Signal guide chip test seat

Abstract

The signal guide chip test seat is provided with a base, a circuit board, a positioning plate, an adapter plate, an upper cover and a chip, the device comprises an upper probe plate, an upper probe, a lower probe plate, a lower probe, a bottom frame, an upper base, a lower base, an upper positioning pin, a lower positioning pin, a pin bonding pad 1, a pin bonding pad 2, an adapter socket and a knob. The lower bottom surface of the lower probe plate is made into the same cross section as the chip and extends beyond the height of the electronic components around the chip so as not to interfere with the electronic components around the chip, and then the cross section is changed so as to be mounted under the base. The invention discloses a signal guide chip test seat, and aims to develop a signal guide chip test seat which has no limitation on a circuit board and can be used when electronic elements around a tested chip on the circuit board are very dense.

Description

(I) Technical field

[0001] The invention relates to the technical field of chip testing, and in particular to a signal-guided chip testing socket. (II) Background technology

[0002] Semiconductor chips can only be used after aging and testing. Aging and testing of chips are generally performed using chip test sockets. The various performances of chips can only be reflected in PCB circuits. Today's tests generally lead the chip pins on the circuit board to the test socket through probes, put the chip into the test socket, connect the chip pins with the chip pins on the circuit board through probes, and detect the performance of the chip through the output signal on the circuit board. In this way, the signal status of each pin of the chip cannot be measured. In order to quickly locate the signal status of each pin, it is necessary to analyze and measure the signals of the real-time working conditions of each pin of each chip.

[0003] For this purpose, the patent application number is: 202223599572.5, and the name is "A universal chip signal analysis test fixture". The patent discloses a universal chip signal analysis test fixture, which includes a ball clamp test seat and a signal analysis adapter board; the ball clamp test seat is used to connect and conduct with the chip, the top of the ball clamp test seat spring is clamped and conducted with the chip solder ball, and the bottom pin is welded and conducted with the pad of the signal analysis adapter board in a one-to-one correspondence; the signal analysis adapter board can be made any thickness between 0.1mm-2.0mm according to the chip signal requirements, and is welded and connected with the pad of the test seat PinTo PinTob surface in a one-to-one correspondence, and the signal analysis adapter board is provided with a plurality of required signal test points on the board or on the edge of the board, and the plurality of test points are used to lead out the signal of the chip. This universal chip signal analysis test fixture can solve the technical problems in the prior art that the chip signal analysis fixture cannot restore the true working state and versatility of the chip, and the test results are inaccurate, such as large signal attenuation.

[0004] This patent directly solders the adapter board onto the circuit board. This method cannot be performed when the electronic components around the chip being tested on the circuit board are very dense and there is no space to place the adapter board.

[0005] Therefore, it is necessary to develop a signal-guided chip test socket which has no restrictions on the circuit board and can be used when the electronic components around the chip to be tested on the circuit board are very dense. (III) Summary of the invention

[0006] The purpose of the present invention is to develop a signal-guided chip test socket which has no restrictions on the circuit board and can be used when the electronic components around the chip to be tested on the circuit board are very dense.

[0007] To achieve the above-mentioned purpose, the signal-guided chip test socket proposed in the present invention includes: a base, a circuit board, a positioning plate, an adapter plate, an upper cover, a chip; an upper probe plate, an upper probe, a lower probe plate, a lower probe, a bottom frame, an upper base, a lower base, an upper positioning pin, a lower positioning pin, a pin pad 1, a pin pad 2, an adapter socket, and a knob.

[0008] Compared with the prior art, the beneficial effect of the present invention is that it can test the pin signals of the current mainstream dense circuit board chip and accurately judge the chip performance. (IV) Description of the drawings

[0009] The specific structure of the present invention is given by the following embodiments and the accompanying drawings:

[0010] Attached Figure 1 It is an isometric view of the signal guiding chip test socket of the present invention with the upper cover opened.

[0011] Attached Figure 2 It is an isometric view of the working state of the signal guide chip test socket of the present invention.

[0012] Attached Figure 3 It is a top view of the signal guiding chip test socket of the present invention.

[0013] Attached Figure 4 It is a cross-sectional view of the AA section of the signal guide chip test socket of the present invention.

[0014] Attached Figure 5 It is a cross-sectional view of the signal guide chip test socket BB of the present invention.

[0015] Attached Figure 6 It is an exploded view of the signal guiding chip test socket of the present invention.

[0016] Wherein: (1) base, (2) circuit board, (3) positioning plate, (4) adapter plate, (5) upper cover, (6) chip; (10) upper probe plate, (11) upper probe, (12) lower probe plate, (13) lower probe, (14) bottom frame, (15) upper base, (16) lower base, (17) upper positioning pin, (18) lower positioning pin, (21) pin pad 1, (41) pin pad 2, (42) adapter socket, (51) knob. (V) Specific implementation methods

[0017] Refer to the attached Figure 1 To Attachment Figure 6:The bottom of the base (16) is fixedly connected to a positioning plate (3), the positioning plate (3) is positioned and connected to a circuit board (2), and the circuit board (2) is provided with a pin pad 1 (21). The bottom of the base (16) and the positioning plate (3) are positioned by the positioning pin (18). The chip to be tested (6) is fixed in the bottom frame (14) by the upper cover (5), and is in elastic contact with the lower probe (13) on the lower probe plate (12). The bottom surface of the lower probe plate (12) is made to have the same cross section as the chip (6) and extends beyond the height of the electronic components around the chip (6) so as not to interfere with the electronic components around the chip (2), and then the cross section is changed so as to be installed on the bottom of the base (16).

[0018] The base (15) is fixedly connected to an adapter plate (4) below, and the adapter plate (4) is provided with a pin pad 2 (41) and an adapter socket (42); the base (15) and the adapter plate (4) are positioned by a positioning pin (17); the pin pad 2 (41) and the upper probe (11) on the upper probe plate (10) are in elastic contact.

[0019] According to the attached Figure 6 As shown, after all components of the test socket are installed, proceed as follows:

[0020] 1. Fix the circuit board (2) on the positioning plate (3). Position the positioning plate (3) and the circuit board (2) under the positioning pins (18) and fix them under the base (16).

[0021] 2. Rotate the knob (51) to open the upper cover (5), place the chip (6) in the bottom frame (14), close the upper cover (5), twist the knob (51) to press the probe (11) on the chip (6).

[0022] 3. The circuit board (2) is powered on and loaded with signals, and the adapter socket (42) on the adapter board (4) leads out the signals of each pin for analysis.

[0023] The present invention has the following characteristics: the bottom surface of the lower probe plate (12) is made to have the same cross section as the chip (6) and extends beyond the height of the electronic components around the chip (6), so as not to interfere with the electronic components around the chip (2). The signal-guided chip test seat has no restrictions on the circuit board (2), and can be used when the electronic components around the chip to be tested on the circuit board (2) are very dense.

Claims

1. A signal-guided chip test socket, characterized in that The signal guide chip test sockets are: A base (1), a circuit board (2), a positioning plate (3), an adapter plate (4), an upper cover (5), a chip (6); an upper probe plate (10), an upper probe (11), a lower probe plate (12), a lower probe (13), a bottom frame (14), an upper base (15), a lower base (16), an upper positioning pin (17), a lower positioning pin (18), a pin pad 1 (21), a pin pad 2 (41), an adapter socket (42), and a knob (51).

2. The signal guiding chip test socket according to claim 1, characterized in that: The bottom surface of the lower probe plate (12) is made to have the same cross section as the chip (6) and extends beyond the height of the electronic components around the chip (6) so as not to interfere with the electronic components around the chip (2), and then changes its cross section so as to be installed on the bottom of the base (16).

3. The signal guiding chip test socket according to claim 1, characterized in that: The chip to be tested (6) is fixed in the bottom frame (14) by the upper cover (5) and is in elastic contact with the lower probe (13) on the lower probe plate (12).

4. The signal guiding chip test socket according to claim 1, characterized in that: The bottom of the base (15) is fixedly connected to an adapter plate (4), and the adapter plate (4) is provided with a pin pad 2 (41) and an adapter socket (42).

5. The signal guiding chip test socket according to claim 1, characterized in that: The base (15) and the adapter plate (4) are positioned by the positioning pins (17); the pin pads 2 (41) and the upper probes (11) on the upper probe plate (10) are in elastic contact.

Images