Device and method for detecting bending capability of flexible chip

Abstract

The invention relates to a device and method for detecting the bending capacity of a flexible chip. The device comprises an arc-shaped block, a first pressing rod, a second pressing rod, a first clamp and a second clamp. The first clamp and the second clamp are used for clamping a flexible substrate, and the arc-shaped block is located between the first clamp and the second clamp; the first pressing rod is movably arranged between the first clamp and the arc-shaped block, the second pressing rod is movably arranged between the second clamp and the arc-shaped block, and a flexible chip on the flexible substrate is located at the arc-shaped block; the first pressing rod and the second pressing rod are used for pressing the flexible substrate to the arc-shaped block so that the flexible chip can be attached to the arc-shaped block.

Description

Technical Field

[0001] The present invention relates to the field of chip detection, and in particular to a flexible chip bending ability detection device and a detection method. Background Art

[0002] In the prior art, a double-roller system is generally used to detect the bending performance of flexible chips. The flexible chip is installed on a flexible substrate. The double-roller system includes a curvature roller and a pressure roller. The flexible substrate leans on the curvature roller while keeping it flat. At this time, the flexible substrate and the curvature roller are tangent, and then the pressure roller rotates around the curvature roller, so that the flexible substrate bends and fits on the outer wall of the curvature roller. As a result, the flexible chip is also bent and fits on the outer wall of the curvature roller. The bending radius of the flexible chip is the radius of the curvature roller.

[0003] When the pressure roller rotates around the curvature roller, relative sliding will occur between the pressure roller and the flexible substrate. Therefore, the pressure roller will squeeze the flexible chip for a short period of time during the rotation process, thereby causing unnecessary damage to the flexible chip. Summary of the invention

[0004] Based on this, it is necessary to provide a flexible chip bending ability detection device and detection method to address the problem of flexible chips being damaged during bending detection.

[0005] A flexible chip bending ability detection device comprises an arc block, a first pressure rod, a second pressure rod, a first clamp and a second clamp;

[0006] The first clamp and the second clamp are used to clamp the flexible substrate, and the arc block is located between the first clamp and the second clamp;

[0007] The first pressing rod is movably arranged between the first clamp and the arc block, the second pressing rod is movably arranged between the second clamp and the arc block, and the flexible chip on the flexible substrate is located at the arc block;

[0008] The first pressing rod and the second pressing rod are used to press the flexible substrate toward the arc-shaped block so that the flexible chip is attached to the arc-shaped block.

[0009] The present invention also includes a substrate, a first elastic member, a second elastic member, a first tension sensor and a second tension sensor. The first clamp and the second clamp are slidably arranged on the substrate, the two ends of the first elastic member are respectively arranged on the substrate and the first clamp, the first tension sensor is arranged on the first elastic member, the two ends of the second elastic member are respectively arranged on the substrate and the second clamp, and the second tension sensor is arranged on the second elastic member.

[0010] The arc block of the present invention comprises a raised portion and an arc portion fixed to the raised portion, the arc portion is used to bend the flexible chip, and the raised portion is mounted on the substrate so that a gap is left between the arc portion and the substrate.

[0011] The base plate of the present invention is provided with a positioning groove extending in a first direction, the raised portion is installed in the positioning groove, the outer wall surface of the arc portion away from the raised portion is a cylindrical surface, and the axis of the cylindrical surface extends in the first direction.

[0012] The base plate of the present invention is provided with two guide grooves extending along the second direction, and the first clamp and the second clamp are slidably disposed at the two guide grooves respectively.

[0013] The normal direction of the substrate of the present invention is the third direction, the first pressure rod and the second pressure rod are both movably arranged along the third direction, and the first pressure rod and the second pressure rod are symmetrical about the axis of the cylindrical surface.

[0014] The base plate of the present invention is provided with an avoidance groove, and the projections of the first pressing rod and the second pressing rod in the third direction are both located in the avoidance groove.

[0015] The positioning groove of the present invention is arranged in the middle of the bottom wall of the avoidance groove.

[0016] The substrate of the present invention is provided with a first positioning column, the first clamp is provided with a first hook, the two ends of the first elastic member are respectively provided on the first positioning column and the first hook, and the first positioning column and the first hook are arranged opposite to each other in the second direction.

[0017] The first clamp of the present invention includes a first base plate, a first pressure plate and a first locking member, the flexible substrate is inserted between the first pressure plate and the first base plate, and the first pressure plate is locked on the first base plate by the first locking member, and the second clamp includes a second base plate, a second pressure plate and a second locking member, the flexible substrate is inserted between the second pressure plate and the second base plate, and the second pressure plate is locked on the second base plate by the second locking member.

[0018] A method for detecting the bending ability of a flexible chip, based on a flexible chip bending ability detection device, the method comprising:

[0019] The first clamp and the second clamp clamp the flexible substrate;

[0020] The first pressing rod and the second pressing rod press the flexible substrate to make the flexible chip adhere to the arc block.

[0021] In the present invention, when the indications of the first tension sensor and the second tension sensor match, the first pressure rod and the second pressure rod stop moving.

[0022] The beneficial effects of the present invention are:

[0023] The first clamp and the second clamp cooperate to clamp the flexible substrate, and the first pressure rod and the second pressure rod squeeze the flexible substrate so that the portion of the flexible substrate between the first pressure rod and the second pressure rod moves toward the arc block. Since the flexible chip is located on the portion of the flexible substrate between the first pressure rod and the second pressure rod, the flexible chip can move to the arc block to bend and fit to the arc block on the basis of avoiding the first pressure rod and the second pressure rod, so that the bending radius of the flexible chip is equal to the curvature radius of the arc block.

[0024] The above detection method avoids double-sided clamping of the flexible chip and reduces damage to the flexible chip while meeting the bending requirements of the flexible chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic diagram of the front view of the flexible chip bending ability detection device in Example 1 of the present invention;

[0026] Figure 2 This is a schematic diagram of the side view of the structure of the flexible chip bending ability detection device in Example 1 of the present invention;

[0027] Figure 3 This is a schematic diagram of the top view of the structure of the flexible chip bending ability detection device in Example 1 of the present invention;

[0028] Figure 4 This is a circuit topology diagram of a flexible chip bending ability detection device in Example 1 of the present invention;

[0029] Figure 5 Schematic diagram of the top view of the flexible chip bending ability detection device in Example 2 of the present invention;

[0030] Figure 6 It is a side view structural schematic diagram of the flexible chip bending ability detection device in Example 2 of the present invention.

[0031] Reference numerals:

[0032] 1. Base plate; 11. First positioning post; 12. Second positioning post; 13. Avoidance groove; 131. Positioning groove; 14. Guide groove; 2. Arc block; 21. Raised portion; 22. Arc portion; 221. Cylindrical surface; 3. First pressure rod; 4. Second pressure rod; 5. First clamp; 51. First elastic member; 52. First tension sensor; 6. Second clamp; 61. Second elastic member; 62. Second tension sensor; 7. Flexible substrate; 71. Flexible chip; 8. Motor screw mechanism; 9. Controller; 91. Display screen; 92. Switch. DETAILED DESCRIPTION

[0033] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0034] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0035] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0036] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0037] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0038] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0039] Embodiment 1:

[0040] See also Figure 1-Figure 4 This embodiment provides a flexible chip bending ability detection device, including a substrate 1, an arc block 2, a first pressure rod 3, a second pressure rod 4, a first clamp 5 and a second clamp 6.

[0041] The first clamp 5 , the arc block 2 and the second clamp 6 are sequentially arranged on the upper surface of the substrate 1 in a second direction and spaced apart from each other. The second direction is parallel to the substrate 1 .

[0042] The normal direction of the substrate 1 is the third direction, wherein the first pressure rod 3 is located between the first clamp 5 and the arc block 2 in the second direction, and the second pressure rod 4 is located between the arc block 2 and the second clamp 6 in the second direction. The first pressure rod 3 and the second pressure rod 4 can only be movably arranged along the third direction on the substrate 1 and are both located above the substrate 1, so as to avoid the first pressure rod 3 and the second pressure rod 4 from contacting or squeezing the arc block 2. The first pressure rod 3 and the second pressure rod 4 are driven by a motor screw mechanism 8, which is a prior art and will not be described in detail in this embodiment.

[0043] Of course, in some other embodiments, the first pressure rod 3 and the second pressure rod 4 may also have more freedom of movement on the substrate 1 , as long as the first pressure rod 3 and the second pressure rod 4 are prevented from directly contacting or squeezing the arc block 2 .

[0044] The flexible substrate 7 is in the shape of a long strip, with a flexible chip 71 mounted in the middle.

[0045] Based on the above-mentioned flexible chip bending ability detection device, this embodiment provides a flexible chip bending ability detection method, including the following steps:

[0046] Step S1: The flexible substrate 7 is arranged along the second direction, and the flexible substrate 7 is clamped by the first clamp 5 and the second clamp 6, so that the length of the flexible substrate 7 between the first clamp 5 and the second clamp 6 is fixed, wherein the flexible chip 71 is located at the arc block 2, and the flexible chip 71 and the arc block 2 are arranged relative to each other in the third direction.

[0047] Step S2: The first pressure rod 3 and the second pressure rod 4 move toward the substrate 1 in the third direction and squeeze the upper surface of the flexible substrate 7 at the same time. Due to the supporting effect of the first clamp 5 and the second clamp 6 on the flexible substrate 7, the portion of the flexible substrate 7 between the first pressure rod 3 and the second pressure rod 4 will also move toward the arc block 2 and contact the arc block 2. With the further movement of the first pressure rod 3 and the second pressure rod 4, the portion of the flexible substrate 7 between the first pressure rod 3 and the second pressure rod 4 will gradually bend along the outer wall surface of the arc block 2 and gradually fit the outer wall surface of the arc block 2. In this process, the flexible chip 71 will also bend along the outer wall surface of the arc block 2, so that the bending radius of the flexible chip 71 finally matches the curvature radius of the arc block 2.

[0048] Since the first pressure rod 3 and the second pressure rod 4 completely avoid the arc block 2 during the movement, the first pressure rod 3 and the second pressure rod 4 will definitely not squeeze the flexible chip 71 located on the arc block 2, thereby avoiding the flexible chip 71 from being squeezed on both sides and reducing the damage to the flexible chip 71.

[0049] Of course, in order to accurately detect the bending ability of the flexible chip 71, not only is it necessary for the bending radius of the flexible chip 71 to match the curvature radius of the arc block 2, but it is also necessary to ensure that the flexible chip 71 is sufficiently bent as a whole to have sufficient contact with the arc block 2. Considering that the arc block 2 and the flexible chip 71 are both very small in size, it is difficult for the first pressure rod 3 and the second pressure rod 4 to directly sense the change in the contact between the arc block 2 and the flexible chip 71 through visual observation during the movement.

[0050] Based on the above problems, in this embodiment, the first clamp 5 and the second clamp 6 are not fixed on the substrate 1, but can slide in the second direction. Correspondingly, the flexible chip bending ability detection device also includes a first elastic member 51, a second elastic member 61, a first tension sensor 52 and a second tension sensor 62.

[0051] The two ends of the first elastic member 51 are respectively arranged on the substrate 1 and the first clamp 5, and the first tension sensor 52 is arranged on the first elastic member 51. The first tension sensor 52 is used to detect the tension on the first elastic member 51. The two ends of the second elastic member 61 are respectively arranged on the substrate 1 and the second clamp 6, and the second tension sensor 62 is arranged on the second elastic member 61. The second tension sensor 62 is used to detect the tension on the second elastic member 61.

[0052] In the process of the first pressure bar 3 and the second pressure bar 4 moving downward to squeeze the flexible substrate 7, a pulling effect will be exerted on the end of the flexible substrate 7, thereby pulling the first clamp 5 and the second clamp 6 toward the arc block 2. Correspondingly, the first clamp 5 and the second clamp 6 will respectively exert a stretching effect on the first elastic member 51 and the second elastic member 61. The closer the first pressure bar 3 and the second pressure bar 4 are to the surface of the substrate 1, the greater the bending degree of the flexible substrate 7 at the arc block 2. Correspondingly, the greater the pulling effect on the first clamp 5 and the second clamp 6, the greater the tension value of the first elastic member 51 and the second elastic member 61 detected by the first tension sensor 52 and the second tension sensor 62. Based on this principle, by reading the tension value on the first elastic member 51 and the second elastic member 61, the bonding state of the flexible substrate 7 and the arc block 2, that is, the bonding area between the flexible chip 71 and the arc block 2, can be objectively reflected.

[0053] Preferably, the arc block 2 includes a raised portion 21 and an arc portion 22 fixed to the raised portion 21, wherein the raised portion 21 is mounted on the substrate 1, and the arc portion 22 is located on the side of the raised portion 21 away from the substrate 1, thereby leaving a certain gap between the arc portion 22 and the substrate 1. Accordingly, when the first pressure bar 3, the second pressure bar 4 and the bottom of the arc portion 22 are at the same height in the third direction, the flexible chip 71 can bend and deform and come into contact with the arc portion 22. On this basis, due to the effect of the raised portion 21, the substrate 1 avoids the first pressure bar 3 and the second pressure bar 4, and the first pressure bar 3 and the second pressure bar 4 obtain an additional movement stroke, thereby the first pressure bar 3 and the second pressure bar 4 can further move toward the substrate 1 to allow the flexible chip 71 to further bend and contact on the arc portion 22, thereby ensuring that the flexible chip 71 can bend and deform to generate a sufficient contact area with the arc portion 22.

[0054] In order to detect different bending radii of the flexible chip 71, it is necessary to use arc portions 22 with different curvature radii, and accordingly, the arc block 2 needs to be detachably installed on the substrate 1. In this embodiment, a positioning groove 131 extending along a first direction is provided on the substrate 1, and the first direction is perpendicular to the second direction and the third direction. The raised portion 21 is installed at the positioning groove 131 and is positioned in the second direction by the side wall of the positioning groove 131, and the arc block 2 can be disassembled and assembled in the third direction. The outer wall surface of the arc portion 22 away from the raised portion 21 is a cylindrical surface 221, and the flexible chip 71 is deformed in contact with the cylindrical surface 221, so the bending radius of the flexible chip 71 is the radius of the cylindrical surface 221. The axis of the cylindrical surface 221, the first pressure rod 3 and the second pressure rod 4 all extend in the first direction. Therefore, when the flexible chip 71 is bent and deformed on the cylindrical surface 221, pressure is only generated in the radial direction of the cylindrical surface 221, and no force is generated in the axial direction of the cylindrical surface 221, that is, in the first direction. This prevents the arc block 2 from sliding in the positioning groove 131, so the arc block 2 does not need to be fixed in the positioning groove 131, which simplifies the installation process of the arc block 2.

[0055] Preferably, an avoidance groove 13 is opened on the substrate 1, and the projections of the first pressure rod 3 and the second pressure rod 4 in the third direction are both located in the avoidance groove 13, so that the first pressure rod 3 and the second pressure rod 4 can enter the avoidance groove 13 along the third direction, and the avoidance groove 13 further improves the movable range of the first pressure rod 3 and the second pressure rod 4 in the third direction to allow the portion of the flexible substrate 7 between the first pressure rod 3 and the second pressure rod 4 and the flexible chip 71 to further generate bending deformation on the cylindrical surface 221.

[0056] In this embodiment, the positioning groove 131 is opened in the middle of the bottom wall of the avoidance groove 13, so the space between the side wall of the avoidance groove 13 and the arc block 2 can be used to accommodate the first pressure rod 3 and the second pressure rod 4. When the first pressure rod 3 and the second pressure rod 4 are located in the avoidance groove 13, the first pressure rod 3 and the second pressure rod 4 are not blocked from the arc block 2 in the second direction, so that the first pressure rod 3 and the second pressure rod 4 can be very close to the arc block 2, which is more conducive to making the flexible chip 71 bend with a small curvature radius.

[0057] It can be seen from the above detection process that when the readings of the first tension sensor 52 and the second tension sensor 62 meet the requirements, it means that the flexible chip 71 has generated sufficient bending and has a sufficient contact area with the cylindrical surface 221. When a large number of flexible chips 71 need to be tested in batches, it is necessary to ensure that during each test, when the bending degree of the flexible chip 71 reaches the target state, the readings of the first tension sensor 52 and the second tension sensor 62 need to remain relatively fixed.

[0058] To this end, the moving direction of the first clamp 5 and the second clamp 6 needs to be restricted, and the tensile deformation direction of the first elastic member 51 and the second elastic member 61 also needs to be restricted, so as to ensure that the moving direction of the first clamp 5 and the second clamp 6, and the tensile direction of the first elastic member 51 and the second elastic member 61 are always along the second direction.

[0059] Correspondingly, two guide grooves 14 extending along the second direction are provided on the substrate 1, and the first clamp 5 and the second clamp 6 are slidably disposed at the two guide grooves 14 respectively, so as to limit the movement direction of the first clamp 5 and the second clamp 6 to the second direction.

[0060] A first positioning column 11 and a second positioning column 12 are provided on the substrate 1, a first hook is provided on the first clamp 5, and a second hook is provided on the second clamp 6. The first positioning column 11 and the first hook are arranged opposite to each other in the second direction, and the second positioning column 12 and the second hook are arranged opposite to each other in the second direction. The two ends of the first elastic member 51 are respectively arranged on the first positioning column 11 and the first hook, and the two ends of the second elastic member 61 are respectively arranged on the second positioning column 12 and the second hook, so that the deformation direction of the first elastic member 51 and the second elastic member 61 is limited to the second direction.

[0061] In this embodiment, the first clamp 5 includes a first bottom plate, a first pressing plate and a first locking member, the flexible substrate 7 is inserted between the first pressing plate and the first bottom plate, and the first pressing plate is locked on the first bottom plate by the first locking member, so that the first pressing plate and the first bottom plate cooperate to clamp the flexible substrate 7; the second clamp 6 includes a second bottom plate, a second pressing plate and a second locking member, the flexible substrate 7 is inserted between the second pressing plate and the second bottom plate, and the second pressing plate is locked on the second bottom plate by the second locking member, so that the second pressing plate and the second bottom plate cooperate to clamp the flexible substrate 7. The first bottom plate and the second bottom plate are slidably arranged on the upper surface of the substrate 1, and by changing the clamping position of the flexible substrate 7 on the first clamp 5 and the second clamp 6, the length of the part of the flexible substrate 7 between the first clamp 5 and the second clamp 6 can be changed, so as to avoid the part of the flexible substrate 7 between the first clamp 5 and the second clamp 6 being too long, and ensure that the first pressing rod 3 and the second pressing rod 4 can make the flexible chip 71 generate sufficient bending and contact area on the cylindrical surface 221 before contacting the bottom wall of the avoidance groove 13.

[0062] In order to make the stress of the flexible chip 71 more uniform during the bending process, the flexible chip 71 should be located in the middle of the cylindrical surface 221 in an ideal state. Therefore, in this embodiment, the first pressure rod 3 and the second pressure rod 4 are symmetrical about the axis of the cylindrical surface 221, so that the stress generated when the first pressure rod 3 and the second pressure rod 4 squeeze the flexible substrate 7 is symmetrical about the axis of the cylindrical surface 221. The first positioning column 11, the first elastic member 51, and the first clamp 5 are also symmetrical with the second positioning column 12, the second elastic member 61, and the second clamp 6 about the axis of the cylindrical surface 221.

[0063] The circuit topology of the flexible chip bending ability detection device in this embodiment is as follows: the controller 9 is electrically connected to the motor screw mechanism 8, and the motor screw mechanism 8 drives the first pressure rod 3 and the second pressure rod 4 to move in the third direction so that the values ​​of the first tension sensor 52 and the second tension sensor 62 change. The first tension sensor 52 and the second tension sensor 62 are electrically connected to the controller 9 and transmit the tension detection value to the controller 9. When the tension detection value triggers the target condition, the controller 9 controls the motor screw mechanism 8 to stop working.

[0064] Based on the symmetrical structure between the aforementioned first pressure rod 3 and the second pressure rod 4, the target condition for triggering the tension detection value in this embodiment is that the readings of the first tension sensor 52 and the second tension sensor 62 match, that is, the readings of the first tension sensor 52 and the second tension sensor 62 are equal and have both reached the target values.

[0065] When the tension detection value triggers the target condition, it can be considered that the flexible chip 71 is in the middle position of the cylindrical surface 221 and has been fully bent. The curvature radius of the flexible chip 71 at this time matches the radius of the cylindrical surface 221, and there is sufficient contact area between the flexible chip 71 and the cylindrical surface 221.

[0066] Furthermore, the controller 9 can also be electrically connected to a display screen 91 and a switch 92 , wherein the display screen 91 can display the tension detection values ​​of the first tension sensor 52 and the second tension sensor 62 , and the switch 92 can manually start and stop the motor screw mechanism 8 .

[0067] Embodiment 2:

[0068] See also Figure 5 and Figure 6 The difference between this embodiment and embodiment 1 is that a plurality of arc blocks 2 are arranged in the positioning groove along the first direction, and the arc portions of different arc blocks 2 have different curvature radii. The motor screw mechanism 8 can drive the first pressing rod 3 and the second pressing rod 4 to squeeze the flexible substrates 7 on all the arc blocks 2 at the same time, thereby improving the detection efficiency.

[0069] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0070] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A flexible chip bending ability detection device, It is characterized in that It includes an arc block, a first pressure rod, a second pressure rod, a first clamp and a second clamp; The first clamp and the second clamp are used to clamp the flexible substrate, and the arc block is located between the first clamp and the second clamp; The first pressing rod is movably arranged between the first clamp and the arc block, the second pressing rod is movably arranged between the second clamp and the arc block, and the flexible chip on the flexible substrate is located at the arc block; The first pressing rod and the second pressing rod are used to press the flexible substrate toward the arc-shaped block so that the flexible chip is attached to the arc-shaped block.

2. The flexible chip bending ability detection device according to claim 1, It is characterized in that It also includes a substrate, a first elastic member, a second elastic member, a first tension sensor and a second tension sensor, the first clamp and the second clamp are slidably arranged on the substrate, the two ends of the first elastic member are respectively arranged on the substrate and the first clamp, the first tension sensor is arranged on the first elastic member, the two ends of the second elastic member are respectively arranged on the substrate and the second clamp, and the second tension sensor is arranged on the second elastic member.

3. The flexible chip bending ability detection device according to claim 2, It is characterized in that The arc block includes a raised portion and an arc portion fixed to the raised portion, the arc portion is used to bend the flexible chip, and the raised portion is mounted on the substrate so that a gap is left between the arc portion and the substrate.

4. The flexible chip bending ability detection device according to claim 3, It is characterized in that The base plate is provided with a positioning groove extending in the first direction, the elevation portion is installed in the positioning groove, the outer wall surface of the arc portion away from the elevation portion is a cylindrical surface, and the axis of the cylindrical surface extends in the first direction.

5. The flexible chip bending ability detection device according to claim 4, It is characterized in that The base plate is provided with two guide grooves extending along the second direction, and the first clamp and the second clamp are slidably disposed at the two guide grooves respectively.

6. The flexible chip bending ability detection device according to claim 5, It is characterized in that The normal direction of the substrate is the third direction, the first pressure rod and the second pressure rod are both movably arranged along the third direction, and the first pressure rod and the second pressure rod are symmetrical about the axis of the cylindrical surface.

7. The flexible chip bending ability detection device according to claim 6, It is characterized in that The base plate is provided with an avoidance groove, and the projections of the first pressing rod and the second pressing rod in the third direction are both located in the avoidance groove.

8. The flexible chip bending ability detection device according to claim 7, It is characterized in that The positioning groove is arranged in the middle of the bottom wall of the avoidance groove.

9. The flexible chip bending ability detection device according to claim 5, It is characterized in that A first positioning column is disposed on the substrate, a first hook is disposed on the first clamp, two ends of the first elastic member are disposed on the first positioning column and the first hook respectively, and the first positioning column and the first hook are disposed opposite to each other in the second direction.

10. The flexible chip bending ability detection device according to claim 5, It is characterized in that The first clamp includes a first base plate, a first pressure plate and a first locking member, the flexible substrate is inserted between the first pressure plate and the first base plate, and the first pressure plate is locked on the first base plate by the first locking member, the second clamp includes a second base plate, a second pressure plate and a second locking member, the flexible substrate is inserted between the second pressure plate and the second base plate, and the second pressure plate is locked on the second base plate by the second locking member.

11. A method for detecting the bending ability of a flexible chip, It is characterized in that Based on the flexible chip bending ability detection device according to any one of claims 1 to 10, the method comprises: The first clamp and the second clamp clamp the flexible substrate; The first pressing rod and the second pressing rod press the flexible substrate to make the flexible chip adhere to the arc block.

12. The method for detecting the bending ability of a flexible chip according to claim 11, It is characterized in that When the indications of the first tension sensor and the second tension sensor match, the first pressure rod and the second pressure rod stop moving.

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