Atomizing core, preparation method thereof and atomizer

Abstract

The invention provides an atomizing core, a preparation method thereof and an atomizer. The atomizing core comprises a porous base body which is provided with an atomizing surface and is used for guiding an atomizing medium to the atomizing surface; the heating element is arranged on the atomizing surface of the porous substrate, and at least one surface of the heating element is provided with a microstructure. According to the atomizing core, the liquid supply speed is increased, the risk of scaling of the atomizing core is reduced, and the atomizing efficiency and the smoking taste are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of atomization, and particularly to an atomization core, a preparation method thereof, and an atomizer. Background Art

[0002] An atomization core generally includes a porous matrix and a heating element. The porous matrix is used for guiding the atomization medium; the heating element is disposed on the porous matrix and is used for generating heat and atomizing the atomization medium to form an aerosol.

[0003] However, in the existing atomization core, insufficient liquid supply causes the heating element to generate high temperature, and the atomization core is prone to fouling, which affects the atomization efficiency and the suction taste. Summary of the Invention

[0004] The atomization core, a preparation method thereof, and an atomizer provided in this application aim to solve the problems that in the atomization core, insufficient liquid supply causes the heating element to generate high temperature, and the atomization core is prone to fouling, which affects the atomization efficiency and the suction taste.

[0005] To solve the above technical problems, a technical solution adopted in this application is: to provide an atomization core. The atomization core includes: a porous matrix and a heating element; the porous matrix has an atomization surface for guiding the atomization medium to the atomization surface; the heating element is disposed on the atomization surface of the porous matrix, and at least one surface of the heating element has a micro-structure.

[0006] Wherein, the heating element includes a heating matrix and an adsorption layer, and the adsorption layer at least covers one side surface of the heating matrix facing away from the porous matrix; the surface of the heating matrix and / or the adsorption layer has the micro-structure.

[0007] Wherein, the surface roughness of the side of the adsorption layer facing away from the heating matrix is greater than the surface roughness of the heating matrix.

[0008] Wherein, the adsorption layer includes a main body layer and a plurality of particulate matters embedded in the main body layer.

[0009] Wherein, a part of the particulate matters protrudes from the side surface of the main body layer facing away from the heating matrix.

[0010] Wherein, the D50 particle size of the particulate matters is 7 - 60 um; and / or, the thickness of the main body layer is 5 - 50 um.

[0011] Wherein, the surface roughness of the heating element is 0.2 - 10 um.

[0012] Wherein, the melting point / softening point of the composition material of the particulate matters is higher than the melting point / softening point of the composition material of the main body layer.

[0013] Wherein, the adsorption layer covers and contacts the entire outer surface of the heating substrate.

[0014] To solve the above technical problems, another technical solution adopted in this application is: to provide an atomizer. The atomizer includes the atomization core involved above.

[0015] To solve the above technical problems, yet another technical solution adopted in this application is: to provide a preparation method of an atomization core, the method including providing a porous substrate; forming a heating element on the porous substrate; at least one surface of the heating element having a microstructure.

[0016] Wherein, the step of disposing the heating element on the porous substrate includes: providing a heating substrate and a slurry; making the slurry adhere to the entire outer surface of the heating substrate; then, sintering the heating substrate with the slurry adhered thereon and the porous substrate together to form an atomization core; or, disposing the heating substrate on the porous substrate; then, making the slurry adhere to the heating substrate and sintering it to form an adsorption layer on the surface of the heating substrate; the adsorption layer at least covers one side surface of the heating substrate facing away from the porous substrate.

[0017] Wherein, the slurry includes the following components in mass percentages: 20-60% glass powder, 15-40% particulate matter, 0.5-5% dispersant, and the balance organic carrier; wherein, the melting point / softening point of the glass powder is less than the melting point / softening point of the constituent material of the particulate matter; the D50 particle size of the particulate matter is greater than the D50 particle size of the glass powder.

[0018] The beneficial effects of the embodiments of this application, different from the prior art: The atomization core provided by the embodiments of this application includes a porous substrate and a heating element. The porous substrate has an atomization surface for guiding the atomization medium to the atomization surface; the heating element is disposed on the atomization surface of the porous substrate, and at least one surface of the heating element has a microstructure. Among them, setting a microstructure on at least one surface of the heating element can, on the one hand, enhance the capillary force on the surface of the heating element to quickly supply the atomization medium to the surface of the heating substrate, reducing the risk of the heating substrate generating high temperature due to insufficient liquid supply. On the other hand, it can increase the surface area of the heating element, enabling the heating element to contact more atomization medium, improving the heat utilization rate, reducing the risk of the heating element generating high temperature, and thus reducing the risk of the atomization core scaling. On the further hand, when the atomization core scales, the dirt will first adhere to the surface of the microstructure. Since the surface roughness of the microstructure is relatively large, the binding strength of the dirt on the microstructure is poor. Under the capillary force of the microstructure, the atomization medium will flow rapidly, thereby generating a certain impact on the dirt, causing the dirt to fall off from the adsorption layer, further reducing the risk of dirt accumulating on the surface of the heating element and affecting the atomization efficiency and suction taste. Description of the Drawings

[0019] Figure 1 Schematic diagram of the structure of an atomizer provided by an embodiment of the present application;

[0020] Figure 2 Schematic diagram of the overall scale formation of an atomization core provided by an embodiment of the present application;

[0021] Figure 3 provided by an embodiment of the present application Figure 2 Disassembly schematic diagram of the atomization core shown;

[0022] Figure 4 Vertical cross-sectional schematic diagram of an atomization core provided by an embodiment of the present application;

[0023] Figure 5 Vertical cross-sectional schematic diagram of an atomization core provided by another embodiment of the present application;

[0024] Figure 6 Schematic diagram of the structure of an adsorption layer provided by an embodiment of the present application;

[0025] Figure 7 Flow chart of the preparation method of an atomization core provided by an embodiment of the present application.

[0026] 1 - Atomization core; 11 - Porous matrix; 12 - Heating element; 120 - Microstructure; 121 - Heating matrix; 121a - Heating part; 121b - First connection part; 121c - Second connection part; 122 - Adsorption layer; 123 - Main body layer; 124 - Particulate matter; 2 - Air flow channel; 3 - Liquid storage chamber. Detailed implementation manners

[0027] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0028] The terms "first", "second", and "third" in this application are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "second", and "third" may explicitly or implicitly include at least one of such features. In the description of this application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically defined. In the embodiments of this application, all directional indications (such as up, down, left, right, front, back...) are only used to explain the relative positional relationship, movement conditions, etc. between components in a specific posture (as shown in the drawings). If the specific posture changes, the directional indications will also change accordingly. In addition, the terms "comprise" and "have" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally further include steps or units not listed, or may optionally further include other steps or units inherent to these processes, methods, products, or devices.

[0029] Referring to "embodiments" herein means that the specific features, structures, or characteristics described in connection with the embodiments may be included in at least one embodiment of this application. The phrase appears in various places in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein may be combined with other embodiments.

[0030] In the related art, the components of the atomization medium usually include propylene glycol, glycerol, flavor, nicotine salt, tobacco extract, and other additives, etc. These components are prone to boiling and atomization at high temperatures, thereby generating aerosol. Through long-term research by the inventors of this application, it is found that: due to the different components and ratios of different atomization media, their boiling points and fluidities are also different. When using the same atomization core for atomization, some atomization media may cause the atomization medium to be consumed too quickly or the supply to be insufficient during the atomization process due to their lower boiling points or poorer fluidities, resulting in an increase in the temperature of the atomization core, thereby forming more dirt (such as soot); and macromolecular substances such as tobacco extract and additives are also prone to forming dirt during the atomization process. The accumulation of these dirt on the surface of the heating element will cause the following problems:

[0031] First, the dirt will block the contact between the heating element and the atomization medium, and the main components of the dirt are carbon (C) and oxygen (O). The heat conduction ability of the dirt is poor, so that the heat generated by the heating element cannot be conducted to the atomization medium in time, affecting the atomization efficiency.

[0032] Second, as the temperature of the heating element gradually increases, the formation of dirt will be further accelerated. Eventually, as suction progresses, the dirt on the surface of the heating element will gradually increase, the atomization efficiency will gradually decrease, the suction experience will gradually deteriorate, and even a burnt smell may occur.

[0033] Third, after the dirt accumulates on the surface of the heating element, it will be repeatedly heated and generate abnormal high temperatures during the suction process, resulting in abnormal decomposition of the dirt or e-liquid and generating harmful aldehyde and ketone substances.

[0034] Based on this, the embodiment of the present application provides an atomization core, which can improve the liquid supply rate and reduce the risk of the heating matrix generating high temperatures due to insufficient liquid supply; at the same time, it reduces the formation of dirt on the surface of the atomization core during continuous heating and reduces the generation of harmful aldehyde and ketone substances.

[0035] The following will describe the present application in detail with reference to the drawings and embodiments.

[0036] In this embodiment, refer to Figure 1 , Figure 1 which is a schematic structural diagram of an atomizer provided in an embodiment of the present application. An atomizer is provided. The atomizer can be specifically used in different fields, such as medical, beauty, and recreational inhalation. In a specific embodiment, the atomizer can be used in an electronic atomization device to atomize an atomization medium and generate an aerosol for a smoker to inhale. The following embodiments will take this recreational inhalation as an example.

[0037] The atomizer includes an atomization core 1, an air flow channel 2, a mouthpiece, and a liquid storage chamber 3. The air flow channel 2 is respectively connected to the mouthpiece and the atomization core 1. The liquid storage chamber 3 is used to store the atomization medium. The atomization core 1 is connected to the liquid storage chamber 3 and is used to atomize the atomization medium to form an aerosol. The aerosol formed by atomization flows through the air flow channel 2 to the mouthpiece for the user to inhale. The specific structure and function of the atomization core 1 can refer to the specific structure and function of the atomization core 1 involved in the following embodiments and can achieve the same or similar technical effects, which will not be elaborated here.

[0038] Refer to Figures 2 to 4 , Figure 2 which is a schematic diagram of the overall scaling of an atomization core provided in an embodiment of the present application; Figure 3 is provided in an embodiment of the present application Figure 2 a disassembly schematic diagram of the atomization core shown;

[0039] Figure 4 is a vertical cross-sectional schematic diagram of an atomization core provided in an embodiment of the present application. In this embodiment, an atomization core 1 is provided, and the atomization core 1 includes a porous matrix 11 and a heating element 12.

[0040] The porous matrix 11 has a plurality of microporous structures, and the microporous structures have capillary forces. Specifically, the porosity of the porous matrix 11 is greater than or equal to 35% and less than or equal to 80%; for example, the porosity can be 35%, 40%, 45%, 50%, 60%, 70% or 80%. The porous matrix 11 within this porosity range has certain liquid guiding performance, improving the liquid supply effect to the heating element 12; moreover, the pore structure of the porous matrix 11 can adsorb a certain amount of dirt (such as soot) in its pore structure, reducing the influence of the dirt on the heating element 12.

[0041] The average pore diameter of the porous matrix 11 is greater than or equal to 3 um and less than or equal to 50 um; for example, the average pore diameter of the porous matrix 11 can be 3 um, 10 um, 15 um, 20 um, 30 um, 40 um or 50 um, etc.

[0042] The porous matrix 11 has a liquid absorption surface and an atomization surface. The liquid absorption surface may have a liquid trough, and the liquid trough is communicated with the liquid storage chamber 3. The atomization medium in the liquid storage chamber 3 is guided to the liquid trough, and the atomization medium in the liquid trough is guided to the atomization surface of the porous matrix 11 through the capillary force of the porous matrix 11.

[0043] The material of the porous matrix 11 may include one or more of alumina, silica, silicon nitride, silicate, hydroxyapatite, silicon carbide. For example, the porous matrix 11 can be a ceramic porous matrix, a glass porous matrix, a polymer porous matrix, etc. In this embodiment, the porous matrix 11 is a porous ceramic, and the disordered pores formed during the preparation process of the porous ceramic have capillary forces. In other embodiments, the porous matrix 11 is other porous structures. For example, a plurality of through holes are provided on a dense matrix to form a porous structure, and the dense matrix can be a dense ceramic, glass, etc. Specifically, the porous matrix 11 can be specifically in a regular cuboid or cube shape; or it can be an irregular other three-dimensional structure, and the present application does not limit this.

[0044] The heating element 12 is arranged on the atomization surface of the porous matrix 11 and is used to heat and atomize the atomization medium to form an aerosol when powered on. Among them, at least one surface of the heating element 12 has a microstructure 120. Among them, the microstructure 120 refers to the surface of the material being uneven and granular. The microstructure 120 is a low surface energy structure, similar to the hydrophobic effect of a lotus leaf, and it has a certain capillary force.

[0045] The above-mentioned setting forms a granular undulating microstructure 120 on the surface of the heating element 12. Due to the capillary force, the undulating microstructure 120 can easily store and quickly absorb the atomized medium, which can prevent the heating element 12 from generating high temperature due to insufficient liquid supply; in addition, the microscopic area of ​​the surface of the heating element 12 can be increased, so that the surface of the heating element 12 is in contact with more atomized medium, improving energy utilization, reducing the probability of forming high temperature, and finally reducing the formation of dirt. In addition, the rough microstructure 120 has uniformly raised particles, and there are gaps between the particles. When dirt is formed, it first adheres to the surface of the particles. Due to the discontinuity between the particles, the contact area between the dirt and the microstructure 120 is small, and the bonding strength is poor. Under the capillary force of the gap between the particles, the atomized medium flows rapidly, exerts a certain impact on the dirt, and causes the dirt to fall off, thereby reducing the accumulation of dirt on the surface of the heating element 12, and further reducing the risk of dirt accumulating on the surface of the heating element 12 and affecting the atomization efficiency and the suction taste.

[0046] In one embodiment, Figure 3 As shown, the heating element 12 includes a heating base 121 and an adsorption layer 122 .

[0047] The heating substrate 121 is arranged on the atomization surface of the porous substrate 11, and is used to generate heat when powered on to atomize the atomization medium, thereby forming an aerosol. The heating substrate 121 includes a heating portion 121a, a first connecting portion 121b and a second connecting portion 121c; the first connecting portion 121b and the second connecting portion 121c are respectively connected to the two sides of the heating portion 121a, the first connecting portion 121b is used to contact and electrically connect with the positive electrode, and the second connecting portion 121c is used to contact and electrically connect with the negative electrode. The host of the electronic atomization device supplies power to the heating portion 121a through the positive electrode and the negative electrode, so that the heating portion 121a is powered on to generate heat, thereby atomizing the atomization medium.

[0048] The heating portion 121a may be a filamentary structure, a strip structure or a grid structure. Specifically, the heating portion 121a may be distributed in a grid shape to increase the contact area between the heating portion 121a and the porous substrate 11 within the effective atomization surface area. The material of the heating substrate 121 includes at least one of metal alloy sheets such as iron-chromium alloy, iron-chromium-aluminum alloy, iron-chromium-nickel alloy, chromium-nickel alloy, titanium alloy, stainless steel alloy, kama alloy, and precious metal alloy.

[0049] In a specific embodiment, the thickness h1 of the heating matrix 121 is greater than or equal to 0.01 mm and less than or equal to 2.00 mm; for example, the thickness h1 of the heating matrix 121 is 0.01 mm, 0.1 mm, 0.5 mm, 1.0 mm, 1.5 mm, or 2.0 mm, etc. The width w1 of the heating portion 121a of the heating matrix 121 is greater than or equal to 0.05 mm and less than or equal to 3 mm; for example, the width w1 of the heating portion 121a is 0.05 mm, 0.1 mm, 0.5 mm, 1.0 mm, 1.5 mm, 2.0 mm, 2.5 mm, or 3.0 mm, etc.

[0050] The adsorption layer 122 covers at least one surface of the heating matrix 121 facing away from the porous matrix 11; the surface of the heating matrix 121 and / or the adsorption layer 122 has a microstructure 120. In some embodiments, see Figure 4 , both the heating matrix 121 and the surface of the heating matrix 121 facing away from the porous matrix 11 have a microstructure 120; thus, the capillary force on the surface of the heating element 12 can be further enhanced to further increase the liquid supply rate and prevent insufficient liquid supply.

[0051] In one embodiment, see Figure 4 , the surface roughness of the side of the adsorption layer 122 facing away from the heating matrix 121 is greater than the surface roughness of the side of the heating matrix 121 in contact with the adsorption layer 122. Thus, the surface area of the heating element 12 can be increased, and the bonding force of dirt on the heating element 12 can be reduced, thereby further reducing the risk of dirt accumulating on the surface of the heating element 12 and affecting the atomization efficiency and suction taste. The heating matrix 121 is usually made of a metal sheet with a relatively low surface roughness. By providing the adsorption layer 122, the overall surface roughness of the heating element 12 is increased.

[0052] See Figure 5 , Figure 5A vertical cross-sectional schematic diagram of the atomization core provided by another embodiment of the present application. Among them, the surface of the heating matrix 121 is treated to form a certain surface microstructure 120, that is, the heating matrix 121 itself has a relatively high roughness. The surface of the adsorption layer 122 facing away from the heating matrix 121 also has a microstructure 120. In this embodiment, the formation of the microstructure 120 on the surface of the adsorption layer 122 can be formed only based on the microstructure 120 of the original heating matrix 121, that is, the adsorption layer 122 mainly includes a main body layer 123. That is, the surface of the adsorption layer 122 has no protrusions, and the surface roughness of the heating element 12 is mainly formed by the microstructure 120 of the heating matrix 121 itself. In another embodiment, the adsorption layer 122 further includes a plurality of particulate matters 124 embedded in the main body layer 123. The surface of the heating matrix 121 can be prepared with a microstructure by any method such as laser etching, chemical etching, and rolling. Specifically, the surface roughness of the heating element 12 is 0.2-10um; that is, the surface roughness of the adsorption layer 122 is 0.2-10um; for example, the surface roughness of the heating element 12 is 0.2um, 1.0um, 3.0um, 5.0um, 8.0um, or 10um. Among them, surface roughness refers to the unevenness of the processed surface with smaller spacing and minute peaks and valleys. The distance (wavelength) between two wave peaks or two wave valleys is very small (less than 1mm), and it belongs to microscopic geometric shape error. The smaller the surface roughness, the smoother the surface.

[0053] In one embodiment, refer to Figure 6 and Figure 4 , Figure 6 is a schematic structural diagram of the adsorption layer 122 provided by an embodiment of the present application. The adsorption layer 122 includes a main body layer 123 and a plurality of particulate matters 124 embedded in the main body layer 123.

[0054] In a specific embodiment, the main body layer 123 includes a glass glaze layer. The composition of the glass glaze layer does not contain heavy metal elements such as lead (Pb), arsenic (As), chromium (Cr), and cadmium (Cd) to avoid the generation of heavy metal ions during the heating process and being sucked by the user, which may damage the health of the user. The glass glaze layer is a relatively dense glass layer formed by sintering raw material glass powder particles at a certain temperature. The sintering temperature is usually higher than the softening point temperature of the raw material glass powder particles, and its thickness is mainly affected by the coating thickness and the D50 particle size of the raw material powder.

[0055] The particulate matter 124 can include one compound or a mixture of several compounds such as aluminum oxide, zirconium oxide, silicon carbide, and silicon oxide. The D50 particle size of the particulate matter 124 is 7-60um; for example, the D50 particle size of the particulate matter 124 is 7um, 15um, 25um, 35um, 45um, or 60um, etc.

[0056] In a specific embodiment, Figure 4 As shown, part of the particles 124 is embedded in the main layer 123, and the rest of the particles 124 protrude from the surface of the main layer 123 on one side away from the heating substrate 121. In this way, a rough surface of the heating element 12 can be formed, so that the heating element 12 presents an undulating microstructure 120 morphology. Therefore, based on the above concept, in order to reliably realize the microstructure 120, the D50 particle size of the particles 124 should be greater than the thickness of the main layer 123 to ensure that at least part of most of the particles 124 protrude from the main layer 123 to form a uniform microstructure 120. At the same time, in order to ensure that the morphology of the particles 124 is controllable during the preparation process, the melting point / softening point of the constituent material of the particles 124 is higher than the melting point / softening point of the constituent material of the main layer 123; that is, the melting point / softening point of the raw material particles of the particles 124 is higher than the melting point / softening point of the raw material glass powder of the main layer 123. In the process of softening the raw glass powder of the main layer 123 to form a dense glaze layer, the raw material particles of the granules 124 can still maintain the original particle size, so that part of the granules 124 can protrude from the surface of the main layer 123. The granules 124 can be composed of a single material or a mixture of multiple materials.

[0057] Specifically, the thickness h2 of the main layer 123 is 5-50um; for example, the thickness h2 of the main layer 123 is 5um, 10um, 20um, 30um, 40um or 50um, etc. In a specific embodiment, the adsorption layer 122 covers multiple outer surfaces of the heating substrate 121. Most preferably, the adsorption layer 122 covers the entire outer surface of the heating substrate 121. The heating substrate 121 is in contact with the porous substrate 11 through the adsorption layer 122. In this embodiment, the heating element 12 can first be sprayed, screen printed, immersed, etc., to attach the coating slurry forming the microstructure 120 to the entire outer surface of the heating substrate 121, and then the heating element 12 is combined with the porous substrate 11 by a process such as grouting molding or powder pressing molding, and sintered to obtain the atomizing core 1.

[0058] Of course, in other embodiments, the adsorption layer 122 may also cover all surfaces of the heating substrate 121 except the bonding surface; wherein the bonding surface of the heating substrate 121 refers to the surface of the heating substrate 121 facing the porous substrate 11. In this embodiment, the heating substrate 121 may be first molded and sintered with the porous substrate 11, and then the coating slurry forming the microstructure 120 is attached to the surface of the heating substrate 121 by spraying or silk-screening, and finally the atomizer core 1 is obtained by sintering.

[0059] It should be noted that, in some embodiments, the porous matrix 11 and the heating element 12 may be fixed by direct embedding or by bonding with an adhesive layer, wherein the adhesive layer may be a glass layer or the like.

[0060] The coating slurry for forming the microstructure 120 includes the following components in various mass percentages: 20-60% glass powder, 15-40% high melting point particles 124, 0.5-5% dispersant and the balance organic carrier. The glass powder can be low temperature glass such as SnO-ZnO-P 2 O 5 Ternary glass (SZP ternary glass system), alkali borosilicate glass system, etc. The particulate matter 124 may be spherical alumina particles. The organic carrier may include an organic solvent and a thermoplastic resin. The organic carrier may make the glass powder and the particulate matter 124 appropriately fluid and plastic. The organic solvent may be at least one of butyl carbitol, pineol, and butyl carbitol acetate. The dispersant may adjust the stability of the glass powder, and the dispersant may be polyethylene wax, paraffin or other commercially available dispersants. The commercially available dispersant may be BYK-110, etc. Among them, BYK-110 is one of the commercially available dispersants, mainly a copolymer solution with an acidic group, and the solvent is propylene glycol methyl ether acetate and alkylbenzene and other components. It should be noted that the atomizing core 1 finally obtained does not contain or retains a small amount of organic carrier and dispersant.

[0061] The atomizer core 1 provided in this embodiment includes a porous substrate 11 and a heating element 12. The porous substrate 11 has an atomization surface for guiding the atomization medium to the atomization surface; the heating element 12 is arranged on the atomization surface of the porous substrate 11, and at least one surface of the heating element 12 has a microstructure 120. Among them, by providing the microstructure 120 on at least one surface of the heating element 12, on the one hand, the capillary force on the surface of the heating element 12 can be enhanced to quickly supply the atomization medium to the surface of the heating substrate 121, thereby reducing the risk of high temperature of the heating substrate 121 due to insufficient liquid supply. On the other hand, the surface area of ​​the heating element 12 can be increased, so that the heating element 12 can be in contact with more atomization medium, improve the heat utilization rate, reduce the risk of high temperature of the heating element 12, and thus reduce the risk of scaling of the atomizer core 1. On the other hand, when the atomizer core 1 is fouled, the dirt will first adhere to the surface of the microstructure 120. Since the surface roughness of the microstructure 120 is relatively large, the bonding strength of the dirt on the microstructure 120 is relatively poor. Under the capillary force of the microstructure 120, the atomization medium will flow rapidly, thereby having a certain impact on the dirt, causing the dirt to fall from the microstructure 120, further reducing the risk of dirt accumulating on the surface of the heating element 12 and affecting the atomization efficiency and the smoking taste; at the same time, it also reduces the risk of the dirt being repeatedly heated and generating abnormally high temperatures, resulting in abnormal decomposition of the dirt or the e-liquid and the production of harmful aldehydes and ketones.

[0062] See also Figure 7 , Figure 7The flowchart of the preparation method of the atomization core provided by an embodiment of the present application. In this embodiment, a preparation method of the atomization core is provided. This preparation method can be used to prepare the atomization core 1 provided in the above embodiment. The specific steps of this preparation method include:

[0063] Step S1: Provide a porous matrix.

[0064] The porous matrix 11 has a plurality of microporous structures. The microporous structure has capillary action for liquid conduction. For the specific structure and function of the porous matrix 11, please refer to the above text. Figure 3 , the heating matrix 121 is used to generate heat when powered on to atomize the atomization medium. For the specific structure and function of the heating matrix 121, please refer to the relevant description above.

[0065] Step S2: Form a heating element on the porous matrix; at least one surface of the heating element has a microstructure.

[0066] In a specific embodiment, step S2 specifically includes:

[0067] Step S21: Provide a heating matrix 121 and a slurry.

[0068] As described above, the slurry includes 20 - 60% glass powder, 15 - 40% high-melting-point particulate matter 124, 0.5 - 5% dispersant, and the balance organic carrier. Among them, the D50 particle size of the particulate matter 124 is larger than the D50 particle size of the glass powder; in this way, the microstructure 120 on the surface of the heating element 12 can be formed by using the particulate matter 124, and the surface roughness of the adsorption layer 122 formed by the particulate matter 124 is within a preset range.

[0069] Among them, the softening temperature of the glass powder is 400 - 1200 °C, such as 400 °C, 500 °C or 600 °C. The D50 particle size of the glass powder is 2 - 30 μm, such as 2 μm, 5 μm, 10 μm, 20 μm or 30 μm; the specific size can be selected according to actual needs. The glass powder can be low-temperature glass such as SnO-ZnO-P 2 O 5 ternary glass (SZP ternary glass system), alkali borosilicate glass system, etc. The particulate matter 124 can be spherical alumina particles. The organic carrier can include organic solvents and thermoplastic resins. The organic carrier can make the glass powder and the particulate matter 124 have appropriate fluidity and plasticity. The organic solvent can be at least one of butyl carbitol, terpineol, butyl carbitol acetate. The dispersant can condition the stability of the glass powder, and the dispersant can be BYK-110, polyethylene wax, paraffin, etc. It should be noted that there is no or a small amount of organic carrier and dispersant remaining in the finally obtained atomization core 1.

[0070] The melting point / softening point of the glass powder is less than that of the constituent material of the particulate matter 124. In this way, it can be ensured that when the temperature reaches a certain level, such as during the sintering process, the glass powder is melted to form the main body layer 123, while the particulate matter 124 is not melted or is less melted, so as to form an adsorption layer 122 with a rough surface and a wavy microstructure 120 on the surface of the heating substrate 121 (such as Figure 6 ). That is, the sintering temperature should be greater than the softening point stability of the glass powder and less than the melting point / softening point temperature of the constituent material of the particulate matter 124.

[0071] Step S22: Attach the slurry to the entire outer surface of the heating substrate 121.

[0072] Specifically, spraying, screen printing, dipping and other methods can be used to attach the slurry to the entire outer surface of the heating substrate 121.

[0073] Step S23: Sinter the heating substrate 121 with the attached slurry together with the porous substrate 11 to form the atomization core 1.

[0074] Specifically, the heating substrate 121 with the attached slurry can be combined with the porous substrate 11 through processes such as slip casting or powder pressing molding, and then the heating substrate 121 and the porous substrate 11 are sintered to obtain the atomization core 1.

[0075] In another specific embodiment, step S2 specifically includes:

[0076] Step S21': Provide the heating substrate 121 and the slurry.

[0077] The slurry is the same as the slurry provided in step S21. This step S21 can also be executed before step S1.

[0078] Step S22': Place the heating substrate 121 on the porous substrate 11.

[0079] The heating substrate 121 and the porous substrate 11 can be formed and sintered through processes such as slip casting or powder pressing molding.

[0080] Step S23': Attach the slurry to the heating substrate 121 and sinter it to form an adsorption layer 122 on the surface of the heating substrate 121.

[0081] Specifically, the slurry can be attached to all surfaces of the heating substrate 121 except the bonding surface by spraying or screen printing methods, and then the heating substrate 121 and the porous substrate 11 are sintered to obtain the atomization core 1. Among them, after sintering, all or most of the organic carrier and the dispersant are volatilized, that is, the finally formed atomization core 1 has no or almost no organic carrier and dispersant.

[0082] The following are two specific experiments by the inventors of this application to form the adsorption layer 122 on the surface of the heating substrate 121.

[0083] Experiment 1: The softening point of the glass powder is 400 - 600 °C, the D50 particle size is 4 μm, and the proportion of the glass powder in the slurry is 38%. The particulate matter 124 is spherical alumina particles, the D50 particle size is 10 μm, and the proportion of the particulate matter 124 in the slurry is 15%. The proportion of the organic carrier in the slurry is 45%. The dispersant is BYK - 110, and the proportion of the dispersant in the slurry is 2%. Among them, the proportion of the thermoplastic resin in the organic carrier is 5%, and the proportion of the organic solvent is 95%. The preparation method of the organic carrier is to completely dissolve the thermoplastic resin in the organic solvent under water bath heating at 60 - 80 °C, and then filter through a 200 - 400 - mesh filter cloth to finally obtain the organic carrier. The solvents are butyl carbitol, terpineol, and butyl carbitol acetate. The glass powder, the high - melting - point particulate matter 124, and the dispersant are added to the organic carrier, and after being stirred evenly, a slurry is obtained. The slurry is sprayed onto the surface of the heating substrate 121 and sintered at 750 °C to obtain the heating element 12. Among them, the surface of the heating element 12 has a microstructure 120 with a roughness of 0.5 - 1.5 μm. Here, the D50 particle size represents the particle size corresponding to when the cumulative particle size distribution percentage of a sample reaches 50%; its physical meaning is that 50% of the particles are larger than it, and 50% of the particles are smaller than it.

[0084] Experiment 2: The softening point of the glass powder is 800 - 1000 °C, the D50 particle size is 10 μm, and the proportion of the glass powder in the slurry is 55%. The high - melting - point particulate matter 124 is spherical zirconia particles, the D50 particle size is 18 μm, and the proportion of the particulate matter 124 in the slurry is 30%. The proportion of the organic carrier in the slurry is 14%. The dispersant is BYK - 110, and the proportion of the dispersant in the slurry is 1%. Among them, the proportion of the thermoplastic resin in the organic carrier is 30%, and the proportion of the organic solvent is 70%. The preparation method of the organic carrier is to completely dissolve the thermoplastic resin in the organic solvent under water bath heating at 60 - 80 °C, and then filter through a 200 - 400 - mesh filter cloth to finally obtain the organic carrier. The glass powder, the high - melting - point particulate matter 124, and the dispersant are added to the organic carrier, and after being stirred evenly, a slurry is obtained. The slurry is screen - printed on the surface of the heating substrate 121 and sintered at 1150 °C to form the heating element 12; among them, the surface of the heating element 12 has a microstructure 120 with a roughness of 2 - 5 μm.

[0085] The preparation method of the atomization core 1 provided in this embodiment includes providing a porous substrate 11, and then forming a heating element 12 on the porous substrate 11; at least one surface of the heating substrate 121 has a microstructure 120. For the atomization core 1 prepared by this method, on the one hand, the capillary force on the surface of the heating element 12 can be enhanced to quickly supply the atomization medium to the surface of the heating substrate 121, reducing the risk of high temperature generated by the heating substrate 121 due to insufficient liquid supply. On the other hand, the surface area of the heating element 12 can be increased, enabling the heating element 12 to come into contact with more atomization medium, improving the heat utilization rate, reducing the risk of high temperature generated by the heating element 12, and thus reducing the risk of scaling of the atomization core 1. On the other hand, when the atomization core 1 is scaled, the dirt will first adhere to the surface of the microstructure 120. Due to the relatively large surface roughness of the microstructure 120, the binding strength of the dirt on the microstructure 120 is poor. Under the capillary force of the microstructure 120, the atomization medium will flow rapidly, thereby exerting a certain impact on the dirt, causing the dirt to fall off from the microstructure 120, further reducing the risk of dirt accumulation on the surface of the heating element 12, affecting the atomization efficiency and the suction taste.

[0086] The above are only the implementation manners of the present application, and do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present application.

Claims

1. An atomizing core, characterized in that, it comprises: a porous matrix having an atomizing surface for guiding an atomizing medium to the atomizing surface; a heating element disposed on the atomizing surface of the porous matrix, and at least one surface of the heating element has a microstructure.

2. The atomizing core according to claim 1, characterized in that, the heating element comprises a heating matrix and an adsorption layer, and the adsorption layer at least covers one side surface of the heating matrix facing away from the porous matrix; the surface of the heating matrix and / or the adsorption layer has the microstructure.

3. The atomizing core according to claim 2, characterized in that, the surface roughness of the side of the adsorption layer facing away from the heating matrix is greater than the surface roughness of the heating matrix.

4. The atomizing core according to claim 3, characterized in that, the adsorption layer comprises a main body layer and a plurality of particulate matters embedded in the main body layer.

5. The atomizing core according to claim 4, characterized in that, part of the particulate matters protrude from the side surface of the main body layer facing away from the heating matrix.

6. The atomizing core according to claim 4, characterized in that, the D50 particle size of the particulate matters is 7 - 60 μm; and / or, the thickness of the main body layer is 5 - 50 μm.

7. The atomizing core according to claim 2, characterized in that, the surface roughness of the heating element is 0.2 - 10 μm.

8. The atomizing core according to claim 4, characterized in that, the melting point / softening point of the constituent material of the particulate matters is higher than the melting point / softening point of the constituent material of the main body layer.

9. The atomizing core according to claim 2, characterized in that, the adsorption layer covers the entire outer surface of the heating matrix.

10. An atomizer, characterized in that, it comprises the atomizing core according to any one of claims 1 - 9.

11. A method for preparing an atomizing core, characterized in that, it comprises: providing a porous matrix; forming a heating element on the porous matrix; at least one surface of the heating element has a microstructure.

12. The method for preparing an atomizing core according to claim 11, characterized in that, the step of forming a heating element on the porous matrix comprises: providing a heating matrix and a slurry; attaching the slurry to the entire outer surface of the heating matrix; then, sintering the heating matrix with the attached slurry together with the porous matrix to form an atomizing core; or, disposing the heating matrix on the porous matrix; then, attaching the slurry to the heating matrix and sintering it to form an adsorption layer on the surface of the heating matrix; the adsorption layer at least covers one side surface of the heating matrix facing away from the porous matrix.

13. The method for preparing an atomizing core according to claim 12, characterized in that, the slurry comprises the following components in mass percentages: 20 - 60% glass powder, 15 - 40% particulate matters, 0.5 - 5% dispersant, and the balance organic carrier; wherein, the melting point / softening point of the glass powder is less than the melting point / softening point of the constituent material of the particulate matters; the D50 particle size of the particulate matters is greater than the D50 particle size of the glass powder.

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