Semiconductor virtual machine system, method, device and medium

Abstract

The embodiment of the invention relates to the technical field of semiconductor processing, and discloses a semiconductor virtual machine system, method, equipment and medium. The system comprises a basic physical module, and the basic physical module comprises a loading port, a mechanical arm and a processing unit and is used for simulating transmission and processing behaviors of wafers in a machine table; the virtual equipment control platform is connected with the basic physical module and is used for controlling the basic physical module according to a received instruction of a host system; the communication module defines a communication interface of a virtual machine based on an SEM I standard, and communicates with the host system; and the behavior model is used for defining a transportation flow and a processing flow of the wafer. The technical problem that the compatibility of a virtual machine is poor can be solved at least.

Description

Technical Field

[0001] The present application relates to the field of semiconductor processing technology, and in particular to a semiconductor virtual machine system, method, device and medium. Background Art

[0002] In modern semiconductor manufacturing processes, the wafer processing process requires highly automated production equipment to ensure product accuracy, production efficiency and yield. Semiconductor machines (i.e. processing equipment) are the core components of semiconductor manufacturing and are used to complete the transmission, positioning and various process processing of wafers. Usually, each machine reports the equipment status and processing progress in real time through communication with the host system, and receives host instructions to perform corresponding operations. In this process, equipment communication and behavior control are important links in achieving automated production. However, there are many differences between different semiconductor manufacturers and equipment models, resulting in a lack of unified standards in control methods, operating procedures and communication protocols, which brings challenges to the compatibility and maintenance of equipment. In order to improve the compatibility between semiconductor equipment, the International Semiconductor Industry Association (SEMI) has developed a series of standards.

[0003] In recent years, with the rapid development of virtualization technology, semiconductor manufacturing companies have begun to apply virtual machine technology to simulate the behavior of real equipment and realize the simulation and testing of production lines. Virtual machines can not only effectively reduce the interference of equipment testing on actual production, but also provide a low-cost simulation environment for equipment debugging, software development, employee training, etc. However, in the design and implementation of virtual machines, there is a lack of a universal, SEMI-compliant infrastructure, which often requires a lot of customization work for the development of virtual machines, increasing the difficulty of development and maintenance costs. Summary of the invention

[0004] One object of the present application is to provide a semiconductor virtual machine system, method, device and medium, at least to solve the technical problem of poor compatibility of virtual machines.

[0005] To achieve the above objectives, some embodiments of the present application provide the following aspects:

[0006] In the first aspect, some embodiments of the present application also provide a semiconductor virtual machine system, including a basic physical module, the basic physical module including a loading port, a robotic arm and a processing unit, for simulating the transmission and processing behavior of wafers in the machine; a virtual device control platform, the virtual device control platform is connected to the basic physical module, and is used to control the basic physical module according to instructions received from the host system; a communication module, the communication module defines the communication interface of the virtual machine based on the SEMI standard, and communicates with the host system; a behavior model, the behavior model is used to define the transportation process and processing process of the wafer.

[0007] On the second aspect, some embodiments of the present application also provide a semiconductor virtual machine processing method, which is applied to the above-mentioned system, including receiving a FOUP and placing it at the loading port; reporting the arrival status of the FOUP to the host system through a communication module, and reading the ID and SlotMap information of the FOUP, waiting for verification and confirmation by the host system; after confirmation by the host system, starting the virtual device control platform, instructing a robotic arm to take out the wafer from the FOUP, and transferring the wafer to a processing unit; executing a processing flow on the wafer in the processing unit, and after the processing is completed, the robotic arm puts the wafer back into the FOUP; after all wafers are processed, sending a processing completion status to the host system through the communication module; instructing the FOUP to leave the loading port, and waiting for the host system to confirm that the removal operation of the FOUP is completed.

[0008] In a third aspect, some embodiments of the present application further provide an electronic device, comprising: one or more processors; and a memory storing computer program instructions, wherein the computer program instructions, when executed, cause the processor to perform the steps of the method described above.

[0009] In a fourth aspect, some embodiments of the present application further provide a computer-readable medium having computer program instructions stored thereon, wherein the computer program instructions can be executed by a processor to implement the method as described above.

[0010] Compared with the related art, the solution provided in the embodiment of the present application is a universal semiconductor virtual machine system based on the SEMI standard, which covers physical modules such as loading ports, robotic arms, and processing units through a modular architecture design, and introduces a virtual device control platform to uniformly manage the behavior control of the equipment. The system can simulate the transmission and processing flow of wafers in an actual production environment, and interact with the host system using a standardized communication interface to meet the virtualization requirements of different models of equipment. This technical solution not only has good compatibility and scalability, but also can significantly reduce the development and maintenance costs of virtual machines, meeting the needs of modern semiconductor manufacturers for flexible and efficient production. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0012] Figure 1 A schematic diagram of the structure of a semiconductor virtual machine system provided according to an embodiment of the present application;

[0013] Figure 2 A schematic diagram of a process of a semiconductor virtual machine processing method provided according to an embodiment of the present application;

[0014] Figure 3 The present invention is a schematic diagram of the structure of an electronic device provided according to an embodiment of the present application. DETAILED DESCRIPTION

[0015] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0016] The following terms are used in this article.

[0017] Virtual Machine: A software that virtualizes semiconductor equipment and simulates the automated behavior of the equipment.

[0018] SEMI: The full name is Semiconductor Equipment And Material International, which is the International Semiconductor Industry Association.

[0019] Load Port: Loading port is the location where goods are unloaded and unloaded on the semiconductor machine.

[0020] Robot: A robotic arm used to transfer wafers within the machine.

[0021] Process Module: The processing unit is the processing position of the wafer in the machine.

[0022] SEMI E37: HIGH-SPEED SECS MESSAGE SERVICES (HSMS) GENERIC SERVICES, referred to as HSMS, is a TCP / IP-based communication protocol used for fast transmission of SECS-II messages.

[0023] SEMI E5: SEMI EQUIPMENT COMMUNICATIONS STANDARD 2MESSAGE CONTENT (SECS-II), provides a standardized message passing system for complex communications between equipment and host systems.

[0024] FOUP: The full name is Front Opening Unified Pod, a front-opening wafer transfer box used for storage and transportation of wafers in the factory.

[0025] SlotMap: The occupancy of slots in FOUP. Each FOUP has 25 slots.

[0026] The present application embodiment relates to a semiconductor virtual machine system. Figure 1 As shown, the system may include:

[0027] The basic physics module includes a loading port, a robotic arm and a processing unit, and is used to simulate the transmission and processing behavior of the wafer in the machine.

[0028] The loading port supports the parallel processing of multiple FOUPs, which improves the throughput of the system and can adapt to different production requirements. By automatically reading the ID and slot information of the FOUP, it ensures the accuracy of the loading and transmission process and reduces the risk of misoperation. The robotic arm has the ability to precisely control multiple degrees of freedom and can accurately transfer wafers between different positions. Its path and transmission sequence can be flexibly adjusted according to process requirements to ensure that the wafers are processed in the preset process sequence, greatly improving the transmission efficiency and production flexibility of the system. The processing unit supports a variety of process operations (such as etching, coating, polishing, etc.), and can process multiple process steps in parallel through different stations, optimizing the processing flow. The configuration of the processing unit supports the customized requirements of different products, making the system compatible with multiple processes and improving the adaptability of the equipment.

[0029] A virtual device control platform is connected to the basic physical module and is used to control the basic physical module according to instructions received from the host system.

[0030] The virtual equipment control platform (vEQP) can automatically control the transmission, processing and homing of wafers through behavioral models, reducing manual intervention and improving the automation level of the system. Its control capabilities ensure the orderly transmission and processing, making the system run more efficiently. vEQP can flexibly set processing parameters and sequences according to the instructions of the host system to meet diverse process requirements. Its flexible configuration characteristics enable the equipment to quickly adapt to the production requirements of different models and processes, significantly improving the production efficiency and process adaptability of the system. vEQP has powerful fault detection and processing capabilities. By monitoring the status of each physical module in real time, it can respond quickly when an abnormality occurs. The system can take measures such as suspending operations, re-executing steps, or reporting to the host system according to the type of fault, effectively reducing the production impact caused by the fault and improving the stability of the system.

[0031] A communication module defines a communication interface of the virtual machine based on the SEMI standard and communicates with the host system.

[0032] The use of the HSMS protocol enables the communication module to achieve high-speed and reliable data transmission through TCP / IP, meeting the needs of large data volumes and high-frequency communications in semiconductor production. Its reliability assurance mechanism ensures the accuracy of data during the communication process and effectively reduces the risk of information loss. The communication module uses the SEMI E5 standard to format data, ensuring a consistent data structure between the host system and the virtual machine, allowing different devices to be seamlessly compatible and interactive. This standardized design facilitates the integration of multiple models of virtual devices into the same production system, improving the interoperability of the system. The communication module has anomaly detection and automatic recovery capabilities, and can take retry and error reporting measures in time when the network is interrupted or the data is erroneous, ensuring the continuity of data communication. Its automatic reconnection function can quickly restore communication and reduce the impact of interruptions on the production process.

[0033] A behavior model is used to define a transportation process and a processing process of a wafer.

[0034] Each step in the behavior model is strictly carried out in accordance with the actual production sequence and operation requirements to ensure that the behavior of the virtual machine is consistent with the real equipment. The system can complete the transmission, processing and homing of the wafer according to the preset process, which is convenient for achieving accurate simulation effects. Each step of the behavior model interacts with the host system in real time, and reports and feedbacks information through the communication module, ensuring the real-time monitoring and control of the virtual machine by the host system. The system can flexibly adjust the transmission path and processing sequence according to the host instructions to achieve efficient and intelligent operation management. The behavior model has built-in fault handling strategies, which enables the system to automatically adjust and restore the process when a fault occurs. For example, re-grabbing the wafer, re-executing the processing steps, etc., improves the system's fault tolerance and emergency response capabilities, and ensures the stable operation of the system.

[0035] The following is a detailed description of each of the above steps.

[0036] The basic physics module is used to simulate the wafer transfer and processing behavior in semiconductor machines. The design of this module is based on the actual process of semiconductor manufacturing, covering the entire process from loading, transfer to processing. The module consists of a loading port, a robotic arm, and a processing unit. The functions and configurations of each component are as follows:

[0037] The load port is used to receive and store wafer boxes (FOUPs), which is the interface for wafers to enter and leave the virtual machine. Each load port is equipped with sensors and reading devices that can identify the ID information of the FOUP and detect the occupancy of the slots (SlotMap) in the FOUP. When the FOUP arrives at the load port, the system automatically reads the ID and slot information of the FOUP, and sends this information to the host system through the communication module for verification. After the host system completes the verification, it will send a confirmation signal to allow subsequent transmission and processing operations. The number of load ports can be flexibly configured according to the throughput requirements of the production line. For example, in a high-capacity environment, multiple load ports can be configured to receive or send multiple FOUPs at the same time to improve production efficiency.

[0038] The robot is responsible for transferring wafers between the loading port and the processing unit. The robot has multi-degree-of-freedom transmission capabilities and can accurately move wafers between different positions to ensure that the wafers are transferred according to the specified process flow. The robot's movement path, transmission speed, and transmission sequence are controlled by the virtual equipment control platform (vEQP). vEQP controls the movement of the robot according to the instructions of the host system, so that it can take the wafer out of the loading port, transfer it to the designated processing unit, and return the wafer to the loading port after processing. The robot can adjust the transmission direction and path as needed to meet the needs of different processing procedures. For example, in some processes, the robot needs to transfer wafers from one processing unit to another to complete multi-step processing operations.

[0039] The Process Module is used to perform actual process processing on the wafer, including etching, coating, polishing and other steps. This unit is the core component for realizing the processing behavior of the virtual machine. The processing unit can contain multiple independent stations, each of which can be configured to perform specific process steps. For example, one station can be configured for etching, while another station is used for coating, ensuring that different process operations can be completed independently and in parallel. The specific processing sequence and parameters can be flexibly configured through the virtual device control platform. For example, the virtual device control platform can set process parameters such as processing time, temperature, pressure, etc. according to the instructions of the host system to meet different wafer processing requirements. In addition, the platform can also set the order of processing, such as automatically transferring the wafer to the coating station after etching is completed.

[0040] The virtual equipment control platform (vEQP) is the core control unit of this system, responsible for managing and coordinating the operation of basic physical modules (loading port, robotic arm, processing unit) to ensure the smooth progress of wafer transmission and processing flow. Through interaction with the host system, vEQP receives and executes instructions to simulate the automated operation of semiconductor equipment. The following are the main functional modules of vEQP and their specific implementation:

[0041] vEQP defines the wafer transfer and processing flow based on a preset behavior model. The behavior model specifies the order and operating parameters of each step to ensure that the wafer completes the transfer and processing tasks in the machine according to a specific process. When vEQP receives instructions from the host system, it first identifies and verifies the ID and slot information of the FOUP through the loading port. After confirmation, vEQP controls the robotic arm to take out the wafer from the loading port and transfer it to the designated processing unit according to the preset path. vEQP can dynamically adjust the wafer transfer order according to the requirements of the host system. For example, high-priority wafers can be transferred first, or qualified processing units can be given priority in a multi-step processing flow. After processing is completed, vEQP controls the robotic arm to put the wafer back into the designated slot of the loading port and wait for subsequent operations.

[0042] Processing step configuration includes: process parameter setting, vEQP sets various parameters of the processing unit according to the process requirements of the host system, including processing time, temperature, pressure, etc., to ensure the processing accuracy of the wafer. For example, in the etching process, vEQP can set the etching time and gas flow to meet specific process requirements.

[0043] For processing units with multiple stations, vEQP can select a specific station to perform processing tasks according to actual needs. For example, when one station is processing a wafer, vEQP can transfer the next wafer to an idle station for processing to improve processing efficiency. It can switch between multiple process steps to adapt to the process requirements of different products or batches. For example, the system can automatically switch to the coating process after completing the etching operation, and adjust the process parameters according to the instructions of the host system to ensure that each wafer is processed according to the predetermined process flow.

[0044] vEQP monitors the transmission and processing process in real time, and determines the operation status of each physical module through the status information fed back by the sensors. For example, it monitors the movement position of the robot arm, the temperature and pressure of the processing unit to ensure the accuracy and safety of the operation. When an abnormal situation occurs during the transmission or processing process (such as deviation of the robot arm position, excessive temperature of the processing unit, etc.), vEQP can immediately detect and record the abnormal information. Through the built-in diagnostic module, vEQP can quickly analyze the cause of the problem and handle it according to the preset strategy.

[0045] The exception handling mechanism includes suspending operations. When a serious fault occurs (such as a robot arm error or excessive temperature in the processing unit), vEQP will immediately suspend all operations to avoid wafer damage or equipment loss; re-executing steps. For non-serious faults (such as slight transmission deviation), vEQP can re-execute specific steps based on the behavioral model to ensure operational accuracy, for example, re-grabbing the wafer and placing it in the correct position; fault reporting, which can send fault information to the host system in a standardized format. After receiving the report, the host system can decide whether to stop other operations, perform equipment maintenance, or reset control parameters.

[0046] The communication module is responsible for data communication between the virtual machine and the host system. The communication module uses the standard protocol and data format established by the International Semiconductor Industry Association (SEMI) to ensure the efficiency and reliability of data transmission and the interoperability between devices. Through the standardized interface, the communication module can interact with the host system at a high speed and stably. Its main functions and implementation methods are as follows:

[0047] The HSMS (High Speed ​​SECS Message Service) protocol is part of the SEMI E37 standard and is used for high-speed data transmission between semiconductor devices and host systems based on TCP / IP. Compared with traditional serial communication methods, the HSMS protocol is transmitted over the network, which significantly improves the communication speed and data processing capabilities, and is very suitable for high data volume and high frequency process environments.

[0048] The communication module uses the HSMS protocol to establish a connection with the host system through the TCP / IP network. When the system starts, the communication module will establish a secure communication channel with the host system through the TCP / IP protocol to ensure accurate data transmission and real-time performance. During the operation of the equipment, the communication module will continuously detect the communication status to ensure high-speed data exchange between the host system and the virtual machine.

[0049] The HSMS protocol supports a message confirmation mechanism, that is, after each message is sent, the receiver must confirm that the message has been received. This mechanism ensures data reliability and avoids data loss. In addition, HSMS also supports real-time detection of abnormal conditions. If the communication connection is interrupted, the communication module will immediately notify the virtual device control platform so that the system can respond in time.

[0050] The data format based on the SEMI E5 standard defines the content format and syntax of the SECS-II message, which is used to standardize the message structure between the host system and the equipment. Through the standardized data format, the communication module can ensure the compatibility and interoperability between different models of equipment and the host system. The communication module formats the transmitted data according to the SEMI E5 standard and converts the data such as instructions, status information, fault reports, etc. into a unified SECS-II message format. For example, when the host system sends a processing instruction to the virtual machine, the communication module encodes the instruction information into a message structure that complies with the SECS-II standard, so that the virtual machine can accurately interpret and execute the instruction.

[0051] The SEMI E5 standard supports multiple data types (such as integers, floating point numbers, strings, etc.) and data structures (such as lists, arrays, dictionaries, etc.), allowing the communication module to flexibly transmit various types of information. For example, when transmitting process parameters (such as temperature, pressure, and processing time), the communication module can select the appropriate data type and structure as needed to ensure the integrity and accuracy of the information.

[0052] Implementation of the communication process. When the virtual machine system is started, the communication module establishes a communication session with the host system through the HSMS protocol. The communication module first sends a connection request, and the host system completes the establishment of the session after confirmation. This session is used to transmit control instructions and status information throughout the entire processing flow. In actual operation, the host system can send various control instructions to the virtual machine through the communication module, such as processing start, pause, and end operations. The communication module will parse the host system's instructions according to the SEMI E5 standard and pass the instructions to the virtual device control platform. At the same time, the status information of the virtual machine (such as loading port status, robot arm position, processing unit temperature, etc.) will be fed back to the host system in real time through the communication module, so that the host can monitor the operation of the virtual machine.

[0053] During data communication, if a network interruption or data anomaly (such as message loss, data error) occurs, the communication module will immediately trigger the error handling mechanism. The communication module will try to re-establish the connection or send a fault notification to the host system through the error reporting function of the SECS-II standard so that the host system can take further measures. The communication module also supports an automatic retry mechanism to ensure that normal communication is quickly restored after a short network interruption.

[0054] The behavioral model is used to simulate the wafer transfer and processing process in the semiconductor manufacturing process to ensure that the virtual machine system can accurately reproduce the process operations in actual production. The behavioral model includes key steps such as the arrival of FOUP, wafer processing, and the departure of FOUP. Through this model, the virtual machine can perform various operations in sequence to achieve coordinated interaction with the host system. The specific process is described as follows:

[0055] FOUP arrival process: When the FOUP (wafer box) arrives at the loading port, the sensor of the loading port will automatically identify the arrival status of the FOUP and start the reading operation. The system reads the ID information and slot occupancy (SlotMap) of the FOUP through the loading port to obtain the number and location of the wafers in the current FOUP. SlotMap data can provide information about which slots are occupied and which are empty, which is convenient for subsequent processing and return operations. The FOUP information read by the loading port will be reported to the host system through the communication module. The host system verifies the FOUP ID and SlotMap information to confirm whether the FOUP meets the preset conditions. After the host system completes the verification, it sends a processing permission signal to the virtual device control platform. After receiving the processing permission, the virtual device control platform starts to execute the wafer processing flow.

[0056] Wafer processing flow: The virtual device control platform controls the robot arm to take out the wafer to be processed from the FOUP and transfer it to the designated station in the processing unit. The transmission path and placement accuracy of the robot arm are controlled by the preset behavior model to ensure that the wafer reaches the processing position accurately. After the wafer is transferred to the processing unit, the virtual device control platform sets the processing parameters, such as temperature, pressure, time, etc., according to the process requirements of the host system. The behavior model predefines various processing steps to meet different process requirements. The processing unit performs specific process operations on the wafer under the set parameters, such as heating, etching or coating. The process can include multiple process steps, which are controlled by the process sequence in the behavior model to ensure that each wafer is processed according to the established process route. When the processing step is completed, the virtual device control platform instructs the robot arm to take the processed wafer out of the processing unit and accurately put it back to the original slot of the FOUP. The movement of the robot arm is controlled by the process of the behavior model to ensure that the wafer returns to the designated slot for subsequent transportation operations.

[0057] FOUP leaving the machine process: When all wafers in the FOUP have been processed, the virtual device control platform sends a confirmation message of the completion of the processing to the host system. At this time, the loading port waits for the removal command from the host system. After receiving the confirmation message of the completion of the processing, the host system verifies the status and SlotMap of the FOUP to confirm that all wafers have been correctly placed and processed. After confirmation, the host system sends a FOUP removal command to the virtual device control platform. After receiving the removal command, the virtual device control platform switches the loading port to the waiting state to prepare for the removal of the FOUP. After the FOUP is removed from the loading port, the process ends, and the FOUP waits to enter the next process or leave the machine.

[0058] It is not difficult to find that in the embodiment of the present application, the semiconductor virtual machine system achieves efficient and stable operation of the equipment with a highly compatible standardized design, an intelligent control platform, and a precise process simulation process. The system is highly adaptable, easy to integrate, and significantly reduces development and maintenance costs. It can meet the virtualization needs in a variety of semiconductor manufacturing scenarios, bringing great production flexibility and cost advantages to semiconductor companies.

[0059] It is worth mentioning that all modules involved in this embodiment are logic modules. In practical applications, a logic unit can be a physical unit, a part of a physical unit, or a combination of multiple physical units. In addition, in order to highlight the innovative part of this application, this embodiment does not introduce units that are not closely related to solving the technical problems proposed by this application, but this does not mean that there are no other units in this embodiment.

[0060] The embodiment of the present application relates to a semiconductor virtual machine processing method, which is applied to the above system, and the method includes:

[0061] S101, receiving a FOUP and placing it at a loading port;

[0062] S102, reporting the arrival status of the FOUP to the host system through the communication module, reading the ID and SlotMap information of the FOUP, and waiting for verification and confirmation by the host system;

[0063] S103, after confirmation by the host system, start the virtual device control platform, instruct the robot arm to take out the wafer from the FOUP, and transfer the wafer to the processing unit;

[0064] S104, performing a processing flow on the wafer in the processing unit, and placing the wafer back into the FOUP by the robotic arm after the processing is completed;

[0065] S105, after all wafers are processed, a processing completion status is sent to the host system through the communication module;

[0066] S106, instructing the FOUP to leave the loading port and waiting for the host system to confirm that the FOUP removal operation is completed.

[0067] It is not difficult to find that in the embodiments of the present application, through automated process control, precise process simulation and reliable real-time communication, not only the production efficiency and process accuracy of the equipment are improved, but also simple system maintenance and flexible configuration adjustment are achieved, greatly optimizing the overall performance of the semiconductor virtual machine.

[0068] The step division of the above methods is only for the purpose of clear description. When implemented, they can be combined into one step or some steps can be split and decomposed into multiple steps. As long as they include the same logical relationship, they are all within the scope of protection of this patent; adding insignificant modifications to the algorithm or process or introducing insignificant designs without changing the core design of the algorithm and process are all within the scope of protection of this patent.

[0069] In addition, some embodiments of the present application also provide an electronic device. The electronic device may be a digital computer in various forms, such as a laptop computer, a desktop computer, a workbench, a personal digital assistant, a server, a blade server, a mainframe computer, etc. The electronic device may also be a mobile device in various forms, such as a personal digital processing, a cellular phone, a smart phone, a wearable device, and other similar computing devices.

[0070] The electronic device includes: one or more processors; and a memory storing computer program instructions, wherein when the computer program instructions are executed, the processor executes the steps of the method provided in any one or more of the above embodiments. Figure 3 An exemplary structural diagram of the electronic device is disclosed. Figure 3 As shown, the electronic device includes: one or more processors 1101, memory 1102, and interfaces for connecting various components, including high-speed interfaces and low-speed interfaces. The various components are connected to each other using different buses and can be installed on a common mainboard or installed in other ways as needed. The processor can process instructions executed in the electronic device, including instructions stored in or on the memory to display graphical information of the GUI on an external input / output device (such as a display device coupled to the interface). In some other embodiments, if necessary, multiple processors and / or multiple buses can be used together with multiple memories and multiple memories. Similarly, multiple electronic devices can be connected, and each device provides some necessary operations (for example, as a server array, a group of blade servers, or a multi-processor system). Among them, the components shown in this article, their connections and relationships, and their functions are only used as examples, and are not intended to limit the implementation of the present application described and / or required herein.

[0071] The electronic device may further include: an input device 1103 and an output device 1104. The processor 1101, the memory 1102, the input device 1103 and the output device 1104 may be connected via a bus or other means. Figure 3 The example of connecting through bus is taken in the following.

[0072] The input device 1103 can receive input digital or character information, and generate key signal input related to the user settings and function control of the electronic device, such as a touch screen, a keypad, a mouse, a track pad, a touch pad, an indicator bar, one or more mouse buttons, a trackball, a joystick and other input devices. The output device 1104 may include a display device, an auxiliary lighting device (e.g., an LED) and a tactile feedback device (e.g., a vibration motor), etc. The display device may include, but is not limited to, a liquid crystal display (LCD), a light emitting diode (LED) display and a plasma display. In some embodiments, the display device may be a touch screen.

[0073] To provide interaction with a user, the electronic device may be a computer. The computer has: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or a trackball), through which the user can provide input to the computer. Other types of devices may also be used to provide interaction with the user; for example, the feedback provided to the user may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form (including acoustic input, voice input, or tactile input).

[0074] In the embodiments of the present application, a computer program / instruction is stored on a computer-readable medium, and when the computer program / instruction is executed by a processor, the steps of the method provided by any one or more of the above embodiments are implemented. The computer-readable medium may be included in the electronic device described in the above embodiments; or it may exist independently without being assembled into the device. The above computer-readable medium carries one or more computer-readable instructions.

[0075] The memory 1102 can be used as a non-transient computer-readable storage medium, which can be used to store non-transient software programs, non-transient computer executable programs and modules. The processor 1101 executes various functional applications and data processing of the server by running the non-transient software programs, instructions and modules stored in the memory 1102, so as to implement the program instructions / modules corresponding to the method provided by any one or more embodiments in the embodiments of the present application.

[0076] The memory 1102 may include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application required for at least one function; the data storage area may store data created according to the use of the electronic device, etc. In addition, the memory 1102 may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage device. In some embodiments, the memory 1102 may optionally include a memory remotely arranged relative to the processor 1101, and these remote memories may be connected to the electronic device via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0077] It should be noted that the computer-readable medium described in the present application may be a computer-readable signal medium or a computer-readable storage medium or any combination of the above two. The computer-readable medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared or semiconductor system, device or device, or any combination of the above. More specific examples of computer-readable storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the present application, a computer-readable medium may be any tangible medium containing or storing a program that can be used by or in combination with an instruction execution system, device or device.

[0078] Computer readable media include permanent and non-permanent, removable and non-removable media, and can be implemented by any method or technology to store information. Information can be computer readable instructions, data structures, modules of programs or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, read-only compact disk (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, magnetic tape disk storage or other magnetic storage devices or any other non-transmission media that can be used to store information that can be accessed by a computing device.

[0079] Computer program code for performing the operations of the present application may be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages, such as Java, Smalltalk, C++, and conventional procedural programming languages, such as "C" or similar programming languages. The program code may be executed entirely on the user's computer, partially on the user's computer, as a separate software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving a remote computer, the remote computer may be connected to the user's computer via any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0080] In the above-described embodiments, it can be implemented in whole or in part by software, hardware, firmware or any combination thereof. For example, it can be implemented by using an application specific integrated circuit (ASIC), a general-purpose computer or any other similar hardware device. In certain embodiments, the software program of the present application can be executed by a processor to implement the above steps or functions. Similarly, the software program of the present application (including relevant data structures) can be stored in a computer-readable recording medium, for example, a RAM memory, a magnetic or optical drive or a floppy disk and similar devices. In addition, some steps or functions of the present application can be implemented by hardware, for example, as a circuit that cooperates with a processor to perform each step or function.

[0081] The computer program product provided in the embodiment of the present application includes one or more computer programs / instructions, and when the computer program / instructions are executed by the processor, the process or function described in the embodiment of the present application is generated in whole or in part. The computer may be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions may be stored in a computer-readable storage medium, or transmitted from a computer-readable storage medium to another computer-readable storage medium, for example, the computer instructions may be transmitted from a website site, a computer, a server or a data center by wired (e.g., coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) mode to another website site, computer, server or data center. The computer-readable storage medium may be any available medium that a computer can access or a data storage device such as a server or a data center that includes one or more available media integrations. The available medium may be a magnetic medium, (e.g., a floppy disk, a hard disk, a tape), an optical medium (e.g., a DVD), or a semiconductor medium (e.g., a solid state disk (SSD)), etc.

[0082] The flow chart or block diagram in the accompanying drawings shows the possible architecture, function and operation of the equipment, method and computer program product according to various embodiments of the present application. In this regard, each box in the flow chart or block diagram can represent a module, a program segment or a part of a code, and the module, a program segment or a part of a code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flow chart, and the combination of the boxes in the block diagram and / or flow chart can be implemented with a dedicated system for hardware that performs a specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0083] The scope of the present application is defined by the appended claims rather than the above description, and it is intended that all changes that fall within the meaning and scope of the equivalent elements of the claims are included in the present application. Any figure mark in the claims should not be regarded as limiting the claims involved. In addition, it is clear that the word "comprising" does not exclude other units or steps, and the singular does not exclude the plural. Multiple units or devices stated in the device claim may also be implemented by one unit or device through software or hardware. The words "first", "second", etc. are only used to distinguish the description, and do not indicate any particular order, nor can they be understood as indicating or implying relative importance.

[0084] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily mention changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims, and the above embodiments should be regarded as exemplary and non-restrictive.

Claims

1. A semiconductor virtual machine system, characterized in that: The system comprises: A basic physics module, which includes a loading port, a robotic arm, and a processing unit, and is used to simulate the transmission and processing behavior of a wafer in a machine; A virtual device control platform, the virtual device control platform is connected to the basic physical module and is used to control the basic physical module according to instructions received from the host system; A communication module, wherein the communication module defines a communication interface of the virtual machine based on the SEMI standard and communicates with the host system; A behavior model is used to define a transportation process and a processing process of a wafer.

2. The system according to claim 1, characterized in that The basic physics module includes: Define the number of loading ports, number of robots, robot transport directions, number of processing units and processing sequence.

3. The system according to claim 2, characterized in that The communication module comprises: Based on the SEMI E37 standard, the HSMS communication method is used to communicate with the host system; Based on the SEMI E5 standard, the data format of the interface is defined.

4. The system according to claim 3, characterized in that The behavior model includes: a FOUP arrival process, a wafer processing process, and a FOUP departure process.

5. The system according to claim 4, characterized in that The FOUP arrival process includes: when the FOUP reaches the loading port, the FOUP ID and SlotMap are read and reported to the host system, and the host system waits for processing after verification.

6. The system according to claim 5, characterized in that The wafer processing flow includes: taking out the wafer from the FOUP, entering the processing unit for processing, and returning the wafer to the FOUP after the wafer processing is completed.

7. The system according to claim 6, characterized in that The process of the FOUP leaving the machine includes: the FOUP waits for removal at the loading port, and the FOUP is moved away after the removal is completed.

8. A semiconductor virtual machine processing method, applied to the system according to claims 1 to 7, characterized in that: The method comprises: Receive FOUP and place it at the loading port; Report the arrival status of the FOUP to the host system through the communication module, read the ID and SlotMap information of the FOUP, and wait for verification and confirmation by the host system; After confirmation by the host system, the virtual device control platform is started, the robot arm is instructed to take out the wafer from the FOUP, and the wafer is transferred to the processing unit; The processing unit performs a processing flow on the wafer, and after the processing is completed, the robotic arm puts the wafer back into the FOUP; After all wafers are processed, a processing completion status is sent to the host system through the communication module; Instruct the FOUP to leave the load port and wait for the host system to confirm that the FOUP removal operation is complete.

9. An electronic device, characterized in that: The electronic device comprises: one or more processors; and A memory storing computer program instructions which, when executed, cause the processor to perform the steps of the method of claim 8.

10. A computer readable medium having a computer program / instructions stored thereon, characterized in that: When the computer program / instructions are executed by a processor, the steps of the method of claim 8 are implemented.

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