Antenna unit, antenna array and electronic equipment

Abstract

The invention provides an antenna unit, an antenna array and electronic equipment, and belongs to the technical field of communication. The antenna unit disclosed by the invention comprises a first substrate and at least one radiation structure, wherein the first substrate comprises a first dielectric substrate and a first reference electrode layer; the first dielectric substrate is provided with a first surface and a second surface which are oppositely arranged, the first reference electrode layer is arranged on the first surface, and the radiation structure is arranged on the side of the second surface; the radiation structure comprises a first balun assembly, a second balun assembly and a radiation layer.

Description

Antenna units, antenna arrays and electronic equipment Technical Field

[0001] The present disclosure belongs to the field of communication technology, and particularly relates to an antenna unit, an antenna array, and an electronic device. Background Art

[0002] As a new type of aesthetic antenna, transparent antennas offer inherently superior concealment thanks to their high light transmittance. Furthermore, their radiation performance, comparable to that of traditional antennas, has led to their increasing adoption in specialized applications such as in-vehicle communications and building signal coverage. Currently, the most established method for transparent antennas is the metal mesh process, in which a meshed metal film is attached to a smooth structural plate using optical fiber adhesive (OCA) and then the components are stacked and bonded together to achieve antenna functionality. However, because metal mesh film relies heavily on readily available structural components, the number and cost of producing transparent film masks for complex three-dimensional structures requiring multi-faceted bonding significantly increases. Furthermore, bonding errors caused by multi-faceted bonding further increase the yield rate of the assembled antenna. Consequently, the current metal mesh process is largely limited to transparent antennas with planar structures, which in turn restricts the operating bandwidth of directional antennas.

[0003] Summary of the Invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art and provides an antenna, an antenna array and an electronic device.

[0005] In a first aspect, an embodiment of the present disclosure provides an antenna comprising a first substrate and at least one radiating structure; wherein,

[0006] The first substrate includes a first dielectric substrate and a first reference electrode layer; the first dielectric substrate has a first surface and a second surface opposite to each other, the first reference electrode layer is arranged on the first surface, and the radiation structure is arranged on the second surface side;

[0007] The radiation structure includes a first balun component and a second balun component, and a radiation layer;

[0008] The radiation layer is arranged on a side of the first balun component and the second balun component away from the first substrate, and the radiation layer is electrically connected to the first reference electrode layer through the second reference electrode layer of the first balun component and the third reference electrode layer of the second balun component.

[0009] The first balun assembly includes a second dielectric substrate, a first balun feed line, and a second reference electrode layer; the second dielectric substrate includes a third surface and a fourth surface arranged opposite to each other; the plane on which the third surface is located intersects with the plane on which the first surface is located, and the first dielectric substrate is fixed to the side of the second surface; the first balun feed line is arranged on the third surface, and the second reference electrode layer is arranged on the fourth surface, and the orthographic projection of the second reference electrode layer and the first balun feed line on the plane on which the third surface is located at least partially overlap;

[0010] The second balun component includes a third dielectric substrate, a second balun feed line and the third reference electrode layer; the third dielectric substrate includes a fifth surface and a sixth surface arranged opposite to each other; the plane where the fifth surface is located intersects with the plane where the first surface is located, and the second dielectric substrate is fixed on the side of the second surface and is arranged crosswise with the first dielectric substrate; the second balun feed line is arranged on the fifth surface, the third reference electrode layer is arranged on the sixth surface, and the orthographic projection of the third reference electrode layer and the second balun feed line on the plane where the fifth surface is located at least partially overlap.

[0011] The second dielectric substrate and the third dielectric substrate in the radiation structure are integrally formed, and the second dielectric substrate and the third dielectric substrate are cross-arranged to divide the second dielectric substrate into a first sub-substrate and a second sub-substrate, and to divide the third dielectric substrate into a third sub-substrate and a fourth sub-substrate; the first sub-substrate is located on the fifth surface side, and the second sub-substrate is located on the sixth surface side; the third sub-substrate is located on the third surface side, and the fourth sub-substrate is located on the fourth surface side;

[0012] A first notch is provided on a side where the third sub-substrate is connected to the third surface, and the first balun feed line passes through the first notch; a second notch is provided on a side where the first sub-substrate is connected to the fifth surface, and the second balun feed line passes through the second notch.

[0013] The second reference electrode layer includes a first sub-reference electrode layer provided on the first sub-substrate and a second sub-reference electrode layer provided on the second sub-substrate; the third reference electrode layer includes a third sub-reference electrode layer provided on the third sub-substrate and a fourth sub-reference electrode layer provided on the fourth sub-substrate;

[0014] The radiation layer includes a fourth dielectric substrate, a first radiation portion, a second radiation portion, a third radiation portion and a fourth radiation portion arranged on the side of the fourth dielectric substrate away from the first dielectric substrate, the first radiation portion is electrically connected to the first sub-reference electrode layer, the second radiation portion is electrically connected to the second sub-reference electrode layer, the third radiation portion is electrically connected to the third sub-reference electrode layer, and the fourth radiation portion is electrically connected to the fourth sub-reference electrode layer.

[0015] Wherein, the first sub-baseboard, the second sub-baseboard, the third sub-baseboard and the fourth sub-baseboard each include a main body portion mounted on the first baseboard, and a first connecting portion connected to a side of the main body portion away from the first baseboard;

[0016] The first connecting portion of the first sub-substrate electrically connects the first sub-reference electrode layer with the first radiating portion through a first via hole penetrating the fourth dielectric substrate and the first radiating portion; the first connecting portion of the second sub-substrate electrically connects the second sub-reference electrode layer with the second radiating portion through a second via hole penetrating the fourth dielectric substrate and the second radiating portion; the first connecting portion of the third sub-substrate electrically connects the third sub-reference electrode layer with the third radiating portion through a third via hole penetrating the fourth dielectric substrate and the third radiating portion; and the first connecting portion of the fourth sub-substrate electrically connects the fourth sub-reference electrode layer with the fourth radiating portion through a fourth via hole penetrating the fourth dielectric substrate and the fourth radiating portion.

[0017] The first sub-baseboard, the second sub-baseboard, the third sub-baseboard and the fourth sub-baseboard each include a main body portion mounted on the first baseboard, and a second connecting portion connected to a side of the main body away from the radiation layer;

[0018] The second connection portion of the first sub-substrate connects the first sub-reference electrode layer with the first reference electrode layer through a fifth via hole penetrating the first dielectric substrate and the first reference electrode layer; the second connection portion of the second sub-substrate connects the second sub-reference electrode layer with the first reference electrode layer through a sixth via hole penetrating the first dielectric substrate and the first reference electrode layer; the second connection portion of the third sub-substrate connects the third sub-reference electrode layer with the first reference electrode layer through a seventh via hole penetrating the first dielectric substrate and the first reference electrode layer; and the second connection portion of the fourth sub-substrate connects the fourth sub-reference electrode layer with the first reference electrode layer through an eighth via hole penetrating the first dielectric substrate and the first reference electrode layer.

[0019] Among them, the first radiating part is connected to the first sub-reference electrode layer by welding; the second radiating part is connected to the second sub-reference electrode layer by welding; the third radiating part is connected to the third sub-reference electrode layer by welding; and the fourth radiating part is connected to the fourth sub-reference electrode layer by welding.

[0020] The first sub-reference electrode layer, the second sub-reference electrode layer, the third sub-reference electrode layer, the fourth sub-reference electrode layer and the first reference electrode layer are connected to each other by welding.

[0021] At least one of the first radiation portion, the second radiation portion, the third radiation portion, and the fourth radiation portion includes a conductive mesh.

[0022] The radiation structure further includes a first transmission line and a second transmission line arranged on the second surface, the first transmission line is connected to the first balun feeder, and the second transmission line is connected to the second balun feeder.

[0023] The first balun feeder is connected to the first transmission line by welding; and / or the second balun feeder is connected to the second transmission line by welding.

[0024] The antenna further comprises a first feeding structure and a second feeding structure provided on the second surface, wherein the first feeding structure and the second feeding structure each comprise a first feeding port and at least one second feeding port;

[0025] A second feeding port of the first feeding structure is connected to one of the first transmission lines; and a second feeding port of the second feeding structure is connected to one of the second transmission lines.

[0026] In which, the antenna also includes a first side panel and a second side panel arranged opposite to each other, the first side panel and the second side panel are respectively connected to two side edges arranged opposite to each other in the width direction of the first dielectric substrate; the plane where the first side panel and the second side panel are located intersects with the plane where the first dielectric substrate is located; the first reference electrode layer extends from the first surface to the first side panel and the second side panel.

[0027] Parts of the first reference electrode layer located on the first side plate and the second side plate have a first opening, and the first opening is arranged corresponding to the radiation structure.

[0028] The first substrate further includes a second opening and a third opening that penetrate the first dielectric substrate and the first reference electrode layer; the second opening coincides with the orthographic projection of the first balun component on the plane where the first surface is located; and the third opening coincides with the orthographic projection of the second balun component on the plane where the first surface is located.

[0029] Wherein, the first balun feed line and the second balun feed line both include stripline balun feed lines.

[0030] Wherein, the first reference electrode layer includes a conductive grid

[0031] And / or the radiation layer comprises a conductive mesh.

[0032] The conductive grid includes a plurality of first conductive lines and second conductive lines that are cross-arranged; the line width of the first conductive lines and the second conductive lines are both 2-30 μm, the line spacing is 5-200 μm, and the line thickness is 1-10 μm.

[0033] In a second aspect, an embodiment of the present disclosure provides an antenna array, which includes multiple antenna units, and the antenna units are any of the above-mentioned antenna units.

[0034] In a third aspect, an embodiment of the present disclosure provides an electronic device, comprising the antenna or antenna array described in any one of the above items. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] FIG1 is a schematic diagram of a transparent antenna according to an embodiment of the present disclosure.

[0036] FIG2 is a disassembled diagram of the transparent antenna according to an embodiment of the present disclosure.

[0037] FIG3 is a schematic diagram of an oscillator of a transparent antenna according to an embodiment of the present disclosure.

[0038] FIG4 is a disassembled view (front view) of the vibrator of the transparent antenna according to an embodiment of the present disclosure.

[0039] FIG5 is a disassembled view (rear view) of the vibrator of the transparent antenna according to an embodiment of the present disclosure.

[0040] FIG6 is a schematic diagram of a feeding network according to an embodiment of the present disclosure.

[0041] FIG7 is a schematic diagram of a conductive grid according to an embodiment of the present disclosure.

[0042] FIG8 a is a schematic diagram of the first balun feeder side of the first balun assembly according to an embodiment of the present disclosure.

[0043] FIG8 b is a schematic diagram of the second reference electrode layer side of the first balun component according to an embodiment of the present disclosure.

[0044] FIG9 a is a schematic diagram of the second balun feeder side of the second balun assembly according to an embodiment of the present disclosure.

[0045] FIG9 b is a schematic diagram of the third reference electrode layer side of the second balun component according to an embodiment of the present disclosure.

[0046] FIG10 is a partially enlarged view of the radiation structure of an embodiment of the present disclosure.

[0047] FIG. 11 is a top view of a radiation layer according to an embodiment of the present disclosure.

[0048] FIG. 12 is a top view of a first reference electrode layer according to a disclosed embodiment.

[0049] FIG13 is a schematic diagram showing how the first sub-reference electrode layer, the second sub-reference electrode layer, and the fourth sub-reference electrode layer are connected to the first reference electrode layer, respectively, according to an embodiment of the present disclosure.

[0050] FIG14 is a schematic diagram of a first balun feed line / a second balun feed line according to an embodiment of the present disclosure.

[0051] FIG15 is a graph showing the standing wave ratio performance of the vibrator in the transparent antenna according to an embodiment of the present disclosure.

[0052] FIG16 is a diagram showing the isolation performance of the oscillator in the transparent antenna according to an embodiment of the present disclosure.

[0053] FIG17 is an S-parameter curve of the first feeding structure / the second feeding structure of an embodiment of the present disclosure.

[0054] FIG18 shows the phase difference characteristics of the first feeding structure / the second feeding structure according to an embodiment of the present disclosure.

[0055] FIG19 is a graph showing the standing wave ratio performance of the transparent antenna according to an embodiment of the present disclosure.

[0056] FIG. 20 is a comparative curve showing the isolation effect of the transparent antenna according to an embodiment of the present disclosure when the first reference electrode layer has a first opening and when the first opening is not.

[0057] FIG21 is a diagram showing the gain characteristics of the transparent antenna according to an embodiment of the present disclosure.

[0058] FIG22 is a schematic diagram of an antenna array according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0059] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0060] Unless otherwise defined, the technical or scientific terms used in this disclosure should have the usual meanings understood by people with ordinary skills in the field to which this disclosure belongs. The words "first", "second" and similar words used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "one", "an" or "the" do not indicate a quantity limitation, but rather indicate the existence of at least one. Words such as "include" or "comprise" mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0061] The present disclosure provides an antenna, specifically a transparent antenna, which can be used in, but not limited to, automobiles, trains (including high-speed trains), airplanes, and buildings. For example, the transparent antenna of the present disclosure is a wide-angle transparent antenna for inter-building communication. The structure of the transparent antenna of the present disclosure is described in detail below.

[0062] In the first aspect, FIG1 is a schematic diagram of a transparent antenna according to an embodiment of the present disclosure; FIG2 is a disassembled diagram of the transparent antenna according to an embodiment of the present disclosure; FIG3 is a schematic diagram of a vibrator of the transparent antenna according to an embodiment of the present disclosure; FIG4 is a disassembled diagram (front view) of the vibrator of the transparent antenna according to an embodiment of the present disclosure; FIG5 is a disassembled diagram (back view) of the vibrator of the transparent antenna according to an embodiment of the present disclosure; As shown in FIG1-5, an embodiment of the present disclosure provides a transparent antenna comprising at least a first substrate 1 and at least one radiating structure 2. A radiating structure 2 and a corresponding portion of the first substrate 1 constitute a vibrator of an antenna unit. In the embodiment of the present disclosure, only two vibrators are used as an example of a transparent antenna. However, it should be understood that the number of vibrators of a transparent antenna is not limited to two, and a corresponding number of vibrators can be designed according to the specific application scenario, for example, the antenna comprises 1*3 vibrators, or 1*4 vibrators, etc.

[0063] The first substrate 1 includes a first dielectric substrate 11 and a first reference electrode layer 12. The first dielectric substrate 11 has a first surface S1 and a second surface S2 opposite to each other. The first reference electrode layer 12 is disposed on the first surface S1, and the radiation structure 2 is mounted on the second surface S2.

[0064] Each radiation structure 2 includes a first balun component 21 and a second balun component 22 that are cross-arranged, and a radiation layer 23 located on a side of the first balun component 21 and the second balun component 22 away from the first dielectric substrate 11 .

[0065] In which, the first balun component 21 includes a second dielectric substrate 211, a first balun feed line 212 and a second reference electrode layer 213; the second dielectric substrate 211 includes a third surface S3 and a fourth surface S4 arranged opposite to each other; the plane where the third surface S3 is located intersects with the plane where the first surface S1 is located, and the first dielectric substrate 11 is fixed on the side of the second surface S2; the first balun feed line 212 is arranged on the third surface S3, and the second reference electrode layer 213 is arranged on the fourth surface S4, and the orthographic projection of the second reference electrode layer 213 and the first balun feed line 212 on the plane where the third surface S3 is located at least partially overlap.

[0066] The second balun assembly 22 includes a third dielectric substrate 221, a second balun feed line 222, and a third reference electrode layer 223. The third dielectric substrate 221 includes a fifth surface S5 and a sixth surface S6 arranged opposite to each other. The plane on which the fifth surface S5 is located intersects with the plane on which the first surface S1 is located, and the second dielectric substrate 211 is fixed to the side of the second surface S2 and is arranged to intersect with the first dielectric substrate 11. The second balun feed line 222 is arranged on the fifth surface S5, and the third reference electrode layer 223 is arranged on the sixth surface S6, and the orthographic projections of the third reference electrode layer 223 and the second balun feed line 222 on the plane on which the fifth surface S5 is located at least partially overlap.

[0067] The radiation layer 23 is electrically connected to the first reference electrode layer 12 through the second reference electrode layer 213 and the third reference electrode layer 223 .

[0068] It should be noted that the transparent antenna in the embodiments of the present disclosure can be a receiving antenna, a transmitting antenna, or a transceiver antenna that simultaneously transmits and receives signals. In the following description, the transparent antenna is used as an example of a transmitting antenna. The first reference electrode layer 12 includes, but is not limited to, a ground electrode layer. In the embodiments of the present disclosure, the first reference electrode layer 12 is described as a ground electrode layer. Furthermore, since both the second reference electrode layer 213 and the third reference electrode layer 223 are connected to the first reference electrode layer 12, the second reference electrode layer 213 and the third reference electrode layer 223 are also ground electrode layers.

[0069] In the disclosed embodiment, the first surface S1 and second surface S2 of the first dielectric substrate 11 are parallel to each other; the third surface S3 and fourth surface S4 of the second dielectric substrate 211 are parallel to each other; and the fifth surface S5 and sixth surface S6 of the third dielectric substrate 221 are parallel to each other. In Figure 2 of the disclosed embodiment, the angles between the first surface S1 and the third surface S3, between the first surface S1 and the fifth surface S5, and between the third surface S3 and the fifth surface S5 are 90°, respectively. In this case, the first dielectric substrate 11 and the second dielectric substrate 211 are perpendicular to each other, the first dielectric substrate 11 and the third dielectric substrate 221 are perpendicular to each other, and the second dielectric substrate 211 and the third dielectric substrate 221 are perpendicular to each other. However, it should be understood that the 90° angles between the first surface S1 and the third surface S3, between the first surface S1 and the fifth surface S5, and between the third surface S3 and the fifth surface S5 do not limit the scope of protection of the disclosed embodiment.

[0070] In the disclosed embodiment, since each radiating structure 2 includes a first balun component 21 and a second balun component 22, power can be supplied to the first balun feeder 212 and the second balun feeder 222, which then excites the radiating layer 23 to radiate a signal. The transparent antenna implemented in the disclosed embodiment can effectively improve radiation efficiency, achieve high gain, and thus ensure stable signal transmission. Furthermore, the antenna in the disclosed embodiment is a transparent antenna, which is highly concealed and aesthetically pleasing.

[0071] In some examples, referring to FIG2 , the transparent antenna includes not only the aforementioned structure but also first and second transmission lines 5, 6, and first and second feed structures 3, 4. The first and second transmission lines 5, 6, and the first and second feed structures 3, 4 can all be disposed on the second surface S2 side of the first dielectric substrate 11. Each first transmission line 5 and second transmission line 6 is provided in a one-to-one correspondence with each radiating structure 2, with a first balun feeder 212 connected to the first transmission line 5 and a second balun feeder 222 connected to the second transmission line 6. The first and second feed structures 3, 4 each include a first feed port and at least one second feed port, with the number of second feed ports being the same as the number of radiating structures 2. One second feed port of the first feed structure 3 is connected to one first transmission line 5, and one second feed port of the second feed structure 4 is connected to one second transmission line 6. In this case, the first feed structure 3 feeds the first balun feeder 212 via the first transmission line 5, and the second feed structure 4 feeds the second balun feeder 222 via the second transmission line 6.

[0072] 1 and 2 , since the transparent antenna includes only two radiating structures 2 in the embodiment of the present disclosure, the first feed structure 3 and the second feed structure 4 are both divided into two feed networks, as shown in FIG6 , which only illustrates one of the two-feed networks. It can be understood that the two-feed network includes a first feed port and two second feed ports, and the signal fed by the first feed port is split into two and output through the two second feed ports.

[0073] The first transmission line 5, the second transmission line 6, and the first feed structure 3, the second feed structure 4 can be formed on the second surface S2 of the first dielectric substrate 11 using laser etching chemical plating. That is, the first transmission line 5, the second transmission line 6, and the first feed structure 3, the second feed structure 4 are all routed using laser etching. Of course, the first transmission line 5, the second transmission line 6, and the first feed structure 3, the second feed structure 4 can also be formed using a patterning process, including but not limited to. The materials for the first transmission line 5, the second transmission line 6, and the first feed structure 3, the second feed structure 4 include, but are not limited to, metal materials such as copper.

[0074] In some examples, the first balun feed line 212 and the second reference electrode layer 213 of the first balun assembly 21 can be formed on the third surface S3 and the fourth surface S4 of the second dielectric substrate 211, respectively, by laser plating. Similarly, the second balun feed line 222 and the third reference electrode layer 223 of the second balun assembly 22 can be formed on the fifth surface S5 and the sixth surface S6 of the third dielectric substrate 221, respectively, by laser plating. Because the second dielectric substrate 211 and the third dielectric substrate 221 are arranged crosswise and relatively perpendicularly on the first dielectric substrate 11, the balun feed lines formed on them by laser plating are more precise, thereby achieving greater freedom in antenna design.

[0075] In some examples, the first transmission line 5 and the first balun feeder 212 can be connected by welding, and the second transmission line 6 and the second balun feeder 222 can be connected by welding. This can effectively ensure a good electrical connection between the first balun feeder 212 and the first transmission line 5, as well as a good electrical connection between the second balun feeder 222 and the second transmission line 6.

[0076] In some examples, the first transmission line 5 and the first feed structure 3 are both disposed on the second surface S2 of the first dielectric substrate 11 and may be integrally formed. Similarly, the second transmission line 6 and the second feed structure are both disposed on the second surface S2 of the first dielectric substrate 11 and may be integrally formed. This not only ensures a stable connection between the first transmission line 5 and the first feed structure 3 but also facilitates manufacturing. Similarly, the integrally formed second transmission line 6 and the second feed structure 4 also provide a stable connection and facilitate manufacturing.

[0077] In some examples, to improve the transmittance of the transparent antenna, both the first reference electrode layer 12 and the radiating layer 23 in the embodiments of the present disclosure may include a conductive mesh. Figure 7 is a schematic diagram of a conductive mesh in the embodiments of the present disclosure. As shown in Figure 7, the conductive mesh may include a plurality of first conductive lines 501 and second conductive lines 502 arranged in a cross pattern. Each first conductive line 501 is arranged side by side along a first direction and extends along a second direction; each second conductive line 502 is arranged side by side along the first direction and extends along a third direction. For example, the first conductive lines 501 and second conductive lines 502 of the conductive mesh may extend perpendicularly to each other, in which case a square or rectangular hollow portion is formed. Of course, the first conductive lines 501 and second conductive lines 502 of the conductive mesh may extend in non-perpendicular directions. For example, the angle between the first conductive lines 501 and second conductive lines 502 is 45°, in which case a diamond-shaped hollow portion is formed. The ends of the first conductive lines 501 and second conductive lines 502 of the conductive mesh are connected together, meaning that the periphery of the metal mesh forms a closed loop structure. In actual products, the ends of the first conductive line 501 and the second conductive line 502 of the conductive grid may not be connected to each other, that is, the periphery of the conductive grid is radial. In the embodiment of the present disclosure, the use of the conductive grid can achieve a light transmittance of about 70%-88% for the transparent antenna.

[0078] In some examples, the line width, line thickness, and line spacing of the first conductive lines 501 and the second conductive lines 502 of the conductive grid are preferably the same, but can also be different. For example, the line width W1 of the first conductive lines 501 and the second conductive lines 502 can both be approximately 2-30 μm, the line spacing W2 can be approximately 5-200 μm, and the line thickness can be approximately 1-10 μm.

[0079] Furthermore, the conductive grid can be formed on a flexible substrate, the material of which includes but is not limited to polyethylene terephthalate (PET) or polyimide (PI). The conductive grid and flexible substrate are integrated into a single structure and attached to a corresponding dielectric substrate using optical bonding adhesive (OCA).

[0080] In some examples, FIG8a is a schematic diagram of the first balun feeder side of the first balun component of the embodiment of the present disclosure; FIG8b is a schematic diagram of the second reference electrode layer side of the first balun component of the embodiment of the present disclosure; FIG9a is a schematic diagram of the second balun feeder side of the second balun component of the embodiment of the present disclosure; FIG9b is a schematic diagram of the third reference electrode layer side of the second balun component of the embodiment of the present disclosure; with reference to FIG8a, 8b, 9a and 9b, since the second dielectric substrate 211 and the third dielectric substrate 221 are cross-arranged, the second dielectric substrate 211 is supported by the third dielectric substrate. The plate 221 is divided into a first sub-baseboard 2111 and a second sub-baseboard 2112. The first sub-baseboard 2111 is located on the fifth surface S5 of the third dielectric substrate 221, and the second sub-baseboard 2112 is located on the sixth surface S6 of the third dielectric substrate 221. Similarly, the third dielectric substrate 221 is divided by the second dielectric substrate 211 into a third sub-baseboard 2211 and a fourth sub-baseboard 2212. The third sub-baseboard 2211 is located on the third surface S3 of the second dielectric substrate 211, and the fourth sub-baseboard 2212 is located on the fourth surface S4 of the second dielectric substrate 211.

[0081] Figure 10 is a partially enlarged view of the radiating structure of an embodiment of the present disclosure. As shown in Figure 10, a first notch 2111c is provided on the side where the third sub-substrate 2211 connects to the third surface S3 of the second dielectric substrate 211. The first balun feed line 212 passes through the first notch 2111c. Because the second sub-substrate 2112 has a first notch 2111c, the connection between the third sub-substrate 2211 and the second dielectric substrate 211 forms a hole at the location of the first notch 2111c. The first balun feed line 212 then passes through this hole. Similarly, a second notch 2211c is provided on the side where the first sub-substrate 2111 connects to the fifth surface S5 of the third dielectric substrate 221. The second balun feed line 222 passes through this second notch 2211c. Because the first sub-substrate 2111 has a second notch 2211c, the connection between the first sub-substrate 2111 and the third dielectric substrate 221 forms a hole at the location of the second notch 2211c. The second balun feed line 222 then passes through this hole.

[0082] Since the second dielectric substrate 211 includes a first sub-substrate 2111 and a second sub-substrate 2112, and the third dielectric substrate 221 includes a third sub-substrate 2211 and a fourth sub-substrate 2212, the corresponding second reference electrode layer 213 is divided by the third dielectric substrate 221 into a first sub-reference electrode layer 2131 disposed on the first sub-substrate 2111 and a second sub-reference electrode layer disposed on the second sub-substrate 2112. The third reference electrode layer 223 is divided by the second dielectric substrate 211 into a third sub-reference electrode layer 2231 disposed on the third sub-substrate 2211 and a fourth sub-reference electrode layer disposed on the fourth sub-substrate 2212. The first sub-reference electrode layer 2131 can have the same pattern as the first sub-substrate 2111, the second sub-reference electrode layer 2132 can have the same pattern as the second sub-substrate 2112, the third sub-reference electrode layer 2231 can have the same pattern as the third sub-substrate 2211, and the fourth sub-reference electrode layer 2232 can have the same pattern as the fourth sub-substrate 2212.

[0083] Furthermore, Figure 11 is a top view of the radiation layer 23 according to an embodiment of the present disclosure. As shown in Figure 11, the radiation layer 23 may include a fourth dielectric substrate 231 and four radiating portions 232 disposed on a side of the fourth dielectric substrate 231 facing away from the first dielectric substrate 11. These radiating portions are a first radiating portion 232a, a second radiating portion 232b, a third radiating portion 232c, and a fourth radiating portion 232d. The first radiating portion 232a is electrically connected to the first sub-reference electrode layer 2131, the second radiating portion 232b is electrically connected to the second sub-reference electrode layer 2132, the third radiating portion 232c is electrically connected to the third sub-reference electrode layer 2231, and the fourth radiating portion 232d is electrically connected to the fourth sub-reference electrode layer 2232. The first radiating portion 232a, the second radiating portion 232b, the third radiating portion 232c, and the fourth radiating portion 232d are arranged in an array. For example, the first radiating portion 232a, the second radiating portion 232b, the third radiating portion 232c, and the fourth radiating portion 232d are all square, and the four square radiating portions form a square radiating surface. Of course, the first radiating portion 232a, the second radiating portion 232b, the third radiating portion 232c, and the fourth radiating portion 232d are not limited to square shapes, and can also be rectangular, hexagonal, circular, etc.

[0084] It should be noted that, as previously described, the radiating layer 2323 is a conductive mesh. When the radiating layer 2323 includes a first radiating portion 232a, a second radiating portion 232b, a third radiating portion 232c, and a fourth radiating portion 232d, the first radiating portion 232a, the second radiating portion 232b, the third radiating portion 232c, and the fourth radiating portion 232d all employ a conductive mesh structure. To further improve light transmittance, when both the radiating layer 23 and the first reference electrode layer 12 comprise conductive meshes, the orthographic projections of the first radiating portion 232a, the second radiating portion 232b, the third radiating portion 232c, and the fourth radiating portion 232d and the orthographic projections of the first reference electrode layer 12 on the plane of the first surface S1 of the first dielectric substrate 11 completely overlap.

[0085] Furthermore, each of the first sub-substrate 2111 , the second sub-substrate 2112 , the third sub-substrate 2211 and the fourth sub-substrate 2212 may include a main body portion and a first connecting portion 2111 a connected to a side away from the first substrate 1 . The first connecting portion 2112a of the first sub-substrate 2111 electrically connects the first sub-reference electrode layer 2131 with the first radiating portion 232a via a first via 233 that passes through the fourth dielectric substrate 231 and the first radiating portion 232a. The first connecting portion of the second sub-substrate 2112 electrically connects the second sub-reference electrode layer 2132 with the second radiating portion 232b via a second via 234 that passes through the fourth dielectric substrate 231 and the second radiating portion 232b. The first connecting portion 2211a of the third sub-substrate 2211 electrically connects the third sub-reference electrode layer 2231 with the third radiating portion 232c via a third via 235 that passes through the fourth dielectric substrate 231 and the third radiating portion 232c. The first connecting portion 2212a of the fourth sub-substrate 2212 electrically connects the fourth sub-reference electrode layer 2232 with the fourth radiating portion 232d via a fourth via 236 that passes through the fourth dielectric substrate 231 and the fourth radiating portion 232d.

[0086] Specifically, a first connection pad 237 may be provided on a side of the first radiating portion 232a facing away from the fourth dielectric substrate 231 and at a position corresponding to the first via 233. A second connection pad 238 may be provided on a side of the second radiating portion 232b facing away from the fourth dielectric substrate 231 and at a position corresponding to the second via 234. A third connection pad 239 may be provided on a side of the third radiating portion 232c facing away from the fourth dielectric substrate 231 and at a position corresponding to the third via 235. A fourth connection pad 2310 may be provided on a side of the fourth radiating portion 232d facing away from the fourth dielectric substrate 231 and at a position corresponding to the fourth via 236. Since the first connection portion of the first sub-substrate 2111 passes through the first via hole 233, the portion of the first sub-reference electrode layer 2131 located at the first connection portion of the first sub-substrate 2111 will also pass through the first via hole 233. In this way, the portion of the first sub-reference electrode layer 2131 passing through the first via hole 233 can be connected to the first connecting pad 237 by welding to achieve the connection between the first sub-reference electrode layer 2131 and the first radiating portion 232a. Similarly, the portion of the second sub-reference electrode layer 2132 passing through the second via hole 234 can be connected to the first connecting pad 237 by welding. It is connected to the second connecting pad 238 to realize the connection between the second sub-reference electrode layer 2132 and the second radiation part 232b; the part of the third sub-reference electrode layer 2231 passing through the third via 235 can be connected to the third connecting pad 239 by welding to realize the connection between the third sub-reference electrode layer 2231 and the third radiation part 232c; the part of the fourth sub-reference electrode layer 2232 passing through the fourth via 236 can be connected to the fourth connecting pad 2310 by welding to realize the connection between the fourth sub-reference electrode layer 2232 and the fourth radiation part 232d.

[0087] Among them, the side of the main body of the first sub-substrate 2111 connected to the first connecting part 2111a is called the first side, the side of the main body of the second sub-substrate 2112 connected to the first connecting part 2112a is called the second side, the side of the main body of the third sub-substrate 2211 connected to the first connecting part 2211a is called the third side, and the side of the main body of the fourth sub-substrate 2212 connected to the first connecting part 2212a is called the fourth side. In an example of the embodiment of the present disclosure, the first side coincides with the orthographic projection of the diagonal of the first radiating portion 232a on the plane where the fourth dielectric substrate 231 is located, the second side coincides with the orthographic projection of the diagonal of the second radiating portion 232b on the plane where the fourth dielectric substrate 231 is located, the third side coincides with the orthographic projection of the diagonal of the third radiating portion 232c on the plane where the fourth dielectric substrate 231 is located, and the fourth side coincides with the orthographic projection of the diagonal of the fourth radiating portion 232d on the plane where the fourth dielectric substrate 231 is located. This arrangement can provide sufficient support force to the radiation layer 23 through the first sub-substrate 2111, the second sub-substrate 2112, the third sub-substrate 2211 and the fourth sub-substrate 2212 to ensure the flatness of the radiation layer 23.

[0088] In some examples, with continued reference to Figures 8a, 8b, 9a and 9b, the first sub-substrate 2111, the second sub-substrate 2112, the third sub-substrate 2211 and the fourth sub-substrate 2212 may each include a main body portion and a second connection portion connected to a side away from the radiation layer 23. The second connecting portion 2111b of the first sub-substrate 2111 connects the first sub-reference electrode layer 2131 to the first reference electrode layer 12 via the fifth via 13 penetrating the first dielectric substrate 11 and the first reference electrode layer 12. The second connecting portion 2112b of the second sub-substrate 2112 connects the second sub-reference electrode layer 2132 to the first reference electrode layer 12 via the sixth via 14 penetrating the first dielectric substrate 11 and the first reference electrode layer 12. The second connecting portion 2211b of the third sub-substrate 2211 connects the third sub-reference electrode layer 2231 to the first reference electrode layer 12 via the seventh via 15 penetrating the first dielectric substrate 11 and the first reference electrode layer 12. The second connecting portion 2212b of the fourth sub-substrate 2212 connects the fourth sub-reference electrode layer 2232 to the first reference electrode layer 12 via the eighth via 16 penetrating the first dielectric substrate 11 and the first reference electrode layer 12.

[0089] Specifically, Figure 12 is a top view of the first reference electrode layer 12 of the disclosed embodiment; Figure 13 is a schematic diagram of the first sub-reference electrode layer 2131, the second sub-reference electrode layer 2132, and the fourth sub-reference electrode layer 2232 of the disclosed embodiment being respectively connected to the first reference electrode layer 12; as shown in Figures 12 and 13, a fifth connecting pad 17 is provided at a position corresponding to the fifth via 13 on the first reference electrode layer 12 away from the first dielectric substrate 11, a sixth connecting pad 18 is provided at a position corresponding to the sixth via 14, a seventh connecting pad 19 is provided at a position corresponding to the seventh via 15, and an eighth connecting pad 110 is provided at a position corresponding to the eighth via 16. Because the second connection portion of the first sub-substrate 2111 passes through the fifth via 13, the portion of the first sub-reference electrode layer 2131 located at the second connection portion of the first sub-substrate 2111 will also pass through the fifth via 13. In this way, the portion of the first sub-reference electrode layer 2131 passing through the fifth via 13 can be connected to the fifth connection pad 17 by welding, thereby achieving a connection between the first sub-reference electrode layer 2131 and the first reference electrode layer 12. Similarly, because the second connection portion of the second sub-substrate 2112 passes through the sixth via 14, the portion of the second sub-reference electrode layer 2132 located at the second connection portion of the second sub-substrate 2112 will also pass through the sixth via 14. In this way, the portion of the second sub-reference electrode layer 2132 passing through the sixth via 14 can be connected to the sixth connection pad 18 by welding, thereby achieving a connection between the second sub-reference electrode layer 2132 and the first reference electrode layer 12. Since the second connection portion of third sub-substrate 2211 passes through seventh via 15, the portion of third sub-reference electrode layer 2231 located at the second connection portion of third sub-substrate 2211 will also pass through seventh via 15. In this way, the portion of third sub-reference electrode layer 2231 passing through seventh via 15 can be connected to seventh connection pad 19 by welding, thereby achieving a connection between third sub-reference electrode layer 2231 and first reference electrode layer 12. Since the second connection portion of fourth sub-substrate 2212 passes through eighth via 16, the portion of fourth sub-reference electrode layer 2232 located at the second connection portion of fourth sub-substrate 2212 will also pass through eighth via 16. In this way, the portion of fourth sub-reference electrode layer 2232 passing through eighth via 16 can be connected to eighth connection pad 110 by welding, thereby achieving a connection between fourth sub-reference electrode layer 2232 and first reference electrode layer 12.

[0090] In some examples, the first substrate 1 not only includes the above-mentioned first dielectric substrate 11 and first reference electrode layer 12, but also includes a second opening 111 and a third opening 112 that penetrate the first dielectric substrate 11 and the first reference electrode layer 12; the second opening 111 coincides with the orthographic projection of the first balun component 21 on the plane where the first surface S1 is located; the third opening 112 coincides with the orthographic projection of the second balun component 22 on the plane where the first surface S1 is located.

[0091] In some examples, continuing to refer to Figures 8a and 9a, the first balun feed line 212 and the second balun feed line 222 can be balun feed lines with exactly the same structure. The line length of the portion of the first balun feed line 212 located on the first sub-substrate 2111 is a, and the line length of the portion located on the second sub-substrate 2112 is b. The ratio of b to a is approximately between 0.56 and 0.57. Similarly, the line length of the portion of the second balun feed line 222 located on the third sub-substrate 2211 is a, and the line length of the portion located on the fourth sub-substrate 2212 is b. The ratio of b to a is approximately between 0.56 and 0.57. By reasonably setting the lengths of the first balun feed line 212 and the second balun feed line 222, the radio frequency signal can be better stimulated to radiate through the radiation structure 2.

[0092] In some examples, FIG14 is a schematic diagram of the first balun feeder / second balun feeder of an embodiment of the present disclosure. As shown in FIG14 , regardless of whether the balun feeder is the first balun feeder 212 or the second balun feeder 222, it includes a first portion 101, a second portion 102, and a third portion 103 connected in sequence, wherein the angle formed by the connection between the first portion 101 and the second portion 102 is a rounded chamfer, and the angle formed by the connection between the second portion 102 and the third portion 103 is a rounded chamfer. In this way, the reflection of the RF signal can be well prevented and the signal loss can be reduced. Of course, the angle formed by the connection between the first portion 101 and the second portion 102 can also be a flat chamfer, and the angle formed by the connection between the second portion 102 and the third portion 103 can also be a flat chamfer.

[0093] In some examples, the antenna of the disclosed embodiments includes not only the aforementioned structure but also includes a first side panel 7 and a second side panel 8 disposed opposite each other. The first side panel 7 and the second side panel 8 are respectively connected to opposite sides of the first dielectric substrate 11 in the width direction. The planes of the first side panel 7 and the second side panel 8 intersect with the plane of the first dielectric substrate 11. The first reference electrode layer 12 extends to the first side panel 7 and the second side panel 8. Specifically, the portion of the first reference electrode layer 12 located on the first side panel 7 and the second side panel 8 has a first opening 121, which is provided corresponding to the radiating structure 2. For example, the first opening 121 is a U-shaped opening. The provision of the first opening 121 improves the isolation between adjacent radiating structures 2 and enhances crosstalk resistance between ports. Of course, the first reference electrode layer 12 can also cover the first side panel 7 and the second side panel 8, which simplifies the process.

[0094] Furthermore, in the embodiment of the present disclosure, the first side plate 7 and the second side plate 8 may be integrally formed with the first dielectric substrate 11. For example, the structure including the first dielectric substrate 11, the first side plate 7 and the second side plate 8 may be formed by an injection molding process.

[0095] In some examples, the materials of the first dielectric substrate 11, the second dielectric substrate 211, the third dielectric substrate 221, and the fourth dielectric substrate in the disclosed embodiments include, but are not limited to, polycarbonate (PC), cycloolefin polymer (COP), or acrylic / organic glass (PMMA).

[0096] As shown in Figures 1-5, the transparent antenna includes two radiating structures 2. The first balun component 21 and the second balun component 22 in the radiating structure 2 are both formed using a laser engraving and chemical plating process. The first reference electrode layer 12 and the radiating layer 23 both utilize a conductive mesh structure. For example, the radiating structure 2 in the antenna of the present embodiment has dimensions of 100mm × 100mm × 17mm (0.83λc × 0.83λc × 0.14λc, where λc is the center frequency wavelength). Figure 15 shows a standing wave ratio performance graph of the transducer in the transparent antenna of the present embodiment. As shown in Figure 15, the transducer in the present embodiment achieves excellent matching with a VSWR < 1.35 within the 2300-2700MHz frequency band. The relative operating bandwidth exceeds 16%. Figure 16 shows a performance graph of the isolation performance of the transducer in the transparent antenna of the present embodiment. As shown in Figure 16, the transducer in the transparent antenna of the present embodiment achieves excellent isolation exceeding 27dB within the operating frequency band, improving the anti-crosstalk characteristics of the dual-polarization transducer.

[0097] When the first reference electrode layer 12 of the antenna of the embodiment of the present disclosure includes the first opening 121, and the first feed structure 3 and the second feed structure 4 are formed by a laser engraving and chemical plating process, the transparent antenna of the embodiment of the present disclosure has a compact antenna size and a low antenna cross-section. Its size is only 195mm×100mm×17mm (1.625λc×0.83λc×0.14λc), and the cross-section height is reduced by 0.11λc compared to the traditional requirement of 0.25λc.

[0098] Figure 17 shows the S-parameter curves of the first feed structure 3 / second feed structure 4 according to the embodiment of the present disclosure. As shown in Figure 17, the S11 of the first feed structure 3 / second feed structure 4 according to the embodiment of the present disclosure is less than -23dB, and both S21 and S31 are greater than -3.3dB. Figure 18 shows the phase difference characteristics of the first feed structure 3 / second feed structure 4 according to the embodiment of the present disclosure. As shown in Figure 18, the phase difference between the second feeding ports of the first feed structure 3 / second feed structure 4 according to the embodiment of the present disclosure is less than 1°.

[0099] Figure 19 is a graph showing the standing wave ratio performance of the transparent antenna of the embodiment of the present disclosure. As shown in Figure 19, the antenna of the present disclosure satisfies VSWR < 1.13 across the entire operating frequency band of 2300-2700 MHz, demonstrating excellent matching characteristics. Figure 20 is a graph comparing the isolation performance of the transparent antenna of the embodiment of the present disclosure with and without the first opening 121 in the first reference electrode layer 12. As shown in Figure 20, when the transparent antenna has a complete first reference electrode layer 12, its isolation is only higher than 19 dB. However, when the first opening 121 is provided on top of the complete first reference electrode layer 12, the isolation of the transparent antenna is increased by nearly 3 dB, resulting in an overall isolation of the antenna of the embodiment of the present disclosure exceeding 22 dB, significantly improving the anti-crosstalk performance between the two ports. Figure 21 is a graph showing the gain characteristics of the transparent antenna of the embodiment of the present disclosure. As shown in Figure 21, the transparent antenna of the embodiment of the present disclosure has a high gain characteristic of 11.25-12.13 dBi within the operating frequency band, ensuring the antenna's transmit and receive strength during signal coverage.

[0100] In summary, the transparent antenna of the embodiment of the present disclosure has the characteristics of low cost and high performance, and will have great application potential in the transparent beautification antenna market.

[0101] On the second aspect, Figure 22 is a schematic diagram of an antenna array according to an embodiment of the present disclosure. As shown in Figure 22 , an embodiment of the present disclosure provides an antenna array, which includes a plurality of antennas 100 , and the antenna 100 adopts any of the above-mentioned antennas.

[0102] Furthermore, in the antenna array of the embodiment of the present disclosure, the first balun feed lines 212 (second balun feed lines 222) in at least some of the antennas 100 have different sizes. Thus, the first balun feed lines 212 of different sizes correspond to different operating frequencies of the antennas 100. Each antenna 100 can also be connected to the feed source via a switch. By selecting different switches, different antennas are selected for operation, thereby realizing the function of a dual-band or multi-band antenna.

[0103] In a third aspect, an embodiment of the present disclosure provides an electronic device, which includes any of the above-mentioned antennas or antenna arrays.

[0104] In some examples, the electronic device also includes a transceiver unit, a radio frequency transceiver, a signal amplifier, a power amplifier, and a filtering unit. The antenna in the communication device can be used as a transmitting antenna or a receiving antenna. The transceiver unit may include a baseband and a receiving end. The baseband provides signals of at least one frequency band, such as 2G signals, 3G signals, 4G signals, 5G signals, etc., and transmits the signals of at least one frequency band to the radio frequency transceiver. After the antenna in the communication system receives the signal, it can be processed by the filtering unit, power amplifier, signal amplifier, and radio frequency transceiver and then transmitted to the receiving end in the transceiver unit. The receiving end may be, for example, a smart gateway.

[0105] Furthermore, a radio frequency transceiver is connected to the transceiver unit and is used to modulate the signals sent by the transceiver unit or to demodulate the signals received by the antenna and transmit them back to the transceiver unit. Specifically, the radio frequency transceiver may include a transmitting circuit, a receiving circuit, a modulation circuit, and a demodulation circuit. After the transmitting circuit receives various types of signals provided by the baseband, the modulation circuit can modulate these various types of signals provided by the baseband and then transmit them to the antenna. The antenna receives the signal and transmits it to the receiving circuit of the radio frequency transceiver. The receiving circuit transmits the signal to the demodulation circuit, which demodulates the signal and transmits it to the receiving end.

[0106] Furthermore, the RF transceiver is connected to a signal amplifier and a power amplifier, which are then connected to a filtering unit, which is connected to at least one antenna. When the communication system transmits signals, the signal amplifier is used to increase the signal-to-noise ratio of the signal output by the RF transceiver before transmitting it to the filtering unit. The power amplifier is used to amplify the power of the signal output by the RF transceiver before transmitting it to the filtering unit. The filtering unit may specifically include a duplexer and a filtering circuit. The filtering unit combines the signals output by the signal amplifier and the power amplifier, filters out noise, and then transmits them to the antenna, which radiates the signal. When the communication system receives signals, the antenna receives the signal and transmits it to the filtering unit. The filtering unit filters out noise from the signal received by the antenna and transmits it to the signal amplifier and power amplifier. The signal amplifier amplifies the signal received by the antenna to increase the signal-to-noise ratio. The power amplifier amplifies the power of the signal received by the antenna. The signal received by the antenna is processed by the power amplifier and the signal amplifier before being transmitted to the RF transceiver, which then transmits it to the transceiver unit.

[0107] In some examples, the signal amplifier may include various types of signal amplifiers, such as a low noise amplifier, which is not limited herein.

[0108] In some examples, the electronic device provided by the embodiments of the present disclosure further includes a power management unit, which is connected to a power amplifier and provides the power amplifier with a voltage for amplifying a signal.

[0109] It will be understood that the above embodiments are merely exemplary embodiments for illustrating the principles of the present invention, and the present invention is not limited thereto. Those skilled in the art will appreciate that various modifications and improvements can be made without departing from the spirit and substance of the present invention, and such modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. An antenna unit, comprising a first substrate and at least one radiating structure; wherein: The first substrate includes a first dielectric substrate and a first reference electrode layer; The first dielectric substrate has a first surface and a second surface that are oppositely arranged, the first reference electrode layer is arranged on the first surface, and the radiation structure is arranged on the second surface side; The radiation structure includes a first balun component and a second balun component, and a radiation layer; The radiation layer is arranged on a side of the first balun component and the second balun component away from the first substrate, and the radiation layer is electrically connected to the first reference electrode layer through the second reference electrode layer of the first balun component and the third reference electrode layer of the second balun component.

2. The antenna unit according to claim 1, wherein: The first balun component includes a second dielectric substrate, a first balun feeder and the second reference electrode layer; the second dielectric substrate includes a third surface and a fourth surface arranged opposite to each other; the plane where the third surface is located intersects with the plane where the first surface is located, and the first dielectric substrate is fixed on the second surface side; the first balun feeder is arranged on the third surface, the second reference electrode layer is arranged on the fourth surface, and the second reference electrode layer and the first balun feeder at least partially overlap in the plane where the third surface is located; The second balun component includes a third dielectric substrate, a second balun feed line and the third reference electrode layer; the third dielectric substrate includes a fifth surface and a sixth surface arranged opposite to each other; the plane where the fifth surface is located intersects with the plane where the first surface is located, and the second dielectric substrate is fixed on the side of the second surface and is arranged crosswise with the first dielectric substrate; the second balun feed line is arranged on the fifth surface, the third reference electrode layer is arranged on the sixth surface, and the third reference electrode layer and the second balun feed line are at least partially overlapped in their orthographic projections on the plane where the fifth surface is located.

3. The antenna unit according to claim 2, wherein: The second dielectric substrate and the third dielectric substrate in the radiation structure are an integrally formed structure, and the second dielectric substrate and the third dielectric substrate are cross-arranged to divide the second dielectric substrate into a first sub-substrate and a second sub-substrate, and to divide the third dielectric substrate into a third sub-substrate and a fourth sub-substrate; the first sub-substrate is located on the fifth surface side, and the second sub-substrate is located on the sixth surface side; the third sub-substrate is located on the third surface side, and the fourth sub-substrate is located on the fourth surface side; A first notch is provided on a side where the third sub-substrate is connected to the third surface, and the first balun feed line passes through the first notch; a second notch is provided on a side where the first sub-substrate is connected to the fifth surface, and the second balun feed line passes through the second notch.

4. The antenna unit according to claim 3, wherein: The second reference electrode layer includes a first sub-reference electrode layer disposed on the first sub-substrate and a second sub-reference electrode layer disposed on the second sub-substrate; The third reference electrode layer includes a third sub-reference electrode layer disposed on the third sub-substrate and a fourth sub-reference electrode layer disposed on the fourth sub-substrate; The radiation layer includes a fourth dielectric substrate, a first radiation portion, a second radiation portion, a third radiation portion and a fourth radiation portion arranged on the side of the fourth dielectric substrate away from the first dielectric substrate, the first radiation portion is electrically connected to the first sub-reference electrode layer, the second radiation portion is electrically connected to the second sub-reference electrode layer, the third radiation portion is electrically connected to the third sub-reference electrode layer, and the fourth radiation portion is electrically connected to the fourth sub-reference electrode layer.

5. The antenna unit according to claim 4, wherein: The first sub-baseboard, the second sub-baseboard, the third sub-baseboard and the fourth sub-baseboard each include a main body portion mounted on the first baseboard, and a first connecting portion connected to a side of the main body portion away from the first baseboard; The first connection portion of the first sub-substrate electrically connects the first sub-reference electrode layer with the first radiating portion through a first via hole penetrating the fourth dielectric substrate and the first radiating portion; the first connection portion of the second sub-substrate electrically connects the second sub-reference electrode layer with the second radiating portion through a second via hole penetrating the fourth dielectric substrate and the second radiating portion; the first connection portion of the third sub-substrate electrically connects the third sub-reference electrode layer with the third radiating portion through a third via hole penetrating the fourth dielectric substrate and the third radiating portion; the first connection portion of the fourth sub-substrate electrically connects the fourth sub-reference electrode layer with the fourth radiating portion through a fourth via hole penetrating the fourth dielectric substrate and the fourth radiating portion.

6. The antenna unit according to claim 4, wherein: The first sub-baseboard, the second sub-baseboard, the third sub-baseboard and the fourth sub-baseboard all include a main body portion mounted on the first baseboard, and a second connecting portion connected to a side of the main body portion away from the radiation layer; The second connection portion of the first sub-substrate connects the first sub-reference electrode layer with the first reference electrode layer through a fifth via hole penetrating the first dielectric substrate and the first reference electrode layer; the second connection portion of the second sub-substrate connects the second sub-reference electrode layer with the first reference electrode layer through a sixth via hole penetrating the first dielectric substrate and the first reference electrode layer; the second connection portion of the third sub-substrate connects the third sub-reference electrode layer with the first reference electrode layer through a seventh via hole penetrating the first dielectric substrate and the first reference electrode layer; the second connection portion of the fourth sub-substrate connects the fourth sub-reference electrode layer with the first reference electrode layer through an eighth via hole penetrating the first dielectric substrate and the first reference electrode layer.

7. The antenna unit according to claim 4, wherein: The first radiating portion is connected to the first sub-reference electrode layer by welding; the second radiating portion is connected to the second sub-reference electrode layer by welding; the third radiating portion is connected to the third sub-reference electrode layer by welding; and the fourth radiating portion is connected to the fourth sub-reference electrode layer by welding.

8. The antenna unit according to claim 4, wherein: The first sub-reference electrode layer, the second sub-reference electrode layer, the third sub-reference electrode layer and the fourth sub-reference electrode layer are connected to the first reference electrode layer by welding.

9. The antenna unit according to claim 4, wherein: At least one of the first radiation portion, the second radiation portion, the third radiation portion, and the fourth radiation portion includes a conductive mesh.

10. The antenna unit according to claim 1, wherein: The radiation structure further includes a first transmission line and a second transmission line disposed on the second surface, wherein the first transmission line is connected to the first balun feeder line, and the second transmission line is connected to the second balun feeder line.

11. The antenna unit according to claim 10, wherein: The first balun feeder is connected to the first transmission line by welding; and / or the second balun feeder is connected to the second transmission line by welding.

12. The antenna unit according to claim 10, wherein: Also included are a first feeding structure and a second feeding structure disposed on the second surface, wherein the first feeding structure and the second feeding structure each include a first feeding port and at least one second feeding port; A second feeding port of the first feeding structure is connected to one of the first transmission lines; and a second feeding port of the second feeding structure is connected to one of the second transmission lines.

13. The antenna unit according to claim 1, wherein: It also includes a first side plate and a second side plate that are arranged opposite to each other, wherein the first side plate and the second side plate are respectively connected to two side edges that are arranged opposite to each other in the width direction of the first dielectric substrate; the plane where the first side plate and the second side plate are located intersects with the plane where the first dielectric substrate is located; and the first reference electrode layer extends from the first surface to the first side plate and the second side plate.

14. The antenna unit according to claim 13, wherein: The first reference electrode layer has a first opening at a portion located at the first side plate and the second side plate, and the first opening is arranged corresponding to the radiation structure.

15. The antenna unit according to claim 1, wherein: The first substrate further includes a second opening and a third opening penetrating the first dielectric substrate and the first reference electrode layer; the second opening coincides with the orthographic projection of the first balun component on the plane where the first surface is located; The third opening coincides with an orthographic projection of the second balun component on a plane where the first surface is located.

16. The antenna unit according to claim 1, wherein: The first balun feed line and the second balun feed line each include a stripline balun feed line.

17. The antenna unit according to claim 1, wherein: The first reference electrode layer comprises a conductive grid and / or the radiation layer comprises a conductive grid.

18. The antenna unit according to claim 17, wherein: The conductive grid includes a plurality of first conductive lines and second conductive lines that are cross-arranged; the line widths of the first conductive lines and the second conductive lines are both 2-30 μm, the line spacing is 5-200 μm, and the line thickness is 1-10 μm.

19. An antenna array comprising a plurality of antenna units, wherein: The antenna unit adopts the antenna unit according to any one of claims 1-18.

20. An electronic device comprising the antenna unit according to any one of claims 1 to 18 or the antenna array according to claim 19.

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