Test equipment, test system and test method thereof

Abstract

The embodiment of the invention provides test equipment, a test system and a test method thereof, and the test equipment, which are used for testing miniature display equipment, the test equipment comprises a control module, and the control module is configured to obtain a preset program and an input signal of a user, and generate an output signal according to the preset program and the input signal; the reading module is configured to be electrically connected with the miniature display equipment and is used for supplying power to the miniature display equipment and acquiring working parameters of the miniature display equipment; and the conversion module is electrically connected with the control module and the reading module, and the conversion module is configured to receive an output signal of the control module, control the reading module to control and obtain working parameters of the miniature display equipment according to the output signal, and transmit the working parameters to the control module to generate a test result. Through configuration of the control terminal and real-time data monitoring, the test system can quickly generate a detailed test result, and the detailed test result is displayed to a user through a visual interface, so that the test period can be remarkably shortened, and the test efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of display device testing, and in particular to a testing device, a testing system and a testing method thereof. Background Art

[0002] In traditional display panel module factories, manufacturers need to manually set and test the device under test multiple times based on voltage, which is time-consuming and labor-intensive. In addition, after the test, a spreadsheet (EXCEL) needs to be manually created to record the measurement results, which is prone to human errors.

[0003] In the related art, since the items that need to be measured in the display panel module are very diverse, the process of collecting test data requires the use of a variety of measuring instruments.

[0004] However, in the above-mentioned testing process, users need to perform frequent manual operations, which is difficult and has a high error rate. Summary of the invention

[0005] The embodiments of the present application provide a testing device, a testing system and a testing method thereof, which are used to solve the technical problem in the related art that the testing process requires frequent manual operations by the user, but is of high difficulty and high error rate.

[0006] In a first aspect, an embodiment of the present application provides a testing device for testing a micro-display device, the testing device comprising:

[0007] A shell having a receiving cavity, an opening communicating with the receiving cavity, and a test interface, wherein the test interface and the opening are respectively opened on different sides of the shell;

[0008] A door body, arranged at the opening;

[0009] A control module, located in the accommodating cavity, the control module being configured to obtain a preset program and an input signal from a user, and to generate an output signal according to the preset program and the input signal;

[0010] a reading module, located in the accommodating cavity and corresponding to the test interface, the reading module being configured to be electrically connected to the micro-display device, for supplying power to the micro-display device and obtaining working parameters of the micro-display device;

[0011] The conversion module is located in the accommodating cavity and is electrically connected to the control module and the reading module. The conversion module is configured to receive an output signal from the control module, control the reading module to control and obtain working parameters of the miniature display device according to the output signal, and transmit the working parameters to the control module to generate a test result.

[0012] In the above-mentioned testing device, optionally, it further includes a circuit board, and the control module, the reading module and the conversion module are all electrically connected to the circuit board;

[0013] The reading module is located on a side of the circuit board facing the test interface, and the conversion module and the control module are located on a side of the circuit board facing away from the test interface.

[0014] In the above-mentioned test device, optionally, the conversion module includes a power conversion module, and the power conversion module is electrically connected to the circuit board and to the reading module;

[0015] The power conversion module is configured to change the resistance between the circuit board and the reading module to control the operating voltage and the operating current of the miniature display device, and obtain the voltage and the current of the miniature display device through the reading module.

[0016] In the above-mentioned test device, optionally, the power conversion module includes:

[0017] A power processor, electrically connected to the control module, and configured to receive an output signal of the control module;

[0018] A digital potentiometer is electrically connected to the power processor and the circuit board, and the digital potentiometer is configured to change resistance under the control of the power processor and control the voltage of the miniature display device through the reading module.

[0019] In the above-mentioned testing device, optionally, the power conversion module further includes:

[0020] A current acquisition module, electrically connected to the control module and the circuit board;

[0021] The current acquisition module is configured to receive the current of the miniature display device through the reading module under the control of the power processor.

[0022] In the above-mentioned test equipment, optionally, a heat dissipation port is also opened on the shell, and the heat dissipation port is connected to the accommodating cavity; the test equipment also includes a heat dissipation fan, the heat dissipation fan is electrically connected to the circuit board, and the heat dissipation fan is arranged corresponding to the heat dissipation port.

[0023] In a second aspect, an embodiment of the present application further provides a test system, including a control terminal and the test device, wherein the control terminal is electrically connected to the test device;

[0024] The control terminal is configured to receive an input signal from a user, and receive and display a test result of the test device.

[0025] In the above-mentioned test system, optionally, the test system further comprises a pattern generator, the pattern generator being electrically connected to the micro-display device and the control terminal;

[0026] The pattern generator is configured to generate a pattern graphic under the control of the control terminal and transmit the pattern graphic to the miniature display device for display.

[0027] In a third aspect, the embodiment of the present application further provides a testing method for the testing system, the testing method comprising:

[0028] Connecting the test system to a miniature display device; wherein the test system comprises an electrically connected test device and a control terminal, the test device comprises an electrically connected control module, a reading module and a conversion module, and the control module is electrically connected to the control terminal;

[0029] The control module controls the conversion module through the input signal of the control terminal and the preset program to generate an output signal;

[0030] The conversion module receives and controls the reading module to obtain the working parameters of the micro-display device according to the output signal output by the control module, and transmits the parameters to the control module to generate a test result;

[0031] The control terminal receives the test result generated by the control module.

[0032] In the above test method, optionally, the output signal includes a switching signal, and the conversion module receives and outputs the output signal according to the control module, including:

[0033] The conversion module receives the switching signal, and processes the switching signal to form a switching image, so as to transmit the switching image to the micro-display device through the reading module, and enable the micro-display device to display the switching image.

[0034] In the above test method, optionally, the output signal includes a power supply signal and a feedback signal;

[0035] The feedback signal is generated later than the power supply signal.

[0036] In the above test method, optionally, when the output signal received by the conversion module is the power supply signal,

[0037] The conversion module receives the power supply signal and controls the resistance of the reading module according to the power supply signal to control the voltage of the miniature display device.

[0038] In the above test method, optionally, when the output signal received by the conversion module is the feedback signal,

[0039] The conversion module receives the feedback signal, and controls the reading module to obtain the working parameters of the miniature display device according to the feedback signal.

[0040] In the above test method, optionally, the operating parameters of the micro-display device include:

[0041] At least one of the junction temperature, operating current, operating voltage, and display image of the miniature display device.

[0042] The test equipment, test system and test method provided by the embodiments of the present application are configured to work through the control terminal, and the test equipment can read the key electrical parameters of the miniature display device in real time, such as the voltage and current of AVEE, VDD and VLED, and the junction temperature of the miniature display device. The monitoring of these parameters provides a direct basis for judging whether the miniature display device is in a normal working state. For example, in the design of an LED drive circuit based on junction temperature protection, the junction temperature can be determined by measuring the forward voltage of the LED, thereby avoiding performance degradation due to overheating. This precise monitoring capability ensures the efficiency and reliability of the test process.

[0043] In addition, through the above test system, users can set data warning lines based on monitoring electrical parameters. When the read data exceeds or falls below the set warning value, the control terminal or test equipment will automatically alarm. This function not only improves test efficiency, but also reduces the risk of equipment damage caused by failure to detect abnormal conditions in time. For example, in an LED drive circuit, when the junction temperature exceeds the set value, the system can automatically take protective measures, such as reducing power operation, thereby extending the life of the equipment.

[0044] In addition, the above test system adopts a modular design and can flexibly adapt to different test requirements. For example, the collaborative work of the control module, the reading module and the conversion module not only improves the test efficiency, but also allows functional expansion according to specific needs.

[0045] Secondly, by configuring the control terminal and real-time data monitoring, the test system can quickly generate detailed test results and display them to the user through a visual interface. That is, the test system has efficient data processing capabilities, which can significantly shorten the test cycle and improve test efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] In order to more clearly illustrate the implementation methods in the embodiments of the present application or the related technologies, the following is a brief introduction to the drawings required for use in the embodiments or the related technology descriptions. Obviously, the drawings described below are some embodiments of the present application, and a person skilled in the art can also obtain other drawings based on these drawings.

[0047] Figure 1 A schematic diagram of a first connection structure of a test system provided in an embodiment of the present application;

[0048] Figure 2 A schematic diagram of a second connection structure of the test system provided in an embodiment of the present application;

[0049] Figure 3 A schematic diagram of the three-dimensional structure of the test equipment provided in the embodiment of the present application;

[0050] Figure 4 A schematic diagram of the rear view structure of the test device provided in an embodiment of the present application;

[0051] Figure 5 A schematic diagram of a third connection structure of the test system provided in an embodiment of the present application;

[0052] Figure 6 A schematic diagram of a fourth connection structure of the test system provided in an embodiment of the present application;

[0053] Figure 7 A first flow chart of the test method provided in the embodiment of the present application;

[0054] Figure 8 A second flow chart of the test method provided in the embodiment of the present application;

[0055] Fig. 9 A third flow chart of the test method provided in the embodiment of the present application;

[0056] Fig.10 A fourth flow chart of the test method provided in the embodiment of the present application;

[0057] Fig.11 A schematic diagram of the structure of a test module of a test device provided in an embodiment of the present application.

[0058] Description of reference numerals:

[0059] 20. Test system; 21. Control terminal; A. Miniature display device;

[0060] 10. Test equipment;

[0061] 100, housing; 101, accommodating chamber; 102, opening;

[0062] 200, door body;

[0063] 300, control module; 301, processor; 302, USB interface; 303, Ethernet interface;

[0064] 400, reading module; 401, first interface; 402, testing module; 403, second interface;

[0065] 500, conversion module; 510, power conversion module; 520, current acquisition module;

[0066] 600, circuit board;

[0067] 700. Cooling fan.

[0068] 800, power supply module; 810, power supply module; 820, power supply socket. DETAILED DESCRIPTION

[0069] In order to make the purpose, implementation mode and advantages of the present application clearer, the exemplary implementation mode of the present application will be clearly and completely described below in conjunction with the drawings in the exemplary embodiments of the present application. Obviously, the described exemplary embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0070] It should be noted that the brief description of terms in this application is only for the convenience of understanding the embodiments described below, and is not intended to limit the embodiments of this application. Unless otherwise specified, these terms should be understood according to their common and usual meanings.

[0071] In addition, the terms "include" and "have" and any variations thereof are intended to cover but not exclude inclusion, for example, a product or device comprising a list of components is not necessarily limited to those components expressly listed but may include other components not expressly listed or inherent to such products or devices.

[0072] In the description of the present application, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0073] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0074] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0075] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0076] Reference Figure 1 , Figure 2 In a first aspect, an embodiment of the present application further provides a test system 20 including a control terminal 21.

[0077] It is understandable that the control terminal 21 can be any device directly controlled by a user, including but not limited to a personal computer (PC), a tablet computer, a smart phone, an industrial controller (such as a programmable logic controller (PLC) or a human-machine interface (HMI) device), an embedded system, a server terminal, a virtual terminal, etc.

[0078] The embodiment of the present application does not limit the specific type of the control terminal 21, nor is it limited to the above example.

[0079] The control terminal 21 is configured to receive an input signal from a user, and receive and display a test result of the test device 10 .

[0080] It is understandable that the input signal can be input in various ways, such as keyboard input, mouse operation, touch screen gesture, voice command, gesture recognition or other sensor signals, etc. The control terminal 21 can generate corresponding control instructions according to the user's input signal, and send these instructions to the test device 10 to trigger the test process or adjust the test parameters.

[0081] At the same time, the control terminal 21 also has the ability to receive test result data fed back by the test device 10, and display the test results to the user through a graphical user interface (GUI), text display, chart, sound prompt or other visual methods, so that the user can intuitively understand the progress and results of the test.

[0082] Reference Figure 3 , Figure 4 , Figure 5 as well as Figure 6 In a second aspect, an embodiment of the present application provides a testing device 10 for testing a miniature display device A.

[0083] It is understandable that the micro-display device A generally refers to a micro-display with a diagonal size of less than 1 inch (2.54 cm). Its core feature is to significantly reduce the size of the display unit to the micron level to achieve higher resolution, brightness and display performance.

[0084] In some embodiments, the testing device 10 includes a housing 100 , a door 200 , a control module 300 , a reading module 400 , and a conversion module 500 .

[0085] Specifically, the housing 100 is the main structure of the testing device 10 , and the housing 100 has a containing cavity 101 , an opening 102 and a testing interface.

[0086] The accommodating cavity 101 provides installation space for the control module 300 , the reading module 400 and the conversion module 500 therein.

[0087] The opening 102 is located at one side of the housing 100 and is used to install the door 200. The door 200 can protect the internal modules from external interference and provide a sealed environment during the test process.

[0088] The test interface is located at the other side of the housing 100 and is used to connect with the miniature display device A to ensure electrical connection and signal transmission during the test process.

[0089] The control module 300 is located in the accommodating cavity 101 and is a core component of the testing device 10. The control module 300 is configured to obtain a preset program and a user's input signal, and generate an output signal according to the preset program and the input signal.

[0090] It is understood that the preset program is a test process and parameters pre-stored in the control module 300, which is used to guide the entire test process. The user's input signal is input through the control terminal 21 (such as a personal computer, tablet computer or smart phone) to adjust the test parameters or start the test. The control module 300 generates an output signal based on the preset program and the user's input signal to control the entire test process.

[0091] It is understandable that the control module 300 may include a processor 301 for processing the above signal. The processor 301 is electrically connected to the reading module 400 and the conversion module 500 respectively.

[0092] It should be noted that the preset program can be preset in any manner. For example, the preset program can be transmitted to the control module 300 through a physical interface or through a communication connection.

[0093] The physical interfaces include but are not limited to:

[0094] USB interface 302: USB (Universal Serial Bus) is a universal serial bus interface, which is widely used for data transmission and device connection. It supports hot plugging and can quickly transfer data, and is suitable for transferring preset programs from an external storage device (such as a USB flash drive) to the control module 300.

[0095] RS-232 / RS-485 serial port: RS-232 and RS-485 are common serial communication interfaces suitable for short-distance communication. RS-232 is usually used for point-to-point communication, while RS-485 supports multi-point communication and is suitable for device connection in industrial environments.

[0096] Ethernet interface 303: Ethernet interface 303 (such as RJ-45) realizes the connection between devices through a network cable and supports high-speed data transmission. It can be used to transfer a preset program from a network server or a computer to the control module 300.

[0097] VGA interface: Although VGA (Video Graphics Array) is an analog video interface mainly used to connect monitors, it can also be used to transmit preset programs in some application scenarios.

[0098] Communication connections include but are not limited to:

[0099] Ethernet communication: Through the Ethernet network, the control module 300 can receive preset programs from a remote server or a local area network. This method is suitable for application scenarios that require remote management and device updates.

[0100] Wi-Fi communication: Wi-Fi is a wireless communication method that allows the control module 300 to receive preset programs through a wireless network. This method is suitable for scenarios that require flexible deployment and are not restricted by physical connections.

[0101] Bluetooth communication: Bluetooth is a short-range wireless communication technology suitable for data transmission between short-range devices. It can be used to transfer preset programs from a mobile device (such as a smartphone or tablet) to the control module 300.

[0102] Zigbee / LoRa communication: These two wireless communication protocols are commonly used for low-power, long-distance communication of IoT devices. They are suitable for the transmission of preset programs in industrial or smart home scenarios.

[0103] It can be understood that in the embodiment of the present application, the preset program can be transmitted to the control module 300 through the USB interface 302 in the physical interface. For example, if the preset program is placed in a storage card (SD card), the SD card is electrically connected to the control module 300 through the USB interface 302.

[0104] The reading module 400 is located in the accommodating cavity 101 and corresponds to the test interface. The reading module 400 is configured to be electrically connected to the miniature display device A to supply power to the miniature display device A and obtain working parameters of the miniature display device A;

[0105] Reference Figure 7 The reading module 400 includes a test module 402, which is electrically connected to the circuit board 600 through a first interface 401. The first interface 401 corresponds to a test interface. The test module 402 is electrically connected to the miniature display device A through a second interface 403 to power the miniature display device A and obtain the working parameters of the miniature display device A.

[0106] It is understandable that a reading module 400 can be provided with multiple test modules 402. For example, if multiple test modules 402 are connected to the same first interface 401 through a sub-circuit board, the number of interfaces between the test module 402 and the circuit board 600 can be reduced, thereby reducing costs.

[0107] The conversion module 500 is located in the accommodating cavity 101 and is electrically connected to the control module 300 and the reading module 400. The conversion module 500 is configured to receive the output signal of the control module 300, control the reading module 400 to control and obtain the working parameters of the miniature display device A according to the output signal, and transmit the working parameters to the control module 300 to generate test results.

[0108] It should be noted that the signal output by the control module 300 is a digital signal in a specific format, such as a composite signal including an instruction code and a data code. After receiving the signal, the conversion module 500 decodes it through an internal signal analysis unit to obtain the control instruction.

[0109] According to the decoded control instruction, the conversion module 500 sends a corresponding control signal to the reading module 400 through its output port to drive the reading module 400 to start working. After receiving the control signal, the reading module 400 establishes a connection with the micro display device A and obtains the working parameters of the micro display device A through the built-in sensor or detection unit.

[0110] It is understandable that the working parameters include but are not limited to indicators such as brightness, contrast, color saturation, response time, power consumption, etc. of the micro display device A. Through the reading module 400, the test device 10 can monitor the performance of the micro display device A in real time.

[0111] It should be noted that, refer to Figure 6 When there are multiple test modules 402, the multiple test modules 402 can be used to test different types of devices. For example, the same reading module 400 can be used to test the working parameters of the micro-display device A1, the micro-display device A2, and the micro-display device A3. In this way, the control terminal 21 can obtain and compare the working conditions of different types of micro-display devices A2.

[0112] Reference Figure 5 , Figure 6 As an optional implementation, the operating parameters of the micro-display device A include: at least one of the junction temperature, operating current, operating voltage, and display image of the micro-display device A.

[0113] In the embodiment of the present application, the operating parameters include at least AVEE (Average Voltage of Electrode), VDD (Voltage Drain Drain), VLED (Voltage of Light Emitting Diode), junction temperature, display image, etc.

[0114] AVEE refers to the average voltage of the electrode, which is used to characterize the voltage level of the electrode in the micro display device A. This parameter is crucial for evaluating the stability and performance of the electrode. For example, in a display device, the stability of the electrode voltage directly affects the display effect and the reliability of the device.

[0115] VDD is the drain voltage, which is usually used to characterize the supply voltage of the drain in a chip or circuit. In MOS transistors or CMOS circuits, VDD is the supply voltage of the drain, usually a positive power supply. It provides the operating voltage for the digital circuit or analog circuit inside the chip and is an important parameter for the normal operation of the chip.

[0116] VLED refers to the voltage of the light-emitting diode (LED), which is used to characterize the voltage level of the LED in the working state. This parameter is crucial for evaluating the luminous efficiency and power consumption of the LED. In the micro display device A, the stability and accuracy of VLED directly affect the display effect.

[0117] The junction temperature is the temperature of the hottest point inside the chip during operation, and the junction temperature directly affects the performance of the chip. Specifically, too high a junction temperature may cause the chip performance to deteriorate, such as slower computing speed and increased power consumption. High junction temperature will accelerate chip aging, reduce its service life, and may cause failures.

[0118] During the testing process, the display performance of the device needs to be evaluated through display image parameters such as contrast and response time.

[0119] During the test, the user inputs test instructions or adjusts parameters through the control terminal 21. After receiving these input signals, the control module 300 generates corresponding output signals according to the preset program. The output signal is transmitted to the reading module 400 through the conversion module 500. The reading module 400 supplies power to the miniature display device A according to the instructions and starts to collect its working parameters. The collected parameters are then transmitted back to the control module 300 through the conversion module 500. The control module 300 analyzes and processes these parameters, and finally generates detailed test results, which are displayed to the user through the control terminal 21.

[0120] The test device 10 provided in the embodiment of the present application is configured to work through the control terminal 21, and the test device 10 can read the key electrical parameters of the miniature display device A in real time, such as the voltage and current of AVEE, VDD and VLED, and the junction temperature of the miniature display device A. The monitoring of these parameters provides a direct basis for determining whether the miniature display device A is in a normal working state. For example, in the design of an LED drive circuit based on junction temperature protection, the junction temperature can be determined by measuring the forward voltage of the LED, thereby avoiding performance degradation due to overheating. This precise monitoring capability ensures the efficiency and reliability of the test process.

[0121] In addition, through the above-mentioned test system 20, the user can set a data warning line based on the monitoring of electrical parameters. When the read data exceeds or falls below the set warning value, the control terminal 21 or the test device 10 will automatically alarm. This function can not only improve the test efficiency, but also reduce the risk of equipment damage caused by the failure to detect abnormal conditions in time. For example, in the LED drive circuit, when the junction temperature exceeds the set value, the system can automatically take protective measures, such as reducing power operation, thereby extending the life of the equipment.

[0122] In addition, the test system 20 adopts a modular design and can flexibly adapt to different test requirements. For example, the coordinated work of the control module 300, the reading module 400 and the conversion module 500 not only improves the test efficiency, but also allows functional expansion according to specific needs.

[0123] Secondly, by configuring the control terminal 21 and real-time data monitoring, the test system 20 can quickly generate detailed test results and display them to the user through a visual interface. That is, the test system 20 has efficient data processing capabilities, which can significantly shorten the test cycle and improve test efficiency.

[0124] Reference Figure 3 , Figure 4 As an optional implementation, the test device 10 also includes a circuit board 600, and the control module 300, the reading module 400 and the conversion module 500 are all electrically connected to the circuit board 600; the reading module 400 is located on the side of the circuit board 600 facing the test interface, and the conversion module 500 and the control module 300 are located on the side of the circuit board 600 away from the test interface.

[0125] It can be understood that, assuming that the side surface of the circuit board 600 facing the test interface is the front side of the circuit board 600, and the side surface of the circuit board 600 away from the test interface is the back side of the circuit board 600. That is, the reading module 400 is located on the front side of the circuit board 600, and the conversion module 500 and the control module 300 are both located on the back side of the circuit board 600.

[0126] It should be noted that the reading module 400 is connected to the test interface via wires on the circuit board 600. When the miniature display device A is connected to the test interface, the reading module 400 can directly supply power and obtain its working parameters.

[0127] The conversion module 500 is connected to the control module 300 via the wires on the circuit board 600. The output signal generated by the control module 300 is decoded and processed by the conversion module 500, and then transmitted to the reading module 400 via the wires of the circuit board 600.

[0128] The control module 300 receives a user input signal and a preset program from the control terminal 21 , generates a control instruction, and transmits the control instruction to the reading module 400 through the conversion module 500 .

[0129] By placing the reading module 400 close to the test interface through the above arrangement, the signal transmission path can be reduced, and signal attenuation and interference can be reduced. The above layout is a modular arrangement, which is convenient for maintenance and upgrading. For example, the control module 300, the reading module 400 or the conversion module 500 can be replaced or upgraded separately. In addition, the test device 10 realizes electrical connection between different modules through the circuit board 600, which can ensure the stability and reliability of signal transmission.

[0130] Reference Figure 3 , Figure 4 As an optional implementation, the conversion module 500 includes a power conversion module 510, and the power conversion module 510 is electrically connected to the circuit board 600 and to the reading module 400;

[0131] The power conversion module 510 is configured to change the resistance between the circuit board 600 and the reading module 400 to control the operating voltage and current of the miniature display device A, and obtain the voltage and current of the miniature display device A through the reading module 400.

[0132] Through the above settings, the test device 10 can adjust the resistance so that the power conversion module 510 can accurately control the working voltage and current of the miniature display device A to ensure its stable operation under different test conditions. In addition, the power conversion module 510 obtains voltage and current parameters in real time through the reading module 400, and can respond and adjust quickly to avoid overloading or damage to the test device 10.

[0133] As an optional implementation, the power conversion module 510 includes a power processor and a digital potentiometer.

[0134] Wherein, the power processor is electrically connected to the control module 300, and the power processor is used to receive the output signal of the control module 300;

[0135] The digital potentiometer is electrically connected to the power processor and the circuit board 600 . The digital potentiometer is configured to change resistance under the control of the power processor and control the voltage of the miniature display device A through the reading module 400 .

[0136] It should be noted that the power conversion module 510 controls the operating voltage and current of the miniature display device A by changing the resistance between the circuit board 600 and the reading module 400. The above adjustment is usually achieved through a digital potentiometer.

[0137] The power conversion module 510 can accurately control the power supply voltage and current of the miniature display device A by adjusting the resistance.

[0138] In addition, the power conversion module 510 also obtains the actual voltage and current values ​​of the miniature display device A through the reading module 400. The above parameters can be used to monitor the working status of the device in real time and fed back to the control module 300 for further analysis and adjustment.

[0139] Through the above settings, the power conversion module 510 can accurately control the working voltage and current of the miniature display device A to ensure its stable operation under different test conditions. The power conversion module 510 obtains voltage and current parameters in real time through the reading module 400, and can respond and adjust quickly to avoid overloading or damage to the miniature display device A. The above design can flexibly adjust the working parameters according to different test requirements and is suitable for various test scenarios of the miniature display device A.

[0140] Reference Figure 3 , Figure 4As an optional implementation, the power conversion module 510 further includes a current acquisition module 520, and the current acquisition module 520 is electrically connected to the control module 300 and the circuit board 600;

[0141] The current acquisition module 520 is configured to receive the current of the miniature display device A through the reading module 400 under the control of the power processor.

[0142] Specifically, the current acquisition module 520 is connected to the miniature display device A through the reading module 400 to measure the current of the miniature display device A in real time. Then, the current acquisition module 520 converts the detected current signal into a voltage signal or other signal form suitable for transmission. The collected current data is transmitted to the control module 300 through the circuit board 600 for real-time monitoring and analysis.

[0143] The current acquisition module 520 can be used to monitor the current changes of the miniature display device A in real time to ensure that it works within a safe range. When the current exceeds the preset range, the current acquisition module 520 can issue a warning signal in time to help the system take protective measures. By accurately measuring the current, the current acquisition module 520 can optimize power management and improve the efficiency of the test device 10.

[0144] Reference Figure 3 , Figure 4 As an optional implementation, a heat dissipation port is also opened on the shell 100, and the heat dissipation port is connected to the accommodating cavity 101; the testing device 10 also includes a heat dissipation fan 700, the heat dissipation fan 700 is electrically connected to the circuit board 600, and the heat dissipation fan 700 is arranged corresponding to the heat dissipation port.

[0145] It is understandable that the heat dissipation port is directly connected to the accommodating cavity 101. By installing a heat dissipation fan 700 near the heat dissipation port, the heat dissipation fan 700 is powered by the circuit board 600 and is electrically connected to the control module.

[0146] When the test device 10 is running, the control module 300, the conversion module 500 and other components will generate heat, and the cooling fan 700 receives the control signal through the circuit board 600 and starts. The cooling fan 700 rotates to generate airflow, and the heat is discharged from the inside of the device through the heat dissipation port. If the temperature inside the device is too high, the control module can increase the fan speed to enhance the heat dissipation effect.

[0147] In a power module with high power density, the cooperation of the cooling fan 700 and the heat dissipation port can effectively reduce the temperature of the module and extend its service life.

[0148] For the test equipment 10 that needs to run for a long time, the design of the heat dissipation fan 700 and the heat dissipation port can prevent the test equipment 10 from overheating and ensure its stable operation.

[0149] As an optional embodiment, the test system 20 further includes a power supply module 800, which includes a power supply module 810 and a power supply socket 820. The power supply socket 820 is used to plug in a 220V power supply, and the power supply module 810 is used to convert AC220V into a working voltage suitable for use by the conversion module 500, such as DC12V. The power supply module 810 is electrically connected to the circuit board 600.

[0150] As an optional implementation, the test system 20 further includes a pattern generator.

[0151] It is understandable that the pattern generator is used to generate specific pattern graphics. These graphics can be test patterns, display effect verification graphics or other images used to test the display function of the miniature display device A.

[0152] Exemplarily, the pattern generator may generate various test patterns (such as black and white stripes, color squares, gradient patterns, etc.) for verifying performance indicators such as resolution, color uniformity, and contrast of the display panel.

[0153] The pattern generator is configured to generate a pattern graphic under the control of the control terminal 21 and transmit it to the display panel module for display. That is, the pattern generator is electrically connected to the miniature display device A and the control terminal 21 to ensure that the generated graphic can be directly transmitted to the display panel module of the miniature display device A for display.

[0154] The pattern generator is usually composed of a digital signal processing unit and a graphic generation module. The digital signal processing unit receives instructions from the control terminal 21 and generates corresponding digital signals according to the instructions. The graphic generation module converts the digital signal into an image format suitable for the display panel and transmits it to the display panel module for display through an electrical connection.

[0155] It is understandable that the control terminal 21 (such as a computer or other control device) sends instructions to the style generator through a software or hardware interface to specify the type of graphics to be generated, display parameters, etc.

[0156] Exemplarily, the working steps of the pattern generator are as follows:

[0157] 1) The control terminal 21 sends instructions through the software interface to specify the pattern generator to generate a resolution test pattern (such as a black and white stripe pattern).

[0158] 2) The instructions are transmitted to the pattern generator via an interface (such as USB or Ethernet).

[0159] 3) After the pattern generator receives the instruction, the digital signal processing unit generates a corresponding digital signal according to the instruction.

[0160] 4) The graphics generation module converts the digital signal into an image format and transmits it to the micro display device A through an electrical connection.

[0161] 5) After receiving the graphic data, the micro-display device A displays it on the screen.

[0162] 6) The tester verifies whether the resolution of the display device meets expectations by observing the display effect.

[0163] 7) The control terminal 21 may continue to send other instructions to generate different types of test patterns (such as color gradient patterns) for verifying the color uniformity and contrast of the display device.

[0164] Through the above settings, the control terminal 21 and the pattern generator cooperate with each other to realize the automated testing of the display device and improve the testing efficiency. The pattern generator can generate a variety of test patterns as needed to meet different testing requirements. The test results can be displayed in real time on the miniature display device A, which is convenient for quickly finding problems.

[0165] Reference Figure 8 In a third aspect, the present application embodiment further provides a testing method for testing the system 20, the testing method comprising:

[0166] S100, connecting the test system to the miniature display device; wherein the test system includes an electrically connected test device and a control terminal, the test device includes an electrically connected control module, a reading module and a conversion module, and the control module is electrically connected to the control terminal;

[0167] That is, a connection is established between the test system 20 and the micro-display device A, providing a basis for subsequent test operations.

[0168] S200, the control module controls the conversion module through the input signal of the control terminal and the preset program to generate an output signal;

[0169] Through the processing of the control module 300, the user input and the preset program are converted into specific test instructions to drive the subsequent modules to work.

[0170] S300, the conversion module receives and controls the reading module to obtain the working parameters of the micro-display device according to the output signal output by the control module, and transmits the parameters to the control module to generate the test results;

[0171] Through the coordination of the conversion module 500 , the reading module 400 can obtain the actual working parameters of the miniature display device A and feed the data back to the control module 300 .

[0172] S400, the control terminal receives the test result generated by the control module.

[0173] The test results are fed back to the user so that the user can understand the performance and status of the micro display device A.

[0174] The test method provided in the embodiment of the present application realizes automation of the test process through the cooperation between the control terminal 21 and the control module 300, which can improve the test efficiency. The reading module 400 can accurately obtain the working parameters of the miniature display device A and provide real-time feedback to the control terminal 21. The control terminal 21 displays the test results through a visual interface, which is convenient for users to quickly understand the performance of the device.

[0175] Reference Fig. 9 As an optional implementation, the output signal includes a switching signal, and the conversion module 500 receives and outputs the output signal according to the control module 300, including:

[0176] S310, the conversion module receives the switching signal, and forms a switching image according to the processing of the switching signal, so as to transmit the switching image to the micro-display device through the reading module, and the micro-display device displays the switching image.

[0177] It should be noted that the switching signal is a special signal generated by the control module 300, which is used to instruct the conversion module 500 to perform a specific operation. In this scenario, the switching signal is used to trigger the conversion module 500 to generate a switching image, and transmit the image to the micro display device A for display through the reading module 400.

[0178] The conversion module 500 first receives the switching signal from the control module 300. The conversion module 500 generates a specific image (switching image) according to the content of the switching signal. This image may be a test pattern, a display mode switching screen, or other images used to verify the function of the display device. The generated switching image is transmitted to the micro-display device A through the reading module 400 and displayed on the micro-display device A.

[0179] After receiving the switching image, the micro-display device A displays it on the screen. This process is not only used to test the display function of the display device, but also can be used to verify the switching ability of the micro-display device A in different modes (for example, switching from normal display mode to low power consumption mode).

[0180] By displaying the switching images, it is possible to intuitively verify whether the switching function of the micro display device A in different modes is normal. Secondly, the above process is automatically completed by the control terminal 21 and the conversion module 500, thereby improving the test efficiency. The conversion module 500 can generate a variety of switching images according to different switching signals, which are applicable to a variety of test scenarios.

[0181] As an optional implementation, the output signal includes a power supply signal and a feedback signal.

[0182] It is understandable that the power supply signal is a signal generated by the control module 300, which is used to provide necessary power support for the miniature display device A to enable it to work normally. The generation and transmission of the power supply signal is the initial step of the test process, ensuring that the miniature display device A obtains a stable power supply during the test process.

[0183] The feedback signal is a status signal sent by the micro display device A to the control module 300 through the reading module 400 and the conversion module 500 after the micro display device A receives the power supply signal and starts working. The feedback signal is used to inform the control module 300 of the working status of the micro display device A, such as the working voltage, current, temperature or other key parameters.

[0184] During the test, a power supply signal is first generated and transmitted to the miniature display device A to start the device and put it into operation. A feedback signal is generated after the miniature display device A starts working and completes the initial self-test or parameter measurement, and is transmitted back to the control module 300 through the reading module 400 and the conversion module 500.

[0185] Therefore, the feedback signal is formed later than the power supply signal, and the feedback signal is transmitted later than the power supply signal.

[0186] Reference Fig.10 As an optional implementation,

[0187] S320: When the output signal received by the conversion module is a power supply signal, the conversion module receives the power supply signal and controls the resistance of the reading module according to the power supply signal to control the voltage of the miniature display device.

[0188] The conversion module 500 controls the voltage of the micro display device A by adjusting the resistance of the reading module 400 , which is usually achieved through a feedback resistor network, such as using a voltage divider resistor or a variable resistor.

[0189] For example, in some power circuit designs, the feedback resistor network samples the output voltage and feeds it back to the conversion module 500 , and the conversion module 500 adjusts the output voltage according to the feedback signal.

[0190] By precisely controlling the voltage, it is ensured that the micro display device A can operate stably in different working modes (such as normal display mode and low power consumption mode). Voltage control can also prevent device damage caused by power supply fluctuations.

[0191] Exemplarily, the steps of the power supply process are as follows:

[0192] 1) Generate a power supply signal. For example, the user inputs a command in the software interface of the control terminal 21 to test the display effect of the micro display device A under a voltage of 5V.

[0193] 2) The control module 300 generates a power supply signal according to the instruction and transmits it to the reading module 400 through the conversion module 500 .

[0194] 3) After receiving the power supply signal, the conversion module 500 adjusts the output voltage through the internal feedback resistor network.

[0195] For example, the conversion module 500 samples the output voltage through voltage-dividing resistors (such as R1 and R2), and adjusts the output voltage according to the feedback signal to ensure that it is stable at 5V.

[0196] 4) After receiving the stable 5V voltage, the micro display device A starts to work and displays the test image.

[0197] 5) The reading module 400 monitors the operating voltage of the device through a built-in sensor and feeds the data back to the control module 300.

[0198] 6) If the reading module 400 detects voltage fluctuation (eg, lower than 5V), the information is fed back to the conversion module 500 .

[0199] 7) The conversion module 500 adjusts the resistor network according to the feedback signal to stabilize the output voltage again.

[0200] Reference Fig.11 As an optional implementation,

[0201] S330: When the output signal received by the conversion module is a feedback signal, the conversion module receives the feedback signal and controls the reading module to obtain the working parameters of the micro-display device according to the feedback signal.

[0202] It is understood that the feedback signal is a signal generated by the micro-display device A, which is used to report its current working status to the test system 20. The feedback signal generally contains key working parameters of the micro-display device A. The feedback signal enables the test system 20 to monitor the operation of the micro-display device A in real time, and adjust the test process or take protective measures according to these parameters.

[0203] The conversion module 500 receives the feedback signal through the connection with the miniature display device A. The conversion module 500 analyzes the received feedback signal to extract useful information. According to the content of the feedback signal, the conversion module 500 controls the reading module 400 to further obtain the detailed working parameters of the miniature display device A.

[0204] The reading module 400 obtains detailed working parameters of the miniature display device A through sensors or detection units according to the instructions of the conversion module 500. The obtained parameters are transmitted back to the control module 300 through the conversion module 500 to generate test results.

[0205] Exemplarily, the steps of testing result feedback are as follows:

[0206] 1) Sending a test command: The user enters a command in the software interface of the control terminal 21 to test the brightness and power consumption of the micro display device A.

[0207] 2) The control module 300 generates an output signal (including a power supply signal and a feedback signal) according to the instruction.

[0208] 3) After receiving the power supply signal, the micro display device A starts to work and generates a feedback signal to report its current working status. The feedback signal contains preliminary working parameters, such as the current working voltage and current.

[0209] 4) The conversion module 500 receives the feedback signal and analyzes the information.

[0210] 5) The conversion module 500 controls the reading module 400 to further obtain detailed operating parameters of the micro display device A according to the content of the feedback signal.

[0211] 6) The detailed working parameters acquired by the reading module 400 are transmitted back to the control module 300 via the conversion module 500 .

[0212] 7) The control module 300 analyzes and processes these parameters to generate test results.

[0213] 8) The control module 300 transmits the test results to the control terminal 21 , and the control terminal 21 displays the test results through a graphical user interface (GUI).

[0214] Through the cooperation of the feedback signal and the reading module 400, the test system 20 can monitor the working status of the micro display device A in real time and adjust the test process as needed. If the feedback signal shows that the device is abnormal (such as excessive temperature or abnormal power consumption), the test system 20 can take protective measures in time to prevent damage to the device. The reading module 400 can obtain detailed parameters to ensure the accuracy and reliability of the test results.

[0215] Preferably, the miniature display device A described in the present application is a miniature display device comprising a miniature light emitting diode chip, each of which has a size of no more than 1 cm, preferably no more than 20 μm. The miniature light emitting diode structure is formed in the miniature light emitting diode chip in an array form, with a resolution of, for example, 720*480, 640*480, 1920*1080, 1280*720, 2K or 4K. The diameter of the miniature light emitting diode structure is at the nanometer level, for example, 20 nm to 100 nm.

[0216] In some embodiments, the micro-LED array may include a single layer of micro-LED structures. In some embodiments, the pitch of the micro-LED array, i.e., the minimum center-to-center distance between micro-LEDs, may be between about 2 microns and about 50 microns. In some embodiments, the number of pixels on a micro-LED chip may be between thousands and millions.

[0217] In some embodiments, the micro-LEDs may be arranged on the driving backplane in a regular or irregular manner to serve as pixels of the micro-LED chip.

[0218] In some embodiments, the driving backplane can be electrically connected to each micro-LED in the micro-LED array via a separate metal interconnect. In some embodiments, each micro-LED can be electrically controlled individually by the driving backplane. In some embodiments, the driving backplane can be electrically connected to electrodes of a micro-LED chip via a metal interconnect. In some embodiments, the driving backplane is an IC backplane.

[0219] In some embodiments, the driving backplane includes a substrate, a driving circuit, and a driving electrode. The driving circuit is located in the substrate and controls the lighting and extinguishing of the micro-LED; the driving electrode is located in the substrate and at least the upper surface is exposed, and the driving electrode is electrically connected to the driving circuit. Each micro-LED corresponds to a driving electrode, and the micro-LED is located on the driving electrode and is electrically connected to the driving electrode.

[0220] In some embodiments, the material of the driving electrode is an alloy of one or more of the following metals: Ni, Al, Ti, Cu, Pt and Au. In some embodiments, the substrate is a Si substrate. In other embodiments, the substrate is a transparent substrate, such as a glass substrate. Examples of other substrates include GaAs, GaP, InP, SiC, ZnO and sapphire substrates. In some embodiments, the substrate is about 700 microns thick. The driving circuit forms individual pixel drivers to control the operation of each single pixel LED device. The driving circuit includes, for example, a complementary metal oxide semiconductor (CMOS) device or a TFT device. In some embodiments, a dielectric layer may be formed in the gap between the micro light emitting diodes. In some embodiments, a dielectric layer may also be formed in the gap between the interconnects.

[0221] The driving mode of the micro-LED is, for example, a passive matrix (PM) driving mode, in which the cathodes of all the micro-LEDs in each array are connected to the cathode line NL, and the micro-LEDs with the same number in each array are connected to the corresponding anode line PL. Thus, the on / off and light brightness of each LED can be individually controlled by controlling the model numbers on the corresponding cathode line and anode line.

[0222] In some embodiments, the micro-LED can be bonded to the surface of the driving backplane through a bonding layer. The driving electrode is electrically connected to the bonding layer, and the bonding layer includes a first metal layer and a second metal layer. In some embodiments, the material of the first metal layer is an alloy of one or more of the following metals: Cr, Al, Ti, Ni, Pt, Au, and Sn; and / or the material of the second metal layer is an alloy of one or more of the following metals: Cr, Al, Ti, Ni, Pt, Au, and Sn.

[0223] In some embodiments, the micro light emitting diode includes: an epitaxial layer, an ohmic contact layer, a passivation isolation layer, and a top conductive layer.

[0224] For convenience, "upward" is used to mean away from the drive backplane, "downward" means towards the drive backplane, and other directional terms such as top, bottom, above, below, directly below, underneath, etc. are to be interpreted accordingly.

[0225] In some embodiments, the micro-light emitting diode includes: an epitaxial layer, an ohmic contact layer, a top conductive layer and a passivation insulating layer. The ohmic contact layer is located on the bonding layer and is electrically connected to the bonding layer. The epitaxial layer is arranged on the ohmic contact layer. The passivation insulating layer at least partially covers the side of the epitaxial layer, and the passivation insulating layer is located between the epitaxial layer and the top conductive layer. The top conductive layer is located on the side and top surface of the epitaxial layer.

[0226] In some embodiments, the material of the passivation isolation layer is, for example, a solid inorganic material or a plastic material. In some embodiments, the solid inorganic material includes SiO2, Al2O3, Si3N4, SiCN, HfO2, Ta2O5, TiO2, ZrO2, La2O3, MgO, phosphosilicate glass (PSG), borophosphosilicate glass (BPSG), or any combination thereof. In some embodiments, the plastic material includes a polymer such as SU-8, PermiNex, benzocyclobutene (BCB), or a transparent plastic (resin) including spin-on glass (SOG), or a microresist BCL-1200 in combination with an adhesive, or any combination thereof. The passivation isolation layer is transparent to the light emitted by the epitaxial layer.

[0227] In some embodiments, the first metal layer of the bonding layer is in direct contact with the ohmic contact layer at the bottom of the epitaxial layer, and the second metal layer is located at the bottom of the bonding layer, away from the epitaxial layer, wherein the profile of the first metal layer is smaller than that of the second metal layer.

[0228] In some embodiments, the bottom lateral dimension of the epitaxial layer is greater than the top lateral dimension. In some embodiments, the optical mesa is stepped or trapezoidal.

[0229] In some embodiments, the epitaxial layer is trapezoidal, not limited to a regular trapezoid or an inverted trapezoid. In some embodiments, the sidewall of the epitaxial layer has an inclination angle ranging from 60° to 85°. In one embodiment, the lateral dimension of the bonding layer is greater than the bottom lateral dimension of the epitaxial layer.

[0230] In some embodiments, the epitaxial layer includes a first type epitaxial layer, a second type epitaxial layer and a light emitting layer therebetween. The first type epitaxial layer is located above the light emitting layer and away from the driving backplane, and the second type epitaxial layer is located below the light emitting layer and close to the driving backplane.

[0231] In some embodiments, the light emitting layer is formed by a plurality of stacked quantum well layers, in particular, quantum well layers stacked in a superlattice. Preferably, the quantum well layers stacked in a superlattice include a plurality of pairs of quantum well layers stacked with quantum barrier layers.

[0232] In one embodiment, the light emitting layer includes a multi-quantum well layer and an electron blocking layer, and the multi-quantum well layer is an InGaN / GaN multi-quantum well layer or an InGaN / AlGaN multi-quantum well layer or an InGaAs / AlGaAs multi-quantum well layer. In another embodiment, the first type epitaxial layer may also be a P-type GaN layer or a P-type AlGaN layer, and the second type epitaxial layer may be an N-type GaN layer or an N-type AlGaN layer.

[0233] In some embodiments, the first type epitaxial layer is a semiconductor material having a first type epitaxial layer, and includes a plurality of semiconductor layers. The main matrix material of the first type epitaxial layer can be, but is not limited to, composed of at least two elements of Ga, N, As, P, In and Al. In addition, the first type epitaxial layer can include, from top to bottom, but is not limited to, a confinement layer and a waveguide layer; in addition, in some embodiments, an ohmic contact layer can be formed on the confinement layer.

[0234] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

[0235] For the convenience of explanation, the above description has been made in conjunction with specific embodiments. However, the above exemplary discussion is not intended to be exhaustive or limit the embodiments to the specific forms disclosed above. Based on the above teachings, various modifications and variations can be obtained. The selection and description of the above embodiments are to better explain the principles and practical applications, so that those skilled in the art can better use the embodiments and various different variations of the embodiments suitable for specific use considerations.

Claims

1. A testing device, characterized in that: Used for testing a micro-display device (A), the testing device (10) comprises: A housing (100) having a receiving cavity (101), an opening (102) communicating with the receiving cavity (101), and a test interface, wherein the test interface and the opening (102) are respectively opened on different sides of the housing (100); A door body (200) is arranged at the opening (102); A control module (300) is located in the accommodating cavity (101), and the control module (300) is configured to obtain a preset program and an input signal from a user, and generate an output signal according to the preset program and the input signal; a reading module (400) located in the accommodating cavity (101) and corresponding to the test interface, the reading module (400) being configured to be electrically connected to the micro-display device (A) for supplying power to the micro-display device (A) and obtaining working parameters of the micro-display device (A); A conversion module (500) is located in the accommodating cavity (101) and is electrically connected to the control module (300) and the reading module (400). The conversion module (500) is configured to receive an output signal of the control module (300), control the reading module (400) to control and obtain working parameters of the miniature display device (A) according to the output signal, and transmit the working parameters to the control module (300) to generate a test result.

2. The test device according to claim 1, characterized in that It also includes a circuit board (600), and the control module (300), the reading module (400) and the conversion module (500) are all electrically connected to the circuit board (600); The reading module (400) is located on a side of the circuit board (600) facing the test interface, and the conversion module (500) and the control module (300) are located on a side of the circuit board (600) facing away from the test interface.

3. The testing device according to claim 2, characterized in that The conversion module (500) comprises a power conversion module (510), wherein the power conversion module (510) is electrically connected to the circuit board (600) and is also electrically connected to the reading module (400); The power conversion module (510) is configured to change the resistance between the circuit board (600) and the reading module (400) to control the operating voltage and the operating current of the micro-display device (A), and to obtain the voltage and the current of the micro-display device (A) through the reading module (400).

4. The testing device according to claim 3, characterized in that The power conversion module (510) comprises: a power processor, electrically connected to the control module (300), the power processor being used to receive an output signal of the control module (300); A digital potentiometer is electrically connected to the power processor and the circuit board (600), and the digital potentiometer is configured to change resistance under the control of the power processor and control the voltage of the miniature display device (A) through the reading module (400).

5. The testing device according to claim 4, characterized in that The power conversion module (510) further includes: A current collection module (520) is electrically connected to the control module (300) and the circuit board (600); The current acquisition module (520) is configured to receive the current of the miniature display device (A) through the reading module (400) under the control of the power processor.

6. The testing device according to any one of claims 2 to 5, characterized in that: The shell (100) is also provided with a heat dissipation port, the heat dissipation port being connected to the accommodating cavity (101); the testing device (10) further comprises a heat dissipation fan (700), the heat dissipation fan (700) is electrically connected to the circuit board (600), and the heat dissipation fan (700) is arranged corresponding to the heat dissipation port.

7. A testing system, characterized in that: comprising a control terminal (21) and a test device (10) according to any one of claims 1 to 5, wherein the control terminal (21) is electrically connected to the test device (10); The control terminal (21) is configured to receive an input signal from a user, and receive and display a test result of the test device (10).

8. The test system according to claim 7, characterized in that: The test system (20) further comprises a pattern generator, wherein the pattern generator is electrically connected to the micro-display device (A) and the control terminal (21); The pattern generator is configured to generate a pattern graphic under the control of the control terminal (21) and transmit it to the miniature display device (A) for display.

9. A testing method, characterized in that: For use in the test system (20) according to claim 7 or 8, the test method comprises: The test system (20) is connected to a miniature display device (A); wherein the test system (20) comprises an electrically connected test device (10) and a control terminal (21); the test device (10) comprises an electrically connected control module (300), a reading module (400) and a conversion module (500); the control module (300) is electrically connected to the control terminal (21); The control module (300) controls the conversion module (500) through the input signal of the control terminal (21) and a preset program to generate an output signal; The conversion module (500) receives and controls the reading module (400) to obtain the working parameters of the micro-display device (A) according to the output signal output by the control module (300), and transmits the parameters to the control module (300) to generate a test result; The control terminal (21) receives the test result generated by the control module (300).

10. The testing method according to claim 9, characterized in that: The output signal comprises a switching signal, and the conversion module (500) receives and outputs the output signal according to the control module (300), comprising: The conversion module (500) receives the switching signal and processes the switching signal to form a switching image, so as to transmit the switching image to the micro-display device (A) through the reading module (400), and enable the micro-display device (A) to display the switching image.

11. The testing method according to claim 9, characterized in that: The output signal includes a power supply signal and a feedback signal; The feedback signal is generated later than the power supply signal.

12. The testing method according to claim 11, characterized in that: When the output signal received by the conversion module (500) is the power supply signal, The conversion module (500) receives the power supply signal and controls the resistance of the reading module (400) according to the power supply signal, so as to control the voltage of the micro display device (A).

13. The testing method according to claim 11, characterized in that: When the output signal received by the conversion module (500) is the feedback signal, The conversion module (500) receives the feedback signal, and controls the reading module (400) to obtain the working parameters of the micro-display device (A) according to the feedback signal.

14. The testing method according to claim 13, characterized in that: The operating parameters of the micro-display device (A) include: At least one of the junction temperature, operating current, operating voltage, and display image of the micro display device (A).

Images