Non-conductive high-thermal-conductivity laminating film and preparation method thereof

Abstract

The invention provides a non-conductive and high-thermal-conductivity laminated film and a preparation method thereof, the non-conductive and high-thermal-conductivity laminated film comprises 16wt%-44wt% of water-based resin, the water-based resin comprises amino functional compound modified epoxy resin and 55wt%-75wt% of inorganic nano powder, and the inorganic nano powder is selected from a group of SiO2, CuO, Al2O3, ZnO or AlN and is subjected to surface modification by 1wt%-10wt% of a silane coupling agent. The preparation method comprises the following steps: modifying the surface of inorganic nano powder by using a silane coupling agent to obtain modified inorganic nano powder; adding the modified inorganic nano powder into the modified epoxy resin to obtain a mixed sizing material; grinding and dispersing the mixed sizing material by using three rollers to obtain a laminating film material; and adding a solvent, coating, forming and drying the laminated film material to obtain the non-conductive and high-thermal-conductivity inorganic nano laminated film. The thickness of the non-conductive and high-thermal-conductivity inorganic nano laminated film is less than 15 microns, and the thermal conductivity is between 1.38 W / mK and 3.5 W / mK.

Description

Technical Field

[0001] The invention relates to a bonding film and a preparation method thereof, in particular to a non-conductive and high-thermal conductive bonding film used for semiconductor packaging and a preparation method thereof. Background Art

[0002] Semiconductor packaging is the process of coating the cut dies with packaging materials after sawing, pick-up, die bonding, and wire bonding of the wafers that have been processed in the semiconductor front end, in order to protect the durability and service life of the completed integrated circuit (IC) components (such as chips), and facilitate the wide application of circuit board assembly. Die attach film (DAF) can be used to bond the wiring substrate to the semiconductor die, or between semiconductor dies. It can effectively prevent the scattered arrangement of the dies caused by cutting during laser cutting.

[0003] With the popularization of the 5G era, terminal electronic products are increasingly demanding lightweight, thin and short applications, and their related packaging technologies are gradually developing towards miniaturization, high density and thinness. As the current density increases, the heat dissipation and insulation requirements increase accordingly, and the thermal conductivity requirements for packaging materials are also gradually increasing.

[0004] The main fillers of existing non-conductive packaging materials are micron-sized SiO2 or Al2O3 powders. However, the thermal conductivity of these fillers is less than 1W / mK, which is insufficient to meet the thermal conductivity requirements of the product. Furthermore, the thickness of the bonding film prepared by SiO2 / Al2O3 powder is about 30 to 60μm, which is difficult to meet the requirements of thinness and high thermal conductivity.

[0005] Accordingly, providing a non-conductive and highly thermally conductive laminating film and a preparation method thereof to solve the problem of thick laminating films and low thermal conductivity in the prior art is an important topic that this application is devoted to studying. Summary of the invention

[0006] The main purpose of the present invention is to provide a non-conductive and highly thermally conductive die attach film (DieAttach Film), which is made of a non-conductive and highly thermally conductive die attach film material. Taking the total weight of the die attach film material as 100wt%, the inorganic nano die attach film material includes: 16wt% to 44wt% of an aqueous resin, which includes an epoxy resin modified with an amino functional compound; and 55wt% to 75wt% of an inorganic nano powder, and the inorganic nano powder is selected from at least one of SiO2, CuO, Al2O3, ZnO or AlN, or a combination of more than one thereof, and is surface-modified with 1wt% to 10wt% of a silane coupling agent.

[0007] In a specific embodiment of the present invention, the silane coupling agent is selected from at least one of a vinyl silane coupling agent, an epoxy silane coupling agent, a methacryloxy silane coupling agent, an acryloxy silane coupling agent, an amino silane coupling agent and an isocyanate silane coupling agent, or a combination of more.

[0008] In a specific embodiment of the present invention, the silane coupling agent is (N-2-aminoethyl-3-aminopropylmethyldimethoxysilane.

[0009] In one embodiment of the present invention, the amino-functional compound is selected from N-2-aminoethyl-3-aminopropylmethyldimethoxysilane, N-2-aminoethyl-3-aminopropyltrimethoxysilane, N-2-aminoethyl-3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N-(1,3-dimethyl-butylene)propylamine, N-phenyl-3-aminopropyltrimethoxysilane or N-vinylbenzyl-2-aminoethyl-3-aminopropyltrimethoxysilane hydrochloride. In one embodiment of the present invention, the amino-functional compound is 3-aminopropyltrimethoxysilane.

[0010] In a specific embodiment of the present invention, the water-based resin further includes an acrylic resin and a dispersant.

[0011] In a specific embodiment of the present invention, the non-conductive and high thermal conductive bonding film material further includes: a solvent, and at least one of the solvent is selected from the group consisting of isopropyl alcohol, n-butanol, isobutyl alcohol, ethyl ether, isopropyl ether, diethylene glycol monobutyl ether, acetic acid, butyric acid and caproic acid.

[0012] In order to achieve the above-mentioned purpose, the present invention also provides a method for preparing a non-conductive and high thermal conductive bonding film, which includes: surface-modifying an inorganic nanopowder with 1wt% to 10wt% of a silane coupling agent to obtain a surface-modified inorganic nanopowder; adding an epoxy resin modified with an amino functional compound to the surface-modified inorganic nanopowder to obtain a mixed adhesive; grinding and dispersing the mixed adhesive with three rollers to obtain a non-conductive and high thermal conductive bonding film material; adding a solvent to the non-conductive and high thermal conductive bonding film material; and coating, forming and drying the non-conductive and high thermal conductive bonding film material to obtain a non-conductive and high thermal conductive inorganic nano bonding film.

[0013] In a specific embodiment of the present invention, the silane coupling agent is N-2-aminoethyl-3-aminopropylmethyldimethoxysilane, and the amino functional compound is 3-aminopropyltrimethoxysilane. In a specific embodiment of the present invention, the water-based resin further includes: an acrylic resin and a dispersant. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1A SEM cross-sectional view of the bonding film prepared from unmodified AIN nanopowders;

[0015] Figure 1B SEM cross-sectional view of the bonding film prepared from unmodified AIN nanopowders;

[0016] Figure 2 Flow chart of the preparation method of the non-conductive and highly thermally conductive bonding film of the present invention;

[0017] Figure 3A SEM image of the CuO nanopowders modified by silane coupling agent in Example 1; and

[0018] Figure 3B SEM cross-sectional view of the bonding film prepared in Example 1.

[0019] Wherein, reference numerals:

[0020] S100 to S500... steps. Detailed Description of the Invention

[0021] The specific embodiments of the present invention will be described in detail below in conjunction with the drawings. Those of ordinary skill in the art can understand the advantages and effects of the present invention through the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. The following embodiments will further describe the related technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention.

[0022] The main object of the present invention is to provide a non-conductive and highly thermally conductive bonding film, which is made of a non-conductive and highly thermally conductive inorganic nano-bonding film material. Taking the total weight of the inorganic nano-bonding film material as 100 wt%, the inorganic nano-bonding film material includes: 16 wt% to 44 wt% of an aqueous resin, which includes an epoxy resin modified by an amino-functional group compound; and 55 wt% to 75 wt% of inorganic nanopowders, and the inorganic nanopowders are selected from at least one or a combination of SiO2, CuO, Al2O3, ZnO or AlN, and are surface-modified by 1 wt% to 10 wt% of a silane coupling agent.

[0023] Specifically, epoxy resin has excellent electrical properties, low curing shrinkage, low volatile byproducts, high temperature resistance, solvent resistance and other characteristics, and is widely used as a packaging material for semiconductor components. After curing, epoxy resin forms a dense and brittle cross-linked protective layer. If the stress accumulated inside is not properly controlled, it is easy to increase the failure rate of integrated circuit components.

[0024] The thermal conductivity of epoxy resin is 0.19W / mK. In the prior art, most of the additives for non-conductivity and improving the thermal conductivity of epoxy resin are metal oxide materials or silane series coupling agents. The epoxy resin used in the present invention can use the previously known materials. For example, the epoxy resin can be selected from specific examples including multifunctional epoxy resin, novolac epoxy resin, biphenyl epoxy resin, bisphenol A epoxy resin, bisphenol F epoxy resin, cyanuric acid epoxy resin, etc.

[0025] More specifically, the epoxy resin of the present invention is modified by an amino-functional compound. For example, the amino-functional compound can be N-2 aminoethyl-3-aminopropylmethyldimethoxysilane, N-2 aminoethyl-3-aminopropyltrimethoxysilane, N-2-aminoethyl-3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N-(1,3-dimethyl-butylene)propylamine, N-phenyl-3-aminopropyltrimethoxysilane or N-vinylbenzyl-2-aminoethyl-3-aminopropyltrimethoxysilane hydrochloride. Preferably, the amino-functional compound of the present invention is 3-aminopropyltrimethoxysilane. Specifically, by two different active groups in the amino-functional compound, amino and oxygen, the epoxy resin interface bonding characteristics are provided, the compatibility and adhesion between the epoxy resin and the metal oxide are enhanced, and the thermal conductivity of the product is more effectively improved. Preferably, the amount of the amino-functional compound added in the present invention is 2 wt.% to 8 wt.%.

[0026] In order to specifically compare the difference in thermal conductivity of modified epoxy resins, the present invention further provides unmodified epoxy resins and modified epoxy resins and modified inorganic nanopowders to prepare laminated films, and further tests the thermal conductivity.

[0027] First, Table 1 tests the bonding films prepared by combining different ratios of 3-aminopropyltrimethoxysilane modified epoxy resin with ZnO having a solid content of 75% and their thermal conductivity.

[0028] Table 1

[0029]

[0030] Furthermore, Table 2 shows the laminated film prepared by unmodified epoxy resin with 75% solid content of ZnO and its thermal conductivity test, and Table 3 shows the laminated film prepared by 6% 3-aminopropyltrimethoxysilane modified epoxy resin with 75% solid content of ZnO and its thermal conductivity test.

[0031] Table 2 Unmodified epoxy resin and inorganic nanopowder

[0032]

[0033] Table 3 Modified epoxy resin and inorganic nanopowder

[0034]

[0035] From the comparison of Tables 1 to 3, it can be seen that the thermal conductivity of the bonding film prepared using the inorganic nanopowder ZnO with the same solid content of 75% is between 1.482 and 1.482 compared to the unmodified epoxy resin, and the epoxy resin modified with amino functional compounds can increase the thermal conductivity to 1.815 to 1.833, indicating that the modification with amino functional compounds can effectively increase the thermal conductivity of the bonding film.

[0036] In the prior art, the main filler of non-conductive packaging materials is micron-sized SiO2 or Al2O3 powder, but the thermal conductivity of these powders is lower than 1 W / mK.

[0037] The inorganic nanopowder of the present invention is selected from at least one of the group consisting of SiO2, CuO, Al2O3, ZnO or AlN, or a combination of multiple thereof, and the inorganic nanopowder is surface-modified by 1wt% to 10wt% of a silane coupling agent. Preferably, the metal oxide is CuO nanopowder.

[0038] Specifically, when the inorganic nanopowder is surface-modified by a silane coupling agent, the compatibility of the inorganic nanopowder with the resin is increased, the interface adhesion is good, and the thermal conductivity can be effectively improved. Preferably, the silane coupling agent is selected from at least one of a vinyl silane coupling agent, an epoxy silane coupling agent, a methacryloxy silane coupling agent, an acryloxy silane coupling agent, an amino silane coupling agent, and an isocyanate silane coupling agent, or a combination of more than one.

[0039] In more detail, the silane coupling agent can be a commercially available product. For example, the vinyl silane coupling agent can be vinyl trichlorosilane, vinyl trimethoxysilane, or vinyl triethoxysilane; the epoxy silane coupling agent can be 2-(3,4-epoxycyclohexylethyltrimethoxysilane, (3-glycidoxypropyl)trimethoxysilane, (3-glycidoxypropyl)methyldiethoxysilane, or (3-glycidoxypropyltriethoxysilane; the methacryloxysilane can be a combination of 3-methacryloxypropyl and other silanes, such as methyldimethoxysilane, trimethoxysilane, methyldiethoxysilane, and triethoxysilane; the acryloxysilane can be a combination of 3-methacryloxypropyl and other silanes, such as methyldimethoxysilane, trimethoxysilane, methyldiethoxysilane, and triethoxysilane; The acyloxysilane coupling agent can be 3-acryloxypropyltrimethoxysilane; the aminosilane coupling agent can be N-2aminoethyl-3-aminopropylmethyldimethoxysilane, N-2aminoethyl-3-aminopropyltrimethoxysilane, N-2-aminoethyl-3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N-(1,3-dimethyl-butylene)propylamine, N-phenyl-3-aminopropyltrimethoxysilane or N-vinylbenzyl-2-aminoethyl-3-aminopropyltrimethoxysilane hydrochloride; the isocyanate silane can be 3-isocyanatepropyltriethoxysilane.

[0040] More specifically, the amino-functional compounds and silane coupling agents selected for modifying the epoxy resin and the inorganic nanopowder in the present invention both have amino-functional groups and silane groups, which can provide better compatibility between the modified epoxy resin and the inorganic nanopowder.

[0041] In a specific embodiment of the present invention, the silane coupling agent is (N-2-aminoethyl-3-aminopropylmethyldimethoxysilane.

[0042] See also Figure 1A and Figure 1B , which shows and compares the SEM cross-sectional images of the laminated films prepared by the inorganic nanopowder without modification and after modification, Figure 1A It is AIN nano powder without surface modification. After mixing with epoxy resin, cracks are easily generated at the contact interface, which increases the thermal resistance of the film. The thermal conductivity is 0.914W / mK. Figure 1B The surface-modified AIN nanopowder has good compatibility with epoxy resin, good interface adhesion, and a thermal conductivity of 3.341W / mK.

[0043] Furthermore, in order to specifically compare the thermal conductivity differences of inorganic nanopowders modified with silane coupling agents and their formula ratios, the present invention further provides laminating films prepared with different ratios, and further tests the thermal conductivity, as shown in Table 4. The water-based resin includes modified epoxy resin, acrylic resin and dispersant.

[0044] Table 4

[0045]

[0046] In a specific embodiment of the present invention, the water-based resin further includes an acrylic resin and a dispersant.

[0047] The acrylic resin may be a resin polymer derived from acrylic monomers, which may be selected from methyl acrylate, ethyl acrylate, n-butyl acrylate, methyl methacrylate, n-butyl methacrylate, etc. The acrylic resin may be selected from thermosetting acrylic resins or thermoplastic acrylic resins as required.

[0048] More specifically, the thermosetting acrylic resin is an infusible acrylic polymer with acrylic monomers as the basic components and cross-linked into a network structure. In addition to the general properties of acrylic resin, it has better heat resistance, water resistance, solvent resistance, wear resistance, and scratch resistance (anti-scratch), and has a variety of forms such as bulk casting materials, solution type, emulsion type, and water-based type. The cross-linking method is divided into two categories: 1. The functional groups in the reactive cross-linking polymer have no cross-linking reaction ability; or 2. The self-cross-linking polymer chain itself contains two or more reactive functional groups.

[0049] The thermoplastic acrylic resin is a type of thermoplastic resin made by polymerizing acrylic acid, methacrylic acid and its derivatives (such as esters, nitriles, and amides). It can be repeatedly softened by heat and solidified by cooling. It is generally a linear polymer compound, which can be a homopolymer or a copolymer, with good physical and mechanical properties, excellent weather resistance, chemical resistance and water resistance, and high gloss and color retention. The molecular weight of the thermoplastic acrylic resin used in the coating industry is generally 75,000 to 120,000, and nitrocellulose, cellulose acetate butyrate and perchlorethylene resin are commonly used with it to improve the coating performance. Thermoplastic acrylic resin is a type of solvent-based acrylic resin, which can be melted and dissolved in a suitable solvent. The coating prepared by it forms a film by the aggregation of macromolecules after the solvent evaporates. No cross-linking reaction occurs during film formation, and it is a non-reactive coating. In order to achieve better physical and chemical properties, the molecular weight of the resin should be increased, but in order to ensure that the total amount of non-volatile substances is not too low and the molecular weight is not too large, generally at a molecular weight of tens of thousands, the physical and chemical properties and construction performance are relatively balanced. In the embodiment of the present invention, the acrylic resin may be polymethyl methacrylate (PMMA).

[0050] Dispersants can be uniformly mixed into acrylic resins simultaneously or sequentially. Adding dispersants can prevent the agglomeration or sedimentation of material molecules, make the physical properties of the material more uniform, and obtain acrylic resins with uniform physical properties during subsequent degradation (such as roller mill dispersion, which may cause the bonds between material molecules to break). Dispersants are generally divided into two categories: inorganic dispersants and organic dispersants. Commonly used inorganic dispersants include silicates (such as water glass) and alkali metal phosphates (such as sodium tripolyphosphate, sodium hexametaphosphate and sodium pyrophosphate). Organic dispersants include triethylhexyl phosphate, sodium dodecyl sulfate, methyl amyl alcohol, cellulose derivatives, polyacrylamide, gum, fatty acid polyethylene glycol esters, etc. Preferably, the ratio of dispersant to acrylic resin is about <10wt%.

[0051] In a specific embodiment of the present invention, the non-conductive and high thermal conductive bonding film material further includes: a solvent, and at least one of the solvents selected from the group consisting of isopropyl alcohol, n-butanol, isobutyl alcohol, ethyl ether, isopropyl ether, diethylene glycol monobutyl ether, acetic acid, butyric acid and caproic acid.

[0052] In addition, the non-conductive and high thermal conductive bonding film material may further include: a hardener, a hardening accelerator, a catalyst, an adhesion promoter, a reactive diluent, a non-reactive diluent, a surfactant, a wetting agent, an antioxidant, a thixotropic agent, a wax, a deaerator, a flow additive, an adhesion promoter, a rheology modifier, a defoaming agent or a combination thereof as required.

[0053] In order to achieve the above-mentioned object, the present invention also provides a method for preparing a non-conductive and high thermal conductive laminating film, see Figure 2 , which are the steps of the method for preparing the non-conductive and high thermal conductive laminating film of the present invention:

[0054] S100: Surface-modifying the inorganic nanopowder with 1 wt % to 10 wt % of a silane coupling agent to obtain a surface-modified inorganic nanopowder.

[0055] S200: adding an inorganic nano powder with modified surface to an epoxy resin modified with an amino functional compound, and mixing them with a degassing mixer to obtain a mixed rubber material. The selection and proportion of the components are based on the above content of the present invention, and will not be repeated here.

[0056] S300: The mixed adhesive is uniformly mixed with a triple roll mill to obtain a non-conductive and high thermal conductive laminating film material. The triple roll mill is a machine that uses three parallel rollers to rotate in opposite directions and at different speeds to generate shear force, thereby achieving the purpose of mixing, refining, dispersing, or making the viscosity of an object uniform.

[0057] S400: adding a solvent to the non-conductive and high thermal conductive bonding film material.

[0058] S500: coating, forming and drying the non-conductive and high thermal conductive bonding film material to obtain a non-conductive and high thermal conductive inorganic nano bonding film.

[0060] According to the composition shown in Table 5, the surface of the inorganic nanopowder is modified with 5wt.% silane coupling agent (N-2aminoethyl-3-aminopropylmethyldimethoxysilane) to obtain a surface-modified inorganic nanopowder; the surface-modified inorganic nanopowder is mixed with an epoxy resin modified with 6wt.% 3-aminopropyltrimethoxysilane to obtain a mixed rubber material. The mixed rubber material is ground and dispersed with three rollers to obtain a non-conductive and high thermal conductive bonding film material, a solvent is added to the inorganic nano bonding film material, and the coating is formed and dried to obtain a non-conductive and high thermal conductive inorganic nano bonding film. The prepared inorganic nano bonding film is further tested for its properties and recorded in Table 5.

[0061] Table 5

[0062]

[0063]

[0064] Referring to the embodiment in Table 5, it can be seen that the inorganic nanopowder surface-modified with 1wt% to 10wt% of silane coupling agent has good compatibility with the epoxy resin modified with amino functional compounds, which can effectively reduce the thickness of the prepared inorganic nano-lamination film and improve its thermal conductivity.

[0065] See also Figure 3A as well as Figure 3B , Figure 3A The SEM image of the CuO nanopowder modified by the silane coupling agent of Example 1 is shown. Figure 3B The SEM cross-sectional view of the laminating film prepared in Example 1 shows that the modified CuO nanopowder has better compatibility with the modified epoxy resin, and no cracks are generated on the contact surface.

[0066] One of the beneficial effects of the present invention is that the non-conductive and highly thermally conductive bonding film and the preparation method thereof provided by the present invention reduce the thickness of the non-conductive and highly thermally conductive bonding film to less than 15 μm through the technical features, specific composition and formula ratio of "16wt% to 44wt% of water-based resin, which includes epoxy resin modified with amino functional compounds and 55wt% to 75wt% of inorganic nanopowder, and the inorganic nanopowder is selected from at least one of SiO2, CuO, Al2O3, ZnO or AlN or a combination of more than one, and surface-modified with 1wt% to 10wt% of silane coupling agent", and more effectively improve the thermal conductivity of the non-conductive and highly thermally conductive bonding film prepared by the present invention to between 1.38W / mK and 3.5W / mK.

[0067] The above is only a preferred embodiment of the present application, and should not limit the scope of implementation of the present application. That is, all equivalent changes and modifications made according to the present application should still fall within the scope of the patent coverage of the present application. The present application may also have other embodiments. Without departing from the spirit and essence of the present application, technicians familiar with the field can make various corresponding changes and deformations according to the present application, but these corresponding changes and deformations should fall within the scope of protection of the claims attached to the present application.

Claims

1. A non-conductive and highly thermally conductive bonding film, which is made of a non-conductive and highly thermally conductive inorganic nano-bonding film material. Characterized in that Based on the total weight of the inorganic nano-bonding film material being 100 wt%, the inorganic nano-bonding film material includes: 16 wt% to 44 wt% of an aqueous resin, including an epoxy resin modified by an amino-functional group compound; and 55 wt% to 75 wt% of inorganic nano-powders, and the inorganic nano-powders are selected from at least one or a combination of SiO2, CuO, Al2O3, ZnO or AlN, and are surface-modified by 1 wt% to 10 wt% of a silane coupling agent; Wherein, the thickness of the non-conductive and highly thermally conductive bonding film is less than 15 μm, and the thermal conductivity is between 1.38 W / mK and 3.5 W / mK.

2. The non-conductive and highly thermally conductive bonding film according to claim 1, Characterized in that The silane coupling agent is selected from at least one or a combination of vinyl silane coupling agents, epoxy silane coupling agents, methacryloxy silane coupling agents, acryloxy silane coupling agents, amino silane coupling agents and isocyanate silane coupling agents.

3. The non-conductive and highly thermally conductive bonding film according to claim 1, Characterized in that The silane coupling agent is N-2-aminoethyl-3-aminopropylmethyldimethoxysilane.

4. The non-conductive and highly thermally conductive bonding film according to claim 1, Characterized in that The amino-functional group compound is selected from N-2-aminoethyl-3-aminopropylmethyldimethoxysilane, N-2-aminoethyl-3-aminopropyltrimethoxysilane, N-2-aminoethyl-3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N-(1,3-dimethyl-butylidene)propylamine, N-phenyl-3-aminopropyltrimethoxysilane or N-vinylbenzyl-2-aminoethyl-3-aminopropyltrimethoxysilane hydrochloride.

5. The non-conductive and highly thermally conductive bonding film according to claim 1, Characterized in that The amino-functional group compound is 3-aminopropyltrimethoxysilane.

6. The non-conductive and highly thermally conductive bonding film according to claim 1, Characterized in that The aqueous resin further includes: acrylic resin and a dispersant.

7. The non-conductive and highly thermally conductive bonding film according to claim 1, Characterized in that It further includes: a solvent, and is selected from at least one of the group consisting of isopropyl alcohol, n-butanol, isobutanol, ether, isopropyl ether, diethylene glycol monobutyl ether, acetic acid, butyric acid and hexanoic acid.

8. A preparation method of a non-conductive and highly thermally conductive bonding film, Characterized in that Includes: Surface-modifying inorganic nano-powders with 1 wt% to 10 wt% of a silane coupling agent to obtain a surface-modified inorganic nano-powder; Adding a surface-modified inorganic nano-powder to an epoxy resin modified by an amino-functional group compound to obtain a mixed adhesive; Grinding and dispersing the mixed adhesive with a three-roll mill to obtain a non-conductive and highly thermally conductive bonding film material; Adding a solvent to the non-conductive and highly thermally conductive bonding film material; And Coating, forming and drying the non-conductive and high thermal conductive bonding film material to obtain a non-conductive and high thermal conductive inorganic nano bonding film; Wherein, the total weight of the laminating film material is 100wt%, which includes: 16wt% to 44wt% of water-based resin, which includes epoxy resin modified by amino functional group compound and 55wt% to 75wt% of inorganic nano powder; Wherein, the inorganic nano powder is at least one or a combination of more than one selected from SiO2, CuO, Al2O3, ZnO or AlN; The thickness of the non-conductive and highly thermally conductive inorganic nano-bonding film is less than 15 μm, and the thermal conductivity is between 1.38 W / mK and 3.5 W / mK.

9. The method for preparing the non-conductive and highly thermally conductive laminating film according to claim 8, It is characterized in that The silane coupling agent is N-2-aminoethyl-3-aminopropylmethyldimethoxysilane, and the amino functional compound is 3-aminopropyltrimethoxysilane.

10. The method for preparing the non-conductive and highly thermally conductive laminating film according to claim 8, It is characterized in that The water-based resin further includes: acrylic resin and dispersant.

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