Computer case with efficient heat dissipation performance

Abstract

The invention relates to the related technical field of computer components, in particular to a computer case with efficient heat dissipation performance, which comprises a case main body, a side cover plate, an overload mechanism, a top cover plate and a magnetic suction cover plate. A heat dissipation buffer area is formed through double-layer design, heat is rapidly transferred to the position away from hardware, the heat dissipation area is adjusted through opening and closing of the opening and closing pieces, the efficient heat dissipation effect is achieved, the hardware is effectively prevented from being damaged due to overheating, the opening and closing pieces on the side cover plates are in a closed state under the normal condition, dust is prevented from entering the case, and the service life of the case is prolonged. When the temperature is too high, the deformation block in the overload mechanism is influenced by temperature change, the opening and closing state of the opening and closing piece is automatically adjusted, dynamic balance of the heat dissipation performance and the dustproof performance is achieved, the overload mechanism is compact in design and does not occupy too much space, the utilization rate of the internal space of the case is kept, and the overall attractiveness of the case is guaranteed. And the method can be applied to cases with different sizes and shapes, and has good compatibility.

Description

Technical Field

[0001] The present invention relates to the technical field related to computer components, and in particular to a computer case with high-efficiency heat dissipation performance. Background Art

[0002] As a part of computer accessories, the main function of the computer case is to place and fix various computer accessories, and it plays a supporting and protective role. In addition, the computer case plays an important role in shielding electromagnetic radiation. In the field of modern computer assembly and DIY, chassis heat dissipation has always been an important issue that players cannot ignore. Effective heat dissipation can not only extend the service life of the hardware, but also avoid performance degradation or crashes under high load conditions.

[0003] In the existing computer case, for example, Chinese patent with publication number CN118642569A discloses a computer case for facilitating heat dissipation, including a case body; a side disassembly plate, the side disassembly plate is fixed to the case body by bolts; a heat dissipation bottom net, the heat dissipation bottom net is arranged at the bottom of the case body; a heat dissipation protection structure, the heat dissipation protection structure is installed at one side of the case body and inside the case body; and a support protection structure, the support protection structure is installed at one side and the bottom of the case body.

[0004] In the above-mentioned prior art, the angle of the rubber tube is arbitrarily bent by shaping iron wire, and then bent into a suitable shape to perform precise heat dissipation. However, the above-mentioned prior art does not take into account the impact of the environment on the heat dissipation effect of the chassis. Usually, the heat dissipation effect of the chassis is sufficient to maintain the stability of the hardware. However, if the weather changes, such as in hot weather, the temperature inside the chassis may be too high. At this time, the heat dissipation efficiency needs to be improved. Otherwise, the hardware may overheat and cause the computer to blue screen, restart, or even be directly damaged. To improve the heat dissipation efficiency, the most direct way is to increase the openings on the chassis to increase the heat dissipation area. However, too many openings will also accelerate the accumulation of dust. The accumulated dust will hinder the wind flow, which may lead to a decrease in the heat dissipation effect.

[0005] Based on this, there is still room for improvement in the above-mentioned prior art. Summary of the invention

[0006] In order to better balance the heat dissipation performance and dustproof performance of the chassis, the present application provides a computer chassis with efficient heat dissipation performance.

[0007] The present application provides a computer case with high-efficiency heat dissipation performance, which adopts the following technical solution: A computer case with efficient heat dissipation performance comprises a case body, side covers, an overload mechanism, a top cover, and a magnetic cover. The side covers are symmetrically mounted on the left and right sides of the case body. The overload mechanism is evenly arranged on the side covers. The overload mechanism has a dormant position for blocking dust and an overload position for increasing the heat dissipation effect during use. The top cover is mounted on the top of the case body, and the magnetic cover is placed on the upper surface of the top cover.

[0008] Preferably, an installation hole for installing a chassis fan is provided at the inner upper end of the chassis body.

[0009] Preferably, the side cover plate is evenly provided with through holes, and an outer convex shell is installed on the outer surface of the side cover plate, and the outer convex shell and the through holes are in a one-to-one correspondence.

[0010] Preferably, the overload mechanism includes an opening and closing member, a rotating shaft, a flip member, a pressing member, an extruding member, a deforming block, a hard plate, a driving member, a traction rope, a driving groove, and a breathable component. The opening and closing member is rotatably arranged in the outer convex shell through the rotating shaft, and the opening and closing member is symmetrically arranged front and back. A spring 1 is connected between the rotating shaft and the outer convex shell, and the spring 1 is a torque spring. The springs work together to reset. Flip members are installed at both ends of the rotating shaft. The pressing member is slidable left and right in the outer convex shell. A spring 2 is connected between the pressing member and the outer convex shell. The spring 2 plays a reset role. The upper and lower ends of the pressing member are An extrusion piece is installed, and the extrusion piece and the flip piece are extrusion-fitted. The deformation block is installed inside the outer convex shell. The deformation block is made of a material with a high thermal expansion coefficient (such as silicone rubber, etc.). It expands and deforms at high temperatures and recovers when the temperature drops. The hard plate is set in the outer convex shell for sliding back and forth. The hard plate and the deformation block are fixedly connected. The driving piece is installed on the hard plate, and a driving groove that is extrusion-fitted with the driving piece is opened on the lower pressing piece. One end of the traction rope is connected to the hard plate, and the other end of the traction rope is connected to the outer wall of the opening and closing piece. The ventilation component is set on the opening and closing piece.

[0011] Preferably, the breathable component includes a component, a breathable net, and a sliding shaft. The breathable nets are symmetrically slidably arranged at both the front and rear ends of the component, a sliding shaft is rotatably arranged at the outer end of the breathable net, a sliding groove is opened on the surface of the opening and closing piece, and the sliding shaft is slidably arranged in the sliding groove.

[0012] Preferably, the free ends of the two symmetrically arranged opening and closing pieces are magnetically engaged with each other.

[0013] Preferably, a sinking groove is provided on the surface of the top cover plate, and rectangular holes are evenly provided inside the sinking groove, and the rectangular holes play a role in ventilation and heat dissipation.

[0014] Preferably, the surface of the magnetic cover plate is evenly provided with air holes, and the magnetic cover plate is adsorbed and cooperated with the sinking groove through magnetic attraction. The magnetic cover plate is located above the rectangular hole. The rectangular hole has a large area and a good heat dissipation effect. However, due to the large area of ​​the rectangular hole, dust can easily invade. The aperture of the air hole is small, and the heat dissipation effect is poorer than that of the rectangular hole. However, the air hole has better ability to resist dust invasion than the rectangular hole.

[0015] In summary, the beneficial technical effects of this application are as follows: The computer case with efficient heat dissipation performance described in the present invention forms a heat dissipation buffer zone through a double-layer design (a top cover plate and a magnetic cover plate), quickly transfers heat to a position away from the hardware, and adjusts the heat dissipation area by opening and closing the opening and closing parts, thereby achieving efficient heat dissipation effect and effectively preventing hardware from being damaged by overheating; The opening and closing parts on the side cover are in a closed state under normal circumstances to prevent dust from entering the chassis. When the temperature is overheated, the deformation block in the overload mechanism is affected by the temperature change and automatically adjusts the opening and closing state of the opening and closing parts to increase the heat dissipation channel and achieve a dynamic balance between heat dissipation performance and dustproof performance; The overload mechanism is compactly designed and does not take up too much space, thus maintaining the internal space utilization of the chassis and ensuring the overall aesthetics of the chassis. It can be applied to chassis of different sizes and shapes and has good compatibility. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a first three-dimensional structural schematic diagram of the present invention; Figure 2 It is an exploded view of the chassis body, the top cover plate, and the magnetic cover plate of the present invention; Figure 3 It is a schematic structural diagram of the top cover plate of the present invention; Figure 4 It is a schematic diagram of the structure between the side cover plate and the outer convex shell of the present invention; Figure 5 It is a structural schematic diagram of the side cover plate, the outer convex shell and the overload mechanism of the present invention; Figure 6 It is a structural schematic diagram of the overload mechanism of the present invention; Figure 7 It is a structural schematic diagram of the overload mechanism of the present invention.

[0017] Explanation of the reference numerals: 1. Chassis body; 2. Side cover; 3. Overload mechanism; 4. Top cover; 5. Magnetic cover; 21. Outer convex shell; 31. Opening and closing member; 32. Rotating shaft; 33. Flipping member; 34. Pressing member; 35. Extrusion member; 36. Deformation block; 37. Hard plate; 38. Driving member; 39. Traction rope; 341. Driving groove; 311. Component; 312. Breathable net; 313. Sliding shaft; 41. Sinking groove; 42. Rectangular hole. DETAILED DESCRIPTION

[0018] The following is combined with Figure 1-Figure 7 This application is described in further detail.

[0019] The embodiment of the present application discloses a computer case with efficient heat dissipation performance. A heat dissipation buffer zone is created through a double-layer design to quickly transfer heat to a location away from hardware. At the same time, the computer case can automatically switch workstations when the temperature is too high according to the temperature conditions inside the case, thereby accelerating heat dissipation.

[0020] Reference Figure 1 , Figure 2 As shown, a computer case with efficient heat dissipation performance includes a case body 1, a side cover 2, an overload mechanism 3, a top cover 4, and a magnetic cover 5. The side cover 2 is symmetrically installed on the left and right sides of the case body 1, and the overload mechanism 3 is evenly arranged on the side cover 2. The overload mechanism 3 has a dormant position for blocking dust and an overload position for increasing the heat dissipation effect during use. The top cover 4 is installed on the top of the case body 1, and the magnetic cover 5 is placed on the upper surface of the top cover 4.

[0021] After the installation is completed, during operation, the cooling fan inside the chassis body 1 continuously transfers the heat generated by the hardware to the top of the chassis body 1, and the heat is transmitted at high speed through the top cover 4, but the heat dissipation efficiency of the magnetic cover 5 is lower than that of the top cover 4, so the heat accumulates between the top cover 4 and the magnetic cover 5. At this time, the heat is far away from the hardware, so it is dissipated to the outside through the magnetic cover 5 at a normal dissipation rate. When the chassis body 1 is overheated, the overload mechanism 3 is triggered, and the overload mechanism 3 switches to the overload position to increase the heat dissipation outlet to alleviate the overheating inside the chassis body 1 and prevent hardware damage. The present application guides the heat to dissipate it at a uniform speed away from the hardware. At the same time, when an abnormal overheating occurs, the heat dissipation efficiency is improved by increasing the heat dissipation outlet to prevent hardware damage due to overheating.

[0022] Reference Figure 1 , Figure 2 As shown, the upper inner end of the chassis body 1 is provided with mounting holes for installing a chassis fan.

[0023] Reference Figure 4As shown, the side cover plate 2 is evenly provided with through holes, and an outer convex shell 21 is installed on the outer surface of the side cover plate 2, and the outer convex shell 21 and the through holes are in a one-to-one correspondence.

[0024] Reference Figure 5-Figure 7 As shown, due to changes in external temperature or environment, the heat dissipation efficiency of the computer will also be affected, especially in hot weather, the computer may overheat. For this reason, the present application is provided with an overload mechanism 3, and the overload mechanism 3 includes an opening and closing member 31, a rotating shaft 32, a flip member 33, a pressing member 34, an extrusion member 35, a deformation block 36, a hard plate 37, a driving member 38, a traction rope 39, a driving groove 341, and a ventilation component. The opening and closing member 31 is rotatably arranged in the outer convex shell 21 through the rotating shaft 32, and the opening and closing member 31 is symmetrically arranged front to back. A spring 1 is connected between the rotating shaft 32 and the outer convex shell 21, and the spring 1 is a torque spring. The spring acts to reset. Flip members 33 are installed at both ends of the rotating shaft 32. The pressing member 34 is slidably arranged in the outer convex shell 21 left and right. A spring 2 is connected between the shells 21, and the spring 2 plays a resetting role. Extrusion pieces 35 are installed at the upper and lower ends of the lower pressure piece 34, and the extrusion piece 35 and the flip piece 33 are extruded together. The deformation block 36 is installed inside the convex shell 21. The deformation block 36 is made of a material with a high thermal expansion coefficient (such as silicone rubber, etc.). It expands and deforms at high temperatures. When the temperature drops, it recovers. The hard plate 37 is slidably arranged in the convex shell 21, and the hard plate 37 and the deformation block 36 are fixedly connected. The driving piece 38 is installed on the hard plate 37. A driving groove 341 that is extruded together with the driving piece 38 is opened on the lower pressure piece 34. One end of the traction rope 39 is connected to the hard plate 37, and the other end of the traction rope 39 is connected to the outer wall of the opening and closing piece 31. The ventilation component is arranged on the opening and closing piece 31.

[0025] Reference Figure 7 As shown, the breathable component includes a component 311, a breathable net 312, and a sliding shaft 313. The breathable net 312 is symmetrically and slidingly arranged at both the front and rear ends of the component 311. The outer end of the breathable net 312 is rotatably arranged with a sliding shaft 313. A sliding groove is provided on the surface of the opening and closing member 31, and the sliding shaft 313 is slidably arranged in the sliding groove.

[0026] Reference Figure 7 As shown, the free ends of the two symmetrically arranged opening and closing members 31 are magnetically engaged with each other.

[0027] In actual operation, if the temperature inside the chassis body 1 is within a normal range, the opening and closing member 31 is in a magnetically closed state (sleeping position). At this time, the through hole is closed by the opening and closing member 31, and the side cover 2 does not have a heat dissipation function. When the temperature inside the chassis body 1 is too high, the deformation block 36 is deformed and expanded by heat, and the hard plate 37 moves under the action of the expanded deformation block 36, thereby pulling the opening and closing member 31 through the traction rope 39, and the opening and closing member 31 in the magnetically closed state is pulled open under the tension. At the same time, the driving member 38 moves following the movement of the hard plate 37, and the movement The driving member 38 squeezes the driving groove 341, so that the pressing member 34 moves toward the center of gravity of the chassis body 1, and then the extruding member 35 squeezes the flip member 33 (at this time, the flip member 33 has been rotated a certain angle following the rotation and opening of the opening and closing member 31, so as to facilitate the extrusion member 35 to squeeze), the flip member 33 is squeezed so that the opening and closing member 31 is rotated and opened again (overload position), and the sliding shaft 313 slides outward along the sliding groove, and the component 311 and the air permeable net 312 are exposed outside the chassis, so that the through hole is unobstructed, providing a new dissipation channel for heat.

[0028] Reference Figure 4 As shown, a sinking groove 41 is provided on the surface of the top cover plate 4, and rectangular holes 42 are evenly provided inside the sinking groove, and the rectangular holes 42 play a role in ventilation and heat dissipation.

[0029] Reference Figure 2 As shown, the surface of the magnetic cover plate 5 is evenly provided with air holes, and the magnetic cover plate 5 is adsorbed and cooperated with the sinking groove 41 through magnetic attraction, and the magnetic cover plate 5 is located above the rectangular hole 42. The rectangular hole 42 has a large area and a good heat dissipation effect. However, due to the large area of ​​the rectangular hole 42, dust can easily invade. The aperture of the air hole is small, and the heat dissipation effect is poorer than that of the rectangular hole 42. However, the air hole has a better ability to resist dust invasion than the rectangular hole 42.

[0030] The implementation principle of this embodiment is: Step 1: Install and use; Step 2: The chassis fan transfers the heat generated by the hardware to the top of the chassis body 1. The heat is transmitted through the top cover 4 at high speed, thus away from the hardware, but accumulates between the top cover 4 and the magnetic cover 5. After that, the heat is dissipated to the outside through the magnetic cover 5 at a normal dissipation rate; Step 3: When the inside of the chassis body 1 is overheated, the deformation block 36 is deformed and expanded by the heat, thereby triggering the opening and closing member 31 to open, so that the through hole is unobstructed and the heat dissipation channel is increased.

[0031] The above description is only by way of illustration of certain exemplary embodiments of the present invention. It is undoubted that those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A computer case with high-efficiency heat dissipation performance, characterized in that: include: Chassis body (1); Side cover plates (2) are symmetrically mounted on the left and right sides of the chassis body (1); An overload mechanism (3) is evenly arranged on the side cover plate (2); the overload mechanism (3) has a dormant position for blocking dust and an overload position for increasing the heat dissipation effect when in use; A top cover plate (4) mounted on the top of the chassis body (1); A magnetic cover plate (5) is placed on the upper surface of the top cover plate (4).

2. A computer case with high heat dissipation performance according to claim 1, characterized in that: The upper inner end of the chassis body (1) is provided with a mounting hole for mounting a chassis fan.

3. A computer case with high heat dissipation performance according to claim 1, characterized in that: The side cover plate (2) is evenly provided with through holes, and an outer convex shell (21) is installed on the outer surface of the side cover plate (2), and the outer convex shell (21) and the through holes are in a one-to-one correspondence.

4. A computer case with high heat dissipation performance according to claim 3, characterized in that: The overload mechanism (3) comprises: An opening and closing member (31) is rotatably arranged in the outer convex shell (21) via a rotating shaft (32), the opening and closing member (31) is symmetrically arranged front and back, a spring is connected between the rotating shaft (32) and the outer convex shell (21), and flip members (33) are installed at both ends of the rotating shaft (32); A pressing member (34) is slidably disposed in the outer convex shell (21) to the left and right, a second spring is connected between the pressing member (34) and the outer convex shell (21), and extrusion members (35) are installed at both upper and lower ends of the pressing member (34), and the extrusion member (35) and the flip member (33) are extrusion-fitted; A deformation block (36) installed inside the outer convex shell (21); A hard plate (37) is slidably disposed in the outer convex shell (21) in a forward and backward manner, and the hard plate (37) is fixedly connected to the deformation block (36); A driving member (38) is mounted on the hard plate (37), and a driving groove (341) is provided on the lower pressing member (34) for extrusion-matching with the driving member (38); A traction rope (39), one end of which is connected to the hard plate (37), and the other end of which is connected to the outer wall of the opening and closing member (31); A ventilation component is arranged on the opening and closing member (31).

5. A computer case with high heat dissipation performance according to claim 4, characterized in that: The breathable component comprises: The component (311) has air-permeable nets (312) symmetrically slidably arranged at both the front and rear ends, a sliding shaft (313) is rotatably arranged at the outer end of the air-permeable net (312), a sliding groove is arranged on the surface of the opening and closing member (31), and the sliding shaft (313) is slidably arranged in the sliding groove.

6. A computer case with high heat dissipation performance according to claim 4, characterized in that: The free ends of the two symmetrically arranged opening and closing members (31) are magnetically engaged with each other.

7. A computer case with high heat dissipation performance according to claim 1, characterized in that: A sinking groove (41) is provided on the surface of the top cover plate (4), and rectangular holes (42) are evenly provided inside the sinking groove.

8. A computer case with high-efficiency heat dissipation performance according to claim 7, characterized in that: The surface of the magnetic cover plate (5) is evenly provided with air holes, and the magnetic cover plate (5) is adsorbed and matched with the sinking groove (41) through magnetic attraction.

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