquid touch the chip pins to complete the soldering of the pins. After the soldering is completed, the conveyor belt 3 drives the bottom frame 1002 to continue to move. When the power-on rod 1001 is stuck in the detection card 11, the circuit board can be powered on through the bottom frame 1002. If the detection fails, the electromagnetic block 1016 is energized to adsorb the sliding rod 1014, thereby pulling the support plate 1013 in the slide groove 10 11 slides inside to move the support plate 1013 away from under the circuit board, and the circuit board can fall from the bottom frame 1002 to the dividing plate 12 under the action of gravity, and slide along the dividing plate 12 to the defective bin 13. If the inspection is qualified, the electromagnetic sheet 1010 is energized to adsorb the card rod 1008, thereby pulling the card block 1007 to slide into the card cavity 1005, and releasing the restriction on the circuit board. When the bottom frame 1002 moves to under the conveyor belt 3, the circuit board can fall into the finished product bin 14 under the action of gravity, completing the inspection and sorting of the circuit boards. In summary, after the mounting is completed, the circuit boards can be soldered and inspected, and the circuit boards can be sorted according to the inspection results.

[0031] In summary, when using the patch testing device for the Bluetooth chip, first, the chip is stacked with its front side facing downward in the storage chamber 402, and the partition plate 411 can provide support for the chip. When patching, the telescopic rod 410 and the push rod 413 successively drive the partition plate 411 and the detection plate 414 to move back and forth left and right. When the partition plate 411 slides out of the storage chamber 402, the detection plate 414 can receive and detect the fallen chip. After the chip falls on the detection plate 414, the telescopic rod 410 immediately drives the partition plate 411 back to its original position to separate the chip above to avoid interference with the detection. After the detection is completed, the push rod 413 drives the detection plate 414 to move left, and the chip can fall onto the sorting plate 417, and then the push rod 413 drives the detection plate 414 to reset. The telescopic rod 410 drives the partition plate 411 to move left again, allowing the next chip to fall for testing. After the chip falls on the sorting plate 417, if the chip is qualified, the pull rod 416 drives the sorting plate 417 to move right, and moves the through port 418 to the bottom of the chip, and the chip can fall from the through port 418. If the chip is unqualified, the pull rod 416 drives the sorting plate 417 to move left. When the right part of the sorting plate 417 moves into the storage chamber 402, the chip can slide along the inclined surface of the right part of the sorting plate 417 to the right part of the sorting slot 415, and leave the storage box 401 from the right end of the sorting slot 415, completing the chip sorting, and the chip falls from the storage chamber 402 into the discharge slot 406, the suction cup 408 adsorbs the chip, and then the feeding motor 404 drives the feeding wheel 405 rotates intermittently in the rotating groove 403. After the chip is placed, the circuit board is immediately placed in the bottom frame 1002. When the circuit board is placed, the circuit board can press the card block 1007 into the card cavity 1005 through the inclined surface of the card block 1007 and compress the limiting spring 1006. When the circuit board enters the lower part of the bottom frame 1002, the circuit board can press the clamping plate 1004 to move and compress the clamping spring 1003. After the circuit board contacts the support plate 1013, the card block 1007 can rebound under the action of the limiting spring 1006 to limit the upper surface of the circuit board. The support plate 1013 can provide support for the circuit board and limit the lower surface of the circuit board, thereby cooperating with the card block 1007 to limit the circuit board in the bottom frame 1002 to avoid The circuit board falls, and the clamping spring 1003 can apply balanced pressure to the edge of the circuit board through the pressure plate, so as to center it, avoiding the failure of mounting due to the deviation of the circuit board during mounting. After the circuit board is placed in the bottom frame 1002, the driving motor 2 drives the conveyor belt 3 to operate intermittently. When the bottom frame 1002 moves to the bottom of the storage box 401, the conveyor belt 3 stops. At this time, the chip moves to the bottom of the feeding wheel 405, and the lifting rod 407 can drive the suction cup 408 to descend. After the chip is mounted on the circuit board, the suction cup 408 is released from adsorption and the lifting rod 407 drives the suction cup 408 back to the discharge chute 406 to complete the mounting. During mounting, the pad 5 can provide support for the bottom frame 1002 to avoid the bottom frame 1002 being subjected to force to stretch the conveyor belt 3.After the mounting is completed, the conveyor belt 3 drives the bottom frame 1002 to continue moving. During the movement, the bottom frame 1002 drives the circuit board to pass over the tin storage box 6. The pump body 9 can extract the tin liquid in the tin storage cavity 7 and spray it out through the tin spray tube 8 to cover the lower surface of the circuit board and make the top of the tin liquid touch the chip pins to complete the soldering of the pins. After the soldering is completed, the conveyor belt 3 drives the bottom frame 1002 to continue moving. When the power-on rod 1001 is stuck in the detection card 11, the circuit board can be powered on through the bottom frame 1002. If the detection fails, the electromagnetic block 1016 is energized to power the slide bar 1014. The bottom frame 1002 is adsorbed, thereby pulling the support plate 1013 to slide in the slide groove 1011, so that the support plate 1013 is moved away from the bottom of the circuit board. The circuit board can fall from the bottom frame 1002 to the dividing plate 12 under the action of gravity, and slide along the dividing plate 12 to the defective warehouse 13. If the inspection is qualified, the electromagnetic sheet 1010 is energized to adsorb the card rod 1008, thereby pulling the card block 1007 to slide into the card cavity 1005, and releasing the restriction on the circuit board. When the bottom frame 1002 moves to the bottom of the conveyor belt 3, the circuit board can fall into the finished product warehouse 14 under the action of gravity, completing the inspection and sorting of the circuit board.

[0032] The embodiments of the present invention are given for the purpose of illustration and description, and are not intended to be exhaustive or to limit the invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

Claims

1. A patch test device for a Bluetooth chip, characterized in that: The invention comprises a chassis (1) and a discharging assembly (4), wherein the discharging assembly (4) is arranged in the middle of the chassis (1), and the discharging assembly (4) comprises a storage box (401), a storage chamber (402), a partition groove (409), a telescopic rod (410), a partition plate (411), a slot (412), a push rod (413), a detection plate (414), a sorting groove (415), a pull rod (416), a sorting plate (417) and a through port (418), wherein the middle of the chassis (1) is connected to the storage box (401), and the storage chamber (402) is arranged in the middle of the storage box (401), and the upper part of the storage chamber (402) is provided with a A partition groove (409) is provided, and a telescopic rod (410) is connected in the partition groove (409), and a partition plate (411) is connected at the right end of the telescopic rod (410), a slot (412) is provided in the middle of the storage chamber (402), and a push rod (413) is connected in the slot (412), and a detection plate (414) is connected at the right end of the push rod (413), a sorting groove (415) is provided at the lower part of the storage chamber (402), and a pull rod (416) is connected in the sorting groove (415), a sorting plate (417) is connected at the right end of the pull rod (416), and a through opening (418) is provided at the left part of the sorting plate (417).

2. A patch test device for a Bluetooth chip according to claim 1, characterized in that: The right end of the partition plate (411) is provided with an inclined surface, and the partition plate (411) is slidably engaged with the material storage chamber (402) through the partition groove (409), the detection plate (414) is slidably engaged with the material storage chamber (402) through the slot (412), and one side of the sorting plate (417) is provided with an inclined surface.

3. A patch test device for a Bluetooth chip according to claim 1, characterized in that: The discharging assembly (4) further comprises a rotating groove (403), a feeding motor (404) and a feeding wheel (405); the rotating groove (403) is arranged below the storage chamber (402); the front of the storage box (401) is connected to the feeding motor (404); the output end of the feeding motor (404) is connected to the feeding wheel (405); the feeding wheel (405) is rotatably connected to the rotating groove (403) via the feeding motor (404).

4. A patch test device for a Bluetooth chip according to claim 3, characterized in that: The discharging assembly (4) further comprises a discharging trough (406), a lifting rod (407) and a suction cup (408); the discharging trough (406) is symmetrically provided on the outer circumference of the feeding wheel (405); the discharging trough (406) is connected with a lifting rod (407); and the other end of the lifting rod (407) is connected with a suction cup (408).

5. A patch test device for a Bluetooth chip according to claim 1, characterized in that: A driving motor (2) is connected to the left portion of the upper surface of the chassis (1), and a conveyor belt (3) is arranged above the chassis (1). A pad (5) is arranged in the middle of the conveyor belt (3), and a tin storage box (6) is arranged on the right side of the pad (5). A tin storage cavity (7) is symmetrically opened in the tin storage box (6), and a tin spraying tube (8) is arranged in the tin storage cavity (7).

6. A patch test device for a Bluetooth chip according to claim 5, characterized in that: The driving motor (2) forms a transmission structure with a conveyor belt (3) through a belt, a pulley, and the backing plate (5) is in contact with the conveyor belt (3). The tin storage box (6) is close to the inner surface of the conveyor belt (3), and the tin spraying tube (8) is symmetrically distributed with respect to the tin storage box (6).

7. A patch test device for a Bluetooth chip according to claim 5, characterized in that: A pump body (9) is connected below the tin spraying tube (8), a clamping assembly (10) is arranged on the surface of the conveyor belt (3), and detection cards (11) are symmetrically arranged on the front and rear sides of the right part of the conveyor belt (3), and a material separation plate (12) is arranged below the detection card (11), a defective product bin (13) is arranged at the right rear part of the chassis (1), and a finished product bin (14) is arranged at the right front part of the chassis (1).

8. A patch test device for a Bluetooth chip according to claim 7, characterized in that: The clamping assembly (10) comprises a power-on rod (1001), a bottom frame (1002), a clamping spring (1003) and a clamping plate (1004); the power-on rods (1001) are symmetrically connected to the front and rear sides of the conveyor belt (3); the bottom frame (1002) is connected between the power-on rods (1001); the clamping springs (1003) are symmetrically connected to the middle of the inner wall of the bottom frame (1002); the other end of the clamping spring (1003) is connected to the clamping plate (1004); the power-on rod (1001) is slidably connected to the detection card (11) by snapping.

9. A patch test device for a Bluetooth chip according to claim 8, characterized in that: The clamping assembly (10) further comprises a clamping cavity (1005), a limiting spring (1006), a clamping block (1007), a clamping rod (1008), a clamping slot (1009) and an electromagnetic sheet (1010); the clamping cavity (1005) is provided on the upper inner wall of the bottom frame (1002), and the clamping cavity (1005) is connected with the limiting spring (1006); one end of the limiting spring (1006) is connected with the clamping block (1007), and one side of the clamping block (1007) is connected with the clamping rod (1008); one side of the clamping cavity (1005) is provided with a clamping slot (1009), and the clamping slot (1009) is connected with the electromagnetic sheet (1010).

10. A patch test device for a Bluetooth chip according to claim 8, characterized in that: The clamping assembly (10) further comprises a clamping cavity (1005), a limiting spring (1006), a clamping block (1007), a clamping rod (1008), a clamping slot (1009) and an electromagnetic sheet (1010); the clamping cavity (1005) is provided on the upper inner wall of the bottom frame (1002), and the clamping cavity (1005) is connected with the limiting spring (1006); one end of the limiting spring (1006) is connected with the clamping block (1007), and one side of the clamping block (1007) is connected with the clamping rod (1008); one side of the clamping cavity (1005) is provided with a clamping slot (1009), and the clamping slot (1009) is connected with the electromagnetic sheet (1010).

Images