Display device, display panel and manufacturing method thereof

Abstract

The present disclosure relates to a display device, a display panel and a manufacturing method thereof, and relates to the technical field of display. The display panel comprises a driving backplane, a plurality of light emitting devices, a pixel definition layer and a truncation layer. The light emitting device comprises a first electrode, a light emitting layer and a second electrode. The pixel definition layer is provided with a plurality of pixel openings, and one pixel opening exposes one first electrode. The pixel definition layer comprises a limiting layer and a protective layer covering the limiting layer. The material of the protective layer comprises an inorganic material. The truncation layer is arranged on the surface of the pixel definition layer away from the driving backplane, and has a plurality of truncation holes corresponding to each pixel opening. The light emitting layer and the second electrode of one light emitting device are located within the range surrounded by one truncation hole. The sidewall of the truncation hole is provided with a truncation groove surrounding the pixel opening overlapping with the truncation hole. The second electrode in the truncation hole is in contact with the truncation layer, and at least part of the second electrode is electrically connected through the truncation layer. The cost can be reduced.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of display, in particular, to a display device, a display panel and a manufacturing method of the display panel. BACKGROUND

[0002] At present, the self-luminous display panel using light emitting diode as light emitting device has been widely applied, but its manufacturing process is complex, and the requirement for equipment is high, resulting in high production cost.

[0003] It should be noted that the information disclosed in the above background section is only used to strengthen the understanding of the background of the present disclosure, and therefore can include information which does not constitute prior art known to those of ordinary skill in the art. SUMMARY

[0004] The present disclosure provides a display device, a display panel and a manufacturing method of the display panel, which is beneficial to reduce the production cost.

[0005] According to one aspect of the present disclosure, a display panel is provided, comprising:

[0006] a driving backplate;

[0007] a plurality of light emitting devices disposed on the driving backplate, the light emitting device comprising a first electrode, a light emitting layer and a second electrode stacked in sequence in a direction away from the driving backplate;

[0008] a pixel definition layer disposed on the same surface of the driving backplate as the light emitting device; the pixel definition layer is provided with a plurality of pixel openings, one of the pixel openings exposes one of the first electrodes, and the light emitting layer of one of the light emitting devices is stacked on the first electrode exposed by one of the pixel openings; the pixel definition layer comprises a limiting layer and a protective layer covering the limiting layer; the material of the protective layer comprises an inorganic material;

[0009] a truncation layer disposed on the surface of the pixel definition layer away from the driving backplate, and having a plurality of truncation holes corresponding to each of the pixel openings; the light emitting layer and the second electrode of one of the light emitting devices are located within the range surrounded by one of the truncation holes; the sidewall of the truncation hole is provided with a truncation groove surrounding the pixel opening overlapping therewith; the second electrode in the truncation hole is in contact with the truncation layer, and at least part of the second electrode is electrically connected through the truncation layer.

[0010] In an exemplary embodiment of the present disclosure, the protective layer comprises a first protective sub-layer and a second protective sub-layer; the first protective sub-layer covers the limiting layer; the second protective sub-layer covers the first protective sub-layer and extends to the surface of the first electrode away from the driving backplate.

[0011] In an example embodiment of the present disclosure, the cutting layer comprises a conductive layer and a shielding layer stacked in sequence in a direction away from the driving backplate, the shielding layer and the conductive layer being different in material; the cutting groove is located in the conductive layer; the second electrode in the cutting hole extends into the cutting groove and contacts the conductive layer.

[0012] In an example embodiment of the present disclosure, the depth of the cutting groove decreases in a direction away from the driving backplate.

[0013] In an example embodiment of the present disclosure, the display panel further comprises:

[0014] The encapsulation layer comprises a first inorganic layer, an organic layer and a second inorganic layer, the first inorganic layer covering the second electrode and the cutting layer and continuously extending at the cutting groove; the organic layer is arranged on a surface of the first inorganic layer away from the driving backplate, and the second inorganic layer covers the organic layer.

[0015] In an example embodiment of the present disclosure, the light emitting device comprises at least three light emitting devices of different light emitting colors, and the depth of the cutting groove of the cutting hole overlapping the pixel opening corresponding to two light emitting devices of different light emitting colors is different.

[0016] In an example embodiment of the present disclosure, the light emitting device comprises a first light emitting device emitting red light, a second light emitting device emitting green light and a third light emitting device emitting blue light; the depth of the cutting groove of the cutting hole overlapping the pixel opening corresponding to the first light emitting device is a first depth; the depth of the cutting groove of the cutting hole overlapping the pixel opening corresponding to the second light emitting device is a second depth; the depth of the cutting groove of the cutting hole overlapping the pixel opening corresponding to the third light emitting device is a third depth.

[0017] The first depth is greater than the second depth, and the second depth is greater than the third depth.

[0018] In an example embodiment of the present disclosure, the first depth is not less than 0.3 μm and not greater than 1.5 μm; the second depth is not less than 0.3 μm and not greater than 1.2 μm; and the third depth is not less than 0.3 μm and not greater than 1 μm.

[0019] In an example embodiment of the present disclosure, the light emitting device comprises adjacent first and second light emitting devices;

[0020] The display panel further comprises a light emitting extension part stacked on a surface of the cutting layer away from the driving backplate and located between the adjacent first and second light emitting devices; the second electrode comprises an electrode extension part covering the light emitting extension part and disconnected from the second electrode.

[0021] The light emitting extension includes a first light emitting extension arranged in the same layer as the light emitting layer of the first light emitting device and disconnected, and a second light emitting extension arranged in the same layer as the light emitting layer of the second light emitting device and disconnected; the first light emitting extension is butted against the second light emitting extension away from the boundary of the first light emitting device.

[0022] In an exemplary embodiment of the present disclosure, the light emitting device includes adjacent first and second light emitting devices;

[0023] The display panel further includes a light emitting extension stacked on the surface of the cutting layer away from the driving backplate and located between the adjacent two light emitting devices; the second electrode includes an electrode extension covering the light emitting extension and disconnected from the second electrode;

[0024] The sidewall of the electrode extension and the light emitting extension covered thereby is tapered in the direction away from the driving backplate.

[0025] According to an aspect of the present disclosure, a manufacturing method of a display panel is provided, comprising:

[0026] forming a driving backplate;

[0027] forming a first electrode of a plurality of light emitting devices on the driving backplate;

[0028] forming a defining layer covering each of the first electrodes, the defining layer having a defining opening corresponding to each of the first electrodes and exposing each of the first electrodes;

[0029] forming a protection layer covering the defining layer and the first electrodes exposed by the defining openings, the material of the protection layer including inorganic material;

[0030] forming a cutting layer having a plurality of cutting holes on the surface of the protection layer away from the driving backplate, each of the cutting holes corresponding to and overlapping each of the defining openings; each of the cutting holes is divided into at least n groups, n being a positive integer not less than 2;

[0031] sequentially performing a device step for each group of the cutting holes, the device step comprising:

[0032] forming a cutting groove surrounding the defining opening overlapping the cutting hole on the sidewall of the cutting hole;

[0033] removing at least part of the protection layer covering the first electrode in the cutting hole to expose the first electrode;

[0034] forming a light emitting layer covering the cutting layer and the first electrode exposed by the cutting hole, the light emitting layer being disconnected at the cutting groove;

[0035] forming a second electrode covering the light-emitting layer, the second electrode being disconnected at the discontinuous groove; at least part of the second electrode being in contact with the discontinuous layer and being electrically connected through the discontinuous layer.

[0036] In an exemplary embodiment of the present disclosure, before performing the device step for the i+1th group of the discontinuous holes, the manufacturing method further comprises:

[0037] removing the second electrode and the light-emitting layer formed in the i+1th group of the discontinuous holes when performing the device step for the ith group of the discontinuous holes, 1≤i≤n.

[0038] In an exemplary embodiment of the present disclosure, forming a protective layer covering the defining layer and the first electrode exposed by the defining opening; comprising:

[0039] forming a first protective sub-layer covering the defining layer and the first electrode exposed by the defining opening;

[0040] patterning the first protective sub-layer, removing the first protective sub-layer at the bottom of the defining opening, so that the first protective sub-layer exposes the first electrode;

[0041] forming a second protective sub-layer covering the first protective sub-layer and the first electrode exposed by the first protective sub-layer.

[0042] In an exemplary embodiment of the present disclosure, forming a discontinuous layer having a plurality of discontinuous holes on the surface of the protective layer away from the driving backplane; comprising:

[0043] forming a conductive layer covering the protective layer;

[0044] forming a shielding layer covering the conductive layer; the shielding layer and the conductive layer being different in material;

[0045] opening a plurality of discontinuous holes penetrating through the shielding layer and the conductive layer, each of the discontinuous holes corresponding to and overlapping with each of the defining openings.

[0046] In an exemplary embodiment of the present disclosure, forming a discontinuous groove surrounding the defining opening overlapping with each of the discontinuous holes on the sidewall of the discontinuous hole; comprising:

[0047] etching the conductive layer in the discontinuous hole to form the discontinuous groove.

[0048] In an exemplary embodiment of the present disclosure, the device step further comprises:

[0049] forming a first inorganic layer covering the second electrode, the first inorganic layer continuously extending at the discontinuous groove.

[0050] In an exemplary embodiment of the present disclosure, after the device steps are performed for the nth group of the truncated holes, the manufacturing method further comprises:

[0051] forming an organic layer on a surface of the first inorganic layer distal to the driving backplane;

[0052] forming a second inorganic layer covering the organic layer.

[0053] In an exemplary embodiment of the present disclosure, n is equal to 3, the truncated holes comprise a first group of truncated holes, a second group of truncated holes, and a third group of truncated holes; the light-emitting layers in any two groups of the first group of truncated holes, the second group of truncated holes, and the third group of truncated holes have different light-emitting colors.

[0054] According to an aspect of the present disclosure, a manufacturing method of a display panel is provided, comprising:

[0055] forming a driving backplane;

[0056] forming a first electrode of a plurality of light-emitting devices on the driving backplane;

[0057] forming a confinement layer covering each of the first electrodes, the confinement layer having a confinement opening corresponding to each of the first electrodes;

[0058] forming a protection layer covering the confinement layer and the first electrode exposed by the confinement opening, a material of the protection layer comprising an inorganic material;

[0059] forming a truncated layer having a plurality of truncated holes on a surface of the protection layer distal to the driving backplane, each of the truncated holes corresponding to and overlapping with each of the confinement openings; each of the truncated holes is divided into a first group and a second group, the second group of the truncated holes comprising a first subgroup and a second subgroup;

[0060] forming a truncated groove surrounding the confinement opening overlapping with the first group of the truncated holes on a sidewall of the first group of the truncated holes;

[0061] removing at least part of the protection layer covering the first electrode in the first group of the truncated holes to expose the first electrode;

[0062] forming a light-emitting layer covering the truncated layer and the first electrode exposed by the first group of the truncated holes, the light-emitting layer being discontinuous at the truncated groove;

[0063] forming a second electrode covering the light-emitting layer, the second electrode being discontinuous at the truncated groove; at least part of the second electrode is in contact with the truncated layer and is electrically connected through the truncated layer;

[0064] removing the light-emitting layer and the second electrode formed in the second group of the truncated holes when forming the light-emitting layer and the second electrode in the first group of the truncated holes;

[0065] forming a truncated groove around the defined opening overlapped with the side wall of the second group of the truncated holes;

[0066] removing the at least partially protective layer covering the first electrode in the second group of the truncated holes to expose the first electrode;

[0067] forming a light-emitting layer covering the truncated layer and the first electrode exposed by the first group of the truncated holes, the light-emitting layer being truncated at the truncated groove;

[0068] forming a second electrode covering the light-emitting layer, the second electrode being truncated at the truncated groove; at least part of the second electrode being in contact with the truncated layer and being electrically connected through the truncated layer;

[0069] removing the light-emitting layer and the second electrode formed in the second group of the truncated holes when forming the light-emitting layer and the second electrode in the first group of the truncated holes to expose the first electrode;

[0070] forming a light-emitting layer covering the truncated layer and the first electrode exposed by the second group of the truncated holes, the light-emitting layer being truncated at the truncated groove;

[0071] forming a second electrode covering the light-emitting layer, the second electrode being truncated at the truncated groove; at least part of the second electrode being in contact with the truncated layer and being electrically connected through the truncated layer.

[0072] According to an aspect of the present disclosure, there is provided a manufacturing method of a display panel, comprising:

[0073] forming a driving backplane;

[0074] forming a plurality of first electrodes of light-emitting devices on the driving backplane;

[0075] forming a defined layer covering each of the first electrodes, the defined layer having a defined opening corresponding to each of the first electrodes;

[0076] forming a protective layer covering the defined layer and the first electrode exposed by the defined opening, the material of the protective layer comprising an inorganic material;

[0077] forming a truncated layer having a plurality of truncated holes on the surface of the protective layer away from the driving backplane, each of the truncated holes corresponding to each of the defined openings; each of the truncated holes being divided into a first group, a second group and a third group;

[0078] A truncated groove is formed around the defined opening overlapped with each of the truncated holes;

[0079] Removing the at least partial protective layer covering the first electrode to expose the first electrode;

[0080] Forming a light-emitting layer covering the truncated layer and the first electrode exposed by the first group of the truncated holes, the light-emitting layer being truncated at the truncated groove;

[0081] Forming a second electrode covering the light-emitting layer, the second electrode being truncated at the truncated groove; at least part of the second electrode is in contact with the truncated layer and is electrically connected through the truncated layer;

[0082] Removing the light-emitting layer and the second electrode formed in the third group of the truncated holes when forming the light-emitting layer and the second electrode in the second group of the truncated holes to expose the first electrode;

[0083] Forming a light-emitting layer covering the truncated layer and the first electrode exposed by the second group of the truncated holes, the light-emitting layer being truncated at the truncated groove;

[0084] Forming a second electrode covering the light-emitting layer, the second electrode being truncated at the truncated groove; at least part of the second electrode is in contact with the truncated layer and is electrically connected through the truncated layer;

[0085] Removing the light-emitting layer and the second electrode formed in the third group of the truncated holes when forming the light-emitting layer and the second electrode in the second group of the truncated holes to expose the first electrode;

[0086] Forming a light-emitting layer covering the truncated layer and the first electrode exposed by the third group of the truncated holes, the light-emitting layer being truncated at the truncated groove;

[0087] Forming a second electrode covering the light-emitting layer, the second electrode being truncated at the truncated groove; at least part of the second electrode is in contact with the truncated layer and is electrically connected through the truncated layer.

[0088] According to one aspect of the present disclosure, a display device is provided, comprising the display panel of any one of the above.

[0089] The display device, the display panel and the manufacturing method thereof are provided. The display device comprises a pixel definition layer, a first electrode, a cutting layer and a second electrode. The cutting layer is arranged on the pixel definition layer, and a undercut structure, i.e. a cutting groove, is formed on the sidewall of the cutting layer. When the light emitting layer is formed, the cutting groove can be used to stage the light emitting material, so that the light emitting layer is patterned, thereby avoiding the use of a special mask, saving the design and manufacturing cost of the mask, and reducing the cost. When the cutting groove is formed in the cutting layer, the first electrode can be protected by the protective layer of the pixel definition layer to prevent the first electrode from being eroded. After the cutting groove is formed, the protective layer covering the first electrode is removed to expose the first electrode, and then the light emitting layer is formed to ensure that the light emitting layer can contact the first electrode.

[0090] In addition, the first electrodes of adjacent light emitting devices are arranged at intervals, and the light emitting layers of adjacent light emitting devices are also arranged at intervals. When the second electrode is formed, it will also be cut off by the cutting groove, but will contact the bottom of the cutting groove, so that the second electrodes of adjacent light emitting devices do not directly contact each other, but can be electrically connected as a whole through the cutting layer, and then can share the same signal. By controlling the signal of the first electrode, the independent light emission of the light emitting device can be realized.

[0091] It should be understood that the foregoing general description and the following detailed description are only exemplary and explanatory, and cannot limit the present disclosure. BRIEF DESCRIPTION OF DRAWINGS

[0092] The drawings incorporated into the specification and forming a part thereof show embodiments consistent with the present disclosure and, together with the specification, serve to explain the principles of the present disclosure. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0093] Figure 1 It is a top view schematic diagram of an embodiment of the display panel of the present disclosure.

[0094] Figure 2 It is a cross-sectional schematic diagram of an embodiment of the display panel of the present disclosure.

[0095] Figure 3 It is a schematic diagram of the light emitting layer in an embodiment of the display panel of the present disclosure.

[0096] Figure 4 It is a schematic diagram of the light emitting layer in another embodiment of the display panel of the present disclosure.

[0097] Figures 5-24 It is a cross-sectional schematic diagram corresponding to part of the steps in the first type of the first embodiment of the display panel of the present disclosure.

[0098] Figure 25 and Figure 26Fig. 2 shows a cross-sectional view of the display panel according to the first embodiment of the present disclosure.

[0099] Figure 27 Fig. 3 shows a cross-sectional view of the display panel according to the second embodiment of the present disclosure. DETAILED DESCRIPTION

[0100] Example embodiments now will be described more fully hereinafter with reference to the accompanying drawings. Example embodiments, may, however, be implemented in many different forms and should not be construed as limited to the implementations set forth herein; rather, these implementations are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. Like reference numerals refer to like elements throughout the specification. It will be understood that the terms "comprises", "comprising", "includes" and / or "including", as used herein, specify the presence of the stated features, integers, steps, operations, objects, and / or the like, but do not preclude the presence or addition of one or more other features, integers, steps, operations, objects, and / or the like.

[0101] The terms "one", "a", "an", "the", and "at least one" are used to mean that "one or more" of the indicated element / s, component / s, etc. is / are present; the terms "includes" and / or "including" are used to mean that "including, but not limited to", and the terms "first", "second", and "third" are merely used for naming, and do not limit the quantity of the named objects.

[0102] The A feature and the B feature "overlap" herein means that the orthographic projection of the A feature on a plane and the orthographic projection of the B feature on the plane at least partially coincide; the plane can be the surface of the driving backplate, or other plane parallel to the driving backplate.

[0103] The embodiments of the present disclosure provide a display panel, such as Figure 1 As shown in Fig. 1, the display panel can be divided into at least a display area AA and a peripheral area WA outside the display area AA; the peripheral area WA can be a continuous annular area surrounding the display area AA; or can be discontinuous areas surrounding the display area AA, for example, the peripheral area WA can be distributed on both sides of the display area AA. The display area AA can be used for light emission to display images, and the peripheral area WA does not emit light.

[0104] As shown in Fig. 1, the display panel can be divided into at least a display area AA and a peripheral area WA outside the display area AA; the peripheral area WA can be a continuous annular area surrounding the display area AA; or can be discontinuous areas surrounding the display area AA, for example, the peripheral area WA can be distributed on both sides of the display area AA. The display area AA can be used for light emission to display images, and the peripheral area WA does not emit light. Figure 2 As shown in Fig. 1, the display panel can be divided into at least a display area AA and a peripheral area WA outside the display area AA; the peripheral area WA can be a continuous annular area surrounding the display area AA; or can be discontinuous areas surrounding the display area AA, for example, the peripheral area WA can be distributed on both sides of the display area AA. The display area AA can be used for light emission to display images, and the peripheral area WA does not emit light.

[0105] The driving backplane BP has a driving circuit, through which the light emitting device LD can be driven to emit light to display an image. In some embodiments of the present disclosure, the driving backplane BP can include a substrate SU and a circuit layer located on one side of the substrate SU. The substrate SU can be a flat plate structure, and the material thereof can be a hard material such as glass or a flexible material such as polyimide. Meanwhile, the substrate SU can be a single-layer or multi-layer structure.

[0106] The circuit layer includes the driving circuit described above. For example, the driving circuit can include pixel circuits located in the display area AA and peripheral circuits located in the peripheral area WA. The pixel circuit can be of a 7T1C, 8T1C or other structure, as long as it can drive the light emitting device LD to emit light, and the structure thereof is not specially limited herein. In the expression nTmC, n represents the number of thin film transistors (denoted by the letter “T”), and m represents the number of capacitors (denoted by the letter “C”). The number of pixel circuits can be the same as the number of light emitting devices LD, and each pixel circuit is connected to each light emitting device LD in a one-to-one correspondence. Of course, one pixel circuit can also be connected to multiple light emitting devices LD, and the present disclosure does not specially limit this.

[0107] The peripheral circuit is connected to the pixel circuit, and is configured to input a driving signal to the pixel circuit to control the light emitting device LD to emit light. The peripheral circuit can include a gate driving circuit and a light emitting control circuit, and of course, can also include other circuits, and the specific structure of the peripheral circuit is not specially limited herein.

[0108] As shown in FIG. 1, Figure 2 In some embodiments of the present disclosure, the circuit layer described above can include a transistor layer TL and a connection layer CL stacked on the side of the transistor layer TL away from the substrate SU. The thin film transistors and the capacitors of the driving circuit can be located in the transistor layer TL. The thin film transistors can be top-gate or bottom-gate thin film transistors. Each thin film transistor can include an active layer and a gate electrode which are arranged in an overlapping manner. The active layers of the thin film transistors are arranged in the same semiconductor layer. Alternatively, the active layers of different thin film transistors can be distributed in different semiconductor layers. The material of the semiconductor layer can be polysilicon or metal oxide, and the present disclosure does not specially limit this.

[0109] Taking a top-gate thin film transistor as an example, the transistor layer TL can include a semiconductor layer, a first gate insulating layer, a first gate electrode layer, a second gate insulating layer, a second gate electrode layer and an interlayer dielectric layer which are stacked in the direction away from the substrate SU. The active layer of each thin film transistor is located in the semiconductor layer, the gate electrode is located in the gate electrode layer, and the two plates of the capacitor are located in the first gate electrode layer and the second gate electrode layer. The connection layer CL can include at least one source / drain layer and a planarization layer. The surface of the planarization layer farthest from the substrate SU is the surface of the driving backplane BP for arranging the light emitting device LD.

[0110] Each source-drain layer SD is covered by a planar layer PLN to achieve planarization, and connections between at least some of the thin film transistors and between the thin film transistors and the capacitor can be achieved through the source-drain layer SD to transmit driving signals, the types of the driving signals and the specific patterns of the film layers depend on the specific configuration of the driving circuit, which is not particularly limited here. For example, the number of the source-drain layer SD and the planar layer PLN is one, and the source-drain layer SD is stacked on the surface of the transistor layer TL away from the substrate SU, and the planar layer PLN covers the source-drain layer SD; or the number of the source-drain layer SD and the planar layer PLN is two, which includes a first source-drain layer, a first planar layer, a second source-drain layer and a second planar layer stacked in the direction away from the substrate SU, and the second source-drain layer is arranged on the surface of the first planar layer away from the substrate SU. Further, the first source-drain layer can be covered by a passivation layer, and the first planar layer covers the passivation layer.

[0111] As shown in Figure 2 , the light emitting device LD can be stacked on the driving backplane BP, for example, the light emitting device LD is stacked on the surface of the planar layer PLN farthest from the substrate SU. At the same time, the light emitting device LD is located in the display area AA, which can be an OLED (Organic Light Emitting Diode) using organic light emitting material, or a Mini LED (Mini Light Emitting Diode, size 100 μm-200 μm), a Micro LED (Micro Light Emitting Diode, size not greater than 100 μm) and an LED (Light Emitting Diode, size greater than 200 μm) using inorganic light emitting material, which is not particularly limited here as long as it can emit light.

[0112] As shown in Figure 2 , taking the OLED as an example, the light emitting device LD can include a first electrode ANO, a light emitting layer EL and a second electrode CAT stacked in the direction away from the driving backplane BP, and the light emitting layer EL can be excited to emit light by applying an electrical signal to the first electrode ANO and the second electrode CAT. The specific light emitting principle is not described here in detail.

[0113] The first electrode ANO can be used as an anode, and its material can include conductive materials such as metal, metal oxide, etc., for example, Ti (titanium), Al (aluminum), Mg (magnesium), Ag (silver), etc. metal, of course, it can also include metal oxides such as ITO (indium tin oxide). At the same time, the first electrode ANO can be a single layer or a multi-layer structure, for example, the first electrode ANO can include a first metal layer, a second metal layer and a third metal layer stacked in the direction away from the driving backplane BP, the materials of the first metal layer and the third metal layer are Ti, and the material of the second metal layer is Al.

[0114] The second electrode CAT can serve as a cathode, and its material can include conductive materials such as metals and metal oxides, for example, metals such as Al (aluminum), Mg (magnesium), Ag (silver), and Yb (ytterbium); it can also include metal oxides such as IZO (indium zinc oxide) and ITO; it can also be metal oxides doped with other elements, such as aluminum-doped zinc oxide (AZO), fluorine-doped tin oxide (FTO), antimony-doped tin oxide (ATO), gallium-doped zinc oxide (GZO), etc. Of course, zinc oxide can also be doped with other elements, or titanium oxide (TiO2) doped with other elements; for example, the second electrode CAT can include a first conductive layer, a second conductive layer, and a third conductive layer stacked sequentially in a direction away from the driving backplane BP. The material of the first conductive layer is either Al or Mg, or an alloy of the two, the material of the second conductive layer is IZO, and the material of the third conductive layer is Al2O3.

[0115] like Figure 3 and Figure 4 As shown, the light-emitting layer EL may include at least one light-emitting sublayer. Each light-emitting sublayer may include a hole transport layer HTL, a light-emitting material layer EML, and an electron transport layer ETL stacked sequentially along a direction away from the driving backplane BP. The light-emitting sublayer may also include a hole injection layer HIL and an electron injection layer EIL distributed along a direction away from the driving backplane BP, with the hole transport layer HTL, the light-emitting material layer EML, and the electron transport layer ETL distributed between the hole injection layer HIL and the electron injection layer EIL along a direction away from the driving backplane BP. Furthermore, for multiple light-emitting sublayers, a charge generation layer CGL may be provided between adjacent light-emitting sublayers, and adjacent light-emitting sublayers are electrically connected through this charge generation layer CGL. The specific structure of the light-emitting layer EL is not specifically limited here, as long as it can cooperate with the first electrode ANO and the second electrode CAT to emit light.

[0116] In addition, an electron blocking layer (EBL) can be placed between the hole transport layer (HTL) and the luminescent material layer (EML) to block electrons; alternatively, a luminescent functional layer (Prime) can be placed between the hole transport layer (HTL) and the luminescent material layer (EML), which can be made of amines, biphenyls, naphthalenes, or other materials, to reduce the potential barrier, block electrons, and improve luminous efficiency; a hole blocking layer (HBL) can also be placed between the electron transport layer (ETL) and the luminescent material layer (EML) to block holes.

[0117] In some embodiments of this disclosure, each light-emitting sublayer in the same light-emitting device (LD) can emit light, and the light-emitting color of each light-emitting sublayer in the same light-emitting device (LD) can be the same. The brightness can be improved by using multiple light-emitting sublayers.

[0118] It should be noted that the present disclosure does not exclude other cases, for example, the light emitting colors of different light emitting sub-layers of the same light emitting device LD are different, and the light emitting colors of different light emitting devices LD are the same. At this time, a color film layer can be arranged on the side of the light emitting device LD away from the driving back plate BP, and the color film layer has filter parts of different colors, one filter part overlaps one light emitting device LD, so that color display can be realized through the color color film layer + light emitting device LD.

[0119] As shown in Figure 2 , the display panel can further include a pixel definition layer PDL separating the light emitting devices LD, which can be arranged on the same surface of the driving back plate BP as the light emitting devices LD, for example, the pixel definition layer PDL can be arranged on the surface of the planar layer farthest from the substrate SU away from the substrate SU as the first electrode ANO. At the same time, the thickness of the pixel definition layer PDL is greater than the thickness of the first electrode ANO, and the pixel definition layer PDL has pixel openings PH exposing each first electrode ANO. One pixel opening PH exposes one first electrode ANO. At the same time, one pixel opening PH is smaller than the first electrode ANO it exposes, that is, the pixel definition layer PDL extends to the surface of the first electrode ANO away from the driving back plate BP, covering the edge of the first electrode ANO.

[0120] As shown in Figure 2 , the light emitting layer EL and the second electrode CAT are stacked on the first electrode ANO in the pixel opening PH. In some embodiments, the light emitting layer EL is an intermittent structure, and the light emitting layer EL of each light emitting device LD is independently spaced apart, and the light emitting colors of different light emitting devices LD can be different; the second electrodes CAT of different light emitting devices LD can be an integral structure or conductively connected.

[0121] As shown in Figure 2 , each light emitting device LD is defined by the pixel definition layer PDL, wherein the range of the pixel opening PH is the range of the light emitting device LD, that is, the shape and size of the orthographic projection of the pixel opening PH on the substrate SU is the shape and size of the orthographic projection of the light emitting device LD on the substrate SU. At the same time, the shape of the pixel opening PH is the shape of its orthographic projection on the driving back plate BP and the substrate SU, etc. The shape can be a polygon such as a rectangle, or a circle, etc. The shape and size of the light emitting device LD are limited by the shape and size of the pixel opening PH, for example, the size of the light emitting device LD is the size of its pixel opening PH.

[0122] The above-mentioned light emitting device LD includes at least two light emitting devices LD with different light emitting colors, each light emitting device LD can be divided into a plurality of light emitting units, one light emitting unit includes a plurality of light emitting devices LD, and at least part of the light emitting devices LD in the same light emitting unit have different light emitting colors.

[0123] As shown in the drawings, Figure 2 In some embodiments of the present disclosure, each light emitting device LD includes a first light emitting device LD1, a second light emitting device LD2 and a third light emitting device LD3 with different light emitting colors, for example, the first light emitting device LD1 emits red light, the second light emitting device LD2 emits green light, and the third light emitting device LD3 emits blue light.

[0124] The number of light emitting devices LD of each color is multiple, but the number of light emitting devices LD of different colors is not necessarily the same, for example, one light emitting unit can include one first light emitting device LD1, one second light emitting device LD2 and one third light emitting device LD3; or, one light emitting unit can include one first light emitting device LD1, two second light emitting devices LD2 and one third light emitting device LD3.

[0125] In some embodiments of the present disclosure, due to the difference in the service life of the light emitting layer EL of the light emitting device LD of different light emitting colors, the degree of decline in light emitting efficiency is different as the light emitting time increases, in order to ensure that the light emitting device LD can have different sizes under different light emitting efficiencies, the size of the light emitting device LD is larger to compensate for the insufficient light emitting efficiency, for example, in terms of the degree of decline in light emitting efficiency, the material emitting blue light is smaller than the material emitting red light, and the material emitting red light is smaller than the material emitting green light, so the size of the third light emitting device LD3 can be larger than the size of the first light emitting device LD1, and the size of the first light emitting device LD1 can be larger than the size of the second light emitting device LD2, so that the uniformity of the brightness of the three is improved.

[0126] Of course, the size of the first light emitting device LD1 and the second light emitting device LD2 can also be the same, and both are larger than the second light emitting device LD2, or the size of each light emitting device LD is the same.

[0127] As shown in the drawings, Figure 2 In order to prevent the erosion of external water vapor, the display panel can further include an encapsulation layer TFE, which can cover each light emitting device LD, for example, the encapsulation layer TFE can adopt a thin film encapsulation manner, which can include a first inorganic layer CVD1, an organic layer IJP and a second inorganic layer CVD2, wherein:

[0128] The first inorganic layer CVD1 can cover each light emitting device LD, that is, the first inorganic layer CVD1 can be covered on the surface of the second electrode CAT away from the driving back plate BP; the material of the first inorganic layer CVD1 can include inorganic insulating materials such as silicon nitride, silicon oxide, silicon oxynitride and aluminum oxide.

[0129] The organic layer IJP can be disposed on the surface of the first inorganic layer CVD1 away from the driving back plate BP, and the boundary of the organic layer IJP can be limited to the inside of the boundary of the first inorganic layer CVD1 by the barrier dam located in the peripheral area WA. Meanwhile, the boundary of the orthographic projection of the organic layer IJP on the driving back plate BP can be located in the peripheral area WA, ensuring that the organic layer IJP can cover each light emitting device LD.

[0130] The second inorganic layer CVD2 can cover the organic layer IJP and the first inorganic layer CVD1 not covered by the organic layer IJP, and can block the invasion of water and oxygen by the second inorganic layer CVD2. The material of the second inorganic layer CVD2 can include inorganic insulating materials such as silicon nitride and silicon oxide.

[0131] When forming the light emitting layer EL of the display panel, a mask is required to form the light emitting material on the first electrode ANO by a process such as evaporation, and in order to achieve the requirements of high resolution, high brightness, long service life and low power consumption, the mask usually adopts FFM (Fine Metal Mask) so as to realize the array arrangement of the light emitting layer EL and the independent light emission of the light emitting device LD. However, due to the limitation of materials and screen printing process, the larger the size of the display panel, the greater the sag of the mask under the action of gravity, and the worse the PPA (Pixel Position Accuracy, which reflects the difference between the opening position of the mask and the pixel position), which significantly increases the risk of evaporation color mixing failure, thus the mask limits the improvement of pixel aperture ratio and the increase of brightness.

[0132] Therefore, the inventors provide a scheme for forming the light emitting layer EL without using an external mask, which saves the high mask design and manufacturing cost and the equipment cost of purchasing screen printing equipment, which will be described in detail as follows:

[0133] As shown in FIG. 1, a pixel definition layer PDL can be disposed on the surface of the driving back plate BP, and a plurality of pixel openings PH can be formed in the pixel definition layer PDL, each of which corresponds to a light emitting device LD. Figure 2 As shown in FIG. 1, a pixel definition layer PDL can be disposed on the surface of the driving back plate BP, and a plurality of pixel openings PH can be formed in the pixel definition layer PDL, each of which corresponds to a light emitting device LD.

[0134] When the second electrode CAT is formed, the second electrode CAT is also disconnected at the cut-off groove CHs. The second electrode CAT in the cut-off hole CH can contact the cut-off layer CSL. The cut-off layer CSL is at least partially conductive, so that at least part of the second electrode CAT can be electrically connected through the cut-off layer CSL, so as to transmit signals to the second electrode CAT of multiple light-emitting devices LD at the same time.

[0135] To facilitate the formation of cut-off grooves (CHs), the cut-off layer (CSL) can be a multi-layered structure, with at least two layers made of different materials. A wet etching process can be used to etch the specific material, thereby forming the undercut structure mentioned above, i.e., the cut-off grooves (CHs). Alternatively, the cut-off layer (CSL) can be a single-layer structure, with the cut-off grooves (CHs) directly formed on the sidewall of the cut-off hole (CH).

[0136] like Figure 2 As shown, in some embodiments of this disclosure, the cutoff layer CSL includes a conductive layer CS1 and a shielding layer CS2 stacked sequentially along a direction away from the drive backplane BP, wherein:

[0137] The cut-off groove CHs is an annular groove surrounding the pixel opening PH and located in the conductive layer CS1. This means that the cut-off groove CHs causes the conductive layer CS1 to be recessed relative to the shielding layer CS2, forming an undercut structure. A portion of the shielding layer CS2 is a cantilever structure. The shielding layer CS2 and the conductive layer CS1 are made of different materials. For example, the conductive layer CS1 may be made of metals or alloys such as Cu (copper), Ag, Al, Mo (molybdenum), and AlNd (aluminum-neodymium alloy), and may also include metal oxides such as ITO and IZO. The shielding layer CS2 may be made of inorganic insulating materials such as silicon oxide and silicon nitride. The cut-off hole CH can penetrate through the shielding layer CS2 and the conductive layer CS1, overlapping with the pixel opening PH and being no smaller than the pixel opening PH, thus avoiding obstruction of the light-emitting device LD.

[0138] The cut-off layer CSL with cut-off holes CH can be etched by wet etching, causing the conductive layer CS1 to shrink inward, thereby forming cut-off grooves CHs. The cut-off grooves CHs have two opposing sidewalls and a bottom surface connecting the two sidewalls. The two sidewalls are distributed in a direction away from the driving backplane BP. One sidewall is the surface of the pixel definition layer PDL away from the driving backplane BP, and the other sidewall is the surface of the masking layer CS2 close to the driving backplane BP.

[0139] A cut-off layer (CSL) can be used instead of a dedicated photomask. During the deposition of the luminescent material to form the luminescent layer (EL), the luminescent material breaks off at the cut-off grooves (CHs) and cannot extend continuously. This allows for patterning of the EL layer through the cut-off holes (CHs) and grooves (CHs), eliminating the need for a photomask. Simultaneously, the cut-off grooves (CHs) also disconnect the second electrode (CAT). However, the second electrode (CAT) within the cut-off holes (CHs) can extend into the cut-off grooves (CHs) and contact the bottom surface of the grooves (CHs), i.e., contact with the conductive layer (CS1). This allows for electrical connection of the second electrodes (CAT) of different luminescent devices (LDs) through the conductive layer (CS1), enabling the simultaneous transmission of the same common power signal to multiple LDs.

[0140] The luminescent material is deposited from the side of the cut-off layer CSL away from the driving backplate BP. Furthermore, in some embodiments, the depth of the cut-off groove CHs can be reduced in the direction away from the driving backplate BP, that is, the inner wall of the cut-off groove CHs contracts in the direction away from the driving backplate BP, which can prevent the luminescent material from continuously passing through the cut-off groove CHs to the greatest extent and ensure that the luminescent layer EL can be broken at the cut-off groove CHs.

[0141] In addition, such as Figure 2 As shown, the first inorganic layer CVD1 of the encapsulation layer TFE can cover the second electrode CAT and the cut-off layer CSL. Since the light-emitting layer EL and the second electrode CAT have already filled the cut-off groove CHs to a certain extent, the first inorganic layer CVD1 can extend continuously at the cut-off groove CHs without being broken, which can prevent external water vapor and oxygen from corroding the light-emitting device LD.

[0142] Based on the aforementioned implementation method, the light-emitting layer EL and the second electrode CAT of the same light-emitting device LD can be located within the range surrounded by a cut-off hole CH, and stacked on the first electrode ANO corresponding to the cut-off hole CH.

[0143] The inventors also discovered that when using the cut-off layer (CSL) to pattern the light-emitting layer (EL), only one color of light-emitting device (LD) EL can be formed at a time, thus requiring the sequential formation of EL layers of various colors. When forming LDs of other colors, it is necessary to remove the EL layers remaining from the formation of those LDs. However, these residues are difficult to completely remove, especially within the cut-off grooves (CHs). Due to their depth, residues are more likely to remain inside, and the greater the depth, the easier it is for residues to remain. Conversely, if the depth is too shallow, it is difficult to cut off the EL layers. Therefore, the inventors proposed limiting the depth of the cut-off grooves (CHs) according to the formation order of different color EL layers to reduce the impact of residues. Specifically, for any two LDs with different emitting colors, the depth of the cut-off grooves (CHs) of the overlapping cut-off holes (PH) of their pixel openings can be different. Furthermore, the depth of the cut-off grooves (CHs) corresponding to the first formed LD can be greater than that corresponding to the later formed LD, because the later the cut-off grooves (CHs) are formed, the more likely they are to retain more luminescent material.

[0144] like Figure 2 As shown, in some embodiments of this disclosure, the light-emitting device (LD) includes a first light-emitting device LD1 emitting red light, a second light-emitting device LD2 emitting green light, and a third light-emitting device emitting blue light. Different colored organic light-emitting materials have different sensitivities to temperature. Red light-emitting materials are less affected by high temperatures, followed by green light-emitting materials, while blue light-emitting materials are the most sensitive to high temperatures. Since the first light-emitting material needs to undergo multiple high-temperature processes when forming different colored LDs sequentially, when forming three colored LDs, the first light-emitting device LD1 can be formed first, followed by the second light-emitting device LD2, and finally the third light-emitting device LD3.

[0145] For ease of description, the depth of the cut-off groove CHs of the cut-off hole CH overlapping with the pixel opening PH corresponding to the first light-emitting device LD1 can be taken as the first depth S1; the depth of the cut-off groove CHs of the cut-off hole CH overlapping with the pixel opening PH corresponding to the second light-emitting device LD2 can be taken as the second depth S2; and the depth of the cut-off groove CHs of the cut-off hole CH overlapping with the pixel opening PH corresponding to the third light-emitting device LD3 can be taken as the third depth S3.

[0146] Based on the above description, the first depth S1 can be greater than the second depth S2, and the second depth S2 can be greater than the third depth S3, that is, the depth of the truncated groove CHs corresponding to the third light emitting device LD3 formed last is the smallest, and the depth of the truncated groove CHs corresponding to the first light emitting device LD1 formed first is the largest. Further, the first depth S1 can be not less than 0.3 μm and not greater than 1.5 μm, the second depth S2 can be not less than 0.3 μm and not greater than 1.2 μm, and the third depth S3 can be not less than 0.3 μm and not greater than 1 μm. This can not only avoid the collapse of the shielding layer CS2 at the truncated groove CHs, but also ensure that the truncated groove CHs can cut off the light emitting layer EL and compress the space of the residual light emitting material to the greatest extent.

[0147] The depth of the above-mentioned truncated groove CHs is the maximum distance between the bottom surface of the truncated groove CHs and the side wall. If the bottom surface shrinks in the direction away from the driving back plate BP, the depth is the distance between the boundary of the bottom surface close to the driving back plate BP and the side wall close to the boundary in the truncated groove CHs.

[0148] For the above-mentioned embodiments, the inventors find that when the truncated groove CHs is opened on the side wall of the truncated hole CH, a wet etching process is usually used, but at the same time of etching the shielding layer CSL, the first electrode ANO is easily damaged. Therefore, the inventors propose a new structure of the pixel definition layer PDL, which protects the first electrode ANO when the truncated groove CHs is formed, and then removes the pixel definition layer PDL covering the first electrode ANO to expose the first electrode ANO when the light emitting layer EL is formed, and then forms the light emitting layer EL.

[0149] As shown in FIG. 1, Figure 2 In some embodiments of the present disclosure, the pixel definition layer PDL can include a definition layer PD1 and a protection layer PD2, wherein:

[0150] The definition layer PD1 can be disposed on the same surface of the driving back plate BP as the light emitting device LD, for example, the definition layer PD1 and the first electrode ANO can be disposed on the surface of the planar layer PLN farthest from the substrate SU away from the substrate SU. At the same time, the definition layer PD1 can be made of resin or other organic materials, and the thickness of the definition layer PD1 is greater than the thickness of the first electrode ANO, and the definition layer PD1 has a definition opening exposing each first electrode ANO. At the same time, one definition opening is smaller than the first electrode ANO it exposes, that is, the definition layer PD1 extends to the surface of the first electrode ANO away from the driving back plate BP, covering the edge of the first electrode ANO.

[0151] The protective layer PD2 can cover the limiting layer PD1 and extend to the surface of the first electrode ANO away from the driving back plate BP, i.e., extend to the limiting opening of the limiting layer PD1. The pixel opening PH is formed in the protective layer PD2, and the sidewall of the limiting opening of the limiting layer PD1 surrounds the pixel opening PH. Meanwhile, the material of the protective layer PD2 includes inorganic materials such as silicon oxide, silicon nitride, silicon oxynitride, and aluminum oxide which are not easy to be corroded. Before the formation of the truncated groove CHs, the protective layer PD2 can cover the first electrode ANO, i.e., the pixel opening PH is not formed, but the thickness of the protective layer PD2 can be smaller than that of the limiting layer PD1, so that the protective layer PD2 is recessed at the limiting opening of the limiting layer PD1. When the truncated groove CHs is formed, the protective layer PD2 can protect the first electrode ANO from being corroded by the etching solution. After the formation of the truncated groove CHs, the protective layer PD2 covering the first electrode ANO can be removed before the formation of the light-emitting layer EL, and the pixel opening PH is formed.

[0152] Further, as shown in FIG. 1, in some embodiments of the present disclosure, the protective layer PD2 includes a first protective sub-layer PD21 and a second protective sub-layer PD22, wherein: Figure 2

[0153] The first protective sub-layer PD21 covers the limiting layer PD1 and extends to the limiting opening, i.e., extends to the surface of the first electrode ANO away from the driving back plate BP, and the first protective sub-layer PD21 exposes the first electrode ANO, i.e., the first protective sub-layer PD21 has a protective opening exposing the first electrode ANO, and the protective opening is smaller than the limiting opening. The material of the first protective sub-layer PD21 can include inorganic materials such as silicon oxide, aluminum oxide, and silicon nitride which are resistant to corrosion, and the thickness can be 500 angstroms-2000 angstroms.

[0154] The second protective sub-layer PD22 can cover the first protective sub-layer PD21 and extend to the surface of the first electrode ANO away from the driving back plate BP, i.e., extend to the protective opening. The pixel opening PH can be formed in the second protective sub-layer PD22, and the material of the second protective sub-layer PD22 can include inorganic materials such as silicon oxide, silicon nitride, and silicon oxynitride which are resistant to corrosion, and the thickness can be 500 angstroms-1500 angstroms.

[0155] ​Under the same etching process, the etching rate of the first protective sublayer PD21 is less than the etching rate of the second protective sublayer PD22. For example, the ratio of the etching rate of the second protective sublayer PD22 to the etching rate of the first protective sublayer PD21 is greater than 2. Therefore, the first protective sublayer PD21 can be used as an etching barrier layer for the second protective sublayer PD22 to protect the organic material limiting layer PD1. When forming the cutoff trench CHs, the second protective sublayer PD22 covers the first electrode ANO, while the first protective sublayer PD21 exposes the first electrode ANO. The first electrode ANO is protected by the second protective sublayer PD22. After forming the cutoff trench CHs and before forming the light-emitting layer EL, a pixel opening PH can be opened in the second protective sublayer PD22 to expose the first electrode ANO.

[0156] like Figure 2 As shown, in some embodiments of this disclosure, the display panel may further include a light-emitting extension Es, which is stacked on the surface of the cut-off layer CSL away from the driving backplane BP and located between two adjacent light-emitting devices LD; the second electrode CAT includes an electrode extension CAs that covers the light-emitting extension Es and is disconnected from the second electrode CAT.

[0157] With adjacent first light-emitting device LD1 and second light-emitting device LD2: the light-emitting extension Es includes a first light-emitting extension Es1 disposed in the same layer as the light-emitting layer EL of the first light-emitting device LD1 and disconnected, and a second light-emitting extension Es2 disposed in the same layer as the light-emitting layer EL of the second light-emitting device LD2 and disconnected; the boundary of the first light-emitting extension Es1 away from the first light-emitting device LD1 and the boundary of the second light-emitting extension Es2 away from the second light-emitting device LD2 are connected, that is, the first light-emitting extension Es1 and the second light-emitting extension Es2 do not overlap.

[0158] It should be noted that in this article, A and B "set in the same layer" means that A and B belong to different regions that are continuous or discontinuous in the same film layer. Each region can be formed at the same time. The light-emitting extension Es can be regarded as the part of the light-emitting layer EL that has not been removed, and the electrode extension CAs can be regarded as the part of the second electrode CAT that has not been removed.

[0159] Furthermore, although the above embodiments are based on the example of the presence of a light-emitting extension Es and an electrode extension Cas between the first light-emitting device LD1 and the second light-emitting device LD2, the first light-emitting device LD1 and the second light-emitting device LD2 do not specifically refer to the light-emitting devices LD that emit red and green light in the example above. Here, they refer to any two adjacent light-emitting devices LD, rather than two specific light-emitting devices LD.

[0160] like Figure 5-24As shown, in some embodiments of this disclosure, the sidewalls of the electrode extension CAs and the light-emitting extension Es covered by them can contract in a direction away from the driving backplate BP, that is, gradually narrow. For example, the cross-section of the electrode extension CAs and the light-emitting extension Es covered by them along the plane perpendicular to the driving backplate BP can be trapezoidal.

[0161] This disclosure also provides a method for manufacturing a display panel, which can be any of the display panels described in the above embodiments. The specific structure of the display panel will not be detailed here. In this manufacturing method, light-emitting devices (LDs) of different colors can be formed sequentially, and the cut-off grooves (CHs) can be formed in batches or simultaneously. There are multiple implementation methods. For ease of description, the manufacturing method can be divided into two categories based on the formation timing of the cut-off grooves (CHs). The first category involves the batch formation of the cut-off grooves (CHs), which can be further divided into at least two types. The second category involves the simultaneous formation of all cut-off grooves (CHs). A detailed description follows:

[0162] like Figure 5 As shown, the first type of manufacturing method includes steps S10-S50, wherein:

[0163] Step S110: Form the drive backplane;

[0164] Step S120: Form the first electrode of multiple light-emitting devices on the driving backplane;

[0165] Step S130: Form a limiting layer covering each first electrode, the limiting layer having a limiting opening that corresponds to each first electrode;

[0166] Step S140: Form a protective layer covering the defining layer and the first electrode exposed by the defined opening, wherein the material of the protective layer includes inorganic materials;

[0167] Step S150: Form a cut-off layer with multiple cut-off holes on the surface of the protective layer away from the drive backplate, with each cut-off hole overlapping with each defined opening in a one-to-one correspondence; each cut-off hole is divided into at least n groups, where n is a positive integer not less than 2.

[0168] Step S160: Perform device steps sequentially for each group of cut-off holes; these device steps include steps S161-S162, wherein:

[0169] Step S161: Form a cut-off groove around the defined opening that overlaps with the cut-off hole on the sidewall;

[0170] Step S162: Remove at least part of the protective layer covering the first electrode inside the cut-off hole to expose the first electrode;

[0171] Step S163, forming a light-emitting layer covering the first electrode exposed by the truncated hole and the truncated layer, the light-emitting layer being truncated at the truncated groove;

[0172] Step S164, forming a second electrode covering the light-emitting layer, the second electrode being truncated at the truncated groove; at least part of the second electrode is in contact with the truncated layer and is electrically connected through the truncated layer.

[0173] By the first manufacturing method of the first type of the above embodiment, the truncated layer CSL can be used to realize the patterning of the light-emitting layer EL, avoiding the use of a mask with high cost, which is conducive to reducing the production cost; at the same time, when the truncated groove CHs is formed, the first electrode ANO is protected by the protection layer PD2 to prevent it from being corroded, reducing the risk of abnormal light emission and improving the product yield.

[0174] The steps of the first manufacturing method of the first type of the above embodiment are described exemplarily as follows:

[0175] In steps S110 and S120, the driving circuit can be prepared on the substrate SU by processes such as plating, exposure and etching, to obtain the driving backplate BP, and the specific structure can refer to the above embodiments of the display panel. The first electrode ANO of each light-emitting device LD can be prepared on the driving backplate BP by a photolithography process.

[0176] As shown in FIG. 13A, in step S130, the limiting layer PD1 of the pixel definition layer PDL can be formed on the driving backplate BP and patterned by processes such as exposure to form a limiting opening LH exposing the first electrode ANO; the limiting layer PD1 can be a resin such as photoresist or other organic material. Figure 6

[0177] As shown in FIG. 13B and FIG. 13C, in step S140, the protection layer PD2 of the pixel definition layer PDL can be formed, wherein: Figure 7 Figure 6 The protection layer PD2 can be a single-layer or multi-layer structure, for example:

[0178] In some embodiments of the present disclosure, step S140 can include steps S140-S143, wherein:

[0179] Step S141, forming a first protection sub-layer covering the limiting layer and the first electrode exposed by the limiting opening.

[0180] As shown in FIG. 14A, the first protection sub-layer PD21 of inorganic material can be formed by plasma enhanced chemical vapor deposition (PECVD) or other processes.

[0181] As shown in FIG. 14B, the second protection sub-layer PD22 of organic material can be formed by spin coating or other processes. Figure 6

[0182] ​​​Step S142: Pattern the first protective sublayer, remove the first protective sublayer that defines the bottom of the opening, so that the first protective sublayer exposes the first electrode.

[0183] like Figure 7 As shown, the first protective sublayer PD21 can be patterned using photolithography to obtain the protective opening SH that exposes the first electrode ANO.

[0184] Step S143: Form a second protective sublayer covering the first protective sublayer and the first electrode exposed by the first protective sublayer.

[0185] like Figure 8 As shown, a second protective sublayer PD22 can be formed by plasma-enhanced chemical vapor deposition or other processes, and the second protective sublayer PD22 covers the area exposed by the protected opening of the first electrode ANO.

[0186] If the protective layer PD2 is a single-layer structure, it can be directly formed to cover the limiting layer PD1 and the first electrode ANO.

[0187] like Figure 8 As shown, in step S150, a cutoff layer CSL can be formed on the pixel definition layer PDL and patterned to form multiple cutoff holes CH, with each cutoff hole CH overlapping a defined opening. Simultaneously, during step S150, the protective layer PD2 remains covering the first electrode ANO as an etching barrier layer, thus protecting the first electrode ANO.

[0188] For the cutoff layer CSL, which includes a conductive layer CS1 and a shielding layer CS2, step S150 may include steps S151-S153, wherein:

[0189] Step S151: Form a conductive layer covering the protective layer.

[0190] The conductive layer CS1 can be formed by sputtering, and the material can be a conductive material such as a metal or a metal oxide.

[0191] Step S152: Form a shielding layer covering the conductive layer; the shielding layer and the conductive layer are made of different materials.

[0192] The shielding layer CS2 was formed using a plasma-enhanced chemical vapor deposition process.

[0193] Step S153: Open multiple cut-off holes that penetrate the shielding layer and the conductive layer, with each cut-off hole corresponding to and overlapping with each defined opening.

[0194] like Figure 2As shown, patterning can be achieved through exposure and etching processes to form the cut-off hole CH that exposes the protective layer PD2. The materials of the conductive layer CS1 and the shielding layer CS2 can be referred to the implementation method of the display panel above, and will not be described in detail here.

[0195] In some embodiments of this disclosure, the light-emitting device (LD) includes n different light-emitting devices of different colors. A cutoff hole (CH) overlaps with a light-emitting device (LD). Correspondingly, each cutoff hole (CH) can be divided into at least n groups, with each group of cutoff holes (CH) corresponding to a light-emitting device (LD) of one color, where n is a positive integer not less than 2. For example... Figure 8 and Figure 9 As shown, for example, the light-emitting device LD includes a first light-emitting device LD1, a second light-emitting device LD2 and a third light-emitting device LD3, n=3, and the cut-off holes CH are divided into 3 groups. The cut-off holes CH corresponding to the first light-emitting device LD1 are in the first group, the cut-off holes CH corresponding to the second light-emitting device LD2 are in the second group, and the cut-off holes CH corresponding to the third light-emitting device LD3 are in the third group.

[0196] In step S160, device steps are performed sequentially for each group of cut-off holes CH. That is, device steps are performed for each group of cut-off holes CH. Each time a device step is performed, a light-emitting device LD is formed in a group of cut-off holes CH. Therefore, after performing n device steps, all light-emitting devices LD can be formed.

[0197] The above-described device steps may include steps S161-S162, wherein:

[0198] Step S161: Form a cut-off groove around the defined opening that overlaps with the cut-off hole on the sidewall of the cut-off hole.

[0199] like Figure 10 As shown, the structure of the cutoff layer CSL and the cutoff groove CHs can be referred to the implementation method of the display panel above, and will not be described in detail here. Before forming the cutoff groove CHs, the area outside the cutoff groove CHs targeted by the device steps can be covered with a resist layer P1. The material of the resist layer P1 can be photoresist.

[0200] like Figure 10 As shown, a set of cut-off holes CH corresponding to a light-emitting device (LD) of the same emission color can be etched inwards using exposure and wet etching processes. For example, for a cut-off layer CSL containing a conductive layer CS1 and a shielding layer CS2, the etching solution can etch the conductive layer CS1 within the cut-off hole CH, while the inorganic shielding layer CS is either not etched or etched at a lower etching rate than the conductive layer CS1, thereby forming cut-off grooves CHs on the sidewalls of the cut-off hole CH. Simultaneously, other sets of cut-off holes CH are covered and filled by the resist layer P1, thus preventing the formation of cut-off grooves CHs.

[0201] Each device step targets the cut-off holes CH corresponding to the same color light-emitting device LD. However, when performing device steps on the cut-off holes CH corresponding to different light-emitting devices LD, the depth of the inward etching in step S161 can be different. As mentioned above, the first depth can be greater than the second depth, and the second depth can be greater than the third depth. That is, the depth of the cut-off groove CHs corresponding to the last formed third light-emitting device LD3 is the smallest, and the depth of the cut-off groove CHs corresponding to the first formed first light-emitting device LD1 is the largest. Furthermore, the first depth can be not less than 0.3μm and not more than 1.5μm, the second depth can be not less than 0.3μm and not more than 1.2μm, and the third depth can be not less than 0.3μm and not more than 1μm. This can both prevent the shielding layer CS2 from collapsing at the cut-off groove CHs and ensure that the cut-off groove CHs can cut off the light-emitting layer EL, and maximize the compression of the space of residual light-emitting material.

[0202] During the formation of the cut-off grooves CHs described above, the first electrode ANO is always covered by the protective layer PD2. That is, the bottom surface of the cut-off hole CH is the surface of the protective layer PD2 away from the driving backplane BP, not the surface of the first electrode ANO away from the driving backplane BP. The protective layer PD2 acts as an etching barrier layer, protecting the first electrode ANO from etching. For example, regarding the protective layer PD2 mentioned above, which includes a first protective sublayer PD21 and a second protective sublayer PD22, it is the second protective sublayer PD22 that protects the first electrode ANO.

[0203] Step S162: Remove at least part of the protective layer covering the first electrode inside the cut-off hole to expose the first electrode.

[0204] like Figure 11 As shown, for the cut-off hole CH where cut-off grooves CHs are formed in step S161, the exposed protective layer PD2 can be removed to expose the first electrode ANO. For example, the area outside the cut-off hole CH where cut-off grooves CHs are formed can be covered by a resist layer P2 to expose the cut-off hole CH with cut-off grooves CHs; the material of the resist layer P2 can be photoresist; then, at least part of the protective layer PD2 exposed by the cut-off hole CH is removed by exposure and dry etching processes to expose the pixel first electrode ANO, and the removed protective layer PD2 can be a second protective sublayer PD22.

[0205] Step S163: Form a light-emitting layer covering the cut-off layer and the first electrode exposed by the cut-off hole, wherein the light-emitting layer is broken at the cut-off groove.

[0206] like Figure 11As shown, a light-emitting layer EL of a certain color can be formed on the cut-off layer CSL after step S162 using a vacuum evaporation device. The light-emitting layer EL is broken at the cut-off grooves CHs. Simultaneously, the light-emitting layer EL extends into the cut-off holes CH where the cut-off grooves CHs are not formed, and extends continuously. However, since the first electrode ANO corresponding to the cut-off hole CH where the cut-off grooves CHs are not formed is still covered by the protective layer PD2, the light-emitting layer EL does not contact the first electrode ANO covered by the protective layer PD2. In this way, it can be ensured that the light-emitting layer EL only contacts the first electrode ANO exposed in the same set of cut-off holes CH, so that a light-emitting device LD of the same color can be formed accordingly. The light-emitting layer EL in other sets of cut-off holes CH will not form a light-emitting device LD.

[0207] Step S164: Form a second electrode covering the light-emitting layer. The second electrode is disconnected at the cut-off groove. At least part of the second electrode is in contact with the cut-off layer and is electrically connected through the cut-off layer.

[0208] like Figures 13-17 As shown, a second electrode CAT covering the light-emitting layer EL can be formed using equipment such as vacuum evaporation equipment. The second electrode CAT can be disconnected at the cut-off grooves CHs, and within the area surrounded by the cut-off grooves CHs, it forms a light-emitting device LD with the light-emitting layer EL and the first electrode ANO. Simultaneously, the disconnected second electrode CAT can extend into the cut-off grooves CHs and contact the bottom surface of the cut-off grooves CHs, i.e., contact the conductive layer CS1, thereby achieving electrical connection with the conductive layer CS1. Furthermore, the second electrode CAT extends continuously within the cut-off holes CHs where the cut-off grooves CHs are not formed, and although it covers the light-emitting layer EL, due to the presence of the protective layer PD2, the light-emitting device LD is not formed within these cut-off holes CHs.

[0209] The above-described device steps can be performed n times, each time forming a light-emitting device LD of one color for a set of cut-off holes CH, thereby forming n light-emitting devices LD with different emitting colors. In some embodiments of this disclosure, n equals 3, and the light-emitting devices LD include a first light-emitting device LD1, a second light-emitting device LD2, and a third light-emitting device LD3 with different emitting colors. Correspondingly, the cut-off holes CH include a first set of cut-off holes CH for forming the first light-emitting device LD1, a second set of cut-off holes CH for forming the second light-emitting device LD2, and a third set of cut-off holes CH for forming the third light-emitting device LD3. The above-described device steps can be performed first for the first set of cut-off holes CH, then for the second set of cut-off holes CH, and finally for the third set of cut-off holes CH.

[0210] Figure 15 This is a schematic diagram of each step in the second execution device step. Figures 18-23 The intermediate resist layer P4 is used to protect the already formed first light-emitting device LD1 and the cut-off hole CH, which does not need to be formed into the third light-emitting device LD3 for the time being.

[0211] Figure 18 This is a schematic diagram of each step in the third execution device step. Figure 13 The intermediate resist layer P5 is used to protect the already formed second light-emitting device LD2. When removing the light-emitting layer EL and the second electrode CAT in the third set of cut-off holes CH, the film layer stacked on the first light-emitting device LD1 can be thinned at the same time, that is, the light-emitting layer EL and the second electrode CAT stacked on the first light-emitting device LD1 can be removed.

[0212] Furthermore, since a light-emitting layer EL and a second electrode CAT are formed in the cut-off holes CH where the cut-off groove CHs are not formed each time a device step is performed, and a light-emitting layer EL and a second electrode CAT are also formed on the surface of the cut-off layer CSL away from the driving backplate BP, only the light-emitting layer EL and the second electrode CAT that form the light-emitting device LD with the first electrode ANO participate in light emission. After multiple device steps are performed, the same area will accumulate multiple layers of light-emitting layer EL and second electrode CAT with a large thickness and step difference. Therefore, before each device step is performed, the light-emitting layer EL and second electrode CAT that do not form the light-emitting device LD remaining after the previous device step can be removed. For example, in some embodiments of this disclosure, before performing the device step for the (i+1)th group of cut-off holes, the manufacturing method further includes:

[0213] Step S170: Remove the second electrode and light-emitting layer formed in the (i+1)th group of cut-off holes during the device execution step for the i-th group of cut-off holes, where 1≤i≤n.

[0214] like Figure 14 and Figure 12 As shown, during the device step of the i-th group, the light-emitting layer EL and the second electrode CAT are formed in the cut-off holes CH outside the i-th group and on the surface of the cut-off layer CSL away from the driving backplane BP. However, only the cut-off groove CHs are formed in the cut-off holes CH of the i-th group, and a light-emitting device LD is formed. Before the light-emitting device LD is formed in the cut-off holes CH of the (i+1)-th group through the device step, a resist layer P3 can be formed by low-temperature exposure and other processes. The resist layer P3 can cover the cut-off holes CH of the i-th group and the light-emitting device LD inside them, as well as the cut-off holes CH before the i-th group and the light-emitting devices LD inside them. That is, the resist layer P3 is used to cover the already formed light-emitting device LD and protect the light-emitting device LD. Subsequently, the light-emitting layer EL and the second electrode CAT of the cut-off holes CH of the (i+1)-th group can be removed by dry etching and other processes to expose the protective layer PD2 inside the cut-off holes CH of the (i+1)-th group.

[0215] After performing step S170 above, the surface of the cut-off layer CSL away from the driving backplate BP may retain a light-emitting layer EL and a second electrode CAT. However, due to the presence of the cut-off grooves CHs, the remaining light-emitting layer EL and the second electrode CAT are disconnected from the light-emitting device LD. Furthermore, after performing the above device steps n times, the surface of the cut-off layer CSL away from the driving backplate BP retains light-emitting layers EL of multiple colors, and this surface may have two colors of light-emitting layers EL in the region between two adjacent cut-off holes CH, which are the same color as the light-emitting device LD in the two cut-off holes CH.

[0216] In some embodiments of this disclosure, the device steps may further include:

[0217] Step S165: Form a first inorganic layer covering the second electrode, the first inorganic layer extending continuously at the cut-off groove.

[0218] like Figure 24 As shown, a first inorganic layer CVD1 can be formed using low-temperature chemical vapor deposition or other processes. The first inorganic layer CVD1 can cover the second electrode CAT. Due to the stacking of the light-emitting layer EL and the second electrode CAT, the first inorganic layer CVD1 can continuously extend at the cut-off groove CHs, thereby protecting the already formed light-emitting device LD from corrosion by moisture and oxygen. Each time a device step is performed, one layer of the first inorganic layer CVD1 is formed.

[0219] like Figure 2 As shown, in some embodiments of this disclosure, the manufacturing method further includes:

[0220] Step S100: After forming the last set of light-emitting devices (LDs), the resist layer P7 can be used to cover the last set of light-emitting devices (LDs), and the light-emitting layer EL, the second electrode CAT, and the first inorganic layer CVD1 on the previously formed light-emitting devices (LDs) can be removed to reduce the step difference.

[0221] Furthermore, step S170 may also include: removing the first inorganic layer CVD1 formed in the (i+1)th group of cut-off holes CH during the device execution step for the i-th group of cut-off holes, and this layer can be removed simultaneously with the light-emitting layer EL and the second electrode CAT through processes such as dry etching.

[0222] In some embodiments of this disclosure, a first inorganic layer CVD1 can be formed each time a device step is performed, and a portion of the first inorganic layer CVD1 is removed in step S170. After n device steps are performed, the first inorganic layer CVD1 formed in each device step and not removed can be used as a whole to cover each light-emitting device (LD). Meanwhile, the aforementioned first inorganic layer CVD1 can be a single-layer structure, with a thickness that is 1.5 times the thickness of the conductive layer CS1; of course, the first inorganic layer CVD1 can also be a multi-layer structure, with a thickness ranging from 400 nm to 1200 nm.

[0223] In some embodiments of this disclosure, after performing the device steps for the nth group of cut-off holes CH, that is, after performing the device steps for all cut-off holes CH, the manufacturing method further includes steps S180 and S190, wherein:

[0224] Step S180: An organic layer is formed on the surface of the first inorganic layer away from the drive backplate.

[0225] like Figure 2 As shown, the organic layer IJP can be coated on the surface of the first inorganic layer CVD1 away from the drive backplate BP by means of printing or other methods, and the boundary of the organic layer IJP can be limited to the inside of the boundary of the first inorganic layer CVD1 by the blocking dam located in the peripheral area WA.

[0226] Step S190: Form a second inorganic layer covering the organic layer.

[0227] like Figure 25 As shown, the second inorganic layer CVD2 can cover the organic layer IJP and the first inorganic layer CVD1, which is not covered by the organic layer IJP. The second inorganic layer CVD2 can block the intrusion of water and oxygen, and planarization is achieved by the organic layer IJP, which is fluid before curing. The material of the second inorganic layer CVD2 can include inorganic insulating materials such as silicon nitride, silicon oxide, silicon oxynitride, and aluminum oxide.

[0228] The first type of manufacturing method can divide the light-emitting devices (LDs) of n colors into m groups, where m < n. If the display panel includes 3 or more light-emitting devices (LDs) of different colors, they can be divided into 2 groups. Therefore, the light-emitting devices (LDs) of different colors can be grouped into one group, and the number of light-emitting devices (LDs) in different groups can be different. Correspondingly, the cut-off holes (CHs) corresponding to the light-emitting devices (LDs) of different colors can be grouped into one group.

[0229] For example, there are three types of light-emitting devices (LDs): a first light-emitting device LD1, a second light-emitting device LD2, and a third light-emitting device LD3. Meanwhile, n can be 2. Correspondingly, the cut-off holes CH include a first set of cut-off holes corresponding to the first light-emitting device LD1 and a second set of cut-off holes corresponding to the second light-emitting device LD2 and the third light-emitting device LD3.

[0230] The first type of the first manufacturing method comprises steps S210-S225, wherein:

[0231] S210, forming a driving backplate;

[0232] S211, forming a plurality of first electrodes of light emitting devices on the driving backplate;

[0233] S212, forming a confinement layer covering the first electrodes, the confinement layer having a plurality of confinement openings corresponding to the first electrodes respectively;

[0234] S213, forming a protection layer covering the confinement layer and the first electrodes exposed by the confinement openings, the material of the protection layer comprising inorganic material;

[0235] S214, forming a truncation layer having a plurality of truncation holes on a surface of the protection layer away from the driving backplate, each of the truncation holes corresponding to one of the confinement openings respectively; the truncation holes are divided into a first group and a second group, the second group of the truncation holes comprising a first subgroup and a second subgroup;

[0236] S215, forming a truncation groove around the confinement openings corresponding to the first group of the truncation holes on sidewalls of the first group of the truncation holes;

[0237] S216, removing at least part of the protection layer covering the first electrodes in the first group of the truncation holes to expose the first electrodes;

[0238] S217, forming a light emitting layer covering the truncation layer and the first electrodes exposed by the first group of the truncation holes, the light emitting layer being truncated at the truncation groove;

[0239] S218, forming a second electrode covering the light emitting layer, the second electrode being truncated at the truncation groove; at least part of the second electrode is in contact with the truncation layer and is electrically connected through the truncation layer;

[0240] S219, removing the light emitting layer and the second electrode formed in the second group of the truncation holes when forming the light emitting layer and the second electrode in the first group of the truncation holes;

[0241] S220, forming a truncation groove around the confinement openings corresponding to the second group of the truncation holes on sidewalls of the second group of the truncation holes;

[0242] S221, removing at least part of the protection layer covering the first electrodes in the second group of the truncation holes to expose the first electrodes;

[0243] S222, forming a light emitting layer covering the truncation layer and the first electrodes exposed by the first subgroup of the truncation holes, the light emitting layer being truncated at the truncation groove;

[0244] Step S223: Form a second electrode covering the light-emitting layer, the second electrode is disconnected at the cut-off groove; at least part of the second electrode is in contact with the cut-off layer and is electrically connected through the cut-off layer;

[0245] When the light-emitting layer and the second electrode are formed in the first group of cut-off holes, the light-emitting layer and the second electrode formed in the second group of cut-off holes are removed, exposing the first electrode;

[0246] Step S224: Form a light-emitting layer covering the cut-off layer and the first electrode exposed by the second group of cut-off holes, wherein the light-emitting layer is broken at the cut-off groove;

[0247] Step S225: Form a second electrode covering the light-emitting layer, the second electrode being disconnected at the cut-off groove; at least a portion of the second electrode is in contact with the cut-off layer and electrically connected through the cut-off layer.

[0248] like Figure 26 and Figure 27 As shown, based on the second manufacturing method described above, cut-off grooves CHs are first formed for the first group of cut-off holes CH, and a first light-emitting device LD1 is formed. The specific process can be referred to the first execution of the device steps in the first embodiment, and will not be detailed here. Then, cut-off grooves CHs are formed for the first group of cut-off holes CH in the second group of cut-off holes CH, and a second light-emitting device LD2 is formed. Subsequently, cut-off grooves CHs are formed for the second group of cut-off holes CH, and a third light-emitting device LD3 is formed. The specific method of forming the cut-off grooves CHs can be referred to the method of forming the cut-off grooves CHs in the above embodiment, and will not be detailed here.

[0249] Before forming the second light-emitting device LD2, the films (light-emitting layer EL, second electrode CAT, and protective layer PD2) within the second set of cut-off holes CH need to be removed until the first electrode ANO is exposed. The light-emitting layer EL and the second electrode CAT can be removed simultaneously before forming the cut-off grooves CHs, while the protective layer PD2 can be removed after forming the cut-off grooves CHs. The removal process can refer to the first embodiment described above. Before forming the third light-emitting device LD3, the films (light-emitting layer EL and second electrode CAT) within the second set of cut-off holes CH need to be removed until the first electrode ANO is exposed. Since the cut-off grooves CHs of the second set of cut-off holes CH are already formed when forming the second light-emitting device LD2, the process of forming the cut-off grooves CHs and removing the protective layer PD2 before each formation of the light-emitting device LD can be eliminated, simplifying the process.

[0250] Furthermore, after each formation of the light-emitting device LD, a first inorganic layer CVD1 can also be formed. Therefore, the second manufacturing method requires the formation of the first inorganic layer CVD1 three times. In the step of removing the film layer in the cut-off hole CH to expose the first electrode ANO, the first inorganic layer CVD1 formed earlier is also removed.

[0251] The second type of manufacturing method can include steps S310-S360, wherein:

[0252] Step S310, forming a driving backplate;

[0253] Step S311, forming a plurality of first electrodes of light emitting devices on the driving backplate;

[0254] Step S312, forming a confinement layer covering the first electrodes, the confinement layer having a plurality of confinement openings corresponding to the first electrodes respectively;

[0255] Step S313, forming a protection layer covering the confinement layer and the first electrodes exposed by the confinement openings, the material of the protection layer comprising an inorganic material;

[0256] Step S314, forming a truncation layer having a plurality of truncation holes on a surface of the protection layer away from the driving backplate, each of the truncation holes corresponding to one of the confinement openings respectively and overlapping with the one of the confinement openings; each of the truncation holes is divided into a first group, a second group and a third group;

[0257] Step S315, forming a truncation groove around the confinement opening overlapping with each of the truncation holes on a sidewall of each of the truncation holes;

[0258] Step S316, removing at least part of the protection layer covering the first electrodes to expose the first electrodes;

[0259] Step S317, forming a light emitting layer covering the confinement layer and the first electrodes exposed by the first group of the truncation holes, the light emitting layer being truncated at the truncation groove;

[0260] Step S318, forming a second electrode covering the light emitting layer, the second electrode being truncated at the truncation groove; at least part of the second electrode is in contact with the confinement layer and is electrically connected through the confinement layer;

[0261] Step S319, removing the light emitting layer and the second electrode formed in the second group and the third group of the truncation holes when forming the light emitting layer and the second electrode in the first group of the truncation holes to expose the first electrodes;

[0262] Step S320, forming a light emitting layer covering the confinement layer and the first electrodes exposed by the second group of the truncation holes, the light emitting layer being truncated at the truncation groove;

[0263] Step S321, forming a second electrode covering the light emitting layer, the second electrode being truncated at the truncation groove; at least part of the second electrode is in contact with the confinement layer and is electrically connected through the confinement layer;

[0264] Step S322, removing the light emitting layer and the second electrode formed in the third group of the truncation holes when forming the light emitting layer and the second electrode in the second group of the truncation holes to expose the first electrodes;

[0265] Step S323, forming a light-emitting layer covering the truncated layer and the first electrode exposed by the third set of truncated holes, the light-emitting layer being truncated at the truncated groove;

[0266] Step S324, forming a second electrode covering the light-emitting layer, the second electrode being truncated at the truncated groove; at least part of the second electrode is in contact with the truncated layer and is electrically connected through the truncated layer.

[0267] The details of each step of the above-mentioned second type of manufacturing method can refer to the embodiments of the display panel and the embodiments of the first type of manufacturing method described above, and the main difference from the first type of manufacturing method is that, as shown in ​ the second type of manufacturing method simultaneously forms the truncated groove CHs for each truncated hole CH, and then forms the light-emitting devices LD of different colors respectively, in this way, the process can be simplified to the greatest extent, but the first type of manufacturing method can reduce the risk of residual light-emitting material in the truncated groove CHs, especially the first type of first manufacturing method, when forming the light-emitting layer EL of the light-emitting device LD of one color each time, only the corresponding truncated hole CH has the truncated groove CHs formed therein, while the truncated holes CH corresponding to the light-emitting devices LD of other colors do not have the truncated groove CHs formed therein, which can avoid the light-emitting material remaining in the truncated groove CHs.

[0268] The manufacturing method of the present disclosure can complete the preparation of a full-color OLED display panel through multiple deposition of light-emitting devices LD and multiple photolithography processes without FMM, has higher size precision, and can increase the effective light-emitting area (aperture ratio) to about 60% from the traditional FMM, and also can increase the pixel density to more than 1500 ppi, and the manufacturing method can also be applied to the field of silicon-based Micro OLED, replacing the existing technology scheme of white OLED (multiple light-emitting layers of different colors) + color film to realize color display; even can realize 6 times of device life or 4 times of brightness; at the same time, the truncated layer CSL between the light-emitting devices LD can solve the color mixing problem between the light-emitting devices LD of the display panel and the crosstalk problem in low brightness driving, further improving the display definition, color performance (color gamut), uniformity and other picture quality performances.

[0269] It should be noted that although the steps of the manufacturing method in the present disclosure are described in a specific order in the drawings, this does not require or imply that the steps must be performed in this specific order, or that all the steps shown must be performed to achieve the desired results. Additionally or alternatively, certain steps can be omitted, multiple steps can be combined into one step, and / or one step can be divided into multiple steps, etc.

[0270] The display device can be a mobile phone, a television, a tablet computer, a virtual reality (VR) device, a smart watch, or a wearable device, but is not limited thereto.

[0271] Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the features disclosed herein. It is intended that the specification and examples be considered as exemplary only, with the true scope and spirit of the disclosure being indicated by the following claims.

Claims

1. A display panel, characterized in that, include: Drive backplane; Multiple light-emitting devices are disposed on the driving backplate, and each light-emitting device includes a first electrode, a light-emitting layer, and a second electrode stacked sequentially in a direction away from the driving backplate. A pixel definition layer is disposed on the same surface as the light-emitting device on the driving backplate; the pixel definition layer has a plurality of pixel openings, one of the pixel openings exposes a first electrode, and the light-emitting layer of the light-emitting device is stacked on the first electrode exposed by one of the pixel openings; the pixel definition layer includes a defining layer and a protective layer covering the defining layer; the material of the protective layer includes an inorganic material; A cut-off layer is disposed on the surface of the pixel definition layer away from the driving backplate, and has a plurality of cut-off holes that overlap with each of the pixel openings. The light-emitting layer and the second electrode of the light-emitting device are located within the area surrounded by one of the cut-off holes. The sidewall of the cut-off hole is provided with a cut-off groove surrounding the pixel opening that overlaps with it. The second electrode in the cut-off hole is in contact with the cut-off layer, and at least a portion of the second electrode is electrically connected through the cut-off layer. The cut-off layer includes a conductive layer and a shielding layer stacked sequentially in a direction away from the drive backplate, the shielding layer and the conductive layer being made of different materials; the cut-off groove is located in the conductive layer; the second electrode in the cut-off hole extends into the cut-off groove and contacts the conductive layer.

2. The display panel according to claim 1, characterized in that, The protective layer includes a first protective sublayer and a second protective sublayer; the first protective sublayer covers the defining layer; the second protective sublayer covers the first protective sublayer and extends to the surface of the first electrode away from the drive backplate.

3. The display panel according to claim 2, characterized in that, The depth of the cut-off groove decreases in the direction away from the drive backplate.

4. The display panel according to claim 1, characterized in that, The display panel also includes: The encapsulation layer includes a first inorganic layer, an organic layer, and a second inorganic layer. The first inorganic layer covers the second electrode and the cut-off layer and extends continuously at the cut-off groove. The organic layer is disposed on the surface of the first inorganic layer away from the drive backplane, and the second inorganic layer covers the organic layer.

5. The display panel according to claim 1, characterized in that, The light-emitting device includes at least three light-emitting devices with different light-emitting colors, and the depth of the cut-off groove of the cut-off hole that overlaps with the pixel opening of two light-emitting devices with different light-emitting colors is different.

6. The display panel according to claim 5, characterized in that, The light-emitting device includes a first light-emitting device that emits red light, a second light-emitting device that emits green light, and a third light-emitting device that emits blue light; the depth of the cut-off groove of the cut-off hole that overlaps with the pixel opening corresponding to the first light-emitting device is a first depth; the depth of the cut-off groove of the cut-off hole that overlaps with the pixel opening corresponding to the second light-emitting device is a second depth; and the depth of the cut-off groove of the cut-off hole that overlaps with the pixel opening corresponding to the third light-emitting device is a third depth. The first depth is greater than the second depth, and the second depth is greater than the third depth.

7. The display panel according to claim 6, characterized in that, The first depth is not less than 0.3 μm and not more than 1.5 μm; the second depth is not less than 0.3 μm and not more than 1.2 μm; and the third depth is not less than 0.3 μm and not more than 1 μm.

8. The display panel according to claim 1, characterized in that, The light-emitting device includes an adjacent first light-emitting device and a second light-emitting device; The display panel further includes a light-emitting extension, which is stacked on the surface of the cut-off layer away from the driving backplate and located between two adjacent light-emitting devices; the second electrode includes an electrode extension that covers the light-emitting extension and is disconnected from the second electrode; The light-emitting extension includes a first light-emitting extension disposed in the same layer as the light-emitting layer of the first light-emitting device and disconnected, and a second light-emitting extension disposed in the same layer as the light-emitting layer of the second light-emitting device and disconnected; the boundary of the first light-emitting extension away from the first light-emitting device and the boundary of the second light-emitting extension away from the second light-emitting device are connected.

9. The display panel according to claim 1, characterized in that, The light-emitting device includes an adjacent first light-emitting device and a second light-emitting device; The display panel further includes a light-emitting extension, which is stacked on the surface of the cut-off layer away from the driving backplate and located between two adjacent light-emitting devices; the second electrode includes an electrode extension that covers the light-emitting extension and is disconnected from the second electrode; The sidewalls of the electrode extension and the light-emitting extension it covers taper away from the drive backplate.

10. A method for manufacturing a display panel, characterized in that, include: Forming a drive backplate; The first electrodes of multiple light-emitting devices are formed on the driving backplate; A defining layer is formed covering each of the first electrodes, the defining layer having a defining opening that corresponds to each of the first electrodes; A protective layer is formed covering the defining layer and the first electrode exposed by the defining opening, the material of the protective layer including inorganic materials; A cut-off layer with multiple cut-off holes is formed on the surface of the protective layer away from the drive back plate, and each cut-off hole overlaps with each defined opening in a one-to-one correspondence; each cut-off hole is divided into at least n groups, where n is a positive integer not less than 2; The steps of forming the light-emitting device are performed sequentially for each group of cut-off holes. The steps of forming the light-emitting device include: A cut-off groove is formed on the sidewall of the cut-off hole, surrounding and overlapping the defined opening therewith; Remove at least a portion of the protective layer covering the first electrode within the cut-off hole to expose the first electrode; A light-emitting layer is formed covering the cut-off layer and the first electrode exposed by the cut-off hole, the light-emitting layer being broken at the cut-off groove; A second electrode is formed covering the light-emitting layer, and the second electrode is disconnected at the cut-off groove; at least a portion of the second electrode is in contact with the cut-off layer and is electrically connected through the cut-off layer; A cut-off layer with multiple cut-off holes is formed on the surface of the protective layer away from the drive backplate; including: A conductive layer is formed covering the protective layer; A shielding layer is formed covering the conductive layer; the shielding layer and the conductive layer are made of different materials; Multiple cut-off holes are made that penetrate the shielding layer and the conductive layer, and each of the cut-off holes and each of the defined openings overlaps in a one-to-one correspondence; A cut-off groove is formed on the sidewall of the cut-off hole, surrounding and overlapping the defined opening therewith; including: The conductive layer is etched inside the cut-off hole to form a cut-off groove; The second electrode in the cut-off hole extends into the cut-off groove and contacts the conductive layer.

11. The manufacturing method according to claim 10, characterized in that, Before performing the step of forming the light-emitting device for the (i+1)th group of cut-off holes, the manufacturing method further includes: When performing the step of forming the light-emitting device for the cut-off holes of the i-th group, the second electrode and the light-emitting layer formed in the (i+1)-th group of cut-off holes are removed, 1≤i≤n.

12. The manufacturing method according to claim 10, characterized in that, A protective layer is formed covering the defining layer and the first electrode exposed by the defining opening; comprising: A first protective sublayer is formed, covering the defining layer and the first electrode exposed by the defining opening; The first protective sublayer is patterned, and the first protective sublayer defining the bottom of the opening is removed, so that the first protective sublayer exposes the first electrode. A second protective sublayer is formed that covers the first protective sublayer and the first electrode exposed by the first protective sublayer.

13. The manufacturing method according to claim 10, characterized in that, The steps for forming the light-emitting device further include: A first inorganic layer is formed covering the second electrode, and the first inorganic layer extends continuously at the cut-off groove.

14. The manufacturing method according to claim 13, characterized in that, After performing the step of forming the light-emitting device for the nth group of cut-off holes, the manufacturing method further includes: An organic layer is formed on the surface of the first inorganic layer away from the drive backplate; A second inorganic layer is formed covering the organic layer.

15. The manufacturing method according to any one of claims 10-14, characterized in that, n equals 3, and the cut-off holes include a first group of cut-off holes, a second group of cut-off holes, and a third group of cut-off holes; the light-emitting layers in any two groups of the first group of cut-off holes, the second group of cut-off holes, and the third group of cut-off holes emit different colors.

16. A method for manufacturing a display panel, characterized in that, include: Forming a drive backplate; The first electrodes of multiple light-emitting devices are formed on the driving backplate; A defining layer is formed covering each of the first electrodes, the defining layer having a defining opening that corresponds to each of the first electrodes; A protective layer is formed covering the defining layer and the first electrode exposed by the defining opening, the material of the protective layer including inorganic materials; A cut-off layer with multiple cut-off holes is formed on the surface of the protective layer away from the drive back plate, and each cut-off hole overlaps with each defined opening in a one-to-one correspondence; each cut-off hole is divided into a first group and a second group, and the cut-off holes in the second group include the first group and the second group. A cut-off groove is formed on the sidewall of the first set of cut-off holes, surrounding and overlapping the defined opening therewith; Remove at least a portion of the protective layer covering the first electrode within the first set of cut-off holes to expose the first electrode; A light-emitting layer is formed covering the cut-off layer and the first electrode exposed by the first set of cut-off holes, the light-emitting layer being broken at the cut-off groove; A second electrode is formed covering the light-emitting layer, and the second electrode is disconnected at the cut-off groove; at least a portion of the second electrode is in contact with the cut-off layer and is electrically connected through the cut-off layer; Remove the light-emitting layer and the second electrode formed in the second set of cut-off holes when the light-emitting layer and the second electrode are formed in the first set of cut-off holes; A cut-off groove is formed on the sidewall of the second set of cut-off holes, surrounding and overlapping the defined opening therewith; Remove at least part of the protective layer covering the first electrode within the second set of cut-off holes to expose the first electrode; A light-emitting layer is formed covering the cut-off layer and the first electrode exposed by the first group of cut-off holes, the light-emitting layer being broken at the cut-off groove; A second electrode is formed covering the light-emitting layer, and the second electrode is disconnected at the cut-off groove; at least a portion of the second electrode is in contact with the cut-off layer and is electrically connected through the cut-off layer; When the light-emitting layer and the second electrode are formed in the cut-off holes of the first group, the light-emitting layer and the second electrode formed in the cut-off holes of the second group are removed, exposing the first electrode; A light-emitting layer is formed covering the cut-off layer and the first electrode exposed by the cut-off holes in the second group, the light-emitting layer being broken at the cut-off groove; A second electrode is formed covering the light-emitting layer, and the second electrode is disconnected at the cut-off groove; at least a portion of the second electrode is in contact with the cut-off layer and is electrically connected through the cut-off layer; The cut-off layer includes a conductive layer and a shielding layer stacked sequentially in a direction away from the drive backplate, the shielding layer and the conductive layer being made of different materials; the cut-off groove is located in the conductive layer; the second electrode in the cut-off hole extends into the cut-off groove and contacts the conductive layer.

17. A method for manufacturing a display panel, characterized in that, include: Forming a drive backplate; The first electrodes of multiple light-emitting devices are formed on the driving backplate; A defining layer is formed covering each of the first electrodes, the defining layer having a defining opening that corresponds to each of the first electrodes; A protective layer is formed covering the defining layer and the first electrode exposed by the defining opening, the material of the protective layer including inorganic materials; A cut-off layer with multiple cut-off holes is formed on the surface of the protective layer away from the drive back plate, and each cut-off hole overlaps with each defined opening in a one-to-one correspondence; each cut-off hole is divided into a first group, a second group and a third group; A cut-off groove is formed on the sidewall of each of the cut-off holes, surrounding and overlapping the defined opening therewith; Remove at least a portion of the protective layer covering the first electrode to expose the first electrode; A light-emitting layer is formed covering the cut-off layer and the first electrode exposed by the first set of cut-off holes, the light-emitting layer being broken at the cut-off groove; A second electrode is formed covering the light-emitting layer, and the second electrode is disconnected at the cut-off groove; at least a portion of the second electrode is in contact with the cut-off layer and is electrically connected through the cut-off layer; When the light-emitting layer and the second electrode are formed in the first set of cut-off holes, the light-emitting layer and the second electrode formed in the second and third sets of cut-off holes are removed, exposing the first electrode; A light-emitting layer is formed covering the cut-off layer and the first electrode exposed by the second set of cut-off holes, the light-emitting layer being broken at the cut-off groove; A second electrode is formed covering the light-emitting layer, and the second electrode is disconnected at the cut-off groove; at least a portion of the second electrode is in contact with the cut-off layer and is electrically connected through the cut-off layer; When the light-emitting layer and the second electrode are formed in the second set of cut-off holes, the light-emitting layer and the second electrode formed in the third set of cut-off holes are removed, exposing the first electrode; A light-emitting layer is formed covering the cut-off layer and the first electrode exposed by the third set of cut-off holes, the light-emitting layer being broken at the cut-off groove; A second electrode is formed covering the light-emitting layer, and the second electrode is disconnected at the cut-off groove; at least a portion of the second electrode is in contact with the cut-off layer and is electrically connected through the cut-off layer; The cut-off layer includes a conductive layer and a shielding layer stacked sequentially in a direction away from the drive backplate, the shielding layer and the conductive layer being made of different materials; the cut-off groove is located in the conductive layer; the second electrode in the cut-off hole extends into the cut-off groove and contacts the conductive layer.

18. A display device, characterized in that, Includes the display panel as described in any one of claims 1-9.

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