Connecting device of integrated controller

Abstract

The invention discloses a connecting device of an integrated controller, and relates to the technical field of electromechanical control equipment, the connecting device comprises a controller body, the controller body comprises an upper cover plate, a main control board, a driving board, a capacitor assembly, a power element and a mounting shell, and the two sides of the mounting shell are provided with an alternating current output connector and a direct current input connector respectively. Heat dissipation assemblies are distributed on the peripheries of the power elements, each heat dissipation assembly comprises a substrate, a partition plate is arranged between the adjacent power elements on the substrate, a heat dissipation pipeline is distributed between the substrate and the partition plate, heat conduction fluid is arranged in the heat dissipation pipeline, a driving mechanism is arranged in the heat dissipation pipeline, and auxiliary heat conduction assemblies are arranged on the alternating current output connector and the direct current input connector. The driving mechanism drives the heat conduction fluid to flow along the heat dissipation pipeline, so that the temperature in the heat dissipation assembly is uniformly reduced, the whole device is uniformly heated, abnormal heating points are avoided, the temperatures between the alternating current output connector and the direct current input connector and the mounting shell are kept close, and the temperature difference is prevented from being too large. And stable operation of the device is maintained.

Description

Technical Field

[0001] The invention relates to the technical field of electromechanical control equipment. Background Art

[0002] An integrated controller is a microcontroller unit that integrates multiple control functions on a single chip and is used to manage specific tasks within an embedded system. The application of integrated controllers in the field of new energy buses is mainly reflected in its ability to serve as the core control unit of the vehicle, integrating multiple control functions such as power steering system, motor control, battery management, etc. to improve the performance and efficiency of the vehicle. By taking the control chip as the core, integrating hardware circuits and vector control strategies, precise control of the permanent magnet synchronous motor is achieved, thereby providing good power-assisting performance and dynamic response. In addition, the integrated controller is designed for new energy vehicles. Its high integration and high power density design make the controller smaller and more efficient, while ensuring reliability and adaptability under different environmental conditions.

[0003] The existing integrated controllers have high integration and large operating current. They generate a lot of heat during operation and have high heat dissipation requirements. Therefore, heat dissipation modules are often provided. Prefabricated wiring connection mechanisms are often used between the existing integrated controllers and the connecting cables to achieve quick connection. However, the existing integrated controller heat dissipation modules only focus on heat dissipation at the control chip, which can easily cause a large overall temperature difference in the integrated controller and poor overall heat dissipation effect. In particular, the temperature difference between the integrated controller and the connecting cable is too large, which causes condensation at the connection, resulting in a decrease in electrical insulation performance, causing equipment insulation "flashover" and corrosion to components, greatly reducing the reliability of the integrated controller. Summary of the invention

[0004] The purpose of the present invention is: in order to solve the above technical problems, the present invention provides a connection device for an integrated controller, which has reasonable temperature distribution and good heat dissipation effect, can reduce the temperature difference between the integrated controller connection cable and the body, and facilitate the smooth operation of the device.

[0005] In order to achieve the above-mentioned purpose, the present invention specifically adopts the following technical solutions:

[0006] A connection device for an integrated controller comprises a controller body, wherein the controller body comprises an upper cover plate, a main control board, a drive board, a capacitor assembly, a power element, and a mounting shell, wherein an AC output connector and a DC input connector are respectively arranged on both sides of the mounting shell, wherein the power element is arranged in a plurality of independent modular arrangements and is evenly distributed in the bottom compartment of the mounting shell, wherein a heat dissipation assembly is distributed on the periphery of the power element, wherein the mounting shell is made of metal, wherein the heat dissipation assembly comprises a substrate arranged at the bottom end of the power element, wherein the substrate is connected to the mounting shell, wherein a partition is arranged between adjacent power elements, wherein a heat dissipation pipeline is distributed between the substrate and the partition, wherein a heat conduction fluid is arranged in the heat dissipation pipeline, wherein a drive mechanism for driving the heat conduction fluid to flow along the heat dissipation pipeline is arranged in the heat dissipation pipeline, wherein the AC output connector and the DC input connector are both provided with auxiliary heat conduction components, wherein the auxiliary heat conduction components are connected to the heat dissipation component.

[0007] Through the above scheme, the power elements are arranged in several independent modular settings and evenly distributed in the bottom compartment of the installation shell, so that the various heat-generating power elements are evenly distributed in the installation shell, the heating area is reasonably rearranged, and the base plate and the partition are set to separate and close the power elements, so as to facilitate the heat dissipation of each power element. At the same time, the heat transfer fluid is driven by the driving mechanism to flow along the heat dissipation pipeline, so that the temperature in the heat dissipation component is uniformly reduced, the whole device is evenly heated, and abnormal heating points are avoided. The installation shell is made of metal material for convenient heat dissipation, and at the same time, heat transfer is promoted between the auxiliary heat transfer component and the heat dissipation component, so that the temperature between the AC output connector and the DC input connector and the installation shell is maintained close, so as to avoid excessive temperature difference and condensation. The heat dissipation effect of the whole device is good, the temperature distribution is uniform, the temperature difference between the integrated controller connection cable and the main body is reduced, and the device is maintained to run smoothly.

[0008] Furthermore, the driving mechanism includes a micro magnetic pump disposed on the mounting housing, the micro magnetic pump is connected to the heat dissipation pipeline, and the mounting housing is also provided with a driving unit for driving the micro magnetic pump to operate.

[0009] Through the above scheme, the micro magnetic pump is driven by the driving unit to operate, which in turn causes the heat transfer fluid to flow along the heat dissipation pipeline, causing the temperature of the entire device to drop evenly and the temperature distribution to be even. The micro magnetic pump is set up without direct contact with the heat transfer fluid. The entire cooling circulation system has good sealing performance and meets the requirements of electrical components such as integrated controllers.

[0010] Furthermore, the driving unit includes a semiconductor power generation chip arranged in the mounting shell, the semiconductor power generation chip is provided with a plurality of pieces, the semiconductor power generation chip is arranged in contact with the substrate and the partition, and a PLC controller is also provided, and the semiconductor power generation chip and the micro magnetic pump are electrically connected to the PLC controller.

[0011] Through the above scheme, a semiconductor power generation sheet is set and is bonded to the substrate and the partition. When the power element generates heat and causes the temperature to rise and fall, the semiconductor power generation sheet generates electricity through the temperature difference and supplies it to the micro magnetic pump for operation. At the same time, the working efficiency of the micro magnetic pump is controlled by the PLC controller. The entire device effectively utilizes the heat generated by the power element. The higher the temperature, the better the power generation efficiency of the semiconductor power generation sheet, thereby improving the working efficiency of the micro magnetic pump, and then enhancing the cooling and heat dissipation effect of the device. The entire system has a good linkage effect and a high degree of automation, which greatly improves the heat dissipation efficiency in the device.

[0012] Furthermore, the substrate is made of metal, and the space between the semiconductor power generation sheet and the substrate is filled with thermal conductive mud.

[0013] Through the above solution, the substrate is made of metal material to facilitate heat dissipation and heat conduction, that is, the gap between the substrate and the semiconductor power generation sheet is filled with thermal conductive mud to efficiently conduct the heat of the power components.

[0014] Furthermore, the micro magnetic pump is electrically connected to a power source, the driving unit includes a PLC controller arranged on the micro magnetic pump, and the PLC controller and the micro magnetic pump are both electrically connected to the main control board.

[0015] Through the above scheme, a PLC controller is set to link the main control board, and then control the micro magnetic pump to drive the heat transfer fluid to circulate.

[0016] Furthermore, the heat dissipation assembly also includes a clamping plate arranged between the main control board and the driving board, and heat dissipation pipelines are also distributed in the clamping plate.

[0017] Through the above scheme, the main control board and the driver board can be cooled by setting the clamping plate in combination with the heat dissipation pipeline. At the same time, the clamping plate can separate the main control board and the driver board to reduce mutual influence.

[0018] Furthermore, the auxiliary heat-conducting component includes a heat-conducting sleeve arranged on the outer periphery of the AC output connector and the DC input connector, and a heat dissipation pipeline is also distributed in the heat-conducting sleeve.

[0019] Through the above scheme, a thermally conductive sleeve is provided in combination with a heat dissipation pipeline, and a heat conductive fluid can be introduced into the thermally conductive sleeve. During the heat dissipation cycle, the temperature of the thermally conductive sleeve is controlled to prevent the temperature of the thermally conductive sleeve from being too low, thereby reducing the temperature difference between the AC output connector and the DC input connector and the device body, and at the same time expanding the heat dissipation area of ​​the entire device, thereby improving the heat dissipation effect.

[0020] Furthermore, fins are distributed on the periphery of the heat-conducting sleeve and the substrate.

[0021] Through the above solution, fins are provided to improve the heat dissipation effect.

[0022] Furthermore, the base plate and the partition are provided with raised ridges, and the outer periphery of the power element is provided with docking slots.

[0023] Through the above scheme, the convex ridges are provided to facilitate the insertion of the power element into the docking slot, facilitate the installation of the power element, and have a good fixing effect. At the same time, the contact area between the substrate and the partition and the power element is increased, thereby improving the heat dissipation effect.

[0024] The beneficial effects of the present invention are as follows:

[0025] 1. The present invention has a simple structure. The power elements are arranged in a plurality of independent modular configurations and are evenly distributed in the bottom compartment of the installation shell, so that the various heat-generating power elements are evenly distributed in the installation shell, the heating area is reasonably rearranged, and a substrate and a partition are arranged to separate and bring the power elements close to each other, so as to facilitate the heat dissipation of each power element. At the same time, the heat-conducting fluid is driven to flow along the heat dissipation pipeline by a driving mechanism, so that the temperature in the heat dissipation component is uniformly reduced, the whole device is evenly heated, and abnormal heating points are avoided. The installation shell is made of metal material for convenient heat dissipation, and at the same time, heat transfer is promoted between the auxiliary heat-conducting component and the heat dissipation component, so that the temperature between the AC output connector and the DC input connector and the installation shell is maintained close, so as to avoid excessive temperature difference and condensation. The whole device has good heat dissipation effect and uniform temperature distribution, and the temperature difference between the connecting cable of the integrated controller and the main body is reduced, so as to maintain the stable operation of the device.

[0026] 2. A thermal sleeve is provided in combination with a heat dissipation pipeline, and the heat transfer fluid can be introduced into the thermal sleeve. During the heat dissipation cycle, the temperature of the thermal sleeve is controlled to prevent the temperature of the thermal sleeve from being too low, thereby reducing the temperature difference between the AC output connector and the DC input connector and the device body, and at the same time expanding the heat dissipation area of ​​the entire device, thereby improving the heat dissipation effect.

[0027] 3. Set up a semiconductor power generation sheet and fit it to the substrate and partition. When the power element generates heat and causes the temperature to rise and fall, the semiconductor power generation sheet generates electricity through the temperature difference and supplies it to the micro magnetic pump for operation. At the same time, the working efficiency of the micro magnetic pump is controlled by the PLC controller. The entire device effectively utilizes the heat generated by the power element. The higher the temperature, the better the power generation efficiency of the semiconductor power generation sheet, thereby improving the working efficiency of the micro magnetic pump, and then enhancing the cooling and heat dissipation effect of the device. The entire system has a good linkage effect and a high degree of automation, which greatly improves the heat dissipation efficiency in the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a schematic diagram of the overall explosion structure of the present invention;

[0029] Figure 2 It is a schematic diagram of the cross-sectional structure of the substrate and AC output connector of the present invention;

[0030] Figure numerals: 11, upper cover; 12, main control board; 13, drive board; 14, capacitor assembly; 15, mounting shell; 16, AC output connector; 17, DC input connector; 18, substrate; 19, partition; 20, heat dissipation pipeline; 21, micro magnetic pump; 22, semiconductor power generation chip; 23, clamping plate; 24, thermal conductive sleeve; 25, fin; 26, ridge; 27, docking slot. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0032] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] Example 1

[0034] like Figure 1 and Figure 2As shown, this embodiment provides a connection device of an integrated controller, including a controller body, the controller body includes an upper cover plate 11, a main control board 12, a drive board 13, a capacitor assembly 14, a power element, and a mounting shell 15. The mounting shell 15 is provided with an AC output connector 16 and a DC input connector 17 on both sides. The power element is provided in a plurality of independent modular arrangements and is evenly distributed in the bottom compartment of the mounting shell 15. The power element is packaged in a separate modular package, which is convenient for installation and reasonable layout. A heat dissipation component is distributed on the periphery of the power element. The mounting shell 15 is made of metal, and the heat dissipation The assembly includes a substrate 18 disposed at the bottom of the power element, the substrate 18 is connected to the mounting shell 15, a partition 19 is disposed between adjacent power elements of the substrate 18, a heat dissipation pipeline 20 is distributed between the substrate 18 and the partition 19, a heat dissipation fluid is disposed in the heat dissipation pipeline 20, a driving mechanism for driving the heat dissipation fluid to flow along the heat dissipation pipeline 20 is disposed in the heat dissipation pipeline 20, the driving mechanism includes a micro-magnetic pump 21 disposed on the mounting shell 15, the micro-magnetic pump 21 is connected to the heat dissipation pipeline 20, and a driving unit for driving the micro-magnetic pump 21 to operate is also disposed on the mounting shell 15. In this embodiment, liquid metal coolant is used as the heat dissipation fluid, which has high thermal conductivity, excellent heat transfer performance, and is convenient for use with the micro-magnetic pump 21, and auxiliary heat conduction components are disposed on the AC output connector 16 and the DC input connector 17, and the auxiliary heat conduction components are connected to the heat dissipation component.

[0035] Therefore, the power elements are arranged in several independent modular configurations and evenly distributed in the bottom compartment of the installation shell 15, the various heat-generating power elements are evenly distributed in the installation shell 15, the heating area is reasonably rearranged, and the base plate 18 and the partition 19 are arranged to separate and close the power elements, so as to facilitate the heat dissipation of each power element. At the same time, the heat-conducting fluid is driven to flow along the heat-dissipating pipeline 20 through the driving mechanism, and the driving unit drives the micro-magnetic pump 21 to operate, thereby prompting the heat-conducting fluid to flow along the heat-dissipating pipeline 20, so that the temperature of the entire device is uniformly reduced and the temperature is evenly distributed. The micro-magnetic pump 21 is arranged without direct contact with the heat-conducting fluid. The entire cooling circulation system has good sealing performance and meets the requirements of electrical components such as integrated controllers. The temperature in the heat dissipation component is evenly reduced, and the whole device is evenly heated to avoid abnormal heating points. The installation shell 15 is made of metal material to facilitate heat dissipation. At the same time, it promotes heat transfer between the auxiliary heat conduction component and the heat dissipation component, and the temperature between the AC output connector 16 and the DC input connector 17 and the installation shell 15 is kept similar to avoid excessive temperature difference and condensation. The whole device has good heat dissipation effect and uniform temperature distribution, which reduces the temperature difference between the integrated controller connection cable and the body, and maintains stable operation of the device.

[0036] Reference Figure 1 and Figure 2In order to further improve the cooling effect, the substrate 18 is made of metal, and the space between the semiconductor power generation sheet 22 and the substrate 18 is filled with thermal conductive mud. The substrate 18 is made of metal to facilitate heat dissipation and heat conduction, that is, the gap between the substrate 18 and the semiconductor power generation sheet 22 is filled with thermal conductive mud to efficiently conduct the heat of the power components. At the same time, the thermal conductive mud also has good insulation. The heat dissipation component also includes a clamping plate 23 arranged between the main control board 12 and the drive board 13. The clamping plate 23 is also distributed with a heat dissipation pipeline 20. The clamping plate 23 is provided in combination with the heat dissipation pipeline 20 to dissipate heat for the main control board 12 and the drive board 13. At the same time, the clamping plate 23 can separate the main control board 12 and the drive board 13 to reduce mutual influence.

[0037] In order to enhance the device's heat dissipation and uniform temperature performance, refer to Figure 1 and Figure 2 , the substrate 18 and the partition 19 are provided with raised ridges 26, the periphery of the power element is provided with docking slots 27, the auxiliary heat-conducting assembly includes a heat-conducting sleeve 24 arranged on the periphery of the AC output connector 16 and the DC input connector 17, the heat-conducting sleeve 24 is also provided with a heat-dissipating pipeline 20, and the periphery of the heat-conducting sleeve 24 and the substrate 18 are provided with fins 25. The fins 25 are provided to improve the heat dissipation effect. The heat-conducting sleeve 24 is provided in combination with the heat-dissipating pipeline 20, and the heat-conducting fluid can be introduced into the heat-conducting sleeve 24. During the heat dissipation cycle, the temperature of the heat-conducting sleeve 24 is controlled to avoid the temperature of the heat-conducting sleeve 24 being too low, and the temperature difference between the AC output connector 16 and the DC input connector 17 and the device body is reduced, and the heat dissipation area of ​​the entire device is also expanded, thereby improving the heat dissipation effect. The ridges 26 are provided to facilitate the embedding of the power element docking slot 27, facilitate the installation of the power element, and have a good fixing effect. At the same time, the contact area between the substrate 18 and the partition 19 and the power element is increased, thereby improving the heat dissipation effect.

[0038] Reference Figure 1 and Figure 2 The driving unit includes a semiconductor power generation chip 22 arranged in the installation shell 15. The semiconductor power generation chip 22 is provided with several pieces. The semiconductor power generation chip 22 is arranged in contact with the substrate 18 and the partition 19. A PLC controller is also provided. The semiconductor power generation chip 22 and the micro magnetic pump 21 are both electrically connected to the PLC controller. The semiconductor power generation chip 22 is arranged in contact with the substrate 18 and the partition 19. When the power element generates heat and causes the temperature to rise and fall, the semiconductor power generation chip 22 generates electricity through the temperature difference and supplies the micro magnetic pump 21 for operation. At the same time, the working efficiency of the micro magnetic pump 21 is controlled by the PLC controller. The whole device effectively utilizes the heat generated by the power element. The higher the temperature, the better the power generation efficiency of the semiconductor power generation chip 22, thereby improving the working efficiency of the micro magnetic pump 21, and then enhancing the cooling and heat dissipation effect of the device. The whole system has a good linkage effect and a high degree of automation, which greatly improves the heat dissipation efficiency in the device.

[0039] It should be noted that, for the convenience of display in this figure, the distribution of the heat dissipation pipeline 20 circuit is relatively simple. The heat dissipation pipeline 20 can be evenly distributed along the inside of the substrate 18 and the partition 19 and the inside of the heat-conducting sleeve 24 and the clamping plate 23, which constitutes an internal heat-conducting fluid heat dissipation cycle.

[0040] Embodiment 2

[0041] The structure of the second embodiment is basically the same as that of the first embodiment, except that the micro magnetic pump 21 in the second embodiment is powered without the semiconductor power generation chip 22, the micro magnetic pump 21 is electrically connected to the power supply, and the driving unit includes a PLC controller provided on the micro magnetic pump 21, and the PLC controller and the micro magnetic pump 21 are both electrically connected to the main control board 12. The PLC controller can be linked to the main control board 12, and then actively control the micro magnetic pump 21 to drive the heat transfer fluid to circulate. Of course, the micro magnetic pump 21 can also be electrically connected to the power supply, and actively controlled by the PLC controller, combined with the solution of setting a semiconductor power generation chip 22 as a supplementary power supply.

[0042] Implementation principle: The present invention discloses a connection device of an integrated controller, which evenly distributes the various heat-generating power components in the installation shell 15 by arranging the power components in a plurality of independent modular arrangements and evenly distributing them in the bottom compartment of the installation shell 15, reasonably rearranges the heat-generating area, and arranges the base plate 18 and the partition plate 19 to separate and bring the power components close to each other, so as to facilitate the heat dissipation of each power component, and at the same time, drives the heat-conducting fluid to flow along the heat-dissipating pipeline 20 through the driving mechanism, and the driving unit drives the micro-magnetic pump 21 to operate, thereby causing the heat-conducting fluid to flow along the heat-dissipating pipeline 20, causing the temperature of the entire device to drop evenly, and the temperature distribution is even, and the micro-magnetic pump 21 is arranged. The pump 21 does not need to directly contact the heat transfer fluid, and the entire cooling circulation system has good sealing performance, which meets the requirements of electrical components such as the integrated controller, promotes the temperature in the heat dissipation component to drop evenly, and the entire device heats up evenly to avoid abnormal heating points. The installation shell 15 is made of metal material to facilitate heat dissipation, and at the same time promotes heat transfer between the auxiliary heat conduction component and the heat dissipation component, and promotes the temperature between the AC output connector 16 and the DC input connector 17 and the installation shell 15 to be maintained similar, avoiding excessive temperature difference and condensation. The entire device has good heat dissipation effect and uniform temperature distribution, reducing the temperature difference between the integrated controller connection cable and the main body, and maintaining stable operation of the device.

[0043] It should be noted that the component connection relationships not specifically mentioned in the present invention are assumed to adopt the existing technology. Since they do not involve the invention point and are widely used in the existing technology, the structural connection relationships are not described in detail.

Claims

1. A connection device for an integrated controller, comprising a controller body, wherein the controller body comprises an upper cover plate (11), a main control board (12), a drive board (13), a capacitor assembly (14), a power element, and a mounting shell (15), wherein two sides of the mounting shell (15) are respectively provided with an AC output connector (16) and a DC input connector (17), wherein: The power elements are arranged in a plurality of independent modular configurations and are evenly distributed in the bottom compartment of the installation shell (15); a heat dissipation component is distributed around the power elements; the installation shell (15) is made of metal; the heat dissipation component comprises a substrate (18) arranged at the bottom end of the power elements; the substrate (18) is connected to the installation shell (15); a partition (19) is provided between adjacent power elements on the substrate (18); a heat dissipation pipeline (20) is distributed between the substrate (18) and the partition (19); a heat conduction fluid is provided in the heat dissipation pipeline (20); a driving mechanism for driving the heat conduction fluid to flow along the heat dissipation pipeline (20) is provided in the heat dissipation pipeline (20); an auxiliary heat conduction component is provided on the AC output connector (16) and the DC input connector (17); the auxiliary heat conduction component is connected to the heat dissipation component.

2. A connection device for an integrated controller according to claim 1, characterized in that: The driving mechanism comprises a micro magnetic pump (21) arranged on the mounting housing (15); the micro magnetic pump (21) is in communication with the heat dissipation pipeline (20); and the mounting housing (15) is also provided with a driving unit for driving the micro magnetic pump (21) to operate.

3. A connection device for an integrated controller according to claim 2, characterized in that: The driving unit comprises a semiconductor power generation chip (22) arranged in the mounting shell (15), wherein the semiconductor power generation chip (22) is provided with a plurality of pieces, and the semiconductor power generation chip (22) is arranged in contact with the substrate (18) and the partition (19), and a PLC controller is also provided, and the semiconductor power generation chip (22) and the micro magnetic pump (21) are both electrically connected to the PLC controller.

4. A connection device for an integrated controller according to claim 3, characterized in that: The substrate (18) is made of metal, and the space between the semiconductor power generation sheet (22) and the substrate (18) is filled with heat-conducting mud.

5. A connection device for an integrated controller according to claim 2, characterized in that: The micro magnetic pump (21) is electrically connected to a power source, the drive unit comprises a PLC controller arranged on the micro magnetic pump (21), and the PLC controller and the micro magnetic pump (21) are both electrically connected to the main control board (12).

6. A connection device for an integrated controller according to claim 1, characterized in that: The heat dissipation component further comprises a clamping plate (23) arranged between the main control board (12) and the driving board (13), and a heat dissipation pipeline (20) is also distributed in the clamping plate (23).

7. A connection device of an integrated controller according to claim 1, characterized in that: The auxiliary heat-conducting component comprises a heat-conducting sleeve (24) arranged on the outer periphery of the AC output connector (16) and the DC input connector (17), and a heat-dissipating pipeline (20) is also distributed in the heat-conducting sleeve (24).

8. A connection device for an integrated controller according to claim 7, characterized in that: Fins (25) are distributed on the peripheries of the heat-conducting sleeve (24) and the base plate (18).

9. A connection device of an integrated controller according to claim 1, characterized in that: The base plate (18) and the partition plate (19) are provided with raised ridges (26), and the outer periphery of the power element is provided with docking slots (27).

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