Packaging film material, display substrate and packaging method thereof

Abstract

The invention discloses a packaging film material, a display substrate and a packaging method thereof, the packaging film material is used for packaging an LED display substrate, the packaging film material comprises a first plastic film and a second plastic film which are arranged in a stacked mode, and a functional adhesive layer located on the side, away from the second plastic film, of the first plastic film; wherein one of the first plastic film and the second plastic film is a transparent film, and the other one of the first plastic film and the second plastic film is a dark film; or the first plastic film and the second plastic film are transparent films, a first bonding layer is arranged between the first plastic film and the second plastic film, and the visible light transmittance of the first bonding layer is smaller than the visible light transmittance of the first plastic film and the second plastic film.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a packaging film material, a display substrate and a packaging method thereof. Background Art

[0002] At present, the surface packaging methods of LED (Light-Emitting Diode, LED) direct display products are mainly divided into two categories: glass packaging and film packaging. In the film packaging method, the packaging film used for packaging contains a dark film layer, so that the surface of the display product appears dark when not displaying. Summary of the invention

[0003] In a first aspect, the present disclosure provides a packaging film material for packaging an LED display substrate, the packaging film material comprising a first plastic film and a second plastic film stacked together, and a functional adhesive layer located on a side of the first plastic film away from the second plastic film;

[0004] Wherein, one of the first plastic film and the second plastic film is a transparent film, and the other is a dark film; or,

[0005] The first plastic film and the second plastic film are both transparent films. A first adhesive layer is included between the first plastic film and the second plastic film. The transmittance of the first adhesive layer to visible light is lower than the transmittance of the first plastic film and the second plastic film to visible light.

[0006] In some embodiments, the first plastic film is a transparent film, and the second plastic film is a dark film, or the first plastic film is a dark film, and the second plastic film is a transparent film;

[0007] A second adhesive layer is further included between the first plastic film and the second plastic film, and the transmittance of the second adhesive layer to visible light is greater than the transmittance of the dark film to visible light.

[0008] In some embodiments, the transparent film has a visible light transmittance greater than 90%, and the dark film has a visible light transmittance in the range of 30% to 60%.

[0009] In some embodiments, the visible light transmittance of the second adhesive layer is greater than or equal to 95%.

[0010] In some embodiments, the material of the transparent film is any one of PET, PC, PI, and TAC; the dark film includes a substrate and carbon black particles dispersed in the substrate, and the material of the substrate is any one of PET, PC, PI, and TAC.

[0011] In some embodiments, the total thickness of the first plastic film, the second plastic film, and the second adhesive layer is between 100 and 300 μm.

[0012] In some embodiments, the second adhesive layer is configured to scatter visible light.

[0013] In some embodiments, the first plastic film and the second plastic film are both transparent films, and the material of the transparent films is any one of PET, PC, PI, and TAC;

[0014] The first adhesive layer includes an adhesive layer matrix and a black pigment located in the matrix. The material of the adhesive layer matrix includes silicon-based optical glue or epoxy resin.

[0015] In some embodiments, the transmittance of the first plastic film, the second plastic film and the first adhesive layer as a whole to visible light is in the range of 30% to 60%.

[0016] In some embodiments, the total thickness of the first plastic film, the second plastic film, and the first adhesive layer is between 100 and 300 μm.

[0017] In some embodiments, the total thickness of the first plastic film and the second plastic film is between 50 and 150 μm.

[0018] In some embodiments, the first adhesive layer is configured to scatter visible light.

[0019] In some embodiments, the surface of the second plastic film away from the first plastic film is an anti-glare surface;

[0020] Alternatively, at least one of an anti-reflection layer and an anti-fouling layer is provided on a side of the second plastic film away from the first plastic film.

[0021] In some embodiments, the functional adhesive layer includes a matrix and scattering particles distributed in the matrix, and the scattering particles are used to scatter visible light.

[0022] In some embodiments, the functional adhesive layer further comprises a black pigment located in the matrix.

[0023] In some embodiments, a first adhesive layer is further included between the first plastic film and the second plastic film, and the hardness of the first plastic film, the second plastic film and the first adhesive layer as a whole is in the range of 2H to 4H; or,

[0024] A second adhesive layer is further included between the first plastic film and the second plastic film, and the hardness of the first plastic film, the second plastic film and the second adhesive layer as a whole is in the range of 2H to 4H.

[0025] In a second aspect, the present disclosure further provides a display substrate, comprising a base, an LED light-emitting chip located on the base, and the above-mentioned packaging film material;

[0026] Wherein, the LED light-emitting chip is located between the substrate and the packaging film material.

[0027] In some embodiments, the functional adhesive layer includes a first functional portion and a second functional portion, the first functional portion is located between the LED light-emitting chip and the first plastic film, and the second functional portion is located between adjacent LED light-emitting chips.

[0028] The first functional portion and the second functional portion are in contact with each other.

[0029] In some embodiments, the functional adhesive layer is integrally formed with the surface of the substrate facing the packaging film material and the LED light-emitting chip.

[0030] In some embodiments, the functional adhesive layer includes a diffusion layer and a transparent adhesive layer which are stacked, and the diffusion layer is located on a side of the transparent adhesive layer away from the substrate;

[0031] The diffusion layer includes a matrix and scattering particles distributed in the matrix, the scattering particles are used to scatter visible light, and a part of the diffusion layer is located on a side of the LED light-emitting chip away from the substrate.

[0032] In a third aspect, the present disclosure further provides a packaging method for a display substrate, wherein the display substrate comprises a base and an LED light-emitting chip located on the base, and the packaging method comprises:

[0033] Providing a packaging film material, wherein the packaging film material is the packaging film material described above;

[0034] The packaging film material is pressed onto the display substrate, and a portion of the functional film layer is located between the LED light-emitting chip and the first plastic film, and another portion is located between adjacent LED light-emitting chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The accompanying drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present disclosure but do not constitute a limitation of the present disclosure. In the accompanying drawings:

[0036] Figure 1 Schematic diagram of packaging film materials provided in some embodiments.

[0037] Figure 2 Schematic diagram of packaging film materials provided in other embodiments.

[0038] Figure 3 Schematic diagram of packaging film materials provided in some embodiments of the present disclosure.

[0039] Figure 4 Schematic diagram of packaging film materials provided in other embodiments of the present disclosure.

[0040] Figure 5 Schematic diagram of packaging film materials provided in some further embodiments of the present disclosure.

[0041] Fig. 6A Schematic diagram of packaging film materials provided in some other embodiments of the present disclosure.

[0042] Figure 6B Schematic diagram of packaging film materials provided in other embodiments of the present disclosure.

[0043] Fig. 7A A schematic diagram of a display substrate provided in some embodiments of the present disclosure.

[0044] Figure 7B Schematic diagram of a display substrate provided in some other embodiments of the present disclosure.

[0045] Figure 8 A schematic diagram of the vacuum pressing process provided in some embodiments of the present disclosure. DETAILED DESCRIPTION

[0046] The specific implementation of the present disclosure is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described herein is only used to illustrate and explain the present disclosure, and is not used to limit the present disclosure.

[0047] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0048] Unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not represent any order, quantity or importance, but are only used to distinguish different components. Similarly, "including" or "comprising" and similar words mean that the elements or objects appearing in front of the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0049] As used herein, "parallel" and "perpendicular" include the described situation and the situation similar to the described situation, and the range of the similar situation is within the acceptable deviation range, wherein the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement in question and the error associated with the measurement of a specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°.

[0050] It will be understood that when a layer or an element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present between the layer or element and the other layer or substrate.

[0051] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are conceivable. Therefore, the exemplary embodiments should not be interpreted as being limited to the shapes of the regions shown herein, but include shape deviations due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device, and are not intended to limit the scope of the exemplary embodiments.

[0052] Figure 1 is a schematic diagram of a packaging film material provided in some embodiments, Figure 2 Schematic diagram of packaging film materials provided in other embodiments, the packaging film materials are used for packaging LED display substrates. Figure 1 As shown, the packaging film material includes: a transparent substrate 1 and a dark adhesive layer 2 arranged on one side of the transparent substrate 1. Figure 2 As shown, in some other embodiments, the packaging film material includes: a functional adhesive layer 3, a dark adhesive layer 2, and a transparent substrate 1 stacked in sequence. Figure 1 and Figure 2 When the encapsulation film material is used to encapsulate the LED display substrate, the encapsulation film material is pressed onto the LED display substrate, thereby encapsulating the LED display substrate. Among them, after the encapsulation is completed, the dark adhesive layer 2 is located on the side of the transparent substrate 1 facing the display substrate. However, the dark adhesive layer 2 is usually formed after dark glue is coated on the transparent substrate 1 and cured. Due to the limitation of the coating process, the thickness accuracy of the dark adhesive layer 2 is low, which leads to a certain fluctuation in the ink color of the encapsulation film layer (that is, the L value of the encapsulation film layer in the LAB space is different from the target value). In addition, the hardness of the dark adhesive layer 2 formed after the glue is cured is low. After the encapsulation film layer encapsulates the LED display substrate, the encapsulation chip is easy to squeeze or puncture the dark adhesive layer 2, which also leads to a low thickness accuracy of the dark adhesive layer 2. When multiple encapsulated display substrates are spliced ​​into a larger spliced ​​display screen, the ink color of different positions of the spliced ​​display screen will be inconsistent.

[0053] In order to solve the above problems, the present disclosure provides a packaging film material for packaging an LED display substrate, and the LED display substrate may be a Mini-LED display substrate or a Micro-LED display substrate. Figure 3 is a schematic diagram of a packaging film material provided in some embodiments of the present disclosure, Figure 4 is a schematic diagram of packaging film materials provided in other embodiments of the present disclosure, Figure 5 Schematic diagram of packaging film materials provided in some other embodiments of the present disclosure, such as Figures 3 to 5 As shown, the packaging film material includes a first plastic film 10 and a second plastic film 20 which are stacked, and a functional adhesive layer 30 located on a side of the first plastic film 10 away from the second plastic film 20 .

[0054] In one embodiment, Figure 3 and Figure 4As shown, one of the first plastic film 10 and the second plastic film 20 is a transparent film TF, and the other is a dark film DF. The dark film DF in the disclosed embodiment refers to a film with a low transmittance to visible light (for example, not more than 75%) and a dark color such as black or dark gray. In this embodiment, both the dark film DF and the transparent film TF are plastic films, and no coating process is required; and compared with the adhesive layer formed after the glue is cured, the plastic film has a higher hardness, and its thickness is not affected by the extrusion of the light-emitting chip, thereby reducing the ink color fluctuation of the packaging film material, thereby improving the ink color consistency of the spliced ​​display screen after multiple packaged display devices are spliced.

[0055] In another embodiment, the first plastic film 10 and the second plastic film 20 are both transparent films TF, and a first adhesive layer 50 is included between the first plastic film 10 and the second plastic film 20. The transmittance of the first adhesive layer 50 to visible light is lower than the transmittance of the first plastic film 10 and the second plastic film 20 to visible light, so that the packaging film material is dark as a whole. The upper and lower sides of the first adhesive layer 50 are both plastic films. Due to its high hardness, it can protect the first adhesive layer 50 and prevent the extrusion of the light-emitting chip from affecting the thickness accuracy of the first adhesive layer 50, thereby reducing the ink color fluctuation of the packaging film material, and further improving the ink color consistency of the spliced ​​display screen after multiple packaged display devices are spliced.

[0056] In some embodiments, Figure 3 As shown, the first plastic film 10 is a transparent film TF, and the second plastic film 20 is a dark film DF. A second adhesive layer 40 is further included between the first plastic film 10 and the second plastic film 20, and the transmittance of the second adhesive layer 40 to visible light is greater than the transmittance of the dark film DF to visible light. Figure 3 When the packaging film material shown is used to package the LED display substrate, compared with the transparent film TF and the second adhesive layer 40, the dark film DF is further away from the LED display substrate, so that the visual ink color of the packaged display product is darker.

[0057] For example, Figure 3The transmittance of the transparent film TF to visible light is greater than 90%, and the transmittance of the dark film DF to visible light is between 20% and 75%, so that the encapsulation film material does not affect the display of the display product, and at the same time, when the display product does not display the picture, a certain visual ink effect is achieved. For example, the transmittance of the transparent film TF to visible light is between 92% and 95%, or between 95% and 98%, or above 98%; the transmittance of the dark film DF to visible light is between 30% and 60%, so as to ensure the normal display of the display product and have a good visual ink effect. For example, the transmittance of the dark film DF to visible light is between 30% and 40%, or between 40% and 50%, or between 50% and 60%.

[0058] For example, Figure 3 The transmittance of the second adhesive layer 40 to visible light is greater than or equal to 95% to prevent the second adhesive layer 40 from affecting the display of the display product.

[0059] For example, in Figure 3 In the invention, the material of the transparent film TF is any one of PET (polyethylene terephthalate), PC (polycarbonate), PI (polyimide), and TAC (polyethylene terephthalate). The dark film DF includes a substrate and carbon black particles dispersed in the substrate, and the substrate is any one of PET, PC, PI, and TAC. When the transparent film TF and the dark film DF are selected from the above materials, the transparent film TF and the dark film DF can have sufficient hardness, thereby providing sufficient mechanical strength support for the packaging film material as a whole, and will not cause the problem of unstable ink color due to the LED light-emitting chip squeezing the packaging film material.

[0060] Among them, Figure 3 In the embodiment, the total thickness of the first plastic film 10, the second plastic film 20 and the second adhesive layer 40 therebetween is in the range of 100 to 300 μm, thereby strengthening the support provided to the packaging film material. For example, the total thickness of the first plastic film 10, the second plastic film 20 and the second adhesive layer 40 therebetween is in the range of 100 to 150 μm, or in the range of 150 to 200 μm, or in the range of 200 to 300 μm.

[0061] Among them, since the material of the second adhesive layer 40 is relatively soft, the first plastic film 10 and the second plastic film 20 mainly play a supporting role. In order to further ensure the supporting effect on the packaging film material, in some embodiments, the total thickness of the first plastic film 10 and the second plastic film 20 is set between 50 and 150 μm, for example, between 50 and 100 μm, or between 100 and 150 μm.

[0062] For example, in Figure 3In the embodiment, the hardness of the whole structure composed of the first plastic film 10, the second plastic film 20 and the second adhesive layer 40 therebetween is between 2H and 4H, thereby providing sufficient mechanical strength support for the packaging film material as a whole.

[0063] It should be noted that in the above examples, the first plastic film 10 and the second plastic film 20 are used to support the packaging film material. In other examples, only a thick dark film DF may be provided, and the transparent film TF and the second adhesive layer 40 may no longer be provided. Compared with this embodiment, the advantage of providing the transparent film TF, the dark film DF and the second adhesive layer 40 at the same time in the above examples is that the thickness of each of the three layers can be relatively small, which is conducive to controlling the thickness uniformity of the film layer.

[0064] In some embodiments, the second adhesive layer 40 may be configured to scatter visible light, so that the encapsulation film material can diffuse the light of the LED display substrate to produce a uniform light output effect. For example, the second adhesive layer 40 may be doped with scattering particles for diffusing visible light, and the scattering particles include but are not limited to titanium dioxide particles, zirconium dioxide particles, and silicon particles.

[0065] In some embodiments, the surface of the second plastic film 20 away from the first plastic film 10 is an anti-glare (AG) surface, so that the encapsulated film material has the characteristics of anti-glare. Alternatively, the second plastic film 20 is provided with at least one of an anti-reflection (AF) layer (not shown) and an anti-fouling (AF) layer (not shown) on the side away from the first plastic film 10, so that the encapsulated film material has the advantages of anti-reflection and easy wiping. Among them, the anti-glare surface can be formed by coating particles or embossing microstructures on the second plastic film 20; the anti-reflection layer can be formed by coating; the anti-fouling layer is formed by coating the second plastic film 20.

[0066] In some embodiments, Figure 3 The functional adhesive layer 30 may include a matrix and scattering particles distributed in the matrix. The scattering particles are used to scatter visible light, so that the packaging film material can diffuse the light of the LED display substrate to produce a uniform light output effect. The scattering particles include but are not limited to titanium dioxide particles, zirconium dioxide particles, and silicon particles. The particle size of these particles can be greater than or equal to 4μm and less than or equal to 6μm, for example, 5μm.

[0067] The matrix of the functional adhesive layer 30 is a transparent optical adhesive, such as a silicon-based optical adhesive or epoxy resin.

[0068] For example, the functional adhesive layer 30 may further include a black pigment in the matrix, so as to adjust the transmittance and ink color of the entire packaging film material. The black pigment may be carbon black particles.

[0069] In some embodiments, the matrix can be an ultraviolet curing product or a thermal curing product. Before curing, the ultraviolet (UV) particles or thermal curing particles provided in the matrix are cured after the matrix containing these particles is cured (ultraviolet irradiation or thermal treatment), so that the matrix of the functional adhesive layer 30 can be hardened as a whole, there is no uncured part, and the creep amount is reduced by about 50%, so that the disassembly and assembly adhesion can be greatly weakened. The above-mentioned curing treatment is the process of converting a substance (a matrix containing ultraviolet particles or thermal curing particles) from a low molecule to a high molecule (a substance generated after curing). Taking ultraviolet curing as an example, its principle can be: ultraviolet particles are photosensitivity, and they are photoinduced under ultraviolet light to form excited ecological molecules, decomposed into free radicals or ions, and make unsaturated organic matter undergo polymerization, grafting, cross-linking and other chemical reactions to achieve the purpose of curing.

[0070] In some examples, the functional adhesive layer 30 may be a single-layer structure, which includes a matrix and scattering particles and / or black pigments located in the matrix. In other examples, the functional adhesive layer 30 may be a composite layer, for example, the functional adhesive layer 30 includes a diffusion layer and a transparent adhesive layer arranged in layers, the transparent adhesive layer is located on the side of the diffusion layer away from the first plastic film 10, and the diffusion layer includes the above-mentioned matrix and scattering particles and / or black pigments located in the matrix. Wherein, the thickness of the functional adhesive layer 30 may be determined according to the height of the LED light-emitting chip, wherein the LED light-emitting chip is arranged on the substrate, and the height of the LED light-emitting chip is the vertical distance from the surface of the LED light-emitting chip away from the substrate to the substrate. For example, the thickness of the functional adhesive layer 30 is greater than or equal to the height of the LED light-emitting chip, so as to ensure that after the functional adhesive layer 30 is pressed and cured with the substrate provided with the LED light-emitting chip, a part of the functional adhesive layer 30 may be located on the side of the LED light-emitting chip away from the substrate. Before lamination, the difference between the thickness of the functional adhesive layer 30 and the height of the LED light emitting chip is between 0 and 50 μm, thereby ensuring that after lamination, the thickness of the functional adhesive layer 30 on the side of the LED light emitting chip away from the substrate is between 10 and 100 μm.

[0071] In one example, the height of the LED light emitting chip is between 80 and 120 μm, and the thickness of the LED functional adhesive layer 30 is between 80 and 170 μm. Figure 4As shown, the first plastic film 10 is a dark film DF, and the second plastic film 20 is a transparent film TF. A second adhesive layer 40 is further provided between the first plastic film 10 and the second plastic film 20, and the transmittance of the second adhesive layer 40 to visible light is greater than the transmittance of the dark film DF to visible light.

[0072] use Figure 4 When the packaging film material shown is used to package the LED display substrate, the transparent film TF is located on the upper layer, and its reflection of ambient light is more uniform. Therefore, after the packaged LED display substrates are spliced ​​into a large-size spliced ​​display screen, the reflection and heat dissipation light energy between the splicing seam and the display area of ​​the LED display panel is not much different, thereby improving the overall display effect of the spliced ​​display screen.

[0073] exist Figure 3 The same, in Figure 4 In the embodiment, the transmittance of the transparent film TF to visible light is greater than 90%, and the transmittance of the dark film DF to visible light is between 20% and 75%, so that the encapsulation film material does not affect the display of the display product, and at the same time, when the display product does not display the picture, a certain visual ink color effect is achieved. For example, the transmittance of the transparent film TF to visible light is between 92% and 95%, or between 95% and 98%, or above 98%; the transmittance of the dark film DF to visible light is between 30% and 60%, so as to ensure the normal display of the display product and have a good visual ink color effect. For example, the transmittance of the dark film DF to visible light is between 30% and 40%, or between 40% and 50%, or between 50% and 60%.

[0074] For example, Figure 4 The transmittance of the second adhesive layer 40 to visible light is greater than or equal to 95% to prevent the second adhesive layer 40 from affecting the display of the display product.

[0075] For example, in Figure 4 In the invention, the material of the transparent film TF is any one of PET, PC, PI and TAC. The dark film DF includes a substrate and carbon black particles dispersed in the substrate, and the substrate is any one of PET, PC, PI and TAC. When the transparent film TF and the dark film DF are selected from the above materials, the transparent film TF and the dark film DF can have sufficient hardness, thereby providing sufficient mechanical strength support for the packaging film material as a whole, and the problem of ink color instability caused by the LED light-emitting chip squeezing the packaging film material will not be caused.

[0076] and Figure 3 The same, in Figure 4In the embodiment, the total thickness of the first plastic film 10, the second plastic film 20 and the second adhesive layer 40 therebetween is in the range of 100 to 300 μm, thereby strengthening the supporting function of the packaging film material. For example, the total thickness of the first plastic film 10, the second plastic film 20 and the second adhesive layer 40 therebetween is in the range of 100 to 150 μm, or in the range of 150 to 200 μm, or in the range of 200 to 300 μm.

[0077] The total thickness of the first plastic film 10 and the second plastic film 20 may be set between 50 and 150 μm, for example, between 50 and 100 μm, or between 100 and 150 μm.

[0078] The hardness of the whole structure composed of the first plastic film 10, the second plastic film 20 and the second adhesive layer 40 therebetween is between 2H and 4H, thereby providing sufficient mechanical strength support for the whole packaging film material.

[0079] exist Figure 4 In the embodiment, the surface of the second plastic film 20 away from the first plastic film 10 can also be at least one of the anti-glare surface, anti-reflection surface and anti-fouling surface. In addition, the second adhesive layer 40 is configured to scatter visible light. For example, scattering particles can be added to the second adhesive layer 40. Figure 4 The specific structure and material of the functional adhesive layer 30 can refer to the above description. Figure 3 The description is not repeated here.

[0080] In some further embodiments, Figure 5 As shown, the first plastic film 10 and the second plastic film 20 are both transparent films TF, and a first adhesive layer 50 is provided between the first plastic film 10 and the second plastic film 20. The material of the transparent film TF is any one of PET, PC, PI, and TAC, so as to ensure that the transparent film TF has sufficient hardness, thereby providing sufficient mechanical support strength for the packaging film material.

[0081] The first adhesive layer 50 includes an adhesive layer substrate and a black pigment in the substrate. The adhesive layer substrate can be made of a transparent optical adhesive, such as a silicon-based optical adhesive or an epoxy resin. In practical applications, the transmittance and ink color of the second adhesive layer 40 can be adjusted by adjusting the amount of black pigment added, thereby adjusting the transmittance and ink color of the entire packaging film material.

[0082] For example, in Figure 5 In the packaging film material shown, the first adhesive layer 50 can be configured to scatter visible light. For example, the first adhesive layer 50 can also include scattering particles, and the scattering particles are used to scatter visible light, so that the packaging film material can scatter the light of the LED display substrate to produce a uniform light output effect.

[0083] Exemplarily, the overall transmittance of the first plastic film 10, the second plastic film 20 and the first adhesive layer 50 to visible light is in the range of 30% to 60%, so that the packaging film material does not affect the display of the display product, and at the same time, a certain visual ink effect is achieved when the display product does not display a picture.

[0084] Among them, Figure 5 In the packaging film material shown, the transmittance of the first plastic film 10 and the second plastic film 20 to visible light is greater than 90%, for example, greater than 92%, or greater than 95%, or greater than 97%. The transmittance of the first adhesive layer 50 to visible light is in the range of 20% to 75%. Optionally, the transmittance of the first adhesive layer 50 to visible light is in the range of 30% to 60%, thereby ensuring the normal display of the display product and having a good visual ink effect. For example, the transmittance of the first adhesive layer 50 to visible light is between 30% and 40%, or between 40% and 50%, or between 50% and 60%.

[0085] and Figure 3 Similarly, in Figure 5 In the packaging film shown, the total thickness of the first plastic film 10, the second plastic film 20 and the first adhesive layer 50 therebetween is in the range of 100-300 μm, thereby strengthening the supporting function of the packaging film. For example, the total thickness of the first plastic film 10, the second plastic film 20 and the first adhesive layer 50 is between 100-150 μm, or between 150-200 μm, or between 200-300 μm. Figure 3 Similarly, in Figure 5 In the embodiment, the total thickness of the first plastic film 10 and the second plastic film 20 is between 50 μm and 150 μm.

[0086] Exemplarily, the hardness of the overall structure composed of the first plastic film 10 , the second plastic film 20 and the first adhesive layer 50 therebetween is between 2H and 4H, thereby providing sufficient mechanical strength support for the packaging film material as a whole.

[0087] exist Figure 5 In the packaging film material shown, the surface of the second plastic film 20 away from the first plastic film 10 can also be set as an anti-glare surface, or at least one of an anti-reflection layer and an anti-fouling layer can be set on the side of the second plastic film 20 away from the first plastic film 10, as described above. Figure 5 The specific structure and material of the functional adhesive layer 30 can refer to the above description. Figure 3 The description is not repeated here.

[0088] Fig. 6A Schematic diagram of packaging film materials provided in some other embodiments of the present disclosure, such as Fig. 6A As shown, the encapsulation film material includes a functional adhesive layer 30, a first plastic film 10, and a dark coating 70 that are stacked. The dark coating 70 can be coated on the surface of the first plastic film 10 close to the functional adhesive layer 30 or the surface away from the functional adhesive layer 30. Among them, Fig. 6A Only the example where the dark coating 70 is coated on the surface of the first plastic film 10 away from the functional adhesive layer 30 will be described.

[0089] In one example, the first plastic film 10 is a transparent film, and its transmittance can be referred to the description of the transparent film above. The transmittance of the dark coating 70 to visible light can be referred to the description of the dark film DF above. The dark coating 70 can be an ink coating, and its thickness can be less than or equal to 10 μm, for example, between 3 and 5 μm.

[0090] In one example, the overall transmittance of the dark coating 70 and the first plastic film 10 to visible light is in the range of 30% to 60%; the total thickness of the dark coating 70 and the first plastic film 10 is between 50 and 150 μm.

[0091] In one example, the hardness of the overall structure of the first plastic film 10 and the dark film DF is between 2H and 4H, thereby providing sufficient mechanical strength support for the overall encapsulation film material.

[0092] In Fig. 6A , the surface of the overall structure formed by the first plastic film 10 and the dark coating 70 away from the functional adhesive layer 30 can be an anti-glare surface, or an anti-reflection layer and / or an anti-fouling layer can be provided on the side of the overall structure away from the functional adhesive layer 30. The specific structure and material of the functional adhesive layer 30 can refer to the description of Figure 3 above, and will not be elaborated here.

[0093] Figure 6B This is a schematic diagram of the encapsulation film material provided in other embodiments of the present disclosure. As Figure 6B shown, the encapsulation film material includes a functional adhesive layer 30 and a first plastic film 10 that are stacked. Among them, the first plastic film 10 includes a first sub-layer 101 and a second sub-layer 102. Among them, the first sub-layer 101 is a transparent plastic layer, and the second sub-layer 102 is a dyeing layer. In one example, the second sub-layer 102 and the first sub-layer 101 are an integral structure. The second sub-layer 102 is formed by dyeing the transparent plastic layer. That is, the second sub-layer 102 includes a transparent plastic substrate and dyeing particles located in the transparent plastic substrate. The dyeing particles include, for example, carbon black particles.

[0094] It should be noted that Figure 6B only the example where the second sub-layer 102 is located on the side of the first sub-layer 101 away from the functional adhesive layer 30 is described. The second sub-layer 102 can also be located on the side of the first sub-layer 101 close to the functional adhesive layer 30.

[0095] The transmittance of the first sublayer 101 in the first plastic film 10 to visible light may be greater than 90%, and the transmittance of the second sublayer 102 to visible light may be in the range of 20% to 75%, for example, between 30% and 60%.

[0096] The material of the first sublayer 101 can be any one of the above-mentioned PET, PC, PI, and TAC.

[0097] In some examples, the total thickness of the first sub-layer 101 and the second sub-layer 102 is between 50 μm and 150 μm, thereby providing effective support for the packaging film material.

[0098] In one example, the overall hardness of the first plastic film 10 is between 2H and 4H, thereby providing sufficient mechanical strength support for the packaging film material as a whole.

[0099] exist Figure 6B In the embodiment, the surface of the first plastic film 10 away from the functional adhesive layer 30 can be an anti-glare surface, and an anti-reflection layer and / or an anti-fouling layer can also be provided on the side of the first plastic film 10 away from the functional adhesive layer 30 .

[0100] exist Figure 6B The specific structure and material of the functional adhesive layer 30 can refer to the above description. Figure 3 The description is not repeated here.

[0101] In the packaging film materials provided in each embodiment, the material and thickness of each film layer can be controlled so that the overall transmittance of the packaging film material to visible light is in the range of 20% to 75%, for example, in the range of 30% to 60%, so that the overall L value of the packaging film material in the LAB space is between 28 and 30.

[0102] Fig. 7A Schematic diagram of a display substrate provided in some embodiments of the present disclosure, such as Fig. 7A As shown, the display substrate includes a base 61, an LED light-emitting chip 62 arranged on the base 61, and a packaging film material. The packaging film material adopts the packaging film material in any of the above embodiments. The LED chip is located between the base 61 and the packaging film material, and is located on the side of the functional adhesive layer 30 away from the first plastic film 10.

[0103] In some embodiments, the LED light emitting chip 62 is a mini-LED chip or a micro-LED chip.

[0104] like Fig. 7AAs shown, the functional adhesive layer 30 includes a first functional portion 31 and a second functional portion 32, the first functional portion 31 is located between the LED light-emitting chip 62 and the first plastic film 10, the second functional portion 32 is located between adjacent LED light-emitting chips 62, and the first functional portion 31 and the second functional portion 32 are in contact with each other. In this case, the thickness of the second functional portion 32 is greater than the thickness of the LED light-emitting chip 62, so that the first functional portion 31 and the second functional portion 32 are in contact, so that each LED light-emitting chip 62 can be completely covered by the first functional portion 31 and the second functional portion 32, so that the LED light-emitting chip 62 can be better protected and prevented from being squeezed and damaged.

[0105] In some embodiments, on the basis of the contact arrangement of the first functional part 31 and the second functional part 32, the second functional part 32 is in contact with the substrate 61 and the first plastic film 10 respectively; the first functional part 31 is in contact with the LED light-emitting chip 62 and the first plastic film 10 respectively. In this case, the thickness of the second functional part 32 is equal to or substantially equal to the sum of the thicknesses of the first functional part 31 and the light-emitting chip 62. In this way, the first functional part 31 and the second functional part 32 can be completely filled between the first plastic film 10 and the substrate 61, thereby better protecting the LED light-emitting chip 62.

[0106] In some embodiments, multiple LED light-emitting chips 62 are separated by the second functional part 32, and the LED light-emitting chips 62 are in direct contact with the second functional part 32. In this way, the second functional part 32 can protect the LED light-emitting chip 62 at the periphery of the LED light-emitting chip 62 to avoid the LED chip being encapsulated by the packaging film material and then being squeezed and damaged by the contact with the first plastic film 10.

[0107] In some embodiments, the orthographic projection of the first functional portion 31 on the plane where the first plastic film 10 is located covers the center of the orthographic projection of the light-emitting area of ​​the light-emitting chip 62 on the plane where the first plastic film 10 is located. The first functional portion 31 can partially cover the light-emitting area of ​​the LED light-emitting chip 62, that is, cover the center of the light-emitting area, so that the light emitting effect of the display substrate is better.

[0108] In some embodiments, the orthographic projection of the first functional portion 31 on the plane where the first plastic film 10 is located covers the orthographic projection of the light emitting area of ​​the LED light emitting chip 62 on the plane where the first plastic film 10 is located. The first functional portion 31 can completely cover the light emitting area of ​​the LED light emitting chip 62.

[0109] In some embodiments, the functional adhesive layer 30 may be a single-layer structure, and the first functional portion 31 and the second functional portion 32 are made of the same material. For the materials of the first and second functional portions, refer to the above description of the functional adhesive layer 30 .

[0110] In other embodiments, Figure 7B As shown, the functional adhesive layer 30 may also be a composite layer formed by a multi-layer structure, for example, the functional adhesive layer 30 includes a transparent adhesive layer 30a and a diffusion layer 30b stacked, the diffusion layer 30b is located on the side of the transparent adhesive layer 30a away from the substrate 61, and the transparent adhesive layer 30a may have a visible light transmittance greater than 90%. The diffusion layer 30b includes the above-mentioned matrix layer and scattering particles and / or black pigments located in the matrix layer.

[0111] When the functional adhesive layer 30 is a composite layer, a portion of the diffusion layer 30b is located on the side of the LED light emitting chip 62 away from the substrate 61, and the size relationship between the thickness of the transparent adhesive layer 30a and the height of the LED light emitting chip 62 is not limited. Figure 7B As shown, the second functional portion 32 includes a portion of the diffusion layer 30b and a portion of the transparent adhesive layer 30a, and the first functional portion 31 may include a portion of the diffusion layer 30b and a portion of the transparent adhesive layer 30a; of course, the first functional portion 31 may also include only a portion of the diffusion layer 30b.

[0112] In some embodiments, the functional adhesive layer 30 is conformal to the surface of the substrate 61 facing the packaging film material and the LED light-emitting chip 62. In other words, the substrate 61 and the structure formed by the assembly of multiple LED light-emitting chips 62 on the substrate 61 are regarded as the light board 60, and the surface of the functional adhesive layer 30 facing the light board 60 and the surface of the light board 60 facing the packaging film material as a whole.

[0113] In this case, the functional adhesive layer 30 can be formed on the light board 60 by lamination. Specifically, a functional material (the functional material at this time is a deformable glue) is formed on the surface of the first plastic film 10 away from the second plastic film 20. When lamination is performed, the entire cavity for lamination is first evacuated, and then air is introduced into the side of the second plastic film 20 in the cavity away from the substrate, so that there is an air pressure difference on both sides of the packaging film material. The packaging film material can be pressed onto the light board 60 by utilizing the air pressure difference. The process of vacuum lamination is as follows: Figure 8 As shown. The functional material on the surface of the LED light-emitting chip 62 facing away from the substrate 61 overflows between two adjacent LED light-emitting chips 62 due to being squeezed, so that the surface of the functional material layer facing the substrate 61 is conformal to the surface of the lamp board 60 as a whole facing the functional material layer. Afterwards, the functional material is cured to form a functional adhesive layer 30 conformal to the surface of the lamp board 60 facing the packaging film material. Among them, the remaining material on the surface of the LED light-emitting chip 62 facing away from the substrate 61 forms the above-mentioned first functional part 31, and the second functional part 32 is formed between two adjacent LED light-emitting chips 62.

[0114] In some embodiments, the thickness of the cured functional adhesive layer 30 is greater than the height of the LED light emitting chip 62, and a portion of the functional adhesive layer 30 can be located on the side of the LED light emitting chip away from the substrate, thereby protecting the LED light emitting chip. In one example, the difference between the thickness of the functional adhesive layer 30 and the height of the LED light emitting chip 62 is between 10 and 100 μm, for example, between 10 and 30 μm, or between 30 and 50 μm, or between 50 and 70 μm.

[0115] It is understandable that the difference between the thickness of the functional adhesive layer 30 and the height of the LED light emitting chip 62 is the thickness of the first functional portion 31 .

[0116] The present disclosure also provides a method for packaging a display substrate, wherein the display substrate includes a substrate and an LED light-emitting chip located on the substrate. The method for packaging a display substrate includes:

[0117] S1. Provide a packaging film material, which is the packaging film material in the above embodiment.

[0118] S2. Press the packaging film material onto the display substrate, so that a portion of the functional film layer is located between the LED light-emitting chip and the first plastic film, and another portion is located between adjacent LED light-emitting chips.

[0119] After the lamination process and curing, the portion of the functional film layer between the LED light-emitting chip and the first plastic film is the first functional portion, and the portion of the functional film layer between adjacent LED light-emitting chips is the second functional portion. The lamination process may be a vacuum lamination process, which is described above and will not be described here.

[0120] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present disclosure, but the present disclosure is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and substance of the present disclosure, and these modifications and improvements are also considered to be within the scope of protection of the present disclosure.

Claims

1. A packaging film material for packaging LED display substrates. It is characterized in that The packaging film material comprises a first plastic film and a second plastic film which are stacked, and a functional adhesive layer located on a side of the first plastic film away from the second plastic film; Wherein, one of the first plastic film and the second plastic film is a transparent film, and the other is a dark film; or, The first plastic film and the second plastic film are both transparent films. A first adhesive layer is included between the first plastic film and the second plastic film. The transmittance of the first adhesive layer to visible light is lower than the transmittance of the first plastic film and the second plastic film to visible light.

2. The packaging film material according to claim 1, It is characterized in that The first plastic film is a transparent film, and the second plastic film is a dark film, or the first plastic film is a dark film, and the second plastic film is a transparent film; A second adhesive layer is further included between the first plastic film and the second plastic film, and the transmittance of the second adhesive layer to visible light is greater than the transmittance of the dark film to visible light.

3. The packaging film material according to claim 2, It is characterized in that The transmittance of the transparent film to visible light is greater than 90%, and the transmittance of the dark film to visible light is in the range of 30% to 60%.

4. The packaging film material according to claim 3, It is characterized in that The visible light transmittance of the second adhesive layer is greater than or equal to 95%.

5. The packaging film material according to claim 2, It is characterized in that The material of the transparent film is any one of PET, PC, PI, and TAC; the dark film includes a substrate and carbon black particles dispersed in the substrate, and the material of the substrate is any one of PET, PC, PI, and TAC.

6. The packaging film material according to claim 5, It is characterized in that The total thickness of the first plastic film, the second plastic film and the second adhesive layer is between 100 and 300 μm.

7. The packaging film material according to claim 2, It is characterized in that The second adhesive layer is configured to scatter visible light.

8. The packaging film material according to claim 1, It is characterized in that The first plastic film and the second plastic film are both transparent films, and the material of the transparent films is any one of PET, PC, PI, and TAC; The first adhesive layer includes an adhesive layer matrix and a black pigment located in the matrix. The material of the adhesive layer matrix includes silicon-based optical glue or epoxy resin.

9. The packaging film material according to claim 8, It is characterized in that The transmittance of the first plastic film, the second plastic film and the first adhesive layer as a whole to visible light is in the range of 30% to 60%.

10. The packaging film material according to claim 8, It is characterized in that The total thickness of the first plastic film, the second plastic film and the first adhesive layer is between 100 and 300 μm.

11. The packaging film material according to claim 5 or 8, It is characterized in that The total thickness of the first plastic film and the second plastic film is between 50 and 150 μm.

12. The packaging film material according to any one of claims 1 to 10, It is characterized in that The first adhesive layer is configured to scatter visible light.

13. The packaging film material according to any one of claims 1 to 10, It is characterized in that The surface of the second plastic film away from the first plastic film is an anti-glare surface; Alternatively, at least one of an anti-reflection layer and an anti-fouling layer is provided on a side of the second plastic film away from the first plastic film.

14. The packaging film material according to any one of claims 1 to 10, It is characterized in that The functional adhesive layer includes a matrix and scattering particles distributed in the matrix, and the scattering particles are used for scattering visible light.

15. The packaging film material according to claim 14, It is characterized in that The functional adhesive layer also includes a black pigment located in the matrix.

16. The packaging film material according to any one of claims 1 to 10, It is characterized in that A first adhesive layer is further included between the first plastic film and the second plastic film, and the hardness of the first plastic film, the second plastic film and the first adhesive layer as a whole is within the range of 2H to 4H; or A second adhesive layer is further included between the first plastic film and the second plastic film, and the hardness of the first plastic film, the second plastic film and the second adhesive layer as a whole is in the range of 2H to 4H.

17. A display substrate, It is characterized in that It comprises a substrate, an LED light-emitting chip located on the substrate, and a packaging film material according to any one of claims 1 to 16; Wherein, the LED light-emitting chip is located between the substrate and the packaging film material.

18. The display substrate according to claim 17, It is characterized in that The functional adhesive layer includes a first functional portion and a second functional portion, wherein the first functional portion is located between the LED light-emitting chip and the first plastic film, and the second functional portion is located between adjacent LED light-emitting chips. The first functional portion and the second functional portion are in contact with each other.

19. The display substrate according to claim 17, It is characterized in that The functional adhesive layer is integrally formed with the surface of the substrate facing the packaging film material and the LED light-emitting chip.

20. The display substrate according to claim 17, It is characterized in that The functional adhesive layer comprises a diffusion layer and a transparent adhesive layer which are stacked, and the diffusion layer is located on a side of the transparent adhesive layer away from the substrate; The diffusion layer includes a matrix and scattering particles distributed in the matrix, the scattering particles are used to scatter visible light, and a part of the diffusion layer is located on a side of the LED light-emitting chip away from the substrate.

21. A method for packaging a display substrate, the display substrate comprising a base and an LED light emitting chip located on the base, It is characterized in that The packaging method comprises: Providing a packaging film material, wherein the packaging film material is the packaging film material according to any one of claims 1 to 16; The packaging film material is pressed onto the display substrate, and a portion of the functional film layer is located between the LED light-emitting chip and the first plastic film, and another portion is located between adjacent LED light-emitting chips.

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