OCS array optical switch and monitoring method thereof

Abstract

The invention relates to the technical field of optical communication, in particular to an OCS array optical switch and a monitoring method thereof.Signal light and first monitoring light are coupled through an input coupling module and then transmitted to an input MEMS chip, the coupled light is transmitted to a dichroic mirror through the input MEMS chip, the two beams of light are separated through the dichroic mirror, and the two beams of light are transmitted to an output MEMS chip; the first monitoring light is transmitted to the monitoring sensing module; similarly, the second monitoring light is transmitted to the monitoring sensing module; whether light spots of the first monitoring light and the second monitoring light fall on ideal positions or not is judged in the monitoring sensing module, if the light spots of the first monitoring light and the second monitoring light are not located on the ideal positions, a rotating mirror is controlled by adjusting the voltage value of an MEMS chip so that the monitoring light can fall on the optimal point position, and at the moment, the rotating angle of the rotating mirror enables light rays incident from a specified channel to be emitted from a specified emergent port; the purpose of optical switch switching is achieved; the monitoring system can also realize real-time monitoring and correction of the optical path, and solves the problem that the performance of the OCS system is degraded due to the deflection of the transfer mirror in the MEMS chip.

Description

Technical Field

[0001] The present invention relates to the field of optical communication technology, and in particular to an OCS array optical switch and a monitoring method thereof. Background Art

[0002] Many optical cross-connect switches can be used to switch optical signals directly from one optical fiber to another, eliminating the need to convert the optical signal into an intermediate electrical signal. Among them, the switching and routing of optical signals can be performed by an optical circuit switch (OCS). OCS is an all-optical switching matrix that can transmit optical signals from input ports to output ports. Optical signals can be switched from one path to another by repositioning one or more mirrors in the mirror array. For MxN array optical switches, arbitrary pairing connections between M input channels and N output channels can be achieved. The switching is all based on the optical layer without wavelength switching or electrical switching. It can significantly reduce the number of traditional switches required in data center networks and reduce the expensive optoelectronic conversion required by circuit switches, which can bring greater cost and power savings and reduce transmission delay. With the advancement of photonic integration technology, the size, power consumption and cost of OCS systems have decreased, while performance and flexibility have improved. In addition, with the growth of cloud computing and big data applications, the demand for high-capacity, low-latency communications is increasing, which has promoted the further development of OCS technology.

[0003] However, as the dimension of OCS increases, the integration of Micro Electro Mechanical Systems (MEMS) chips becomes very high, resulting in a very small spacing between the rotating mirrors. As long as a slight displacement occurs in the entire system, it may cause a sharp degradation of performance such as channel insertion loss. During the operation of accessing customer signal light, the mirror on the MEMS chip may shift its rotation angle due to factors such as charge accumulation, or environmental factors such as vibration may cause channel performance to deteriorate, affecting usage.

[0004] In view of this, overcoming the defects of the prior art is an urgent problem to be solved in the field of this technology. Summary of the invention

[0005] The technical problem to be solved by the present invention is how to solve the problem that the rotation angle of the rotating mirror in the MEMS chip drifts due to changes in environmental factors such as charge accumulation or vibration, thereby causing the performance of the OCS system to deteriorate.

[0006] The present invention adopts the following technical solution:

[0007] In a first aspect, an OCS array optical switch is provided, comprising an input coupling module 1, an input MEMS chip 2, a dichroic mirror 3, a monitoring sensor module 4, an output MEMS chip 5, and an output coupling module 6;

[0008] The input coupling module 1, the input MEMS chip 2, the reflective surface of the dichroic mirror 3, the output MEMS chip 5 and the output coupling module 6 are coupled in sequence along the optical path, and the monitoring sensor module 4 is coupled with the transmission surface of the dichroic mirror 3;

[0009] The input coupling module 1 is used to transmit the signal light and the first monitoring light to the input MEMS chip 2, the input MEMS chip 2 is used to transmit the signal light and the first monitoring light to the dichroic mirror 3, the dichroic mirror 3 is used to reflect the signal light to the output MEMS chip 5, and transmit the first monitoring light to the monitoring sensor module 4; the output MEMS chip 5 is used to transmit the signal light to the corresponding output port in the output coupling module 6;

[0010] The output coupling module 6 is used to transmit the second monitoring light to the output MEMS chip 5, the output MEMS chip 5 is used to transmit the second monitoring light to the dichroic mirror 3, and the dichroic mirror 3 is used to transmit the second monitoring light to the monitoring sensor module 4;

[0011] The monitoring sensor module 4 is used to adjust the rotation angle of the input MEMS chip 2 and the rotation angle of the output MEMS chip 5 according to the spot position of the first monitoring light and the spot position of the second monitoring light, so that the signal light is transmitted to the corresponding output port.

[0012] Preferably, it further comprises an input monitoring light source 7, the input coupling module 1 comprises an input optical switch 11, an input wavelength division device 12 and an input collimator 13, the input monitoring light source 7 is coupled with the input end of the input optical switch 11, the output end of the input optical switch 11 is coupled with the monitoring end of the input wavelength division device 12, the signal end of the input wavelength division device 12 is used to receive the signal light, the common end of the input wavelength division device 12 is coupled with the input end of the input collimator 13, and the output end of the input collimator 13 is coupled with the input MEMS chip 2;

[0013] The input monitoring light source 7 is used to emit the first monitoring light, the input optical switch 11 is used to transmit the first monitoring light to the input wavelength division device 12, the input wavelength division device 12 is used to transmit the signal light and the first monitoring light to the input collimator 13, and the input collimator 13 is used to collimate the signal light and the first monitoring light and then transmit them to the input MEMS chip 2.

[0014] Preferably, it further comprises an output monitoring light source 8, the output coupling module 6 comprises an output optical switch 61, an output wavelength division device 62 and an output collimator 63, the output monitoring light source 8 is coupled with the input end of the output optical switch 61, the output end of the output optical switch 61 is coupled with the monitoring end of the output wavelength division device 62, the signal end of the output wavelength division device 62 is used to output the signal light, the common end of the output wavelength division device 62 is coupled with the output end of the output collimator 63, and the input end of the output collimator 63 is coupled with the output MEMS chip 5;

[0015] The output monitoring light source 8 is used to emit the second monitoring light, the output optical switch 61 is used to transmit the second monitoring light to the output wavelength division device 62, the output wavelength division device 62 is used to transmit the second monitoring light to the output collimator 63, and the output collimator 63 is used to transmit the second monitoring light to the output MEMS chip 5.

[0016] Preferably, the monitoring sensor module 4 includes a first beam alignment screen 41, a second beam alignment screen 42, a first image acquisition unit 43, a second image acquisition unit 44 and a control unit 45; the first beam alignment screen 41 is used to receive the first monitoring light from the dichroic mirror 3, and the first image acquisition unit 43 is used to acquire the spot position of the first monitoring light on the first beam alignment screen 41;

[0017] The second light beam alignment screen 42 is used to receive the second monitoring light from the dichroic mirror 3, and the second image acquisition unit 44 is used to acquire the spot position of the second monitoring light on the second light beam alignment screen 42;

[0018] The first light beam alignment screen 41 is preset with an ideal position of the light spot of the first monitoring light, and the second light beam alignment screen 42 is preset with an ideal position of the light spot of the second monitoring light;

[0019] The control unit 45 is used to adjust the rotation angle of the input MEMS chip 2 and the rotation angle of the output MEMS chip 5 according to the spot position of the first light beam on the aiming screen 41 and the spot position of the second light beam on the aiming screen 42, until the spot position of the first light beam on the aiming screen 41 falls at the ideal position of the spot of the first monitoring light, and the spot position of the second light beam on the aiming screen 42 falls at the ideal position of the spot of the second monitoring light.

[0020] Preferably, the first beam alignment screen 41 and the input MEMS chip 2 are mirror-symmetrical about the dichroic mirror 3, so that the image of each rotating mirror in the input MEMS chip 2 in the dichroic mirror 3 coincides with the center of each cross on the first beam alignment screen 41;

[0021] The second beam alignment screen 42 and the output MEMS chip 5 are mirror-symmetrical about the dichroic mirror 3 , so that the image of each rotating mirror in the output MEMS chip 5 in the dichroic mirror 3 coincides with the center of each cross on the second beam alignment screen 42 .

[0022] Preferably, the first monitoring light and the second monitoring light are both infrared light.

[0023] In a second aspect, a monitoring method for an OCS array optical switch is provided. The monitoring method is applicable to the OCS array optical switch as described in the first aspect, and includes:

[0024] The input coupling module 1 transmits the signal light and the first monitoring light to the input MEMS chip 2, the input MEMS chip 2 transmits the signal light and the first monitoring light to the dichroic mirror 3, the dichroic mirror 3 reflects the signal light to the output MEMS chip 5, and transmits the first monitoring light to the monitoring sensor module 4; the output MEMS chip 5 transmits the signal light to the corresponding output port in the output coupling module 6;

[0025] The output coupling module 6 transmits the second monitoring light to the output MEMS chip 5, the output MEMS chip 5 transmits the second monitoring light to the dichroic mirror 3, and the dichroic mirror 3 transmits the second monitoring light to the monitoring sensor module 4;

[0026] The monitoring sensor module 4 adjusts the rotation angle of the input MEMS chip 2 and the rotation angle of the output MEMS chip 5 according to the spot position of the first monitoring light and the spot position of the second monitoring light, so that the signal light is transmitted to the corresponding output port.

[0027] Preferably, the monitoring sensor module 4 includes a first beam alignment screen 41, a second beam alignment screen 42, a first image acquisition unit 43, a second image acquisition unit 44 and a control unit 45; the monitoring method also includes:

[0028] The first light beam alignment screen 41 receives the first monitoring light from the dichroic mirror 3, and the first image acquisition unit 43 acquires the spot position of the first monitoring light on the first light beam alignment screen 41;

[0029] The second light beam alignment screen 42 receives the second monitoring light from the dichroic mirror 3, and the second image acquisition unit 44 acquires the spot position of the second monitoring light on the second light beam alignment screen 42;

[0030] The ideal position of the light spot of the first monitoring light is preset on the first light beam alignment screen 41, and the ideal position of the light spot of the second monitoring light is preset on the second light beam alignment screen 42;

[0031] The control unit 45 adjusts the rotation angle of the input MEMS chip 2 and the rotation angle of the output MEMS chip 5 according to the light spot position on the first light beam alignment screen 41 and the light spot position on the second light beam alignment screen 42, until the light spot position on the first light beam alignment screen 41 falls at the ideal position of the light spot of the first monitoring light, and the light spot position on the second light beam alignment screen 42 falls at the ideal position of the light spot of the second monitoring light.

[0032] Preferably, the preset ideal position of the light spot of the first monitoring light on the first light beam alignment screen 41 includes:

[0033] receiving the first monitoring light and the signal light through a first channel, and monitoring the insertion loss of the first channel;

[0034] When the insertion loss of the first channel is at a minimum value, the spot position of the first monitoring light on the first light beam aiming at the screen 41 recorded by the first image acquisition unit 43 is the ideal position of the spot of the first monitoring light corresponding to the first channel.

[0035] Preferably, the monitoring method further includes: the control unit 45 pre-processes the spot position of the first monitoring light on the first light beam alignment screen 41, specifically including:

[0036] Obtaining grayscale values ​​ρ(x, y) of all pixel points at the position of the light spot of the first monitoring light on the first light beam alignment screen 41 on the first light beam alignment screen 41, where x and y are coordinates of the pixel points in a two-dimensional plane;

[0037] Traverse all the pixels at the spot position, multiply the horizontal coordinate x of each pixel by the grayscale value ρ(x,y) of the pixel, and then multiply it by the area of ​​the unit pixel dσ to obtain the pixel product result, and accumulate the pixel product results corresponding to all pixels to obtain the numerator value of the x-center coordinate;

[0038] Traverse all the pixels at the spot position, multiply the vertical coordinate y of each pixel by the gray value ρ(x,y) of the pixel, and then multiply it by the area of ​​the unit pixel dσ to obtain the pixel product result, and accumulate the pixel product results corresponding to all pixels to obtain the numerator value of the y centroid coordinate;

[0039] Traverse all the pixels at the spot position, multiply the grayscale value ρ(x, y) of each pixel by the area of ​​the unit pixel dσ, and then add them up to get the denominator value;

[0040] Divide the numerator of the x-center coordinate by the denominator to get the horizontal coordinate x of the center of gravity of the spot. 重心 ; Divide the numerator of the y-center coordinate by the denominator to get the horizontal coordinate y of the center of gravity of the spot 重心 , to obtain the center of gravity coordinates of the light spot (x 重心 ,y 重心 ).

[0041] Compared with the prior art, the present invention has the following beneficial effects:

[0042] The present invention couples the signal light and the first monitoring light through the input coupling module 1 and transmits them to the input MEMS chip 2, and then the input MEMS chip 2 transmits the coupled light to the dichroic mirror 3, and the two beams of light are separated by the dichroic mirror 3, the first monitoring light is transmitted to the monitoring sensor module 4, and the signal light is transmitted to the output port; similarly, the second monitoring light is also transmitted to the monitoring sensor module 4, and in the monitoring sensor module 4, it is determined whether the light spots of the first monitoring light and the second monitoring light fall on the ideal position through image recognition and algorithm analysis. If it is found that they are not in the ideal position during the monitoring process, the rotating mirror can be controlled by adjusting the voltage value of the corresponding MEMS chip so that the monitoring light falls on the optimal point. At this time, it means that the rotation angle of the rotating mirror can just make the light incident from the specified channel be emitted from the specified output port, so as to achieve the purpose of optical switch switching, thereby realizing the monitoring and correction of the optical path, and being able to play a role in real-time monitoring of the operation of the equipment, avoiding the problem of performance degradation of the OCS system due to the deflection of the rotating mirror in the MEMS chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0044] Figure 1 is a schematic diagram of the structure of an MxN array optical switch provided by an embodiment of the present invention;

[0045] Figure 2 is a schematic structural diagram of an OCS array optical switch provided by an embodiment of the present invention;

[0046] Figure 3 is a structural schematic diagram of an input coupling module provided by an embodiment of the present invention;

[0047] Figure 4 is a specific structural diagram of an input coupling module provided by an embodiment of the present invention;

[0048] Figure 5 is a structural schematic diagram of an output coupling module provided by an embodiment of the present invention;

[0049] Figure 6 is a specific structural diagram of an output coupling module provided by an embodiment of the present invention;

[0050] Figure 7 is a structural schematic diagram of a monitoring sensor module provided by an embodiment of the present invention;

[0051] Figure 8 It is a structural schematic diagram of a light beam alignment screen provided by an embodiment of the present invention;

[0052] Fig. 9 is a structural schematic diagram of an image acquisition unit provided by an embodiment of the present invention;

[0053] Fig.10 It is a flow chart of a method for monitoring an OCS array optical switch provided by an embodiment of the present invention.

[0054] In all drawings, the same reference numerals refer to the same structure, wherein:

[0055] Input coupling module 1, input optical switch 11, input wavelength division device 12, input collimator 13, input MEMS chip 2, dichroic mirror 3, monitoring sensor module 4, first beam alignment screen 41, second beam alignment screen 42, first image acquisition unit 43, second image acquisition unit 44, control unit 45, output MEMS chip 5, output coupling module 6, output optical switch 61, output wavelength division device 62, output collimator 63, input monitoring light source 7, output monitoring light source 8. DETAILED DESCRIPTION

[0056] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0057] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as open inclusion, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "examples", "specific examples" or "some examples" and the like are intended to indicate that specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner, that is, although they may be carried in the embodiments or examples of the above terms due to reasons such as the order and position of appearance, it is not limited to that they can be carried in combination by one embodiment or example.

[0058] In the description of the present invention, the terms "first" and "second" are used only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, the meaning of "multiple" is two or more. In addition, for example, the same type of nouns may be described as two independent individuals by adding "A" and "B" at the end. In this case, the corresponding features defined as "A" and "B" are only used to distinguish the same type of individuals for description purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features.

[0059] When describing some embodiments, the expressions "coupling", "coupling" and "connection" and their derivatives may be used. For example, when describing some embodiments, the term "connection" may be used to indicate that two or more components are in direct physical or electrical contact with each other. For another example, when describing some embodiments, the term "coupling" may be used to indicate that two or more components are in direct physical or electrical contact. However, the terms "connection" or "coupling" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other, such as "optical path coupling", "wireless connection", etc. The embodiments disclosed herein are not necessarily limited to the contents of the present invention.

[0060] In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0061] Embodiment 1:

[0062] Before describing this embodiment in detail, an MxN optical switch is first introduced. In one embodiment, Figure 1 As shown, it includes M input ports and N output ports, and a MEMS chip is arranged inside. There are multiple rotating mirrors in the MEMS chip, and the rotation angle of each rotating mirror can be controlled separately. By controlling the rotation angle of the rotating mirror of the MEMS chip to change, it is possible to output the optical signal input from any input port from any output port. With the increase in the dimension of the array optical switch OCS (currently there are several hundred dimensions), the integration of MEMS chips is very high. Among them, the spacing between each rotating mirror is very small. A slight displacement in the whole system may cause a sharp degradation of performance such as channel insertion loss. Therefore, it becomes very difficult to achieve accurate channel switching, but it is also very important. In addition, during operation, the rotating mirror may cause the angle to drift due to factors such as charge accumulation, or changes in environmental factors such as vibration may cause slight changes in the rotation angle of the rotating mirror in the MEMS chip, resulting in degradation of system performance.

[0063] In order to solve the above problems, an OCS array optical switch is proposed in this embodiment. Figure 2 As shown, it includes an input coupling module 1, an input MEMS chip 2, a dichroic mirror 3, a monitoring sensor module 4, an output MEMS chip 5 and an output coupling module 6; the input coupling module 1, the input MEMS chip 2, the reflective surface of the dichroic mirror 3, the output MEMS chip 5 and the output coupling module 6 are coupled in sequence along the optical path, and the monitoring sensor module 4 is coupled with the transmission surface of the dichroic mirror 3; the input coupling module 1 is used to transmit the signal light and the first monitoring light to the input MEMS chip 2, the input MEMS chip 2 is used to transmit the signal light and the first monitoring light to the dichroic mirror 3, the dichroic mirror 3 is used to reflect the signal light to the output MEMS chip 5, and The first monitoring light is transmitted to the monitoring sensor module 4; the output MEMS chip 5 is used to transmit the signal light to the corresponding output port in the output coupling module 6; the output coupling module 6 is used to transmit the second monitoring light to the output MEMS chip 5, the output MEMS chip 5 is used to transmit the second monitoring light to the dichroic mirror 3, and the dichroic mirror 3 is used to transmit the second monitoring light to the monitoring sensor module 4; the monitoring sensor module 4 is used to adjust the rotation angle of the input MEMS chip 2 and the rotation angle of the output MEMS chip 5 according to the spot position of the first monitoring light and the spot position of the second monitoring light, so that the signal light is transmitted to the corresponding output port.

[0064] Among them, the input coupling module 1 is used to couple the received signal light and the first monitoring light into a beam of light, and the output coupling module 6 receives the second monitoring light; the first monitoring light and the second monitoring light are both infrared light, and the dichroic mirror 3 can reflect the signal light and completely transmit the first monitoring light and the second monitoring light to the monitoring sensor module 4.

[0065] The first monitoring light enters from the input coupling module 1 together with the signal light, and is transmitted to the monitoring sensor module 4 by the dichroic mirror 3 after passing through the input MEMS chip 2. The monitoring sensor module 4 can understand the accuracy of the input MEMS chip 2 in adjusting the optical path by analyzing the spot position of the first monitoring light. For example, if the spot position deviates from the expected position, it means that there may be a deviation in the angle of the transfer mirror in the input MEMS chip 2, and the monitoring sensor module 4 will send an instruction to adjust the angle of the transfer mirror in the input MEMS chip 2. The second monitoring light is transmitted from the output coupling module 6 to the dichroic mirror 3 through the output MEMS chip 5, and then transmitted to the monitoring sensor module 4 by the dichroic mirror 3. Similarly, the monitoring sensor module 4 determines whether the adjustment of the optical path by the output MEMS chip 5 is accurate according to the spot position of the second monitoring light, and then adjusts the angle of the transfer mirror in the output MEMS chip 5. By accurately controlling the driving voltage of the MEMS chip, the transfer mirror in the MEMS chip rotates, and the light beam incident from any input port can be switched to any output port to realize the switching of the M-dimensional optical path. Through this feedback adjustment mechanism based on monitoring the position of the light spot, the entire optical switch system can adjust the optical path in real time and accurately to ensure that the signal light is accurately transmitted to the target output port.

[0066] For example, the first monitoring light and the signal light input from the input terminal M, the first monitoring light is transmitted to the monitoring sensor module 4, the signal light is reflected to the output MEMS chip 5, and is output from the output terminal N on the output coupling module 6; the second monitoring light input from the output terminal N is transmitted to the monitoring sensor module 4 through the output MEMS chip 5 and the dichroic mirror 3, and the ideal spot position of the first monitoring light and the ideal spot position of the second monitoring light corresponding to the channel MN (that is, the input light enters from the M port, and the output light exits from the N port) are preset in the monitoring sensor module 4. At this time, the spot position of the first monitoring light is compared with the spot position of the first monitoring light. By comparing the ideal spot position of the light, the angle of the transfer mirror in the input MEMS chip 2 is adjusted until the spot position of the first monitoring light reaches the ideal spot position of the first monitoring light. Similarly, the angle of the transfer mirror in the output MEMS chip 5 is adjusted until the spot position of the second monitoring light reaches the ideal spot position of the second monitoring light. In this way, for the MN channel, the signal light transmitted from the input end M can be ideally output from the output end N, achieving the purpose of real-time monitoring of the MN channel in the optical switching switch. It can also achieve monitoring of any other channels. The specific details will not be described in detail in this embodiment. How to obtain the ideal spot positions of the first monitoring light and the second monitoring light corresponding to each channel will be specifically described below.

[0067] In order to couple the signal light with the first monitoring light, for multiple input ends, in one embodiment, Figure 3 As shown, the OCS array optical switch also includes an input monitoring light source 7, the input coupling module 1 includes an input optical switch 11, an input wavelength division device 12 and an input collimator 13, the input monitoring light source 7 is coupled to the input end of the input optical switch 11, the output end of the input optical switch 11 is coupled to the monitoring end of the input wavelength division device 12, the signal end of the input wavelength division device 12 is used to receive the signal light, the common end of the input wavelength division device 12 is coupled to the input end of the input collimator 13, and the output end of the input collimator 13 is coupled to the input MEMS chip 2; the input monitoring light source 7 is used to emit the first monitoring light, the input optical switch 11 is used to transmit the first monitoring light to the input wavelength division device 12, the input wavelength division device 12 is used to transmit the signal light and the first monitoring light to the input collimator 13, and the input collimator 13 is used to collimate the signal light and the first monitoring light and then transmit them to the input MEMS chip 2.

[0068] In one embodiment, Figure 4As shown, the input wavelength division device 12 is usually composed of a tapered beam splitter used in communications, and the energy is split by generating light exchange through the fused tapered of two optical fibers. In addition, a prism splitter device can also be used to achieve different splitting ratios by coating a splitting film therein. In this example, 3:97 and 1:99 splitting ratio devices are used. The light after the first monitoring light and the signal light are combined contains 97% of the signal light and 3% of the first monitoring light.

[0069] In one embodiment, the input optical switch 11 is a 1xM optical switch as an optical switching device, having a COM terminal as an input and M output terminals. It can meet the requirements of light input from the COM port and output from any of the M output ports. It can also be used in reverse, with the M output terminals as the light input and the COM terminal as the light output. The 1xM optical switch in this embodiment can use a MEMS optical switch, which has obvious advantages in terms of large ports. The increase in the number of ports of the MEMS optical switch basically only increases the cost of the optical fiber, and the cost of the optical chip is basically the same.

[0070] In one embodiment, the input collimator 13 includes M collimating lens units, which can ensure that the M light beams can be accurately incident on the input MEMS chip 2 after passing through the input collimator 13 .

[0071] In the input coupling module 1, first, the input monitoring light source 7 generates a first monitoring light, which is received by the input optical switch 11 and transmitted to the monitoring end of the input wavelength division device 12. At the same time, the external signal light enters from the signal end of the input wavelength division device 12. The input wavelength division device 12 couples the signal light and the first monitoring light, and transmits the coupled optical signal to its common end, and then transmits it from the common end to the input collimator 13. The input collimator 13 performs collimation operation on the coupled optical signal, converts it into parallel light, and then transmits the collimated signal light and the first monitoring light to the input MEMS chip 2.

[0072] The input monitoring coupling module 1 ensures the accuracy of the rotation angle of the rotating mirror in the input MEMS chip 2, but the light beam cannot be collimated and emitted to the collimated optical fiber of the target output port after being reflected by the output MEMS chip 5. In this case, the output coupling module 6 is required. Figure 5 and Figure 6As shown, the OCS array optical switch also includes an output monitoring light source 8, the output coupling module 6 includes an output optical switch 61, an output wavelength division device 62 and an output collimator 63, the output monitoring light source 8 is coupled with the input end of the output optical switch 61, the output end of the output optical switch 61 is coupled with the monitoring end of the output wavelength division device 62, the signal end of the output wavelength division device 62 is used to output the signal light, the common end of the output wavelength division device 62 is coupled with the output end of the output collimator 63, and the input end of the output collimator 63 is coupled with the output MEMS chip 5; the output monitoring light source 8 is used to emit the second monitoring light, the output optical switch 61 is used to transmit the second monitoring light to the output wavelength division device 62, the output wavelength division device 62 is used to transmit the second monitoring light to the output collimator 63, and the output collimator 63 is used to transmit the second monitoring light to the output MEMS chip 5.

[0073] In one embodiment, the input monitoring light source 7 and the output monitoring light source 8 both use laser diodes to provide high-brightness monochromatic light, and common wavelengths include 850 nm, 980 nm, and 1064 nm.

[0074] Similarly, the difference between the output coupling module 6 and the input coupling module 1 is that the output coupling module 6 includes N output wavelength division devices 62 and N output collimators 63. The monitoring end of the output wavelength division device 62 receives the second monitoring light, and the common end of the output wavelength division device 62 is used to receive the signal light from the output MEMS chip 5, and output by the signal end of the output wavelength division device 62. The common end of the output wavelength division device 62 is also used to transmit the second monitoring light received by its monitoring end to the output MEMS chip 5. The working principles of the output optical switch 61, the output wavelength division device 62 and the output collimator 63 refer to the above embodiment, which will not be repeated here.

[0075] In this embodiment, only one monitoring light source is needed at the input end and the output end, and an M-dimensional light source array is not required, which greatly saves costs. And as the dimension increases, it is only necessary to increase the number of channels of the input optical switch 11 or the output optical switch 61, without the need to add additional light sources. Similarly, multi-channel light sources and optical switches can also be used to increase the number of channels monitored simultaneously and achieve a balance between efficiency and cost. In addition, the monitoring light and the signal light in this embodiment are completely co-routed, so there is no need for additional monitoring light path debugging, and the accuracy is higher. Moreover, the first monitoring light has been coupled with the signal light before entering the input collimator 13, so there is no need to insert other optical devices in the optical path between the input wavelength division device 12 and the input collimator 13, saving the working distance of the input collimator 13.

[0076] In order to analyze the spot positions of the first monitoring light and the second monitoring light, in one embodiment, Figure 7 As shown, the monitoring sensor module 4 includes a first beam alignment screen 41, a second beam alignment screen 42, a first image acquisition unit 43, a second image acquisition unit 44 and a control unit 45; the first beam alignment screen 41 is used to receive the first monitoring light from the dichroic mirror 3, and the first image acquisition unit 43 is used to acquire the spot position of the first monitoring light on the first beam alignment screen 41; the second beam alignment screen 42 is used to receive the second monitoring light from the dichroic mirror 3, and the second image acquisition unit 44 is used to acquire the spot position of the second monitoring light on the second beam alignment screen 42; the first beam alignment screen 41 is preset with an ideal spot position of the first monitoring light, and the second beam alignment screen 42 is preset with an ideal spot position of the second monitoring light; the control unit 45 is used to adjust the rotation angle of the input MEMS chip 2 and the rotation angle of the output MEMS chip 5 according to the spot position on the first beam alignment screen 41 and the spot position on the second beam alignment screen 42, until the spot position on the first beam alignment screen 41 falls on the ideal spot position of the first monitoring light, and the spot position on the second beam alignment screen 42 falls on the ideal spot position of the second monitoring light.

[0077] The control unit 45 also needs to be connected to the control ends of the input MEMS chip 2 and the output MEMS chip 5 (not shown in the figure), and controls the driving voltages of the input MEMS chip 2 and the output MEMS chip 5 to control the rotation of each mirror.

[0078] In one embodiment, the first beam alignment screen 41 is mirror-symmetrical with the input MEMS chip 2 about the color dichroic mirror 3, so that the image of each rotating mirror in the input MEMS chip 2 in the color dichroic mirror 3 coincides with the center of each cross on the first beam alignment screen 41; the second beam alignment screen 42 is mirror-symmetrical with the output MEMS chip 5 about the color dichroic mirror 3, so that the image of each rotating mirror in the output MEMS chip 5 in the color dichroic mirror 3 coincides with the center of each cross on the second beam alignment screen 42.

[0079] When the first monitoring light is transmitted through the dichroic mirror 3, it will irradiate the first light beam alignment screen 41. Figure 8As shown, the ideal position of the light spot of the first monitoring light corresponding to the corresponding channel is preset on the first beam alignment screen 41 (i.e., the position of the cross, one cross position corresponds to the ideal position of the first monitoring light in a certain channel). The ideal position is the position that the system expects the first monitoring light of the channel to reach under normal working conditions, and can be used as a reference standard for judging whether the first monitoring light is in the correct transmission path. Similar to the first beam alignment screen 41, the second beam alignment screen 42 receives the second monitoring light transmitted from the dichroic mirror 3, and provides a display plane for the light spot of the second monitoring light. The ideal position of the light spot of the second monitoring light is also preset on the second beam alignment screen 42. This position is the position where the second monitoring light corresponding to the channel should appear under normal working conditions, which is preset by the system and is used to measure whether the transmission of the second monitoring light is accurate.

[0080] In one embodiment, Fig. 9 As shown, the main task of the first image acquisition unit 43 is to acquire the position of the light spot formed by the first monitoring light on the first beam alignment screen 41. By using image acquisition technology, the actual position information of the light spot on the first beam alignment screen 41 can be accurately captured, providing the system with specific data about the current position of the first monitoring light, so that the system can know whether the first monitoring light has deviated. The second image acquisition unit 44 is responsible for acquiring the position of the light spot of the second monitoring light on the second beam alignment screen 42. Through its image acquisition function, the actual position information of the light spot of the second monitoring light can be converted into data that can be processed by the system, providing a basis for the system to judge the transmission status of the second monitoring light. In one embodiment, both the first image acquisition unit 43 and the second image acquisition unit 44 can be cameras.

[0081] The control unit 45 is responsible for adjusting the rotation angles of the rotating mirrors in the input MEMS chip 2 and the output MEMS chip 5 according to the light spot position information provided by the first image acquisition unit 43 and the second image acquisition unit 44 .

[0082] When the whole system is working, the first monitoring light and the second monitoring light will respectively reach the corresponding beam alignment screen through their respective paths. The first image acquisition unit 43 and the second image acquisition unit 44 will continuously monitor and collect their spot position information on their respective beam alignment screens. The control unit 45 compares and analyzes the collected information with the preset ideal position. When a deviation is found, the control unit 45 fine-tunes the optical path by adjusting the rotation angle of the rotating mirror in the input MEMS chip 2 and the output MEMS chip 5. The feedback and adjustment mechanism will continue to cycle until the spot positions of the first monitoring light and the second monitoring light accurately fall on their respective ideal positions, ensuring that the signal light can be accurately transmitted to the corresponding output port.

[0083] Since the input monitoring light source 7 and the output monitoring light source 8 used in this embodiment are single light sources, there will be only one light spot on each light speed alignment screen, which is very convenient for identification and positioning. If an array light source is used, it is easy for light spots to overlap, thereby misjudging the position of the light spots. This embodiment can avoid this situation.

[0084] In this embodiment, the signal light and the first monitoring light are coupled by the input coupling module 1 and then transmitted to the input MEMS chip 2, and then the input MEMS chip 2 transmits the coupled light to the dichroic mirror 3, and the two beams of light are separated by the dichroic mirror 3, the first monitoring light is transmitted to the monitoring sensor module 4, and the signal light is transmitted to the output port; similarly, the second monitoring light is also transmitted to the monitoring sensor module 4, and the monitoring sensor module 4 is used to determine whether the light spots of the first monitoring light and the second monitoring light fall on the ideal position through image recognition and algorithm analysis. If it is found that they are not in the ideal position during the monitoring process, the rotating mirror can be controlled by adjusting the voltage value of the corresponding MEMS chip so that the monitoring light falls on the optimal point. At this time, it means that the rotation angle of the rotating mirror can just make the light incident from the specified channel be emitted from the specified output port, so as to achieve the purpose of optical switch switching, thereby realizing the monitoring and correction of the optical path, and being able to play a role in real-time monitoring of the operation of the equipment, avoiding the problem of performance degradation of the OCS system due to the deflection of the rotating mirror in the MEMS chip.

[0085] Embodiment 2:

[0086] In order to further illustrate the OCS array optical switch proposed in Example 1, a monitoring method for an OCS array optical switch is proposed in this embodiment. Fig.10 As shown, including:

[0087] Step 101: the input coupling module 1 transmits the signal light and the first monitoring light to the input MEMS chip 2, the input MEMS chip 2 transmits the signal light and the first monitoring light to the dichroic mirror 3, the dichroic mirror 3 reflects the signal light to the output MEMS chip 5, and transmits the first monitoring light to the monitoring sensor module 4. The output MEMS chip 5 transmits the signal light to the corresponding output port in the output coupling module 6;

[0088] Among them, refer to Figure 3 and Figure 4 The input monitoring light source 7 emits the first monitoring light, the input optical switch 11 transmits the first monitoring light to the input wavelength division device 12, the input wavelength division device 12 transmits the signal light and the first monitoring light to the input collimator 13, and the input collimator 13 collimates the signal light and the first monitoring light and then transmits them to the input MEMS chip 2.

[0089] Step 102 : the output coupling module 6 transmits the second monitoring light to the output MEMS chip 5 , the output MEMS chip 5 transmits the second monitoring light to the dichroic mirror 3 , and the dichroic mirror 3 transmits the second monitoring light to the monitoring sensor module 4 .

[0090] Among them, refer to Figure 5 and Figure 6 The output monitoring light source 8 emits the second monitoring light, the output optical switch 61 transmits the second monitoring light to the output wavelength division device 62, the output wavelength division device 62 transmits the second monitoring light to the output collimator 63, and the output collimator 63 transmits the second monitoring light to the output MEMS chip 5.

[0091] Step 103: The monitoring sensor module 4 adjusts the rotation angle of the input MEMS chip 2 and the rotation angle of the output MEMS chip 5 according to the spot position of the first monitoring light and the spot position of the second monitoring light, so that the signal light is transmitted to the corresponding output port.

[0092] Among them, refer to Figure 7 The first beam alignment screen 41 receives the first monitoring light from the dichroic mirror 3, and the first image acquisition unit 43 acquires the spot position of the first monitoring light on the first beam alignment screen 41; the second beam alignment screen 42 receives the second monitoring light from the dichroic mirror 3, and the second image acquisition unit 44 acquires the spot position of the second monitoring light on the second beam alignment screen 42; an ideal position of the spot of the first monitoring light is preset on the first beam alignment screen 41, and an ideal position of the spot of the second monitoring light is preset on the second beam alignment screen 42; the control unit 45 adjusts the rotation angle of the input MEMS chip 2 and the rotation angle of the output MEMS chip 5 according to the spot position on the first beam alignment screen 41 and the spot position on the second beam alignment screen 42, respectively, until the spot position on the first beam alignment screen 41 falls on the ideal position of the spot of the first monitoring light, and the spot position on the second beam alignment screen 42 falls on the ideal position of the spot of the second monitoring light.

[0093] In one embodiment, the preset ideal position of the spot of the first monitoring light on the first light beam alignment screen 41 includes: receiving the first monitoring light and the signal light through a first channel (the first here has no special meaning and can be any one), and monitoring the insertion loss of the first channel; when the insertion loss of the first channel is a minimum value, the spot position of the first monitoring light on the first light beam alignment screen 41 is recorded by the first image acquisition unit 43 as the ideal position of the spot of the first monitoring light corresponding to the first channel.

[0094] Among them, refer to Figure 8 , the ideal position of each light spot on the first beam alignment screen 41 and the second beam alignment screen 42 needs to be known (e.g. Figure 8 The monitoring method further comprises: placing the first beam alignment screen 41 at a position that is mirror-symmetrical with the input MEMS chip 2 about the dichroic mirror 3, so that the image of each rotating mirror in the input MEMS chip 2 in the dichroic mirror 3 coincides with the center of each cross on the first beam alignment screen 41; and placing the second beam alignment screen 42 at a position that is mirror-symmetrical with the output MEMS chip 5 about the dichroic mirror 3, so that the image of each rotating mirror in the output MEMS chip 5 in the dichroic mirror 3 coincides with the center of each cross on the second beam alignment screen 42.

[0095] Theoretically, the spacing and size of the crosses on the beam alignment screen should be consistent with the size of the array on the MEMS chip. However, since light incident on the dichroic mirror 3 at different angles will generate a small offset when it is transmitted to the beam alignment screen, in one embodiment, the offset can be calculated based on the refractive index, thickness and incident angle of the dichroic mirror 3, and the ideal position of the beam alignment screen can be corrected. At the same time, due to tolerances generated during the installation and debugging process, the ideal position on the beam alignment screen and the mirror image position may also be offset. The ideal position of the monitoring light spot can be calibrated by designing an optical power feedback system. That is, by monitoring the insertion loss of different channels of the OCS and finding the minimum value of the insertion loss, it means that the rotating mirror has rotated to the optimal angle. At this time, the monitoring light spot position on the beam alignment screen recorded by the camera is the ideal alignment position of the channel. The calibrated ideal light spot position can correct the above-mentioned various errors, and the final ideal position is recorded.

[0096] In one embodiment, the light spots of the first monitoring light and the second monitoring light imaged on the first beam alignment screen 41 and the second beam alignment screen 42, respectively, are usually irregular in shape and unevenly distributed in brightness, while the ideal imaging position is a certain point. Therefore, it is necessary to convert the irregular light spots into specific points through an image processing algorithm. In one embodiment, the monitoring method further includes: the control unit 45 preprocesses the light spot position of the first monitoring light on the first beam alignment screen 41, specifically including: obtaining the grayscale values ​​ρ(x, y) of all pixel points of the light spot of the first monitoring light on the first beam alignment screen 41 on the first beam alignment screen 41, where x and y are the coordinates of the pixel points in the two-dimensional plane; multiplying the horizontal coordinate x of each pixel point by the grayscale value ρ(x, y) of the pixel point, and then multiplying by the area of ​​the unit pixel point dσ, get the pixel product result, and accumulate the pixel product results corresponding to all pixels to get the numerator value of the x-center coordinate; multiply the vertical coordinate y of each pixel by the grayscale value ρ(x,y) of the pixel, and then multiply it by the area of ​​the unit pixel dσ to get the pixel product result, and accumulate the pixel product results corresponding to all pixels to get the numerator value of the y-center coordinate; multiply the grayscale value ρ(x,y) of each pixel by the area of ​​the unit pixel dσ and then accumulate them to get the denominator value; divide the numerator value of the x-center coordinate by the denominator value to get the horizontal coordinate x of the center of gravity of the light spot 重心 ; Divide the numerator of the y-center coordinate by the denominator to get the horizontal coordinate y of the center of gravity of the spot 重心 , to obtain the center of gravity coordinates of the light spot (x 重心 ,y 重心 ).

[0097] Among them, the coordinates of the center of gravity of the light spot (x 重心 ,y 重心 ) is expressed as:

[0098]

[0099] After the center of gravity position of the light spot is obtained, the center of gravity position can be compared with the point of the ideal position, so as to adjust the rotation angles of the rotating mirrors in the input MEMS chip 2 and the output MEMS chip 5 respectively, so as to eliminate the deviations of their respective rotating mirrors.

[0100] The specific structure of the OCS array optical switch will not be described in detail in this embodiment.

[0101] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An OCS array optical switch, characterized in that: It comprises an input coupling module (1), an input MEMS chip (2), a color separation mirror (3), a monitoring sensor module (4), an output MEMS chip (5) and an output coupling module (6); The input coupling module (1), the input MEMS chip (2), the reflective surface of the dichroic mirror (3), the output MEMS chip (5) and the output coupling module (6) are coupled in sequence along an optical path, and the monitoring sensor module (4) is coupled with the transmission surface of the dichroic mirror (3); The input coupling module (1) is used to transmit the signal light and the first monitoring light to the input MEMS chip (2); the input MEMS chip (2) is used to transmit the signal light and the first monitoring light to the dichroic mirror (3); the dichroic mirror (3) is used to reflect the signal light to the output MEMS chip (5) and transmit the first monitoring light to the monitoring sensor module (4); the output MEMS chip (5) is used to transmit the signal light to the corresponding output port in the output coupling module (6); The output coupling module (6) is used to transmit the second monitoring light to the output MEMS chip (5), the output MEMS chip (5) is used to transmit the second monitoring light to the dichroic mirror (3), and the dichroic mirror (3) is used to transmit the second monitoring light to the monitoring sensor module (4); The monitoring sensor module (4) is used to adjust the rotation angle of the input MEMS chip (2) and the rotation angle of the output MEMS chip (5) according to the spot position of the first monitoring light and the spot position of the second monitoring light, respectively, so that the signal light is transmitted to the corresponding output port.

2. The OCS array optical switch according to claim 1, characterized in that: It also comprises an input monitoring light source (7), the input coupling module (1) comprises an input optical switch (11), an input wavelength division device (12) and an input collimator (13), the input monitoring light source (7) is coupled to the input end of the input optical switch (11), the output end of the input optical switch (11) is coupled to the monitoring end of the input wavelength division device (12), the signal end of the input wavelength division device (12) is used to receive the signal light, the common end of the input wavelength division device (12) is coupled to the input end of the input collimator (13), and the output end of the input collimator (13) is coupled to the input MEMS chip (2); The input monitoring light source (7) is used to emit the first monitoring light, the input optical switch (11) is used to transmit the first monitoring light to the input wavelength division device (12), the input wavelength division device (12) is used to transmit the signal light and the first monitoring light to the input collimator (13), and the input collimator (13) is used to collimate the signal light and the first monitoring light and then transmit them to the input MEMS chip (2).

3. The OCS array optical switch according to claim 1, characterized in that: It also includes an output monitoring light source (8), the output coupling module (6) includes an output optical switch (61), an output wavelength division device (62) and an output collimator (63), the output monitoring light source (8) is coupled to the input end of the output optical switch (61), the output end of the output optical switch (61) is coupled to the monitoring end of the output wavelength division device (62), the signal end of the output wavelength division device (62) is used to output the signal light, the common end of the output wavelength division device (62) is coupled to the output end of the output collimator (63), and the input end of the output collimator (63) is coupled to the output MEMS chip (5); The output monitoring light source (8) is used to emit the second monitoring light, the output optical switch (61) is used to transmit the second monitoring light to the output wavelength division device (62), the output wavelength division device (62) is used to transmit the second monitoring light to the output collimator (63), and the output collimator (63) is used to transmit the second monitoring light to the output MEMS chip (5).

4. The OCS array optical switch according to claim 1, characterized in that: The monitoring sensor module (4) comprises a first light beam alignment screen (41), a second light beam alignment screen (42), a first image acquisition unit (43), a second image acquisition unit (44) and a control unit (45); the first light beam alignment screen (41) is used to receive the first monitoring light from the dichroic mirror (3), and the first image acquisition unit (43) is used to acquire the spot position of the first monitoring light on the first light beam alignment screen (41); The second light beam alignment screen (42) is used to receive the second monitoring light from the dichroic mirror (3), and the second image acquisition unit (44) is used to acquire the spot position of the second monitoring light on the second light beam alignment screen (42); The first light beam alignment screen (41) is preset with an ideal position of the light spot of the first monitoring light, and the second light beam alignment screen (42) is preset with an ideal position of the light spot of the second monitoring light; The control unit (45) is used to adjust the rotation angle of the input MEMS chip (2) and the rotation angle of the output MEMS chip (5) respectively according to the light spot position on the first light beam alignment screen (41) and the light spot position on the second light beam alignment screen (42), until the light spot position on the first light beam alignment screen (41) falls at an ideal position of the light spot of the first monitoring light, and the light spot position on the second light beam alignment screen (42) falls at an ideal position of the light spot of the second monitoring light.

5. The OCS array optical switch according to claim 4, characterized in that: The first light beam alignment screen (41) and the input MEMS chip (2) are mirror-symmetrical about the dichroic mirror (3), so that the image of each rotating mirror in the input MEMS chip (2) in the dichroic mirror (3) coincides with the center of each cross on the first light beam alignment screen (41); The second light beam alignment screen (42) and the output MEMS chip (5) are mirror-symmetrical about the dichroic mirror (3), so that the image of each rotating mirror in the output MEMS chip (5) in the dichroic mirror (3) coincides with the center of each cross on the second light beam alignment screen (42).

6. The OCS array optical switch according to claim 1, characterized in that: The first monitoring light and the second monitoring light are both infrared light.

7. A method for monitoring an OCS array optical switch, characterized in that: The monitoring method is applicable to the OCS array optical switch according to any one of claims 1 to 6, comprising: The input coupling module (1) transmits the signal light and the first monitoring light to the input MEMS chip (2); the input MEMS chip (2) transmits the signal light and the first monitoring light to the dichroic mirror (3); the dichroic mirror (3) reflects the signal light to the output MEMS chip (5) and transmits the first monitoring light to the monitoring sensor module (4); the output MEMS chip (5) transmits the signal light to the corresponding output port in the output coupling module (6); The output coupling module (6) transmits the second monitoring light to the output MEMS chip (5), the output MEMS chip (5) transmits the second monitoring light to the dichroic mirror (3), and the dichroic mirror (3) transmits the second monitoring light to the monitoring sensor module (4); The monitoring sensor module (4) adjusts the rotation angle of the input MEMS chip (2) and the rotation angle of the output MEMS chip (5) respectively according to the spot position of the first monitoring light and the spot position of the second monitoring light, so that the signal light is transmitted to the corresponding output port.

8. The method for monitoring an OCS array optical switch according to claim 7, characterized in that: The monitoring sensor module (4) comprises a first light beam alignment screen (41), a second light beam alignment screen (42), a first image acquisition unit (43), a second image acquisition unit (44) and a control unit (45); the monitoring method further comprises: The first light beam alignment screen (41) receives the first monitoring light from the dichroic mirror (3), and the first image acquisition unit (43) acquires the spot position of the first monitoring light on the first light beam alignment screen (41); The second light beam alignment screen (42) receives the second monitoring light from the dichroic mirror (3), and the second image acquisition unit (44) acquires the spot position of the second monitoring light on the second light beam alignment screen (42); The ideal position of the light spot of the first monitoring light is preset on the first light beam alignment screen (41), and the ideal position of the light spot of the second monitoring light is preset on the second light beam alignment screen (42); The control unit (45) adjusts the rotation angle of the input MEMS chip (2) and the rotation angle of the output MEMS chip (5) respectively according to the light spot position on the first light beam alignment screen (41) and the light spot position on the second light beam alignment screen (42), until the light spot position on the first light beam alignment screen (41) falls at an ideal position of the light spot of the first monitoring light, and the light spot position on the second light beam alignment screen (42) falls at an ideal position of the light spot of the second monitoring light.

9. The method for monitoring an OCS array optical switch according to claim 8, characterized in that: The step of presetting the ideal position of the light spot of the first monitoring light on the first light beam alignment screen (41) comprises: receiving the first monitoring light and the signal light through a first channel, and monitoring the insertion loss of the first channel; When the insertion loss of the first channel is at a minimum value, the spot position of the first monitoring light on the first light beam alignment screen (41) recorded by the first image acquisition unit (43) is the ideal position of the spot of the first monitoring light corresponding to the first channel.

10. The method for monitoring an OCS array optical switch according to claim 8, characterized in that: The monitoring method further comprises: the control unit (45) preprocessing the light spot position of the first monitoring light on the first light beam alignment screen (41), specifically comprising: Obtaining grayscale values ​​ρ(x, y) of all pixel points at positions of the light spot of the first monitoring light on the first light beam alignment screen (41) on the first light beam alignment screen (41), wherein x and y are coordinates of the pixel points in a two-dimensional plane; Multiply the horizontal coordinate x of each pixel by the gray value ρ(x,y) of the pixel, and then multiply it by the area of ​​the unit pixel dσ to obtain the pixel product result, and accumulate the pixel product results corresponding to all pixels to obtain the numerator value of the x-center coordinate; Multiply the vertical coordinate y of each pixel by the gray value ρ(x,y) of the pixel, and then multiply it by the area of ​​the unit pixel dσ to obtain the pixel product result, and accumulate the pixel product results corresponding to all pixels to obtain the numerator value of the y centroid coordinate; Multiply the grayscale value ρ(x,y) of each pixel by the area of ​​the unit pixel dσ and add them up to get the denominator value; Divide the numerator of the x-center coordinate by the denominator to get the horizontal coordinate x of the center of gravity of the spot. 重心 ; Divide the numerator of the y-center coordinate by the denominator to get the horizontal coordinate y of the center of gravity of the spot 重心 , to obtain the center of gravity coordinates of the light spot (x 重心 ,y 重心 ).

Images