Display device and optical adhesive material

By using an optical adhesive material containing aliphatic and aromatic monomers in the display device, combined with the structure of the conductive pattern layer and the protective layer, the problem that the display device in the prior art is difficult to take into account the light efficiency, optical characteristics and foldable characteristics, and a display device with efficient light output and excellent optical performance is realized.

CN119997760APending Publication Date: 2025-05-13SAMSUNG DISPLAY CO LTD
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Patent Information

Application Number
CN202411554340.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2023-11-09
Filing Date
2024-11-04
Publication Date
2025-05-13

AI Technical Summary

Technical Problem

While improving the light output efficiency, it is difficult to take into account excellent optical characteristics and foldable characteristics.

Method used

An optical bonding material containing aliphatic monomers, aromatic monomers, organic additives and inorganic particles is adopted, and the structure of a conductive pattern layer, a protective layer and an optical bonding layer is combined to achieve efficient light output and foldable characteristics of the display device.

Benefits of technology

The light output efficiency of the display device is improved, while ensuring excellent optical characteristics and foldable characteristics, and enhancing the flexibility and durability of the display device.

✦ Generated by Eureka AI based on patent content.

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Abstract

Embodiments of the present disclosure provide a display device and an optical adhesive material. The display device includes a display layer and a sensor layer disposed on the display layer and including a conductive pattern layer, a protective layer disposed on the conductive pattern layer and formed with an opening, and an optical adhesive layer disposed on the protective layer, forming an interface with the protective layer, and containing an optical adhesive material. The protective layer has a first refractive index. The optical adhesive layer has a second refractive index greater than the first refractive index. The optical adhesive material includes an aliphatic monomer, an aromatic monomer, an organic additive, and inorganic particles.
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Description

Technical Field

[0001] The present disclosure relates to a display device and an optical bonding material. Background Art

[0002] As information technology develops, the importance of display devices as a medium for connecting information has become prominent. In response to this, the use of display devices such as liquid crystal display devices (Liquid Crystal Display Device) and organic light emitting display devices (Organic Light Emitting Display Device) has increased.

[0003] The display device may include a display panel for displaying an image and a sensing panel for sensing an object. The sensing panel may be used to determine the position of a touch input provided by a user.

[0004] The light provided by the display panel can be transmitted through the sensing panel and provided to the outside. In order to improve the efficiency of the display device, it is necessary to carefully define the light emission direction of the light provided by the display panel. Therefore, research and development for improving the light emission efficiency of the display device is continuously carried out. Summary of the invention

[0005] One aspect of the present disclosure is to provide a display device with improved light extraction efficiency, and an optical adhesive material applicable to the display device.

[0006] An aspect of the present disclosure is to provide a display device capable of having a foldable property while ensuring excellent optical characteristics, and an optical adhesive material applicable to the display device.

[0007] According to an embodiment of the present disclosure, a display device may include a display layer and a sensor layer, wherein the display layer includes a light-emitting device including a first electrode, a second electrode, and a light-emitting layer electrically connected to the first electrode and the second electrode, and the sensor layer is arranged on the display layer and includes a conductive pattern layer, a protective layer arranged on the conductive pattern layer and formed with an opening, and an optical bonding layer arranged on the protective layer, forming an interface with the protective layer and including an optical bonding material. The protective layer may have a first refractive index. The optical bonding layer may have a second refractive index greater than the first refractive index. The optical bonding material may include an aliphatic monomer, an aromatic monomer, an organic additive, and an inorganic particle.

[0008] According to an embodiment, the aliphatic monomer may be represented by any one of Chemical Formula 1 to Chemical Formula 6.

[0009] [Chemical formula 1]

[0010]

[0011] [Chemical formula 2]

[0012]

[0013] [Chemical formula 3]

[0014]

[0015] [Chemical formula 4]

[0016]

[0017] [Chemical formula 5]

[0018]

[0019] [Chemical formula 6]

[0020]

[0021] In Chemical Formula 5 and Chemical Formula 6, n is independently an integer of 1 to 20.

[0022] According to an embodiment, the aliphatic monomer may be included in a range of 10 wt % to 20 wt % with respect to the total weight of the optical adhesive material.

[0023] According to embodiments, the aromatic monomer may be represented by any one of Chemical Formula 7 to Chemical Formula 12.

[0024] [Chemical formula 7]

[0025]

[0026] [Chemical formula 8]

[0027]

[0028] [Chemical formula 9]

[0029]

[0030] [Chemical formula 10]

[0031]

[0032] [Chemical formula 11]

[0033]

[0034] [Chemical formula 12]

[0035]

[0036] In Chemical Formula 9 and Chemical Formula 10, n is independently an integer of 0 to 6.

[0037] According to an embodiment, the aromatic monomer may be included in a range of 40 wt % to 65 wt % with respect to the total weight of the optical adhesive material.

[0038] According to an embodiment, the organic additive may include xylene resin. The xylene resin may be included in an amount ranging from 15 wt % to 25 wt % with respect to the total weight of the optical adhesive material.

[0039] According to an embodiment, the organic additive may include a sulfide-based aromatic organic material. The sulfide-based aromatic organic material may be included in an amount ranging from 10 wt % to 20 wt % with respect to the total weight of the optical adhesive material.

[0040] According to an embodiment, the second refractive index of the optical adhesive layer may be in the range of 1.56 to 1.7.

[0041] According to an embodiment, the optical adhesive material may have a storage elastic modulus in a range of 0.01 MPa or more and 1.8 MPa or less at -20°C.

[0042] According to an embodiment, tan δ (G′ / G″) of the optical adhesive material may be in a range of 3.0 to 3.4.

[0043] According to an embodiment, the glass transition temperature of the optical adhesive material may be in a range of -25°C or more and -20°C or less.

[0044] According to an embodiment, the protective layer may include one or more of the group consisting of acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, methacrylic acid-based resin, polyisoprene, vinyl resin, urethane-based resin, cellulose-based resin, siloxane-based resin, and perylene-based resin.

[0045] According to an embodiment, the first refractive index of the protection layer may be in a range of 1.45 to 1.56.

[0046] According to an embodiment, the light emitting device may include an organic light emitting device.

[0047] According to an embodiment, the conductive pattern layer may include a first conductive pattern layer and a second conductive pattern layer. The sensor layer may include an insulating layer disposed between the first conductive pattern layer and the second conductive pattern layer. The protective layer and the second conductive pattern layer may contact each other.

[0048] According to an embodiment, the optical adhesive layer may include a single layer structure.

[0049] According to an embodiment, the display device may further include an upper layer disposed on the sensor layer and directly adjacent to the optical adhesive layer.

[0050] According to an embodiment, the opening may overlap the light emitting layer when viewed on a plane.

[0051] According to an embodiment, the display device may be a flexible display device.

[0052] According to an embodiment of the present disclosure, the optical adhesive material may include an aliphatic monomer, an aromatic monomer, an organic additive including an organic material, and an inorganic material.

[0053] According to the embodiments of the present disclosure, a display device with improved light extraction efficiency and an optical adhesive material applicable to the display device can be provided.

[0054] According to the embodiments of the present disclosure, a display device capable of having a foldable property while ensuring excellent optical characteristics, and an optical adhesive material applicable to the display device can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] Figure 1 is a diagram for explaining a display device according to an embodiment.

[0056] Figure 2 is a schematic plan view showing a display device according to an embodiment.

[0057] Figure 3 is a schematic cross-sectional view for explaining a stacked structure of a display device according to an embodiment.

[0058] Figure 4 is a schematic cross-sectional view showing a display portion according to an embodiment.

[0059] Figure 5 is a schematic cross-sectional view showing a sensor portion according to the embodiment.

[0060] Figure 6 is a schematic plan view showing a sensing electrode according to an embodiment.

[0061] Figure 7 Shown along Figure 6 A~A' schematic cross-sectional structure and along Figure 6 The cross-sectional structure of B~B'.

[0062] Figure 8 is a schematic cross-sectional view showing a display device according to an embodiment. DETAILED DESCRIPTION

[0063] The present disclosure can implement multiple changes and can have various forms, and specific embodiments will be exemplified in the drawings and described in detail herein. However, this is not intended to limit the present disclosure to a specific disclosed form, but should be understood to include all changes, equivalents and substitutes included in the thought and technical scope of the present disclosure.

[0064] The terms first, second, etc. can be used to describe a variety of constituent elements, but the constituent elements are not limited by the terms. The terms are used only for the purpose of distinguishing one constituent element from another constituent element. For example, without departing from the scope of the present disclosure, the first constituent element can be named as the second constituent element, and similarly, the second constituent element can also be named as the first constituent element. Unless clearly indicated differently in the context, the singular expression includes the plural expression.

[0065] It should be understood that the terms "including" or "having" and the like in the present disclosure are intended to specify the presence of features, numbers, steps, operations, constituent elements, parts or combinations thereof recorded in the specification, rather than excluding in advance the presence or possibility of addition of one or more other features, numbers, steps, operations, constituent elements, parts or combinations thereof. In addition, in the case where a portion referred to as a layer, film, region, plate, etc. is "on" another portion, it includes not only the case where it is "directly on" another portion, but also the case where there is another portion between them. In addition, in the present specification, in the case where a portion referred to as a layer, film, region, plate, etc. is formed "on" another portion, the direction of formation is not limited to the upper direction, but includes the case where it is formed in the side or lower direction. On the contrary, in the case where a portion referred to as a layer, film, region, plate, etc. is "under" another portion, it includes not only the case where it is "directly under" another portion, but also the case where there is another portion between them.

[0066] The present disclosure relates to a display device and an optical bonding material. A display device and an optical bonding material according to an embodiment will be described below with reference to the accompanying drawings.

[0067] 1. Display device

[0068] Figure 1 is a diagram for explaining a display device according to an embodiment. Figure 2 is a schematic plan view showing a display device according to an embodiment. Figure 3 is a schematic cross-sectional view for explaining a stacked structure of a display device according to an embodiment.

[0069] Reference Figures 1 to 3 , the display device DD is configured to provide (or emit) light.

[0070] According to the embodiment, the display device DD may be applicable to various devices, and the applicable devices are not limited to specific examples.

[0071] According to an embodiment, the display device DD may be a flexible display device. For example, the display device DD may be one or more of a rollable display device, a bendable display device, a curved display device, and a foldable display device. For example, the display device DD may also be folded along a bending line BL. According to an embodiment, the bending line BL may extend in the second direction DR2. The number and position of the bending lines BL are not particularly limited.

[0072] The display device DD may include a panel PNL and a driving circuit part DV for driving the panel PNL. The display device DD may further include a peripheral part OUP.

[0073] The panel PNL may include a display part DP for displaying an image, and a sensor part TSP which may sense a user input (eg, a touch input).

[0074] The display part DP may be referred to as a display panel or a display layer. The sensor part TSP may be referred to as a sensing panel, a sensor layer, or a sensing layer.

[0075] The panel PNL may include a sub-pixel SPX and a sensing electrode SP. According to an embodiment, the sub-pixel SPX may display an image in a display frame interval unit. The sensing electrode SP may sense a user's input (e.g., a touch input) in a sensing frame interval unit. The sensing frame interval and the display frame interval may be independent of each other, or may be different from each other. The sensing frame interval and the display frame interval may also be synchronized with each other, or may not be synchronized.

[0076] The sensor part TSP including the sensing electrode SP may obtain information about the user's touch input. According to an embodiment (e.g., a mutual capacitance method), the sensing electrode SP may include a first sensing electrode SP1 providing a first sensing signal and a second sensing electrode SP2 providing a second sensing signal. According to an embodiment, the first sensing electrode SP1 may be a transmitter (Tx) pattern electrode, and the second sensing electrode SP2 may be a receiver (Rx) pattern electrode. Information about the touch input (or touch event) may mean information including the position of the touch that the user wants to provide, etc.

[0077] However, the present disclosure is not limited thereto. For example, according to an embodiment (eg, a self-capacitive method), the sensing electrode SP may also be composed of one type of sensing electrode without distinguishing between the first sensing electrode SP1 and the second sensing electrode SP2.

[0078] The driving circuit part DV may include a display driving part DDV for driving the display part DP and a sensor driving part SDV for driving the sensor part TSP.

[0079] The display part DP may include a first base layer BS1 and a sub-pixel SPX provided on the first base layer BS1. The sub-pixel SPX may be arranged in the display area DA. The first base layer BS1 may be a display base layer.

[0080] The first base layer BS1 (or the display device DD) may include a display area DA displaying an image and a non-display area NDA as an outer area of ​​the display area DA. According to an embodiment, the display area DA may be arranged in a central area of ​​the display part DP, and the non-display area NDA may be arranged adjacent to the periphery of the display area DA.

[0081] The first base layer BS1 may be a base substrate or a base component for supporting the display device DD. The first base layer BS1 may be a rigid substrate made of glass. Alternatively, the first base layer BS1 may include a silicon wafer. Alternatively, the first base layer BS1 may be a flexible substrate that can be bent, folded, rolled, etc. In this case, the first base layer BS1 may include an insulating substance such as a polymer resin of polyimide. However, the present disclosure is not particularly limited thereto.

[0082] The display area DA may be provided with a scan line SL, a data line DL, and a sub-pixel SPX connected to the scan line SL and the data line DL. The sub-pixel SPX may be configured to be selected by a scan signal of a conduction level supplied from the scan line SL to receive a data signal from the data line DL and emit light of a brightness corresponding to the data signal. Thus, an image corresponding to the data signal is displayed in the display area DA. However, in the present disclosure, the structure and driving method of the sub-pixel SPX are not particularly limited.

[0083] Various wirings and / or built-in circuits connected to the sub-pixels SPX of the display area DA may be arranged in the non-display area NDA. For example, a plurality of wirings for supplying various power supplies and control signals to the display area DA may be arranged in the non-display area NDA.

[0084] The display unit DP can output visual information (as an example, an image). According to an embodiment, the type / kind of the display unit DP is not particularly limited. For example, the display unit DP can be implemented as a self-luminous type display panel such as an organic light emitting display panel (Organic Light Emitting Display Panel). However, when the display unit DP is implemented as a self-luminous type, each pixel is not necessarily limited to a case including only organic light-emitting devices. For example, the light-emitting device of each pixel can be formed as an organic light emitting device (organic light emitting diode), an inorganic light-emitting device (inorganic light emitting diode) or a quantum dot / well light emitting device (quantum dot / well light emitting diode), etc. According to an embodiment, the display unit DP can also be implemented as a non-luminous type display panel such as a liquid crystal display panel (Liquid Crystal Display Panel). In the case where the display unit DP is implemented as a non-luminous type, the display device DD may be additionally provided with a light source such as a backlight unit (Back-light Unit).

[0085] For the convenience of description, the following description will be based on an embodiment in which the display portion DP is implemented as an organic light emitting display panel.

[0086] The sensor part TSP includes a second base layer BS2 and a plurality of sensing electrodes SP formed on the second base layer BS2. The sensing electrodes SP may be arranged in a sensing area SA on the second base layer BS2. The second base layer BS2 may be a sensor base layer.

[0087] The second base layer BS2 (or the display device DD) may include a sensing area SA that can sense a touch input, etc., and a non-sensing area NSA around the sensing area SA. According to an embodiment, the sensing area SA may be arranged to overlap at least a portion of the display area DA. For example, the sensing area SA may be set to an area corresponding to the display area DA (e.g., an area overlapping the display area DA), and the non-sensing area NSA may be set to an area corresponding to the non-display area NDA (e.g., an area overlapping the non-display area NDA). In this case, when a touch input, etc. is provided on the display area DA, the touch input may be detected by the sensor portion TSP.

[0088] The second base layer BS2 may include one or more insulating layers (eg, the first insulating layer INS1 (see Figure 5)). For example, a first insulating layer INS1 for forming the second base layer BS2 may be disposed on the display part DP to form a base for forming the sensing electrode SP. However, an example for forming the second base layer BS2 is not particularly limited.

[0089] The sensing area SA is set as an area that can react to a touch input (ie, an effective area of ​​a sensor). To this end, a sensing electrode SP for sensing a touch input or the like may be arranged in the sensing area SA.

[0090] The sensor part TSP may obtain information about an input provided from a user. The sensor part TSP may recognize a touch input. The sensor part TSP may recognize a touch input using a capacitive sensing method. The sensor part TSP may sense a touch input by a mutual capacitance method or by a self-capacitance method.

[0091] According to an embodiment, each first sensing electrode SP1 may extend in the first direction DR1. The first sensing electrodes SP1 may be arranged in the second direction DR2. The second direction DR2 may be different from the first direction DR1. For example, the second direction DR2 may be a direction orthogonal to the first direction DR1.

[0092] According to an embodiment, each of the second sensing electrodes SP2 may extend in the second direction DR2. The second sensing electrodes SP2 may be arranged in the first direction DR1.

[0093] According to an embodiment, the first sensing electrode SP1 and the second sensing electrode SP2 may have the same (e.g., substantially the same) shape as each other. For example, the first sensing electrode SP1 as a transmitter pattern and the second sensing electrode SP2 as a receiver pattern may have corresponding shapes (e.g., substantially the same shape), and thus, the sensing performance of the touch event may be uniformly set within the sensing area SA.

[0094] In addition, a sensing line for electrically connecting the sensing electrode SP with the sensor driving part SDV and the like may be arranged in the non-sensing area NSA of the sensor part TSP.

[0095] The driving circuit part DV may include a display driving part DDV for driving the display part DP and a sensor driving part SDV for driving the sensor part TSP.

[0096] The display driving part DDV is configured to be electrically connected to the display part DP to drive the sub-pixel SPX. The sensor driving part SDV is configured to be electrically connected to the sensor part TSP to drive the sensor part TSP.

[0097] The peripheral portion OUP may be arranged at a substantially periphery of the display device DD. The peripheral portion OUP may be arranged on the sensor portion TSP. Light provided from the display portion DP may pass through the peripheral portion OUP and be output to the outside. According to an embodiment, the peripheral portion OUP may include a window portion WD (refer to Figure 5 According to an embodiment, the peripheral part OUP may further include a polarization layer POL (refer to Figure 5 ). However, the present disclosure is not limited thereto. The peripheral portion OUP may also further include a color filter layer that selectively transmits light of one color.

[0098] The outer periphery OUP may be referred to as an outer optical layer or an upper layer.

[0099] Next, refer to Figure 4 An embodiment of the display portion DP will be described. Figure 4 is a schematic cross-sectional view showing a display portion according to an embodiment.

[0100] Reference Figure 4 , the display part DP may include a pixel circuit layer PCL and a light emitting device layer LEL.

[0101] The pixel circuit layer PCL may include a pixel circuit PXC for driving the light emitting device LD. The pixel circuit layer PCL may include a first base layer BS1, a conductive layer for forming the pixel circuit PXC, and an insulating layer disposed between the conductive layers.

[0102] The pixel circuit PXC may include a circuit device including a transistor. The pixel circuit PXC may include a driving transistor. The pixel circuit PXC may be electrically connected to the light emitting device LD to provide an electrical signal for causing the light emitting device LD to emit light.

[0103] The light emitting device layer LEL may be disposed on the pixel circuit layer PCL. According to an embodiment, the light emitting device layer LEL may include a light emitting device LD, a pixel defining layer PDL, and an encapsulation layer TFE.

[0104] The light emitting device LD may be arranged on the pixel circuit layer PCL. According to an embodiment, the light emitting device LD may include a first electrode ELT1, a light emitting layer EL, and a second electrode ELT2. According to an embodiment, the light emitting layer EL may be arranged in a region defined by a pixel defining film PDL. The pixel defining film PDL may be adjacent to the periphery of the light emitting layer EL. One side of the light emitting layer EL may be electrically connected to the first electrode ELT1, and the other side of the light emitting layer EL may be electrically connected to the second electrode ELT2.

[0105] The first electrode ELT1 may be an anode electrode for the light emitting layer EL, and the second electrode ELT2 may be a common electrode (or cathode electrode) for the light emitting layer EL. According to an embodiment, the first electrode ELT1 and the second electrode ELT2 may include a conductive substance. For example, the first electrode ELT1 may include a conductive substance having a reflective property, and the second electrode ELT2 may include a transparent conductive substance. However, the present disclosure is not limited thereto.

[0106] The light emitting layer EL may have a multi-layer thin film structure including a light generation layer. The light emitting layer EL may include a hole injection layer for injecting holes, a hole transport layer for excellent hole transportability and for suppressing the movement of uncombined electrons in the light generation layer to increase the chance of recombination of holes and electrons, a light generation layer for generating light by recombination of injected electrons and holes, a hole blocking layer for suppressing the movement of uncombined holes in the light generation layer, an electron transport layer for smoothly transporting electrons to the light generation layer, and an electron injection layer for injecting electrons. The light emitting layer EL may emit light based on an electrical signal provided from the first electrode ELT1 and the second electrode ELT2.

[0107] The light emitting layer EL may form a sub-pixel SPX. The light emitting layer EL may form a sub-pixel region SPXA that emits light of one color. When viewed on a plane, the region of the light emitting layer EL and the sub-pixel region SPXA may correspond to each other. For example, each of the light emitting layers EL may correspond to each of the sub-pixel regions SPXA.

[0108] According to an embodiment, the light emitting layer EL may emit light of one color. For example, the sub-pixel SPX may include a first sub-pixel providing light of a first color (e.g., red), a second sub-pixel providing light of a second color (e.g., green), and a third sub-pixel providing light of a third color (e.g., blue). The sub-pixel region SPXA may include a first sub-pixel region formed by a first sub-pixel and for the first color to be observed, a second sub-pixel region formed by a second sub-pixel and for the second color to be observed, and a third sub-pixel region formed by a third sub-pixel and for the third color to be observed. According to an embodiment, the light emitting layer EL may provide light of different colors from each other from the first sub-pixel to the third sub-pixel. For example, the light emitting layer EL may include a first light emitting layer included in a first sub-pixel and providing light of a first color, a second light emitting layer included in a second sub-pixel and providing light of a second color, and a third light emitting layer included in a third sub-pixel and providing light of a third color. However, the present disclosure is not limited thereto. For example, the light emitting layer EL may emit light of the same color from each of the first to third sub-pixels, and the display device DD may also further include a quantum dot layer and / or a color filter layer to implement a full-color display device structure.

[0109] The pixel definition film PDL may be arranged on the pixel circuit layer PCL to define the position where the light emitting layer EL is arranged. According to an embodiment, the pixel definition film PDL may include an inorganic material. However, the present disclosure is not limited thereto. The pixel definition film PDL may also include an organic material.

[0110] The encapsulation layer TFE may be arranged on the light emitting device LD. The encapsulation layer TFE may offset the step generated by the light emitting device LD and the pixel defining film PDL. The encapsulation layer TFE may include a plurality of insulating films covering the light emitting device LD. According to an embodiment, the encapsulation layer TFE may have a structure in which an inorganic film and an organic film are alternately stacked. According to an embodiment, the encapsulation layer TFE may be a thin film encapsulation layer.

[0111] Next, refer to Figures 5 to 7 The sensor portion TSP and the peripheral portion OUP arranged on the display portion DP will be described.

[0112] Figure 5 is a schematic cross-sectional view showing a sensor portion according to the embodiment. Figure 6 is a schematic plan view showing a sensing electrode according to an embodiment. Figure 6 A schematic plan structure showing a region where the first sensing electrode SP1 and the second sensing electrode SP2 are adjacent to each other is illustrated. Figure 7 is a schematic cross-sectional view showing a sensor part TSP and a peripheral part OUP according to the embodiment. Figure 7 Shown along Figure 6 The schematic cross-sectional structure of A to A' and the Figure 6The cross-sectional structure of B~B'.

[0113] Reference Figures 5 to 7 , the sensor part TSP may be arranged on the display part DP (e.g., the encapsulation layer TFE). The sensor part TSP may include a first insulating layer INS1, a first conductive pattern layer CP1, a second insulating layer INS2, a second conductive pattern layer CP2, a protective layer PVX, and an optical adhesive layer PSA. According to an embodiment, the optical adhesive layer PSA may include an optical adhesive material and may be referred to as an "optical adhesive material PSA".

[0114] According to an embodiment, the first conductive pattern layer CP1 and the second conductive pattern layer CP2 may be patterned in a region to form a sensing electrode SP. For example, a portion of the first conductive pattern layer CP1 may constitute the first sensing electrode SP1, and a portion of each of the first conductive pattern layer CP1 and the second conductive pattern layer CP2 may form the second sensing electrode SP2. Alternatively, a portion of the second conductive pattern layer CP2 may constitute the first sensing electrode SP1, and a portion of each of the first conductive pattern layer CP1 and the second conductive pattern layer CP2 may form the second sensing electrode SP2. However, the present disclosure is not limited thereto.

[0115] The first insulating layer INS1 may be disposed on the encapsulation layer TFE. The first insulating layer INS1 may form the second base layer BS2 to provide a region where the first conductive pattern layer CP1, the second insulating layer INS2, the second conductive pattern layer CP2, and the protective layer PVX are disposed.

[0116] The first conductive pattern layer CP1 may be disposed on the first insulating layer INS1. The second conductive pattern layer CP2 may be disposed on the second insulating layer INS2. The first conductive pattern layer CP1 and the second conductive pattern layer CP2 may be spaced apart from each other via the second insulating layer INS2.

[0117] The first conductive pattern layer CP1 and the second conductive pattern layer CP2 may include a single layer or multiple layers of metal layers. The first conductive pattern layer CP1 and the second conductive pattern layer CP2 may include at least one of a plurality of metal substances such as gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), platinum (Pt), etc., or alloys thereof. According to an embodiment, the first conductive pattern layer CP1 and the second conductive pattern layer CP2 may include at least one of a plurality of transparent conductive materials including silver nanowire (AgNW), indium tin oxide (ITO, Indium Tin Oxide), indium zinc oxide (IZO, Indium Zinc Oxide), indium gallium zinc oxide (IGZO, IndiumGallium Zinc Oxide), antimony zinc oxide (AZO, Antimony Zinc Oxide), indium tin zinc oxide (ITZO, IndiumTin Zinc Oxide), zinc oxide (ZnO, Zinc Oxide), tin oxide (SnO2, Tin Oxide), carbon nanotube (CarbonNano Tube) and graphene.

[0118] The second insulating layer INS2 may be disposed on the first conductive pattern layer CP1. The second insulating layer INS2 may be interposed between the first conductive pattern layer CP1 and the second conductive pattern layer CP2. The protection layer PVX may be disposed on the second conductive pattern layer CP2.

[0119] The first insulating layer INS1 may include one or more of an inorganic material and an organic material. The second insulating layer INS2 may include one or more of an inorganic material and an organic material. The inorganic material may include one or more of a cluster of silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiOxNy), and aluminum oxide (AlOx). The organic material may include one or more of a cluster of acrylic resin, epoxy resin, phenol resin, polyamide resin, and polyimide resin. However, the present disclosure is not limited thereto.

[0120] The sensing electrode SP may include a cell C and a bridge BRD. The cell C may have a relatively wide area, and the bridge BRD may have a relatively small area. The cells C adjacent to each other may be electrically connected by the bridge BRD. The cell C may include a first cell C1 and a second cell C2. The bridge BRD may include a first bridge BRD1 and a second bridge BRD2.

[0121] According to an embodiment, the first unit C1 and the second unit C2 may be formed by the second conductive pattern layer CP2. The first bridge BRD1 may be formed by the first conductive pattern layer CP1. A portion of the second bridge BRD2 may be formed by the first conductive pattern layer CP1, and another portion of the second bridge BRD2 may be formed by the second conductive pattern layer CP2.

[0122] However, the present disclosure is not necessarily limited thereto. For example, the first unit C1 and the second unit C2 may be formed by the first conductive pattern layer CP1. The first bridge BRD1 may be formed by the second conductive pattern layer CP2. A portion of the second bridge BRD2 may be formed by the second conductive pattern layer CP2, and another portion of the second bridge BRD2 may be formed by the first conductive pattern layer CP1.

[0123] According to an embodiment, the sensing electrode SP may have a mesh structure. The cell C and the bridge BRD may have a mesh structure. For example, the second conductive pattern layer CP2 for forming the sensing electrode SP may be patterned according to the mesh structure. As the sensing electrode SP has a mesh structure, the capacitance that may be formed with other electrodes arranged at the lower portion of the cell C may be reduced.

[0124] The first sensing electrode SP1 may have a structure in which a first cell C1 having a relatively wide area and a first bridge BRD1 having a relatively narrow area are connected. For example, the first cell C1 may include a 1-1th cell C1-1 and a 1-2th cell C1-2, and the first bridge BRD1 may electrically connect the 1-1th cell C1-1 and the 1-2th cell C1-2.

[0125] The second sensing electrode SP2 may have a structure in which a second cell C2 having a relatively wide area and a second bridge BRD2 having a relatively narrow area are connected. For example, the second cell C2 may include a 2-1st cell C2-1 and a 2-2nd cell C2-2, and the second bridge BRD2 may electrically connect the 2-1st cell C2-1 and the 2-2nd cell C2-2.

[0126] According to an embodiment, the first bridge BRD1 may be electrically connected to the 1-1th cell C1-1 through one contact CNT, and may be electrically connected to the 1-2th cell C1-2 through another contact CNT. Thus, the first bridge BRD1 arranged in a layer different from the first cell C1 may electrically connect the 1-1th cell C1-1 and the 1-2th cell C1-2 through the contact CNT. According to an embodiment, the contact CNT may penetrate the second insulating layer INS2.

[0127] The first cell C1 and the second cell C2 may have a rhombus shape as a whole. However, the shapes of the first cell C1 and the second cell C2 are not particularly limited thereto. For example, the first cell C1 and the second cell C2 may also have a quadrilateral shape as a whole.

[0128] The first sensing electrode SP1 and the second sensing electrode SP2 may be adjacent to each other across a dividing line SEL. The dividing line SEL may be an imaginary line arranged in a region between the first sensing electrode SP1 and the second sensing electrode SP2. For example, the dividing line SEL may be arranged between the 1-1th cell C1-1 and the 1-2th cell C1-2. The dividing line SEL may be arranged between the second bridge BRD2 and the 1-1th cell C1-1 and the 1-2th cell C1-2.

[0129] The optical adhesive layer PSA may be disposed on the protective layer PVX. For example, the optical adhesive layer PSA may be directly disposed on the protective layer PVX. When viewed on a plane, the optical adhesive layer PSA may be disposed across the sub-pixel area SPXA.

[0130] The optical adhesive layer PSA may bond other configurations of the sensor part TSP with the peripheral part OUP. For example, the layers of the display device DD may be sequentially arranged on the display part DP, and the optical adhesive layer PSA may bond other adjacent layers. The optical adhesive layer PSA may be directly adjacent to the lowermost portion of the peripheral part OUP.

[0131] According to an embodiment, the optical adhesive layer PSA may have a thickness thicker than that of the protective layer PVX.

[0132] The optical adhesive layer PSA may transmit applied light. The optical adhesive layer PSA may define a light path.

[0133] The optical adhesive layer PSA may form an interface with the protective layer PVX. According to an embodiment, light provided from the display part DP (eg, the light emitting device LD) may be refracted in the interface between the optical adhesive layer PSA and the protective layer PVX, and the display device DD may provide the light to the outside along a desired path. Figure 8 This will be described later.

[0134] The peripheral part OUP may be disposed on the sensor part TSP (eg, the optical adhesive layer PSA). For example, the peripheral part OUP may be directly disposed on the optical adhesive layer PSA.

[0135] According to an embodiment, the peripheral portion OUP may include a polarization layer POL, a transparent adhesive layer OCA, and a window portion WD.

[0136] The polarizing layer POL may be disposed on the optical adhesive layer PSA. The polarizing layer POL may be in contact with the optical adhesive layer PSA.

[0137] The polarization layer POL may be configured to polarize the applied light. According to an embodiment, the polarization layer POL may include a λ / 4 phase difference film. According to an embodiment, the polarization layer POL may include an absorption polarization layer, and may also include a reflective polarization layer (e.g., a wire grid polarization layer). However, the present disclosure is not limited thereto.

[0138] The transparent adhesive layer OCA may include an optically clear adhesive (OCA) material known in the art, and is not limited to any particular example.

[0139] A transparent adhesive layer OCA may be disposed between the polarization layer POL and the window portion WD. The transparent adhesive layer OCA may bond the polarization layer POL and the window portion WD.

[0140] The window portion WD may be disposed at the periphery of the display device DD and may transmit light. The window portion WD may protect other layers of the display device DD.

[0141] Next, refer to Figure 8 A light path defined in the display device DD according to the embodiment will be described. Contents overlapping with the aforementioned contents will be briefly described or omitted.

[0142] Figure 8 is a schematic cross-sectional view showing a display device according to an embodiment. Figure 8 The optical path of the light provided by the light emitting layer EL is schematically shown. For example, an exemplary optical path of the light provided by the light emitting layer EL is indicated by an arrow.

[0143] Figure 8 A portion of the second conductive pattern layer CP2 is shown to form a structure of a unit C, and for the convenience of explanation, an area where the first conductive pattern layer CP1 is not arranged is shown. Figure 8 The display portion DP is briefly shown. For example, Figure 8 The light emitting layer EL and the encapsulation layer TFE arranged on the pixel circuit layer PCL are shown, and the illustration of the partial configuration of the first electrode ELT1 and the second electrode ELT2, etc. is omitted. For the convenience of explanation, Figure 8 The outer peripheral part OUP is not shown. The applied light may be transmitted through the outer peripheral part OUP and emitted to the outside.

[0144] Reference Figure 8 , light provided by the light emitting layer EL may be transmitted through the optical adhesive layer PSA and provided to the outside of the display device DD along an optical path.

[0145] When viewed on a plane, the light emitting layer EL may be arranged in the sub-pixel area SPXA. When viewed on a plane, the light emitting layer EL may be arranged to correspond to the area where the sub-pixel SPX is viewed. When viewed on a plane, the light emitting layer EL may not overlap with the protective layer PVX. When viewed on a plane, the light emitting layer EL may be arranged in the opening OPN. When viewed on a plane, the light emitting layer EL may overlap with the opening OPN.

[0146] The protective layer PVX may be arranged in a partial area on the second insulating layer INS2. The protective layer PVX may cover the second conductive pattern layer CP2 as a whole. When viewed on a plane, the protective layer PVX may surround an area and may form an opening OPN. The opening OPN may correspond to the sub-pixel SPX (e.g., the sub-pixel area SPXA).

[0147] The protective layer PVX may be in contact with the optical adhesive layer PSA. According to an embodiment, the interface formed by the protective layer PVX and the optical adhesive layer PSA may extend in an oblique direction (e.g., a direction different from the third direction DR3). When viewed on a plane, as a part of the protective layer PVX, the end portion directly adjacent to the opening OPN may not overlap with the light-emitting layer EL.

[0148] The protective layer PVX may include an organic material. For example, the protective layer PVX may include one or more of a group consisting of acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, methacrylic resin, polyisoprene, vinyl resin, urethane resin, cellulose resin, siloxane resin, and perylene resin. However, the present disclosure is not limited thereto.

[0149] The protective layer PVX may have a refractive index (eg, a first refractive index) smaller than that of the optical adhesive layer PSA. For example, the refractive index of the protective layer PVX may be in the range of 1.45 to 1.56. According to an embodiment, the protective layer PVX may have a refractive index of about 1.54. However, the present disclosure is not limited thereto.

[0150] The optical adhesive layer PSA may entirely cover the protective layer PVX, and at least a portion of the optical adhesive layer PSA may be disposed within the opening OPN. The optical adhesive layer PSA may be an adhesive layer, and may be an optical layer forming an interface with the protective layer PVX to change a light path.

[0151] The optical bonding layer PSA may have a refractive index (e.g., a second refractive index) greater than that of the protective layer PVX. For example, the refractive index of the optical bonding layer PSA may be in the range of 1.56 to 1.7. Alternatively, the refractive index of the optical bonding layer PSA may be in the range of 1.56 to 1.68. According to an embodiment, the optical bonding layer PSA may have a refractive index of about 1.58. According to an embodiment, the optical bonding layer PSA may have a refractive index of about 1.60. However, the present disclosure is not limited thereto.

[0152] According to an embodiment, a portion of the light provided by the light emitting layer EL may be transmitted through the optical adhesive layer PSA without passing through the protective layer PVX. For example, when viewed on a plane, the light emitting layer EL may substantially overlap with the opening OPN defined without the protective layer PVX, and the light emitted by the light emitting layer EL may be transmitted through the optical adhesive layer PSA through the opening OPN to be observed on the front side of the display device DD.

[0153] According to an embodiment, a portion of the light provided by the light-emitting layer EL may be totally reflected from the interface between the protective layer PVX and the optical bonding layer PSA and transmitted through the optical bonding layer PSA. For example, as at least a portion of the light emitted by the light-emitting layer EL, a portion generally toward the oblique direction (for example, a direction different from the third direction DR3) may be provided to the interface between the protective layer PVX and the optical bonding layer PSA. At this time, due to the refractive index difference between the protective layer PVX and the optical bonding layer PSA, the provided light may be totally reflected and guided toward the display direction (for example, the third direction DR3) of the display device DD. Thereby, the luminous efficiency of the light-emitting device LD may be improved, and the power consumed for realizing an image of the same brightness may be reduced. That is, according to an embodiment, a display device DD with improved light extraction efficiency may be provided.

[0154] According to an embodiment, the optical adhesive layer PSA may be configured as a single layer. For example, the optical adhesive layer PSA may not include a separate layer and may include a structure in which materials are substantially uniformly distributed. Thus, the process steps may be simplified and the process cost may be reduced.

[0155] According to embodiments, the optical adhesive layer PSA may include a first base resin (eg, a first monomer), a second base resin (eg, a second monomer) different from the first base resin, an organic additive, and inorganic particles.

[0156] The first base resin may be an aliphatic monomer. The first base resin may be an aliphatic acrylate containing an aliphatic substituent (e.g., an aliphatic methacrylate). The type of the first base resin is not particularly limited, but according to an embodiment, the first base resin may include an aliphatic acrylate containing an alkyl group having a carbon number of 1 to 30, 1 to 20, or 1 to 10.

[0157] In the present specification, the alkyl group may be linear, branched or cyclic. The carbon number of the alkyl group is 1 to 50, 1 to 30, 1 to 20, 1 to 10 or more, or 1 to 6. Examples of the alkyl group include methyl, ethyl, n-propyl, isopropyl, n-butyl, sec-butyl, tert-butyl, isobutyl, 2-ethylbutyl, 3,3-dimethylbutyl, n-pentyl, isopentyl, neopentyl, tert-pentyl, cyclopentyl, 1-methylpentyl, 3-methylpentyl, 2-ethylpentyl, 4-methyl-2-pentyl, n-hexyl, 1-methylhexyl, 2-ethylhexyl, 2-butylhexyl, cyclohexyl, 4-methylcyclohexyl, 4-tert-butylcyclohexyl, n-heptyl, 1-methylheptyl, 2,2-dimethylheptyl, 2-ethylheptyl, 2-butylheptyl, n-octyl, tert-octyl, 2-ethyloctyl, 2-butyloctyl, 2-hexyloctyl, 3,7-dimethyloctyl, cyclooctyl, n-nonyl, n-decyl, adamantyl, 2-ethyldecyl, and 2-butyldecyl. , 2-hexyldecyl, 2-octyldecyl, n-undecyl, n-dodecyl, 2-ethyldodecyl, 2-butyldodecyl, 2-hexyldodecyl, 2-octyldodecyl, n-tridecyl, n-tetradecyl, n-pentadecyl, n-hexadecyl, 2-ethylhexadecyl, 2-butylhexadecyl, 2-hexylhexadecyl, 2-octylhexadecyl, n-heptadecyl, n-octadecyl, n-nonadecyl, n-eicosyl, 2-ethyleicosyl, 2-butyleicosyl, 2-hexyleicosyl, 2-octyleicosyl, n-heneicosyl, n-docosyl, n-tricosyl, n-tetracosyl, n-pentacosyl, n-hexacosyl, n-heptacosyl, n-octacosyl, n-nonacosyl and n-triacontyl, but are not limited thereto.

[0158] The first base resin may include a resin formed from an aliphatic monomer (or oligomer). For example, the first base resin may include an aliphatic acrylate. In this case, the entanglement between the chains forming the first base resin may increase and the modulus value of the optical adhesive layer PSA may decrease, so the flexibility of the display device DD may be improved. Thus, according to the embodiment, the display device DD may be appropriately set as a flexible device.

[0159] The first base resin may be contained in an amount of 30 wt % or less relative to the total weight of the optical bonding layer PSA. For example, the first base resin may be contained in a range of 10 wt % to 30 wt % relative to the total weight of the optical bonding layer PSA. For example, the first base resin may be contained in a range of 10 wt % to 20 wt % relative to the total weight of the optical bonding layer PSA.

[0160] In the present specification, the physical amount (eg, weight ratio, elastic modulus, etc.) of the compound contained in the optical adhesive layer PSA may be defined based on the physical amount of the target optical adhesive layer or the target optical adhesive material.

[0161] According to an embodiment, the first base resin may be represented by any one of Chemical Formula 1 to Chemical Formula 6.

[0162] [Chemical formula 1]

[0163]

[0164] [Chemical formula 2]

[0165]

[0166] [Chemical formula 3]

[0167]

[0168] [Chemical formula 4]

[0169]

[0170] [Chemical formula 5]

[0171]

[0172] [Chemical formula 6]

[0173]

[0174] In Chemical Formula 5 and Chemical Formula 6, n may be an integer of 1 to 20 independently.

[0175] According to an embodiment, the glass transition temperature (Tg) of the first base resin may be -10° C. or less. For example, the glass transition temperature of the first base resin may be -20° C. or less. By making the glass transition temperature of the first base resin satisfy the aforementioned numerical range, excellent flexibility and processability may be achieved, and the durability of the display device DD may be improved.

[0176] The second base resin may be an aromatic monomer. The second base resin may be an aromatic acrylate containing an aromatic substituent (e.g., an aromatic methacrylate). The type of the second base resin is not particularly limited, but according to an embodiment, the second base resin may be an aromatic acrylate containing an aromatic group having a ring carbon number of 6 to 30, 6 to 20, or 6 to 10.

[0177] In this specification, aryl means any functional group or substituent derived from an aromatic hydrocarbon ring. The aryl group may be a monocyclic aryl group or a polycyclic aryl group. The ring carbon number of the aryl group may be 6 or more and 30 or less, 6 or more and 20 or less, or 6 or more and 15 or less. Examples of aryl groups include phenyl, naphthyl, fluorenyl, anthracenyl, phenanthrenyl, biphenyl, terphenyl, quaterphenyl, quinquephenyl, sexiphenyl, triphenylene, pyrenyl, benzofluoranthenyl, chrysene, etc., but are not limited thereto.

[0178] The second base resin may include a resin formed from an aromatic monomer (or oligomer). For example, the second base resin may include an aromatic acrylate. In this case, the second base resin may be configured to include an aromatic substituent having a large molar refractive index, and thus the optical adhesive layer PSA may be configured to have a relatively large refractive index (e.g., a range of 1.56 to 1.7).

[0179] The second base resin may be included in an amount of 65 wt % or less relative to the total weight of the optical bonding layer PSA. For example, the second base resin may be included in an amount ranging from 40 wt % to 65 wt % relative to the total weight of the optical bonding layer PSA.

[0180] According to an embodiment, the second base resin may be represented by any one of Chemical Formula 7 to Chemical Formula 12.

[0181] [Chemical formula 7]

[0182]

[0183] [Chemical formula 8]

[0184]

[0185] [Chemical formula 9]

[0186]

[0187] [Chemical formula 10]

[0188]

[0189] [Chemical formula 11]

[0190]

[0191] [Chemical formula 12]

[0192]

[0193] In Chemical Formula 9 and Chemical Formula 10, n may be an integer of 0 to 6 independently.

[0194] According to an embodiment, the optical adhesive layer PSA may include the first base resin and the second base resin at the same time, so that the display device DD has excellent optical characteristics while satisfying the foldable characteristics. The foldable characteristics may mean that even if bending or folding stress is applied to the display device DD, the risk of physical defects such as cracks is low.

[0195] The organic additive may be a plasticizer. According to an embodiment, the organic additive may include xylene resin and / or sulfide-based aromatic organic material.

[0196] The xylene resin can improve the adhesive force of the optical adhesive layer PSA and can perform a plasticizer role. The sulfide-based aromatic organic material can also improve the plasticity to be excellent when the optical adhesive layer PSA has a high refractive property.

[0197] The xylene resin may be included in a range of 15 wt % to 25 wt % with respect to the total weight of the optical adhesive layer PSA.

[0198] According to an embodiment, the xylene resin may be represented as Chemical Formula 13 below.

[0199] [Chemical formula 13]

[0200]

[0201] In Chemical Formula 13, n may be an integer of 0 to 100.

[0202] The sulfide-based aromatic organic material may be included in an amount ranging from 10 wt % to 20 wt % with respect to the total weight of the optical adhesive layer PSA.

[0203] According to an embodiment, the sulfide-based aromatic organic material may be expressed as any one of Chemical Formula 14 and Chemical Formula 15 below.

[0204] [Chemical formula 14]

[0205]

[0206] [Chemical formula 15]

[0207]

[0208] The inorganic particles may include metal oxides. For example, the metal oxide may be an oxide of one or more metals selected from the group consisting of titanium (Ti), zirconium (Zr), aluminum (Al), indium (In), zinc (Zn), tin (Sn), and antimony (Sb). For example, the inorganic particles may include zirconium oxide (ZrOx: for example, ZrO 2 ) and titanium oxides (TiOx: e.g., TiO 2 )

[0209] The inorganic particles may be included in an amount of 2 wt % or less relative to the total weight of the optical bonding layer PSA. For example, the inorganic particles may be included in a range of 1.0 wt % to 2.0 wt % relative to the total weight of the optical bonding layer PSA. Alternatively, the inorganic particles may be included in a range of 1.3 wt % to 1.9 wt % relative to the total weight of the optical bonding layer PSA. Alternatively, the inorganic particles may be included in a range of 1.32 wt % to 1.84 wt % relative to the total weight of the optical bonding layer PSA.

[0210] According to an embodiment, the content of the inorganic particles may be analyzed by a thermogravimetric analyzer (TGA) or a wavelength dispersive X-ray fluorescence (WDXRF) spectroscopy.

[0211] According to an embodiment, the optical bonding layer PSA may further include inorganic particles to control the refractive index value range of the optical bonding layer PSA. For example, the optical bonding layer PSA may include a first base resin to improve the flexibility of the display device DD, and the first base resin may include an aliphatic monomer to allow the optical bonding layer PSA to have a relatively low refractive index property. However, according to an embodiment, the optical bonding layer PSA may further include inorganic particles to allow the optical bonding layer PSA to have a relatively high refractive index while having a flexible physical property.

[0212] The storage elastic modulus (G') of the optical adhesive layer PSA at -20°C may be in the range of 0.01 MPa to 2.4 MPa. Alternatively, the storage elastic modulus (G') of the optical adhesive layer PSA at -20°C may be in the range of 0.01 MPa to 1.8 MPa. For example, the storage elastic modulus (G') of the optical adhesive layer PSA at -20°C may be about 1.6 MPa. According to an embodiment, the storage elastic modulus (G') of the optical adhesive layer PSA at -20°C may be about 0.1 MPa.

[0213] The loss elastic modulus (G”) of the optical adhesive layer PSA at -20°C may be in the range of 5.0 MPa to 6.0 MPa. Alternatively, the loss elastic modulus (G”) of the optical adhesive layer PSA at -20°C may be in the range of 5.2 MPa to 5.6 MPa. For example, the loss elastic modulus (G”) of the optical adhesive layer PSA at -20°C may be approximately 5.4 MPa.

[0214] The tanδ(G' / G") of the optical adhesive layer PSA at -20°C may be in the range of 3.0 to 3.4. The tanδ(G' / G") of the optical adhesive layer PSA at -20°C may be in the range of 3.1 to 3.3. For example, the tanδ(G' / G") of the optical adhesive layer PSA at -20°C may be about 3.25.

[0215] When the above numerical range is satisfied, the optical adhesive layer PSA according to the embodiment may have excellent low temperature characteristics. For example, when the optical adhesive layer PSA is subjected to a low temperature operating life (LTOL) test at -20°C, no buckling phenomenon occurs.

[0216] Experimentally, as the storage elastic modulus of the optical adhesive layer PSA increases, it may have a high refractive index, but in the case where the storage elastic modulus increases excessively, when stress is applied to the optical adhesive layer PSA, there may be a risk of cracks occurring in the optical adhesive layer PSA. However, according to an embodiment, the optical adhesive layer PSA may include the aforementioned material so as to have sufficient foldable properties while having a relatively high refractive index, and thus the aforementioned risk may not occur.

[0217] In addition, when the storage elastic modulus of the optical adhesive layer PSA is too low, the optical adhesive layer PSA may have difficulty in having sufficient adhesive properties, but as the storage elastic modulus of the optical adhesive layer PSA satisfies the aforementioned numerical range, the optical adhesive layer PSA can have sufficient adhesive properties.

[0218] The glass transition temperature of the optical bonding layer PSA may be -15°C or less. For example, the glass transition temperature of the optical bonding layer PSA may be in a range of -25°C or more and -20°C or less. For example, the glass transition temperature of the optical bonding layer PSA may be about -19°C. Alternatively, in another example, the glass transition temperature of the optical bonding layer PSA may be about -20°C. As the glass transition temperature of the optical bonding layer PSA satisfies the aforementioned numerical range, the optical bonding layer PSA may have excellent flexibility, and the durability of the display device DD may be improved.

[0219] The creep value of the optical adhesive layer PSA at 60°C may be in the range of 10% to 20%. For example, the creep value of the optical adhesive layer PSA at 60°C may be about 15.8%. According to an embodiment, when the creep value of the optical adhesive layer PSA at 60°C is less than the aforementioned range, it may be difficult to fully deform during the folding operation of the display device DD, and when it is greater than the aforementioned range, the resilience of the optical adhesive layer PSA may be lacking.

[0220] In addition, as described above, the optical adhesive layer PSA may have a single-layer structure. That is, due to the single-layer structure of the optical adhesive layer PSA, an environment in which the interlayer movement of the material for realizing high refractive properties can be restricted can be provided. In this case, the reliability of the light extraction efficiency for the display device DD can be ensured. For example, in a case where the optical adhesive layer PSA has a multi-layer structure and a portion of the layers adjacent to the protective layer PVX in the multi-layer structure substantially have a large refractive index, in order to realize a layer substantially having a large refractive index, a structure of a material containing a high refractive plasticizer or the like may be provided. However, in a case where the high refractive plasticizer is selectively arranged in a portion of the layers, there may be a risk that the high refractive plasticizer penetrates into other adjacent layers, and thus, there may be a risk that the light extraction efficiency is reduced. However, according to an embodiment, since the optical adhesive layer PSA may have a single-layer structure, the aforementioned risks may be reduced.

[0221] Hereinafter, the present disclosure will be described in more detail based on examples and comparative examples. However, the following examples and comparative examples are merely examples for describing the present disclosure in more detail, and the present disclosure is not limited to the following examples and comparative examples.

[0222] 2. Examples and Comparative Examples

[0223] (1) Production Examples—Examples and Comparative Examples

[0224] [Example]

[0225] Aliphatic methacrylate (A) as the first base resin, aromatic methacrylate (B) as the second base resin, xylene resin (C), sulfide aromatic organic material (D) as the organic additive, and ZrO 2 (E) Inorganic particles were mixed in a weight ratio of 20:50:15:13:2 (A:B:C:D:E) to prepare an optical adhesive material PSA according to an embodiment.

[0226] At the same time, in order to more carefully ensure the reliability of the experimental results, two optical adhesive materials PSA according to the examples were prepared by the same preparation method. Hereinafter, the prepared optical adhesive materials PSA are respectively referred to as Example 1 and Example 2.

[0227] [Comparative Example]

[0228] An aromatic resin (A) as a base resin and a plasticizer (B) as an organic additive were mixed at a weight ratio of 70:30 (A:B) to prepare an optical adhesive material according to a comparative example.

[0229] At the same time, similar to the optical adhesive material PSA according to the embodiment, in order to ensure the reliability of the experimental results, two optical adhesive materials according to comparative examples were prepared by the same preparation method. Hereinafter, the prepared optical adhesive materials are respectively referred to as comparative example 1 and comparative example 2.

[0230] (2) Experimental example - rheological property measurement and low temperature reliability test

[0231] The rheological properties of the optical adhesive material PSA prepared according to the embodiment and the optical adhesive material prepared according to the comparative example were measured in a low temperature environment (-20°C). The equipment used in this experiment to measure the rheological properties of the target material is a rheometer (Rheometer) (model name: DHR-3) from TA Instruments. The measured rheological properties are shown in Table 1 below. According to each embodiment and comparative example, the average value of the measured property values ​​is also included.

[0232] Then, the same equipment was used to conduct a low temperature reliability test in a low temperature environment (-20°C) for the optical adhesive material PSA prepared according to the embodiment and the optical adhesive material prepared according to the comparative example. The low temperature reliability test is to measure the recovery rate after applying an external force (e.g., stress) to the object in a low temperature environment.

[0233] [Table 1]

[0234]

[0235] Referring to Table 1, as the optical adhesive material PSA according to the embodiment includes a predetermined material, it may have a rheological property including a predetermined numerical range. In this case, the optical adhesive material PSA may be configured to have excellent foldable properties. In addition, there is also a risk that the material properties of the optical adhesive material PSA may be destroyed in a low temperature environment, and it is known that the low temperature reliability is excellent.

[0236] In summary, although the preferred embodiments of the present disclosure have been described with reference to the disclosure, those skilled in the art or those of ordinary skill in the art will appreciate that various modifications and changes can be made to the present disclosure without departing from the scope of the ideas and technical fields of the present disclosure as described in the appended claims.

[0237] Therefore, the technical scope of the present disclosure is not limited by the contents described in the detailed description of the specification, but should be defined only by the claims.

Claims

1. A display device, comprising: A display layer, the display layer comprising a light emitting device including a first electrode, a second electrode, and a light emitting layer electrically connected to the first electrode and the second electrode; as well as a sensor layer, the sensor layer being arranged on the display layer and comprising a conductive pattern layer, a protective layer being arranged on the conductive pattern layer and having an opening formed therein, and an optical bonding layer being arranged on the protective layer, forming an interface with the protective layer and containing an optical bonding material, The protective layer has a first refractive index, The optical bonding layer has a second refractive index greater than the first refractive index, The optical adhesive material comprises an aliphatic monomer, an aromatic monomer, an organic additive and inorganic particles.

2. The display device according to claim 1, wherein: The aliphatic monomer is represented by any one of Chemical Formula 1 to Chemical Formula 6, [Chemical formula 1] [Chemical formula 2] [Chemical formula 3] [Chemical formula 4] [Chemical formula 5] [Chemical formula 6] In Chemical Formula 5 and Chemical Formula 6, n is independently an integer of 1 to 20.

3. The display device according to claim 2, wherein: The aliphatic monomer is included in a range of 10 wt % to 20 wt % with respect to the total weight of the optical adhesive material.

4. The display device according to claim 1, wherein: The aromatic monomer is represented by any one of Chemical Formula 7 to Chemical Formula 12, [Chemical formula 7] [Chemical formula 8] [Chemical formula 9] [Chemical formula 10] [Chemical formula 11] [Chemical formula 12] In Chemical Formula 9 and Chemical Formula 10, n is independently an integer of 0 to 6.

5. The display device according to claim 4, characterized in that The aromatic monomer is included in a range of 40 wt % to 65 wt % with respect to the total weight of the optical adhesive material.

6. The display device according to claim 1, wherein: The organic additive comprises xylene resin, The xylene resin is included in a range of 15 wt % to 25 wt % with respect to the total weight of the optical adhesive material.

7. The display device according to claim 1, wherein: The organic additive comprises a sulfide aromatic organic material, The sulfide-based aromatic organic material is included in a range of 10 wt % to 20 wt % based on the total weight of the optical adhesive material.

8. The display device according to claim 1, wherein: The second refractive index of the optical adhesive layer ranges from 1.56 to 1.

7.

9. The display device according to claim 1, wherein: The optical adhesive material has a storage elastic modulus at -20°C in a range of 0.01 MPa or more and 1.8 MPa or less.

10. The display device according to claim 1, wherein: The optical adhesive material has a tan δ (G' / G") in the range of 3.0 to 3.

4.

11. The display device according to claim 1, wherein: The glass transition temperature of the optical adhesive material is in the range of -25°C to -20°C.

12. The display device according to claim 1, wherein: The protective layer comprises one or more of the group consisting of acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, methacrylic acid-based resin, polyisoprene, vinyl resin, urethane-based resin, cellulose-based resin, siloxane-based resin and perylene-based resin, The first refractive index of the protective layer is in a range of 1.45 to 1.

56.

13. The display device according to claim 1, wherein: The light emitting device comprises an organic light emitting device, The conductive pattern layer includes a first conductive pattern layer and a second conductive pattern layer, The sensor layer includes an insulating layer arranged between the first conductive pattern layer and the second conductive pattern layer, The protection layer and the second conductive pattern layer contact each other.

14. The display device according to claim 1, wherein: The optical bonding layer comprises a single layer structure, The display device further includes an upper layer disposed on the sensor layer and directly adjacent to the optical bonding layer, The opening overlaps with the light-emitting layer when viewed in a plane. The display device is a flexible display device.

15. An optical bonding material, comprising: Aliphatic monomers; Aromatic monomers; Organic additives containing organic materials; as well as Inorganic materials.