Chip test calibration device and method

Abstract

The invention provides a chip test calibration device and method, and relates to the technical field of chip test. The chip test calibration device comprises a base, a cooling air supply device, a control device, a chip and two groups of manipulators. According to the invention, the chip is heated by setting different temperature environments in stages, and the multi-point synchronous temperature measurement of each temperature stage is combined, so that the heat distribution on the surface of the chip can be comprehensively captured, and the calibration error caused by non-uniform temperature or a detection blind area is avoided; the chip is automatically circulated among the heating station, the detection station and the cooling station, synchronous processing and continuous detection of multiple chips are achieved, the single-batch detection period is greatly shortened, the surface of the chip is directly blown by directional airflow, an efficient air return channel is matched, the temperature of the chip can be rapidly reduced after detection is completed, idle waiting for station switching is reduced, and the overall production efficiency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip testing, in particular to a chip testing calibration device and method. BACKGROUND

[0002] In the semiconductor industry, high-temperature testing is required for chips during mass production. The accuracy, stability and efficiency of the testing temperature are particularly important for chips. Whether the chip reaches the preset temperature is measured by using a thermocouple. In the current manual testing method, a plurality of chips are fixed on a chip testing seat, and a thermocouple probe is manually pasted to the center of each chip one by one by using a high-temperature adhesive tape for testing the temperature of the chip. The efficiency is low, and the thermocouple has no special fixed position, which cannot guarantee that the thermocouple detection position and the chip detection position are the same in each test, which may easily lead to differences in chip temperature detection. Therefore, a temperature calibration device is disclosed on the market, which comprises a carrier, a support column provided with a support baffle on the carrier, a support frame comprising an upper support plate and a plurality of longitudinal holes penetrating through the upper support plate, one thermocouple corresponding to and fixed in each longitudinal hole, an elastic element arranged between the top surface of the support frame and the baffle, and an opening in the carrier, through which the thermocouple probe passes and is below the lower surface of the upper carrier plate. The chip to be tested is fixed on the chip testing seat, the chip testing seat is fixed in the accommodating cavity of the carrier, and the thermocouple probe contacts the chip. The temperature calibration device can be used for temperature testing of multiple chips, and multiple chips can be detected at one time, which is more efficient. The detection point elastic structure guarantees the stability and safety of the contact between the thermocouple and the chip, and then synchronously reads the temperature of multiple points. The detection point fixed design ensures that the thermocouple detection position and the chip detection position are the same in each test, and ensures the accuracy and consistency of the detection results.

[0003] However, the above-mentioned disclosed technology still has certain disadvantages when used. First, only one set of thermocouples is used for each chip for detection, which cannot detect the heat distribution on the surface of the chip after heating, and can only detect the temperature of the point in contact with the chip. Second, when clamping, a plurality of chips are placed in the chip testing seat first, then the carrier and the chip testing seat are fixed by the buckle, and then the test is carried out. After the test is completed, the buckle needs to be unlocked to take out the chip testing seat, which is very cumbersome, and the efficiency improvement is limited compared with single measurement.

[0004] Therefore, it is necessary to optimize and improve the structure of the above-mentioned disclosed technology to improve the testing precision and efficiency. SUMMARY

[0005] In view of the deficiencies of the prior art, the present application provides a chip testing calibration device and method, which solves the problems of insufficient precision and low efficiency of the chip testing calibration device and method in the prior art.

[0006] In order to achieve the above object, the chip test calibration device is realized by the following technical scheme: a chip test calibration device, comprising a base, a cooling air providing device, a control device, a chip and two groups of mechanical hands, the inner side wall of the base is fixedly connected with a check ring near the upper end position, the upper wall of the check ring is rotationally connected with a rotating disc, six groups of workstations are arranged above the rotating disc, a rotating drive structure for driving the rotating disc to rotate to switch the positions of the groups of workstations is arranged on the lower wall of the inner side of the base, a heat dissipation port for heat dissipation is arranged at the intersection of the lower wall and the front wall of the base, a support plate is fixedly connected to the inner side wall of the base below the check ring, a heating structure for heating the chip is arranged on the upper wall of the support plate, a top plate is fixedly connected to the top of the base through a plurality of fixed rods, three groups of connecting plates are slidingly connected to the lower wall of the top plate, a lifting drive structure for driving the connecting plates to lift is arranged between the connecting plates and the top plate, a first shielding pipe is fixedly connected to the lower wall of the connecting plate, a partition plate is fixedly connected inside the first shielding pipe, five groups of mounting rods are slidingly connected to the lower wall of the partition plate through elastic structures, temperature sensors for detecting the temperature of the chip are fixedly connected to the lower ends of the mounting rods, a cooling structure for cooling the chip is arranged on the lower wall of the top plate and at one side of the connecting plate, and the cooling structure is connected with the cooling air providing device through a joint.

[0007] Preferably, mounting holes are arranged on the inner wall of the rotating disc within the range of each group of workstations, chip supporting plates are arranged on the inner side walls of each group of mounting holes, chip placing grooves for placing the chip are arranged on the upper walls of the chip supporting plates, openings penetrating through the inside of the base are arranged on the inner side lower walls of the chip placing grooves, the six workstations on the rotating disc are sequentially arranged in the counterclockwise rotation direction starting from the six o'clock direction in the top view, and the six workstations are an inlet workstation, a first heating workstation, a second heating workstation, a third heating workstation, a cooling workstation and an outlet workstation, the inlet workstation, the first heating workstation, the second heating workstation, the third heating workstation, the cooling workstation and the outlet workstation are circumferentially equally distributed with the rotating disc axis as the center, the three groups of connecting plates are respectively opposite to the first heating workstation, the second heating workstation and the third heating workstation, the cooling structure is opposite to the cooling workstation, ring grooves are arranged on the upper wall of the rotating disc and outside each group of workstations, and the size of the inner cavity of the ring groove is adapted to the size of the end of the first shielding pipe away from the connecting plate.

[0008] Preferably, the rotating drive structure is a servo motor, the servo motor is fixedly connected to the lower wall of the inner side of the base through two groups of fixed seats, the servo motor is fixedly connected to the lower wall of the rotating disc through the extended shaft end, and the rotating disc is driven to rotate by the servo motor.

[0009] Preferably, the heating structure comprises three groups of heat insulation pipes and three groups of heating modules, the three groups of heat insulation pipes are fixedly connected to the upper wall of the support plate and respectively opposite to the first heating station, the second heating station and the third heating station, and the three groups of heating modules are fixedly connected to the upper wall of the support plate and respectively located inside one group of heat insulation pipes.

[0010] Preferably, the lifting driving structure comprises a first electric telescopic rod and two groups of guide rods, the two groups of guide rods are fixedly connected to the upper wall of the connecting plate, the two groups of guide rods are penetrated through the top plate and are in sliding connection with the top plate, the first electric telescopic rod is fixedly connected to the upper wall of the top plate and located between the two groups of guide rods, and the shaft end of the first electric telescopic rod is penetrated through the inner wall of the top plate and is fixedly connected to the upper wall of the connecting plate.

[0011] Preferably, the elastic structure comprises a slide rod and a spring, the slide rod is in penetrating sliding connection with the inner wall of the partition plate, a group of limiting rings are arranged on the outer wall of the slide rod and close to the upper and lower ends, the spring is sleeved on the outer wall of the slide rod and located between the upper wall of the lower group of limiting rings and the lower wall of the partition plate, and the axial section of the slide rod is square.

[0012] Preferably, the cooling structure comprises an outer air pipe, an inner air pipe and a second shielding pipe, the outer air pipe is fixedly connected to the lower wall of the top plate, one end of the outer air pipe towards the top plate is penetrated through the upper wall of the top plate and penetrates through the upper side of the top plate, the inner air pipe is fixedly connected to the inner side wall of the outer air pipe through a support, the connector is fixedly connected to the upper end of the inner air pipe, the second shielding pipe is in sliding connection with the outer wall of the outer air pipe and located on the side away from the top plate, the size of the lower end of the second shielding pipe is matched with the size of the inner cavity of the annular groove, and a second electric telescopic rod for driving the second shielding pipe to move along the outer air pipe in the axial direction is arranged between the outer wall of the second shielding pipe and the outer wall of the outer air pipe.

[0013] Preferably, an air inlet channel penetrating from top to bottom is arranged in the inner air pipe, and an air return channel is arranged between the inner side wall of the outer air pipe and the outer wall of the inner air pipe.

[0014] Preferably, the temperature sensor is fixedly connected with a heat-conducting layer at the end away from the mounting rod, the heat-conducting layer is a sheet-like phase-change heat-conducting silica gel, and the thickness of the heat-conducting layer is 0.1-0.5mm.

[0015] A calibration method of a chip test calibration device, the calibration method uses the above-mentioned chip test calibration device for calibration, and the calibration method comprises the following steps:

[0016] S1, the loading stage: the chip is supplied by the conveying belt, and two groups of mechanical hands are respectively used for loading and discharging; the loading mechanical hand grabs the chip on the conveying belt into the chip placing groove of the feeding station;

[0017] S2, first rotation and heating detection: the servo motor drives the turntable to rotate, the rotation angle is 60 degrees, and the direction is counterclockwise rotation in the overhead view; after the rotation is completed, the heating module corresponding to the first heating station starts heating to 80 DEG C, and the first shielding pipe above the station is driven to descend by the first electric telescopic rod until it enters the annular groove; when the first shielding pipe descends, the five groups of temperature sensors in the first shielding pipe abut against the chip surface, the chip surface heat distribution field is detected, and the detection time is 120 seconds;

[0018] S3, continuous feeding and multi-station detection: during the detection process of the first heating station, the feeding manipulator again picks up the chip and sends it into the chip placing groove of the feeding station; after the detection of the first heating station is completed, the first shielding pipe is raised and reset by the first electric telescopic rod, and the servo motor drives the turntable to rotate again by 60 degrees; the first group of chips enters the second heating station for detection, the heating module corresponding to the second heating station is heated to 100 DEG C, the detection time is 120 seconds, the second chip enters the first heating station for detection, and the feeding manipulator picks up the third chip and sends it into the chip placing groove in the feeding station; after the detection of the first chip in the second heating station is completed, the servo motor drives the turntable to rotate again by 60 degrees, and the first chip continues to enter the third heating station for detection; the heating module corresponding to the third heating station is heated to 120 DEG C, the detection time is 120 seconds, and three-stage temperature calibration is completed.

[0019] S4, third stage heating and cooling stage: after the first chip is calibrated, the chip is driven to the cooling station by the servo motor, and the second shielding pipe is driven to descend to the inner wall of the annular groove by the second electric telescopic rod; the cooling air supply device directly blows the chip surface through the air inlet channel, and the return air is discharged to the top of the top plate through the air return channel, and the cooling time is 120 seconds.

[0020] S5, discharging and circulating: the cooled chip enters the discharging station and is taken out by the discharging manipulator; the subsequent chips are detected in sequence according to the above steps to form a continuous operation.

[0021] The application provides a chip test calibration device and method.

[0022] 1. Compared with the prior art, the chip test calibration device and method heat the chip by setting different temperature environments in stages, and combine multi-point synchronous temperature measurement in each temperature stage to solve the problem that the traditional single-point single-temperature detection is easily affected by local thermal deviation, can fully capture the chip surface heat distribution, and avoid calibration errors caused by uneven temperature or detection blind area.

[0023] 2、Compared with the prior art, the chip test calibration device and method adopt a rotating driving structure to cooperate with a manipulator to automatically transfer the chip among heating, detection and cooling stations, solve the efficiency bottleneck caused by frequent manual intervention in traditional single-station detection, realize multi-chip synchronous processing and continuous detection, and greatly shorten the single-batch detection period.

[0024] 3、Compared with the prior art, the chip test calibration device and method directly blow the chip surface through directional airflow and cooperate with an efficient air return channel, solve the problem of long occupation time of natural cooling or external heat dissipation device, slow down the production rhythm, can quickly reduce the chip temperature after detection, reduce the idle waiting of station switching, and improve the overall production efficiency. DETAILED DESCRIPTION

[0025] Figure 1 is a structural schematic view of the application;

[0026] Figure 2 is a partial enlarged view of A in the application; Figure 1

[0027] Figure 3 is a partial enlarged view of B in the application; Figure 1

[0028] Figure 4 is a bottom view of the base and the rotating disc connection structure of the application;

[0029] Figure 5 is a bottom view of the base, servo motor, support plate and retainer ring connection structure of the application;

[0030] Figure 6 is a partial sectional view of the outer air pipe, inner air pipe and second shielding pipe connection structure of the application;

[0031] Figure 7 is a partial sectional view of the connecting plate, first shielding pipe, partition plate, mounting rod and temperature sensor connection structure of the application.

[0032] ​​The components include: 1. Base; 2. Fixing rod; 3. Top plate; 4. Heat dissipation vent; 5. Turntable; 6. First electric telescopic rod; 7. Guide rod; 8. Connecting plate; 9. First shielding tube; 10. External air duct; 1001. Return air channel; 11. Second electric telescopic rod; 12. Second shielding tube; 1301. Feeding station; 1302. First heating station; 1303. Second heating station; 1304. Third heating station; 1305. Cooling station. Workstation; 1306, Unloading station; 14, Ring groove; 15, Chip tray; 16, Chip placement slot; 17, Inner air duct; 1701, Air inlet channel; 18, Connector; 19, Retaining ring; 20, Support plate; 21, Heat insulation pipe; 22, Heating module; 23, Fixing base; 24, Servo motor; 25, Partition; 26, Sliding rod; 27, Limiting ring; 28, Spring; 29, Mounting rod; 30, Temperature sensor; 31, Thermal conductive layer. Detailed Implementation

[0033] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0034] Example:

[0035] like Figures 1 to 7 As shown, this embodiment of the invention provides a chip testing and calibration device, including a base 1, a cooling air supply device, a control device, a chip, and two sets of robotic arms. The cooling air supply device, the control device, and the two sets of robotic arms are all existing technologies on the market and will not be described in detail in this embodiment. The two sets of robotic arms are a feeding robotic arm and a discharging robotic arm, which are used to pick up the chip onto the turntable 5 and remove the chip from the turntable 5, respectively. In addition, this embodiment also includes a conveyor belt for transporting the chip to obtain continuous feeding.

[0036] In order to realize the automatic flow of the chip between multiple stations and improve the detection efficiency, the inner side wall of the base 1 is fixedly connected with a baffle ring 19 near the upper end position, the upper wall of the baffle ring 19 is rotatably connected with a rotating disc 5, six groups of stations are arranged above the rotating disc 5, the lower wall of the base 1 is provided with a heat dissipation opening 4 at the intersection with the front wall for heat dissipation, the inner lower wall of the base 1 is provided with a rotating drive structure for driving the rotating disc 5 to rotate to switch the positions of the multiple groups of stations, the inner wall of the rotating disc 5 and within the range of each group of stations is provided with a mounting hole, the inner side wall of each group of mounting holes is provided with a chip supporting plate 15, the upper wall of the chip supporting plate 15 is provided with a chip placing groove 16 for placing the chip, the inner lower wall of the chip placing groove 16 is provided with an opening communicating with the inside of the base 1, the six groups of stations on the rotating disc 5 are sequentially arranged in the counterclockwise direction starting from the six o'clock direction in the overhead projection, and are an inlet station 1301, a first heating station 1302, a second heating station 1303, a third heating station 1304, a cooling station 1305 and an outlet station 1306, the inlet station 1301, the first heating station 1302, the second heating station 1303, the third heating station 1304, the cooling station 1305 and the outlet station 1306 are circumferentially equidistributed with the rotating disc 5 as the center, three groups of connecting plates 8 are respectively opposite to the first heating station 1302, the second heating station 1303 and the third heating station 1304, the cooling structure is opposite to the cooling station 1305, the upper wall of the rotating disc 5 and outside each group of stations is provided with a ring groove 14, the size of the inner cavity of the ring groove 14 is matched with the size of the end of the first shielding pipe 9 away from the connecting plate 8, the rotating drive structure is a servo motor 24, the servo motor 24 is fixedly connected to the inner lower wall of the base 1 through two groups of fixed seats 23, the servo motor 24 is fixedly connected to the lower wall of the rotating disc 5 through the extended shaft end, and the rotating disc 5 is driven to rotate by the servo motor 24.

[0037] The through opening is arranged at the bottom of the chip placing groove 16 for heat transfer, when the rotating disc 5 is driven to rotate by the servo motor 24 at a fixed angle, the chip can be automatically switched between the inlet station, the heating station, the cooling station and the outlet station, thereby avoiding the low efficiency problem caused by frequent manual intervention in the traditional single station, and realizing the continuous flow detection of multiple chips.

[0038] In order to calibrate the temperature of the chip in stages and reduce heat interference, the inner side wall of the base 1 is fixedly connected with a supporting plate 20 below the baffle ring 19, the upper wall of the supporting plate 20 is provided with a heating structure for heating the chip, the heating structure comprises three groups of heat insulation pipes 21 and three groups of heating modules 22, the three groups of heat insulation pipes 21 are fixedly connected to the upper wall of the supporting plate 20 and are respectively opposite to the first heating station 1302, the second heating station 1303 and the third heating station 1304, and the three groups of heating modules 22 are fixedly connected to the upper wall of the supporting plate 20 and are respectively located inside one group of heat insulation pipes 21.

[0039] The heating module 22 is embedded in the heat insulation pipe 21, the material of the heat insulation pipe 21 is ceramic fiber, and the outer wall is covered with a nickel alloy reflection layer. When the chip enters the heating station, the heat insulation pipe 21 blocks external airflow interference and reflects radiant heat, ensuring accurate temperature control of the chip by the heating module 22, and solving the calibration error problem caused by uneven heat dissipation of traditional single-point heating.

[0040] In order to isolate external environmental interference, the top of the base 1 is fixedly connected with a top plate 3 through a plurality of fixing rods 2, the lower wall of the top plate 3 is slidably connected with three groups of connecting plates 8, the lower wall of the connecting plate 8 is fixedly connected with a first shielding pipe 9, and a lifting driving structure for driving the connecting plate 8 to ascend and descend is arranged between the connecting plate 8 and the top plate 3. The lifting driving structure comprises a first electric telescopic rod 6 and two groups of guide rods 7, the upper wall of the connecting plate 8 is fixedly connected with the two groups of guide rods 7, the ends away from the connecting plate 8 of the two groups of guide rods 7 penetrate through the inner wall of the top plate 3 and are slidably connected with the top plate 3, and the upper wall of the top plate 3 is fixedly connected with the first electric telescopic rod 6 between the two groups of guide rods 7. The first electric telescopic rod 6 extends through the inner wall of the top plate 3 and is fixedly connected with the upper wall of the connecting plate 8.

[0041] When the first electric telescopic rod 6 drives the first shielding pipe 9 to descend, the first shielding pipe 9 is inserted into the ring groove 14, and the corresponding heat insulation pipe 21 forms a closed detection space, so as to avoid external temperature fluctuation interference on the sensor reading.

[0042] In order to realize stable contact of the temperature sensor 30 and avoid damage caused by hard contact between the temperature sensor 30 and the chip, a partition plate 25 is fixedly connected in the first shielding pipe 9, the lower wall of the partition plate 25 is slidably connected with five groups of mounting rods 29, the mounting rod 29 and the partition plate 25 are slidably connected through an elastic structure, the elastic structure comprises a sliding rod 26 and a spring 28, the sliding rod 26 is slidably connected in the inner wall of the partition plate 25 in a penetrating manner, a group of limiting rings 27 are arranged on the outer wall of the sliding rod 26 and close to the upper and lower ends, the spring 28 is sleeved on the outer wall of the sliding rod 26 and located between the upper wall of the lower group of limiting rings 27 and the lower wall of the partition plate 25, and the axial section of the sliding rod 26 is square.

[0043] The partition plate 25 is elastically connected with the five groups of mounting rods 29 through the sliding rod 26, when the first electric telescopic rod 6 drives the first shielding pipe 9 to descend, the spring 28 buffers the pressure of the mounting rod 29 and the temperature sensor 30 on the chip, at the same time, the spring 28 is elastically connected with the heat conduction layer 31 to tightly adhere to the surface of the chip to uniformly conduct heat.

[0044] In order to improve the detection accuracy, the lower end of the mounting rod 29 is fixedly connected with a temperature sensor 30 for detecting the temperature of the chip, the end away from the mounting rod 29 of the temperature sensor 30 is fixedly connected with a heat conduction layer 31, the heat conduction layer 31 is a sheet-shaped phase change heat conduction silica gel, and the thickness of the heat conduction layer 31 is 0.1-0.5mm.

[0045] The heat-conducting layer 31 closely adheres to the chip surface and uniformly conducts heat, and the five groups of temperature sensors 30 simultaneously detect the chip surface, solving the problem that the traditional single-point single-temperature detection is easily affected by local thermal deviation, and comprehensively capturing the chip surface heat distribution, avoiding calibration errors caused by uneven temperature or detection blind area.

[0046] In order to quickly cool the chip and prevent the cooling airflow from interfering with the heating station, a cooling structure for cooling the chip is arranged on the lower wall of the top plate 3 and at one side of the connecting plate 8, the cooling structure is connected with the cooling air supply device through the joint 18, the cooling structure comprises an outer air pipe 10, an inner air pipe 17 and a second shielding pipe 12, the outer air pipe 10 is fixedly connected to the lower wall of the top plate 3, one end of the outer air pipe 10 towards the top plate 3 penetrates the upper wall of the top plate 3 and penetrates through the upper side of the top plate 3, the inner air pipe 17 is fixedly connected to the inner side wall of the outer air pipe 10 through a support, the joint 18 is fixedly connected to the upper end of the inner air pipe 17, the second shielding pipe 12 is slidably connected to the outer wall of the outer air pipe 10 and located at the side away from the top plate 3, the lower end of the second shielding pipe 12 is adapted in size to the inner cavity size of the ring groove 14, a second electric telescopic rod 11 for driving the second shielding pipe 12 to move axially along the outer air pipe 10 is arranged between the outer wall of the second shielding pipe 12 and the outer wall of the outer air pipe 10, an air inlet channel 1701 penetrating up and down is arranged in the inner air pipe 17, and an air return channel 1001 is arranged between the inner side wall of the outer air pipe 10 and the outer wall of the inner air pipe 17.

[0047] When the chip enters the cooling station 1305, the second shielding pipe 12 is lowered to insert into the ring groove 14 to form a closed air duct, the cooling air is blown directly to the chip surface through the air inlet channel 1701 and then discharged through the air return channel 1001, and the second shielding pipe 12 blocks the airflow from diffusing to the adjacent heating station, solving the problem of temperature fluctuation in the heating area caused by traditional air cooling, and shortening the cooling waiting time.

[0048] A calibration method of a chip test calibration device, the calibration method uses the above-mentioned chip test calibration device for calibration, and the calibration method comprises the following steps:

[0049] S1, the loading stage: the chip is supplied by a conveying belt, and two groups of mechanical hands are used for loading and discharging respectively; the loading mechanical hand grabs the chip on the conveying belt into the chip placing groove 16 of the feeding station 1301;

[0050] S2, first rotation and heating detection: the servo motor 24 drives the rotating disc 5 to rotate, the rotation angle is 60°, and the direction is counterclockwise rotation in the overhead view; after the rotation is completed, the heating module 22 corresponding to the first heating station 1302 starts heating to 80℃, and at the same time, the first shielding pipe 9 above the station is driven to descend by the first electric telescopic rod 6 until it enters the inside of the ring groove 14; when the first shielding pipe 9 descends, the five groups of temperature sensors 30 in the first shielding pipe 9 abut against the chip surface, the chip surface heat distribution field is detected, and the detection time is 120 seconds;

[0051] S3, continuous feeding and multi-station detection: during the detection process of the first heating station 1302, the feeding manipulator again picks up the chips and sends them into the chip placement groove 16 in the feeding station 1301; after the detection of the first heating station 1302 is completed, the first shielding tube 9 is lifted and reset by the first electric telescopic rod 6, and the turntable 5 is rotated 60° again by the servo motor 24; the first group of chips enters the second heating station 1303 for detection, the corresponding heating module 22 of the second heating station 1303 is heated to 100℃, the detection time is 120 seconds, the second chip enters the first heating station 1302 for detection, and the feeding manipulator picks up the third chip and sends it into the chip placement groove 16 in the feeding station 1301; after the detection of the first chip in the second heating station 1303 is completed, the turntable 5 is rotated 60° again by the servo motor 24, and the first chip continues to enter the third heating station 1304 for detection, the corresponding heating module 22 of the third heating station 1304 is heated to 120℃, the detection time is 120 seconds, and three-stage temperature calibration is completed;

[0052] S4, third stage heating and cooling stage: after calibration of the first chip, the chip is driven to the cooling station 1305 by the servo motor 24, and the second shielding tube 12 is lowered to the inner side wall of the ring groove 14 by the second electric telescopic rod 11; the cooling air supply device directly blows the chip surface through the air inlet channel 1701, cools the chip, and the return air is discharged to the top plate 3 through the air return channel 1001, and the cooling time is 120 seconds;

[0053] S5, discharging and recycling: the cooled chip enters the discharging station 1306 and is taken out by the discharging manipulator; the subsequent chips are detected in turn according to the above steps to form a continuous operation.

[0054] Working principle: when the servo motor 24 drives the rotating disc 5 to rotate by a fixed angle, the chip can automatically switch between the feeding, heating, cooling and discharging stations, avoiding the low efficiency problem caused by frequent manual intervention in traditional single station, realizing continuous flow detection of multiple chips; when the chip enters the heating station, the heat insulation pipe 21 blocks the external airflow interference and reflects the radiant heat, ensuring the accurate temperature control of the chip by the heating module 22, solving the calibration error problem caused by uneven heat dissipation in traditional single-point heating; when the first electric telescopic rod 6 drives the first shielding pipe 9 to descend, the spring 28 buffers the pressure of the chip on the mounting rod 29, the heat conduction layer 31 tightly adheres to the surface of the chip and uniformly conducts heat, and at the same time, the first shielding pipe 9 and the heat insulation pipe 21 form a closed detection space, avoiding the interference of external temperature fluctuation on the sensor reading, solving the precision problem of single-point temperature measurement easily affected by the environment; when the first electric telescopic rod 6 drives the first shielding pipe 9 to descend, the first shielding pipe 9 is inserted into the ring groove 14, forming a closed detection space with the corresponding heat insulation pipe 21, avoiding the interference of external temperature fluctuation on the sensor reading; the partition plate 25 is elastically connected with the five groups of mounting rods 29 through the slide rod 26, when the first electric telescopic rod 6 drives the first shielding pipe 9 to descend, the spring 28 buffers the pressure of the chip on the mounting rod 29 and the temperature sensor 30, at the same time, the spring 28 makes the heat conduction layer 31 tightly adhere to the surface of the chip to uniformly conduct heat; the heat conduction layer 31 tightly adheres to the surface of the chip and uniformly conducts heat, and the five groups of temperature sensors 30 simultaneously detect the surface of the chip, solving the problem of traditional single-point single-temperature detection easily affected by local thermal deviation, which can comprehensively capture the heat distribution of the chip surface, avoiding the calibration error caused by uneven temperature or detection blind area; when the chip enters the cooling station 1305, the second shielding pipe 12 descends and inserts into the ring groove 14 to form a closed air duct, the cooling air is blown directly to the surface of the chip through the air inlet channel 1701 and then discharged through the air return channel 1001, the second shielding pipe 12 blocks the airflow from diffusing to the adjacent heating station, solving the problem of temperature fluctuation in the heating area caused by traditional air cooling, and shortening the cooling waiting time.

[0055] Although embodiments of the present application have been shown and described, it is to be understood that various modifications, substitutions, replacements and changes can be made to these embodiments without departing from the principles and spirit of the present application, the scope of the present application being defined by the appended claims and their equivalents.

Claims

1. A chip test calibration apparatus, characterized by: The utility model provides a chip cooling device, including base (1), cooling wind provides device, controlling means, chip and two groups of mechanical hands, the inner side wall of base (1) and close upper end position fixedly connected with baffle (19), the upper wall rotationally connected with carousel (5) of baffle (19), six groups of work stations are provided with in carousel (5) top, the rotation drive structure for driving carousel (5) rotation to switch multiple work station positions is arranged in the inner side lower wall of base (1), the heat dissipation port (4) for heat dissipation is arranged in the lower wall and the intersection of front wall of base (1), the inner side wall of base (1) and located baffle (19) downside fixedly connected with support plate (20), the heating structure for heating chip is arranged on the upper wall of support plate (20), the top of base (1) is fixedly connected with top plate (3) through multiple fixed links (2), three groups of connecting plates (8) are slidably connected to the lower wall of top plate (3), the lifting drive structure for driving connecting plate (8) lifting is arranged between connecting plate (8) and top plate (3), the first shield pipe (9) is fixedly connected to the lower wall of connecting plate (8), the inner fixedly connected with partition (25) of first shield pipe (9), five groups of mounting rods (29) are slidably connected to the lower wall of partition (25), the mounting rod (29) is slidably connected through elastic structure between mounting rod (29) and partition (25), the temperature sensor (30) for detecting chip temperature is fixedly connected to the lower end of mounting rod (29), the cooling structure for cooling chip is arranged in the lower wall of top plate (3) and located one side of connecting plate (8), and the cooling structure is connected with cooling wind providing device through connector (18).

2. The chip test calibration apparatus according to claim 1, characterized by: The inner wall of carousel (5) and located in each work station range is provided with mounting hole, the inner side wall of each mounting hole is provided with chip supporting plate (15), the upper wall of chip supporting plate (15) is provided with chip placing groove (16) for placing chip, the lower wall of chip placing groove (16) is provided with opening through the inside of base (1), six work stations on carousel (5) are clockwise rotation in turn as feeding station (1301), first heating station (1302), second heating station (1303), third heating station (1304), cooling station (1305) and discharge station (1306) from six o'clock direction in projection view, feeding station (1301), first heating station (1302), second heating station (1303), third heating station (1304), cooling station (1305) and discharge station (1306) are all distributed in circle around carousel (5) axis, three connecting plates (8) are respectively opposite to first heating station (1302), second heating station (1303) and third heating station (1304), the cooling structure is opposite to cooling station (1305), the upper wall of carousel (5) and located outside each work station is provided with ring groove (14), and the inner cavity size of ring groove (14) is adapted to the size of the one end of first shield pipe (9) away from connecting plate (8).

3. The chip test calibration apparatus according to claim 2, wherein: The rotating driving structure is a servo motor (24), the servo motor (24) is fixedly connected to the inner lower wall of the base (1) through two groups of fixed seats (23), the servo motor (24) is fixedly connected to the lower wall of the rotating disc (5) through the extended shaft end, and the rotating disc (5) is driven to rotate by the servo motor (24).

4. The chip test calibration apparatus according to claim 3, wherein: The heating structure includes three groups of heat insulation pipes (21) and three groups of heating modules (22), the three groups of heat insulation pipes (21) are fixedly connected to the upper wall of the supporting plate (20) and are respectively opposite to the first heating station (1302), the second heating station (1303) and the third heating station (1304) in the up-down direction, and the three groups of heating modules (22) are fixedly connected to the upper wall of the supporting plate (20) and are respectively located inside one group of heat insulation pipes (21).

5. The chip test calibration apparatus according to claim 4, characterized by: The lifting driving structure includes a first electric telescopic rod (6) and two groups of guide rods (7), the two groups of guide rods (7) are fixedly connected to the upper wall of the connecting plate (8), the ends, away from the connecting plate (8), of the two groups of guide rods (7) penetrate through the top plate (3) and are slidably connected to the top plate (3), the first electric telescopic rod (6) is fixedly connected to the upper wall of the top plate (3) and is located between the two groups of guide rods (7), and the extended shaft end of the first electric telescopic rod (6) penetrates through the inner wall of the top plate (3) and is fixedly connected to the upper wall of the connecting plate (8).

6. The chip test calibration apparatus according to claim 5, wherein: The elastic structure includes a sliding rod (26) and a spring (28), the sliding rod (26) is slidably connected to the inner wall of the partition plate (25) in a penetrating manner, a group of limiting rings (27) are arranged on the outer wall of the sliding rod (26) and close to the upper and lower ends, the spring (28) is sleeved on the outer wall of the sliding rod (26) and located between the upper wall of the lower group of limiting rings (27) and the lower wall of the partition plate (25), and the axial section of the sliding rod (26) is square.

7. The chip test calibration apparatus according to claim 6, wherein: The cooling structure includes an outer air pipe (10), an inner air pipe (17) and a second shielding pipe (12), the outer air pipe (10) is fixedly connected to the lower wall of the top plate (3), one end of the outer air pipe (10) penetrates through the upper wall of the top plate (3) and is in communication with the upper side of the top plate (3), the inner air pipe (17) is fixedly connected to the inner wall of the outer air pipe (10) through a support, the connector (18) is fixedly connected to the upper end of the inner air pipe (17), the second shielding pipe (12) is slidably connected to the outer wall of the outer air pipe (10) and located on the side away from the top plate (3), the lower end of the second shielding pipe (12) is matched with the inner cavity size of the ring groove (14) in size, and a second electric telescopic rod (11) for driving the second shielding pipe (12) to move along the outer air pipe (10) in the axial direction is arranged between the outer wall of the second shielding pipe (12) and the outer wall of the outer air pipe (10).

8. The chip test calibration apparatus according to claim 7, wherein: An air inlet channel (1701) penetrating through the upper and lower sides is arranged in the inner air pipe (17), and an air return channel (1001) is arranged between the inner wall of the outer air pipe (10) and the outer wall of the inner air pipe (17).

9. The chip test calibration apparatus according to claim 8, wherein: The temperature sensor (30) is fixedly connected with a heat conduction layer (31) away from one end of the mounting rod (29), the heat conduction layer (31) is a sheet-like phase change heat conduction silica gel, and the heat conduction layer (31) has a thickness of 0.1-0.5 mm.

10. A calibration method of a chip test calibration apparatus, the calibration method calibrating using the chip test calibration apparatus according to any one of claims 1 to 9, characterized by: The calibration method comprises the following steps: S1, the loading stage: the chips are fed by the conveying belt, and two groups of mechanical hands are used for loading and discharging respectively; the loading mechanical hand grabs the chips on the conveying belt into the chip placing groove (16) of the feeding station (1301); S2, first rotation and heating detection: the servo motor (24) drives the rotating disc (5) to rotate, the rotation angle is 60°, and the direction is counterclockwise rotation in the overhead view; after the rotation is completed, the heating module (22) corresponding to the first heating station (1302) starts heating to 80 DEG C, and at the same time, the first shielding pipe (9) above the station is driven to descend by the first electric telescopic rod (6) until it enters the annular groove (14) inside; when the first shielding pipe (9) descends, five groups of temperature sensors (30) in the first shielding pipe (9) abut against the surface of the chip, the heat distribution field of the chip surface is detected, and the detection time is 120 seconds; S3, continuous loading and multi-station detection: during the detection process of the first heating station (1302), the loading mechanical hand again grabs the chips and sends them into the chip placing groove (16) of the feeding station (1301); after the detection of the first heating station (1302) is completed, the first shielding pipe (9) is lifted and reset through the first electric telescopic rod (6), the rotating disc (5) is rotated again by 60° under the drive of the servo motor (24); the first group of chips enters the second heating station (1303) for detection, the heating module (22) corresponding to the second heating station (1303) is heated to 100 DEG C, the detection time is 120 seconds, the second chip enters the first heating station (1302) for detection, and the loading mechanical hand grabs the third chip and sends it into the chip placing groove (16) in the feeding station (1301); after the detection of the first chip in the second heating station (1303) is completed, the rotating disc (5) is rotated again by 60° under the drive of the servo motor (24), and the first chip continues to enter the third heating station (1304) for detection; the heating module (22) corresponding to the third heating station (1304) is heated to 120 DEG C, the detection time is 120 seconds, and three-stage temperature calibration is completed; S4, third stage heating and cooling stage: after the calibration of the first chip, the chip is rotated to the cooling station (1305) through the servo motor (24), the second shielding pipe (12) is driven by the second electric telescopic rod (11) to descend to the inner side wall of the annular groove (14); the cooling air supply device directly blows the chip surface through the air inlet channel (1701), and the chip is cooled, the return air is discharged to the upper side of the top plate (3) through the air return channel (1001), and the cooling time is 120 seconds; S5, discharging and circulation: the cooled chip enters the discharging station (1306) and is taken out by the discharging mechanical hand; the subsequent chips are detected in sequence according to the above steps to form a continuous operation.

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