Display device

Abstract

Disclosed is a display device including: a display panel configured to include a display area and a pad area around the display area; a printed circuit film configured to be attached to a pad area of the display panel; a cover layer configured to be disposed over the display panel and overlap the printed circuit film; and a bonding layer configured to bond the display panel and the cover layer. In a plan view, the printed circuit film and the bonding layer have a spacing space therebetween. A thickness of the cover layer overlapping the printed circuit film is between a thickness of the cover layer in the interval space and a thickness of the cover layer on the bonding layer.

Description

Technical Field

[0001] The present disclosure relates to a display device. Background Art

[0002] As the information society develops, various demands for display devices for displaying images are increasing. Various types of display devices such as liquid crystal displays, organic light emitting diode displays, etc. are being used.

[0003] The organic light-emitting display device among the display devices emits light by itself. Compared with the liquid crystal display device, the organic light-emitting display device has a larger viewing angle, a better contrast, etc., and does not require a separate backlight, so that it can be lighter and thinner and has advantages in power consumption. In addition, the organic light-emitting display device can be driven at a low voltage of direct current, and has a fast response speed and a lower manufacturing cost.

[0004] The display device may include a display panel, a printed circuit film providing an external signal to the display panel, and a cover layer on the display panel and protecting the display panel. Summary of the invention

[0005] An object of the present disclosure is to provide a display device capable of compensating for a step difference formed between a cover layer and a member below the cover layer.

[0006] An object of the present disclosure is to provide a display device having excellent rigidity against external impact by filling a rigidity weak section of the display device.

[0007] An object of the present disclosure is to provide a display device whose process can be simplified by omitting a separate process for filling a gap formed between a cover layer and a member under the cover layer.

[0008] The problems of the present disclosure are not limited to the above-mentioned problems. Other technical problems can be inferred from the following embodiments.

[0009] One embodiment is a display device, comprising: a display panel configured to include a display area and a pad area around the display area; a printed circuit film configured to be attached to the pad area of ​​the display panel; a cover layer configured to be disposed above the display panel and overlapped with the printed circuit film; and a bonding layer configured to bond the display panel and the cover layer. In a plan view, the printed circuit film and the bonding layer have a spacing space between each other. The thickness of the cover layer overlapping the printed circuit film is between the thickness of the cover layer in the spacing space and the thickness of the cover layer on the bonding layer.

[0010] Another embodiment is a display device including: a display panel configured to include a display area and a pad area around the display area; a printed circuit film configured to be attached to the pad area of ​​the display panel; a cover layer configured to be disposed above the display panel and overlap the printed circuit film; and a bonding layer configured to bond the display panel and the cover layer. The thickness of the cover layer varies according to the area.

[0011] Additional details of these implementations are included in the detailed description and accompanying drawings.

[0012] According to the display device according to the embodiment, the thickness of the covering layer may vary according to the region in consideration of the spacing distance of the spacing space formed between the covering layer and the member disposed under the covering layer. Due to the covering layer whose thickness varies according to the region, the spacing space between the covering layer and the member under the covering layer may be filled. The spacing space between the covering layer and the member under the covering layer is very susceptible to external impact, which causes physical damage to the covering layer. However, according to the display device according to the embodiment, due to the covering layer whose thickness varies according to the region, the spacing space between the covering layer and the member under the covering layer is filled so that the rigidity against external impact can be improved.

[0013] In addition, according to the display device according to the embodiment, a separate gap filling process for filling a spacing space between a cover layer and a member under the cover layer may be omitted, so that the process may be significantly simplified.

[0014] In addition, the display device according to the embodiment has excellent rigidity against external impact, which may lead to a longer lifespan thereof.

[0015] The advantageous effects according to the present disclosure are not limited by the foregoing description. In addition, those skilled in the art to which the present disclosure pertains can clearly understand other unmentioned effects from the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a plan view of a display device according to a first embodiment;

[0017] Figure 2 It is along Figure 1 A cross-sectional view taken along line AA';

[0018] Figure 3 It is along Figure 1 A cross-sectional view taken along line BB';

[0019] Figure 4 and Figure 5 is a cross-sectional view of a display device according to a second embodiment;

[0020] Figure 6 and Figure 7is a cross-sectional view of a display device according to a third embodiment;

[0021] Figure 8 and Fig. 9 is a cross-sectional view of a display device according to a fourth embodiment; and

[0022] Fig.10 is a cross-sectional view of a display device according to a fifth embodiment.

[0023] Reference Numbers

[0024] 10, 11: Display device

[0025] 100: Display panel

[0026] 200: Printed circuit film

[0027] 300, 300_1: Covering layer

[0028] 400, 400_1: Resin layer

[0029] 710: First bonding layer

[0030] 720: Second bonding layer DETAILED DESCRIPTION

[0031] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. In this specification, when referring to a component (or region, layer, part) being "on" another component, "connected to" another component, or "combined with" another component, the term "on...", "connected to" or "combined with..." means that the component can be directly connected to / combined with another component, or can mean that a third component can be arranged between them.

[0032] The same reference numerals correspond to the same components. In addition, in the drawings, the thickness, proportion and size of the components are exaggerated in order to effectively describe the technical details. The term "and / or" includes all of one or more combinations that can be defined by the relevant configurations.

[0033] Although various components can be described using terms such as first and second, components are not limited by the above terms. These terms are only used to distinguish between a component and other components. For example, without departing from the scope of rights of various embodiments, a first component can be designated as a second component. Similarly, a second component can be designated as a first component. Unless otherwise clearly mentioned in the context, an expression in the singular includes an expression in its plural form.

[0034] Terms such as "below", "lower", "above", "upper", etc. are used to describe the relationship between components shown in the drawings. These terms have relative concepts and are described based on the directions indicated in the drawings.

[0035] The terms used in this specification are only for describing specific embodiments of the present invention and are not intended to be limiting. Unless otherwise clearly stated in the context, expressions in the singular form include their plural forms. In this specification, it should be understood that terms such as "including" or "comprising" are intended to specify the features, quantities, steps, operations, components, parts, or any combination thereof mentioned in the specification, and are not intended to preclude the possibility of the existence or addition of at least one other feature, quantity, step, operation, component, part, or any combination thereof.

[0036] Figure 1 is a plan view of a display device according to a first embodiment.

[0037] Refer to Figure 1 , the display device 10 according to the first embodiment may be an organic light emitting display device. However, the embodiment is not limited thereto. The display device 10 may be a liquid crystal display device or an inorganic light emitting display device. Hereinafter, the description will focus on the fact that the display device according to the embodiment is an organic light emitting display device. The organic light emitting display device may include a display panel 100. The display panel 100 may include a display area (DA) and a non-display area (NDA) located around the display area (DA).

[0038] The display area (DA) may include a plurality of pixels. The plurality of pixels may be arranged in a matrix form, but are not limited thereto. The display area (DA) may have a rectangular shape, which includes a short side extending in a first direction DR1 and a long side extending in a second direction DR2, but is not limited thereto.

[0039] In a plan view, the non-display area (NDA) may surround the display area (DA). The non-display area (NDA) may include a pad area (PA). The pad area (PA) may be provided at the other end of the display panel 100 in the second direction DR2. However, the pad area (PA) is not limited thereto.

[0040] The printed circuit film 200 may be attached to the pad area (PA). The driving chip 250 may be mounted on the printed circuit film 200. The printed circuit board 300 may be attached to the other end of the printed circuit film 200 in the second direction DR2. A plurality of printed circuit films 200 may be provided and arranged in the first direction DR1.

[0041] Although not shown in the printed circuit board 300, a power management integrated circuit (PMIC), a controller, etc. may be mounted on the printed circuit board 300. The controller may perform an overall control function related to driving the display panel 100, and may control the operation of the driving chip 250 and the gate driving circuit. The power management integrated circuit may supply various voltages or currents to the driving chip 250, the gate driving circuit, etc., or may control various voltages or currents to be supplied. The gate driving circuit may be illustratively disposed on one side of the display area (DA) in the first direction DR1 or on the non-display area (NDA) on the other side of the display area (DA) in the first direction DR1, but is not limited thereto.

[0042] Figure 2 It is along Figure 1 A cross-sectional view taken along line AA'. Figure 3 It is along Figure 1 A cross-sectional view taken along the line BB'. Figures 1 to 3 , the display device 10 according to the first embodiment may include a display panel 100, a backplane layer 600 below the display panel 100, and a cover layer 300 above the display panel 100. The display device 10 may further include bonding layers 710 and 720 that bond adjacent components 100, 300, and 600. The bonding layers 710 and 720 may be disposed between the display panel 100 and the backplane layer 600. The bonding layers 710 and 720 may include a first bonding layer 710 that bonds the display panel 100 and the backplane layer 600, and a second bonding layer 720 that is disposed between the display panel 100 and the cover layer 300 and bonds the display panel 100 and the cover layer 300.

[0043] The display panel 100 may include a plurality of pixels (PX) disposed in a display area (DA) of a base substrate. The pixel (PX) may include at least one transistor (TFT) and a light emitting device (OLED) connected to the transistor (TFT). The transistor (TFT) is turned on or off according to a control signal applied through a control signal line, thereby adjusting the amount of current applied to the light emitting device (OLED). The light emitting device (OLED) may emit light at a brightness corresponding to the amount of current applied through the transistor (TFT). The light emitting device (OLED) may include an organic light emitting diode, but is not limited thereto. The base substrate may include a rigid substrate. However, the base substrate is not limited thereto and may include a flexible substrate. When the base substrate of the display panel 100 includes a flexible substrate, the display device 10 may be used as a foldable, stretchable or bendable display device, but is not limited thereto. The display panel 100 may also include a polarizing layer, but is not limited thereto. The polarizing layer may be separately disposed between the display panel 100 and the cover layer 300. The polarizing layer may include a first phase retardation layer, a second phase retardation layer located on the first phase retardation layer, and a polarizing layer located on the second phase retardation layer.

[0044] The printed circuit film 200 may be attached to the pad area (PA) of the display panel 100 .

[0045] The backplane layer 600 may be disposed below the display panel 100. The backplane layer 600 may be disposed below the display panel 100 for supporting the display panel 100. The backplane layer 600 may include a material capable of supporting the display panel 100. For example, the backplane layer 600 may include polyethylene terephthalate (PET), polyimide (PI), or polycarbonate (PC), but is not limited thereto. The backplane layer 600 may be disposed above the display area (DA) and the non-display area (NDA). One side of the backplane layer 600 may be aligned with one side of the display panel 100 above, but is not limited thereto.

[0046] The first bonding layer 710 and the second bonding layer 720 may each include an optically transparent resin (OCR) or an optically transparent adhesive (OCA). One side of the first bonding layer 710 may be aligned with one side of the display panel 100, but is not limited thereto. However, one side of the second bonding layer 720 may be arranged more inwardly than one side of the display panel 100. One side of the second bonding layer 720 may be arranged in the display area (DA), or may be aligned at the boundary between the display area (DA) and the non-display area (NDA), but is not limited thereto. One side of the second bonding layer 720 may also be aligned in the non-display area (NDA). Because the printed circuit film 200 is attached to the following pad area (PA) of the display panel 100, one side of the second bonding layer 720 is arranged more inwardly than one side of the display panel 100. The second bonding layer 720 may not overlap with the pad area (PA). One side of the second bonding layer 720 may be arranged in the pad area (PA).

[0047] The cover layer 300 may be disposed above the display panel 100. The cover layer 300 may include a rigid material. The rigid material may include glass or a glass material including quartz. The cover layer 300 is disposed above the display panel 100 so that the cover layer 300 can be used to protect the components disposed below the cover layer 300 from external influences. The cover layer 300 may be disposed above the display area (DA) and the non-display area (NDA). The cover layer 300 may overlap with the printed circuit film 200 in the thickness direction. One side of the cover layer 300 may be disposed more inwardly than one side of the display panel 100. However, one side of the cover layer 300 is not limited thereto and may be aligned with one side of the display panel 100 or may extend further outward.

[0048] As described above, the printed circuit film 200 may be attached to the pad area (PA) of the display panel 100. The second bonding layer 720 bonding the cover layer 300 and the display panel 100 may be arranged not to overlap with the pad area (PA) so as to prevent physical interference with the printed circuit film 200. As a result, in a cross section, a spacing space (or alignment gap (ALG)) may be formed between the second bonding layer 720 and the printed circuit film 200. The alignment gap (ALG) is located in the non-display area (NDA) and may also overlap with the pad area (PA). The thickness of the printed circuit film 200 may be less than the thickness of the second bonding layer 720.

[0049] Therefore, in the thickness direction, a spacing space between the cover layer 300 and the printed circuit film 200 may be formed, and a spacing space between the cover layer 300 and the display panel 100 may be formed. The spacing space between the display panel 100 and the cover layer 300 may refer to a spacing space in the alignment gap (ALG). Since the thickness of the printed circuit film 200 is less than the thickness of the second bonding layer 720, the spacing distance d1 between the printed circuit film 200 and the cover layer 300 may be less than the spacing distance d2 between the display panel 100 and the cover layer 300 in the alignment gap (ALG).

[0050] like Figure 3 As shown, the alignment gap (ALG) may be formed on the left or right side of the printed circuit film 200. The alignment gap (ALG) may also be formed in a region between adjacent printed circuit films 200.

[0051] like Figure 2 and Figure 3 As shown, in the first embodiment, when a physical impact is applied from above the display device 10 (or from above the cover layer 300), a spacing space is formed between the cover layer 300 and the components 100 and 200 below the cover layer 300. While the cover layer 300 and the second bonding layer 720 are bonded, a spacing space is formed between the cover layer 300 and the printed circuit film 200 and between the cover layer 300 above the alignment gap (ALG) and the display panel 100. Therefore, the end of the cover layer 300 that is not bonded to the second bonding layer 720 may be very susceptible to external impact.

[0052] The following embodiment proposes a configuration for compensating for the characteristic that the end of the cover layer 300 is vulnerable to external impact due to the spacing space formed between the cover layer 300 and the members 100 and 200 below the cover layer 300 .

[0053] Figure 4 and Figure 5 is a cross-sectional view of a display device according to a second embodiment.

[0054] Reference Figure 4 and Figure 5 The display device 11 according to the second embodiment may further include a filling resin (FR) in the spacing space between the cover layer 300 and the components 100 and 200 below the cover layer 300. The filling resin (FR) may include a resin containing an organic material. The filling resin (FR) fills the spacing space between the cover layer 300 and the components 100 and 200 below the cover layer 300, thereby filling the level difference between the components 100, 200, and 720 below the cover layer 300.

[0055] However, if Figure 4 and Figure 5 As shown, the filling resin (FR) may not completely fill the spacing space between the cover layer 300 and the components 100 and 200 under the cover layer 300. This is due to the viscosity of the filling resin (FR). If the viscosity of the filling resin (FR) is lower than the standard range, when the filling resin (FR) is filled in the spacing space between the cover layer 300 and the components 100 and 200 under the cover layer 300 by the gap filling process, the filling resin (FR) having high fluidity flows into the spacing space between the cover layer 300 and the components 100 and 200 under the cover layer 300, so that a poor appearance may appear in the display device 11. In addition, if the viscosity of the filling resin (FR) is higher than the standard range, when the filling resin (FR) is filled in the interval space between the cover layer 300 and the components 100 and 200 under the cover layer 300 through the gap filling process, the filling resin (FR) having low fluidity cannot fill the entire interval space between the cover layer 300 and the components 100 and 200 under the cover layer 300, so that a blank space G may be formed. Since the viscosity of the filling resin (FR) is very sensitive to process conditions such as a process temperature during the gap filling, it may be difficult for the viscosity of the filling resin (FR) to meet the standard range.

[0056] Figure 6 and Figure 7 is a cross-sectional view of a display device according to a third embodiment.

[0057] Reference Figure 6 and Figure 7 According to the third embodiment, the display device 12 and Figure 2 and Figure 3 The display device 10 is different in that the cover layer 300_1 has different thicknesses t1, t2, and t3 for respective regions.

[0058] More specifically, the cover layer 300_1 may include a first portion 310 having a first thickness t1, a second portion 320 having a second thickness t2, and a third portion 330 having a third thickness t3. The first portion 310 may overlap with the second bonding layer 720 and may be in contact with the second bonding layer 720. The second portion 320 may overlap with the printed circuit film 200 and may be in contact with the printed circuit film 200. The third portion 330 may overlap with the alignment gap (ALG) and may be in contact with the display panel 100 above the alignment gap (ALG). The first portion 310 to the third portion 330 of the cover layer 300_1 may include the same material and may be directly connected to each other.

[0059] As above Figure 3 As described in the third embodiment, a spacing space between the cover layer 300 and the printed circuit film 200 may be formed, and a spacing space between the cover layer 300 and the display panel 100 above the alignment gap (ALG) may be formed. In addition, the spacing distance d1 between the printed circuit film 200 and the cover layer 300 may be smaller than the spacing distance d2 between the display panel 100 and the cover layer 300 in the alignment gap (ALG). However, according to the display device 12 of the third embodiment, considering the spacing distance between the cover layer 300_1 and the components 100, 200, and 730 under the cover layer 300_1, the thicknesses t1, t2, and t3 of the cover layer 300_1 are designed differently for each region to fill the spacing space between the cover layer 300 and the components 100 and 200 under the cover layer 300.

[0060] According to the covering layer 300_1 of the display device 12 according to the third embodiment, the thicknesses t1, t2 and t3 of the covering layer 300_1 are designed differently for each region, and the spacing space between the covering layer 300 and the components 100 and 200 under the covering layer 300 is filled, thereby solving the problem that the end of the covering layer 300_1 that is not bonded to the second bonding layer 720 is very susceptible to external impact.

[0061] In addition, if Figure 6 and Figure 6 As shown in the enlarged view of FIG. 3 , an air gap (AG) may be formed between the bottom surface of the cover layer 300_1 and the members 100 and 200 below the cover layer 300_1. This is because unevenness may be formed on the bottom surface of the cover layer 300_1 during the etching process for forming the first to third portions 310, 320 and 330 of the cover layer 300_1.

[0062] That is, according to Figure 6 and Figure 7In the display device 12 of the present invention, the thicknesses t1, t2, and t3 of the cover layer 300_1 are designed differently for each region, and the spacing space between the cover layer 300 and the components 100 and 200 below the cover layer 300 may be filled. However, due to the uneven shape on the bottom surface of the cover layer 300_1, the spacing space between the cover layer 300_1 and the components 100 and 200 below the cover layer 300_1 may not be completely filled. When external air is introduced through the air gap (AG) formed between the bottom surface of the cover layer 300_1 and the components 100 and 200 below the cover layer 300_1 or moisture penetration occurs, defects may be caused in the display device 12.

[0063] Figure 8 and Fig. 9 is a cross-sectional view of a display device according to a fourth embodiment.

[0064] Reference Figure 8 and Fig. 9 , the display device 13 according to the fourth embodiment may further include a resin layer 400 disposed between the cover layer 300_1 and the members 100 , 200 , and 720 below the cover layer 300_1 .

[0065] More specifically, the resin layer 400 may be formed by coating on the bottom surface of the cover layer 300_1. The resin layer 400 may include a resin containing an organic material. The resin layer 400 may be formed on the bottom surfaces of the first to third portions 310, 320, and 330, and may contact the top surface of the printed circuit film 200, the top surface of the display panel 100 above the alignment gap (ALG), and the top surface of the second bonding layer 720, respectively.

[0066] As above Figure 6 As described in Figure 6 and Figure 7 In the display device 12 of the present invention, the thicknesses t1, t2, and t3 of the cover layer 300_1 are designed differently for each region, and the interval space between the cover layer 300 and the components 100 and 200 below the cover layer 300 can be filled. However, due to the uneven shape on the bottom surface of the cover layer 300_1, the interval space between the cover layer 300_1 and the components 100 and 200 below the cover layer 300_1 may not be completely filled. That is, the cover layer 300_1 includes a rigid material. Therefore, even if the cover layer 300_1 is strongly pressed from above, the interval space between the bottom surface of the cover layer 300_1 including the rigid material and the components 100 and 200 below the cover layer 300_1 cannot be completely filled.

[0067] However, according to Figure 8 and Fig. 9In the display device 13, the resin layer 400 is formed by coating on the bottom surface of the cover layer 300_1. The resin layer 400 may include a material having a lower modulus than the cover layer 300_1 including a rigid material. That is, the resin layer 400 including a material having a lower modulus than the cover layer 300_1 is additionally formed on the bottom surface of the cover layer 300_1 so that the interval space between the bottom surface of the cover layer 300_1 and the components 100 and 200 below the cover layer 300_1 can be completely filled.

[0068] Therefore, in the display device 13 according to the fourth embodiment, the resin layer 400 is additionally formed on the bottom surface of the cover layer 300_1. Therefore, when external air is introduced or moisture permeation occurs through the air gap (AG) formed between the bottom surface of the cover layer 300_1 and the components 100 and 200 below the cover layer 300_1, defects can be prevented from being caused in the display device 12 in advance.

[0069] Fig.10 is a cross-sectional view of a display device according to a fifth embodiment.

[0070] Reference Fig.10 The display device 14 according to the fifth embodiment and the display device 14 according to the fifth embodiment Figure 8 and Fig. 9 The display device 13 of FIG. 1 is different in that the resin layer 400_1 is not formed on the first portion 310 .

[0071] Since the above Figure 8 and Fig. 9 Other descriptions are given in the text, so their detailed description will be omitted below.

[0072] A display device according to some embodiments includes: a display panel configured to include a display area and a pad area around the display area; a printed circuit film configured to be attached to the pad area of ​​the display panel; a cover layer configured to be disposed above the display panel and overlapped with the printed circuit film; and a bonding layer configured to bond the display panel and the cover layer. In a plan view, the printed circuit film and the bonding layer have a spacing space between each other. The thickness of the cover layer overlapping the printed circuit film is between the thickness of the cover layer in the spacing space and the thickness of the cover layer on the bonding layer.

[0073] The thickness of the cover layer in the spacing space may be greater than the thickness of the cover layer overlapping the printed circuit film.

[0074] The cover layer may comprise a rigid material.

[0075] One side of the display panel may protrude further outward than one side of the cover layer.

[0076] The cover layer may be in direct contact with a top surface of the printed circuit film and a top surface of the display panel in the spacing space.

[0077] An air gap may be formed between the cover layer and the top surface of the printed circuit film or between the cover layer and the top surface of the display panel in the spacing space.

[0078] The cover layer may further include a resin layer coated on a bottom surface thereof.

[0079] The resin layer may be disposed on a bottom surface of the cover layer overlapping the printed circuit film and on a bottom surface of the cover layer in the spacing space.

[0080] A display device according to some embodiments includes: a display panel configured to include a display area and a pad area around the display area; a printed circuit film configured to be attached to the pad area of ​​the display panel; a cover layer configured to be disposed above the display panel and overlapped with the printed circuit film; and a bonding layer configured to bond the display panel and the cover layer. The thickness of the cover layer varies according to the area.

[0081] The cover layer may include a first portion overlapping the bonding layer, a second portion overlapping the printed circuit film, and a third portion overlapping the spacing space.

[0082] The thickness of the second portion may be between the thickness of the first portion and the thickness of the third portion, and the thickness of the third portion may be greater than the thickness of the second portion.

[0083] The cover layer may comprise a rigid material.

[0084] One side of the display panel may protrude further outward than one side of the cover layer.

[0085] The second portion may directly contact the top surface of the printed circuit film, and the third portion may directly contact the top surface of the display panel in the spacing space.

[0086] An air gap may be formed between the second portion and the top surface of the printed circuit film or between the third portion and the top surface of the display panel in the spacing space.

[0087] The cover layer may further include a resin layer coated on a bottom surface thereof.

[0088] The resin layer may be disposed on a bottom surface of the second portion and on a bottom surface of the third portion.

[0089] Although the embodiments of the present invention are described with reference to the accompanying drawings, it will be appreciated by those skilled in the art that the present invention may be specifically implemented in other characteristic forms without departing from its spirit or basic characteristics. Therefore, the above-mentioned embodiments and advantages are merely exemplary and should not be construed as limiting the present invention. The present teachings may be easily applied to other types of devices. The description of the above-mentioned embodiments is intended to be illustrative rather than limiting the scope of the claims. Many alternatives, modifications and variations will be apparent to those skilled in the art. In the claims, means plus function clauses are intended to cover structures described herein as performing the functions, and not only structural equivalents, but also equivalent structures.

[0090] CROSS-REFERENCE TO RELATED APPLICATIONS

[0091] This application claims priority to Korean Patent Application No. 10-2023-0163910 filed on November 23, 2023, which is incorporated herein by reference in its entirety for all purposes.

Claims

1. A display device, comprising: A display panel, the display panel being configured to include a display area and a pad area around the display area; a printed circuit film configured to be attached to the pad area of ​​the display panel; a cover layer configured to be disposed above the display panel and overlap the printed circuit film; as well as a bonding layer configured to bond the display panel and the cover layer, Wherein, in a plan view, the printed circuit film and the bonding layer have a spacing space between them, and The thickness of the covering layer overlapping the printed circuit film is between the thickness of the covering layer in the spacing space and the thickness of the covering layer on the bonding layer.

2. The display device according to claim 1, wherein: A thickness of the cover layer in the spacing space is greater than a thickness of the cover layer overlapping the printed circuit film.

3. The display device according to claim 1, wherein: The cover layer comprises a rigid material.

4. The display device according to claim 1, wherein: One side of the display panel protrudes further outward than one side of the cover layer.

5. The display device according to claim 1, wherein: The cover layer is in direct contact with a top surface of the printed circuit film and a top surface of the display panel in the spacing space.

6. The display device according to claim 1, wherein: An air gap is formed between the cover layer and a top surface of the printed circuit film or between the cover layer and a top surface of the display panel in the spacing space. 7 . The display device according to claim 1 , further comprising a resin layer coated on a bottom surface of the cover layer.

8. The display device according to claim 7, wherein: The resin layer is disposed on the bottom surface of the cover layer overlapping the printed circuit film and on the bottom surface of the cover layer in the spacing space.

9. A display device, comprising: A display panel, the display panel being configured to include a display area and a pad area around the display area; a printed circuit film configured to be attached to the pad area of ​​the display panel; a cover layer configured to be disposed above the display panel and overlap the printed circuit film; as well as a bonding layer configured to bond the display panel and the cover layer, The thickness of the covering layer varies according to the region.

10. The display device according to claim 9, wherein: The cover layer includes a first portion overlapping the bonding layer, a second portion overlapping the printed circuit film, and a third portion overlapping the spacing space.

11. The display device according to claim 10, wherein: The thickness of the second portion is between the thickness of the first portion and the thickness of the third portion, and the thickness of the third portion is greater than the thickness of the second portion.

12. The display device according to claim 10, wherein: The cover layer comprises a rigid material.

13. The display device according to claim 10, wherein: One side of the display panel protrudes further outward than one side of the cover layer.

14. The display device according to claim 10, wherein: The second portion directly contacts a top surface of the printed circuit film, and the third portion directly contacts a top surface of the display panel in the spacing space.

15. The display device according to claim 10, wherein: An air gap is formed between the second portion and a top surface of the printed circuit film or between the third portion and a top surface of the display panel in the spacing space. 16 . The display device according to claim 10 , further comprising a resin layer coated on a bottom surface of the cover layer.

17. The display device according to claim 16, wherein: The resin layer is provided on a bottom surface of the second portion and a bottom surface of the third portion.

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