Wiring device and dimmer

Abstract

The invention provides a wiring device and a dimmer, the wiring device comprises a first circuit board assembly, the first circuit board assembly comprises a first circuit board, the first circuit board is provided with a heating element and a plurality of wiring terminals, and the plurality of wiring terminals are arranged on at least a first edge of the first circuit board; the heating element is arranged on at least a second edge of the first circuit board; the heat dissipation mechanism is configured to absorb and transfer heat generated by the heating element; and the shell comprises an inner cavity, and the first circuit board assembly and the heat dissipation mechanism are at least partially arranged in the inner cavity.

Description

Technical Field

[0001] The present application relates to the field of dimmers, and in particular to a wiring device and a dimmer. Background Art

[0002] A dimmer is a device that changes the luminous flux of a light source in a lighting device and adjusts the illumination. Its basic principle is to change the effective value of the current input to the light source to achieve the purpose of dimming. The dimmer is equipped with a dimming element, such as a thyristor or a relay. The dimming element generates a lot of heat during operation, causing the temperature of the dimmer to rise. When the generated heat cannot be effectively dissipated, the safety and life of the dimmer will be reduced. Summary of the invention

[0003] An object of the present application is to solve at least one aspect of the above-mentioned problems and defects in the prior art.

[0004] In response to the above problems, the present application discloses a wiring device, including a first circuit board assembly, including a first circuit board, on which a heating element and a plurality of wiring terminals are provided, the plurality of wiring terminals are arranged on at least a first edge of the first circuit board, and the heating element is arranged on at least a second edge of the first circuit board; a heat dissipation mechanism, the heat dissipation mechanism is configured to absorb and transfer heat generated by the heating element; and a shell, the shell including an inner cavity, the first circuit board assembly and the heat dissipation mechanism are at least partially arranged in the inner cavity.

[0005] According to an exemplary embodiment of the present application, the heat dissipation mechanism includes a heat conducting plate and a heat dissipation plate, the heat conducting plate extends from the heat dissipation plate and bends along a direction of insertion into the inner cavity, and the surfaces of the heat conducting plate and the heating element are in contact with each other.

[0006] According to an exemplary embodiment of the present application, a heat-conducting layer is filled between the heat-conducting plate and the heating element.

[0007] According to an exemplary embodiment of the present application, the heat conducting plate is a whole plate-shaped structure, the heating element includes a plurality of heating elements, and the plurality of heating elements are arranged at intervals on the circuit board along the length direction of the heat conducting plate.

[0008] According to an exemplary embodiment of the present application, the heating element is located between the heat conducting plate and a side wall of the housing.

[0009] According to an exemplary embodiment of the present application, the middle portion of the heat dissipation plate is sunken and has a U-shaped structure.

[0010] According to an exemplary embodiment of the present application, two ends of the heat dissipation plate extend out of the housing.

[0011] According to an exemplary embodiment of the present application, the heat-conducting layer includes one or more of thermally conductive silicone grease, thermally conductive gel, and thermally conductive silica gel.

[0012] According to an exemplary embodiment of the present application, a heat dissipation hole is provided on a side surface of the shell, and a position of the heat dissipation hole corresponds to a position of the heat conducting plate.

[0013] According to an exemplary embodiment of the present application, the heating element and the plurality of connection terminals are disposed on the same surface of the circuit board.

[0014] According to an exemplary embodiment of the present application, a pin hole is provided on the heat dissipation structure, and the pin hole is configured to be connected to a ground wire.

[0015] The present application also discloses a dimmer, comprising an adjusting device and a wiring device as described in any embodiment of the present application.

[0016] According to an exemplary embodiment of the present application, the adjusting device includes a seesaw structure, a seesaw bracket, a second circuit board assembly and a circuit board bracket, wherein the seesaw structure is disposed in the seesaw bracket and is configured to press the second circuit board assembly, the second circuit board assembly is disposed in the circuit board bracket, and the circuit board bracket is connected to the shell.

[0017] In the aforementioned exemplary embodiments of the present application, a plurality of connection terminals in the circuit board assembly of the wiring device are arranged at least on the first edge of the circuit board, and the heating element is arranged at least on the second edge of the circuit board. In addition, the circuit board assembly and the heat dissipation structure are at least partially arranged in the inner cavity of the housing. The heating element and the connection terminals are respectively and centrally arranged on the circuit board, which can improve the heat dissipation efficiency of the heating element, thereby reducing the temperature rise of the wiring device and ensuring its service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The features, advantages and other aspects of the embodiments of the present application will become more apparent with reference to the following detailed description in conjunction with the accompanying drawings. Several embodiments of the present application are shown in an exemplary and non-limiting manner. In the accompanying drawings:

[0019] Figure 1 A perspective exploded view of a wiring device according to an embodiment of the present application;

[0020] Figure 2 A schematic diagram of the structure of a circuit board assembly according to an embodiment of the present application;

[0021] Figure 3 A schematic diagram of the structure of a wiring device in an assembled state according to an embodiment of the present application; and

[0022] Figure 4It is a three-dimensional exploded view of a dimmer according to an embodiment of the present application. DETAILED DESCRIPTION

[0023] The implementation and use of the embodiments are discussed in detail below. However, it should be understood that the specific embodiments discussed are merely exemplary of specific ways to implement and use the present invention, and are not intended to limit the scope of the present invention. When describing the structural positions of the various components, such as up, down, top, bottom, etc., the expressions of directions are not absolute, but relative. When the various components are arranged as shown in the figure, these directional expressions are appropriate, but when the positions of the various components in the figure change, these directional expressions also change accordingly.

[0024] The dimmer can be electrically connected to the lighting device to adjust the illumination of the lighting device. Generally, the dimmer may include a housing, a circuit board assembly, a heat sink, and a dimming device. The circuit board assembly may be disposed in an internal chamber of the housing. In the circuit board assembly, a variety of components may be disposed on the circuit board, such as one or more of a dimming component, a rectifier, a switch, and a terminal. Some of these components, such as the dimming component and the rectifier, will emit a large amount of heat during operation due to their high power.

[0025] In some examples, the connection terminals are dispersedly arranged around the circuit board, and other components are arranged on the rest of the circuit board. In this layout, the heat generated by the heat-generating components cannot be effectively dissipated, thereby reducing the life of the product.

[0026] In order to solve the above problems, an embodiment of the present application provides a wiring device and a dimmer. The wiring device includes a first circuit board assembly, a heat dissipation mechanism and a housing. The first circuit board assembly includes a first circuit board, and a heating element and a plurality of wiring terminals are provided on the first circuit board. The plurality of wiring terminals are arranged on at least a first edge of the first circuit board, and the heating element is arranged on at least a second edge of the first circuit board. The heat dissipation mechanism is configured to absorb and transfer heat generated by the heating element. The housing includes an inner cavity, and the first circuit board assembly and the heat dissipation mechanism are at least partially arranged in the inner cavity.

[0027] Figure 1 A three-dimensional exploded view of a wiring device 100 of an embodiment of the present application is shown. The wiring device 100 includes a first circuit board assembly 10, a heat dissipation mechanism 20 and a housing 30. The first circuit board assembly 10 includes a first circuit board 101 and a plurality of components arranged on the first circuit board 101, including heating elements 102a and 102b and a plurality of wiring terminals 103. The heating elements 102a and 102b are components that emit heat during operation, such as dimming elements or rectifiers. In some examples, the dimming element includes one or more of a triac, a relay, etc. The plurality of wiring terminals 103 are used to connect to the power supply wires of the lighting device.

[0028] Figure 2 Shows Figure 1 Schematic diagram of the structure of the circuit board assembly. Figure 2 As shown, the plane of the circuit board 101 is roughly rectangular, including two opposite long sides a1, a2 and two opposite short sides b1, b2. In some other examples, the shape of the circuit board 101 is not limited thereto, for example, it can be roughly square or polygonal, wherein the polygon includes a rectangle or square with missing corners, as well as a pentagon, a hexagon, etc.

[0029] Two heating elements and three connection terminals are provided on the circuit board 101. The two heating elements can be a dimming element and a rectifier, for example, the heating element 102a is a triac, and the heating element 102b is a rectifier. It can be understood that Figure 1 The number of heating elements and connecting terminals in the embodiment is only an example. In other examples, the number of heating elements and connecting terminals can also be other numbers. The connecting terminals can be press terminals or other types of terminals.

[0030] The connection terminals 103 are centrally arranged at the first edge of the circuit board 101, i.e., the first long side a1. The heating elements 102a and 102b are arranged at the second edge of the circuit board 101, i.e., the second long side a2. The first edge and the second edge are long sides of the circuit board that are arranged oppositely. The connection terminals are neatly arranged for easy connection.

[0031] Understandably, Figure 1 The layout of the heating element and the terminal block is only an example. In some other examples, the heating element and the terminal block may be arranged on two adjacent sides of the circuit board, or on different edges spaced apart. In some examples, the positions of the multiple terminals and the multiple heating elements may not be limited to a certain edge. For example Figure 1 Some of the connection terminals may be located at the first long side a1, and another part of the connection terminals may be located at the first short side b1 adjacent to the first long side a1. Figure 1 The heating element 102a may be located at the second long side a2, and the heating element 102b may be located at the second short side b2 adjacent to the second long side a2.

[0032] Figure 1 A heat dissipation structure 20 is provided on one side of the circuit board assembly 10, and a housing 30 is provided on the other side. The heat dissipation structure 20 is used to absorb and transfer the heat generated by the heating elements 102a and 102b. Specifically, the heat dissipation structure 20 may include a plate-like structure, which may be attached to the surface of the heating elements 102a and 102b, and conduct the heat generated by the heating elements 102a and 102b to the rest of the heat dissipation structure 20, and finally conduct the heat to the outside of the wiring device.

[0033] The housing 30 is provided with an inner cavity, and the circuit board assembly 10 and part of the heat dissipation mechanism 20 can be arranged in the inner cavity of the housing 30. The housing 30 can be made of a plastic material with a low thermal conductivity. The side of the housing 30 is provided with three receiving grooves for respectively receiving three connection terminals.

[0034] Figure 1 In the circuit board assembly of the wiring device 100, a plurality of wiring terminals are arranged at least at the first edge of the circuit board, and the heating element is arranged at at least at the second edge of the circuit board. In addition, the circuit board assembly and the heat dissipation structure are arranged in the inner cavity of the housing. The heating element and the wiring terminals are respectively arranged on the circuit board, which can improve the heat dissipation efficiency of the heating element, thereby reducing the temperature rise of the wiring device and ensuring its service life. In addition, the heating element and the wiring terminals are arranged at different edges of the circuit board to increase the free space of the circuit board assembly.

[0035] In some examples, the heat dissipation mechanism can be made of a metal material with high thermal conductivity, such as copper, aluminum or alloy. In some examples, the heat dissipation mechanism can be a ceramic plate with strong thermal conductivity. The heat dissipation mechanism includes a heat dissipation plate and a heat conducting plate, wherein the heat conducting plate is used to fit with the heating element on the circuit board and absorb heat, and the heat dissipation plate is used to dissipate the heat absorbed by the heat conducting plate.

[0036] Figure 1 The heat dissipation mechanism 20 includes a heat conducting plate 201 and a heat sink 202. The heat conducting plate 201 extends from the heat sink 202 and is bent in an L shape. The heat sink 202 can serve as the top of the wiring device 100. The heat conducting plate is bent downward along the side of the housing 30 from the edge of the heat sink 202, that is, it is bent along the direction of the inner cavity of the housing 30. The heat conducting plate 201 is plate-shaped and can be attached to the surface of the heating element 102a, 102b. The attachment of the heat conducting plate 201 to the surface of the heating element can quickly transfer the heat to the heat sink 202.

[0037] In some examples, the heating element can be disposed on the circuit board in a lying position and can be attached to the horizontally disposed heat conducting plate on the top. In the wiring device 100, the heating elements 102a and 102b are disposed upright on the circuit board 101, and the sides of the heating elements are attached to the vertically disposed heat conducting plate 201. This arrangement can not only optimize the layout of the circuit board assembly, but also the heat conducting surface is close to the edge of the housing 30, which can dissipate heat faster.

[0038] exist Figure 1In the embodiment, the heat conducting plate 201 is a whole plate-like structure, and the heating elements 102a and 102b are arranged at intervals on the circuit board 101 along the heat conducting plate. In the arrangement where a plurality of dispersed heating elements are attached to a heat conducting plate, the heat dissipation surface area is increased, thereby improving the heat dissipation efficiency. The heat conducting plate can run through the inner cavity of the housing 30 in the length direction. In some examples, the ratio of the length of the heat conducting plate to the length of the heat dissipation plate in the housing is in the range of 7:10 to 9:10.

[0039] In some examples, when the wiring device includes a plurality of heating elements, the heat conducting plate may include a plurality of separate plate-like structures, and each plate-like structure is disposed at intervals corresponding to the position of different heating elements.

[0040] In some examples, a heat conducting sheet may be provided between the heat conducting plate and the heating element to improve heat dissipation. In some examples, a heat conducting layer (not shown in the figure) may be provided between the heat conducting plate 201 and the heating elements 102a, 102b. The heat conducting layer is used to fill the gap between the heat conducting plate and the heating element. The interface wettability of the heat conducting layer is good and the coating is thin, which can cooperate with the heat conducting plate to achieve thermal expansion. The heat conducting layer does not need to be fixed by mechanical parts such as bolts like a conductive sheet. The heat conducting layer includes a phase change material or a thermal conductive paste. The thermal conductive paste can be one or more of thermal conductive silicone grease, thermal conductive gel, and thermal conductive silica gel. The thickness of the heat conducting layer is relatively thin. In some examples, the thickness of the heat conducting layer may not exceed 0.1 mm, for example, 0.05 mm, 0.06 mm or 0.1 mm. In some examples, the thermal conductivity of the heat conducting layer may be greater than 4W / (m·K).

[0041] Figure 1 In the figure, the heat sink 202 is plate-shaped as a whole, but the middle part thereof is sunken, forming a U-shaped structure. Compared with a heat sink that is a whole flat plate, the U-shaped structure can increase the surface area for heat dissipation. In addition, the U-shaped structure of the heat sink can increase the convection area with the air. Specifically, when the surface temperature of the heat sink rises, the surrounding cold air rises due to the heat, forming natural convection, and the shape of the U-shaped heat sink can guide the air flow to accelerate the dissipation of heat. In addition, the left and right ends of the heat sink 202 extend out of the shell 30. The heat sink can absorb heat and transfer it to the outside of the wiring device.

[0042] In some examples, the heat dissipation mechanism 20 can not only perform the function of heat dissipation, but also play the role of grounding. For example, the heat dissipation mechanism 20 can be provided with a pin hole ( Figure 4 203), the pin hole can be used to connect to the ground wire.

[0043] Figure 3 Shows Figure 1 Schematic diagram of the structure of the wiring device in the assembled state. Figure 3It can be seen that the heating elements 102 a and 102 b are located outside the heat conducting plate 201 , that is, the heating elements are located between the heat conducting plate and the side wall of the housing 30 . Figure 3 In the example, since the heating element is located outside the heat conducting plate, part of the heat generated by it can be directly exchanged with the air, which is more conducive to heat dissipation.

[0044] The relative positions of the heating element and the heat conducting plate can be set accordingly according to the specific situation. In some examples, the heating element can be located on the inner side of the heat conducting plate, that is, the outer surface of the heating element fits the inner surface of the heat conducting plate. In some examples, the heating element 102a and the heating element 102b can be located on different sides of the heat conducting plate. For example, the heating element 102a is located on the inner side of the heat conducting plate, and the heating element 102b is located on the outer side of the heat conducting plate. Figure 3 It is also shown that the heating element and the heat conducting plate can be fixed by screws 105, which can increase the fastening force between the two.

[0045] like Figure 1 and Figure 3 As shown, in the wiring device 100, the side of the housing 30 is provided with a heat dissipation hole 301, and its position corresponds to the position of the heat conducting plate 201, and also corresponds to the position of the heating elements 102a, 102b. The setting of the heat dissipation hole helps to accelerate the heat dissipation. When the heating element is working, part of the heat generated by it is guided out through the heat conducting plate, and part of the heat is directly dissipated to the outside of the housing through the heat dissipation hole. In other examples, the heat dissipation hole can be set at other positions of the housing and can be other appropriate numbers.

[0046] In addition, in the circuit board assembly 10, the heating elements 102a, 102b and the plurality of connection terminals 103 are located on the same surface of the circuit board 101, that is, Figure 1 In this way, in the assembled state of the wiring device 100, the heat dissipation structure 20 and the circuit board assembly 10 are at least partially arranged in the inner cavity of the housing 30. For example, the sunken middle part of the heat dissipation plate is arranged in the inner cavity of the housing 30, and the two ends of the heat dissipation plate extend out of the housing 30, which can save the internal space of the housing 30, thereby facilitating the miniaturization of the wiring device 100. In some examples, the heating elements 102a, 102b and the plurality of wiring terminals 103 are located on different surfaces of the circuit board 101. For example, the heating elements 102a, 102b are located on the upper surface of the circuit board 101, and the plurality of wiring terminals are located on the lower surface of the circuit board.

[0047] The circuit board assembly 10 may further include a switch 104. In some examples, the switch 104 is a mechanical switch, and when the mechanical switch 104 is triggered, forced switch control can be implemented, thereby forcibly cutting off the power supply to avoid accidents.

[0048] An embodiment of the present application provides a dimmer 1 . Figure 4 The dimmer 1 is a perspective exploded view. The dimmer 1 comprises a wiring device and an adjusting device. The wiring device is any of the above embodiments of the present application, for example, a wiring device 100 comprising a circuit board assembly 10, a heat dissipation mechanism 20 and a housing 30.

[0049] Figure 4 The middle dimmer 1 adjusts the luminous flux and illumination of the lighting device through a seesaw structure. Specifically, the adjusting device includes a small seesaw 90, a large seesaw 80, a seesaw bracket 70, a pressing circuit board assembly (second circuit board) 60, and a circuit board bracket 50. The seesaw structure composed of the small seesaw 90 and the large seesaw 80 can be assembled into the seesaw bracket 70. The user can press the plus and minus symbols on the seesaw structure, and the seesaw can press the circuit board assembly. The pressing circuit board assembly 60 can be snapped into the circuit board bracket 50. The shape of the circuit board bracket 50 matches the housing 30, and the two can be connected by screws. In addition, the grounding wire 40 can be riveted in the heat dissipation mechanism 20.

[0050] It can be understood that the structure of the dimmer of the present application is not limited to Figure 4 In some other examples, the adjusting device in the dimmer may include any one of a rotating torsion bar, a push-pull switch, and a touch device.

[0051] It is worth noting that the wiring device of the present application is not limited to the dimmer. In some examples, the wiring device of the present application can also be applied to a switch or a socket.

[0052] The above is only an optional embodiment of the embodiment of the present application, and is not intended to limit the embodiment of the present application. For those skilled in the art, the embodiment of the present application may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the embodiment of the present application shall be included in the protection of the embodiment of the present application.

[0053] Although the embodiments of the present application have been described with reference to several specific embodiments, it should be understood that the embodiments of the present application are not limited to the disclosed specific embodiments. The embodiments of the present application are intended to cover various modifications and equivalent arrangements included in the spirit and scope of the appended claims. The scope of the appended claims conforms to the broadest interpretation, thereby including all such modifications and equivalent structures and functions.

Claims

1. A wiring device, characterized in that: include: A first circuit board assembly comprises a first circuit board, wherein a heating element and a plurality of connection terminals are arranged on the first circuit board, wherein the plurality of connection terminals are arranged at least at a first edge of the first circuit board, and the heating element is arranged at at least at a second edge of the first circuit board; a heat dissipation mechanism configured to absorb and transfer heat generated by the heating element; as well as The housing comprises an inner cavity, and the first circuit board assembly and the heat dissipation mechanism are at least partially disposed in the inner cavity.

2. The wiring device according to claim 1, characterized in that: The heat dissipation mechanism comprises a heat conduction plate and a heat dissipation plate, the heat conduction plate extends from the heat dissipation plate and is bent along a direction of being inserted into the inner cavity, and the surfaces of the heat conduction plate and the heating element are in contact with each other.

3. The wiring device according to claim 2, characterized in that: A heat-conducting layer is filled between the heat-conducting plate and the heating element.

4. The wiring device according to claim 2, characterized in that: The heat conducting plate is a whole plate-shaped structure, the heating element comprises a plurality of heating elements, and the plurality of heating elements are arranged at intervals on the circuit board along the length direction of the heat conducting plate.

5. The wiring device according to claim 2, characterized in that: The heating element is located between the heat conducting plate and the side wall of the housing.

6. The wiring device according to claim 2, characterized in that: The middle part of the heat dissipation plate is sunken and has a U-shaped structure.

7. The wiring device according to claim 2, characterized in that: Both ends of the heat dissipation plate extend out of the shell.

8. The wiring device according to claim 3, characterized in that: The heat-conducting layer includes one or more of thermal grease, thermal gel, and thermal silica gel.

9. The wiring device according to claim 2, characterized in that: The side surface of the shell is provided with a heat dissipation hole, and the position of the heat dissipation hole corresponds to the position of the heat conducting plate.

10. The wiring device according to claim 1, characterized in that: The heating element and the plurality of connection terminals are arranged on the same surface of the circuit board.

11. The wiring device according to claim 1, characterized in that: The heat dissipation structure is provided with a pin hole, and the pin hole is configured to be connected to a ground wire.

12. A dimmer, characterized in that: The invention comprises an adjusting device and a wiring device as claimed in any one of claims 1 to 11.

13. The dimmer according to claim 12, characterized in that: The adjusting device includes a seesaw structure, a seesaw bracket, a second circuit board assembly and a circuit board bracket, wherein the seesaw structure is arranged in the seesaw bracket and is configured to press the second circuit board assembly, the second circuit board assembly is arranged in the circuit board bracket, and the circuit board bracket is connected to the shell.

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