An automatic packaging device for indium ingots

Abstract

This invention provides an automatic packaging device for indium ingots, relating to the field of mechanical equipment technology. It includes a forming component and a cover component. The forming component comprises a bottom mold and an upper mold. When a PVC rigid sheet passes through the forming component, the bottom mold and upper mold close, pressing a placement groove into the PVC rigid sheet. A robotic arm places the indium ingot into the placement groove, and the PVC rigid sheet, carrying the indium ingot, moves to the cover component. The advantages of this invention are that the forming component and cover component are provided. The forming component presses the PVC rigid sheet to create the placement groove, the size of which is larger than the size of the indium ingot. The placement groove has a certain degree of hardness, protecting the indium ingot from impact or compression, preventing deformation or scratches. The cover component seals the opening of the placement groove, placing the indium in a sealed space, preventing oxidation or reaction with other metals, and ensuring the purity of the indium ingot.

Description

Technical Field

[0001] This invention relates to the field of mechanical equipment technology, and in particular to an automatic packaging device for indium ingots. Background Technology

[0002] Indium is a silvery-white metal with a slightly bluish luster. It is very soft; a fingernail can easily scratch its surface. Indium has good plasticity and ductility, allowing it to be pressed into thin sheets. Therefore, indium is mainly used in the production of ITO sputtering targets (for liquid crystal displays and flat panel screens), semiconductor materials, and devices. When storing indium ingots, they should be kept separate from other metals and packaged in non-metallic containers such as plastic or glass to prevent oxidation or other contamination.

[0003] Currently, most indium ingots on the market are packaged in plastic sealed bags. However, plastic sealed bags can only protect indium ingots from oxidation. Indium ingots are relatively soft and are easily deformed by bumps and impacts during transportation, which will affect their shape. If glass bottles are used to package indium, it will increase the packaging cost. Summary of the Invention

[0004] This invention overcomes the shortcomings of the prior art by providing a molding component and a cover component. The molding component presses a PVC rigid sheet into a placement groove, the size of which is larger than the size of the indium ingot. Because the placement groove has a certain degree of hardness, it can protect the indium ingot from deformation or scratches when the packaged indium ingot is subjected to impact or compression. The cover component seals the opening of the placement groove, so that the indium ingot is in a sealed space, preventing the indium ingot from being oxidized or reacting with other metals, thus ensuring the purity of the indium ingot.

[0005] To solve the above-mentioned technical problems, the invention is achieved through the following technical solution:

[0006] An automatic packaging device for indium ingots includes a forming component and a cover component. The forming component includes a bottom mold component and an upper mold component. When a PVC rigid sheet passes through the forming component, the bottom mold component and the upper mold component close together to press a placement groove into the PVC rigid sheet. A robotic arm places the ingot into the placement groove, and the PVC rigid sheet moves the indium ingot to the cover component.

[0007] The cover assembly is provided with a cover PVC roll, and a PVC film roll is provided at the cover PVC roll. The cover assembly is also provided with a cover hot pressing component, and a pressure bearing component is provided directly below the cover hot pressing component. The PVC film and the PVC rigid film with indium ingot overlap and pass through the cover hot pressing component and the pressure bearing component.

[0008] The cover hot pressing component includes a hot pressing plate, which is detachably connected to a hot pressing forming plate. When the hot pressing plate is powered on, it generates heat and transfers the heat to the hot pressing forming plate. The hot pressing forming plate presses down to press the PVC soft sheet and the PVC rigid sheet with indium ingots together.

[0009] Furthermore, the bottom mold component includes a bottom mold base block and a bottom mold changing block;

[0010] The bottom mold base block is provided with a bottom mold slide rail, a limit strip is provided on one side of the bottom mold slide rail, and a first side locking groove is provided at the end of the bottom mold base block away from the limit strip.

[0011] The bottom mold changing block is provided with a sliding groove at its lower end, a limit groove at one end of the sliding groove, and a second side locking sliding groove at the end of the bottom mold changing block away from the limit groove.

[0012] The slide groove is slidably connected to the bottom mold slide rail;

[0013] When the bottom mold base block and the bottom mold changing block coincide, the limiting groove and the limiting strip are engaged, and the first side locking groove and the second side locking groove coincide.

[0014] Both the first and second side lock grooves are slidably connected to the side lock block, and the side lock block is connected to the bottom mold base block and the bottom mold changing block by side lock bolts.

[0015] Furthermore, the molding assembly also includes a molding base, on which a support column is provided. A molding upper plate and an adjusting shim are inserted into the support column. The height of the molding upper plate can be set by adjusting the position of the molding upper plate and the adjusting shim. The top end of the support column is connected to a top nut.

[0016] The upper mold component is connected to the upper forming plate by mold locking bolts;

[0017] The molding base is connected to the molding lifting cylinder, and the bottom mold base block is provided with a bottom mold lifting rail. The output end of the molding lifting cylinder is connected to the bottom mold base block, and the bottom mold lifting rail is movably connected to the molding base.

[0018] Furthermore, the lower end of the upper forming plate is provided with an upper plate slide rail, and the upper mold component includes an upper mold base block, the upper mold base block is provided with an upper mold slide groove, and the upper plate slide rail is inserted into the upper mold slide groove;

[0019] The upper forming plate is provided with a punch positioning groove, and a punch insertion hole is provided in the punch positioning groove. A punch is detachably connected to the punch positioning groove. The punch includes a punch insertion post, which is inserted into the punch insertion hole.

[0020] The upper mold base block is fitted with a mold locking strip, which enters from one side of the upper mold base block and is inserted together with the punch pin. The mold locking strip finally exits from the other side of the upper mold base block.

[0021] The locking insert protrudes from one end of the upper mold base block and connects to the locking nut.

[0022] Furthermore, the cover assembly includes a cover base;

[0023] The cover hot pressing component also includes a hot pressing cylinder, a hot pressing plate connected to the output end of the hot pressing cylinder, and a first spring connected to the hot pressing plate. The other end of the first spring is connected to the cover base.

[0024] The pressure-bearing component includes a pressure-bearing base, a second spring connected to the pressure-bearing base, a pressure-bearing bottom plate connected to the other end of the second spring, a pressure-bearing guide post connected to the lower end of the pressure-bearing bottom plate, and the pressure-bearing guide post being movably inserted into the pressure-bearing base.

[0025] Furthermore, the pressure-bearing base is connected to hot-pressing side limiting components on both sides. The hot-pressing side limiting components include hot-pressing limiting blocks. A hot-pressing limiting slide rod is provided on one side of the hot-pressing limiting block. The hot-pressing limiting block is rotatably connected to a hot-pressing limiting adjusting screw.

[0026] The hot-pressing limiting slide rod is slidably inserted into the pressure-bearing base, and the hot-pressing limiting adjusting screw is threadedly connected to the pressure-bearing base;

[0027] A cover roll transition shaft is provided on one side of the cover base.

[0028] Furthermore, a power assembly and an indium ingot loading platform are provided between the forming assembly and the cover assembly. On the side of the forming assembly away from the cover assembly, a film roll assembly, a transition shaft assembly, a tensioning assembly, and a preheating assembly are provided from far to near. On the side of the cover assembly away from the forming assembly, a power assembly and a receiving conveyor belt are provided from near to far.

[0029] Rolled PVC rigid sheets are mounted on the film roll assembly. After being pulled out, the PVC rigid sheets are fed into the preheating assembly through the transition shaft assembly and tensioning assembly. The preheating assembly heats the PVC rigid sheets to soften them. The softened PVC rigid sheets are then pressed into placement grooves by the forming assembly. Driven by the power assembly, the PVC rigid sheets with placement grooves pass through the indium ingot loading platform. A robot arm is positioned to the side of the indium ingot loading platform. The robot arm grabs the indium ingot and places it into the placement groove. The cover hot pressing component applies a layer of PVC soft sheet at the opening of the placement groove. The sealed indium ingot is pushed onto the receiving conveyor belt by the second set of power assemblies.

[0030] Furthermore, the membrane roll assembly includes a lever, the middle of which is rotatably connected to a lever support, one end of which is provided with a membrane roll placement groove, and a locking block is hinged to the side of the membrane roll placement groove, the locking block being connected to a locking bolt;

[0031] A force-applying rod is provided at the end of the lever away from the film roll placement slot;

[0032] A lever lifting cylinder is provided above the force-applying rod, and lifting positioning rods are provided on both sides of the lever lifting cylinder. The output end of the lever lifting cylinder is connected to a push plate.

[0033] When the lever lifting cylinder is pushed out, the push plate presses the force rod down, and the film roll placement slot at the other end of the lever rises.

[0034] The tensioning assembly includes a tensioning cylinder, the output end of which is connected to a tensioning shaft.

[0035] The preheating assembly includes a preheating frame connected to a first preheating belt, preheating lifting frames on both sides of the preheating frame, preheating lifting cylinders connected to the preheating lifting cylinders, and the output end of the preheating lifting cylinders connected to a second preheating belt.

[0036] Furthermore, the power assembly includes a power shaft, with power lifting seats connected to both ends of the power shaft. The power lifting seats are slidably connected to the power base. The power base is connected to a power lifting cylinder. The output end of the power lifting cylinder is connected to the power lifting seat. One end of the power shaft is also connected to a power motor.

[0037] The power base is rotatably connected to the power adaptation shaft.

[0038] Furthermore, the power adaptation shaft includes an adaptation base shaft, which includes a shaft core with end portions at both ends, and the diameter of the shaft core is smaller than the diameter of the end portions;

[0039] The outer periphery of the shaft core is surrounded by a changing shaft, and no less than two changing shafts form a circumference; the end of the changing shaft is provided with a pin hole and a connecting hole; the connecting hole and the pin hole are coaxially arranged, and the connecting hole is threadedly connected to a changing pin;

[0040] The replacement pin includes a threaded section and an insertion slide section. The threaded section is connected to the connecting hole, and the insertion slide section is inserted into the pin hole.

[0041] The indium ingot loading platform includes a platform base, and width adjustment blocks are provided on both sides above the platform base. The width adjustment blocks are connected to the platform base by fixing bolts.

[0042] Compared with the prior art, the present invention has the following beneficial effects:

[0043] 1. A molding component and a cover component are provided. The molding component presses out a placement groove from the PVC rigid sheet. The size of the placement groove is larger than the size of the indium ingot. Because the placement groove has a certain degree of hardness, it can protect the indium ingot from deformation or scratches when the packaged indium ingot is impacted or squeezed. The cover component seals the opening of the placement groove, so that the indium ingot is in a sealed space, preventing the indium ingot from being oxidized or reacting with other metals, thus ensuring the purity of the indium ingot.

[0044] 2. A membrane roll assembly is installed, which includes a lever. The rolled PVC rigid sheet is installed at one end of the lever, and a force-applying rod is installed at the other end of the lever. Since the rolled PVC rigid sheet is relatively heavy, during installation, the lever lifting cylinder can be retracted first. At this time, the end of the lever with the membrane roll placement slot can be easily pressed down by the operator. Then, the rolled PVC rigid sheet is pushed above the membrane roll placement slot, and then the output rod of the lever lifting cylinder is pushed out. The push plate presses down the force-applying rod, and the rolled PVC rigid sheet located at the other end of the lever is lifted, making it convenient to pull out the PVC rigid sheet when the equipment is used later.

[0045] 3. A power assembly is provided, which includes a power adaptation shaft. The outer diameter of the shaft core of the power adaptation shaft can be set by replacing it with a form change shaft of different outer diameter. Therefore, when the depth of the placement groove changes, a form change shaft of different outer diameter can be installed according to the depth of the placement groove, thus making the power assembly more adaptable. Attached Figure Description

[0046] The accompanying drawings are provided to further illustrate the invention and are used together with the embodiments of the invention to explain the invention. They do not constitute a limitation of the invention. In the drawings:

[0047] Figure 1 This is a schematic diagram of the overall automatic packaging equipment according to an embodiment of the present invention;

[0048] Figure 2 This is a side view of the automatic packaging equipment according to an embodiment of the present invention;

[0049] Figure 3 This is a schematic diagram of the first structure of the membrane roll assembly according to an embodiment of the present invention;

[0050] Figure 4 This is a schematic diagram of the second structure of the membrane roll assembly according to an embodiment of the present invention;

[0051] Figure 5 This is a schematic diagram of the explosion of the preheating component according to an embodiment of the present invention;

[0052] Figure 6 This is a schematic diagram of the molding component structure according to an embodiment of the present invention;

[0053] Figure 7 This is an exploded view of the molding component according to an embodiment of the present invention;

[0054] Figure 8 This is an exploded view of the bottom mold component according to an embodiment of the present invention;

[0055] Figure 9 This is an exploded view of the upper mold component according to an embodiment of the present invention;

[0056] Figure 10 This is a schematic diagram of the power component structure according to an embodiment of the present invention;

[0057] Figure 11 This is an exploded schematic diagram of the power component according to an embodiment of the present invention;

[0058] Figure 12 This is a perspective view of the dynamic adaptation axis according to an embodiment of the present invention;

[0059] Figure 13 This is an exploded schematic diagram of the indium ingot loading platform according to an embodiment of the present invention;

[0060] Figure 14 This is a schematic diagram of the cover component structure according to an embodiment of the present invention;

[0061] Figure 15 This is an exploded view of the cover component according to an embodiment of the present invention;

[0062] Figure 16 This is an exploded schematic diagram of the cover hot-pressing component and the pressure-bearing component according to an embodiment of the present invention;

[0063] Figure 17 This is a schematic diagram of the explosion of the pressure-bearing component according to an embodiment of the present invention.

[0064] In the diagram: 1. Membrane roll assembly; 101. Lever bracket; 102. Lever; 1021. Membrane roll placement slot; 1022. Locking block; 1023. Locking bolt; 1024. Force rod; 103. Lever lifting cylinder; 104. Lifting positioning rod; 105. Push plate; 2. Transition shaft assembly; 3. Tensioning assembly; 301. Tensioning cylinder; 302. Tensioning shaft; 4. Preheating assembly; 401. Preheating frame; 402. First preheating belt; 403. Preheating lifting frame; 404. Preheating lifting cylinder; 405. Second preheating belt; 5. Forming assembly; 501. Forming base; 5011. Support column; 502. Forming lifting cylinder; 503, Bottom mold component; 5031, Bottom mold base block; 503D, Limiting strip; 503E, Bottom mold slide rail; 503F, First side locking slide groove; 503G, Bottom mold lifting rail; 5032, Bottom mold changing block; 503A, Limiting groove; 503B, Slide groove; 503C, Second side locking slide groove; 503H, Forming die; 5033, Side locking block; 5034, Side locking bolt; 504, Forming upper plate; 5041, Upper plate slide rail; 505, Upper mold component; 5051, Upper mold base block; 505A, Upper mold slide groove; 505B, Upper mold insertion hole; 505C, Punch positioning groove; 505D, Punch insertion hole; 5052, Punch; 505E, Punch insert; 5053, Mold locking nut; 5054, Mold locking strip; 506, Mold locking bolt; 507, Adjusting shim; 508, Top nut; 6. Power assembly; 601, Power base; 602, Power lifting cylinder; 603, Power lifting seat; 604, Power shaft; 605, Power motor; 606, Power adaptation shaft; 6061, Adaptive base shaft; 606A, End; 606B, Shaft core; 606C, Connecting hole; 6062, Form changing shaft; 606D, Pin hole; 6063, Form changing pin; 606E, Threaded section; 606F, Insertion slide section; 7. Indium ingot loading platform; 701, Flat 702. Base plate; 703. Width adjustment block; 704. Fixing bolt; 8. Cover assembly; 805. Cover base; 806. Cover PVC roll; 807. Cover roll transition shaft; 808. Cover hot pressing component; 809. Hot pressing cylinder; 80002. First spring; 80003. Hot pressing plate; 80004. Hot pressing shape changing plate; 80007. Hot pressing side limiting component; 800071. Hot pressing limiting block; 800072. Hot pressing limiting slide bar; 800073. Hot pressing limiting adjusting screw; 80008. Pressure bearing component; 800081. Pressure bearing base; 800082. Second spring; 800083. Pressure bearing guide column; 800084. Pressure bearing base plate; 9. Receiving conveyor belt. Detailed Implementation

[0065] The preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0066] like Figures 1 to 17 An automatic packaging device for indium ingots is shown, used for sealing and packaging indium ingots. It includes a forming component 5 and a cover component 8. The forming component 5 includes a bottom mold component 503 and an upper mold component 505. When a PVC rigid sheet passes through the forming component 5, the bottom mold component 503 and the upper mold component 505 close, pressing a placement groove into the PVC rigid sheet. A robotic arm places the indium ingot into the placement groove, and the PVC rigid sheet, carrying the indium ingot, moves it to the cover component 8. The placement groove is larger than the indium ingot. Because the placement groove has a certain degree of hardness, it can protect the indium ingot from deformation or scratches when the packaged indium ingot is subjected to impact or compression. The cover component 8 is equipped with a cover PVC roll 802, and the PVC flexible sheet roll is placed on the cover PVC roll. At C-spindle 802, the cover assembly 8 is also provided with a cover hot pressing component 806. A pressure bearing component 808 is provided directly below the cover hot pressing component 806. The PVC soft sheet and the PVC rigid sheet with indium ingot overlap and pass through the space between the cover hot pressing component 806 and the pressure bearing component 808. The cover hot pressing component 806 includes a hot pressing plate 8063, which is detachably connected to a hot pressing forming plate 8064. When the hot pressing plate 8063 is powered on, it generates heat and transfers the heat to the hot pressing forming plate 8064. The hot pressing forming plate 8064 presses down to press the PVC soft sheet and the PVC rigid sheet with indium ingot together. The cover assembly 8 seals the opening of the placement groove, so that the indium ingot is in a sealed space, preventing the indium ingot from being oxidized or reacting with other metals, thus ensuring the purity of the indium ingot.

[0067] The bottom mold component 503 includes a bottom mold base block 5031 and a bottom mold changing block 5032; a bottom mold slide rail 503E is provided on the bottom mold base block 5031, a limit strip 503D is provided on one side of the bottom mold slide rail 503E, and a first side locking groove 503F is also provided at the end of the bottom mold base block 5031 away from the limit strip 503D; a slide groove 503B is provided at the lower end of the bottom mold changing block 5032, a limit groove 503A is provided at one end of the slide groove 503B, and a second side locking groove 503C is provided at the end of the bottom mold changing block 5032 away from the limit groove 503A; the slide groove 503B is slidably connected to the bottom mold slide rail 503E; the bottom mold base block 5031 includes a bottom mold base block 5031 and a bottom mold changing block 5032. When 31 coincides with the bottom mold changing block 5032, the limiting groove 503A and the limiting strip 503D are engaged. Therefore, the limiting groove 503A can prevent misalignment when the bottom mold base block 5031 and the bottom mold changing block 5032 are connected, so that the bottom mold base block 5031 and the bottom mold changing block 5032 can be quickly positioned when they are combined. The first side locking slide groove 503F coincides with the second side locking slide groove 503C. Both the first side locking slide groove 503F and the second side locking slide groove 503C are slidably connected to the side locking block 5033. The side locking block 5033 is connected to the bottom mold base block 5031 and the bottom mold changing block 5032 by the side locking bolt 5034. When the size of the indium ingot to be packaged changes, that is, the size of the placement groove needs to change, this can be achieved by replacing the bottom mold changing block 5032. First, remove the side retraction bolt 5034 connected to the bottom mold changing block 5032, loosen the side retraction bolt 5034 connected to the bottom mold base block 5031, and then move the side locking block 5033 towards the bottom mold base block 5031. When the side locking block 5033 no longer blocks the side of the bottom mold changing block 5032, the bottom mold changing block 5032 can be slid out from the side away from the limit strip 503D. Then, the new... The groove 503B of the bottom mold changing block 5032 is inserted into the bottom mold slide rail 503E. The new bottom mold changing block 5032 is pushed into the bottom mold base block 5031 until the limiting groove 503A and the limiting strip 503D are engaged. Then, the side locking block 5033 is pushed towards the bottom mold changing block 5032 to block the side of the bottom mold changing block 5032. Next, the side shrink bolt 5034 is passed through the side locking block 5033 and connected to the bottom mold changing block 5032, thus completing the process of changing the bottom mold changing block 5032. The whole process is simple to operate and can be quickly positioned, so it is very convenient for the operator.

[0068] The molding assembly 5 also includes a molding base 501, on which a support column 5011 is provided. A molding upper plate 504 and an adjusting shim 507 are inserted into the support column 5011. The uppermost end of the support column 5011 is connected to a top nut 508. When the thickness of the indium ingot changes, the depth of the placement groove changes, and the thickness of the bottom mold changing block 5032 also changes. Therefore, when the bottom mold changing block 5032 is lifted by the molding lifting cylinder 502, its maximum height will also change accordingly. At this time, by adjusting the position of the molding upper plate 504 and the adjusting shim 507, the height of the molding upper plate 504 can be set, thus enabling the molding assembly 5 to adapt to the packaging of indium ingots of different sizes.

[0069] The molding base 501 is connected to the molding lifting cylinder 502. The bottom mold base block 5031 is provided with a bottom mold lifting rail 503G at its lower end. The output end of the molding lifting cylinder 502 is connected to the bottom mold base block 5031. The bottom mold lifting rail 503G is movably inserted into the molding base 501. The molding lifting cylinder 502 pushes the bottom mold component 503 upward, so that the bottom mold component 503 and the upper mold component 505 are fitted together, thus pressing the PVC rigid sheet that has softened due to heat into the placement groove.

[0070] The upper mold component 505 is connected to the upper forming plate 504 via mold locking bolts 506; the lower end of the upper forming plate 504 is provided with an upper plate slide rail 5041; the upper mold component 505 includes an upper mold base block 5051, the upper mold base block 5051 is provided with an upper mold slide groove 505A, and the upper plate slide rail 5041 is inserted into the upper mold slide groove 505A; the upper forming plate 504 is provided with a punch positioning groove 505C, and a punch is provided in the punch positioning groove 505C. A punch 5052 is detachably connected to a die insertion hole 505D and a punch positioning groove 505C. The punch 5052 includes a punch insert 505E, which is inserted into the punch insertion hole 505D. A locking strip 5054 is inserted into the upper die base block 5051. The locking strip 5054 passes through one side of the upper die base block 5051 and is interlocked with the punch insert 505E. The locking strip 5054 finally exits from the upper die base block. The base block 5051 protrudes from the other side; the mold locking insert 5054 protrudes from one end of the upper mold base block 5051 and connects to the mold locking nut 5053. When replacing the punch 5052, the upper mold base block 5051 needs to be removed first. Simply loosen the mold locking bolt 506, and the upper mold component 505 can be pulled out along the upper plate slide rail 5041. Then, remove the mold locking nut 5053, pull out the mold locking insert 5054, and the punch 5052 can be removed from the upper mold base block. After removing the punch 5052 from the base block 5051 and replacing it with a new punch 5052, insert the locking strip 5054 into the upper die base block 5051. This allows the locking strip 5054 to connect the punch 5052 and the upper die base block 5051 together. This makes it very quick to replace the punch 5052, and one upper die base block 5051 can accommodate a variety of different punches 5052, making the upper die component 505 more adaptable and more flexible in use.

[0071] The cover assembly 8 includes a cover base 801; a cover roll transition shaft 804 is provided on one side of the cover base 801. The cover hot pressing component 806 also includes a hot pressing cylinder 8061, a hot pressing plate 8063 connected to the output end of the hot pressing cylinder 8061, and a first spring 8062 connected to the hot pressing plate 8063. The other end of the first spring 8062 is connected to the cover base 801; the first spring 8062 also plays a role in pulling and limiting the hot pressing plate 8063, and the first spring 8062 plays an auxiliary role when the hot pressing cylinder 8061 pulls up the hot pressing plate 8063.

[0072] The pressure-bearing component 808 includes a pressure-bearing base 8081, which is connected to a second spring 8082. The other end of the second spring 8082 is connected to a pressure-bearing base plate 8084, and the lower end of the pressure-bearing base plate 8084 is connected to a pressure-bearing guide post 8083. The pressure-bearing guide post 8083 is movably inserted into the pressure-bearing base 8081. When the hot-pressing plate 8064 hot-presses the PVC rigid sheet and PVC flexible sheet containing indium ingots, fusing them together at their contact points, the second spring 8082 is compressed downwards. At this time, the second spring 8082 exerts an upward pushing force on the PVC rigid sheet, making the PVC rigid sheet and PVC flexible sheet adhere more tightly and improving their bonding effect.

[0073] The pressure-bearing base 8081 is connected to hot-pressing side limiting components 807 on both sides. The hot-pressing side limiting components 807 include hot-pressing limiting blocks 8071. A hot-pressing limiting slide rod 8072 is provided on one side of the hot-pressing limiting block 8071. The hot-pressing limiting block 8071 is rotatably connected to a hot-pressing limiting adjusting screw 8073. The hot-pressing limiting slide rod 8072 is slidably inserted into the pressure-bearing base 8081, and the hot-pressing limiting adjusting screw 8073 is threadedly connected to the pressure-bearing base 8081. Rotating the hot-pressing limiting adjusting screw 8073 can adjust the position between the two hot-pressing limiting blocks 8071, thereby limiting all the PVC rigid sheets and PVC soft sheets with indium ingots in the middle, facilitating the alignment of their action directions, and resulting in a better sealing effect.

[0074] A power assembly 6 and an indium ingot loading platform 7 are arranged between the forming assembly 5 and the cover assembly 8. On the side of the forming assembly 5 away from the cover assembly 8, from far to near, are arranged a film roll assembly 1, a transition shaft assembly 2, a tensioning assembly 3, and a preheating assembly 4. On the side of the cover assembly 8 away from the forming assembly 5, from near to far, are arranged a power assembly 6 and a receiving conveyor belt 9. The rolled PVC rigid sheet is installed on the film roll assembly 1. After the PVC rigid sheet is pulled out, it is fed into the preheating assembly 4 through the transition shaft assembly 2 and the tensioning assembly 3. The preheating assembly 4 heats the PVC rigid sheet to soften it. The softened PVC rigid sheet is then pressed into a placement groove by the forming assembly 5. Driven by the power assembly 6, the PVC rigid sheet with the placement groove passes through the indium ingot loading platform 7. A robot arm is set to the side of the indium ingot loading platform 7. The robot arm grabs the indium ingot from the external positioning platform and puts it into the placement groove. The cover hot pressing component 806 presses a layer of PVC soft sheet at the opening of the placement groove. The packaged indium ingot is pushed onto the receiving conveyor belt 9 by the second set of power assemblies 6.

[0075] The indium ingot loading platform 7 includes a platform base 701, with width adjustment blocks 702 on both sides above the platform base 701. The width adjustment blocks 702 are connected to the platform base 701 by fixing bolts 703. When the PVC rigid sheet with the pressed-out placement groove arrives at the indium ingot loading platform 7, the width adjustment blocks 702 can limit its lateral position, making the positioning of the robot arm more accurate when placing the indium ingot.

[0076] The membrane roll assembly 1 includes a lever 102, which is rotatably connected to a lever bracket 101 at its center. One end of the lever 102 has a membrane roll placement slot 1021, and a locking block 1022 is hinged to the side of the slot. The locking block 1022 is connected to a locking bolt 1023. A force-applying rod 1024 is located at the end of the lever 102 away from the membrane roll placement slot 1021. A lever lifting cylinder 103 is located above the force-applying rod 1024, and lifting and positioning rods 104 are located on both sides of the lever lifting cylinder 103. The output end of the lever lifting cylinder 103 is connected to a push plate 105. Because the rolled PVC rigid sheet is relatively heavy, during installation… First, the lever lifting cylinder 103 can be retracted. At this time, the end of the lever 102 with the film roll placement groove 1021 can be easily pressed down by the operator. Then, the rolled PVC rigid sheet is pushed above the film roll placement groove 1021. Then, the output end of the lever lifting cylinder 103 is pushed out, and the push plate 105 presses down the force rod 1024. The film roll placement groove 1021 at the other end of the lever 102 rises. The rolled PVC rigid sheet at the other end of the lever will be lifted, making it convenient to pull out the PVC rigid sheet when the equipment is used later. The setting of the film roll assembly 1 makes it easier for the operator to replace the rolled PVC rigid sheet.

[0077] Tensioning assembly 3 includes tensioning cylinder 301. The output end of tensioning cylinder 301 is connected to tensioning shaft 302. After the PVC rigid sheet is pulled out and wound on the equipment, tensioning cylinder 301 pushes out tensioning shaft 302, which can tighten the PVC rigid sheet, making the positioning of the PVC rigid sheet more accurate during processing.

[0078] The preheating component 4 includes a preheating frame 401 connected to a first preheating belt 402. Preheating lifting frames 403 are located on both sides of the preheating frame 401, and preheating lifting cylinders 404 are connected to the preheating lifting cylinders 404. The output end of the preheating lifting cylinders 404 is connected to a second preheating belt 405. Heating components, such as electrically heated plates, are installed in both the first and second preheating belts 402 and 405. Therefore, both belt surfaces of the first and second preheating belts 402 and 405 have a certain amount of heat. When the PVC rigid sheet passes between the first and second preheating belts 402 and 405, it is quickly softened so that it can be pressurized and shaped when it reaches the molding component 5. Furthermore, after shaping by the molding component 5, the temperature of the PVC rigid sheet also decreases rapidly. Therefore, when the shaped PVC rigid sheet is transferred into the indium ingot, its temperature will not affect the stability of the ingot.

[0079] The power assembly 6 includes a power shaft 604, with power lifting seats 603 connected to both ends of the power shaft 604. The power lifting seats 603 are slidably connected to the power base 601. The power base 601 is connected to a power lifting cylinder 602. The output end of the power lifting cylinder 602 is connected to the power lifting seat 603. One end of the power shaft 604 is also connected to a power motor 605. The power base 601 is rotatably connected to a power adaptation shaft 606. The power adaptation shaft 606 includes an adaptation base shaft 6061, which includes a shaft core 606B. The shaft core 606B has end portions 606A at both ends, and the diameter of the shaft core 606B is smaller than the diameter of the end portions 606A. The outer circumference of the shaft core 606B is surrounded by a changing shaft 6062, with at least two changing shafts 6062 forming a circumference. The changing shaft 6062 has a pin hole 606D at one end and a connecting hole 606C at one end 606A. The connecting hole 606C is coaxial with the pin hole 606D and is threaded. There is a change-fit pin 6063; the change-fit pin 6063 includes a threaded section 606E and a sliding rod section 606F. The threaded section 606E is connected to the connecting hole 606C, and the sliding rod section 606F is inserted into the pin hole 606D. Therefore, when the depth of the placement groove changes, a change-fit shaft 6062 with a different outer diameter can be installed according to the depth of the placement groove, making the power assembly 6 more adaptable. When the change-fit shaft 6062 rotates, its outer circumference can always support the bottom of the placement groove, making the shape of the placement groove more stable.

[0080] Finally, it should be noted that the above are only preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. However, any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. An automatic packaging device for indium ingots, characterized in that, The assembly includes a molding component (5) and a cover component (8). The molding component (5) includes a bottom mold component (503) and an upper mold component (505). When the PVC rigid sheet passes through the molding component (5), the bottom mold component (503) and the upper mold component (505) close together, pressing a placement groove on the PVC rigid sheet. The robot puts the silver ingot into the placement groove, and the PVC rigid sheet moves with the indium ingot to the cover component (8). The cover assembly (8) is provided with a cover PVC roll (802), and a PVC film roll is provided at the cover PVC roll (802). The cover assembly (8) is also provided with a cover hot pressing component (806). A pressure bearing component (808) is provided directly below the cover hot pressing component (806). The PVC film and the PVC rigid film with indium ingot overlap and pass through the space between the cover hot pressing component (806) and the pressure bearing component (808). The cover hot pressing component (806) includes a hot pressing plate (8063), which is detachably connected to a hot pressing forming plate (8064). When the hot pressing plate (8063) is powered on, it generates heat and transfers the heat to the hot pressing forming plate (8064). The hot pressing forming plate (8064) presses down to press the PVC soft sheet and the PVC hard sheet with indium ingot together. The bottom mold component (503) includes a bottom mold base block (5031) and a bottom mold changing block (5032); The bottom mold base block (5031) is provided with a bottom mold slide rail (503E), a limit strip (503D) is provided on one side of the bottom mold slide rail (503E), and a first side locking groove (503F) is also provided at the end of the bottom mold base block (5031) away from the limit strip (503D). The bottom mold changing block (5032) is provided with a sliding groove (503B) at its lower end. One end of the sliding groove (503B) is provided with a limiting groove (503A). The bottom mold changing block (5032) is provided with a second side locking sliding groove (503C) at the end away from the limiting groove (503A). The slide groove (503B) is slidably connected to the bottom mold slide rail (503E); When the bottom mold base block (5031) and the bottom mold changing block (5032) overlap, the limiting groove (503A) and the limiting strip (503D) are engaged, and the first side locking groove (503F) and the second side locking groove (503C) overlap. The first side lock groove (503F) and the second side lock groove (503C) are both slidably connected to the side lock block (5033). The side lock block (5033) is connected to the bottom mold base block (5031) and the bottom mold changing block (5032) by the side lock bolt (5034). The molding component (5) also includes a molding base (501), on which a support column (5011) is provided. A molding upper plate (504) and an adjusting shim (507) are inserted into the support column (5011). The height of the molding upper plate (504) can be set by adjusting the position of the molding upper plate (504) and the adjusting shim (507). The top end of the support column (5011) is connected to the top nut (508). The upper mold component (505) and the upper forming plate (504) are connected by mold locking bolts (506); The molding base (501) is connected to the molding lifting cylinder (502), and the bottom mold base block (5031) is provided with a bottom mold lifting rail (503G) at the lower end. The output end of the molding lifting cylinder (502) is connected to the bottom mold base block (5031), and the bottom mold lifting rail (503G) is movably inserted into the molding base (501). The upper forming plate (504) is provided with an upper plate slide rail (5041) at its lower end. The upper mold component (505) includes an upper mold base block (5051), and the upper mold base block (5051) is provided with an upper mold slide groove (505A). The upper plate slide rail (5041) is inserted into the upper mold slide groove (505A). The upper forming plate (504) is provided with a punch positioning groove (505C), and a punch insertion hole (505D) is provided in the punch positioning groove (505C). A punch (5052) is detachably connected to the punch positioning groove (505C). The punch (5052) includes a punch insert (505E), which is inserted into the punch insertion hole (505D). The upper mold base block (5051) is fitted with a mold locking strip (5054). The mold locking strip (5054) is inserted from one side of the upper mold base block (5051), and the mold locking strip (5054) is inserted together with the punch pin (505E). Finally, the mold locking strip (5054) is inserted from the other side of the upper mold base block (5051). The locking insert (5054) extends out of the upper mold base block (5051) and is connected to the locking nut (5053).

2. The automatic packaging equipment for indium ingots according to claim 1, characterized in that, The cover assembly (8) includes a cover base (801); The cover hot pressing component (806) also includes a hot pressing cylinder (8061), a hot pressing plate (8063) connected to the output end of the hot pressing cylinder (8061), and a first spring (8062) connected to the hot pressing plate (8063). The other end of the first spring (8062) is connected to the cover base (801). The pressure-bearing component (808) includes a pressure-bearing base (8081), which is connected to a second spring (8082). The other end of the second spring (8082) is connected to a pressure-bearing base plate (8084), and the lower end of the pressure-bearing base plate (8084) is connected to a pressure-bearing guide post (8083). The pressure-bearing guide post (8083) is movably inserted into the pressure-bearing base (8081).

3. The automatic packaging equipment for indium ingots according to claim 2, characterized in that, The pressure-bearing base (8081) is connected to hot-pressing side limiting components (807) on both sides. The hot-pressing side limiting components (807) include hot-pressing limiting blocks (8071). A hot-pressing limiting slide rod (8072) is provided on one side of the hot-pressing limiting block (8071). A hot-pressing limiting adjusting screw (8073) is rotatably connected to the hot-pressing limiting block (8071). The hot-pressing limiting slide bar (8072) is slidably inserted into the pressure-bearing base (8081), and the hot-pressing limiting adjusting screw (8073) is threadedly connected to the pressure-bearing base (8081); A cover roll transition shaft (804) is provided on one side of the cover base (801).

4. The automatic packaging equipment for indium ingots according to any one of claims 1 to 3, characterized in that, A power assembly (6) and an indium ingot loading platform (7) are provided between the forming assembly (5) and the cover assembly (8). On the side of the forming assembly (5) away from the cover assembly (8), a film roll assembly (1), a transition shaft assembly (2), a tensioning assembly (3), and a preheating assembly (4) are provided from far to near. On the side of the cover assembly (8) away from the forming assembly (5), a power assembly (6) and a receiving conveyor belt (9) are provided from near to far. The rolled PVC rigid sheet is installed on the film roll assembly (1). After the PVC rigid sheet is pulled out, it is fed into the preheating assembly (4) through the transition shaft assembly (2) and the tensioning assembly (3). The preheating assembly (4) heats the PVC rigid sheet to make it soft. The softened PVC rigid sheet is then pressed out of the placement groove by the forming assembly (5). Driven by the power assembly (6), the PVC rigid sheet with the placement groove passes through the indium ingot loading platform (7). The robot is set on the side of the indium ingot loading platform (7). The robot grabs the indium ingot and puts it into the placement groove. The cover hot pressing component (806) presses a layer of PVC soft sheet at the opening of the placement groove. The packaged indium ingot is pushed onto the receiving conveyor belt (9) by the second set of power assemblies (6).

5. The automatic packaging equipment for indium ingots according to claim 4, characterized in that, The membrane roll assembly (1) includes a lever (102), the middle part of which is rotatably connected to a lever bracket (101), and a membrane roll placement groove (1021) is provided at one end of the lever (102). A locking block (1022) is hinged to the side of the membrane roll placement groove (1021), and the locking block (1022) is connected to a locking bolt (1023). A force-applying rod (1024) is provided at the end of the lever (102) away from the film roll placement groove (1021). A lever lifting cylinder (103) is provided above the force-applying rod (1024), and lifting positioning rods (104) are provided on both sides of the lever lifting cylinder (103). The output end of the lever lifting cylinder (103) is connected to a push plate (105). When the lever lifting cylinder (103) is pushed out, the push plate (105) presses the force rod (1024) down, and the film roll placement groove (1021) at the other end of the lever (102) rises. The tensioning assembly (3) includes a tensioning cylinder (301), the output end of which is connected to a tensioning shaft (302); The preheating component (4) includes a preheating frame (401), which is connected to a first preheating belt (402). Preheating lifting frames (403) are provided on both sides of the preheating frame (401), which are connected to a preheating lifting cylinder (404). The output end of the preheating lifting cylinder (404) is connected to a second preheating belt (405).

6. The automatic packaging equipment for indium ingots according to claim 5, characterized in that, The power assembly (6) includes a power shaft (604), with power lifting seats (603) connected to both ends of the power shaft (604). The power lifting seats (603) are slidably connected to the power base (601). The power base (601) is connected to the power lifting cylinder (602). The output end of the power lifting cylinder (602) is connected to the power lifting seat (603). One end of the power shaft (604) is also connected to the power motor (605). The power base (601) is rotatably connected to the power adaptation shaft (606).

7. The automatic packaging equipment for indium ingots according to claim 6, characterized in that, The power adaptation shaft (606) includes an adaptation base shaft (6061), the adaptation base shaft (6061) includes a shaft core (606B), and the shaft core (606B) has end portions (606A) at both ends. The diameter of the shaft core (606B) is smaller than the diameter of the end portions (606A). The outer periphery of the shaft core (606B) is surrounded by a changing shaft (6062), and no less than two changing shafts (6062) form a circumference; the end of the changing shaft (6062) is provided with a pin hole (606D), and the end (606A) is provided with a connecting hole (606C); the connecting hole (606C) and the pin hole (606D) are coaxially arranged, and the connecting hole (606C) is threadedly connected with a changing pin (6063). The replacement pin (6063) includes a threaded section (606E) and a sliding rod section (606F). The threaded section (606E) is connected to the connecting hole (606C), and the sliding rod section (606F) is inserted into the pin hole (606D). The indium ingot loading platform (7) includes a platform base (701), and width adjustment blocks (702) are provided on both sides above the platform base (701). The width adjustment blocks (702) are connected to the platform base (701) by fixing bolts (703).

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