A circuit board half-hole grinding device and method

Abstract

The present application provides a half-hole grinding device and method for a circuit board, which relates to the technical field of circuit board processing. The device includes a bottom plate, a moving plate, a fixing component, and a grinding component; the moving plate is arranged parallel to the upper side of the bottom plate and is movably arranged along the length direction of the bottom plate. A circular hole is vertically penetrated through the center of the moving plate; the fixing component includes two pressing plates symmetrically arranged above the moving plate and arranged along the length direction of the bottom plate, and a lifting plate arranged below the moving plate. The pressing plates and the lifting plate are both movably arranged in the vertical direction. A communicating pipe that is rotationally matched with the lifting plate and moves synchronously is vertically penetrated through the lifting plate, and the axis thereof coincides with the axis of the circular hole. The top of the communicating pipe is communicated with a suction cup, and the diameter of the suction cup is less than or equal to the inner diameter of the circular hole; two grinding components are symmetrically arranged on both sides of the bottom plate. The solution of the present application has a simple structure, and can improve the grinding accuracy of the circuit board while also improving the grinding efficiency.

Description

Technical Field

[0001] The present application relates to the technical field of circuit board processing, and particularly relates to a circuit board half-hole grinding device and method. Background Art

[0002] With the increase in the integration degree of circuit boards, three-dimensional design has become an indispensable trend under the premise of subsequent large-scale integrated circuits. In a large number of three-dimensional designs, many integrated functions that cannot be satisfied by conventional electronic ICs must be replaced by small integrated circuit modules. When designing all small circuit integrated modules, considering the intercommunication and stability between the module and the main board, it must be designed to be docked with the main board in the form of a half-sunk hole connection as Figure 1 shown.

[0003] Half-sunk holes are formed at the edges around the circuit board. A half-through hole is coaxially formed at the bottom of the half-sunk hole. The diameter of the half-through hole is smaller than that of the half-sunk hole. During the formation of the half-through hole, due to the tool, situations such as Figure 2 shown missing processing or incomplete processing may occur. Therefore, it is necessary to manually grind the half-through hole again. However, manual grinding is not only time-consuming and laborious, but also has low grinding accuracy. Therefore, it is necessary to make improvements. Summary of the Invention

[0004] In order to solve the above deficiencies of the prior art, the present application provides a circuit board half-hole grinding device and method, which has a simple structure and can improve the grinding accuracy and efficiency of the circuit board at the same time.

[0005] In order to achieve the above object, the present invention adopts the following technologies:

[0006] A circuit board half-hole grinding device includes a bottom plate, a moving plate, a fixing component, and a grinding component;

[0007] The moving plate is arranged parallel above the bottom plate and is movably arranged along the length direction of the bottom plate. A circular hole is vertically penetrated through the center of the moving plate;

[0008] The fixing component includes two pressing plates symmetrically arranged above the moving plate and arranged along the length direction of the bottom plate, and a lifting plate arranged below the moving plate. The pressing plates and the lifting plate are both movably arranged in the vertical direction. A communicating pipe that rotates in cooperation with and moves synchronously with the lifting plate is vertically penetrated through the lifting plate. The communicating pipe is rotatably arranged around its own axis, and the axis coincides with the axis of the circular hole. A suction cup is connected to the top of the communicating pipe, and the diameter of the suction cup is less than or equal to the inner diameter of the circular hole;

[0009] Two grinding components are symmetrically arranged on both sides of the bottom plate, including a first vertical plate movably arranged along the width direction of the bottom plate, a first horizontal plate connected to the inner side end of the top of the first vertical plate, a U-shaped block located below the first horizontal plate, and a milling cutter vertically passing through the first horizontal plate and driven to rotate by a first motor. The outer side surface of the arc end of the U-shaped block faces the moving plate and is used to cooperate with the inner wall of the semi-sunken hole of the circuit board to be ground. The open end of the U-shaped block is connected to a guide rod horizontally passing through the first vertical plate. A first spring is sleeved on the guide rod between the first vertical plate and the open end. The shaft rod of the milling cutter is located between the two straight sections of the U-shaped block. The cutting part at the bottom end of the shaft rod is located below the U-shaped block. The inner side surface of the arc end of the U-shaped block is used to cooperate with the outer wall of the shaft rod. The milling diameter of the cutting part is equal to the inner diameter of the semi-through hole of the circuit board to be ground.

[0010] Further, the pressing plate is connected to the top end of a second vertical plate. The second vertical plate vertically passes through the moving plate. The bottom end of the second vertical plate is horizontally connected with a second horizontal plate. Limit plates are arranged below both ends of the moving plate. When the bottom surface of the limit plate is in contact with the top surface of the second horizontal plate, the distance between the pressing plate and the moving plate is greater than the thickness of the circuit board.

[0011] Further, the second horizontal plates and the lifting plates are connected by second springs arranged vertically.

[0012] Further, fourth vertical plates are arranged on both sides of the bottom plate. A chute is formed through the fourth vertical plate. The chute includes a first section, a second section, a third section, a fourth section, a fifth section, and a sixth section connected in sequence. The first section, the third section, and the fifth section are horizontal grooves. The length of the third section is greater than or equal to the length of the moving plate. The second section is an inclined groove with a downward trend. The fourth section and the sixth section are inclined grooves with an upward trend. Sliding rods are horizontally connected to both sides of the lifting plate. The sliding rods slidably pass through the chute. When the sliding rods are in the first section, the distance between the pressing plate and the moving plate is greater than the thickness of the circuit board, and the suction cups are not higher than the top surface of the moving plate. When the sliding rods are in the third section, the distance between the pressing plate and the moving plate is equal to the thickness of the circuit board, and the suction cups are not higher than the top surface of the moving plate. When the sliding rods are in the fifth section, the distance between the pressing plate and the suction cups is greater than the thickness of the circuit board, and the suction cups are higher than the top surface of the moving plate. When the sliding rods are at the top end of the sixth section, the distance between the pressing plate and the moving plate is greater than the thickness of the circuit board, and the distance between the suction cups and the pressing plate is equal to the thickness of the circuit board.

[0013] A method for grinding semi-holes of a circuit board, using the above-mentioned circuit board semi-hole grinding device, the method includes the following steps:

[0014] Placing the circuit board: The moving plate is located on one side of the grinding component, and the sliding rods are in the first section, so that the distance between the pressing plate and the moving plate is greater than the thickness of the circuit board, and the suction cups are not higher than the top surface of the moving plate, so as to place the circuit board in the middle on the moving plate;

[0015] First half-hole grinding: The moving plate passes through the grinding assembly along the first moving direction. The sliding rod is located in the third section, so that the distance between the pressing plate and the moving plate is equal to the thickness of the circuit board, and the suction cup is not higher than the top surface of the moving plate to press the circuit board onto the moving plate. Define the two sides of the circuit board parallel to the length direction of the bottom plate as the sides to be ground. Align the semi-sunken holes with the grinding assembly in sequence according to the moving direction, and use the grinding assembly to grind the semi-through holes.

[0016] Circuit board adsorption: The moving plate is located on the other side of the grinding assembly. The sliding rod is located in the sixth section, so that the distance between the pressing plate and the moving plate is greater than the thickness of the circuit board, and the distance between the suction cup and the pressing plate is equal to the thickness of the circuit board to adsorb the circuit board onto the suction cup.

[0017] Circuit board rotation: The moving plate is located on the other side of the grinding assembly. The sliding rod is located in the fifth section, so that the distance between the pressing plate and the suction cup is greater than the thickness of the circuit board, and the suction cup is higher than the top surface of the moving plate 2, so that the suction cup drives the circuit board to rotate 90 degrees to switch the sides of the circuit board to be ground to the other two unground sides.

[0018] Second half-hole grinding: The moving plate passes through the grinding assembly along the second moving direction. The first moving direction is opposite to the second moving direction. The sliding rod is located in the third section, and the circuit board is pressed onto the moving plate. Define the two sides of the circuit board parallel to the length direction of the bottom plate as the sides to be ground. Align the semi-sunken holes with the grinding assembly in sequence according to the moving direction, and use the grinding assembly to grind the semi-through holes.

[0019] Circuit board removal: The moving plate is located on one side of the grinding assembly. The sliding rod is located in the first section, so that the distance between the pressing plate and the moving plate is greater than the thickness of the circuit board, and the suction cup is not higher than the top surface of the moving plate to remove the circuit board from the moving plate.

[0020] The beneficial effects of the present invention are as follows:

[0021] 1. By moving the pressing plate and the lifting plate, the positional relationship between the pressing plate and the suction cup relative to the moving plate and the relative distance between the pressing plate and the suction cup can be adjusted to meet the working requirements of different stages.

[0022] 2. Through the cooperation of the U-shaped block and the milling cutter, automatic positioning of the milling cutter can be achieved, so that the axis of the arc section of the U-shaped block, the milling cutter, and the half-hole coincide, and situations such as excessive feed can also be prevented, improving the precision of grinding.

[0023] 3. Through the cooperation of the movement of the moving plate in the length direction of the bottom plate and the movement of the grinding assembly in the width direction of the bottom plate, the semi-holes of the circuit board can be continuously ground, improving the working efficiency of semi-hole grinding.

[0024] 4. Through the settings of the limit plate, the second spring, and the six-section chute, the automatic adjustment of the positions of the pressing plate and the suction cup can be achieved only by the movement of the lifting plate, improving the working efficiency of half-hole grinding. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The drawings described herein are only for illustrating the selected embodiments, not all possible implementation schemes, and are not intended to limit the scope of the present invention.

[0026] Figure 1 It is a schematic structural diagram of the circuit board in the embodiment of the present application.

[0027] Figure 2 is Figure 1 The partial enlarged view of A in

[0028] Figure 3 It is a three-dimensional view of the overall structure in the embodiment of the present application.

[0029] Figure 4 It is a schematic structural diagram of the moving plate and the fixing component in the embodiment of the present application.

[0030] Figure 5 It is a schematic cross-sectional view of the moving plate and the fixing component in the circuit board placing stage and the circuit board taking-out stage in the embodiment of the present application.

[0031] Figure 6 It is a schematic cross-sectional view of the moving plate and the fixing component in the first half-hole grinding stage and the second half-hole grinding stage in the embodiment of the present application.

[0032] Figure 7 It is a schematic cross-sectional view of the moving plate and the fixing component in the circuit board adsorption stage in the embodiment of the present application.

[0033] Figure 8 It is a schematic side view of the grinding component in the embodiment of the present application.

[0034] Figure 9 It is a schematic top view of the grinding component in cooperation with the half-hole in the embodiment of the present application.

[0035] Figure 10 It is a schematic side view of the grinding component in cooperation with the half-hole in the embodiment of the present application.

[0036] Figure 11 It is a schematic structural diagram of the chute in the embodiment of the present application.

[0037] Figure 12 It is a schematic structural diagram of the U-shaped fitting block and the fitting strip in the embodiment of the present application.

[0038] Figure 13 It is a schematic internal structure diagram of the lifting plate in the embodiment of the present application.

[0039] Figure 14 It is a flowchart of the method for grinding half holes of a circuit board in an embodiment of the present application.

[0040] Reference numerals: bottom plate - 1, moving plate - 2, fixing assembly - 3, grinding assembly - 4, worm gear - 5, screw rod - 6, fourth vertical plate - 11, limiting plate - 21, third vertical plate - 22, pressing plate - 31, second vertical plate - 32, second horizontal plate - 33, lifting plate - 34, suction cup - 35, second spring - 36, connecting pipe - 37, first vertical plate - 41, first horizontal plate - 42, U - shaped block - 43, first spring - 44, milling cutter - 45, guide rod - 46, chute - 111, sliding rod - 341, worm - 342, U - shaped fitting block - 431, fitting strip - 432, first section - 1111, second section - 1112, third section - 1113, fourth section - 1114, fifth section - 1115, sixth section - 1116. Specific embodiments

[0041] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the following will describe the embodiments of the present invention in detail with reference to the accompanying drawings. However, the embodiments described herein are only a part of the embodiments of the present invention, not all of them.

[0042] Embodiment 1

[0043] This embodiment provides a device for grinding half holes of a circuit board, as Figures 3 - 10 shown, including a bottom plate 1, a moving plate 2, a fixing assembly 3, and a grinding assembly 4.

[0044] As Figure 3 shown, the moving plate 2 is arranged parallel to the upper side of the bottom plate 1 and is movably arranged along the length direction of the bottom plate 1. A circular hole is vertically penetrated through the center of the moving plate 2.

[0045] As Figures 3 - 7 shown, the fixing assembly 3 includes two pressing plates 31 symmetrically arranged above the moving plate 2 and along the length direction of the bottom plate 1, and a lifting plate 34 arranged below the moving plate 2. The pressing plates 31 and the lifting plate 34 are both movably arranged in the vertical direction. A connecting pipe 37 that is rotationally and synchronously moved in cooperation with the lifting plate 34 is vertically penetrated through the lifting plate 34. The connecting pipe 37 is rotatably arranged around its own axis, and the axis coincides with the axis of the circular hole. A suction hose is connected to the bottom of the connecting pipe 37, and the suction hose is connected to a suction device. A suction cup 35 is connected to the top of the connecting pipe 37. The diameter of the suction cup 35 is less than or equal to the inner diameter of the circular hole, so that the suction cup 35 can pass through the circular hole. Specifically, the bottom surface of the pressing plate 31 can be made of materials such as rubber, which can not only avoid damaging the circuit board when pressing the circuit board, but also improve the friction of the pressing plate 31 and enhance the fixing effect of the pressing plate 31 to prevent the circuit board from shifting due to external forces.

[0046] AsFigure 3 , Figures 8 - 10 As shown in Figures 8 - 10 , two grinding components 4 are symmetrically arranged on both sides of the bottom plate 1. Each grinding component 4 includes a first vertical plate 41 movably arranged along the width direction of the bottom plate 1, a first horizontal plate 42 connected to the inner side end of the top of the first vertical plate 41, a U-shaped block 43 located below the first horizontal plate 42, and a milling cutter 45 vertically passing through the first horizontal plate 42 and driven to rotate by a first motor. The grinding component 4 is driven to move by a cylinder, the milling cutter 45 is driven to rotate by a first motor, and the outer side surface of the arc end of the U-shaped block 43 faces the moving plate 2 and is used to cooperate with the inner wall of the semi-sunken hole of the circuit board to be ground. The open end of the U-shaped block 43 is connected to a guide rod 46 horizontally passing through the first vertical plate 41. A first spring 44 is sleeved on the guide rod 46 between the first vertical plate 41 and the open end. The shaft of the milling cutter 45 is located between the two straight sections of the U-shaped block 43, and the cutting part at the bottom end of the shaft is located below the U-shaped block 43. The inner side surface of the arc end of the U-shaped block 43 is used to cooperate with the outer wall of the shaft. The milling diameter of the cutting part is equal to the inner diameter of the semi-through hole of the circuit board to be ground. Through the cooperation of the U-shaped block 43 and the milling cutter 45, the positioning of the milling cutter 45 can be automatically realized, and situations such as excessive feed can be prevented, improving the precision of grinding.

[0047] As Figures 8 - 10 shown in Figures 8 - 10 , the grinding method is specifically as follows: Move the first vertical plate 41 to make the outer side surface of the arc end of the U-shaped block 43 closely adhere to the inner wall of the semi-sunken hole, and the outer wall of the shaft closely adhere to the inner side surface of the arc end of the U-shaped block 43. At this time, the first spring 44 is in a compressed state, and the axes of the arc end of the U-shaped block 43, the milling cutter 45, and the semi-hole coincide. At this time, the rotating milling cutter 45 can grind the semi-through hole. Specifically, the correspondence between the semi-hole and the grinding component 4 can be realized by a detection instrument, and it is judged by whether the arc end of the U-shaped block 43 corresponds to the semi-sunken hole. More specifically, one grinding component 4 is provided with a detection instrument to ensure that when the grinding object is a circuit board with asymmetric semi-holes on two parallel side edges, the two grinding components 4 can also work independently.

[0048] Specifically, as Figures 5 - 7 shown in Figures 5 - 7 , the pressing plate 31 is connected to the top end of a second vertical plate 32 vertically passing through the moving plate 2. The bottom end of the second vertical plate 32 is horizontally connected with a second horizontal plate 33. Limiting plates 21 are arranged below both ends of the moving plate 2. When the bottom surface of the limiting plate 21 is in contact with the top surface of the second horizontal plate 33, the distance between the pressing plate 31 and the moving plate 2 is greater than the thickness of the circuit board to limit the predetermined highest point that the pressing plate 31 can rise.

[0049] Specifically, as Figures 4 - 7As shown, the second cross plate 33 and the lifting plate 34 are connected by vertically arranged second springs 36. Through the arrangement of the second springs 36 and the limiting plate 21, on the one hand, the positions of the pressing plate 31 and the suction cup 35 can be adjusted only according to the height of the lifting plate 34. On the other hand, the second springs 36 can provide a certain buffering ability for the pressing plate 31 to avoid damaging the circuit board when pressing.

[0050] Specifically, as Figure 3 shown, fourth vertical plates 11 are provided on both sides of the bottom plate 1, mounting plates are erected on the fourth vertical plates 11, the grinding assembly 4 and the cylinder for driving the movement of the grinding assembly 4 are both arranged on the mounting plates, and sliding grooves 111 are formed through the fourth vertical plates 11. As Figure 11 shown, the sliding groove 111 includes a first section 1111, a second section 1112, a third section 1113, a fourth section 1114, a fifth section 1115 and a sixth section 1116 connected in sequence. The first section 1111, the third section 1113 and the fifth section 1115 are horizontal grooves, the second section 1112 is an inclined groove with a downward trend, and the fourth section 1114 and the sixth section 1116 are inclined grooves with an upward trend. Sliding rods 341 are horizontally connected to both sides of the lifting plate 34, and the sliding rods 341 are slidably inserted into the sliding groove 111. When the sliding rod 341 is in the first section 1111, as Figure 5 shown, the distance between the pressing plate 31 and the moving plate 2 is greater than the thickness of the circuit board, and the suction cup 35 is not higher than the top surface of the moving plate 2. When the sliding rod 341 is in the third section 1113, as Figure 6 shown, the distance between the pressing plate 31 and the moving plate 2 is equal to the thickness of the circuit board, and the suction cup 35 is not higher than the top surface of the moving plate 2. When the sliding rod 341 is in the fifth section 1115, as Figure 7 shown, the distance between the pressing plate 31 and the suction cup 35 is greater than the thickness of the circuit board, and the suction cup 35 is higher than the top surface of the moving plate 2. When the sliding rod 341 is at the top of the sixth section 1116, the distance between the pressing plate 31 and the moving plate 2 is greater than the thickness of the circuit board, and the distance between the suction cup 35 and the pressing plate 31 is equal to the thickness of the circuit board. Among them, the length of the third section 1113 is greater than or equal to the length of the moving plate 2, so that when the entire moving plate 2 passes through the grinding assembly 4, the distance between the pressing plate 31 and the moving plate 2 is always equal to the thickness of the circuit board, and the suction cup 35 is always not higher than the top surface of the moving plate 2 to maintain the pressing state of the circuit board to adapt to the half-hole grinding of circuit boards with different lengths or widths. Through the sliding fit of the sliding rod 341 and the sliding groove 111, during the movement of the moving plate 2 along the length direction of the bottom plate 1, the height of the lifting plate 34 can automatically change, and then the positions of the pressing plate 31 and the suction cup 35 can be automatically adjusted according to the different positions of the moving plate 2.

[0051] To meet the grinding requirements of different-sized half-holes on the circuit board, the milling cutter 45 and the U-shaped mating block 431 are a set of associated replaceable components. Specifically, asFigure 12 As shown, the U-shaped block 43 includes a U-shaped fitting block 431 and two fitting bars 432 inserted into the straight sections of the U-shaped fitting block 431. The U-shaped fitting block 431 and the fitting bars 432 are fixed by locking screws. There are two first springs 44 and two guide rods 46, which are correspondingly connected to the outer ends of the two fitting bars 432. The shaft of the milling cutter 45 is detachably connected to the output shaft of the first motor. For circuit boards with inconsistent half-holes, multiple pairs of grinding components 4 with different specifications can be correspondingly arranged in a circuit board half-hole grinding device.

[0052] More specifically, as Figure 13 shown, the inside of the lifting plate 34 is hollow, and a worm gear 5 is sleeved outside the connecting pipe 37. The worm gear 5 meshes with a worm 342. The worm gear 5 and the worm 342 are located inside the lifting plate 34 and are driven to rotate by a second motor to realize the rotation of the connecting pipe relative to the lifting plate 34.

[0053] More specifically, as Figure 3 shown, third vertical plates 22 are provided below both ends of the moving plate 2. A screw rod 6 is threaded through one of the third vertical plates 22, and a guide rod is slidably inserted through the other third vertical plate 22. The screw rod 6 and the guide rod are both arranged along the length direction of the bottom plate 1. The screw rod 6 is driven to rotate by a third motor to realize the movement of the moving plate 2 along the length direction of the bottom plate 1.

[0054] Embodiment 2

[0055] As Figure 14 shown, this embodiment provides a method for grinding half-holes of a circuit board, using the circuit board half-hole grinding device described in Embodiment 1. The method steps are as follows:

[0056] Placing the circuit board: The moving plate 2 is located on one side of the grinding component 4, the sliding rod 341 is located in the first section 1111, so that the distance between the pressing plate 31 and the moving plate 2 is greater than the thickness of the circuit board, and the suction cup 35 is not higher than the top surface of the moving plate 2, so as to place the circuit board in the middle on the moving plate 2.

[0057] Grinding the first half-hole: The moving plate 2 passes through the grinding component 4 along the first moving direction, the sliding rod 341 is located in the third section 1113, so that the distance between the pressing plate 31 and the moving plate 2 is equal to the thickness of the circuit board, and the suction cup 35 is not higher than the top surface of the moving plate 2, so as to press the circuit board tightly on the moving plate 2. Define the two sides of the circuit board parallel to the length direction of the bottom plate 1 as the sides to be ground. Align the half-sunken holes with the grinding component 4 in sequence according to the moving direction, and use the grinding component 4 to grind the half-through holes. Among them, for circuit boards with asymmetric half-holes on both sides, the two grinding components 4 can work independently; for circuit boards with symmetric half-holes on both sides, the two grinding components 4 can work simultaneously.

[0058] Circuit board adsorption: The moving plate 2 is located on the other side of the grinding assembly 4, and the sliding rod 341 is located in the sixth section 1116, so that the distance between the pressing plate 31 and the moving plate 2 is greater than the thickness of the circuit board, and the distance between the suction cup 35 and the pressing plate 31 is equal to the thickness of the circuit board, so as to adsorb the circuit board on the suction cup 35. The pre-step of pressing the circuit board tightly by the bottom surfaces of the two pressing plates 31 and the suction cup 35 is to make the adsorption effect of the suction cup 35 more stable.

[0059] Circuit board rotation: The moving plate 2 is located on the other side of the grinding assembly 4, and the sliding rod 341 is located in the fifth section 1115, so that the distance between the pressing plate 31 and the suction cup 35 is greater than the thickness of the circuit board, and the suction cup 35 is higher than the top surface of the moving plate 2, so that there is a predetermined distance between the pressing plate 31 and the circuit board, so as to facilitate the suction cup 35 to drive the circuit board to rotate 90 degrees and switch the side of the circuit board to be ground to the other two unground sides.

[0060] Second half-hole grinding: The moving plate 2 moves along the second moving direction through the grinding assembly 4, the sliding rod 341 is located in the third section 1113, the first moving direction is opposite to the second moving direction, and the rest is the same as the first half-hole grinding.

[0061] Circuit board removal: The moving plate 2 is located on one side of the grinding assembly 4, and the sliding rod 341 is located in the first section 1111, so that the distance between the pressing plate 31 and the moving plate 2 is greater than the thickness of the circuit board, and the suction cup 35 is not higher than the top surface of the moving plate 2, so as to remove the circuit board from the moving plate 2.

[0062] By driving the circuit board to complete a reciprocating movement through the moving plate 2, the grinding work of the half-holes at the four sides of the circuit board can be completed.

[0063] According to the reciprocating movement path of the moving plate 2, the corresponding relationship between the position of the sliding rod 341 in the six-section chute 111 and the six steps is explained in turn as: the first section 1111 (circuit board placement), the second section 1112, the third section 1113 (first half-hole grinding), the fourth section 1114, the fifth section 1115, the sixth section 1116 (circuit board adsorption), the fifth section 1115 (circuit board rotation), the fourth section 1114, the third section 1113 (second half-hole grinding), the second section 1112, the first section 1111 (circuit board removal).

[0064] In application, the above is only the preferred embodiment of the present application and is not used to limit the present application. Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application.

Claims

1. A circuit board half-hole grinding device, the half-holes are formed at the four peripheral edges of the circuit board, and the half-holes include half-counterbores and half-through holes, characterized in that, Comprising: Bottom plate (1); Moving plate (2), arranged parallel to the upper side of the bottom plate (1) and movably arranged along the length direction of the bottom plate (1), and a circular hole penetrates through the center of the moving plate (2); Fixing assembly (3), including two pressing plates (31) symmetrically arranged above the moving plate (2) and along the length direction of the bottom plate (1) and a lifting plate (34) arranged below the moving plate (2), both the pressing plate (31) and the lifting plate (34) are movably arranged in the vertical direction, a communicating pipe (37) which is rotationally matched with and moves synchronously with the lifting plate (34) is vertically penetrated through the lifting plate (34), the axis of the communicating pipe (37) coincides with the axis of the circular hole, a suction cup (35) is connected to the top of the communicating pipe (37), and the diameter of the suction cup (35) is less than or equal to the inner diameter of the circular hole; Two grinding assemblies (4), symmetrically arranged on both sides of the bottom plate (1), including a first vertical plate (41) movably arranged along the width direction of the bottom plate (1), a first horizontal plate (42) connected to the inner side end of the top of the first vertical plate (41), a U-shaped block (43) located below the first horizontal plate (42), and a milling cutter (45) vertically penetrated through the first horizontal plate (42) and driven to rotate by a first motor, the outer side of the arc end of the U-shaped block (43) faces the moving plate (2) and is used for cooperating with the inner wall of the semi-sunken hole of the circuit board to be ground, the open end of the U-shaped block (43) is connected to a guide rod (46) horizontally penetrated through the first vertical plate (41), a first spring (44) is sleeved on the guide rod (46) and located between the first vertical plate (41) and the open end, the shaft of the milling cutter (45) is located between the two straight sections of the U-shaped block (43), the cutting part at the bottom end of the shaft is located below the U-shaped block (43), and the inner side of the arc end of the U-shaped block (43) is used for cooperating with the outer wall of the shaft, and the milling diameter of the cutting part is equal to the inner diameter of the semi-through hole of the circuit board to be ground.

2. The semi - hole grinding device for a circuit board according to claim 1, characterized in that, The pressing plate (31) is connected to the top end of a second vertical plate (32), the second vertical plate (32) is vertically penetrated through the moving plate (2), the bottom end of the second vertical plate (32) is horizontally connected with a second horizontal plate (33), and limiting plates (21) are arranged below both ends of the moving plate (2). When the bottom surface of the limiting plate (21) is attached to the top surface of the second horizontal plate (33), the distance between the pressing plate (31) and the moving plate (2) is greater than the thickness of the circuit board.

3. The semi-hole grinding device for a circuit board according to claim 2, wherein, The second horizontal plate (33) and the lifting plate (34) are both connected by a second spring (36) arranged vertically.

4. The semi-hole grinding device for a circuit board according to claim 3, characterized in that, On both sides of the bottom plate (1), there are fourth vertical plates (11). A chute (111) is penetrated through the fourth vertical plate (11). The chute (111) includes a first section (1111), a second section (1112), a third section (1113), a fourth section (1114), a fifth section (1115), and a sixth section (1116) that are connected in sequence. The first section (1111), the third section (1113), and the fifth section (1115) are horizontal grooves. The length of the third section (1113) is greater than or equal to the length of the moving plate (2). The second section (1112) is an inclined groove with a downward trend. The fourth section (1114) and the sixth section (1116) are inclined grooves with an upward trend. On both sides of the lifting plate (34), sliding rods (341) are horizontally connected. The sliding rods (341) are slidably inserted into the chute (111). When the sliding rod (341) is in the first section (1111), the distance between the pressing plate (31) and the moving plate (2) is greater than the thickness of the circuit board, and the suction cup (35) is not higher than the top surface of the moving plate (2). When the sliding rod (341) is in the third section (1113), the distance between the pressing plate (31) and the moving plate (2) is equal to the thickness of the circuit board, and the suction cup (35) is not higher than the top surface of the moving plate (2). When the sliding rod (341) is in the fifth section (1115), the distance between the pressing plate (31) and the suction cup (35) is greater than the thickness of the circuit board, and the suction cup (35) is higher than the top surface of the moving plate (2). When the sliding rod (341) is at the top of the sixth section (1116), the distance between the pressing plate (31) and the moving plate (2) is greater than the thickness of the circuit board, and the distance between the suction cup (35) and the pressing plate (31) is equal to the thickness of the circuit board.

5. A semi-hole grinding device for a circuit board according to claim 1, characterized in that, The U-shaped block (43) includes a U-shaped mating block (431) and two mating strips (432) for inserting into the straight sections of the U-shaped mating block (431). The U-shaped mating block (431) and the mating strips (432) are fixed by locking screws. There are two first springs (44) and two guide rods (46), which are correspondingly connected to the outer ends of the two mating strips (432). The shaft rod of the milling cutter (45) is detachably connected to the output shaft of the first motor.

6. The semi-hole grinding device for a circuit board according to claim 1, wherein, The inside of the lifting plate (34) is hollow. A worm gear (5) is sleeved outside the connecting pipe (37). The worm gear (5) meshes with a worm (342). The worm gear (5) and the worm (342) are located inside the lifting plate (34) and are driven to rotate by a second motor.

7. A half-hole grinding device for a circuit board according to claim 1, characterized in that, Below both ends of the moving plate (2), there are third vertical plates (22). A screw rod (6) is threaded through one of the third vertical plates (22), and a guide rod is slidably inserted through the other third vertical plate (22). The screw rod (6) and the guide rod are both arranged along the length direction of the bottom plate (1). The screw rod (6) is driven to rotate by a third motor.

8. A method for grinding half-holes of a circuit board, characterized in that, Adopt the circuit board half-hole grinding device as described in claim 4. The method includes the following steps: Circuit board placement: The moving plate (2) is located on one side of the grinding assembly (4), and the sliding rod (341) is in the first section (1111). Place the circuit board centered on the moving plate (2). First half-hole grinding: The moving plate (2) passes through the grinding assembly (4) along the first moving direction. The sliding rod (341) is located in the third section (1113), and the circuit board is pressed against the moving plate (2). The two sides of the circuit board parallel to the length direction of the bottom plate (1) are defined as the sides to be ground. The half-sunken holes are aligned with the grinding assembly (4) in sequence according to the moving direction, and the grinding assembly (4) is used to grind the half-through holes. Circuit board adsorption: The moving plate (2) is located on the other side of the grinding assembly (4). The sliding rod (341) is located in the sixth section (1116), and the circuit board is adsorbed on the suction cup (35). Circuit board rotation: The moving plate (2) is located on the other side of the grinding assembly (4). The sliding rod (341) is located in the fifth section (1115), and the suction cup (35) drives the circuit board to rotate 90 degrees, switching the sides of the circuit board to be ground to the other two ungrounded sides. Second half-hole grinding: The moving plate (2) passes through the grinding assembly (4) along the second moving direction. The first moving direction is opposite to the second moving direction. The sliding rod (341) is located in the third section (1113), and the circuit board is pressed against the moving plate (2). The two sides of the circuit board parallel to the length direction of the bottom plate (1) are defined as the sides to be ground. The half-sunken holes are aligned with the grinding assembly (4) in sequence according to the moving direction, and the grinding assembly (4) is used to grind the half-through holes. Circuit board removal: The moving plate (2) is located on one side of the grinding assembly (4). The sliding rod (341) is located in the first section (1111), and the circuit board is removed from the moving plate (2).

Images