Infrared measuring device and measuring method thereof

Abstract

The invention relates to an infrared measurement device and a measurement method thereof, and belongs to the technical field of infrared measurement, and the infrared measurement method comprises the following steps: S100, feeding and conveying an object to be measured; step S200, acquiring and processing an image of an object to be detected, extracting and identifying an edge closed contour of the object to be detected, capturing center position data and attitude data of the object to be detected according to the edge closed contour of the object to be detected, and sending the data to a control unit; height data of the object to be measured and the height measuring unit are collected and sent to the control unit; and step S300, the control unit adjusts the position of the infrared measurement unit according to the central position data and the attitude data of the to-be-measured object and the height data of the to-be-measured object and the height measurement unit so as to focus the to-be-measured object, and performs infrared irradiation on the to-be-measured object to form infrared imaging. According to the invention, automatic focusing infrared measurement of the to-be-measured object can be realized, manual intervention is not needed, and the precision and efficiency of infrared measurement are effectively improved.

Description

Technical Field

[0001] The present invention belongs to the field of infrared measurement technology, and specifically relates to an infrared measurement device and a measurement method thereof. Background Art

[0002] With the rapid development of the manufacturing industry, the requirements for product accuracy are increasing. The precise measurement of various physical quantities such as product size and shape has become a key factor in ensuring product quality and production efficiency. Especially in high-precision and large-scale production environments, how to quickly obtain product data in real time and conduct effective quality control has become a common technical challenge. In order to meet the above challenges, the stability, accuracy and automation of measuring equipment have been raised to an unprecedented level, especially for infrared measuring equipment, which has played an irreplaceable role in many industrial production. Traditional infrared measuring equipment usually requires operators to focus by manually adjusting the camera focal length, which has many limitations in modern high-precision and high-demand industrial production applications.

[0003] First of all, the manual focusing process is cumbersome and time-consuming, requiring operators to adjust the focal length based on experience and vision. The differences between different operators, especially in the absence of standardized operating procedures, often lead to inaccurate focal length adjustment, thereby causing measurement errors. This measurement error not only affects the accuracy of the measurement results, but also seriously affects the reliability and repeatability of the measurement results. Moreover, due to errors in operation by different personnel, the measurement results of the same product in different batches or at different time points may deviate, and the stability of product quality during the production process cannot be ensured. In addition, in some large-scale production environments that require efficient measurement, the low operating efficiency of the manual focusing method leads to increased measurement time. The increased measurement time will directly affect the operating efficiency of the production line in industrial production, making it impossible for the production line to complete the measurement task within the specified time, reducing the efficiency of the entire production process, and also affecting the production cycle and delivery time of the product. The manual focusing method can no longer meet the needs of fast and continuous measurement. The manual focusing method has become a bottleneck with the automation, precision and intelligent production.

[0004] Therefore, in order to solve these problems existing in traditional infrared measurement equipment, it is necessary to develop an infrared measurement equipment that can automatically focus and provide an efficient, accurate and highly automated overall solution for product infrared measurement. This has become an urgent need in the field of infrared measurement technology in current industrial production. Summary of the invention

[0005] The purpose of the present invention is to overcome the defects in the prior art and provide an infrared measuring device and a measuring method thereof to partially or completely solve the technical problem that the existing lead wires usually have some protrusions or unevenness, resulting in poor welding of the lead wires between the junction box and the busbar. In order to achieve the above purpose, the present invention provides the following technical solutions:

[0006] In a first aspect, the present invention provides an infrared measuring device, comprising: a stage unit, a loading unit, a collection unit, an infrared measuring unit and a control unit, wherein the loading unit, the collection unit and the infrared measuring unit are mounted on the stage unit, the loading unit is used to load and convey the object to be measured; the collection unit comprises a camera unit, a height measuring unit and a processing unit, the camera unit captures an image of the object to be measured to obtain an image of the object to be measured, the processing unit processes the image of the object to be measured, extracts and identifies the edge closed contour of the object to be measured, and captures the center position data and posture data of the object to be measured based on the edge closed contour of the object to be measured, and sends these data to the control unit, the height measuring unit collects and processes the height data of the object to be measured and the height measuring unit and sends them to the control unit; the control unit adjusts the position of the infrared measuring unit to focus on the object to be measured based on the center position data, posture data, and height data of the object to be measured and the height measuring unit; the infrared measuring unit performs infrared irradiation on the object to be measured to form an infrared imaging.

[0007] Optionally, the camera unit includes a camera, a telecentric mirror and a camera light source, the camera is connected to the telecentric mirror, the telecentric mirror is connected to the camera light source, the height measuring unit includes a spectroscopic height meter, the infrared measurement unit includes an infrared detector, an infrared camera light source and an optical lens, the infrared detector is connected to the infrared camera light source, and the infrared detector is connected to the optical lens; the infrared measuring device also includes an adjustment unit, the control unit controls the adjustment unit to adjust the position of the infrared measurement unit to focus on the object to be measured, the loading unit includes an X-direction moving component, a Y-direction moving component and a loading platform, the loading platform is connected to the Y-direction moving component, the Y-direction moving component is connected to the X-direction moving component, the X-direction moving component is connected to the loading platform unit, the adjustment unit includes a mounting seat and a Z-direction moving component, the mounting seat is connected to the loading platform unit, and the Z-direction moving component is connected to the acquisition unit and the infrared measurement unit.

[0008] Optionally, the control unit obtains first focusing height data H1 according to the height data of the object to be measured and the height measuring unit, and the first focusing height data H1 is:

[0009] H1=Z1+Z2-Z3

[0010] Among them, Z1 is the height difference between the object to be measured and the height measuring unit, Z2 is the fixed installation height difference between the infrared camera and the height measuring unit, and Z3 is the reference height compensation value of the height measuring unit.

[0011] Optionally, the control unit controls the Z-direction moving component to adjust the distance between the infrared measurement unit and the object to be measured to focus on the object to be measured according to the center position data of the object to be measured, the posture data of the object to be measured and the first focusing height data H1, and the infrared measurement unit collects multiple infrared images of the object to be measured to obtain multiple focused infrared images of the object to be measured; the control unit calculates the first clarity EC of the dth focused infrared image of the object to be measured d , second definition EH d , and according to the first definition EC d , second definition EH d Calculate the total clarity ECH of the dth focused infrared image of the object to be tested d , according to the total clarity ECH of the dth focused infrared image of the object to be tested d and preset conditions to determine whether to stop focusing, where d is a positive integer.

[0012] Optionally, the second definition EH d for:

[0013] EH1=μ1σ1

[0014] EH d =ω1 d μ d σ d +ω2 d (Δμ d +Δσ d )

[0015]

[0016] Δμ d =μ d -μ d-1

[0017] Δσ d =σ d -σ d-1

[0018] Among them, μ1 is the gradient mean of the first focused infrared image of the object to be tested, σ1 is the gradient standard deviation of the first focused infrared image of the object to be tested, and ω1 d is the first weight factor, ω2 d is the second weight factor, μ d is the gradient mean of the dth focused infrared image of the object to be tested, σ d is the gradient standard deviation of the dth focused infrared image of the object to be tested, μ d-1 is the gradient mean of the d-1th focused infrared image of the object to be tested, σ d-1 is the standard deviation of the gradient of the d-1th focused infrared image of the object to be tested, Δμd is the change in the mean value of the d-th gradient, Δσ d is the change in the dth gradient standard deviation.

[0019] Optionally, the total definition ECH of the dth focused infrared image of the object to be tested is d for:

[0020]

[0021] The default conditions are:

[0022]

[0023] Among them, ε is the focus stability coefficient.

[0024] In a second aspect, the present invention provides an infrared measurement method, using an infrared measurement device as described in any one of the first aspects above, comprising:

[0025] Step S100, loading and conveying the object to be tested;

[0026] Step S200, acquiring and processing the image of the object to be tested, extracting and identifying the edge closed contour of the object to be tested, and capturing the center position data and posture data of the object to be tested according to the edge closed contour of the object to be tested, and sending these data to the control unit; collecting the height data of the object to be tested and the height measuring unit and sending them to the control unit;

[0027] Step S300, the control unit adjusts the position of the infrared measuring unit to focus on the object to be measured according to the center position data, posture data, and height data of the object to be measured and the height measuring unit, and irradiates the object to be measured with infrared to form infrared imaging.

[0028] Optionally, in step S300, the control unit adjusts the position of the infrared measurement unit to focus on the object to be measured according to the center position data of the object to be measured, the posture data, and the height data of the object to be measured and the height measurement unit, including:

[0029] Step S301: The control unit obtains first focusing height data H1 according to the height data of the height measuring unit. The first focusing height data H1 is:

[0030] H1=Z1+Z2-Z3

[0031] Among them, Z1 is the height difference between the object to be measured and the height measuring unit, Z2 is the fixed installation height difference between the infrared detector and the height measuring unit, and Z3 is the reference height compensation value of the height measuring unit.

[0032] Step S302: The control unit controls the Z-direction moving component to adjust the distance between the infrared measurement unit and the object to be measured to focus on the object to be measured according to the center position data of the object to be measured, the posture data of the object to be measured and the first focusing height data H1, and the infrared measurement unit collects multiple infrared images of the object to be measured to obtain multiple focused infrared images of the object to be measured, and calculates the first clarity EC of the dth focused infrared image of the object to be measured. d , second definition EH d , and according to the first definition EC d , second definition EH d Calculate the total clarity ECH of the dth focused infrared image of the object to be tested d , according to the total clarity ECH of the dth focused infrared image of the object to be tested d and preset conditions to determine whether to stop focusing, where d is a positive integer.

[0033] Optionally, the second definition EH d for:

[0034] EH1=μ1σ1

[0035] EH d =ω1 d μ d σ d +ω2 d (Δμ d +Δσ d )

[0036]

[0037]

[0038] Δμ d =μ d -μ d-1

[0039] Δσ d =σ d -σ d-1

[0040] Among them, μ1 is the gradient mean of the first focused infrared image of the object to be tested, σ1 is the gradient standard deviation of the first focused infrared image of the object to be tested, and ω1 d is the first weight factor, ω2 d is the second weight factor, μ d is the gradient mean of the dth focused infrared image of the object to be tested, σ d is the gradient standard deviation of the dth focused infrared image of the object to be tested, μ d-1 is the gradient mean of the d-1th focused infrared image of the object to be tested, σd-1 is the standard deviation of the gradient of the d-1th focused infrared image of the object to be tested, Δμ d is the change in the mean value of the d-th gradient, Δσ d is the change in the dth gradient standard deviation.

[0041] Optionally, the total definition ECH of the dth focused infrared image of the object to be tested is d for:

[0042]

[0043] The default conditions are:

[0044]

[0045] Among them, ε is the focus stability coefficient.

[0046] In summary, the present invention has the following beneficial technical effects:

[0047] (1) In the present invention application, the infrared measuring device adopts an acquisition unit, an infrared measuring unit, an adjustment unit and a control unit. The infrared measuring device can automatically complete the positioning, focusing and measurement data acquisition and processing of the object to be measured without human intervention. The infrared measurement process of the entire product is highly automated, which effectively avoids errors introduced by improper human operation, such as inaccurate manual focusing and measurement position deviation. It not only improves the accuracy and reliability of the infrared measurement results, but also makes the measurement operation simpler and faster, reduces the requirements for the professional skills of the operator, reduces human errors, and reduces the investment in labor costs.

[0048] (2) In the present invention application, the control unit accurately adjusts the focal length of the infrared camera according to the height data (Z direction) of the object to be measured and the height measuring unit, ensuring that the infrared camera is always in the best imaging state. Compared with the manual focus method, the infrared measurement unit is not affected by the subjective factors of the operator, and can focus more accurately on the target area of ​​the object to be measured, thereby obtaining a clearer and more accurate measurement image. The high-precision measurement image provides a reliable basis for subsequent data processing and analysis, which significantly improves the accuracy of the measurement results. For example, in the dimensional measurement of tiny parts, the automatic focus method of the infrared measurement unit can clearly capture the edge contour of the parts, and its dimensional parameters can be accurately calculated through precise image processing algorithms. The error range can be controlled within a very small range, meeting the requirements of high-precision measurement.

[0049] (3) In the present invention, the control unit can fully optimize and intelligently control the infrared measurement process, achieving seamless connection and efficient coordination between various measurement links. After the object to be measured enters the measurement area of ​​the acquisition unit, the camera unit can quickly capture its position information and transmit it to the control unit, which then starts the automatic focus and measurement operation. The entire infrared measurement process is fast and smooth, without the need for manual waiting and intervention. At the same time, the control unit can dynamically adjust the parameters and measurement methods of the infrared camera according to actual conditions during the infrared measurement process, avoiding infrared measurement failures or repeated measurements due to environmental changes or differences in the objects to be measured, greatly improving the one-time success rate and overall efficiency of infrared measurement, and being able to quickly perform infrared measurement on products that pass continuously. The infrared measurement time is greatly shortened, effectively improving the production efficiency and production capacity of the production line. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] Figure 1 It is a schematic diagram of the structure of the infrared measuring device applied for by the present invention;

[0051] Figure 2 This is a partial structural diagram of the infrared measuring device applied in the present invention. Figure 1 ;

[0052] Figure 3 This is a partial structural diagram of the infrared measuring device applied in the present invention. Figure 2 ;

[0053] Figure 4 This is a partial structural diagram of the adjustment unit, collection unit and infrared measurement unit of the present invention. Figure 1 ;

[0054] Figure 5 This is a partial structural diagram of the adjustment unit, collection unit and infrared measurement unit of the present invention. Figure 2 ;

[0055] Figure 6 This is a partial structural diagram of the adjustment unit, collection unit and infrared measurement unit of the present invention. Figure 3 ;

[0056] Figure 7 It is a schematic flow chart of the infrared measurement method applied in the present invention.

[0057] Reference numerals:

[0058] Stage unit-100, loading unit-200, acquisition unit-300, infrared measurement unit-400, camera-3011, telecentric lens-3012, camera light source-3013, infrared detector-401, infrared camera light source-402, optical lens-403, mounting seat-501, Z-direction moving component-502, connecting plate-503, lower frame-P2, upper frame-P1. DETAILED DESCRIPTION

[0059] In the following description, a large number of specific details are provided to provide a more thorough understanding of the present invention. However, it is obvious to those skilled in the art that the present invention can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present invention, some technical features well known in the art are not described.

[0060] like Figures 1 to 6 As shown, in the first aspect, an infrared measuring device includes: a stage unit 100, a loading unit 200, a collection unit 300, an infrared measuring unit 400 and a control unit, wherein the loading unit 200, the collection unit 300 and the infrared measuring unit 400 are installed on the stage unit 100, the loading unit 200 is used to load and transport the object to be measured; the collection unit 300 includes a camera unit 301, a height measuring unit 302 and a processing unit, the camera unit 301 takes an image of the object to be measured to obtain the image of the object to be measured, and the processing unit 303 processes the image of the object to be measured , extract and identify the edge closed contour of the object to be measured, and capture the center position data and posture data of the object to be measured based on the edge closed contour of the object to be measured, and send these data to the control unit, the height measuring unit 302 collects and processes the height data of the object to be measured and the height measuring unit and sends them to the control unit; the control unit adjusts the position of the infrared measuring unit 400 to focus on the object to be measured based on the center position data, posture data and height data of the object to be measured and the height measuring unit, and the infrared measuring unit 400 performs infrared irradiation on the object to be measured to form infrared imaging.

[0061] In some embodiments, a stage unit 100 is installed on the lower frame P2. The lower frame P2 and the stage unit 100 serve as the support base of the entire infrared measurement device. The stage unit 100 is installed with a loading unit 200, a collection unit 300, and an infrared measurement unit 400, thereby providing a stable working environment for the loading unit 200, the collection unit 300, and the infrared measurement unit 400. Of course, an upper frame P1 may also be provided outside the stage unit 100, the loading unit 200, the collection unit 300, and the infrared measurement unit 400. The upper frame P1 is used to cover the outside of the stage unit 100, the loading unit 200, the collection unit 300, and the infrared measurement unit 400. The upper frame P1 is connected to the lower frame P2 to form the entirety of the infrared measurement device.

[0062] In some embodiments, the loading unit 200 transports the object to be measured to the measuring area of ​​the acquisition unit 300 to ensure that the object to be measured is in a suitable acquisition position for the acquisition unit 300 during the measurement process. The acquisition unit 300 includes a camera unit 301, a height measurement unit 302, and a processing unit. The camera unit 301 takes an image of the object to be measured to obtain an image of the object to be measured. The processing unit processes the image of the object to be measured, extracts and identifies the edge closed contour of the object to be measured, and captures the center position data and posture data of the object to be measured according to the edge closed contour of the object to be measured, and sends these data to the control unit.

[0063] In the present invention application, the infrared measuring device adopts an acquisition unit, an infrared measuring unit, an adjustment unit and a control unit. The infrared measuring device can automatically complete the positioning, focusing and measurement data collection and processing of the object to be measured without human intervention. The infrared measurement process of the entire product is highly automated, which effectively avoids errors introduced by improper human operation, such as inaccurate manual focusing, measurement position deviation, etc., which not only improves the accuracy and reliability of the infrared measurement results, but also makes the measurement operation simpler and faster, reduces the requirements for the professional skills of the operator, reduces human errors, and reduces the investment in labor costs.

[0064] Optionally, the processing unit includes: an image contour extraction processing unit and a center position posture processing unit, the image contour extraction processing unit processes the image of the object to be tested, extracts and identifies the edge closed contour of the object to be tested; the center position posture processing unit captures the center position data and posture data of the object to be tested according to the edge closed contour of the object to be tested, and sends these data to the control unit.

[0065] In some embodiments, the camera unit 301 can use a high-resolution camera and a precision optical lens, such as a 20-megapixel camera, a 40-megapixel camera, etc., to ensure that the image of the object to be measured has sufficient clarity and contrast to meet the requirements of subsequent processing. The image acquisition process needs to consider factors such as lighting conditions and shooting angles to minimize noise interference. The height measurement unit 302 can collect height sensors, such as ultrasonic ranging sensors, laser ranging sensors, spectral altimeters, etc., to measure the height difference between the object to be measured and the height measurement unit, and send the height data to the control unit to help the control unit determine the position of the object to be measured.

[0066] In some embodiments, the image contour extraction processing unit uses a Gaussian filter to smooth the image of the object to be tested to remove noise. Specifically, the image of the object to be tested can be a grayscale image, and each pixel in the image of the object to be tested is convolved with a Gaussian kernel function, and the Gaussian kernel function is:

[0067] K(x_i,x_j)=exp(-||x_i-x_j||^2 / (2*σ^2))

[0068] Among them, (x_i, x_j) is the pixel coordinate, ||x_i-x_j||^2 is the standard deviation, and σ^2 controls the distribution width of the Gaussian function, that is, the degree of filtering.

[0069] In some embodiments, the image contour extraction processing unit can also perform edge detection on the smoothed image of the object to be tested to obtain the edge of the image of the object to be tested, and a common edge detection Sobel operator can be used to detect the edge information of the smoothed image of the object to be tested. The edge detection Sobel operator mainly calculates the first-order derivative approximation of the smoothed image of the object to be tested in the horizontal and vertical directions to highlight the edge area of ​​the smoothed image of the object to be tested. The Sobel operator uses two convolution kernels to respectively calculate the horizontal and vertical gradients (i.e., the approximation of the first-order derivative) of the smoothed image of the object to be tested. The role of the two kernels is to calculate the neighborhood information of each pixel in the smoothed image of the object to be tested in a weighted manner, thereby obtaining the degree of change of each pixel in the horizontal and vertical directions.

[0070] In some embodiments, the Sobel kernel G in the horizontal direction x As follows, the Sobel kernel G in the horizontal direction x It is used to calculate the horizontal gradient of the smoothed image of the object to be tested, focusing on the edges in the horizontal direction.

[0071]

[0072] In some embodiments, the vertical Sobel kernel Gy As follows, the Sobel kernel G in the vertical direction y It is used to calculate the vertical gradient of the smoothed image of the object to be tested, focusing on the edges in the vertical direction.

[0073]

[0074] In some embodiments, the above-mentioned Sobel kernels in the horizontal and vertical directions are used to perform convolution operations on the smoothed image of the object to be tested to obtain the horizontal gradient G x (x,y) and the vertical gradient G y (x,y):

[0075]

[0076] Where I(x,y) is the pixel value of any pixel point Z(x,y) in the image of the object to be tested;

[0077] In some embodiments, the horizontal gradient image G x (x, y) and vertical gradient images G y (x,y), calculate the gradient magnitude G of any pixel point Z z And the gradient direction θ of any pixel point Z:

[0078]

[0079] Among them, G z is the gradient amplitude of any pixel point Z, indicating the strength of the edge; θ is the gradient direction of each pixel point, indicating the direction of the edge.

[0080] In some embodiments, in order to improve efficiency, the gradient amplitude G of any pixel point Z is z You can also use an approximation without taking the square root:

[0081] G z =|G x (x,y)|+|G y (x,y)|

[0082] In some embodiments, a thresholding operation may be generally applied to the gradient magnitude image, and pixel points below a certain threshold are regarded as non-edges, thereby obtaining edge information of the image.

[0083] In some embodiments, the image contour extraction processing unit starts from an edge point in the edge of the image of the object to be tested, searches for adjacent edge points, and extracts and identifies the edge closed contour of the image of the object to be tested. In searching for adjacent edge points, a boundary-based tracking algorithm or a region-based tracking method can be used, wherein the boundary-based tracking can use the Moore-Neighbor tracking algorithm, which takes the current edge point as the center and checks the surrounding 8 neighboring pixel points in a clockwise or counterclockwise direction in sequence. If an edge point is found, the current point is updated and tracking is continued until it returns to the starting point or the end condition is met, thereby obtaining an edge closed contour.

[0084] In some embodiments, the center position and posture processing unit captures the center position data and posture data of the object to be measured according to the edge closed contour of the object to be measured, and sends these data to the control unit.

[0085] Specifically, the edge closed contour point set P of the object to be tested is determined according to the edge closed contour of the object to be tested.

[0086] {(x1,y1,f(x1,y1)),(x2,y2,f(x2,y2)),...,(x m ,y m ,f(x m ,y m )),...,(x n ,y n ,f(x n ,y n )), where (x m ,y m ) is the coordinate of the edge contour point, f(x m ,y m ) is the pixel value of the edge contour point.

[0087] Specifically, the center position C data is:

[0088]

[0089] Among them, (x c ,y c ) is the coordinate of the center position C of the object to be measured.

[0090] Specifically, the weighted second-order moment S1 of the x-axis, the weighted second-order moment S2 of the y-axis, and the weighted mixed second-order moment S0 are calculated. The weighted second-order moment S2 of the x-axis, the weighted second-order moment S1 of the y-axis, and the weighted mixed second-order moment S0 are respectively:

[0091]

[0092] Therefore, the posture data T of the object to be tested is:

[0093]

[0094] In the present application, firstly, the center position posture processing unit can accurately capture the (rotation) posture information of the object to be measured through the combination of weighted second-order moment and weighted mixed second-order moment, and is applicable to various object shapes and postures, whether it is a simple rectangular object or a complex polygonal object, and can perform posture estimation well, especially when the object shape is irregular, it can effectively estimate its posture; in addition, the center position posture processing unit only relies on the contour points in the edge closed contour of the object to be measured, without the need for additional physical calibration or additional sensor data, and is applicable to a variety of visual measurement systems. The calculation method is very simple, with high calculation efficiency, calculation accuracy, strong adaptability and robustness, and can be well applied to infrared measurement of the object to be measured. Of course, other methods can also be used to calculate the center position and posture data of the object to be measured, and those skilled in the art can make reasonable settings according to actual conditions.

[0095] In some embodiments, the infrared measurement unit 400 performs infrared irradiation on the object to be measured to generate infrared imaging data; the control unit can receive the center position data, posture data and height data sent by the acquisition unit 300, and control the automatic focus and position adjustment of the infrared measurement unit 400, thereby achieving accurate infrared imaging of the object to be measured.

[0096] In the infrared measuring device of the present invention, firstly, through the position information provided by the camera unit and the height measuring unit, the control unit can automatically adjust the focal length of the infrared measuring unit 400, the infrared measuring device can realize automatic focusing and precise infrared measurement of the object to be measured, and the infrared measuring unit can obtain high-precision infrared images, thereby accurately detecting and analyzing the object without manual intervention, effectively improving the accuracy and efficiency of infrared measurement; in addition, the high-resolution infrared camera and optical lens (such as a microscope lens) equipped with the infrared measuring unit can obtain clear infrared images of the object to be measured, thereby improving the accuracy of measurement and the ability to capture details, and the infrared measuring device can be applied to multiple fields, such as quality inspection of electronic components, surface defect inspection of precision machinery, thermal performance analysis of materials, etc., and has strong adaptability; in addition, the infrared measuring device has a high degree of automation, can realize the automatic focusing and position adjustment functions of the infrared measuring unit, reduces the complexity of manual operation, greatly improves the efficiency and accuracy of the measurement process and the production efficiency of the product, and shows good reliability and adaptability in industrial production applications.

[0097] Optionally, the camera unit 301 includes a camera 3011, a telecentric mirror 3012 and a camera light source 3013, the camera 3011 is connected to the telecentric mirror 3012, the telecentric mirror 3012 is connected to the camera light source 3013, the altimeter unit 302 includes a spectroscopic altimeter, the infrared measurement unit 400 includes an infrared detector 401, an infrared camera light source 402 and an optical lens 403, the infrared detector 401 is connected to the infrared camera light source 402, and the infrared detector 401 is connected to the optical lens 403.

[0098] In some embodiments, the camera 3011 is connected to the telecentric lens 3012, and the telecentric lens 3012 is connected to the camera light source 3013. The camera 3011 can capture the center position and posture data of the object to be measured, and a high-resolution camera is used to ensure that clear image information is obtained. The camera 3011 can have a high frame rate and can capture the state of dynamic objects in real time; the telecentric lens 3012 can ensure that the imaging of the object will not be affected by the angle, especially at different heights and angles. It can still keep the size of the object unchanged, which is suitable for shooting more complex object shapes. The application of the telecentric lens 3012 can improve the imaging accuracy, especially for small or tiny objects. The imaging effect is particularly significant; the camera light source 3013 can provide uniform lighting to ensure that the camera can capture clear images with appropriate contrast. The camera light source 3013 can be used in low-light environments or scenes that require precise lighting to avoid interference from reflections or shadows.

[0099] In some embodiments, the height measuring unit 302 includes a spectral altimeter, which can be used to accurately measure the height difference Z1 between the object to be measured and the height measuring unit. By analyzing the reflection spectrum, high-precision and fast response height measurement can be achieved, which is particularly suitable for measuring irregular or dynamically changing surface shapes of objects.

[0100] In some embodiments, the infrared detector 401 is connected to the infrared camera light source 402, and the infrared detector 401 is connected to the optical lens 403. The optical lens 403 includes a lens, a reflector, and a filter, and is responsible for focusing the infrared radiation of the object to be tested onto the infrared detector 401. The infrared detector 401 is the core component of the infrared measurement unit 400. The infrared detector 401 can capture the infrared radiation emitted by the object to be tested and convert it into an electrical signal. In an environment with insufficient light, the infrared camera light source 402 can use a common infrared LED or laser light as a supplementary light source to enhance the light intensity, and then the infrared measurement unit 400 can complete the capture of the infrared image of the object to be tested. Therefore, through infrared imaging technology, the temperature distribution, surface defects and other information of the object can be detected non-contactly, which is suitable for the detection of electronic components, thermal properties of materials, etc.

[0101] In the present application, the camera 3011, the telecentric mirror 3012, the infrared detector 401 and the optical lens 403 work together. During the infrared measurement process, the infrared measuring device can adapt to different objects to be measured and environmental conditions, and can provide accurate measurement and detection in multiple infrared measurement fields. It is particularly suitable for application environments with high requirements for tiny objects, objects with complex shapes and thermal properties, improves the efficiency and reliability of infrared imaging measurement, and reduces the complexity, interference and errors of manual operation.

[0102] Optionally, the infrared measuring device also includes an adjustment unit 500, and the control unit controls the adjustment unit 500 to adjust the position of the infrared measuring unit 400 to focus on the object to be measured. The loading unit 201 includes an X-direction moving component 201, a Y-direction moving component 202 and a loading platform 203, the loading platform 203 is connected to the Y-direction moving component 202, the Y-direction moving component 202 is connected to the X-direction moving component 201, the X-direction moving component 201 is connected to the loading platform unit 100, the adjustment unit 500 includes a mounting seat 501 and a Z-direction moving component 502, the mounting seat 501 is connected to the loading platform unit 100, and the Z-direction moving component 502 is connected to the acquisition unit 300 and the infrared measuring unit 400.

[0103] In some embodiments, the X-direction moving component 201 can move the loading platform 203 in the X-axis direction to control the position of the object to be tested in the X-axis direction. The X-direction moving component 201 can be a conventional X-direction module. The X-direction moving component can generally include: a motor, a guide rail, and a slider, etc. The X-direction moving component 201 can adjust the position of the object to be tested in the X-axis direction according to the control unit, and the X-axis direction can be a horizontal direction.

[0104] In some embodiments, the loading platform 203 is connected to the Y-direction moving component 202, and the Y-direction moving component 202 can move the loading platform 203 in the Y-axis direction to control the position of the object to be tested in the Y-axis direction. The Y-direction moving component 202 can be a conventional Y-direction module, and the Y-direction moving component can generally include: a motor, a guide rail, and a slider, etc. The Y-direction moving component 202 can adjust the position of the object to be tested in the X-axis direction according to the control unit, and the Y-axis direction can be a vertical direction. The Y-direction moving component 202 usually forms a coordinated movement in the X-direction and the Y-direction by connecting the X-direction moving component 201, and can then realize the joint control of the object in the X-direction and the Y-direction.

[0105] In some embodiments, the loading platform 203 is used to support and carry the object to be tested. The loading platform 203 may include: an adjustment mechanism, such as an air floating mechanism or an automatic clamping mechanism, which can ensure the stability of the object to be tested during the movement.

[0106] In some embodiments, the control unit can send instructions to control the X-direction moving component 201 and the Y-direction moving component 202, so that the loading platform 203 moves precisely along the X-axis direction and the Y-axis direction according to the set trajectory, and the object to be tested will be precisely placed in the measurement area of ​​the collection unit 200 or below the collection unit 200, and can be ready for the next step of collection, measurement or analysis.

[0107] In some embodiments, the mounting base 501 is the basic supporting component of the adjustment unit 500, and is responsible for fixing the Z-direction moving component 502, the acquisition unit 300, and the infrared measurement unit 400 to the stage unit 100. The mounting base 501 is usually made of rigid materials (such as steel or aluminum alloy) to ensure the stability and durability of the system; the mounting base 501 should be designed to have a certain adjustment capability, such as being connected by screws or hinges to fine-tune the position, so as to make subtle adjustments according to actual measurement needs.

[0108] In some embodiments, the Z-direction moving component 502 connects the acquisition unit 300 and the infrared measurement unit 400. For example, the Z-direction moving component 502 can connect the acquisition unit 300 and the infrared measurement unit 400 through a connecting plate 503. The acquisition unit 300 and the infrared measurement unit 400 are both mounted on the connecting plate 503. The Z-direction moving component 502 can not only adjust the position of the acquisition unit 300 in the Z-axis direction, but also adjust the position of the infrared measurement unit 400 in the Z-axis direction, thereby ensuring that the measurement unit 400 and the acquisition unit 300 always maintain an appropriate relative position to avoid measurement errors caused by position changes.

[0109] In some embodiments, the Z-direction moving component 502 adjusts the distance between the infrared measurement unit 400 and the object to be measured to focus on the object to be measured. The Z-direction moving component 502 can be a conventional Z-direction module. The Z-direction moving component can generally include: a motor, a guide rail, and a slider, etc., so that the infrared measurement unit 400 can move accurately in the vertical direction. The Z-direction moving component 502 can perform a small vertical movement through the signal received by the control unit, and automatically adjust to the most suitable measurement position to ensure that it has a clear focus on the object to be measured and an accurate measurement range.

[0110] In some embodiments, after the infrared measurement unit 400 is automatically adjusted to an appropriate position, the control unit can start infrared imaging of the object to be measured to capture the temperature distribution or thermal characteristics of the surface of the object to be measured. At this time, the entire infrared imaging process can also be controlled by the adjustment unit 500, and the infrared measurement unit 400 can accurately measure and image the surface area of ​​the object to be measured, and can automatically adapt to and maintain the best measurement effect regardless of the size of the object to be measured, and realize high-precision infrared imaging without deviation.

[0111] In the present application, the adjustment unit 500 can automatically adjust the position of the infrared measurement unit 400. Through the coarse adjustment and / or fine adjustment capability of the Z-direction moving component 502, the infrared measurement unit 400 can achieve extremely precise vertical focus, ensuring that clear infrared imaging can be provided under different objects to be measured and / or different measurement conditions, thereby improving the measurement accuracy, greatly reducing the need for manual operation, and improving the overall efficiency and automation level of the production line.

[0112] Optionally, the control unit adjusts the position of the infrared measuring unit 400 to focus on the object to be measured according to the center position data of the object to be measured, the posture data, and the height data of the object to be measured and the height measuring unit.

[0113] In some embodiments, the control unit obtains first focus height data according to the height data of the height measuring unit, and the first focus height data H1 is:

[0114] H1=Z1+Z2-Z3

[0115] Wherein, Z1 is the height difference between the object to be measured and the height measuring unit, Z2 is the fixed installation height difference between the infrared detector 401 and the height measuring unit, and Z3 is the reference height compensation value of the height measuring unit 302.

[0116] In some embodiments, Z3 is a reference height compensation value of the altimeter unit 302. The reference height compensation value is usually adjusted based on the historical reference height values ​​of the altimeter unit 302 and the object to be measured, to compensate for the difference between the current height data of the altimeter unit 302 and the reference height data of the altimeter unit 302, thereby helping to correct the height data of the altimeter unit 302; Z1 is the height difference between the object to be measured and the altimeter unit. This height difference is measured in real time and can reflect the actual position of the object to be measured; Z2 is the fixed installation height difference between the infrared detector 401 and the altimeter unit. The fixed installation height difference takes into account the physical position difference between the infrared camera and the altimeter unit, and the fixed installation height difference is usually a fixed value.

[0117] In some embodiments, Z1-Z3 adjusts and compensates for the difference between the current height of the altimeter unit and the reference height, reflecting the change in the relative reference position of the altimeter unit 302. Z2 represents the difference between the fixed position of the infrared camera and the installation of the altimeter unit, and is used to correct the position of the infrared camera to ensure that the positional relationship between the infrared camera and the altimeter unit is correct. First, by measuring the current height of the unit and the relative position difference between the altimeter unit and the infrared camera, the first focus height data H1 of the infrared camera can be calculated. The first focus height data H1 provides the approximate focus position of the infrared camera. The first focus height data H1 provides the basis for subsequent fine adjustments to accurately focus, thereby ensuring the clarity of image acquisition.

[0118] Optionally, the control unit controls the Z-direction moving component 502 to adjust the distance between the infrared measurement unit 400 and the object to be measured to focus on the object to be measured according to the center position C data of the object to be measured, the posture data T of the object to be measured and the first focusing height data H1, the infrared measurement unit 400 collects multiple infrared images of the object to be measured to obtain multiple focused infrared images of the object to be measured, and the control unit calculates the first clarity EC of the dth focused infrared image of the object to be measured d , second definition EH d , and according to the first definition EC d , second definition EH d Calculate the total clarity ECH of the dth focused infrared image of the object to be tested d , according to the total clarity ECH of the dth focused infrared image of the object to be tested d and preset conditions to determine whether to stop focusing.

[0119] In some embodiments, the first clarity EC of the dth focused infrared image of the object to be tested d In the calculation, the Sobel gradient operator can also be used, and the Sobel kernel G in the horizontal direction xf As follows, the Sobel kernel G in the horizontal direction xf Used to calculate the horizontal gradient of the focused infrared image of the object to be tested.

[0120]

[0121] In some embodiments, the vertical Sobel kernel G yf As follows, the Sobel kernel G in the vertical direction yf Used to calculate the vertical gradient of the focused infrared image of the object to be tested.

[0122]

[0123] In some embodiments, the above-mentioned Sobel kernels in the horizontal and vertical directions are used to perform a convolution operation on the focused infrared image of the object to be tested to obtain a focus gradient G in the horizontal direction. xf (x, y) and vertical focus gradient G yf (x,y):

[0124]

[0125] Among them, F dq (x, y) is the pixel M in the dth focused infrared image of the object to be tested. q(x, y), d is a positive integer, q=1, 2, 3, ..., B, B is the total number of pixels in the focused infrared image of the object to be tested.

[0126] In some embodiments, the image G may be focused according to the gradient in the horizontal direction. dqxf (x, y) and vertical gradient focus image G dqyf (x, y), calculate the pixel M in the dth focused infrared image of the object to be tested q The focus gradient amplitude G of (x,y) dqf for:

[0127]

[0128] Among them, G dqf is the pixel M in the dth focused infrared image of the object to be tested q The focus gradient magnitude at (x,y).

[0129] In some embodiments, the gradient mean μ of the dth focused infrared image of the object to be tested is d , gradient standard deviation σ d They are:

[0130]

[0131] Similarly, for the focused infrared image of the object to be tested in the d+1th image, the Sobel gradient operator can also be used, and the Sobel kernel G in the horizontal direction xf As follows, the Sobel kernel G in the horizontal direction xf Used to calculate the horizontal gradient of the focused infrared image of the object to be tested.

[0132]

[0133] In some embodiments, the vertical Sobel kernel G yf As follows, the Sobel kernel G in the vertical direction yf Used to calculate the vertical gradient of the focused infrared image of the object to be tested.

[0134]

[0135] In some embodiments, the above-mentioned Sobel kernels in the horizontal and vertical directions are used to perform a convolution operation on the d+1th focused infrared image of the object to be tested to obtain a focus gradient G in the horizontal direction. xf (x, y) and vertical focus gradient G yf (x,y):

[0136]

[0137] Among them, F d+1q (x, y) is the pixel M in the d+1th focused infrared image of the object to be tested. q The pixel value of (x, y), d is a positive integer, q = 1, 2, 3, ..., B, B is the total number of pixels in the d+1th focused infrared image of the object to be tested. It should be noted that for the convenience of calculation, the number of pixels in each focused infrared image of the object to be tested is set to be the same. For example, insufficient pixels are supplemented and replaced, and the pixel values ​​of insufficient pixels can be set to 0 or 255.

[0138] In some embodiments, the image G may be focused according to the gradient in the horizontal direction. d+1qxf (x, y) and vertical gradient focus image G d+1qyf (x, y), calculate the pixel M in the d+1th focused infrared image of the object to be tested q The focus gradient amplitude G of (x,y) d+1qf for:

[0139]

[0140] Among them, G d+1qf is the pixel M in the d+1th focused infrared image of the object to be tested q The focus gradient magnitude at (x,y).

[0141] In some embodiments, the gradient mean μ of the d+1th focused infrared image of the object to be tested is d+1 , gradient standard deviation σ d+1 They are:

[0142]

[0143] In some embodiments, F 1q (x, y) is the pixel point M in the first focused infrared image of the object to be tested. q The pixel value at (x,y), F 2q (x, y) is the pixel M in the second focused infrared image of the object to be tested. q The pixel value of (x,y), ..., F dq (x, y) is the pixel M in the dth focused infrared image of the object to be tested. q The pixel value at (x,y), F d+1q (x, y) is the pixel M in the d+1th focused infrared image of the object to be tested. q The pixel value of (x, y), d is a positive integer, d=1, 2, 3, ..., preferably, d≥2, so that each image can be described and quantified, which is convenient for extracting and analyzing image features, and then can be used to evaluate the clarity calculation during the focusing process.

[0144] In some embodiments, after the gradient distribution processing of the focused infrared image of the dth object to be tested, for the out-of-focus image, the standard deviation is small and the distribution is relatively flat, while for the clear image, the change is usually large and the standard deviation is large. Therefore, after the gradient distribution processing, it can be based on the gradient mean μ d , gradient standard deviation σ d To build the first clarity EC d , First Definition EC d It can reflect the focus of the infrared measurement unit, and then can be used to determine whether the focused infrared image of the object to be measured is clear, or whether focus adjustment is required. The first clarity EC d The formula is:

[0145]

[0146] Among them, α, β, and γ are the first weight coefficient, the second weight coefficient, and the third weight coefficient respectively, and α+β+γ=1.

[0147] In some embodiments, the first weight coefficient α and the second weight coefficient β weigh the gradient mean and the gradient standard deviation respectively on the first definition EC d The third weight coefficient γ captures the detailed information of the gradient distribution of all pixels by summing the gradient distribution values ​​of each pixel after nonlinear transformation. For example, α, β, and γ are 0.3, 0.3, and 0.4 respectively.

[0148] EC in First Clarity d Based on the calculation, the first definition EC corresponding to the dth focused infrared image of the object to be tested can be obtained. d , and then the clarity evaluation of the dth focused infrared image of the object to be tested can be used to determine whether the focus meets the set conditions. This relies on the local focus imaging evaluation characteristics of the infrared measurement unit. It can also be considered from the overall infrared imaging of the front and back of the infrared measurement unit. Accordingly, the second clarity EH of the focused infrared image of the object to be tested is set. d .

[0149] In some embodiments, at the second definition EH of the focused infrared image of the object to be tested d In the calculation, the gradient mean μ1 and gradient standard deviation σ1 of the first focused infrared image of the object to be tested, the gradient mean μ2 and gradient standard deviation σ2 of the second focused infrared image of the object to be tested, ..., the gradient mean μ of the dth focused infrared image of the object to be tested d , gradient standard deviation σ d ,..., the gradient mean μ of the Bth focused infrared image of the object to be tested B , gradient standard deviation σB , correspondingly, the d-1th gradient mean change Δμ d-1 , the change in the d-1th gradient standard deviation Δσ d-1 They are:

[0150] Δμ d =μ d -μ d-1

[0151] Δσ d =σ d -σ d-1

[0152] Therefore, the second definition EH d Calculated by the following formula:

[0153] EH1=μ1σ1(when d=1)

[0154] EH d =ω1 d μ d σ d +ω2 d (Δμ d +Δσ d )(ie d=2,3...)

[0155]

[0156] Among them, μ1 is the gradient mean of the first focused infrared image of the object to be tested, σ1 is the gradient standard deviation of the first focused infrared image of the object to be tested, and ω1 d is the first weight factor, ω2 d is the second weight factor, μ d is the gradient mean of the dth focused infrared image of the object to be tested, σ d is the gradient standard deviation of the dth focused infrared image of the object to be tested, μ d-1 is the gradient mean of the d-1th focused infrared image of the object to be tested, σ d-1 is the standard deviation of the gradient of the d-1th focused infrared image of the object to be tested, Δμ d is the change in the mean value of the d-th gradient, Δσ d is the change in the standard deviation of the dth gradient. It should be noted that the corresponding change in the mean value of the first gradient and the change in the standard deviation of the first gradient do not exist.

[0157] Among them, μ1 is the gradient mean of the first focused infrared image of the object to be tested, σ1 is the gradient standard deviation of the first focused infrared image of the object to be tested, and ω1 d is the first weight factor, ω2 d is the second weighting factor.

[0158] In some embodiments, first, μ d σ d The precision of the clarity of the focused infrared image of the object to be tested (Δμ d +Δσ d ) can reflect the change of the focus trend. When the focus area is completed, (Δμ d +Δσ d ) will change less; In addition, the first weight factor ω1 is set d , the second weight factor ω2 d , the first weight factor ω1 d , the second weight factor ω2 d The gradient mean change Δμ can be calculated at different stages of the focused infrared image of the object to be tested. d , the gradient mean change Δσ d The weight size is dynamically adjusted according to the size of the image. For example, in the early stage of focusing, the gradient changes are more significant and the image clarity improves rapidly. At this time, the clarity accuracy should account for more weight; in the focusing process, the image gradually becomes clear or stable. In the later stage of focusing, the gradient changes tend to be gentle and the image is close to being clear. At this time, you can pay attention to the stability of the image. By dynamically adjusting the weight, the system can evaluate according to the features of different stages to avoid a certain feature excessively affecting the final result, thereby more accurately judging the focus state.

[0159] In some embodiments, according to the first definition EC d , second definition EH d Calculate the total clarity ECH of the dth focused infrared image of the object to be tested d , the total clarity of the dth focused infrared image of the object to be tested ECH d for:

[0160]

[0161] The total clarity of the dth focused infrared image of the object to be tested ECH d The setting not only considers the clarity of a single image but also constructs the first clarity EC d The second clarity EH can also be constructed by combining the gradient mean change, gradient standard deviation change and adaptive weight adjustment d , second definition EH d It reflects the dynamic trend of image clarity and focus; and, through preset conditions, monitors the total clarity of the focused infrared image of the dth object to be tested. d Changes in focus in the later stages of ECH d The change area is stable, so the focus completion status can be accurately evaluated and good focus accuracy can be obtained.

[0162] In some embodiments, the preset condition is:

[0163]

[0164] Wherein, ε is the focus stability coefficient, and ε is a constant, for example, ε is 0.02, 0.01, etc.

[0165] In some embodiments, in the actual process, the focus is generally adjusted multiple times (greater than or equal to 2 times), and accordingly d ≥ 2, that is, more than 2 focused infrared images of the object to be tested are obtained, and the total clarity ECH of the focused infrared image of the object to be tested is obtained according to the dth image. d , the total clarity of the focused infrared image of the object to be tested can be determined by ECH d Whether the preset conditions are met. If yes, the focused infrared image of the object to be measured is clear, and the Z-direction moving component 502 stops moving to end the focusing process; if no, the focused infrared image of the object to be measured is not clear, and the Z-direction moving component 502 continues to adjust the position of the infrared measurement unit to continue the focusing process.

[0166] Of course, in other embodiments, the preset conditions may be adjusted, and the transformation of the dth focused infrared image of the object to be tested may be monitored by structural similarity, thereby accurately evaluating the focusing completion status and the stability of the overall focusing process.

[0167]

[0168] Among them, SM is the structural similarity coefficient, v1 is the first constant, and v2 is the second constant.

[0169]

[0170] In other embodiments, for a clear image, since the brightness and contrast are well maintained and the structural information is complete, the two clear images in the later stage of focus are highly similar, and for a blurred image, the brightness and contrast are reduced, the structural information is lost, and the similarity of the two images in the early and middle stages of focus is low. Exemplarily, for an 8-bit image, the first constant v1 can be 6.5025 and the second constant v2 can be 58.5225, so that SM can be stably calculated in most images. Of course, those skilled in the art can also reasonably select the size of the first constant v1 and the second constant v2 as needed.

[0171] like Figure 7 As shown, in a second aspect, the present invention provides an infrared measurement method, using any infrared measurement device described in the first aspect, including:

[0172] Step S100, loading and conveying the object to be tested;

[0173] Step S200, acquiring and processing the image of the object to be tested, extracting and identifying the edge closed contour of the object to be tested, and capturing the center position data and posture data of the object to be tested according to the edge closed contour of the object to be tested, and sending these data to the control unit; collecting the height data of the object to be tested and the height measuring unit and sending them to the control unit;

[0174] Step S300, the control unit adjusts the position of the infrared measuring unit 400 to focus on the object to be measured according to the center position data, posture data, and height data of the object to be measured and the height measuring unit, and irradiates the object to be measured with infrared to form infrared imaging.

[0175] In some embodiments, in step S100, the object to be tested is transported and positioned by the loading unit 200, and the specific loading process may include: first, the object to be tested is placed on the loading platform 203 by manual placement or a robot; then, the control unit controls the X-direction moving component 201 and the Y-direction moving component 202 to move, and the loading platform 203 moves along the X-axis direction and the Y-axis direction, and the object to be tested is moved to the measuring area of ​​the collection unit 200 or is located below the collection unit 200.

[0176] In some embodiments, in step S200, the camera unit 301 and the height measuring unit 302 are respectively responsible for collecting the center position, posture-related data and height-related data of the object to be measured, and sending these related data to the control unit. The camera unit 301 takes an image of the object to be measured to obtain an image of the object to be measured, and the image of the object to be measured includes the position and angle information of the object to be measured in the X and Y axis directions, which can be used for the subsequent automatic focusing needs of the infrared measurement unit. The height measuring unit 302 can measure the height data between the object to be measured and the height measuring unit to ensure that the distance between the object to be measured and the infrared measurement unit is correct during the measurement process.

[0177] In some embodiments, in step S300, the control unit can adjust the position of the infrared measurement unit 400 to focus on the object to be measured based on the center position data, posture data, and height data of the object to be measured and the height measuring unit. The infrared measurement unit 400 can perform infrared irradiation on the object to be measured to generate an infrared imaging image, which can be used to analyze the thermal characteristics, defects or other infrared characteristics of the object.

[0178] In the infrared measurement method of the present invention, firstly, through the accurate data collection of the camera unit 301 and the height measuring unit 302, it is possible to achieve accurate positioning, posture adjustment and height measurement of the object to be measured, and the control unit automatically adjusts the position of the infrared measurement unit 400 according to these data, ensuring that each infrared imaging can obtain a high-precision focusing effect, avoiding errors caused by manual operation; in addition, through the automated object positioning, data collection and focus adjustment, the automation level of the production line is improved, and manual intervention is reduced. The infrared measurement process of the entire object to be measured is not only fast, but also accurate, which can meet the needs of high-speed production lines, and also improves the consistency and repeatability of the infrared measurement results, ensuring the accuracy and reliability of each infrared measurement result; in addition, the infrared measurement method can be applied to multiple fields, such as quality inspection of electronic components, surface defect inspection of precision machinery, thermal performance analysis of materials, etc., and can automatically adapt to objects to be measured of different sizes, shapes or heights, and can automatically adjust the position and focal length of the infrared measurement unit according to the specific conditions of the object, with a high degree of automation, reducing the complexity of manual operation, greatly improving the efficiency and accuracy of the measurement process and product production efficiency, and showing good reliability and adaptability in industrial production applications.

[0179] Optionally, in step S300, the control unit adjusts the position of the infrared measurement unit 400 to focus on the object to be measured according to the center position data and posture data of the object to be measured and the height data of the object to be measured and the height measurement unit, including:

[0180] Step S301: The control unit obtains first focusing height data H1 according to the height data of the height measuring unit. The first focusing height data H1 is:

[0181] H1=Z1+Z2-Z3

[0182] Wherein, Z1 is the height difference between the object to be measured and the height measuring unit, Z2 is the fixed installation height difference between the infrared detector 401 and the height measuring unit, and Z3 is the reference height compensation value of the height measuring unit 302.

[0183] Step S302: The control unit controls the Z-direction moving component 502 to adjust the distance between the infrared measurement unit 400 and the object to be measured to focus on the object to be measured according to the center position C data of the object to be measured, the posture data T of the object to be measured and the first focusing height data H1. The infrared measurement unit 400 collects multiple infrared images of the object to be measured to obtain multiple focused infrared images of the object to be measured, and calculates the first clarity EC of the focused infrared image of the dth object to be measured. d , second definition EH d , and according to the first definition EC d , second definition EH dCalculate the total clarity ECH of the dth focused infrared image of the object to be tested d , according to the total clarity ECH of the dth focused infrared image of the object to be tested d and preset conditions to determine whether to stop focusing.

[0184] In some embodiments, in step S300, the adjustment unit 500 includes a mounting seat 501 and a Z-direction moving component 502, and the control unit can control the Z-direction moving component 502 to adjust the position of the infrared measurement unit 400 in the vertical direction (Z axis) to ensure that the focal length between the infrared measurement unit 400 and the surface of the object to be measured is in the best state. Specifically, the acquisition unit 300 obtains the height data, position data, and posture data of the object to be measured, and transmits them to the control unit. The control unit can analyze these data to calculate the optimal focal length and position of the infrared measurement unit 400. The control unit instructs the adjustment unit 500 to perform precise Z-axis adjustment according to the height information of the object to be measured. The Z-direction moving component 502 accurately adjusts the height of the infrared measurement unit 400 according to the instruction of the control unit to ensure that it focuses on the surface of the object. After the infrared measurement unit 400 is adjusted to a suitable focal length, the infrared measurement unit 400 performs infrared irradiation on the object to be measured, and then a very clear infrared imaging image can be generated for analyzing the thermal characteristics, surface defects, etc. of the object to be measured.

[0185] In step S300, the first definition EC of the dth focused infrared image of the object to be tested is d In the calculation, the Sobel gradient operator can also be used, and the Sobel kernel G in the horizontal direction xf As follows, the Sobel kernel G in the horizontal direction xf It is used to calculate the horizontal gradient of the focused infrared image of the object to be tested and the vertical Sobel kernel G yf As follows, the Sobel kernel G in the vertical direction yf Used to calculate the vertical gradient of the focused infrared image of the object to be tested.

[0186]

[0187] In step S300, the focused infrared image of the object to be tested is convolved using the above-mentioned Sobel kernels in the horizontal and vertical directions to obtain the focus gradient G in the horizontal direction. xf (x, y) and vertical focus gradient G yf (x,y):

[0188]

[0189] Among them, F dq (x, y) is the pixel M in the dth focused infrared image of the object to be tested. q(x, y), d is a positive integer, q=1, 2, 3, ..., B, B is the total number of pixels in the focused infrared image of the object to be tested.

[0190] In some embodiments, the image G may be focused according to the gradient in the horizontal direction. dqxf (x, y) and vertical gradient focus image G dqyf (x, y), calculate the pixel M in the dth focused infrared image of the object to be tested q The focus gradient amplitude G of (x,y) dqf for:

[0191]

[0192] Among them, G dqf is the pixel M in the dth focused infrared image of the object to be tested q The focus gradient magnitude at (x,y).

[0193] The gradient mean μ of the dth focused infrared image of the object to be tested d , gradient standard deviation σ d They are:

[0194]

[0195] In step S300, after the gradient distribution processing of the focused infrared image of the dth object to be tested, for the out-of-focus image, the standard deviation is small and the distribution is relatively flat, while for the clear image, the change is usually large and the standard deviation is large. Therefore, after the gradient distribution processing, it can be based on the gradient mean μ d , gradient standard deviation σ d To build the first clarity EC d , First Definition EC d It can reflect the focus of the infrared measurement unit, and then can be used to determine whether the focused infrared image of the object to be measured is clear, or whether focus adjustment is required. The first clarity EC d The formula is:

[0196]

[0197] Among them, α, β, and γ are the first weight coefficient, the second weight coefficient, and the third weight coefficient respectively, and α+β+γ=1.

[0198] In step S300, at a second definition EH of the focused infrared image of the object to be tested, d In the calculation, the gradient mean μ1 and gradient standard deviation σ1 of the first focused infrared image of the object to be tested, the gradient mean μ2 and gradient standard deviation σ2 of the second focused infrared image of the object to be tested, ..., the gradient mean μ of the dth focused infrared image of the object to be testedd , gradient standard deviation σ d ,..., the gradient mean μ of the Bth focused infrared image of the object to be tested B , gradient standard deviation σ B , correspondingly, the d-1th gradient mean change Δμ d-1 , the change in the d-1th gradient standard deviation Δσ d-1 Respectively.

[0199] Δμ d =μ d -μ d-1

[0200] Δσ d =σ d -σ d-1

[0201] Therefore, the second definition EH d Calculated by the following formula:

[0202] EH1=μ1σ1(d=1)

[0203] EH d =ω1 d μ d σ d +ω2 d (Δμ d +Δσ d )(d=2,3...)

[0204]

[0205] Among them, μ1 is the gradient mean of the first focused infrared image of the object to be tested, σ1 is the gradient standard deviation of the first focused infrared image of the object to be tested, and ω1 d is the first weight factor, ω2 d is the second weight factor, μ d is the gradient mean of the dth focused infrared image of the object to be tested, σ d is the gradient standard deviation of the dth focused infrared image of the object to be tested, μ d-1 is the gradient mean of the d-1th focused infrared image of the object to be tested, σ d-1 is the standard deviation of the gradient of the d-1th focused infrared image of the object to be tested, Δμ d is the change in the mean value of the d-th gradient, Δσ d is the change in the dth gradient standard deviation.

[0206] In step S300, according to the first definition EC d , second definition EH d Calculate the total clarity ECH of the dth focused infrared image of the object to be testedd , the total clarity of the dth focused infrared image of the object to be tested ECH d for:

[0207]

[0208] The default conditions are:

[0209]

[0210] Wherein, ε is the focus stability coefficient, and ε is a constant, for example, ε is 0.02, 0.01, etc.

[0211] Therefore, the total resolution ECH of the dth focused infrared image of the object to be tested is d The setting not only considers the clarity of a single image but also constructs the first clarity EC d The second clarity EH can also be constructed by combining the gradient mean change, gradient standard deviation change and adaptive weight adjustment d , second definition EH d It can reflect the dynamic trend of image clarity and focus; in addition, by presetting conditions, the total clarity of the focused infrared image of the dth object to be tested is monitored. d The change of the ECH of the focused infrared image of the object to be tested in the later stage of focusing d The change area of ​​is stable, so the focusing completion can be accurately evaluated and good focusing accuracy can be obtained; in addition, in the actual process, multiple focusing is generally performed, and accordingly, d is usually greater than or equal to 2, that is, more than 2 focused infrared images of the object to be tested will be obtained. According to the total clarity ECH of the dth focused infrared image of the object to be tested d , the total clarity of the focused infrared image of the object to be tested can be determined by ECH d Whether the preset conditions are met. If yes, the focused infrared image of the object to be measured is clear, and the Z-direction moving component 502 stops moving to end the focusing process; if no, the focused infrared image of the object to be measured is not clear, and the Z-direction moving component 502 continues to adjust the position of the infrared measurement unit 400 to continue the focusing process.

[0212] Of course, in other embodiments, the preset conditions may be adjusted, and the transformation of the dth focused infrared image of the object to be tested may be monitored by structural similarity, thereby accurately evaluating the focusing completion status and the stability of the overall focusing process.

[0213]

[0214] Among them, SM is the structural similarity coefficient, v1 is the first constant, and v2 is the second constant.

[0215]

[0216] In other embodiments, for a clear image, since the brightness and contrast are well maintained and the structural information is complete, the two clear images in the later stage of focusing are highly similar, and for a blurred image, the brightness and contrast are reduced, the structural information is lost, and the similarity of the two images in the early and middle stages of focusing is low. Exemplarily, for an 8-bit image, the first constant v1 can be 6.5025 and the second constant v2 can be 58.5225, so that SM can be stably calculated in most images. Of course, those skilled in the art can also reasonably select the size of the first constant v1 and the second constant v2 as needed.

[0217] In the present invention application, the control unit can automatically adjust the focal length according to the height change of the object to be tested, ensuring that clear infrared imaging images can be obtained regardless of whether the object is high or low. The automated adjustment and focusing process significantly improves the speed and accuracy of infrared imaging, reduces the time for manual intervention and adjustment, adapts to the needs of high-speed production lines, reduces the uncertainty of manual operation, improves the consistency and repeatability of the detection process, ensures that high-quality results can be obtained each time the image is imaged, realizes accurate focusing and infrared imaging of the object to be tested, and realizes high-precision and high-efficiency infrared measurement of products. It can be widely used in product inspection in manufacturing industries such as electronic components and mechanical parts.

[0218] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0219] Those skilled in the art can understand that the various operations, methods, steps, measures, and schemes in the process discussed in the present application can be alternated, changed, combined, or deleted; further, the various operations, methods, and other steps, measures, and schemes in the process discussed in the present application can also be alternated, changed, rearranged, decomposed, combined, or deleted; further, the various operations, methods, and steps, measures, and schemes in the prior art that are similar to those disclosed in the present application can also be alternated, changed, rearranged, decomposed, combined, or deleted;

[0220] The above-described embodiments only express several implementation methods of the embodiments of the present disclosure, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the patent scope of the embodiments of the present disclosure. It should be pointed out that, for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the embodiments of the present disclosure, which all belong to the protection scope of the embodiments of the present disclosure. Therefore, the protection scope of the embodiments of the present disclosure shall be based on the attached claims.

Claims

1. An infrared measuring device, characterized in that: include: The loading unit, the feeding unit, the collecting unit, the infrared measuring unit and the control unit are installed on the loading unit. The feeding unit is used to load and convey the object to be tested. The collecting unit includes a camera unit, a height measuring unit and a processing unit. The camera unit takes an image of the object to be tested to obtain the image of the object to be tested. The processing unit processes the image of the object to be tested, extracts and identifies the edge closed contour of the object to be tested, and captures the center position data and posture data of the object to be tested according to the edge closed contour of the object to be tested, and sends these data to the control unit. The height measuring unit collects and processes the height data of the object to be tested and the height measuring unit and sends them to the control unit. The control unit adjusts the position of the infrared measuring unit to focus on the object to be tested according to the center position data, posture data, and height data of the object to be tested and the height measuring unit. The infrared measuring unit performs infrared irradiation on the object to be tested to form infrared imaging.

2. An infrared measuring device according to claim 1, characterized in that: The camera unit includes a camera, a telecentric mirror and a camera light source, the camera is connected to the telecentric mirror, the telecentric mirror is connected to the camera light source, the height measuring unit includes a spectroscopic height meter, the infrared measuring unit includes an infrared detector, an infrared camera light source and an optical lens, the infrared detector is connected to the infrared camera light source, and the infrared detector is connected to the optical lens; the infrared measuring device also includes an adjustment unit, the control unit controls the adjustment unit to adjust the position of the infrared measuring unit to focus on the object to be measured, the loading unit includes an X-direction moving component, a Y-direction moving component and a loading platform, the loading platform is connected to the Y-direction moving component, the Y-direction moving component is connected to the X-direction moving component, the X-direction moving component is connected to the loading platform unit, the adjustment unit includes a mounting seat and a Z-direction moving component, the mounting seat is connected to the loading platform unit, and the Z-direction moving component is connected to the acquisition unit and the infrared measuring unit.

3. An infrared measuring device according to claim 2, characterized in that: The control unit obtains the first focusing height data H1 according to the height data of the object to be measured and the height measuring unit. The first focusing height data H1 is: H1=Z1+Z2-Z3 Among them, Z1 is the height difference between the object to be measured and the height measuring unit, Z2 is the fixed installation height difference between the infrared camera and the height measuring unit, and Z3 is the reference height compensation value of the height measuring unit.

4. An infrared measuring device according to claim 3, characterized in that: The control unit controls the Z-direction moving component to adjust the distance between the infrared measurement unit and the object to be measured to focus on the object to be measured according to the center position data of the object to be measured, the posture data of the object to be measured and the first focusing height data H1, and the infrared measurement unit collects multiple infrared images of the object to be measured to obtain multiple focused infrared images of the object to be measured; the control unit calculates the first clarity EC of the dth focused infrared image of the object to be measured d , second definition EH d , and according to the first definition EC d , second definition EH d Calculate the total clarity ECH of the dth focused infrared image of the object to be tested d , according to the total clarity ECH of the dth focused infrared image of the object to be tested d and preset conditions to determine whether to stop focusing, where d is a positive integer.

5. An infrared measuring device according to claim 4, characterized in that: Second Definition EH d for: EH1=μ1σ1 EH d =ω1 d m d s d +ω2 d (Dm d +Ds d ) Dm d =μ d -m d-1 Board d =s d -s d-1 Among them, μ1 is the gradient mean of the first focused infrared image of the object to be tested, σ1 is the gradient standard deviation of the first focused infrared image of the object to be tested, and ω1 d is the first weight factor, ω2 d is the second weight factor, μ d is the gradient mean of the dth focused infrared image of the object to be tested, σ d is the gradient standard deviation of the dth focused infrared image of the object to be tested, μ d-1 is the gradient mean of the d-1th focused infrared image of the object to be tested, σ d-1 is the standard deviation of the gradient of the d-1th focused infrared image of the object to be tested, Δμ d is the change in the mean value of the d-th gradient, Δσ d is the change in the dth gradient standard deviation.

6. An infrared measuring device according to claim 5, characterized in that: The total clarity of the dth focused infrared image of the object to be tested ECH d for: The default conditions are: Among them, ε is the focus stability coefficient.

7. An infrared measurement method, using an infrared measurement device according to any one of claims 1 to 6, characterized in that: include: Step S100, loading and conveying the object to be tested; Step S200, acquiring and processing the image of the object to be tested, extracting and identifying the edge closed contour of the object to be tested, and capturing the center position data and posture data of the object to be tested according to the edge closed contour of the object to be tested, and sending these data to the control unit; collecting the height data of the object to be tested and the height measuring unit and sending them to the control unit; Step S300, the control unit adjusts the position of the infrared measuring unit to focus on the object to be measured according to the center position data, posture data, and height data of the object to be measured and the height measuring unit, and irradiates the object to be measured with infrared to form infrared imaging.

8. An infrared measurement method according to claim 7, characterized in that: In step S300, the control unit adjusts the position of the infrared measurement unit to focus on the object to be measured according to the center position data of the object to be measured, the posture data, and the height data of the object to be measured and the height measurement unit, including: Step S301: The control unit obtains first focusing height data H1 according to the height data of the height measuring unit. The first focusing height data H1 is: H1=Z1+Z2-Z3 Among them, Z1 is the height difference between the object to be measured and the height measuring unit, Z2 is the fixed installation height difference between the infrared detector and the height measuring unit, and Z3 is the reference height compensation value of the height measuring unit. Step S302: The control unit controls the Z-direction moving component to adjust the distance between the infrared measurement unit and the object to be measured to focus on the object to be measured according to the center position data of the object to be measured, the posture data of the object to be measured and the first focusing height data H1, and the infrared measurement unit collects multiple infrared images of the object to be measured to obtain multiple focused infrared images of the object to be measured, and calculates the first clarity EC of the dth focused infrared image of the object to be measured. d , second definition EH d , and according to the first definition EC d , second definition EH d Calculate the total clarity ECH of the dth focused infrared image of the object to be tested d , according to the total clarity ECH of the dth focused infrared image of the object to be tested d and preset conditions to determine whether to stop focusing, where d is a positive integer.

9. An infrared measurement method according to claim 8, characterized in that: Second Definition EH d for: EH1=μ1σ1 EH d =ω1 d m d s d +ω2 d (Dm d +Ds d ) Dm d =μ d -m d-1 Board d =s d -s d-1 Among them, μ1 is the gradient mean of the first focused infrared image of the object to be tested, σ1 is the gradient standard deviation of the first focused infrared image of the object to be tested, and ω1 d is the first weight factor, ω2 d is the second weight factor, μ d is the gradient mean of the dth focused infrared image of the object to be tested, σ d is the gradient standard deviation of the dth focused infrared image of the object to be tested, μ d-1 is the gradient mean of the d-1th focused infrared image of the object to be tested, σ d-1 is the standard deviation of the gradient of the d-1th focused infrared image of the object to be tested, Δμ d is the change in the mean value of the d-th gradient, Δσ d is the change in the dth gradient standard deviation.

10. An infrared measurement method according to claim 9, characterized in that: The total clarity of the dth focused infrared image of the object to be tested ECH d for: The default conditions are: Among them, ε is the focus stability coefficient.

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