Display panel, preparation method of display panel and electronic equipment

Abstract

The embodiment of the invention provides a display panel, a preparation method of the display panel and electronic equipment, and relates to the technical field of display. In the display panel, a touch control wire and an isolation structure are formed by an isolation structure layer, and a shielding layer is arranged between the touch control wire and a signal wire in a substrate, so that when the distance between the touch control wire and the signal wire in the substrate is small, signal interference between the touch control wire and the signal wire in the substrate can be reduced through the shielding layer; the display panel is ensured to have good display effect and touch precision, and the use experience of a user is improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular, to a display panel, a method for preparing a display panel, and an electronic device. Background Art

[0002] Organic Light Emitting Diode (OLED) is considered to be the next generation display technology after liquid crystal display technology. It is widely used in various consumer electronic products such as smart phones, TVs, laptops, desktop computers, car displays, wearable devices, etc. due to its excellent color and picture quality, and has become the mainstream technology in display panels.

[0003] However, the process performance of current OLED display products needs to be further improved. Summary of the invention

[0004] In order to overcome the technical problems mentioned in the above technical background, the present application provides a display panel, a method for preparing a display panel, and an electronic device.

[0005] In a first aspect of the present application, a display panel is provided, the display panel comprising a first display area, and the display panel further comprising:

[0006] substrate;

[0007] An isolation structure layer, located on one side of the substrate, the isolation structure layer includes an isolation structure and a touch line, the isolation structure encloses a plurality of isolation openings on the substrate, the touch line at least partially surrounds the isolation openings, and the isolation structure is insulated from the touch line;

[0008] A shielding layer is located between the signal wiring of the substrate and the touch wiring.

[0009] In a possible implementation of the present application, there is a gap between the isolation structures respectively enclosing corresponding sides of the adjacent isolation openings, and at least part of the touch control wiring is located in the gap.

[0010] In a possible implementation of the present application, the orthographic projection of the touch trace on the substrate completely overlaps with the orthographic projection of the shielding layer on the substrate; or,

[0011] The orthographic projection of the touch control trace on the substrate is located within the orthographic projection of the shielding layer on the substrate.

[0012] In a possible implementation of the present application, the orthographic projection of the touch trace on the substrate surrounds the orthographic projection of the isolation opening on the substrate;

[0013] Preferably, the touch control wiring is continuously distributed around the isolation opening;

[0014] Preferably, the orthographic projections of the isolation structures enclosing adjacent isolation openings on the substrate do not overlap with each other;

[0015] Preferably, the display panel also includes a first conductive connection portion, and the isolation structure enclosing adjacent isolation openings is connected through the first conductive connection portion, wherein the first conductive connection portion is located on a side of the isolation structure layer away from the substrate or the first conductive connection portion is formed by a conductive layer in the substrate close to the shielding layer.

[0016] In a possible implementation of the present application, the touch control wiring is distributed discontinuously around the isolation opening;

[0017] Preferably, the isolation structure layer further comprises an isolation structure connecting portion, and the isolation structures enclosing adjacent isolation openings are connected via the isolation structure connecting portion;

[0018] Preferably, the isolation structure connecting portion is located at a gap between the isolation structures on opposite sides of the adjacent isolation openings;

[0019] Preferably, the touch control wiring is insulated from the isolation structure connection portion.

[0020] In a possible implementation manner of the present application, at the gap position between the isolation structures on opposite sides of the adjacent isolation openings, the touch wiring is located on opposite sides of the connection portion of the isolation structure;

[0021] Preferably, the display panel also includes a second conductive connection portion, which connects touch lines located on opposite sides of the isolation structure connection portion. The second conductive connection portion is located on a side of the isolation structure layer away from the substrate or the second conductive connection portion is formed by a conductive layer close to the substrate.

[0022] In a possible implementation of the present application, the display panel further includes:

[0023] A pixel defining layer is located on one side of the substrate, and the isolation structure layer is located on a side of the pixel defining layer away from the substrate;

[0024] The pixel defining layer defines a plurality of pixel openings on the substrate, and the pixel openings are connected to the corresponding isolation openings;

[0025] Preferably, the pixel defining layer is an inorganic pixel defining layer;

[0026] Preferably, the pixel defining layer is a single-layer structure of silicon oxide or silicon nitride, or a stacked-layer structure formed alternately of silicon oxide and silicon nitride;

[0027] Preferably, the display panel further comprises a light emitting device, and in a direction away from the substrate, the light emitting device comprises a first electrode, a light emitting material layer and a second electrode which are stacked, wherein the second electrode overlaps the isolation structure;

[0028] Preferably, the first electrode is disposed on a side of the pixel defining layer close to the substrate, at least a portion of the first electrode is exposed by the pixel opening, and the first electrode is connected to a pixel circuit in the substrate, wherein the pixel circuit includes the signal wiring;

[0029] Preferably, in a plane perpendicular to the substrate, the shielding layer is located between the touch control trace and the pixel circuit in the substrate;

[0030] Preferably, the first electrode and the shielding layer have the same material, or the shielding layer is formed by a conductive layer on a side of the substrate close to the isolation structure layer.

[0031] In a possible implementation of the present application, the first electrode and the shielding layer are insulated;

[0032] On a cross section perpendicular to the plane of the substrate and passing through the centers of two adjacent isolation openings, the orthographic projection of the first electrode away from the corresponding isolation opening on the substrate is located within the orthographic projection of the corresponding isolation structure on the substrate.

[0033] In a possible implementation of the present application, the display panel further includes a shielding signal wiring, the shielding layer is connected to the shielding signal wiring, and the shielding signal wiring provides a shielding signal for the shielding layer; or,

[0034] The display panel further includes a touch chip, the shielding layer is connected to the touch chip, and the touch chip provides the shielding layer with a signal opposite to the touch driving signal;

[0035] Preferably, the shielding signal includes a ground signal or a negative voltage signal.

[0036] In a possible implementation of the present application, on a cross section perpendicular to the plane where the substrate is located and passing through the centers of two adjacent isolation openings, the distance between the touch wiring and the adjacent isolation structure is 4 μm-6 μm;

[0037] Preferably, in a cross section perpendicular to the plane where the substrate is located and passing through the centers of two adjacent isolation openings, the size of the touch wiring is 3 μm-7 μm.

[0038] In a possible implementation of the present application, the isolation structure layer includes a first isolation layer and a second isolation layer that are stacked, the second isolation layer is arranged on a side of the first isolation layer away from the substrate, and the orthographic projection of the first isolation layer on the substrate is located within the orthographic projection of the second isolation layer on the substrate;

[0039] Preferably, the isolation structure layer further includes a third isolation layer, and in a direction away from the substrate, the third isolation layer, the first isolation layer and the second isolation layer are stacked in sequence, and the orthographic projection of the first isolation layer on the substrate is located within the orthographic projection of the third isolation layer on the substrate;

[0040] Preferably, the orthographic projection of the third isolation layer on the substrate is located within the orthographic projection of the second isolation layer on the substrate;

[0041] Preferably, the material of the first isolation layer includes aluminum, silver or copper, the material of the second isolation layer includes titanium or molybdenum, and the material of the third isolation layer includes molybdenum or titanium.

[0042] In a possible implementation of the present application, the display panel further includes a first encapsulation layer, the first encapsulation layer includes a plurality of encapsulation units, and different encapsulation units are used to encapsulate light-emitting devices in different isolation openings;

[0043] Preferably, the orthographic projection of the packaging unit on the substrate is outside the orthographic projection of the touch wiring on the substrate;

[0044] Preferably, the packaging unit is located outside the gap between the touch wiring and the corresponding isolation structure;

[0045] Preferably, the display panel further comprises a second encapsulation layer, the second encapsulation layer is located on a side of the encapsulation unit away from the substrate, and the second encapsulation layer at least covers the encapsulation unit;

[0046] Preferably, the second packaging layer fills the gap between the isolation structure and the touch wiring, and the second packaging layer also covers the touch wiring;

[0047] Preferably, the second encapsulation layer has a flat surface on a side away from the substrate;

[0048] Preferably, the display panel further comprises a third encapsulation layer, and the third encapsulation layer is located on a side of the second encapsulation layer away from the substrate;

[0049] Preferably, the first encapsulation layer and the third encapsulation layer are inorganic encapsulation layers, and the second encapsulation layer is an organic encapsulation layer.

[0050] In a second aspect of the present application, a method for preparing a display panel is further provided, the method comprising:

[0051] Providing a substrate, wherein the substrate includes a signal trace;

[0052] Making a conductive material layer on one side of the signal wiring, and patterning the conductive material layer to obtain a shielding layer;

[0053] An isolation structure material layer is manufactured on a side of the shielding layer away from the substrate, and the isolation structure material layer is patterned to obtain an isolation structure layer including a touch line and an isolation structure, and the shielding layer is located between the touch line and the signal line in the substrate, wherein the isolation structure encloses a plurality of isolation openings on the substrate, the touch line at least partially surrounds the isolation opening, and the isolation structure is insulated from the touch line.

[0054] In a possible implementation of the present application, the step of manufacturing a conductive material layer on one side of the signal wiring and patterning the conductive material layer to obtain a shielding layer includes:

[0055] A conductive material layer is formed on one side of the signal wiring, and the conductive material layer is patterned to obtain a first electrode and the shielding layer that are insulated from each other;

[0056] Preferably, after the step of manufacturing a conductive material layer on one side of the signal wiring and patterning the conductive material layer to obtain a shielding layer, the method further comprises:

[0057] Making a pixel defining material layer on a side of the first electrode and the shielding layer away from the substrate;

[0058] Preferably, after the step of manufacturing an isolation structure material layer on a side of the shielding layer away from the substrate and patterning the isolation structure material layer to obtain an isolation structure layer including touch wiring and an isolation structure, the method further comprises:

[0059] The pixel defining material layer exposed at the isolation opening is patterned to obtain a pixel defining layer including a pixel opening, wherein the pixel opening exposes a portion of the first electrode.

[0060] In a third aspect of the present application, an electronic device is provided, comprising a display panel according to any possible implementation of the first aspect, or a display panel prepared according to any possible implementation of the second aspect.

[0061] The embodiments of the present application provide a display panel, a method for preparing a display panel, and an electronic device. In the display panel, a touch line and an isolation structure are formed by an isolation structure layer, and a shielding layer is arranged between the touch line and the signal line of the substrate. Such a design can reduce the signal interference between the touch line and the line in the substrate when the distance between the touch line and the line in the substrate is close, thereby ensuring that the display panel has a good display effect and touch accuracy, and improving the user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0062] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0063] Figure 1 One of the distribution schematic diagrams of the isolation structure layer provided in this embodiment is illustrated;

[0064] Figure 2 Example Figure 1 One of the cross-sectional diagrams at the AA position;

[0065] Figure 3 Example Figure 1 The second cross-sectional diagram at the AA position;

[0066] Figure 4 Example Figure 1 The third cross-sectional diagram at the AA position;

[0067] Figure 5 The schematic diagram of the distribution of the isolation structure, the first conductive connection part and the shielding layer is illustrated;

[0068] Figure 6 The second distribution diagram of the isolation structure layer provided in this embodiment;

[0069] Figure 7 Example Figure 6 One of the cross-sectional diagrams at the mid-BB position;

[0070] Figure 8 Example Figure 6 The second cross-sectional diagram of the middle BB position;

[0071] Figure 9 One of the schematic diagrams of the film layer structure of the display panel provided in this embodiment is illustrated;

[0072] Figure 10 A structural schematic diagram of the isolation structure layer provided in this embodiment is illustrated;

[0073] Figure 11 Another structural schematic diagram of the isolation structure layer provided in this embodiment is illustrated;

[0074] Figure 12 The second schematic diagram of the film layer structure of the display panel provided in this embodiment is illustrated;

[0075] Figure 13 The third schematic diagram of the film layer structure of the display panel provided in this embodiment is illustrated;

[0076] Figure 14 A schematic diagram illustrating a process of a method for preparing a display panel provided in this embodiment;

[0077] Figure 15 for Figure 14 The corresponding process diagram;

[0078] Figure 16a and Figure 16b Another process flow chart provided by this embodiment is illustrated.

[0079] Icons: 1-display panel; 11-substrate; 111-signal routing; 12-isolation structure layer; 1201-isolation opening; 1202-gap; 121-isolation structure; 122-touch routing; 123-isolation structure connection portion; 1211-first isolation structure layer; 1212-second isolation structure layer; 1213-third isolation structure layer; 13-shielding layer; 14-pixel defining layer; 1401-pixel opening; 15-light-emitting device; 151-first electrode; 152-light-emitting material layer; 153-second electrode; 171-first packaging layer; 1711-packaging unit; 172-second packaging layer; 173-third packaging layer; 21-first conductive connection portion; 22-second conductive connection portion; 30-conductive material layer; 40-isolation structure material layer; 50-pixel defining material layer. DETAILED DESCRIPTION

[0080] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0081] In the description of the present application, it should be noted that the terms "upper", "lower", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the product of the application is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0082] Improving the density of light-emitting devices in a display panel (i.e., pixel density) is an important way to improve the display effect. However, the display panels currently made using fine metal evaporation mask (FMM) technology are unable to further increase the density of light-emitting devices due to technical limitations. After long-term research, the inventors found that in order to solve the technical problem that the density of light-emitting devices cannot be further increased, an isolation structure is set in some display panels. When the light-emitting material layer and the cathode are evaporated in the entire layer, the light-emitting material layer and the cathode can be disconnected at the isolation structure position. Through multiple evaporation and multiple etching processes, light-emitting devices of different colors can be formed in different isolation openings. The above process is called light-emitting device patterning.

[0083] Patent CN118251982A, patent 202410864269.8, patent PCT / CN2024 / 098407, patent PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419 and patent PCT / CN2024 / 099072 record relevant technical solutions of isolation structure (or partition structure or isolation column) and encapsulation layer, and their contents are incorporated into this application by reference for reference.

[0084] In the above-mentioned display panel, a touch function can generally be integrated into the display panel. There may be interference between the touch signal and the display signal, thereby causing a decrease in the display effect and touch accuracy. How to ensure the display effect and touch accuracy of the display panel is a technical problem that technical personnel in this field urgently need to solve.

[0085] In order to solve the above problems, the inventor innovatively designed the following technical solution, and the specific implementation scheme of the present application will be described in detail below in conjunction with the accompanying drawings. It should be noted that the defects existing in the above solutions in the prior art are the results obtained by the inventor after practice and careful research. Therefore, the discovery process of the above technical problems and the solutions proposed in this embodiment below for the above problems should all be the contributions made by the inventor to the present application in the process of invention and creation, and should not be understood as the technical content known to those skilled in the art.

[0086] Please refer to Figure 1 andFigure 2 , Figure 1 The schematic diagram of the distribution of the isolation structure layer provided in this embodiment is illustrated. Figure 2 Example Figure 1 In the present embodiment, the display panel 1 comprises a substrate 11, an isolation structure layer 12 and a shielding layer 13, wherein the substrate 11 is a multi-layer structure, the substrate 11 comprises at least a plurality of conductive layers and an insulating layer between adjacent conductive layers, a pixel circuit for providing a driving signal to the light-emitting device 13 is formed in the substrate 11, wherein the conductive layer may be a metal conductive layer.

[0087] The isolation structure layer 12 is located on the substrate 11, and the isolation structure layer 12 includes an isolation structure 121 and a touch wiring 122, that is, the isolation structure 121 and the touch wiring 122 have the same film layer structure, and the isolation structure 121 encloses a plurality of isolation openings 1201 on the substrate 11, and the touch wiring 122 at least partially surrounds the isolation openings 1201, and the touch wiring 122 is insulated from the isolation structure 121.

[0088] In this embodiment, in a direction perpendicular to the plane of the substrate 11, the shielding layer 13 is located between the signal wiring 111 and the touch wiring 122 in the substrate 11, and the shielding layer 13 is used to shield the signal interference between the signal wiring 111 and the touch wiring 122 in the substrate 11, wherein the signal wiring 111 is used to electrically connect and transmit various signals, including but not limited to wiring for transmitting data signals, wiring for transmitting control signals, or active layers in thin film transistors. Exemplarily, the shielding layer 13 is used to shield the signal interference between the signal wiring for controlling the display and the touch wiring 122 in the substrate 11, wherein the signal wiring for controlling the display can be a wiring in a pixel circuit.

[0089] In the above structure, when the distance between the touch line 122 and the signal line 111 in the substrate 11 is close, the shielding layer 13 can be used to reduce signal interference between the two, ensuring that the display panel 1 has good display effect and touch accuracy, thereby improving the user experience.

[0090] Please refer again Figure 1 There is a gap 1202 between the isolation structures 121 on the corresponding sides of the adjacent isolation openings 1201 , and at least part of the touch wiring 122 can be located in the gap 1202 .

[0091] Furthermore, in this embodiment, the orthographic projection of the touch trace 122 on the substrate 11 overlaps with the orthographic projection of the shielding layer 13 on the substrate 11 , wherein the orthographic projections of the two on the substrate 11 may completely overlap or partially overlap.

[0092] Optionally, the orthographic projection of the touch trace 122 on the substrate 11 completely overlaps with the orthographic projection of the shielding layer 13 on the substrate 11 ; or, the orthographic projection of the touch trace 122 on the substrate 11 is located within the orthographic projection of the shielding layer 13 on the substrate 11 .

[0093] Optionally, an orthographic projection pattern of the touch trace 122 on the substrate 11 is the same as an orthographic projection pattern of the shielding layer 13 on the substrate 11 .

[0094] With such a design, the touch line 122 can be shielded by the shielding layer 13 , so that the shielding layer 13 can block the signal propagation path between the touch line 122 and the line in the substrate 11 , thereby eliminating signal interference between the two.

[0095] In a possible implementation of this embodiment, please refer to Figure 1 The orthographic projection of the touch line 122 on the substrate 11 is enclosed around the orthographic projection of the isolation opening 1201 on the substrate 11. Optionally, the touch line 122 is continuously distributed around the isolation opening 1201, that is, the touch line 122 can form a touch pattern on the isolation structure layer 12 alone, without connecting the touch line 122 located on the isolation structure layer 12 through other film layers. The orthographic projections of the isolation structure 121 enclosing adjacent isolation openings 1201 on the substrate 11 do not overlap each other.

[0096] In this embodiment, please refer to Figure 3 and Figure 4 The display panel 1 may further include a first conductive connection portion 21, and the isolation structures 121 enclosing adjacent isolation openings 1201 are connected via the first conductive connection portion 21. Figure 3 As shown, the first conductive connection portion 21 may be located on the side of the isolation structure layer 12 away from the substrate 11. For example, the first conductive connection portion 21 may be formed on the conductive layer of the thin film encapsulation layer away from the substrate 11, and connected to the isolation structure 121 through the film layer through hole of the thin film encapsulation layer. In addition, the first conductive connection portion 21 may also be formed by the conductive layer on the side of the substrate 11 close to the shielding layer 13, such as Figure 4 As shown, when the substrate 11 includes four conductive metal layers, the first conductive connection portion 21 can be formed by the fourth conductive metal layer M4.

[0097] In this embodiment, if Figure 5 As shown, the first conductive connection part 21 connects the isolation structure 121, the first conductive connection part 21 is insulated from the shielding layer 13, the orthographic projection of the first conductive connection part 21 on the substrate 11 and the orthographic projection of the shielding layer 13 on the substrate 11 partially overlap, and the extension direction of the first conductive connection part 21 and the extension direction of the shielding layer 13 intersect. Exemplarily, the extension direction of the first conductive connection part 21 and the extension direction of the shielding layer 13 are perpendicular to each other.

[0098] In another possible implementation of this embodiment, please refer to Figure 6 The touch lines 122 are discontinuously distributed around the isolation opening 1201 . Optionally, the isolation structure layer 12 further includes an isolation structure connecting portion 123 , and the isolation structures 121 enclosing adjacent isolation openings 1201 are connected via the isolation structure connecting portion 123 .

[0099] In this embodiment, the isolation structure connection portion 123 is located at a gap 1202 between the isolation structures 121 on two opposite sides of adjacent isolation openings 1201 , and the touch wiring 122 is insulated from the isolation structure connection portion 123 .

[0100] Furthermore, at the position of the gap 1202 between the isolation structures 121 on two opposite sides of the adjacent isolation openings 1201 , the touch wiring 122 is located on two opposite sides of the isolation structure connection portion 123 .

[0101] In this embodiment, the touch pattern is formed by the isolation structure layer 12 and the conductive layer located at different layers. Figure 7 and Figure 8 The display panel 1 further includes a second conductive connection portion 22, and the second conductive connection portion 22 is connected to the touch traces 122 located on opposite sides of the isolation structure connection portion 123. Figure 7 As shown, the second conductive connection part 22 can be located on the side of the isolation structure layer 12 away from the substrate 11. The second conductive connection part 22 can be formed on the conductive layer on the side of the thin film encapsulation layer away from the substrate 11, and the touch traces 122 are connected together through the film layer through holes of the thin film encapsulation layer. In addition, the second conductive connection part 22 can also be formed by the conductive layer close to the substrate 11, wherein the second conductive connection part 22 can be located between the touch traces 122 and the shielding layer 13, for example, Figure 8 As shown; of course, Figure 8 It is only illustrated that the orthographic projection of the touch trace 122 on the substrate 11 is located within the orthographic projection of the shielding layer 13 on the substrate 11 ; in other embodiments, the orthographic projection of the second conductive connection portion 22 on the substrate 11 is also located within the orthographic projection of the shielding layer 13 on the substrate 11 .

[0102] Please refer to Figure 9 The display panel 1 also includes a pixel defining layer 14, which is located on one side of the substrate 11. The isolation structure layer 12 is located on the side of the pixel defining layer 14 away from the substrate. The pixel defining layer 14 defines a plurality of pixel openings 1401 on the substrate 11. The pixel openings 1401 are connected to the corresponding isolation openings 1201. Exemplarily, the orthographic projection of the pixel opening 1401 on the substrate 11 is located within the orthographic projection of the isolation opening 1201 on the substrate 11.

[0103] In this embodiment, the pixel defining layer 14 may be an organic pixel defining layer or an inorganic pixel defining layer. Preferably, the pixel defining layer 14 is an inorganic pixel defining layer. When the pixel defining layer 14 is an inorganic pixel defining layer, the pixel defining layer 14 may be a single layer structure of silicon oxide (SiOx) or silicon nitride (SiNx), or a stacked layer structure formed alternately of silicon oxide and silicon nitride.

[0104] Further, please refer to Figure 9 The display panel 1 further includes a light emitting device 15, at least part of which is located in the pixel opening 1401. In the direction away from the substrate 11, the light emitting device 15 includes a first electrode 151, a light emitting material layer 152 and a second electrode 153 which are stacked. The first electrode 151 is distributed at intervals on one side of the substrate 11. For example, the first electrode 151 is distributed on the substrate 11, and the pixel opening 1401 exposes at least part of the first electrode 151. The first electrode 151 is connected to a pixel circuit (not shown in the figure) in the substrate 11. The light emitting material layer 152 extends from the pixel opening 1401 to the side of the pixel defining layer 14 away from the substrate 11, and the second electrode 153 extends from the pixel opening 1401 to the side of the pixel defining layer 14 away from the substrate 11 and is connected to the isolation structure 121. For example, the second electrode 153 extends from the pixel opening 1401 to the side of the pixel defining layer 14 away from the substrate 11 and overlaps with the isolation structure 121, wherein the isolation structure 121 is a conductive isolation structure. Exemplarily, the first electrode 151 may be an anode of the light emitting device 15 , and the second electrode 153 may be a cathode of the light emitting device 15 .

[0105] Exemplarily, in a plane perpendicular to the substrate 11 , the shielding layer 13 is located between the touch wiring 122 and the pixel circuit in the substrate 11 .

[0106] In this embodiment, the first electrode 151 and the shielding layer 13 have the same material, and the first electrode 151 and the shielding layer 13 can be made in the same layer, and the shielding layer 13 can be a three-layer structure of ITO / Ag / ITO. The first electrode 151 and the shielding layer 13 are made in the same layer without adding additional processes, and will not affect the existing process flow. In addition, the shielding layer 13 can also be formed by a conductive layer on the side of the substrate 11 close to the isolation structure layer 12. For example, when the substrate 11 includes 4 conductive metal layers, the shielding layer 13 can be formed by the fourth conductive metal layer M4.

[0107] In this embodiment, the first electrode 151 is insulated from the shielding layer 13. Figure 9In a cross section perpendicular to the plane of the substrate 11 and passing through the centers of two adjacent isolation openings 1201 , the orthographic projection of the side of the first electrode 151 away from the corresponding isolation opening 1201 on the substrate 11 is located within the orthographic projection of the corresponding isolation structure 121 on the substrate 11 .

[0108] Furthermore, in the present embodiment, the display panel 1 also includes a shielding signal line. Exemplarily, the shielding signal line is arranged in the non-display area of ​​the display panel. The shielding signal line is connected to the shielding layer 13. The shielding signal line provides a shielding signal for the shielding layer 13. Exemplarily, the shielding signal includes a ground signal or a negative voltage signal (for example, a -5V signal) so that the shielding layer 13 has the ability to shield signal interference between the lines in the substrate 11 and the touch line 122.

[0109] In other implementations of this embodiment, the display panel 1 may further include a touch chip, the touch chip is connected to the touch wiring 122 and the shielding layer 13, and the touch chip provides the shielding layer 13 with a signal opposite to the touch driving signal, so that the shielding layer 13 has the ability to shield the signal interference between the wiring in the substrate 11 and the touch wiring 122. Exemplarily, when the touch driving signal is a high-level signal in a square wave signal, the touch chip provides the shielding layer 13 with a signal that is a low-level signal in the square wave signal; when the touch driving signal is a sine wave signal, the touch chip provides the shielding layer 13 with a signal that is a cosine wave signal.

[0110] Further, please refer again to Figure 9 , on a cross section perpendicular to the plane of the substrate 11 and passing through the centers of two adjacent isolation openings 1201, the distance d1 between the touch wiring 122 and the adjacent isolation structure 121 is 4 μm-6 μm. Exemplarily, the distance d1 between the touch wiring 122 and the adjacent isolation structure 121 includes 4 μm, 4.05 μm, 4.23 μm, 4.35 μm, 4.85 μm, 5.1 μm, 5.45 μm, 5.86 μm or 6 μm.

[0111] Optionally, in a cross section perpendicular to the plane of the substrate 11 and passing through the centers of two adjacent isolation openings 1201, the dimension d2 of the touch trace 122 is 3 μm-7 μm. Exemplarily, the dimension d2 of the touch trace 122 includes 3 μm, 3.05 μm, 3.23 μm, 3.5 μm, 3.75 μm, 3.96 μm, 4.35 μm, 4.85 μm, 5.1 μm, 5.45 μm, 5.86 μm, 6 μm, 6.35 μm, 6.75 μm or 7 μm.

[0112] In this embodiment, please refer to Figure 10, in the direction away from the substrate 11, the isolation structure layer 12 includes a first isolation layer 1211 and a second isolation layer 1212 which are stacked, wherein the orthographic projection of the first isolation layer 1211 on the substrate 11 is located within the orthographic projection of the second isolation layer 1212 on the substrate 11. That is, in the direction toward the isolation opening 1201, the second isolation layer 1212 extends relative to the first isolation layer 1211. In the direction perpendicular to the plane where the substrate 11 is located and along the line connecting the geometric centers of two adjacent isolation openings 1201, the cross section of the isolation structure layer 12 may be T-shaped. In this embodiment, the second electrode 153 may be connected to the first isolation layer 1211 in the isolation structure 121, wherein the first isolation layer 1211 is a conductive isolation layer.

[0113] For further information, please refer to Figure 11 , the isolation structure layer 12 also includes a third isolation layer 1213. In the direction away from the substrate 11, the third isolation layer 1213, the first isolation layer 1211 and the second isolation layer 1212 are stacked in sequence, and the orthographic projection of the first isolation layer 1211 on the substrate 11 is located within the orthographic projection of the third isolation layer 1213 on the substrate 11. The orthographic projection of the third isolation layer 1213 on the substrate 11 is located within the orthographic projection of the second isolation layer 1212 on the substrate 11. In the direction perpendicular to the plane where the substrate 11 is located and along the line connecting the geometric centers of two adjacent isolation openings 1201, the cross-section of the isolation structure layer 12 may be in an I-shape. In this embodiment, the second electrode 153 may also be connected to the third isolation layer 1213, wherein the third isolation layer 1213 may also be a conductive isolation layer.

[0114] In this embodiment, the material of the first isolation layer 1211 includes aluminum, silver or copper, the material of the second isolation layer 1212 includes titanium or molybdenum, and the material of the third isolation layer 1213 includes molybdenum or titanium.

[0115] For further information, please refer to Figure 12 The display panel 1 further includes a first encapsulation layer 171, which includes a plurality of encapsulation units 1711, and different encapsulation units 1711 are used to encapsulate the light-emitting devices 15 in different isolation openings 1201. The orthographic projection of the encapsulation unit 1711 on the substrate 11 is located outside the orthographic projection of the touch wiring 122 on the substrate 11, that is, the encapsulation unit 1711 will not cover the touch wiring 122, and further, the encapsulation unit 1711 will not be located in the gap 1202 between the touch wiring 122 and the isolation structure 121, so as to avoid the conductive layer formed by evaporation under the encapsulation unit 1711 connecting the touch wiring 122 and the isolation structure 121. That is, during the patterning process of the light-emitting device, the film layer formed in the gap 1202 between the touch wiring 122 and the isolation structure 121 will be etched and removed.

[0116] For further information, please refer to Figure 13The display panel 1 further includes a second encapsulation layer 172 . The second encapsulation layer 172 is located on a side of the encapsulation unit 1711 away from the substrate 11 . The second encapsulation layer 172 at least covers the encapsulation unit 1711 .

[0117] Optionally, the second encapsulation layer 172 fills the gap 1202 between the isolation structure 121 and the touch wiring 122, and the second encapsulation layer 172 also covers the touch wiring 122. The second encapsulation layer 172 has a flat surface on a side away from the substrate 11.

[0118] Further, please refer again to Figure 13 The display panel 1 further includes a third encapsulation layer 173 , and the third encapsulation layer 173 is located on a side of the second encapsulation layer 172 away from the substrate 11 .

[0119] Optionally, the first encapsulation layer 171 and the third encapsulation layer 173 are inorganic encapsulation layers, and the second encapsulation layer 172 is an organic encapsulation layer. For example, the first encapsulation layer 171 and the third encapsulation layer 173 can be formed by chemical vapor deposition (CVD), and the second encapsulation layer 172 can be formed by inkjet printing (IJP).

[0120] It is understandable that the display panel 1 may also include a touch function layer, an optical adhesive layer, a polarizer, a cover plate and other film layers stacked in sequence on the side of the third packaging layer 173 away from the substrate 11. The above film layers are conventional film layers of the display panel and will not be described in detail here.

[0121] Based on the same inventive concept, this embodiment also provides a method for preparing a display panel, please refer to Figure 14 and Figure 15 ,in Figure 14 The schematic diagram of the process of the method for preparing the display panel provided in this embodiment is illustrated. Figure 15 Example Figure 14 The corresponding process diagram is combined with the following Figure 14 and Figure 15 The method for manufacturing the display panel provided in this embodiment is described in detail.

[0122] Step S11 , providing a substrate 11 , wherein the substrate 11 includes a signal trace 111 .

[0123] In this embodiment, the substrate 11 is a multi-layer structure, and the substrate 11 includes at least a plurality of conductive layers and an insulating layer between adjacent conductive layers. A pixel circuit 111 for providing a driving signal for the light-emitting device is formed in the substrate 11. Exemplarily, the conductive layer includes a metal conductive layer. The signal trace 111 is used to electrically connect and transmit various signals, including but not limited to traces for transmitting data signals, traces for transmitting control signals, or active layers in thin film transistors.

[0124] Step S12 , manufacturing a conductive material layer 30 on one side of the signal wiring, and patterning the conductive material layer 30 to obtain a shielding layer 13 .

[0125] In step S13, an isolation structure material layer 40 is formed on the side of the shielding layer 13 away from the substrate 11, and the isolation structure material layer 40 is patterned to obtain an isolation structure layer 12 including a touch line 121 and an isolation structure 122, and the shielding layer 13 is located between the touch line 122 and the signal line 111 in the substrate 11.

[0126] The isolation structure 122 encloses a plurality of isolation openings 1201 on the substrate 11 , and the touch lines 122 at least partially surround the isolation openings 1201 . Exemplarily, gaps 1202 exist between the isolation structures 121 on corresponding sides of adjacent isolation openings 1201 , and at least part of the touch lines 122 is located in the gaps 1202 .

[0127] In this embodiment, please refer to Figure 16a , step S12 can be implemented in the following way.

[0128] A conductive material layer 30 is formed on one side of the signal wiring, and the conductive material layer 30 is patterned to obtain a first electrode 151 and a shielding layer 13 that are insulated from each other.

[0129] like Figure 16a As shown, after step S12 , the method provided in this embodiment further includes: forming a pixel defining material layer 50 on a side of the first electrode 151 and the shielding layer 13 away from the substrate 11 .

[0130] Please refer to Figure 16b After step S13 , the method provided in this embodiment further includes: patterning the pixel defining material layer 50 exposed at the isolation opening 1201 to obtain a pixel defining layer 14 including a pixel opening 1401 , wherein the pixel opening 1401 exposes a portion of the first electrode 151 .

[0131] In the preparation method of the above-mentioned display panel, a shielding layer 13 is made between the touch line 122 and the signal line 111 in the substrate. When the distance between the touch line 122 and the signal line 111 in the substrate is close, the shielding layer 13 is used to reduce the signal interference between the two, thereby ensuring that the display panel 1 has good display effect and touch accuracy, thereby improving the user experience.

[0132] Based on the same inventive concept, an embodiment of the present application also provides an electronic device, which includes the display panel provided in the present application, or includes a display panel prepared by the display panel preparation method provided in the present embodiment. The electronic device may include a smart phone, a tablet computer, a vehicle-mounted display device, a smart wearable device, a television, a laptop computer, and other devices with a display function.

[0133] The embodiments of the present application provide a display panel, a method for preparing a display panel, and an electronic device. In the display panel, a touch line and an isolation structure are formed by an isolation structure layer, and a shielding layer is arranged between the touch line and the signal line in the substrate. Such a design can reduce the signal interference between the touch line and the signal line in the substrate through the shielding layer when the distance between the touch line and the signal line in the substrate is close, thereby ensuring that the display panel has a good display effect and touch accuracy, and improving the user experience.

[0134] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A display panel, characterized in that: The display panel comprises: substrate; An isolation structure layer, located on one side of the substrate, the isolation structure layer includes an isolation structure and a touch line, the isolation structure encloses a plurality of isolation openings on the substrate, the touch line at least partially surrounds the isolation openings, and the isolation structure is insulated from the touch line; A shielding layer is located between the signal wiring and the touch wiring in the substrate.

2. The display panel according to claim 1, wherein: There is a gap between the isolation structures respectively enclosing the corresponding sides of the adjacent isolation openings, and at least part of the touch wiring is located in the gap.

3. The display panel according to claim 1, wherein: The orthographic projection of the touch trace on the substrate completely overlaps with the orthographic projection of the shielding layer on the substrate; or, The orthographic projection of the touch control trace on the substrate is located within the orthographic projection of the shielding layer on the substrate.

4. The display panel according to claim 1, wherein: The orthographic projection of the touch wiring on the substrate surrounds the orthographic projection of the isolation opening on the substrate; Preferably, the touch control wiring is continuously distributed around the isolation opening; Preferably, the orthographic projections of the isolation structures enclosing adjacent isolation openings on the substrate do not overlap with each other; Preferably, the display panel also includes a first conductive connection portion, and the isolation structure enclosing adjacent isolation openings is connected through the first conductive connection portion, wherein the first conductive connection portion is located on a side of the isolation structure layer away from the substrate or the first conductive connection portion is formed by a conductive layer in the substrate close to the shielding layer.

5. The display panel according to claim 1, wherein: The touch control wiring is distributed discontinuously around the isolation opening; Preferably, the isolation structure layer further comprises an isolation structure connecting portion, and the isolation structures enclosing adjacent isolation openings are connected via the isolation structure connecting portion; Preferably, the isolation structure connecting portion is located at a gap between the isolation structures on opposite sides of the adjacent isolation openings; Preferably, the touch control wiring is insulated from the isolation structure connection portion.

6. The display panel according to claim 5, wherein: At the gap position between the isolation structures enclosing the adjacent isolation openings on opposite sides, the touch control wiring is located on opposite sides of the connection portion of the isolation structure; Preferably, the display panel also includes a second conductive connection portion, which connects touch lines located on opposite sides of the isolation structure connection portion. The second conductive connection portion is located on a side of the isolation structure layer away from the substrate or the second conductive connection portion is formed by a conductive layer close to the substrate.

7. The display panel according to any one of claims 1 to 6, characterized in that: The display panel further includes: A pixel defining layer is located on one side of the substrate, and the isolation structure layer is located on a side of the pixel defining layer away from the substrate; The pixel defining layer defines a plurality of pixel openings on the substrate, and the pixel openings are connected to the corresponding isolation openings; Preferably, the pixel defining layer is an inorganic pixel defining layer; Preferably, the pixel defining layer is a single-layer structure of silicon oxide or silicon nitride, or a stacked-layer structure formed alternately of silicon oxide and silicon nitride; Preferably, the display panel further comprises a light emitting device, and in a direction away from the substrate, the light emitting device comprises a first electrode, a light emitting material layer and a second electrode which are stacked, wherein the second electrode overlaps the isolation structure; Preferably, the first electrode is disposed on a side of the pixel defining layer close to the substrate, at least a portion of the first electrode is exposed by the pixel opening, and the first electrode is connected to a pixel circuit in the substrate, wherein the pixel circuit includes the signal wiring; Preferably, in a plane perpendicular to the substrate, the shielding layer is located between the touch control trace and the pixel circuit in the substrate; Preferably, the first electrode and the shielding layer have the same material, or the shielding layer is formed by a conductive layer on a side of the substrate close to the isolation structure layer.

8. The display panel according to claim 7, wherein: The first electrode is insulated from the shielding layer; On a cross section perpendicular to the plane of the substrate and passing through the centers of two adjacent isolation openings, an orthographic projection of a side of the first electrode away from the corresponding isolation opening on the substrate is located within an orthographic projection of the corresponding isolation structure on the substrate.

9. The display panel according to claim 1, wherein: The display panel further includes a shielding signal wiring, the shielding layer is connected to the shielding signal wiring, and the shielding signal wiring provides a shielding signal for the shielding layer; or, The display panel further includes a touch chip, the shielding layer is connected to the touch chip, and the touch chip provides the shielding layer with a signal opposite to the touch driving signal; Preferably, the shielding signal includes a ground signal or a negative voltage signal.

10. The display panel according to claim 1, wherein: On a cross section perpendicular to the plane where the substrate is located and passing through the centers of two adjacent isolation openings, the distance between the touch wiring and the adjacent isolation structure is 4 μm-6 μm; Preferably, in a cross section perpendicular to the plane where the substrate is located and passing through the centers of two adjacent isolation openings, the size of the touch wiring is 3 μm-7 μm.

11. The display panel according to any one of claims 1 to 6, characterized in that: The isolation structure layer comprises a first isolation layer and a second isolation layer which are stacked, wherein the second isolation layer is arranged on a side of the first isolation layer away from the substrate, and an orthographic projection of the first isolation layer on the substrate is located within an orthographic projection of the second isolation layer on the substrate; Preferably, the isolation structure layer further includes a third isolation layer, and in a direction away from the substrate, the third isolation layer, the first isolation layer and the second isolation layer are stacked in sequence, and the orthographic projection of the first isolation layer on the substrate is located within the orthographic projection of the third isolation layer on the substrate; Preferably, the orthographic projection of the third isolation layer on the substrate is located within the orthographic projection of the second isolation layer on the substrate; Preferably, the material of the first isolation layer includes aluminum, silver or copper, the material of the second isolation layer includes titanium or molybdenum, and the material of the third isolation layer includes molybdenum or titanium.

12. The display panel according to any one of claims 1 to 6, characterized in that: The display panel further comprises a first encapsulation layer, wherein the first encapsulation layer comprises a plurality of encapsulation units, and different encapsulation units are used to encapsulate light-emitting devices in different isolation openings; Preferably, the orthographic projection of the packaging unit on the substrate is outside the orthographic projection of the touch wiring on the substrate; Preferably, the packaging unit is located outside the gap between the touch wiring and the corresponding isolation structure; Preferably, the display panel further comprises a second encapsulation layer, the second encapsulation layer is located on a side of the encapsulation unit away from the substrate, and the second encapsulation layer at least covers the encapsulation unit; Preferably, the second packaging layer fills the gap between the isolation structure and the touch wiring, and the second packaging layer also covers the touch wiring; Preferably, the second encapsulation layer has a flat surface on a side away from the substrate; Preferably, the display panel further comprises a third encapsulation layer, and the third encapsulation layer is located on a side of the second encapsulation layer away from the substrate; Preferably, the first encapsulation layer and the third encapsulation layer are inorganic encapsulation layers, and the second encapsulation layer is an organic encapsulation layer.

13. A method for preparing a display panel, characterized in that: The method comprises: Providing a substrate, wherein the substrate includes a signal trace; Making a conductive material layer on one side of the signal wiring, and patterning the conductive material layer to obtain a shielding layer; An isolation structure material layer is manufactured on a side of the shielding layer away from the substrate, and the isolation structure material layer is patterned to obtain an isolation structure layer including a touch line and an isolation structure, and the shielding layer is located between the touch line and the signal line in the substrate, wherein the isolation structure encloses a plurality of isolation openings on the substrate, the touch line at least partially surrounds the isolation opening, and the isolation structure is insulated from the touch line.

14. The method for preparing a display panel according to claim 13, wherein: The step of manufacturing a conductive material layer on one side of the signal wiring and patterning the conductive material layer to obtain a shielding layer comprises: A conductive material layer is formed on one side of the signal wiring, and the conductive material layer is patterned to obtain a first electrode and the shielding layer that are insulated from each other; Preferably, after the step of manufacturing a conductive material layer on one side of the signal wiring and patterning the conductive material layer to obtain a shielding layer, the method further comprises: Making a pixel defining material layer on a side of the first electrode and the shielding layer away from the substrate; Preferably, after the step of manufacturing an isolation structure material layer on a side of the shielding layer away from the substrate and patterning the isolation structure material layer to obtain an isolation structure layer including touch wiring and an isolation structure, the method further comprises: The pixel defining material layer exposed at the isolation opening is patterned to obtain a pixel defining layer including a pixel opening, wherein the pixel opening exposes a portion of the first electrode.

15. An electronic device, characterized in that: The electronic device comprises the display panel described in any one of claims 1 to 12, or a display panel prepared by the preparation method described in any one of claims 13 to 14.

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