A laser cutting method based on visual positioning and a laser circuit board cutting machine

Abstract

The present invention provides a laser cutting method and a laser board splitting machine based on visual positioning. The method includes: determining a laser cutting path based on a standard image template and a current image; analyzing the historical cutting effect to obtain an analysis result; and adjusting the laser cutting path based on the analysis result. The laser cutting method and the laser board splitting machine based on visual positioning of the present invention analyze the historical cutting effect, perform cutting adjustment based on the analysis result, and thus achieve more accurate and effective visual positioning cutting.

Description

Technical Field

[0001] The present invention relates to the technical field of machine vision, and particularly relates to a laser cutting method based on visual positioning and a laser panel cutting machine. Background Art

[0002] The laser cutting PCB panel cutting machine is an advanced PCB panel cutting and processing equipment, which can achieve high-precision, high-speed, high-efficiency and high-quality panel cutting and processing, and is widely used in fields such as electronics, communication, computer, and automobile. In the existing laser cutting machines, products and product carriers are transferred by a roller shaft method, and the laser cutting head moves above the roller shaft table, and the PCB board is cut by calibrating the position through a vision module. However, the calibration of the vision module is generally performed before cutting, and the position is calibrated according to a standard calibration image template. In the actual application process, due to the influence of mechanisms and the like, there are situations of partial or overall deviation. How to achieve more accurate and effective visual positioning cutting is a technical problem that needs to be solved urgently. Summary of the Invention

[0003] One of the purposes of the present invention is to provide a laser cutting method based on visual positioning and a laser panel cutting machine, which analyze the historical cutting effect, perform cutting adjustment based on the analysis result, and thus achieve more accurate and effective visual positioning cutting.

[0004] A laser cutting method based on visual positioning provided by an embodiment of the present invention includes:

[0005] Determine a laser cutting path based on a standard image template and a current image;

[0006] Analyze the historical cutting effect to obtain an analysis result;

[0007] Adjust the laser cutting path based on the analysis result.

[0008] Preferably, determining a laser cutting path based on a standard image template and a current image includes:

[0009] Map the standard image template to the current image and translate it;

[0010] During the translation process, compare the positioning area in the standard image template with the corresponding area in the current image;

[0011] When the comparison is in line, determine the cutting trajectory in the current image according to the preset trajectory line in the standard image template;

[0012] Determine the trajectory data of the cutting trajectory according to the coordinate system corresponding to the current image;

[0013] According to the coordinate system conversion rules, the trajectory data of the cutting trajectory is converted into the laser cutting path of the laser cutting head.

[0014] Preferably, analyze the historical cutting effect to obtain the analysis result, including:

[0015] Determine the expected trajectory and the actual trajectory corresponding to the cutting paths of the first preset number of times;

[0016] Perform point sampling on the expected trajectory and the actual trajectory to determine multiple associated point groups;

[0017] Based on the deviation between each point in each point group, construct a deviation array of the cutting path;

[0018] Arrange the deviation arrays of each cutting in order to form a deviation analysis data set;

[0019] Analyze the deviation analysis data set with a pre-configured deviation analysis library to obtain the analysis result.

[0020] Preferably, adjust the laser cutting path, including:

[0021] Analyze the analysis result to determine the point sampling rule and the deviation correction value of each point;

[0022] Based on the point sampling rule, perform point sampling on the laser cutting path and correct the sampled points according to the deviation correction value of each point;

[0023] Re-fit the corrected sampled points to obtain the adjusted laser cutting path.

[0024] Preferably, the laser cutting method based on visual positioning further includes:

[0025] Determine the expected trajectory and the actual trajectory corresponding to the cutting paths of the second preset number of times;

[0026] Perform point sampling on the expected trajectory and the actual trajectory to determine multiple associated point groups;

[0027] Based on the deviation between each point in each point group, construct a deviation array of the cutting path;

[0028] Use a pre-configured risk assessment library to perform a risk assessment on the deviation arrays of all cuts within the second preset number of times. When the risk assessment meets the trigger condition, trigger the adjustment of the laser cutting path.

[0029] The present invention also provides a laser board cutting machine, which includes a main body, a conveying mechanism, at least one image acquisition mechanism, at least one laser cutting mechanism and a main controller; the conveying mechanism is used to convey the board to be cut; the image acquisition mechanism and the laser cutting mechanism are associated with each other one by one and are arranged above the conveying mechanism, and the laser cutting mechanism can cut different boards respectively or cut the same board cooperatively; a laser cutting system based on visual positioning is configured in the main controller, and the laser cutting system includes: a path planning module, an analysis module and an adjustment module; wherein, the path planning module determines the laser cutting path based on the standard image template and the current image; the analysis module analyzes the historical cutting effect to obtain an analysis result; the adjustment module adjusts the laser cutting path based on the analysis result.

[0030] Preferably, the path planning module performs the following operations:

[0031] Map the standard image template to the current image and translate it;

[0032] During the translation process, compare the positioning area in the standard image template with the corresponding area in the current image;

[0033] When the comparison is in line, determine the cutting trajectory in the current image according to the preset trajectory line in the standard image template;

[0034] Determine the trajectory data of the cutting trajectory according to the coordinate system corresponding to the current image;

[0035] According to the coordinate system conversion rule, convert the trajectory data of the cutting trajectory into the laser cutting path of the laser cutting head.

[0036] Preferably, the analysis module performs the following operations:

[0037] Determine the expected trajectory and the actual trajectory corresponding to the cutting paths of the first preset number of times;

[0038] Perform point sampling on the expected trajectory and the actual trajectory to determine multiple associated point groups;

[0039] Based on the deviation between each point in each point group, construct a deviation array of the cutting path;

[0040] Arrange the deviation arrays of each cutting in order to form a deviation analysis data set;

[0041] Analyze the deviation analysis data set with a pre-configured deviation analysis library to obtain an analysis result.

[0042] Preferably, the adjustment module performs the following operations:

[0043] Analyze the analysis result to determine the point sampling rule and the deviation correction value of each point;

[0044] Based on the point sampling rule, perform point sampling on the laser cutting path and correct the sampled points according to the deviation correction values of each point;

[0045] Re-fit the corrected sampled points to obtain the adjusted laser cutting path.

[0046] Preferably, the laser board cutting machine further includes: a risk trigger module;

[0047] The risk trigger module performs the following operations:

[0048] Determine the expected trajectory and the actual trajectory corresponding to the cutting paths of the first and second preset numbers of times;

[0049] Perform point sampling on the expected trajectory and the actual trajectory to determine multiple associated point groups;

[0050] Based on the deviation between each point in each point group, construct a deviation array of the cutting path;

[0051] Use a pre-configured risk assessment library to perform a risk assessment on the deviation arrays of all cuts within the second preset number of times. When the risk assessment meets the trigger condition, trigger the adjustment of the laser cutting path.

[0052] Other features and advantages of the present invention will be described in the following specification, and, in part, will be obvious from the specification, or will be understood by practicing the present invention. The objectives and other advantages of the present invention can be realized and obtained by the structures specifically pointed out in the written specification and the drawings.

[0053] The technical solution of the present invention will be further described in detail below through the drawings and embodiments. Description of the Drawings

[0054] The drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation to the present invention. In the drawings:

[0055] Figure 1 is a schematic diagram of a vision-based laser cutting method in an embodiment of the present invention;

[0056] Figure 2 is a schematic diagram of a laser board cutting machine in an embodiment of the present invention;

[0057] Figure 3 is a schematic diagram of a vision-based laser cutting system in an embodiment of the present invention. Detailed Embodiments

[0058] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are only for explaining and illustrating the present invention, and are not used to limit the present invention.

[0059] An embodiment of the present invention provides a laser cutting method based on visual positioning, as Figure 1 shown, including:

[0060] Step 1: Determine the laser cutting path based on the standard image template and the current image;

[0061] Existing laser cutting methods based on visual positioning all use an image acquisition device to acquire an image of the working area corresponding to the laser cutting head, and then analyze the current image. Generally, a standard image template is used to compare with the current image to locate the real-time position of the plate to be cut in the working area, and then the position where the plate needs to be cut is fitted to obtain the laser cutting path; that is, based on the standard image template and the current image, determine the laser cutting path, including: mapping the standard image template to the current image and translating; during the translation process, comparing the positioning area in the standard image template with the corresponding area in the current image; when the comparison is in line, determine the cutting trajectory in the current image according to the preset trajectory line in the standard image template; determine the trajectory data of the cutting trajectory according to the coordinate system corresponding to the current image; according to the coordinate system conversion rule, convert the trajectory data of the cutting trajectory into the laser cutting path of the laser cutting head;

[0062] Step 2: Analyze the historical cutting effect to obtain the analysis result;

[0063] This application considers the actual application effect to improve the cutting accuracy; specifically: analyze the cutting effect before the current cutting operation, and use the analysis result to guide the current cutting, which can effectively consider the coordination of various components of the machine and the cutting deviation under the influence of factors such as the environment, thereby realizing the improvement of the cutting accuracy;

[0064] Step 3: Adjust the laser cutting path based on the analysis result. The analysis result mainly shows whether there is an offset in each cutting before the current cutting operation. When an offset occurs, determine whether to make an adjustment; for example: when the first cut is offset to the left and the second cut is offset to the right; both are offset left and right from the expected position, and the center of the offset is at the expected position, indicating that no adjustment is required; when each time is offset to the left or right, adjustment is required;

[0065] In order to realize the analysis of the historical cutting effect, among them, analyzing the historical cutting effect to obtain the analysis result includes:

[0066] Determine the expected trajectory and the actual trajectory corresponding to the cutting paths of the first preset number of times; wherein, the first preset number of times can be any value from 2 to 1;

[0067] Perform point sampling on the expected trajectory and the actual trajectory to determine multiple associated point groups; the rule of point sampling is that the number of points sampled on the expected trajectory and the actual trajectory is the same, and then equidistant sampling is performed to obtain each point; the points are associated according to the same serial number after sorting on the expected trajectory or the actual trajectory to obtain associated point groups;

[0068] Based on the deviation between each point in each point group, construct a deviation array of the cutting path; sort the deviations according to the serial number of the points in the point group to obtain the deviation array;

[0069] Arrange the deviation arrays of each cutting in order to form a deviation analysis data set; that is, each row in the deviation analysis data set corresponds to the deviation array of one time, and is arranged in chronological order from top to bottom;

[0070] Analyze the deviation analysis data set with a pre-configured deviation analysis library to obtain an analysis result. The deviation analysis library is pre-analyzed and configured, and in the library, the deviation analysis data set is in one-to-one correspondence with the analysis result.

[0071] In order to achieve accurate adjustment of the laser cutting path of the laser cutting head, wherein, adjusting the laser cutting path includes:

[0072] Analyze the analysis result to determine the point sampling rule and the deviation correction value of each point; the point sampling rule is actually the number of points specified for equidistant sampling; the analysis result includes the data corresponding to the point sampling rule and the deviation correction value of each point; the analysis process is to obtain the point sampling rule and the deviation correction value of each point by understanding this part of the data;

[0073] Based on the point sampling rule, perform point sampling on the laser cutting path and correct the sampled points according to the deviation correction value of each point;

[0074] Re-fit the corrected sampled points to obtain the adjusted laser cutting path.

[0075] Since it is more troublesome and unnecessary to calculate the adjustment every time according to the historical analysis, in order to determine when historical analysis is needed for adjustment, in one embodiment, the laser cutting method based on visual positioning further includes:

[0076] Determine the expected trajectory and the actual trajectory corresponding to the cutting paths of the second preset number of times; the setting of the second preset number of times is smaller than that of the first preset number of times; for example: the first preset number of times is set to 5, and the second preset number of times is set to 2;

[0077] Sample the points of the expected trajectory and the actual trajectory to determine multiple associated point groups;

[0078] Based on the deviations between the points in each point group, construct a deviation array of the cutting path;

[0079] Using a pre-configured risk assessment library, conduct a risk assessment on the deviation arrays of all cuts within the second preset number of times. When the risk assessment meets the trigger condition, trigger the adjustment of the laser cutting path. The risk assessment library is also pre-analyzed and configured, and the deviation arrays in the library are in one-to-one correspondence with the evaluation values; obtain the evaluation values corresponding to the evaluation of each cut through the deviation arrays of each cut; then, based on the weight coefficients corresponding to each time, take the sum of the products of the evaluation values of each cut and the corresponding weight coefficients as the total risk assessment value, and use the risk assessment value as the basis for trigger judgment. When the risk assessment value is greater than or equal to the risk threshold configured in the trigger condition, adjust the laser cutting path.

[0080] When the adjustment is triggered, it indicates that the cutting path needs to be adjusted. Therefore, how to make prior adjustments to subsequent cuts is the guarantee for ensuring the accuracy of subsequent cuts; in one embodiment, the laser cutting method based on visual positioning further includes: configuring a pre-adjustment array, and the pre-adjustment values of each point on the trajectory are configured in the pre-adjustment array; at the initial stage (when the software just runs), all the values in the pre-adjustment array are set to zero; when the first adjustment is triggered, calculate the deviation correction values of each point used for adjustment with a preset pre-adjustment coefficient (any one of 0.1 to 0.9) to obtain the values corresponding to each point in the pre-adjustment array; when the second adjustment is triggered, query the preset coefficient allocation table according to the number of cuts between the two adjustments to determine the coefficients corresponding to the first adjustment and the second adjustment; take the sum of the products of the deviation correction values of each point used for adjustment in the first adjustment and the second adjustment and their respective corresponding coefficients as the values corresponding to each point in the pre-adjustment array; thereafter, after each adjustment, query the coefficient according to the preset coefficient allocation table, and take the sum of the products of the deviation correction values of each point used for adjustment in each adjustment and their respective corresponding coefficients as the values corresponding to each point in the pre-adjustment array; however, with the increase in the number of adjustments, the amount of data of previous adjustments that need to be analyzed is increasing. At this time, the analysis volume is large, there is a large delay for cutting, and the improvement of accuracy is not significant. Therefore, a number threshold can be configured. When the historical cuts exceeding this number threshold are not considered, that is, the data of historical cuts with the number of adjustment intervals between the historical cuts and the current cut greater than the number threshold are not within the consideration range;

[0081] At each update reset, the pre-adjustment array is zero-adjusted. To extend the time when the first adjustment occurs, the pre-adjustment coefficient can be configured. By analyzing the pre-adjustment coefficients after each historical reset and the last pre-adjustment array, a configuration analysis dataset is constructed. Then, from the pre-configured configuration library, the corresponding configuration value is retrieved to configure the pre-adjustment coefficient. The configuration library is pre-analyzed and constructed, and the configuration values in the library are in one-to-one correspondence with the configuration analysis dataset. Each row of data in the configuration analysis dataset corresponds to the pre-adjustment coefficient of one update reset and the data in the last pre-adjustment array. However, this configuration rule requires a large amount of data. Therefore, a threshold for the number of times can be configured. When the number of update resets reaches the threshold for the number of times, the configuration adjustment of the pre-adjustment coefficient is performed.

[0082] Under normal circumstances, the number of cuts between each adjustment increases. If there is a trend of decreasing number of cuts, the pre-adjustment array needs to be zeroed and the pre-adjustment coefficient needs to be reduced. Among them, the determination of the trend of decreasing number of cuts can be analyzed between at least 3 to 5 adjustments. When it decreases in sequence, it can be determined as a trend of decreasing number of cuts. For the adjustment of the pre-adjustment coefficient, a decreasing step or an increasing step can be configured, and each decrease or adjustment is made according to the decreasing step or the increasing step. The decreasing step or the increasing step is the difference between the value after adjustment and the value before adjustment.

[0083] The present invention also provides a laser board cutting machine, including: a main body, a conveying mechanism, at least one image acquisition mechanism, at least one laser cutting mechanism, and a main controller; the conveying mechanism is used to convey the board to be cut; the image acquisition mechanism and the laser cutting mechanism are in one-to-one correspondence and are arranged above the conveying mechanism. The laser cutting mechanism can cut different boards respectively or cut the same board cooperatively; as Figure 2 shown, it is a laser board cutting machine with two image acquisition mechanisms and two laser cutting mechanisms. The laser board cutting machine includes: a main body 10, a conveying mechanism 11, two image acquisition mechanisms 12, two laser cutting mechanisms 13, and a main controller 14; the two image acquisition mechanisms 12 and the two laser cutting mechanisms 13 form two cutting stations; when cutting the same board, the conveying mechanism conveys the board to be cut under the image acquisition mechanism. The two image acquisition mechanisms respectively scan and photograph from both sides of the board. After the controller performs image stitching and analysis, it then controls the laser cutting mechanism to perform cooperative cutting; when cutting different boards, the conveying mechanism conveys two boards simultaneously and respectively conveys them under each laser cutting mechanism. Then, the corresponding image acquisition mechanism performs image scanning, plans the cutting, and then the laser cutting mechanism performs separate cutting;

[0084] A laser cutting system based on visual positioning is configured in the main controller, as Figure 3As shown in the figure, the laser cutting system includes: a path planning module 1, an analysis module 2, and an adjustment module 3. Among them, the path planning module 1 determines the laser cutting path based on a standard image template and the current image. The analysis module 2 analyzes the historical cutting effect to obtain an analysis result. The adjustment module 3 adjusts the laser cutting path based on the analysis result. The laser cutting system adopts a parallel processing mode when the laser cutting mechanism cuts different plates, that is, path planning and adjustment are carried out separately. When the laser cutting mechanism cuts the same plate, the current image is obtained by stitching the images collected by each image acquisition mechanism.

[0085] Among them, the path planning module performs the following operations:

[0086] Map the standard image template to the current image and translate it;

[0087] During the translation process, compare the positioning area in the standard image template with the corresponding area in the current image;

[0088] When the comparison is in line, determine the cutting trajectory in the current image according to the preset trajectory line in the standard image template;

[0089] Determine the trajectory data of the cutting trajectory according to the coordinate system corresponding to the current image;

[0090] According to the coordinate system conversion rule, convert the trajectory data of the cutting trajectory into the laser cutting path of the laser cutting head.

[0091] Among them, the analysis module performs the following operations:

[0092] Determine the expected trajectory and the actual trajectory corresponding to the cutting path of the first preset number of times;

[0093] Perform point sampling on the expected trajectory and the actual trajectory to determine multiple associated point groups;

[0094] Based on the deviation between each point in each point group, construct a deviation array of the cutting path;

[0095] Arrange the deviation arrays of each cutting in order to form a deviation analysis data set;

[0096] Analyze the deviation analysis data set with a pre-configured deviation analysis library to obtain an analysis result.

[0097] Among them, the adjustment module performs the following operations:

[0098] Analyze the analysis result to determine the point sampling rule and the deviation correction value of each point;

[0099] Based on the point sampling rule, perform point sampling on the laser cutting path and correct the sampled points according to the deviation correction value of each point;

[0100] Re - fit the corrected sampling points to obtain the adjusted laser cutting path.

[0101] In one embodiment, the laser circuit board cutting machine further includes: a risk triggering module;

[0102] The risk triggering module performs the following operations:

[0103] Determine the expected trajectory and the actual trajectory corresponding to the cutting paths of the first second preset number of times;

[0104] Perform point sampling on the expected trajectory and the actual trajectory to determine multiple associated point groups;

[0105] Based on the deviation between each point in each point group, construct a deviation array of the cutting path;

[0106] Use a pre - configured risk assessment library to perform a risk assessment on the deviation arrays of all cuts within the second preset number of times. When the risk assessment meets the trigger condition, trigger the adjustment of the laser cutting path.

[0107] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention also intends to include these changes and modifications.

Claims

1. A laser cutting method based on visual positioning, characterized in that, Including: Determine the laser cutting path based on a standard image template and the current image; Analyze the historical cutting effect to obtain an analysis result; Adjust the laser cutting path based on the analysis result; Also including: Configure a pre-adjustment array, in which pre-adjustment values for each point on the trajectory are configured; Set all values in the pre-adjustment array to zero in the initial stage; Configure a number threshold, and when the historical cutting exceeding this number threshold is not considered; By analyzing the pre-adjustment coefficients after each reset in history and the last pre-adjustment array, construct a configuration analysis data set, and then retrieve the corresponding configuration value from a pre-configured configuration library to configure the pre-adjustment coefficients; The number of cuts between each adjustment increases. If there is a trend of decreasing number of cuts, the pre-adjustment array needs to be set to zero and the pre-adjustment coefficient needs to be reduced.

2. The laser cutting method based on visual positioning according to claim 1, wherein Determine the laser cutting path based on a standard image template and the current image, including: Map the standard image template to the current image and translate it; During the translation process, compare the positioning area in the standard image template with the corresponding area in the current image; When the comparison is in line, determine the cutting trajectory in the current image according to the preset trajectory line in the standard image template; Determine the trajectory data of the cutting trajectory according to the coordinate system corresponding to the current image; According to the coordinate system conversion rule, convert the trajectory data of the cutting trajectory into the laser cutting path of the laser cutting head.

3. The laser cutting method based on visual positioning according to claim 1, wherein Analyze the historical cutting effect to obtain an analysis result, including: Determine the expected trajectory and the actual trajectory corresponding to the cutting paths of the first preset number of times; Perform point sampling on the expected trajectory and the actual trajectory to determine multiple associated point groups; Based on the deviation between each point in each point group, construct a deviation array of the cutting path; Arrange the deviation arrays of each cut in order to form a deviation analysis data set; Analyze the deviation analysis data set with a pre-configured deviation analysis library to obtain an analysis result.

4. The laser cutting method based on visual positioning according to claim 1, wherein Adjust the laser cutting path based on the analysis result, including: Analyze the analysis result to determine the point sampling rule and the deviation correction value for each point; Based on the point sampling rule, perform point sampling on the laser cutting path and correct the sampled points according to the deviation correction value for each point; Re-fit the corrected sampled points to obtain the adjusted laser cutting path.

5. A laser circuit board cutting machine, comprising a main body, a conveying mechanism, at least one image acquisition mechanism, at least one laser cutting mechanism and a main controller; characterized in that, The conveying mechanism is used to convey the plate to be cut; the image acquisition mechanism and the laser cutting mechanism are associated one by one and configured above the conveying mechanism. The laser cutting mechanism can cut different plates separately or cut the same plate cooperatively; the main controller is configured with a laser cutting system based on visual positioning. The laser cutting system includes: a path planning module, an analysis module, and an adjustment module; among them, the path planning module determines the laser cutting path based on a standard image template and the current image; the analysis module analyzes the historical cutting effect to obtain an analysis result; the adjustment module adjusts the laser cutting path based on the analysis result; The adjustment module also performs the following operations: Configure a pre-adjustment array, in which pre-adjustment values for each point on the trajectory are configured; at the initial stage, all values in the pre-adjustment array are set to zero; Configure a count threshold, and historical cuts exceeding this count threshold are not considered; By analyzing the pre-adjustment coefficients after each historical reset and the last pre-adjustment array, a configuration analysis data set is constructed, and then the corresponding configuration value is retrieved from a pre-configured configuration library to configure the pre-adjustment coefficients; The number of cuts between each adjustment increases. If there is a trend of decreasing number of cuts, the pre-adjustment array needs to be set to zero, and the pre-adjustment coefficients need to be reduced.

6. The laser board cutting machine according to claim 5, wherein, The path planning module performs the following operations: Map the standard image template to the current image and translate it; During the translation process, compare the positioning area in the standard image template with the corresponding area in the current image; When the comparison is in line, determine the cutting trajectory in the current image according to the preset trajectory line in the standard image template; Determine the trajectory data of the cutting trajectory according to the coordinate system corresponding to the current image; According to the coordinate system conversion rule, the trajectory data of the cutting trajectory is converted into the laser cutting path of the laser cutting head.

7. The laser board cutting machine according to claim 5, wherein, The analysis module performs the following operations: Determine the expected trajectory and the actual trajectory corresponding to the cutting paths of the first preset number of times; Perform point sampling on the expected trajectory and the actual trajectory to determine multiple associated point groups; Based on the deviation between each point in each point group, construct a deviation array of the cutting path; Arrange the deviation arrays of each cut in order to form a deviation analysis data set; Analyze the deviation analysis data set with a pre-configured deviation analysis library to obtain the analysis result.

8. The laser board cutting machine according to claim 5, characterized in that, The adjustment module performs the following operations: Parse the analysis result to determine the point sampling rule and the deviation correction value for each point; Based on the point sampling rule, perform point sampling on the laser cutting path and correct the sampled points according to the deviation correction value of each point; Re-fit the corrected sampled points to obtain the adjusted laser cutting path.

9. The laser board cutting machine according to claim 5, wherein, It also includes: A risk trigger module; The risk trigger module performs the following operations: Determine the expected trajectory and the actual trajectory corresponding to the cutting paths of the second preset number of times; Perform point sampling on the expected trajectory and the actual trajectory to determine multiple associated point groups; Based on the deviation between each point in each point group, construct a deviation array of the cutting path; Use a pre-configured risk assessment library to perform a risk assessment on the deviation arrays of all cuts within the second preset number of times. When the risk assessment meets the trigger condition, trigger an adjustment to the laser cutting path.

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