PCB soldering flux smearing equipment and operation method

Abstract

The invention relates to the technical field of soldering flux smearing equipment, and particularly discloses PCB soldering flux smearing equipment and an operation method.The PCB soldering flux smearing equipment comprises a bottom plate, two mounting plates are arranged on the bottom plate in a sliding mode, and a bearing plate is mounted between the two mounting plates; a random shape change mechanism is arranged on the bearing plate; the shape random change mechanism comprises a plurality of first automatic guided vehicles installed on the bearing plate. According to the invention, the rubber limiting sleeve is utilized to surround the area, which needs to be coated with the soldering flux, on the PCB, so that the coating brush can only move in the area, which needs to be coated with the soldering flux, on the PCB, and then the coating brush can only coat the soldering flux on the area, which needs to be coated with the soldering flux, on the PCB; the problem that the soldering flux is easily smeared out of the limit when the soldering flux is smeared on the PCB in the prior art is solved, and the soldering flux can be accurately smeared in the area, needing to be smeared with the soldering flux, of the PCB through the soldering flux smearing device.

Description

Technical Field

[0001] The present invention relates to the technical field of soldering flux coating equipment, and in particular to a soldering flux coating equipment for a PCB board and an operating method thereof. Background Art

[0002] Flux is usually a mixture with rosin as the main ingredient, and is an auxiliary material to ensure the smooth progress of the welding process. Soldering is the main process in electronic assembly, and flux is an auxiliary material used in welding. The main function of flux is to remove oxides on the surface of solder and the base material to be welded, so that the metal surface reaches the necessary cleanliness. It prevents the surface from re-oxidation during welding, reduces the surface tension of the solder, and improves the welding performance. The quality of flux performance directly affects the quality of electronic products.

[0003] After searching, it was found that the Chinese patent with application number 201720810888.4 disclosed "a flux coating device, which includes at least one coating mechanism and a moving mechanism, each coating mechanism includes a first coating section and a second coating section that are arranged opposite to each other, wherein: for each coating mechanism, a coating component for providing flux is provided on a side of the first coating section in the coating mechanism opposite to the second coating section, and / or, a coating component for providing flux is provided on a side of the second coating section in the coating mechanism opposite to the first coating section; the moving mechanism is connected to the first coating section and drives the first coating section to move closer to the second coating section or away from the second coating section. "; However, when the above-mentioned flux coating device is used to coat the PCB board with flux, the flux coated on the PCB board is prone to flow on the PCB board, which is prone to cause the coated flux to flow on the PCB board and cause the coated flux to flow across the boundary to the area where the flux does not need to be coated. Therefore, in order to solve such problems, a PCB board flux coating device and an operation method are proposed. Summary of the invention

[0004] The purpose of the present invention is to solve the shortcomings of the prior art and to propose a PCB board soldering flux coating device and an operating method.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A PCB solder flux coating device comprises a bottom plate, two mounting plates are slidably arranged on the bottom plate, and a bearing plate is installed between the two mounting plates;

[0007] The bearing plate is provided with a mechanism for arbitrary shape change;

[0008] The arbitrary shape changing mechanism comprises a plurality of first automatic guided vehicles mounted on a carrying plate, a first electromagnet is mounted at the bottom of the first automatic guided vehicle, a plurality of first mounting plates corresponding to the positions of the first automatic guided vehicles are arranged at the bottom of the carrying plate, a third electromagnet mutually attracted to the first electromagnet is mounted on one side of the first mounting plate close to the carrying plate, a lower adjustment rod is mounted at the bottom of the first mounting plate, and a plurality of rubber limit sleeves are arranged on the plurality of lower adjustment rods;

[0009] The carrier plate is provided with a coating mechanism for coating solder flux on the PCB, and the coating mechanism is located in the rubber limiting sleeve;

[0010] A protective mechanism is arranged at the bottom of the bearing plate, and the rubber limiting sleeve is located inside the protective mechanism.

[0011] Preferably, the smearing mechanism includes a second automatic guided vehicle mounted on a carrying plate, a second electromagnet is mounted on the bottom of the second automatic guided vehicle, a second mounting plate corresponding to the position of the second automatic guided vehicle is arranged at the bottom of the carrying plate, a fourth electromagnet that is mutually attracted to the second electromagnet is mounted on the side of the second mounting plate close to the carrying plate, universal ball bearings are arranged on the side of the first mounting plate and the second mounting plate close to the carrying plate, a connecting box is connected to the bottom of the second mounting plate through a telescopic assembly, a plurality of smear brushes are arranged at the bottom of the connecting box, a plurality of liquid outlet holes are opened at the bottom of the connecting box, a flux box is mounted at the bottom of the second mounting plate, the flux box is loaded with flux, the flux box is connected to the connecting box through a second bellows, a liquid pump is arranged in the second bellows, and the connecting box is located in a rubber limit sleeve.

[0012] Preferably, the telescopic assembly comprises an electric telescopic rod mounted on the bottom of the second mounting plate, and a piston rod end of the electric telescopic rod is connected to the top of the connection box.

[0013] Preferably, a fixing rod is installed on the top of the second automatic guided vehicle, a mounting sleeve is fixedly sleeved on the fixing rod, a plurality of baffles are installed on the outer wall of the mounting sleeve, and upper adjustment rods are installed on the tops of the plurality of first automatic guided vehicles, rubber limiting rings are arranged on the plurality of upper adjustment rods, and the baffles are located inside the rubber limiting rings.

[0014] Preferably, a through hole is provided on the rubber limit ring, the upper adjusting rod is located in the through hole, a limiting hole is provided on the top of the rubber limit sleeve, the lower adjusting rod is located in the limiting hole, a rectangular installation groove is provided at the bottom of the rubber limit sleeve, a wiping sponge is installed in the installation groove, and the bottom end of the wiping sponge is located below the rubber limit sleeve.

[0015] Preferably, the protective mechanism includes a rubber sealing sleeve installed at the bottom of the bearing plate, the bottom end of the rubber sealing sleeve is fixed to the outer wall of the rubber limiting sleeve, and the ductility of the rubber sealing sleeve is greater than the ductility of the rubber limiting sleeve, an air purifier is installed on the mounting plate, the air inlet end of the air purifier is connected to a first bellows, the end of the first bellows passes through the bearing plate and extends into the rubber sealing sleeve, and an air pump is arranged in the first bellows.

[0016] Preferably, two fixing plates are symmetrically mounted on the bottom plate, guide rails are mounted on opposite surfaces of the two fixing plates, an electric slider is slidably mounted on the guide rail, and the mounting plate is mounted on the side of the electric slider.

[0017] Preferably, limit blocks are installed at both upper and lower ends of the guide rail, the limit blocks are fixed to the sides of the fixed plate, and a reinforcement block is fixed between the electric slider and the mounting plate.

[0018] Preferably, a raw material box and a collection box are symmetrically installed on the bottom plate, a limiting groove for limiting the PCB board is opened on the bottom plate, the limiting groove is located between the raw material box and the collection box, a limiting frame is installed on the carrying plate, and the first automatic guided vehicle is located in the limiting frame.

[0019] An operating method of a PCB solder flux coating device in the present invention comprises the following steps:

[0020] S1: Using the shape-arbitrary changing mechanism to adsorb the PCB board in the raw material box, and moving and placing the PCB board in the limiting groove to load the PCB board;

[0021] S2: using the shape arbitrary changing mechanism to adjust the shape of the rubber limit sleeve to be consistent with the shape of the area on the PCB board where solder flux needs to be applied;

[0022] S3: Apply flux to the area on the PCB board where flux is required by using the applying mechanism;

[0023] S4: The PCB board coated with flux is adsorbed again by using the arbitrary shape changing mechanism, and the PCB board coated with flux is moved and placed in the collection box for unloading processing of the PCB board.

[0024] Compared with the prior art, the present invention has the following beneficial effects:

[0025] 1: In the present invention, several first automated guided vehicles move on the carrier plate, and according to the shape of the area on the PCB board where the flux needs to be applied, the several first automated guided vehicles are moved on the carrier plate, thereby driving several lower adjustment rods to move to drive the rubber limit sleeve to make a shape consistent with the shape of the area on the PCB board where the flux needs to be applied, and the second automated guided vehicle is located between the several first automated guided vehicles, so that the shape of the rubber limit sleeve can be adjusted to be consistent with the shape of the area on the PCB board where the flux needs to be applied, and the rubber limit sleeve is used to surround the area on the PCB board where the flux needs to be applied, so that the application brush can only move in the area on the PCB board where the flux needs to be applied, and then the application brush can only apply flux to the area on the PCB board where the flux needs to be applied, thereby avoiding the problem of the flux being easily applied out of bounds when applying flux to the PCB board in the traditional way. By using the present device, the flux can be accurately applied to the area on the PCB board where the flux needs to be applied.

[0026] 2: In the present invention, a rubber limiting sleeve is used to limit the area on the PCB board where flux needs to be applied, so that the application brush can only be moved in the area on the PCB board where flux needs to be applied to apply flux. The applied flux is limited by the rubber limiting sleeve to prevent the flux applied on the PCB board from flowing on the PCB board. The flux applied on the PCB board can be limited in the rubber limiting sleeve to prevent the flux from flowing over the boundary on the PCB board and causing the flux to flow to the area on the PCB board where flux does not need to be applied. The flux applied on the PCB board can always be kept in the area on the PCB board where flux needs to be applied.

[0027] 3: In the present invention, a plurality of first automatic guided vehicles are used to move on the carrying plate to drive a plurality of lower adjustment rods to move to change the shape of the rubber limit sleeve, so that the shape of the rubber limit sleeve can be changed according to the shape of the area on the PCB board where the flux needs to be applied, so that the device can be used for PCB boards with different application areas. Through the coordinated use of a plurality of first automatic guided vehicles, the lower adjustment rods and the rubber limit sleeves, the rubber limit sleeves can be adjusted at any time according to the different shapes of the areas on the PCB board where the flux needs to be applied, so that the device can be suitable for PCB boards with different application areas.

[0028] 4: In the present invention, after the rubber limiting sleeve is used to seal the area of ​​the PCB board in the rubber limiting sleeve, the vacuum pump extracts the air in the rubber sealing sleeve and the rubber limiting sleeve. After the rubber sealing sleeve seals the rubber limiting sleeve, the opening at the bottom end of the rubber limiting sleeve can generate an adsorption force on the PCB board, and then the opening at the bottom end of the rubber limiting sleeve is used to adsorb and fix the PCB board. The movement of the first automatic guided vehicle on the carrying plate can drive the PCB board adsorbed and fixed by the opening at the bottom end of the rubber limiting sleeve to move, and the PCB board can be automatically loaded without manual loading of the PCB board.

[0029] 5: After the PCB board is adsorbed and fixed by the rubber limiting sleeve in the present invention, the PCB board can be taken out from the limiting groove by moving the electric slider upward on the guide rail, and the rubber limiting sleeve can be moved by a plurality of first automatic guided vehicles to move the PCB board adsorbed and fixed by the opening at the bottom end of the rubber limiting sleeve until the PCB board is moved to the top of the collection box and then stopped, and the PCB board can be placed in the collection box by moving the electric slider up and down on the guide rail, and the PCB board can be placed in the collection box by turning off the vacuum pump to complete the unloading process of the PCB board, and the PCB board that has been coated with flux can be automatically unloaded. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 This is a structural schematic diagram of a PCB solder flux coating device proposed by the present invention from a first perspective;

[0031] Figure 2 This is a structural schematic diagram of a PCB solder flux coating device proposed by the present invention from a second viewing angle;

[0032] Figure 3 for Figure 2 A partial enlarged view of the middle A part;

[0033] Figure 4 This is a schematic structural diagram of a PCB solder flux coating device from a third perspective proposed by the present invention;

[0034] Figure 5 A schematic diagram of the connection between a fixed plate and a guide rail of a PCB solder flux coating device proposed by the present invention;

[0035] Figure 6 A schematic diagram of the connection between the guide rail and the electric slider of a PCB solder flux coating device proposed by the present invention;

[0036] Figure 7 A schematic diagram of the connection between a mounting plate and a carrier plate of a PCB solder flux coating device proposed by the present invention;

[0037] Figure 8This is a schematic structural diagram of a rubber sealing sleeve of a PCB solder flux coating device proposed by the present invention;

[0038] Fig. 9 A schematic diagram of the connection between a lower adjustment rod and a rubber limit sleeve of a PCB solder flux coating device proposed by the present invention;

[0039] Fig.10 This is a schematic diagram of the connection between the first mounting plate and the third electromagnet of a PCB solder flux coating device proposed by the present invention;

[0040] Fig.11 for Fig.10 A partial enlarged view of part B in the middle;

[0041] Fig.12 , 13 This is a structural schematic diagram of a rubber limit sleeve of a PCB board solder flux coating device proposed by the present invention;

[0042] Fig.14 This is a schematic diagram of the connection between the second mounting plate and the electric telescopic rod of a PCB board flux coating device proposed by the present invention.

[0043] In the figure: 1, bottom plate; 2, fixing plate; 3, guide rail; 4, electric slider; 5, limit block; 6, reinforcement block; 7, mounting plate; 8, air purifier; 9, bearing plate; 10, limit frame; 11, first bellows; 12, vacuum pump; 13, raw material box; 14, collection box; 15, limit groove; 16, rubber sealing sleeve; 17, rubber limit sleeve; 18, rubber limit ring; 19, first automatic guided vehicle; 20, first electromagnet; 21, upward adjustment The whole rod; 22. The second automatic guided vehicle; 23. The second electromagnet; 24. The fixing rod; 25. The mounting sleeve; 26. The baffle; 27. The first mounting plate; 28. The lower adjustment rod; 29. ​​The connecting box; 30. The wiping sponge; 31. The third electromagnet; 32. The second mounting plate; 33. The fourth electromagnet; 34. The flux box; 35. The electric telescopic rod; 36. The second bellows; 37. The liquid pump; 38. The mounting groove; 39. The smear brush; 40. The liquid outlet. DETAILED DESCRIPTION

[0044] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0045] Reference Figure 1-14 , a PCB solder flux coating device, comprising a base plate 1, two mounting plates 7 are slidably arranged on the base plate 1, and a bearing plate 9 is installed between the two mounting plates 7;

[0046] The bearing plate 9 is provided with a mechanism for arbitrary shape change;

[0047] The shape arbitrary change mechanism includes a plurality of first automatic guided vehicles 19 mounted on a carrying plate 9, a first electromagnet 20 is mounted at the bottom of the first automatic guided vehicle 19, a plurality of first mounting pieces 27 corresponding to the positions of the first automatic guided vehicles 19 are arranged at the bottom of the carrying plate 9, a third electromagnet 31 mutually attracted to the first electromagnet 20 is mounted on the side of the first mounting piece 27 close to the carrying plate 9, a lower adjustment rod 28 is mounted at the bottom of the first mounting piece 27, and a plurality of rubber limit sleeves 17 are arranged on the lower adjustment rods 28;

[0048] The carrier plate 9 is provided with a coating mechanism for coating the PCB with solder flux, and the coating mechanism is located in the rubber limiting sleeve 17;

[0049] A protection mechanism is provided at the bottom of the bearing plate 9, and the rubber limiting sleeve 17 is located inside the protection mechanism.

[0050] As a technical optimization solution of the present invention, the smearing mechanism includes a second automatic guided vehicle 22 installed on the carrying plate 9, a second electromagnet 23 is installed at the bottom of the second automatic guided vehicle 22, a second mounting piece 32 corresponding to the position of the second automatic guided vehicle 22 is provided at the bottom of the carrying plate 9, a fourth electromagnet 33 that is mutually attracted to the second electromagnet 23 is installed on the side of the second mounting piece 32 close to the carrying plate 9, a universal ball is provided on the side of the first mounting piece 27 and the second mounting piece 32 close to the carrying plate 9, and the bottom of the second mounting piece 32 is connected by a telescopic component There is a connection box 29, and several smear brushes 39 are arranged at the bottom of the connection box 29. Several liquid outlet holes 40 are opened at the bottom of the connection box 29. A flux box 34 is installed at the bottom of the second mounting plate 32. The flux box 34 is loaded with flux. The flux box 34 is connected to the connection box 29 through a second bellows 36. A liquid pump 37 is arranged in the second bellows 36. The connection box 29 is located in the rubber limit sleeve 17. The liquid pump 37 can extract the flux in the flux box 34 into the connection box 29, and the smear brush 39 can smear the flux on the PCB board.

[0051] As a technical optimization solution of the present invention, the telescopic assembly includes an electric telescopic rod 35 installed at the bottom of the second mounting plate 32, the piston rod end of the electric telescopic rod 35 is connected to the top of the connecting box 29, and the electric telescopic rod 35 can drive the connecting box 29 to move up and down.

[0052] As a technical optimization solution of the present invention, a fixing rod 24 is installed on the top of the second automatic guided vehicle 22, a mounting sleeve 25 is fixedly sleeved on the fixing rod 24, a plurality of baffles 26 are installed on the outer wall of the mounting sleeve 25, and an upper adjustment rod 21 is installed on the top of a plurality of first automatic guided vehicles 19, a plurality of upper adjustment rods 21 are provided with rubber limit rings 18, and the baffles 26 are located inside the rubber limit rings 18.

[0053] As a technical optimization scheme of the present invention, a through hole is opened on the rubber limit ring 18, the upper adjustment rod 21 is located in the through hole, a limiting hole is opened on the top of the rubber limit sleeve 17, the lower adjustment rod 28 is located in the limiting hole, and a rectangular installation groove 38 is opened at the bottom of the rubber limit sleeve 17. A wiping sponge 30 is installed in the installation groove 38, and the bottom end of the wiping sponge 30 is located below the rubber limit sleeve 17. The installation groove 38 can provide a mounting plane for the wiping sponge 30, which is convenient for installing the wiping sponge 30 and facilitating the connection between the wiping sponge 30 and the rubber limit sleeve 17.

[0054] As a technical optimization scheme of the present invention, the protective mechanism includes a rubber sealing sleeve 16 installed at the bottom of the bearing plate 9, the bottom end of the rubber sealing sleeve 16 is fixed to the outer wall of the rubber limiting sleeve 17, and the ductility of the rubber sealing sleeve 16 is greater than the ductility of the rubber limiting sleeve 17, an air purifier 8 is installed on the mounting plate 7, the air inlet end of the air purifier 8 is connected to the first bellows 11, the end of the first bellows 11 passes through the bearing plate 9 and extends into the rubber sealing sleeve 16, an air pump 12 is arranged in the first bellows 11, the ductility of the rubber sealing sleeve 16 is greater than the ductility of the rubber limiting sleeve 17, so that when the air pump 12 extracts air from the rubber sealing sleeve 16, the rubber sealing sleeve 16 is deformed first while the rubber limiting sleeve 17 is not deformed, so that the rubber sealing sleeve 16 can be deformed first to avoid deformation of the rubber limiting sleeve 17.

[0055] As a technical optimization solution of the present invention, two fixed plates 2 are symmetrically installed on the base plate 1, and guide rails 3 are installed on the opposite surfaces of the two fixed plates 2. An electric slider 4 is slidably installed on the guide rail 3, and a mounting plate 7 is installed on the side of the electric slider 4. The fixed plate 2 can provide a mounting plane for the guide rail 3.

[0056] As a technical optimization solution of the present invention, limit blocks 5 are installed at both ends of the guide rail 3, the limit blocks 5 are fixed on the side of the fixed plate 2, and a reinforcement block 6 is fixed between the electric slider 4 and the mounting plate 7. The reinforcement block 6 can increase the connection strength between the electric slider 4 and the mounting plate 7.

[0057] As a technical optimization scheme of the present invention, a raw material box 13 and a collection box 14 are symmetrically installed on the base plate 1, and a limiting groove 15 for limiting the PCB board is opened on the base plate 1, and the limiting groove 15 is located between the raw material box 13 and the collection box 14. A limiting frame 10 is installed on the carrying plate 9, and the first automatic guided vehicle 19 is located in the limiting frame 10. The limiting frame 10 can limit the first automatic guided vehicle 19 to prevent the first automatic guided vehicle 19 from detaching from the carrying plate 9.

[0058] An operating method of a PCB solder flux coating device in the present invention comprises the following steps:

[0059] S1: using the shape-arbitrary changing mechanism to adsorb the PCB board in the raw material box 13, and moving and placing the PCB board in the limiting groove 15 to perform material loading processing on the PCB board;

[0060] S2: using the shape arbitrary changing mechanism to adjust the shape of the rubber limiting sleeve 17 to be consistent with the shape of the area on the PCB board where soldering flux needs to be applied;

[0061] S3: Apply flux to the area on the PCB board where flux is required by using the applying mechanism;

[0062] S4: The PCB board coated with solder flux is adsorbed again by using the arbitrary shape changing mechanism, and the PCB board coated with solder flux is moved and placed in the collecting box 14 to perform unloading processing on the PCB board.

[0063] When the present invention is in use, when it is necessary to apply soldering flux to the PCB board, first, start a plurality of first automatic guided vehicles 19, and utilize the adsorption between the first electromagnet 20 and the third electromagnet 31 when the plurality of first automatic guided vehicles 19 move on the carrier plate 9. When the first automatic guided vehicle 19 moves on the carrier plate 9, the lower adjustment rod 28 can be driven to move with the first automatic guided vehicle 19, and the rubber limit sleeve 17 can be driven to move by the plurality of lower adjustment rods 28. The rubber limit sleeve 17 can be made into a corresponding shape according to the position distribution of the plurality of lower adjustment rods 28, so that the area of ​​the rubber limit sleeve 17 can be smaller than the area of ​​the PCB board, and the rubber limit sleeve 17 can be moved to the top of the raw material box 13.

[0064] At this time, the electric slider 4 is started, and the electric slider 4 moves downward on the guide rail 3, thereby driving the carrying plate 9 to move upward. The downward movement of the carrying plate 9 can drive several lower adjusting rods 28 to move downward, thereby causing the rubber limit sleeve 17 to move downward until the wiping sponge 30 at the bottom of the rubber limit sleeve 17 contacts the upper surface of the PCB board, and the electric slider 4 continues to move downward on the guide rail 3, thereby causing the rubber limit sleeve 17 to move downward until the rubber limit sleeve 17 moves downward to squeeze the wiping sponge 30 into the mounting groove 38 at the bottom of the rubber limit sleeve 17, and as the rubber limit sleeve 17 continues to move downward, the bottom end of the rubber limit sleeve 17 can contact the upper surface of the PCB board until the bottom end of the rubber limit sleeve 17 generates a downward squeezing force on the PCB board to seal the area of ​​the PCB board in the rubber limit sleeve 17.

[0065] After the rubber limiting sleeve 17 is used to seal the area of ​​the PCB board in the rubber limiting sleeve 17, the vacuum pump 12 in the first bellows 11 can be started, and the vacuum pump 12 extracts the air in the rubber sealing sleeve 16 and the rubber limiting sleeve 17. After the rubber sealing sleeve 16 seals the rubber limiting sleeve 17, the opening at the bottom end of the rubber limiting sleeve 17 can generate an adsorption force on the PCB board, and then the opening at the bottom end of the rubber limiting sleeve 17 is used to adsorb and fix the PCB board. At this time, the electric slider 4 is started again, and the electric slider 4 moves upward on the guide rail 3 to drive the rubber limiting sleeve 17 and the PCB board adsorbed and fixed by the rubber limiting sleeve 17 to move up, so that the PCB board can be removed from the raw material The PCB board is taken out from the box 13, and at this time, several first automatic guided vehicles 19 are started. The first automatic guided vehicles 19 move on the carrying plate 9 to drive the PCB board fixed by the opening at the bottom end of the rubber limiting sleeve 17 to move, until the PCB board is moved to the top of the limiting groove 15 and then stops. At this time, the electric slider 4 is started to move downward on the guide rail 3, which can drive the rubber limiting sleeve 17 and the PCB board fixed by the opening at the bottom end of the rubber limiting sleeve 17 to move downward, until the PCB board is placed in the limiting groove 15 and then stops, and the vacuum pump 12 is turned off to place the PCB board in the limiting groove 15, so that the PCB board can be automatically loaded without manual loading of the PCB board.

[0066] After placing the PCB board in the limiting groove 15, start a plurality of first automatic guided vehicles 19, and the plurality of first automatic guided vehicles 19 are arranged in a row on the carrying plate 9. The electric slider 4 is used to move downward on the guide rail 3, so that the wiping sponge 30 at the bottom end of the rubber limiting sleeve 17 contacts the upper surface of the PCB board. At this time, start a plurality of first automatic guided vehicles 19 and a second automatic guided vehicle 22 to move horizontally on the carrying plate 9, and the plurality of first automatic guided vehicles 19 can drive the wiping sponge 30 at the bottom of the rubber limiting sleeve 17 to move horizontally. The upper surface of the PCB board can be wiped by the wiping sponge 30 contacting the upper surface of the PCB board, and then the dust and impurities on the upper surface of the PCB board are wiped away, so as to ensure the cleanliness of the upper surface of the PCB board and avoid the dust and impurities on the upper surface of the PCB board affecting the effect of applying the solder flux on the PCB board in the later stage.

[0067] After wiping away the dust and impurities on the upper surface of the PCB board, start several first automatic guided vehicles 19 again, and several first automatic guided vehicles 19 move on the carrying plate 9 according to the shape of the area on the PCB board where the flux needs to be applied, thereby driving several lower adjustment rods 28 to move to drive the rubber limit sleeve 17 to make a shape consistent with the shape of the area on the PCB board where the flux needs to be applied, and make the second automatic guided vehicle 22 between the several first automatic guided vehicles 19, so that the shape of the rubber limit sleeve 17 can be adjusted to be consistent with the shape of the area on the PCB board where the flux needs to be applied, and use the electric slider 4 to move downward on the guide rail 3 again until the bottom end of the rubber limit sleeve 17 contacts the upper surface of the PCB board again, and use the rubber limit sleeve 17 and the vacuum pump 12 to seal the area of ​​the PCB board in the rubber limit sleeve 17.

[0068] After the area of ​​the PCB board in the rubber limit sleeve 17 is sealed, the second automatic guided vehicle 22 is started, and the second automatic guided vehicle 22 moves on the carrier plate 9 according to the shape of the rubber limit sleeve 17, and the electric telescopic rod 35 is started at the same time, and the piston rod of the electric telescopic rod 35 pushes the connection box 29 to move downward, and the smear brush 39 at the bottom of the connection box 29 is in contact with the upper surface of the PCB board, and the liquid pump 37 is started at the same time, and the liquid pump 37 draws the flux in the connection box 29 into the connection box 29, and the flux drawn into the connection box 29 is discharged through the liquid outlet 40 at the bottom of the connection box 29, and then the flux discharged from the liquid outlet 40 is smeared on the PCB board by the smear brush 39. , and the second automatic guided vehicle 22 moves on the carrying plate 9, and the second automatic guided vehicle 22 moves according to the shape formed by the rubber limiting sleeve 17 to drive the smear brush 39 to apply the flux on the PCB board, and the rubber limiting sleeve 17 is used to surround the area on the PCB board where the flux needs to be applied, so that the smear brush 39 can only move in the area on the PCB board where the flux needs to be applied, and then the smear brush 39 can only apply the flux to the area on the PCB board where the flux needs to be applied, avoiding the problem of the traditional method of easily applying the flux out of the boundary when applying the flux to the PCB board. By using this device, the flux can be accurately applied to the area on the PCB board where the flux needs to be applied.

[0069] In addition, a plurality of first automatic guided vehicles 19 are used to move on the carrier plate 9 to drive a plurality of lower adjustment rods 28 to move to change the shape of the rubber limit sleeve 17, so that the shape of the rubber limit sleeve 17 can be changed according to the shape of the area on the PCB board where the solder flux needs to be applied, so that the device can be used for PCB boards with different application areas. Through the coordinated use of a plurality of first automatic guided vehicles 19, the lower adjustment rods 28 and the rubber limit sleeve 17, the rubber limit sleeve 17 can be adjusted at any time according to the different shapes of the areas on the PCB board where the solder flux needs to be applied, so that the device can be suitable for PCB boards with different application areas.

[0070] And when using the application brush 39 to apply flux to the PCB board, the rubber limiting sleeve 17 is used to limit the area on the PCB board where the flux needs to be applied, so that the application brush 39 can only be moved in the area on the PCB board where the flux needs to be applied to apply flux. The rubber limiting sleeve 17 is used to limit the applied flux to prevent the flux applied on the PCB board from flowing on the PCB board. The flux applied on the PCB board can be limited in the rubber limiting sleeve 17 to prevent the flux from flowing over the boundary on the PCB board and causing the flux to flow to the area on the PCB board where the flux does not need to be applied. The flux applied on the PCB board can always be kept in the area on the PCB board where the flux needs to be applied.

[0071] The rubber limiting sleeve 17 is used to limit the soldering flux applied on the PCB board, and the rubber sealing sleeve 16 is used to seal the area on the PCB board where the soldering flux needs to be applied in the rubber limiting sleeve 17. The rubber sealing sleeve 16 and the rubber limiting sleeve 17 can be used in combination to provide protection for the soldering flux applied on the PCB board, thereby preventing external dust and impurities from falling into the soldering flux on the PCB board and causing the soldering flux to be contaminated. At the same time, it can also prevent external objects from colliding with the soldering flux applied on the PCB board and causing the soldering flux to flow out of the boundary on the PCB board.

[0072] The soldering flux applied on the PCB board is sealed in the rubber sealing sleeve 16 by the rubber sealing sleeve 16 and the rubber limiting sleeve 17. The rubber sealing sleeve 16 can be used to seal the odor generated during and after the soldering flux is applied. The odor generated by the soldering flux can be sealed in the rubber sealing sleeve 16, thereby preventing the odor generated by the soldering flux and the harmful gases contained therein from wafting out to affect the surrounding air environment and the respiratory health of the surrounding staff. The odor generated by the soldering flux and the harmful gases contained therein can be sealed in the rubber sealing sleeve 16.

[0073] The position of the lower adjusting rod 28 corresponds to the position of the upper adjusting rod 21 one by one, and the shape of the rubber limiting ring 18 driven by the upper adjusting rod 21 is consistent with the shape of the rubber limiting sleeve 17. The staff can judge the shape of the rubber limiting sleeve 17 by the shape of the rubber limiting ring 18, which is convenient for the staff to check the shape of the rubber limiting sleeve 17 in real time, and the second automatic guided vehicle 22 can be limited by the rubber limiting ring 18, and the baffle 26 can be limited by the rubber limiting ring 18, so as to limit the second automatic guided vehicle 22 in the rubber limiting ring 18, so as to prevent the second automatic guided vehicle 22 from moving out of the bounds on the carrying plate 9, and the second automatic guided vehicle 22 can be limited by the rubber limiting ring 18 in the area formed by several first automatic guided vehicles 19, so as to ensure that the smear brush 39 will not apply the flux beyond the bounds.

[0074] After the flux is applied to the PCB board, the vacuum pump 12 is started again, and the opening at the bottom of the rubber limit sleeve 17 is used to adsorb and fix the PCB board, and the vacuum pump 12 draws the air in the rubber sealing sleeve 16 to extract the odor generated by the flux in the rubber sealing sleeve 16 and the harmful gases contained therein into the first bellows 11, and the odor and the harmful gases contained therein are extracted into the air purifier 8, so that the odor and the harmful gases contained therein are processed by the air purifier 8 to prevent the air containing the odor and the harmful gases contained therein from being directly discharged to the outside and polluting the external air environment.

[0075] After the PCB board is adsorbed and fixed by the rubber limiting sleeve 17, the PCB board can be taken out of the limiting groove 15 by moving the electric slider 4 upward on the guide rail 3, and a plurality of first automatic guided vehicles 19 are started to move the rubber limiting sleeve 17, so that the PCB board adsorbed and fixed by the opening at the bottom end of the rubber limiting sleeve 17 can be moved, until the PCB board is moved to the top of the collection box 14 and then stopped, and the electric slider 4 is started to move up and down on the guide rail 3 to place the PCB board in the collection box 14, and the vacuum pump 12 can be turned off to place the PCB board in the collection box 14 to complete the unloading process of the PCB board, and the PCB board that has been coated with flux can be automatically unloaded.

[0076] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A PCB solder flux coating device, comprising a base plate (1), characterized in that: Two mounting plates (7) are slidably arranged on the bottom plate (1), and a bearing plate (9) is installed between the two mounting plates (7); The bearing plate (9) is provided with a mechanism for changing shape at will; The arbitrary shape changing mechanism comprises a plurality of first automatic guided vehicles (19) mounted on a carrying plate (9), a first electromagnet (20) being mounted on the bottom of the first automatic guided vehicles (19), a plurality of first mounting plates (27) corresponding to the positions of the first automatic guided vehicles (19) being arranged on the bottom of the carrying plate (9), a third electromagnet (31) being mounted on a side of the first mounting plate (27) close to the carrying plate (9) and being attracted to the first electromagnet (20), a lower adjustment rod (28) being mounted on the bottom of the first mounting plate (27), and a plurality of rubber limit sleeves (17) being arranged on the plurality of lower adjustment rods (28); The carrier plate (9) is provided with a coating mechanism for coating solder flux on the PCB, and the coating mechanism is located inside the rubber limiting sleeve (17); A protective mechanism is provided at the bottom of the bearing plate (9), and the rubber limiting sleeve (17) is located inside the protective mechanism.

2. A PCB board soldering flux coating device according to claim 1, characterized in that: The smearing mechanism comprises a second automatic guided vehicle (22) mounted on a carrying plate (9), a second electromagnet (23) being mounted on the bottom of the second automatic guided vehicle (22), a second mounting plate (32) corresponding to the position of the second automatic guided vehicle (22) being arranged on the bottom of the carrying plate (9), a fourth electromagnet (33) mutually attracted to the second electromagnet (23) being mounted on a side of the second mounting plate (32) close to the carrying plate (9), a universal ball bearing being arranged on a side of the first mounting plate (27) and a side of the second mounting plate (32) close to the carrying plate (9), and a fourth electromagnet (33) being arranged on a side of the second mounting plate (32) close to the carrying plate (9). The bottom of the second mounting piece (32) is connected to a connection box (29) via a telescopic assembly, a plurality of smear brushes (39) are arranged at the bottom of the connection box (29), a plurality of liquid outlet holes (40) are opened at the bottom of the connection box (29), a soldering flux box (34) is installed at the bottom of the second mounting piece (32), soldering flux is loaded in the soldering flux box (34), the soldering flux box (34) is connected to the connection box (29) via a second bellows (36), a liquid pump (37) is arranged in the second bellows (36), and the connection box (29) is located in the rubber limiting sleeve (17).

3. A PCB board soldering flux coating device according to claim 2, characterized in that: The telescopic assembly comprises an electric telescopic rod (35) mounted on the bottom of the second mounting plate (32), and the piston rod end of the electric telescopic rod (35) is connected to the top of the connection box (29).

4. A PCB board soldering flux coating device according to claim 2, characterized in that: A fixing rod (24) is mounted on the top of the second automated guided vehicle (22); a mounting sleeve (25) is fixedly sleeved on the fixing rod (24); a plurality of baffles (26) are mounted on the outer wall of the mounting sleeve (25); upper adjustment rods (21) are mounted on the tops of the plurality of first automated guided vehicles (19); a rubber limiting ring (18) is disposed on the plurality of upper adjustment rods (21); and the baffles (26) are located inside the rubber limiting ring (18).

5. A PCB soldering flux coating device according to claim 4, characterized in that: The rubber limiting ring (18) is provided with a through hole, the upper adjustment rod (21) is located in the through hole, the top of the rubber limiting sleeve (17) is provided with a limiting hole, the lower adjustment rod (28) is located in the limiting hole, the bottom of the rubber limiting sleeve (17) is provided with a rectangular installation groove (38), a wiping sponge (30) is installed in the installation groove (38), and the bottom end of the wiping sponge (30) is located below the rubber limiting sleeve (17).

6. A PCB soldering flux coating device according to claim 1, characterized in that: The protective mechanism comprises a rubber sealing sleeve (16) mounted on the bottom of the bearing plate (9), the bottom end of the rubber sealing sleeve (16) being fixed to the outer wall of the rubber limiting sleeve (17), and the ductility of the rubber sealing sleeve (16) being greater than the ductility of the rubber limiting sleeve (17), an air purifier (8) being mounted on the mounting plate (7), an air inlet end of the air purifier (8) being connected to a first bellows (11), an end of the first bellows (11) passing through the bearing plate (9) and extending into the rubber sealing sleeve (16), and an air pump (12) being arranged in the first bellows (11).

7. A PCB soldering flux coating device according to claim 1, characterized in that: Two fixed plates (2) are symmetrically mounted on the bottom plate (1), guide rails (3) are mounted on opposite surfaces of the two fixed plates (2), an electric slider (4) is slidably mounted on the guide rail (3), and a mounting plate (7) is mounted on the side of the electric slider (4).

8. A PCB soldering flux coating device according to claim 7, characterized in that: Limit blocks (5) are installed at both upper and lower ends of the guide rail (3), the limit blocks (5) are fixed to the side of the fixed plate (2), and a reinforcement block (6) is fixed between the electric slider (4) and the mounting plate (7).

9. A PCB board soldering flux coating device according to claim 1, characterized in that: A raw material box (13) and a collection box (14) are symmetrically mounted on the bottom plate (1). A limiting groove (15) for limiting the position of the PCB board is provided on the bottom plate (1). The limiting groove (15) is located between the raw material box (13) and the collection box (14). A limiting frame (10) is mounted on the carrier plate (9). The first automatic guided vehicle (19) is located within the limiting frame (10).

10. A method for operating a PCB solder flux coating device as claimed in any one of claims 1 to 9, characterized in that: The operation method includes the following steps: S1: using the shape-arbitrary changing mechanism to adsorb the PCB board in the raw material box (13), and moving and placing the PCB board in the limiting groove (15) to perform a loading process on the PCB board; S2: using the shape arbitrary changing mechanism to adjust the shape of the rubber limiting sleeve (17) to be consistent with the shape of the area on the PCB board where soldering flux needs to be applied; S3: Apply flux to the area on the PCB board where flux is required by using the applying mechanism; S4: The PCB board coated with solder flux is adsorbed again by using the arbitrary shape changing mechanism, and the PCB board coated with solder flux is moved and placed in a collection box (14) to perform unloading processing on the PCB board.

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