Semiconductor device support structure

Abstract

The invention relates to the technical field of semiconductor devices, in particular to a semiconductor device support structure which comprises a base, a plurality of abutting columns used for abutting against the lower side of a socket are elastically arranged in the base, the base is provided with containing grooves corresponding to the abutting columns, and the abutting columns are arranged in a sliding mode in the axial direction of the containing grooves. A containing groove is formed in the base, a follow-up spring connected to the lower side of the abutting column is arranged in the containing groove, a limiting piece is arranged in the base, and the limiting piece is provided with an embedded part used for being embedded into a gap of the follow-up spring so as to limit the extension length of the follow-up spring. Compared with the prior art, the socket has the following beneficial effects that each contact column can generate different displacements according to the inclination condition of the lower side surface of the socket, so that the contact column is well matched with the lower side surface of the socket, and then the embedded part is embedded into the gap of the follow-up spring under the action of the limiting piece, so that the position of the contact column is limited, and then the position of the contact column is fixed; therefore, the base can well support the socket.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor devices, and in particular to a semiconductor device support structure. Background Art

[0002] With the rapid development of semiconductor technology, the integration of microelectronic devices continues to improve, and the performance and functions of chips are becoming more and more powerful. As an important part of semiconductor manufacturing, chip packaging technology is directly related to the performance, reliability and cost of chips, and is also one of the important technical challenges facing the current semiconductor industry.

[0003] In the invention patent with application number 201910671415.4, a semiconductor device is disclosed, including: an integrated circuit die; a rewiring structure located on the front surface of the integrated circuit die; a socket located on the rewiring structure; a mechanical bracket located on the socket, the mechanical bracket having an opening exposing the socket, the edge area of ​​the socket overlapping the edge area of ​​the mechanical bracket at the opening; a first support screw arranged in the edge area of ​​the mechanical bracket, the first support screw physically contacts the socket, the first support screw extends a first distance between the socket and the mechanical bracket; and a bolt extending through the mechanical bracket and the rewiring structure.

[0004] The disclosed mechanical bracket has a support screw, which will rest on the socket when the mechanical bracket is clamped, and the support screw can compensate for the height difference of the socket. The specific compensation method is to rotate the support screw in the screw hole so that it hits the lower side of the socket. However, during the adjustment process, the inclination state of the lower side of each socket is different, and each support screw needs to be adjusted separately, and the force when it hits the socket is controlled to be moderate, which is relatively cumbersome. Summary of the invention

[0005] In order to more conveniently adjust the connection between the connection base and the socket, the present application provides a semiconductor device bracket structure.

[0006] A semiconductor device support structure provided in the present application adopts the following technical solution: a semiconductor device support structure, including a base, in which a plurality of interference columns for abutting against the lower side of a socket are elastically arranged, the base has a receiving groove corresponding to the interference column, the interference column is axially slidably arranged along the receiving groove, the receiving groove has a follower spring connected to the lower side of the interference column, a limiting member is arranged in the base, and the limiting member has an embedding portion for embedding into the gap of the follower spring to limit the extension length of the follower spring.

[0007] By adopting the above technical solution, when the present structure is connected, the lower side surface of the socket will contact the interference column protruding from the base. During the contact process, each interference column will undergo different displacements according to the inclination of the lower side surface of the socket. During the displacement, the follower spring will undergo different compressions, so that the interference column and the lower side surface of the socket are better adapted. Then, through the action of the limiting member, the embedded part is embedded in the gap of the follower spring, thereby limiting the position of the interference column, and then fixing the position of the interference column, so that the base can well support the socket.

[0008] Preferably, the base has a spacing groove connected to the accommodating groove, the limiting member includes a capsule body arranged in the spacing groove and a medium filled in the capsule body, and the base has an action member for squeezing the limiting member; a connecting hole is provided between the spacing groove and the accommodating groove, and the action member applies force to the capsule body so that the capsule body protrudes from the connecting hole to form the embedded part.

[0009] By adopting the above technical solution, the capsule is present in the spacing groove. After the interference column is adapted to the socket, a force is applied to the capsule through the action member. After the capsule is deformed, it will be embedded into the follower spring through the connecting hole to prevent the follower spring from moving again.

[0010] Preferably, the action member is a rotating rod rotatably connected to the base and a cam column arranged on the outer wall of the rotating rod, and the cam column is used to apply pressure to the capsule.

[0011] Preferably, the inner wall of one side of the spacing groove close to the rotating rod has a section of elastic metal band along the circumferential direction, and the elastic metal band is used to contact the cam column.

[0012] By adopting the above technical solution, the elastic metal belt can close the part except the connecting hole, so that the capsule can only protrude from the connecting hole, and the contact between the cam column and the elastic metal belt is smoother.

[0013] Preferably, the base has a connecting groove for the rotating rod to rotate, and the base has an arc-shaped avoidance groove connected to the connecting groove, the cam column rotates in the avoidance groove, the outer side of the avoidance groove is connected to the connecting groove, and the inner side of the avoidance groove is the elastic metal belt.

[0014] Preferably, the extending length of the communicating hole in the axial direction is not less than the initial length of the follower spring.

[0015] Preferably, the medium is gas or thermosetting adhesive liquid.

[0016] By adopting the above technical solution, if the inside is a thermosetting glue liquid, the shape of the capsule can be limited by heating in the subsequent process.

[0017] Preferably, both ends of the spacing groove have a rotating disk connected to the capsule body, and the rotating disk is rotatably connected to the inner wall of the spacing groove.

[0018] Preferably, the rotation direction of the cam column causes the capsule to have a relative rotation tendency, and simultaneously the contact of the capsule causes the follower spring to have a relative rotation, so that the follower spring has an axial outward expansion tendency.

[0019] Preferably, an edge of one side of the communicating hole close to the capsule body has a guiding arc surface.

[0020] In summary, the present application includes at least one of the following beneficial technical effects: 1. Each of the resistance columns will undergo different displacements according to the inclination of the lower side of the socket. During the displacement, the follower spring will undergo different compressions, so that the resistance column and the lower side of the socket are better adapted. Then, the embedded part is embedded into the gap of the follower spring through the action of the limiter, thereby limiting the position of the resistance column, and then fixing the position of the resistance column, so that the base can well support the socket; 2. After the abutment column is adapted to the socket, the action member applies force to the capsule body, and the capsule body is deformed and embedded into the follower spring through the connecting hole to prevent the follower spring from moving again; 3. During the rotation of the cam column, while squeezing the capsule, the capsule will also have a tendency to rotate relatively, so that in the process of embedding into the follower spring, it is pressed outward along the spiral angle of the follower spring, thereby making the contact column better contact with the lower side of the socket. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the structure of this application; Figure 2 is a partial cross-sectional view in the longitudinal direction of the present application; Figure 3 is a partial cross-sectional view of the present application in the transverse direction; Figure 4 It is a schematic diagram of the connection relationship between the capsule and the rotating rod.

[0022] Explanation of the reference numerals: 100, base; 110, abutment column; 111, accommodating groove; 112, follower spring; 113, telescopic sleeve; 114, spacing groove; 120, capsule; 121, connecting hole; 122, guiding arc surface; 123, rotating rod; 124, cam column; 125, connecting groove; 126, avoidance groove; 130, elastic metal belt; 131, rotating disk. DETAILED DESCRIPTION

[0023] The present application is further described in detail below in conjunction with the accompanying drawings.

[0024] The present application discloses a semiconductor device support structure, referring to Figure 1 , including a base 100, wherein a plurality of abutment posts 110 for abutting against the lower side of the socket are elastically arranged in the base 100. In this embodiment, a groove in the middle of the base 100 for the socket to be embedded has two abutment posts 110 on each side of the groove.

[0025] Reference Figure 2 , Figure 3 The base 100 has a receiving groove 111 corresponding to the abutment column 110. The abutment column 110 is axially slidably arranged along the receiving groove 111. The receiving groove 111 has a follower spring 112 connected to the lower side of the abutment column 110. There is also a telescopic sleeve 113 at the bottom of the receiving groove 111. The telescopic sleeve 113 is located in the middle of the follower spring 112. The end of the telescopic sleeve 113 is connected to the lower side of the abutment column 110. When the follower spring 112 is in the initial state, the end of the abutment column 110 will protrude from the upper surface of the base 100.

[0026] When the base 100 contacts the lower side of the socket, it will contact the abutment post 110, causing the abutment post 110 to move inward, and at the same time the follower spring 112 will be compressed, and the abutment post 110 will keep matching the inclined surface of the lower side of the socket.

[0027] In order to fix the position of the abutment column 110, a limiting member is provided in the base 100, and the limiting member has an embedding portion for embedding into the gap of the follower spring 112 to limit the extension length of the follower spring 112. The base 100 has a spacing groove 114 connected to the receiving groove 111, and the limiting member includes a capsule 120 disposed in the spacing groove 114 and a medium filled in the capsule 120. The base 100 has an action member for squeezing the limiting member. A connecting hole 121 is provided between the spacing groove 114 and the receiving groove 111, and the action member applies force to the capsule 120 so that the capsule 120 protrudes from the connecting hole 121 to form an embedding portion.

[0028] The extending length of the connecting hole 121 along the axial direction is not less than the initial length of the follower spring 112. During the sliding process, the abutting column 110 can cover the connecting hole 121 located on the upper side of the follower spring 112. When the stopper is inserted into the receiving groove 111, only the lower part of the capsule 120 is inserted into the inner side of the follower spring 112. At the same time, in order to protect the capsule 120 when being squeezed, the connecting hole 121 in this embodiment has a guiding arc surface 122 on one side edge close to the capsule 120.

[0029] The acting member is a rotating rod 123 rotatably connected to the base 100, and a cam column 124 arranged on the outer wall of the rotating rod 123. The base 100 has a connecting groove 125 for the rotating rod 123 to rotate. The base 100 has an arc-shaped avoidance groove 126 connected to the connecting groove 125, and the cam column 124 rotates in the avoidance groove 126. The inner wall of one side of the spacing groove 114 close to the rotating rod 123 has a section of elastic metal belt 130 along the circumferential direction, and the elastic metal belt 130 is used to contact the cam column 124. The outer side of the avoidance groove 126 is connected to the connecting groove 125, and the inner side of the avoidance groove 126 is the elastic metal belt 130. During rotation, the cam column 124 rotates with the rotating rod 123, and when the cam column 124 rotates in the avoidance groove 126, it will abut against the elastic metal belt 130, causing the elastic metal belt 130 to deform inward, thereby causing the bag body 120 to deform. Since only the connecting hole 121 in the spacing groove 114 can convex outward, the bag body 120 can be better embedded in the gap of the follower spring 112.

[0030] Reference Figure 3 , Figure 4 During the embedding process of the capsule 120, the telescopic sleeve 113 can support the inner side of the follower spring 112, and the follower spring 112 will not be skewed. Both ends of the spacing groove 114 have a rotating disk 131 connected to the capsule 120, and the rotating disk 131 is rotatably connected to the inner wall of the spacing groove 114. In this embodiment, the rotation direction of the cam column 124 is limited. After the cam column 124 rotates, the capsule 120 has a relative rotation tendency. At the same time, the contact of the capsule 120 causes the follower spring 112 to have a relative rotation, so that the follower spring 112 has an axial outward expansion tendency, that is, the way of its rotation tendency is along the spiral angle of the follower spring 112, so that the follower spring 112 can maintain a state of contact with the lower side of the socket, and then be fixed.

[0031] In this embodiment, the medium is gas or thermosetting adhesive liquid. If it is gas, it can be nitrogen, which is sufficiently stable. If it is thermosetting adhesive liquid, such as thermosetting acrylic resin, it will be liquid at room temperature and sealed in the capsule 120. When the extrusion is completed, in the subsequent process, the liquid inside the capsule 120 is turned into solid through external heating or heat transfer on the base 100, thereby fixing the position of the resistance column 110.

[0032] It is worth noting that the rotation form of the rotating rod 123 in this embodiment can be that the end is threadedly connected to the base 100. Compared with the situation in the prior art that the screw needs to be twisted to different degrees each time, it only needs to be rotated a specified amount in a single direction; it can also be that multiple rotating rods 123 rotate synchronously by means of a worm gear; it can also be that the rotating rod 123 is simply rotationally connected to the base 100, and after rotating a certain angle, the rotating rod 123 is limited circumferentially by a limiting bolt. Various rotation forms only need to achieve that the rotating rod 123 drives the cam column 124 to rotate within a smaller range and can be fixed.

[0033] Implementation method: First, the base 100 is pressed against the lower side of the socket. This process can be done by keeping the planes of the two opposite sides parallel (by fixing the bracket, etc.), or by pre-fixing with long bolts. This is mainly to make the end of the abutting column 110 fit with the lower side of the base 100 to achieve different degrees of retraction. At this time, the follower spring 112 is in a retracted state.

[0034] Then, through the movement of the rotating rod 123, the cam column 124 is pressed against the elastic metal belt 130, and through its deformation, the capsule 120 is squeezed and relatively rotated at the same time. The capsule 120 is embedded in the gap of the follower spring 112 through the connecting hole 121, and a force is applied to the follower spring 112 along the spiral angle direction, and the follower spring 112 is kept pressed against the lower side of the socket. Then the rotating rod 123 is fixed to fix the position of the whole. In other embodiments, that is, when the interior of the capsule 120 is a thermosetting glue, the interior of the capsule 120 is cured by heating.

[0035] The embodiments of this specific implementation method are all preferred embodiments of the present application, and are not intended to limit the protection scope of the present application. Therefore, all equivalent changes made based on the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A semiconductor device support structure, comprising a base (100), characterized in that: A plurality of abutment columns (110) for abutting against the lower side of the socket are elastically arranged in the base (100), the base (100) has a receiving groove (111) corresponding to the abutment column (110), the abutment column (110) is axially slidably arranged along the receiving groove (111), the receiving groove (111) has a follower spring (112) connected to the lower side of the abutment column (110), and a limiting member is arranged in the base (100), the limiting member has an embedding portion for embedding into a gap of the follower spring (112) to limit the extension length of the follower spring (112).

2. A semiconductor device support structure according to claim 1, characterized in that: The base (100) has a spacing groove (114) connected to the containing groove (111); the limiting member comprises a capsule (120) arranged in the spacing groove (114) and a medium filled in the capsule (120); the base (100) has an action member for pressing the limiting member; a connecting hole (121) is provided between the spacing groove (114) and the containing groove (111); the action member applies force to the capsule (120) so that the capsule (120) protrudes from the connecting hole (121) to form the embedded portion.

3. A semiconductor device support structure according to claim 2, characterized in that: The action member is a rotating rod (123) rotatably connected to the base (100) and a cam column (124) arranged on the outer wall of the rotating rod (123); the cam column (124) is used to apply pressure to the capsule (120).

4. A semiconductor device support structure according to claim 3, characterized in that: An inner wall of one side of the spacing groove (114) close to the rotating rod (123) has a section of elastic metal band (130) along the circumferential direction, and the elastic metal band (130) is used to contact the cam column (124).

5. A semiconductor device support structure according to claim 4, characterized in that: The base (100) has a connecting groove (125) for the rotating rod (123) to rotate, and the base (100) has an arc-shaped avoidance groove (126) connected to the connecting groove (125). The cam column (124) rotates in the avoidance groove (126), the outer side of the avoidance groove (126) is connected to the connecting groove (125), and the inner side of the avoidance groove (126) is the elastic metal belt (130).

6. A semiconductor device support structure according to claim 5, characterized in that: The extending length of the communicating hole (121) in the axial direction is not less than the initial length of the follower spring (112).

7. A semiconductor device support structure according to claim 6, characterized in that: The medium is gas or thermosetting adhesive liquid.

8. A semiconductor device support structure according to claim 6 or 7, characterized in that: Both ends of the spacing groove (114) are provided with a rotating disk (131) connected to the capsule (120), and the rotating disk (131) is rotatably connected to the inner wall of the spacing groove (114).

9. A semiconductor device support structure according to claim 8, characterized in that: The rotation direction of the cam column (124) causes the capsule (120) to have a relative rotation tendency, and at the same time, the contact of the capsule (120) causes the follower spring (112) to have a relative rotation, causing the follower spring (112) to have an axial outward expansion tendency.

10. The semiconductor device support structure according to claim 2, characterized in that: A side edge of the communication hole (121) close to the capsule (120) has a guiding arc surface (122).

Images