Optoelectronic module, optoelectronic module operation method and optoelectronic module manufacturing method

Abstract

The invention relates to a photoelectric module, a photoelectric module operation method and a photoelectric module manufacturing method. In order to improve electromagnetic interference, the photoelectric module comprises a shell, an anti-interference layer arranged corresponding to the shell, and a sensor module used for emitting or receiving light. The anti-interference layer is optically transparent in an infrared light band or a visible light band. The shell and the anti-interference layer form an accommodating space, and the sensor module is arranged in the accommodating space. The housing and the anti-interference layer are electrically grounded or electrically connected to a potential.

Description

Technical Field

[0001] The present application relates to a photoelectric module and a method for operating the photoelectric module and a method for manufacturing the photoelectric module, and more specifically, to a photoelectric module for reducing electromagnetic interference and a method for operating the photoelectric module and a method for manufacturing the photoelectric module. Background Art

[0002] Electromagnetic interference (EMI) resistance or electromagnetic compatibility (EMC) resistance is very important for optoelectronic sensor modules. However, existing EMI resistance or EMC technology still needs to be improved to provide a new electronic device module that allows for minimal EMI. Summary of the invention

[0003] Therefore, the main purpose of the present application is to provide a photovoltaic module and a photovoltaic module operation method and a photovoltaic module manufacturing method to reduce electromagnetic interference.

[0004] The present application discloses an optoelectronic module, comprising a shell; an anti-interference layer, arranged corresponding to the shell, wherein the anti-interference layer is optically transparent in an infrared light band or a visible light band; and a sensor module, used to emit or receive light, wherein the shell and the anti-interference layer form a accommodating space, and the sensor module is arranged in the accommodating space, wherein the shell and the anti-interference layer are electrically grounded or electrically connected to a potential.

[0005] The present application discloses a method for operating a photoelectric module, which is used in a photoelectric module, including activating the photoelectric module, wherein the photoelectric module includes a shell, an anti-interference layer and a sensor module; and using the sensor module to emit or receive light, wherein the anti-interference layer is optically transparent in an infrared light band or a visible light band so that the light can pass through the anti-interference layer; wherein the shell and the anti-interference layer are electrically grounded or electrically connected to a potential.

[0006] The present application discloses a method for manufacturing an optoelectronic module, which is used to manufacture an optoelectronic module, including forming a shell, an anti-interference layer and a sensor module respectively; and arranging the sensor module in a containing space formed by the shell and the anti-interference layer; and electrically grounding the shell and the anti-interference layer or electrically connecting them to a potential; wherein the anti-interference layer is optically transparent in the infrared light band or the visible light band. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figures 1 to 5 is a schematic diagram of a photovoltaic module according to an embodiment of the present application.

[0008] Figure 6 is a flow chart of a photovoltaic module operation method according to an embodiment of the present application.

[0009] Figure 7 is a flow chart of a method for manufacturing a photovoltaic module according to an embodiment of the present application.

[0010] The reference numerals are described as follows:

[0011] 10~50 Photoelectric modules

[0012] 100M~300M sensor module

[0013] 103~203 Image sensor chip level packaging

[0014] 106~406 Aperture

[0015] 107~307、317 Optical mirror

[0016] 109~409 Shell

[0017] 210~410 Translucent cover

[0018] 211~411 Anti-interference layer

[0019] 303 Optical Receiver Module

[0020] 313 Optical Transmitter Module

[0021] 60 Photovoltaic Module Operation Method

[0022] 70 Photovoltaic module manufacturing method

[0023] DD Distance

[0024] Steps S602~S608, S702~S710 DETAILED DESCRIPTION

[0025] Figure 1 1 is a schematic diagram of an optoelectronic module 10 of an embodiment of the present application. The optoelectronic module 10 may be an optoelectronic sensor module, and the optoelectronic module 10 may include a sensor module 100M and a housing 109 having an aperture 106, and the housing 109 and the sensor module 100M are assembled together. The sensor module 100M may be an image sensor module, and the sensor module 100M may include an image sensor chip scale package (CSP) 103 and at least one optical mirror 107 (e.g., a lens or a mirror) corresponding to the aperture 106.

[0026] Metal can be used to prevent electromagnetic interference from other electronic components in the digital circuit system; accordingly, in one embodiment, the housing 109 can be a shell made of a conductive material (such as metal, carbon fiber, carbon nanotube, graphene, thin conductive polymer, conductor, semiconductor or a combination of the foregoing materials), and the housing 109 is electrically grounded to reduce electromagnetic interference. In another embodiment, the housing 109 can also be made of other materials or coated with plastic paint and plated with a shielding coating made of a conductive material. However, the housing 109 has an opening for defining the aperture 106, and it is difficult for the housing 109 to prevent electromagnetic interference entering from its opening (such as the aperture 106).

[0027] Figure 2 2 is a schematic diagram of an optoelectronic module 20 according to an embodiment of the present application. The optoelectronic module 20 (e.g., an optoelectronic sensor module) may include a sensor module 200M, a housing 209 having an aperture 206, and a light-transmitting cover plate 210, wherein the housing 209, the light-transmitting cover plate 210, and the sensor module 200M are assembled together. The sensor module 200M (e.g., an image sensor module) may include an image sensor chip-scale package 203 and at least one optical mirror 207 corresponding to the aperture 206.

[0028] In order to reduce electromagnetic interference, the light-transmitting cover plate 210 may be covered by a transparent and conductive anti-interference layer 211. Specifically, the anti-interference layer 211 may have high optical penetration or be optically transparent. In one embodiment (optionally), the anti-interference layer 211 may have high optical penetration or be optically transparent for the visible light band. In addition, the anti-interference layer 211 may be made of a conductive material (such as but not limited to indium tin oxide (indium tin oxide, ITO), aluminum-doped zinc oxide (aluminum-doped zinc oxide, AZO), carbon nanotubes, other transparent conductive oxides or a combination of the foregoing materials) or have conductivity, so as to be used as electromagnetic interference shielding to shield the influence of external electromagnetic waves on internal electronic components or to prevent the electromagnetic waves generated inside from radiating outward. The housing 209 and the anti-interference layer 211 may be made of different (or the same) conductive materials.

[0029] In other words, the shell 209 has an opening for defining the aperture 206. The opening of the shell 209 allows light to be transmitted to the image sensor chip-level package 203 via the anti-interference layer 211, the transparent cover 210 and the optical mirror 207. However, the anti-interference layer 211 can achieve electromagnetic shielding to prevent the electromagnetic waves to be shielded from passing through the opening of the shell 209.

[0030] The housing 209 and the anti-interference layer 211 are electrically connected to a potential (e.g., 0 volts) or an element, or the housing 209 and the anti-interference layer 211 are electrically grounded to minimize electromagnetic interference. In one embodiment (optional), the housing 209 and the anti-interference layer 211 may be in direct contact with each other; in one embodiment (optional), the housing 209 and the anti-interference layer 211 may be connected by a wire; in another embodiment (optional), the housing 209 and the anti-interference layer 211 are electrically connected to a potential or electrically grounded respectively and are not directly connected to each other.

[0031] In order to effectively shield electromagnetic waves, in one embodiment (optionally), the distance DD between the shell 209 for shielding electromagnetic waves and the anti-interference layer 211 is substantially equal to zero or less than an integer multiple of the wavelength of the electromagnetic wave to be shielded. The distance DD can be the minimum distance between the shell 209 and the anti-interference layer 211.

[0032] exist Figure 2 , the anti-interference layer 211 integrally covers or seals the transparent cover plate 210; in another embodiment (optionally), the anti-interference layer 211 only covers the upper surface 210t, the lower surface 210b or the partial surface of the transparent cover plate 210; in another embodiment (optionally), the anti-interference layer 211 can be embedded in the transparent cover plate 210. In one embodiment (optionally), the anti-interference layer 211 is patterned, for example, having a mesh, strip or hollow structure. In one embodiment (optionally), the transparent cover plate 210 can be made of a conductive material (such as a transparent conductive material) and can also have a certain strength. Accordingly, the transparent cover plate 210 can remove or omit the anti-interference layer 211 without coating, so from another point of view, the transparent cover plate 210 can be used as an anti-interference layer.

[0033] The transparent cover plate 210 may be a cover glass, and may be optically high in transmittance or optically transparent. The transparent cover plate 210 may have a certain strength to protect the optical mirror 207 and the image sensor chip-scale package 203 from being easily damaged, and to avoid affecting the optical effect of the optical mirror 207 or the optoelectronic module 20. In one embodiment (optional), the upper surface 210t or the lower surface 210b of the transparent cover plate 210 may be a plane to avoid affecting the optical effect of the optical mirror 207 or the optoelectronic module 20; in another embodiment (optional), the transparent cover plate 210 has a curved surface.

[0034] The structures (eg, shape or component configuration) of the image sensor chip-scale package 203 , the optical mirror 207 , the housing 209 , and the transparent cover 210 can be adjusted according to different requirements.

[0035] In one embodiment, the optoelectronic module 20 can be used to implement a camera module, and the sensor module 200M can be used to receive light, but is not limited thereto. The present application utilizes the anti-interference layer 211 to reduce electromagnetic interference, thereby allowing the optoelectronic module 20 to be closer to a printed circuit board (PCB) or electronic components of the printed circuit board, and reducing the impact of the optoelectronic module 20 on the electronic components of the printed circuit board.

[0036] Figure 3 3 is a schematic diagram of an optoelectronic module 30 according to an embodiment of the present application. The optoelectronic module 30 (e.g., an optoelectronic sensor module) may include a sensor module 300M, a housing 309 having an aperture 306, and a light-transmitting cover 310. The sensor module 300M (e.g., a depth sensor module) may include a light emitting module 313, at least one optical mirror 307, 317, and a light receiving module 303.

[0037] In one embodiment, the optoelectronic module 30 may be used to implement light detection and ranging (LiDAR), and the sensor module 300M may be used to transmit and receive light, but is not limited thereto. In the case where the optoelectronic module 20 is used to implement a camera module, the opening (e.g., aperture 306) of the housing 309 of the optoelectronic module 30 may be wider than the housing 209 of the optoelectronic module 20, making electromagnetic interference more serious.

[0038] In order to reduce electromagnetic interference, the anti-interference layer 311 can be coated on the transparent cover plate 310. Specifically, the anti-interference layer 311 can have high optical penetration or be optically transparent. In one embodiment (optionally), the anti-interference layer 311 can have high optical penetration or be optically transparent for infrared light (Infra-red, IR). In addition, the anti-interference layer 311 can be made of a conductive material (such as but not limited to indium tin oxide, aluminum-doped zinc oxide, carbon nanotubes, other transparent conductive oxides or a combination of the foregoing materials) or have conductivity, so as to be used as an electromagnetic interference shield to shield the influence of external electromagnetic waves on internal electronic components or to prevent the electromagnetic waves generated inside from radiating outward. Therefore, the anti-interference layer 311 can be used as an infrared light transparent conductive layer.

[0039] The housing 309 and the anti-interference layer 311 are both electrically connected to a potential (eg, 0 volts) or a component, or the housing 309 and the anti-interference layer 311 are both electrically grounded to minimize electromagnetic interference.

[0040] In one embodiment (optional), the light emitting module 313 may be an infrared light emitter and may include at least one light source for emitting pulse light 314. The light receiving module 303 may be an infrared light receiver and may include at least one light detector for capturing reflected pulse light 304. The optical mirrors 307 and 317 may serve as a light beam guiding unit.

[0041] Figure 4 is a schematic diagram of a photovoltaic module 40 according to an embodiment of the present application. Figure 4 (a) and (b) show a top view and an exploded view respectively. The photovoltaic module 40 can be implemented by the photovoltaic module 30. In other words, the cross-sectional view of the photovoltaic module 40 can refer to Figure 3 The optoelectronic module 40 (eg, an optoelectronic sensor module) may include a sensor module 300M, a housing 409 having an aperture 406, and a transparent cover plate 410. Similar to the anti-interference layer 311, the transparent anti-interference layer 411 on the transparent cover plate 410 may have electromagnetic interference shielding properties.

[0042] like Figure 4 As shown in (a), the light-transmitting cover plate 410 (or the anti-interference layer 411) can be arranged corresponding to the housing 409. For example, the housing 409 has an opening for defining the aperture 406, and the anti-interference layer 411 is arranged corresponding to the opening (e.g., the aperture 406) of the housing 409, and the projection area of ​​the opening onto the light-transmitting cover plate 410 (or the anti-interference layer 411) is equal to the area of ​​the opening, that is, the opening completely overlaps the light-transmitting cover plate 410 (or the anti-interference layer 411). Therefore, in Figure 4 (a) The light-transmissive cover plate 410 shown in dotted lines surrounds the aperture 406 shown in solid lines.

[0043] like Figure 4 As shown in (b), the housing 409 and the light-transmitting cover 410 (or the anti-interference layer 411) form a concave-shaped accommodation space, and the sensor module 300M for emitting or receiving light can be arranged in this accommodation space.

[0044] In one embodiment, the housing 409 may be integrally formed with a continuously connected surface; in another embodiment, the housing 409 may be composed of a plurality of elements or may be formed by assembling the surfaces of a plurality of separate elements.

[0045] As long as the aperture 406 can be covered, the light-transmitting cover plate 410 can be disposed inside the housing 409 (see Figure 4 ), so that the light-transmitting cover plate 410 (or the anti-interference layer 411) is disposed between the housing 409 and the sensor module 300M, but the present application is not limited thereto. For example, Figure 5 is a schematic diagram of a photovoltaic module 50 according to an embodiment of the present application.

[0046] The optoelectronic module 50 is substantially similar to the optoelectronic module 30 , however, in the optoelectronic module 50 , the light-transmitting cover 310 may be disposed outside the housing 309 , so that a portion of the housing 309 adjacent to the aperture 306 is disposed between the light-transmitting cover 310 (or the anti-interference layer 311 ) and the sensor module 300M.

[0047] In one embodiment, the image sensor chip-scale package (eg, 103, 203) may include an integrated circuit, a laser chip, or a detector chip; or, the image sensor chip-scale package may include a filter or a color filter.

[0048] The housings 109-409 may have the same or similar structure or material, the light-transmitting cover plates 210-410 may have the same or similar structure or material, the anti-interference layers 211-411 may have the same or similar structure or material, the image sensor chip-level packages 103-203 may have the same or similar structure or material, and the optical mirrors 107-307, 317 may have the same or similar structure or material. The components (e.g., the light-transmitting cover plates, the anti-interference layers, the image sensor chip-level packages, the optical mirrors, the light-transmitting modules, or the light-receiving modules) may be optically coupled to each other and arranged accordingly. For details or variations of the light beam guiding unit, the light transmitter, the light source, the light receiver, or the light detector, reference may be made to U.S. Patent Application Nos. 18 / 084,562 and 17 / 900,864, the disclosures of which are incorporated herein by reference in their entirety and become part of this specification.

[0049] Figure 6 6 is a flow chart of a photovoltaic module operation method 60 according to an embodiment of the present application. The photovoltaic module operation method 60 can be compiled into a code and used in a photovoltaic module (e.g., one of 10 to 50). The code can be, for example, stored in a storage circuit of the photovoltaic module and executed by the photovoltaic module, and can include the following steps:

[0050] Step S602: Start.

[0051] Step S604: The optoelectronic module is activated, wherein the optoelectronic module includes a housing (eg 209 ), an anti-interference layer (eg 211 ) and a sensor module (eg 200M), and the housing and the anti-interference layer are electrically grounded or electrically connected to a potential.

[0052] Step S606: emitting or receiving light using the sensor module, wherein the anti-interference layer is optically transparent in the infrared light band or the visible light band, so that the light can pass through the anti-interference layer.

[0053] Step S608: End.

[0054] For example, in Figure 3In the optoelectronic module 30 shown, the light emitting module 313 can be activated and emit a train of laser pulses (i.e., pulsed light 314), and the pulsed light 314 can be collimated by a set of optical mirrors 317 and pass through the transparent cover plate 310 (or the anti-interference layer 311). Once the pulsed light 314 hits the object, the pulsed light 314 is reflected, and the reflected pulsed light 304 can represent the pulsed light 314 reflected by the object, and the reflected pulsed light 304 passes through the transparent cover plate 310 (or the anti-interference layer 311) again. The reflected pulsed light 304 can then be focused by a set of optical mirrors 307 and collected by the light receiving module 303. The distance between the optoelectronic module 30 and the object can be calculated by measuring the time difference between the pulsed light 314 and the reflected pulsed light 304. In one embodiment, the laser pulse can be an infrared laser pulse; in one embodiment, the wavelength of the laser pulse can be 840, 905, 940, 1310, 1550 nanometers (nm).

[0055] Figure 7 1 is a flow chart of a photovoltaic module manufacturing method 70 of an embodiment of the present application. The photovoltaic module operation method 70 for manufacturing a photovoltaic module (e.g., one of 10-50) can be compiled into a code, which can be stored in a storage circuit of a manufacturing system and executed by a processing circuit of the manufacturing system, and can include the following steps:

[0056] Step S702: Start.

[0057] Step S704: forming a housing (eg 309 ), an anti-interference layer (eg 311 ) and a sensor module (eg 300M) respectively, wherein the anti-interference layer is optically transparent in the infrared light band or the visible light band.

[0058] Step S706: disposing the sensor module in a receiving space formed by the housing and the anti-interference layer.

[0059] Step S708: electrically grounding or electrically connecting the housing and the anti-interference layer to a potential.

[0060] Step S710: End.

[0061] For example, in step S704, a transparent cover plate may be formed, and the anti-interference layer may cover the transparent cover plate.

[0062] For example, when forming the shell in step S704, an opening may be formed in the shell, and, during subsequent assembly, the anti-interference layer may be arranged corresponding to the opening of the shell so that the projection area of ​​the opening projected onto the anti-interference layer is equal to the area of ​​the opening.

[0063] For example, during assembly, the distance between the anti-interference layer for shielding electromagnetic waves and the shell can be adjusted to be substantially equal to zero or less than an integer multiple of the wavelength of the electromagnetic wave, so that the shell and the anti-interference layer form an accommodating space.

[0064] For example, during assembly, the anti-interference layer may be disposed between the housing and the sensor module, or a portion of the housing may be disposed between the anti-interference layer and the sensor module, so that the housing and the anti-interference layer form a containing space.

[0065] The descriptions of "first", "second", etc. mentioned throughout the specification are only used to distinguish different elements, and do not limit the order, priority, time sequence of method execution, or the existence of all elements. The embodiments can be combined in various ways without conflict.

[0066] In summary, light can pass through the opening of the shell and the anti-interference layer of the present application to allow light to propagate between the inside and outside of the shell. However, the anti-interference layer of the present application can achieve electromagnetic shielding, preventing the electromagnetic waves to be shielded from passing through the opening of the shell to reduce electromagnetic interference, especially reducing electromagnetic interference in the area of ​​the opening of the shell.

[0067] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A photovoltaic module, characterized in that: include: a housing; an anti-interference layer, disposed corresponding to the housing, wherein the anti-interference layer is optically transparent in an infrared light band or a visible light band; and A sensor module is used to transmit or receive light, wherein the housing and the anti-interference layer form a containing space, and the sensor module is arranged in the containing space. Wherein, the shell and the anti-interference layer are electrically grounded or electrically connected to a potential.

2. The photovoltaic module according to claim 1, characterized in that: The shell and the anti-interference layer are made of conductive material or have conductivity.

3. The photovoltaic module according to claim 1, wherein: The shell has an opening, the anti-interference layer is arranged corresponding to the opening of the shell, and the projection area of ​​the opening projected onto the anti-interference layer is equal to the area of ​​the opening.

4. The photovoltaic module according to claim 1, wherein: The anti-interference layer and the shell are used to shield electromagnetic waves. A distance between the anti-interference layer and the shell is substantially equal to zero or less than an integral multiple of the wavelength of the electromagnetic wave.

5. The photovoltaic module according to claim 1, characterized in that: Also includes: A light-transmitting cover plate, wherein the anti-interference layer covers the light-transmitting cover plate.

6. The photovoltaic module according to claim 1, characterized in that: The anti-interference layer entirely covers a light-transmitting cover plate or is arranged on a surface of the light-transmitting cover plate.

7. The photovoltaic module according to claim 1, characterized in that: The anti-interference layer is disposed between the housing and the sensor module; or A portion of the housing is disposed between the anti-interference layer and the sensor module.

8. The photovoltaic module according to claim 1, wherein: The sensor module comprises: An image sensor chip-level package is disposed in the accommodating space; and At least one optical mirror is disposed between the housing, the anti-interference layer and the image sensor chip-level package, The housing has an opening for allowing the light to be transmitted to the image sensor chip-level package via the anti-interference layer and the at least one optical mirror.

9. The photovoltaic module according to claim 1, characterized in that: The sensor module comprises: A light emitting module is disposed in the accommodating space; a light receiving module, disposed in the accommodating space; and At least one optical mirror is arranged between the light emitting module or the light receiving module and the housing and the anti-interference layer. The housing has an opening for allowing the light to be transmitted from the light emitting module or to the light receiving module via the anti-interference layer and the at least one optical mirror.

10. The photovoltaic module according to claim 1, wherein: The anti-interference layer includes indium tin oxide or aluminum-doped zinc oxide.

11. A photovoltaic module operation method, used for a photovoltaic module, characterized in that: The photovoltaic module operation method comprises: activating the optoelectronic module, wherein the optoelectronic module comprises a housing, an anti-interference layer and a sensor module; and emitting or receiving light using the sensor module, wherein the anti-interference layer is optically transparent in an infrared light band or a visible light band, so that the light can pass through the anti-interference layer; Wherein, the shell and the anti-interference layer are electrically grounded or electrically connected to a potential.

12. The photovoltaic module operating method according to claim 11, characterized in that: The housing has an opening, the sensor module includes an image sensor chip-level package and at least one optical mirror, and using the sensor module to receive the light includes: The image sensor chip-scale package of the sensor module receives the light passing through the opening, the anti-interference layer and the at least one optical mirror.

13. The photovoltaic module operating method according to claim 11, characterized in that: The housing has an opening, the sensor module includes a light emitting module, a light receiving module and at least one optical mirror, and using the sensor module to emit or receive the light includes: Passing the light emitted from the light emitting module through at least one of the at least one optical mirror, the anti-interference layer and the opening; or The light receiving module of the sensor module is used to receive the light passing through at least one of the opening, the anti-interference layer and the at least one optical mirror.

14. A method for manufacturing a photovoltaic module, used to manufacture a photovoltaic module, characterized in that: The photoelectric module manufacturing method comprises: A shell, an anti-interference layer and a sensor module are formed respectively; Disposing the sensor module in a containing space formed by the housing and the anti-interference layer; and Electrically grounding or connecting the housing and the anti-interference layer to a potential; Wherein, the anti-interference layer is optically transparent in the infrared light band or the visible light band.

15. The method for manufacturing a photovoltaic module according to claim 14, wherein: The shell and the anti-interference layer are made of conductive material or have conductivity.

16. The method for manufacturing a photovoltaic module according to claim 14, wherein: Also includes: forming an opening in the housing; as well as The anti-interference layer is arranged corresponding to the opening of the shell, wherein a projection area of ​​the opening projected onto the anti-interference layer is equal to an area of ​​the opening.

17. The method for manufacturing a photovoltaic module according to claim 14, wherein: Also includes: A distance between the anti-interference layer for shielding electromagnetic waves and the housing is adjusted to be substantially equal to zero or less than an integral multiple of the wavelength of the electromagnetic wave.

18. The method for manufacturing a photovoltaic module according to claim 14, wherein: Also includes: forming a light-transmitting cover plate; as well as The anti-interference layer covers the light-transmitting cover plate.

19. The method for manufacturing a photovoltaic module according to claim 14, wherein: Also includes: The anti-interference layer is entirely coated with a light-transmitting cover plate or is arranged on a surface of the light-transmitting cover plate.

20. The method for manufacturing a photovoltaic module according to claim 14, wherein: Also includes: Disposing the anti-interference layer between the housing and the sensor module; or A portion of the housing is disposed between the anti-interference layer and the sensor module.

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