Large-size glass substrate breaking method, breaking equipment and production line

Abstract

The invention provides a large-size glass substrate breaking method, breaking equipment and a production line. The method comprises the steps that a glass substrate is vertically conveyed in a suspended mode through a conveying assembly; when the glass substrate enters the breaking area, the pressing and fixing assembly and the supporting assembly are used for getting close to the glass substrate from the front face and the back face respectively, and the glass substrate is clamped and positioned with a preset clamping gap; a cutting-up assembly is used for longitudinally cutting up the glass substrate on the front face of the glass substrate, the outer side of the pressing and fixing assembly and the opposite side of the supporting assembly, and a pre-breaking-off lineation line is formed; the cutting assembly is removed, the breaking assembly is controlled to be close to the glass substrate, the two sides of the glass substrate are grabbed, and the glass substrate is broken towards the back face along the pre-breaking line; and the pressing and fixing assembly and the supporting assembly are removed, and the broken glass substrate continues to be vertically output. The problem that the breaking rate of the large-size glass substrate is high is solved, the breaking quality is improved, the process time is shortened, and the production efficiency is improved.

Description

Technical Field

[0001] The present application relates to the technical field of glass substrate production, and in particular to a method, a breaking device and a production line for breaking a large-size glass substrate. Background Art

[0002] Glass substrates, such as liquid crystal glass substrates, are usually produced by float or overflow methods to produce larger glass raw material strips, and then the ear material area and invalid area of ​​the glass raw material strip need to be broken off and removed to finally form a glass substrate product of the required size.

[0003] With the upgrading of the liquid crystal industry, the production generation of liquid crystal glass substrates has also been gradually updated. The size of high-generation liquid crystal glass substrates is huge, and the width is usually more than 2.1m. Therefore, the quality fluctuation of the glass substrate is significantly amplified, resulting in a significant increase in the probability of poor cutting of the glass substrate due to micro-deformation during the breaking process, and the resulting waste of raw materials and delays in construction are costly. In the existing glass substrate breaking production process (such as Chinese patent CN115432918A, a workbench based on glass substrate cutting and breaking), the breaking process is arranged unreasonably, the glass substrate is placed on the workbench, and is always subjected to adsorption, causing the glass substrate to be subjected to multiple groups of forces at the same time during the scratching stage of the breaking process, resulting in an increase in local force and abnormal curvature, resulting in a high rate of poor breakage. At the same time, the efficiency of the existing breaking process is also low, and the unreasonable processes such as the adsorption component and the scribing component make them easily interfere with each other. Therefore, it is necessary to adapt its breaking process according to the size changes of today's glass substrates. Summary of the invention

[0004] The present application provides a large-size glass substrate breaking method, breaking equipment and production line to solve the problems of high breakage rate and low process efficiency in the glass substrate breaking process in the prior art.

[0005] According to a large-size glass substrate breaking method provided in the present application, the width of the glass substrate is more than 2.5m and the thickness is 0.4-0.7mm. The method comprises:

[0006] S10, using a transmission component to vertically transmit the glass substrate in mid-air;

[0007] S20, when the glass substrate enters the breaking area, using a pressing assembly and a supporting assembly to approach the glass substrate from the front and back sides respectively, and clamping and positioning the glass substrate with a preset clamping gap;

[0008] S30, on the front side of the glass substrate, located outside the pressing assembly and on the opposite side of the supporting assembly, use a scribing assembly to longitudinally scribble the glass substrate to form a pre-breaking scribing line;

[0009] S40, removing the scribing assembly, and controlling the breaking assembly to approach the glass substrate, grabbing both sides of the glass substrate, and breaking the glass substrate toward the back side along the pre-breaking scribing line;

[0010] S50, removing the pressing assembly and the supporting assembly, and outputting the broken glass substrate vertically.

[0011] In some embodiments, the method further comprises:

[0012] Before step S20, the flatness information of the glass substrate is obtained, and according to the flatness information, the preset clamping gap d between the pressing assembly and the supporting assembly is adjusted: d=1.7h+t, wherein h is the thickness of the glass substrate, and t is the flatness parameter of the glass substrate.

[0013] In some embodiments, in step S20, the support component is a support plate, the pressing component is a pressing plate, the surfaces of the support plate and the pressing plate are both provided with silicone rubber, and the edge of the support surface of the support plate is provided in a chamfered form.

[0014] In some embodiments, in step S30, the cutting component is an adaptive elastic cutting knife, and the elastic force of the adaptive elastic cutting knife is set to make the depth of the pre-breaking line be 1 / 10 to 1 / 9 of the thickness of the glass substrate.

[0015] In some embodiments, the adaptive elastic cutting knife includes a 3.5 mm*0.8 mm cutting wheel, which cuts toward the glass substrate at an angle of 105-120 degrees to form a pre-breaking line.

[0016] In some embodiments, the cutter wheel is mounted on a spring or a compression cylinder with pre-adjustable pressure to maintain a desired elastic force.

[0017] In some embodiments, in step S40, the breaking component is a suction mechanism, and the suction mechanism approaches, suctions, and breaks the glass substrate from the back side of the glass substrate.

[0018] In some embodiments, the adsorption mechanism includes: a suction cup frame and a rotating cylinder, the suction cup frame is provided with a suction cup group arranged in a vertical direction; the rotating cylinder is connected to the suction cup frame, and the adsorption and grasping action of the suction cup group and the rotation action of the rotating cylinder are continuous without delay.

[0019] According to another aspect of the present application, a large-size glass substrate breaking device is provided, wherein the width of the glass substrate is greater than 2.5 mm and the thickness is between 0.4 mm and 0.7 mm. The large-size glass substrate breaking device comprises:

[0020] A transmission component, used for vertically suspending and transmitting the glass substrate;

[0021] The pressing assembly and the supporting assembly are used to approach the glass substrate from the front and back sides respectively when the glass substrate enters the breaking area, and clamp and position the glass substrate with a preset clamping gap;

[0022] A scribing assembly is used to scribble the glass substrate longitudinally on the front side of the glass substrate, outside the pressing assembly and on the opposite side of the supporting assembly, to form a pre-breaking scribing line;

[0023] A breaking component is used to approach the glass substrate when the scribing component is removed, grasp the two sides of the glass substrate, and break the glass substrate toward the back along the pre-breaking scribing line;

[0024] The control component is used to connect the transmission component, the pressing component, the supporting component, the cutting component and the breaking component to control the working sequence of each component.

[0025] According to another aspect of the present application, a large-size glass substrate production line is provided, wherein the width of the glass substrate is greater than 2.5 m and the thickness is 0.4-0.7 mm. The large-size glass substrate production line comprises: the large-size glass substrate breaking device as described above.

[0026] By applying the technical solution of the present application, the breaking operation is performed when the glass substrate is vertically suspended and transmitted. The gravity line is in line with the glass substrate, so the curvature of the glass is not affected, and it is easy to scribe and break. In addition, the scribing action of the glass substrate in the present application is performed before the adsorption and grasping action, relying on the large-size self-weight stabilizing effect of the glass substrate to assist in positioning the glass substrate, thereby reducing the amount of external force applied to the glass substrate during cutting, thereby avoiding the problem of abnormal local bending of the glass substrate due to multi-point force, significantly reducing the probability of the glass substrate being broken during the scribe process, and improving the breaking quality. At the same time, since the scribe action of the present method is performed before the adsorption action, the scribe component does not need to waste time waiting for the breaking component to recover stability after touching the glass substrate, thereby improving the feed speed, and the scribe action is no longer interspersed between the subsequent adsorption action and the breaking action of the breaking component, so it can be performed continuously, saving the overall reaction time of the breaking action, and improving the process beat and production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0028] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0029] Figure 1A schematic diagram showing the process of a method for breaking a large-size glass substrate according to an embodiment of the present application is shown;

[0030] Figure 2 A schematic diagram showing the quality fluctuation deformation types of existing large-size glass substrates is shown;

[0031] Figure 3 A schematic diagram showing the force on a glass substrate in a slicing process of a large-size glass substrate breaking method according to an embodiment of the present application is shown;

[0032] Figure 4 A schematic diagram showing the force acting on a glass substrate in a breaking process of a large-size glass substrate breaking method according to an embodiment of the present application is shown;

[0033] Figure 5 A schematic diagram showing the actual working process of the method for breaking a large-size glass substrate according to an embodiment of the present application is shown;

[0034] Figure 6 A schematic structural diagram of a large-size glass substrate breaking device according to an embodiment of the present application is shown.

[0035] The above drawings include the following reference numerals:

[0036] 100, glass substrate; 101, pre-breaking scribing line; 210, transmission component; 220, pressing component; 230, support component; 240, dicing component; 250, breaking component; 260, control component. DETAILED DESCRIPTION

[0037] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0038] It should be noted that the following detailed descriptions are illustrative and are intended to provide further explanation of the present application. Unless otherwise specified, all technical and scientific terms used herein have the same meanings as those commonly understood by those skilled in the art to which the present application belongs.

[0039] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" may include both "above" and "below". The device may also be positioned in other different ways, rotated 90 degrees or in other orientations, and the spatially relative descriptions used herein are interpreted accordingly.

[0040] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0041] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein, for example. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0042] like Figures 1 to 5As shown, the present application discloses a method for breaking a large-sized glass substrate. The width of the glass substrate 100 to be broken is more than 2.5m, and the thickness is 0.4-0.7mm. Under the current breaking process, the glass substrate 100 of this size is subjected to multiple external forces such as adsorption force, cutting force and even breaking force when the surface is cut, resulting in complex stress in the plate, uneven local stress, and micro-deformation amplification effect after the size is enlarged, which leads to abnormal bending moment in the ear area during cutting, resulting in frequent breakage during the cutting process, and the resulting cost waste and delays are expensive. Therefore, the present application proposes a breaking method suitable for large-sized glass substrates to solve the problem of glass substrate breakage during cutting and improve the breaking yield.

[0043] like Figure 1 As shown, the present application proposes a method for breaking a large-size glass substrate, the method comprising: step S10, using the transmission component 210 to vertically suspend and transfer the glass substrate 100. Step S20, when the glass substrate 100 enters the breaking area, the pressing component 220 and the supporting component 230 are used to approach the glass substrate 100 from the front and back, respectively, and the glass substrate 100 is clamped and positioned with a preset clamping gap. Step S30, on the front side of the glass substrate 100, located on the outside of the pressing component 220 and the opposite side of the supporting component 230, the glass substrate 100 is longitudinally cut using the cutting component 240 to form a pre-breaking line 101. Step S40, remove the cutting component 240, and control the breaking component 250 to approach the glass substrate 100, grab the two sides of the glass substrate 100, and break the glass substrate 100 toward the back along the pre-breaking line 101. Step S50 , removing the pressing assembly 220 and the supporting assembly 230 , and outputting the broken glass substrate 100 vertically.

[0044] Through the above technical means, in the breaking method of the embodiment of the present application, the breaking operation is performed when the glass substrate 100 is vertically suspended and transmitted, and the gravity line is colinear with the glass substrate 100, so it does not affect the curvature of the glass, and it is easy to perform the marking and breaking operation. In addition, the marking action in the present application occurs before the adsorption and grasping action, relying on the large size of the glass substrate and the pressure to position the glass substrate, reducing the amount of external force on the edge ear area when the glass substrate is cut, thereby avoiding the problem of abnormal local bending moment caused by multiple points of force on the glass substrate, significantly reducing the probability of glass substrate being broken due to micro-deformation and stress concentration during the cutting process, and improving the breaking quality. At the same time, since the cutting action of the present method is performed before the adsorption action, the cutting component does not need to wait for the breaking component to recover stability after touching the glass substrate 100, so the feed speed is improved, and the subsequent adsorption action and breaking action of the breaking component itself are no longer interspersed with the cutting action, so it can be performed continuously, saving the overall reaction time of the breaking action, and significantly improving the process beat and production efficiency.

[0045] refer to Figure 2 and Figure 3 As shown in FIG. 1 , since the quality fluctuations in the glass substrate 100 during the production process are inevitable, micro-deformation problems are common. Figure 2 As shown in the figure, from left to right, the B-bend, A-bend, S-bend, local convexity and local concave deformation of the glass substrate 100 are respectively shown. In the traditional cutting and breaking process, the edge ear area (i.e. Figure 3 C zone), and then the slicing operation is performed, and finally the breaking operation is performed along the scribe line. However, such a process arrangement cannot adapt to the above-mentioned quality fluctuations of the large-sized glass substrate 100. Because, for low-generation glass substrates 100, such as G4.5 (Generation 4.5) generation glass substrates 100, the size is within one meter square (730mm*920mm), and the quality fluctuation within the glass substrate surface at this size is not obvious, so the overall flatness within the surface is relatively high, and the above process will not cause significant stress uneven breakage problems. For the large-sized high-generation glass substrates (such as G8.5 and above) targeted by the present application, the size width even reaches more than 2.5m, so the size amplification effect of the quality fluctuation is obvious, and the flatness difference within the entire surface becomes larger. At this time, under the simultaneous action of multiple external forces, the edge deformation of the glass substrate 100 is uncontrollable, so the bending moment is abnormal and stress concentration conditions occur frequently, and it is easy to break when cutting and scribbling, resulting in reduced cutting adaptability under traditional processes and the breaking yield cannot meet the standards. Reference Figure 3 As shown, the present application advances the scribing action to before the adsorption breaking action through the above method embodiment, so that during scribing and cutting, in the ear material area (i.e. Figure 3 The glass substrate 100 in area C shown in the figure is only subjected to scribing pressure but not adsorption pressure, which reduces the interference of adsorption force, makes it easier to disperse the stress in the glass substrate 100, reduces stress concentration, and significantly improves the breaking yield, thereby improving the cutting adaptability and being more compatible with large-size glass substrates 100.

[0046] Continue to refer Figure 3As shown, area A of the glass substrate 100 is an effective area, which is the effective part of the final production of the display screen and needs to be retained. Area B outside area A is an invalid area, which is retained in the breaking process, but needs to be cut and peeled in the subsequent process. The pressing component 220 of the present application is pressed in the invalid area B, which can protect the quality of the final product of the glass substrate 100 and does not cause display damage defects. Among them, the clamping gap of the pressing component 220 pressed against the supporting component 230 is an adjustable value, which can be fine-tuned on a predetermined size according to the flatness information of the current glass substrate 100, so as to make it more adaptable to the quality fluctuations of each batch of glass substrates. Specifically, in some embodiments of the present application, the breaking method of the present application also includes: obtaining the flatness information of the glass substrate 100, and adjusting the preset clamping gap between the pressing component 220 and the supporting component 230 according to the flatness information. The specific method is to calculate the preset clamping gap d according to the following formula: d=1.7h+t, where h is the thickness of the glass substrate and t is the flatness parameter of the glass substrate. By obtaining the flatness information of the current glass substrate 100 and adjusting the preset clamping gap, fine-tuning can be better achieved. When the flatness of the glass is poor, the problem of excessive local stress caused by excessive squeezing and leveling can be reduced, thereby further avoiding the probability of glass substrate breakage. In the practice of the method of this application, taking a 0.5mm glass substrate as an example, in its breaking process, the usual preset clamping gap d will be fine-tuned to float around 1mm, which can not only meet the clamping and positioning needs of the breaking process, but also reduce the probability of breakage.

[0047] In some embodiments of the present application, Figure 3 and Figure 4 As shown, in step S20, the support assembly 230 is a support plate, and the pressing assembly 220 is a pressing plate. The surfaces of the support plate and the pressing plate are both provided with silicone rubber to protect the glass substrate 100 from damage. The pressing plate is divided into two parts, the left and right parts, which are pressed on the invalid area B on both sides of the effective area of ​​the glass substrate 100. Figure 4 As shown, the edge of the supporting surface of the supporting plate is set to be chamfered to adapt to the rotation and breaking operation of the glass substrate 100. The chamfer (i.e. point O) is used as the axis to facilitate the rotation and breaking of the glass substrate 100, thereby reducing the problem of the glass substrate 100 being broken or the breaking line being uneven due to being supported by sharp edges.

[0048] In some embodiments of the present application, in step S30, the cutting component 240 is an adaptive elastic cutting knife, which can adjust the force of cutting the glass substrate 100 through its own elastic structure, control the cutting depth, and avoid cutting too deep during the cutting process, causing the glass substrate 100 to break and fall prematurely. Among them, the elastic force of the adaptive elastic cutting knife is set to make the cutting depth of the pre-breaking line 101 1 / 10 to 1 / 9 of the thickness of the glass substrate 100. This cutting depth can not only meet the subsequent breaking needs, but also maintain sufficient connection force for the ear material area of ​​the glass substrate 100, so that it will not break and fall before adsorption, protecting the glass substrate 100 The breaking process is safe and reliable.

[0049] In some embodiments of the present application, specifically in the cutting process, the adaptive elastic cutting knife used includes a 3.5mm*0.8mm cutter wheel, which cuts toward the glass substrate 100 at an angle of 105-120°, thereby forming a pre-breaking score line 101. The 3.5mm*0.8mm cutter wheel size can adapt to the plate thickness of the large-size glass substrate 100, and the cutting angle of 105-120° can ensure that the size of the scoring wound is moderate, which meets the breaking requirements while facilitating the control of the cutting depth, thereby improving the scoring accuracy and improving the breaking quality.

[0050] In some embodiments of the present application, the cutter wheel used for cutting is installed on a spring or a compression cylinder with pre-adjustable pressure, so that the pressure can be easily adjusted to maintain the elastic force required for the cutter wheel to cut.

[0051] In some embodiments of the present application, in step S40, the breaking component 250 is a suction mechanism, and the suction mechanism approaches, suctions, and breaks the glass substrate 100 from the back of the glass substrate 100. Therefore, the slicing operation and suction operation of the present application occur on the front and back of the glass substrate 100, respectively, so that the upward paths of the slicing component 240 and the breaking component 250 do not interfere with each other, and the process actions can be seamlessly connected, thereby improving the production cycle and shortening the production time.

[0052] Specifically, in some embodiments of the present application, the adsorption mechanism includes: a suction cup frame and a rotating cylinder. The suction cup frame is provided with a suction cup group arranged in a vertical direction. The suction cup group can absorb the ear material area of ​​the cut glass substrate 100 at multiple points in the longitudinal direction, so as to accurately rotate and break it along the pre-breaking line 101. The rotating cylinder is connected to the suction cup frame and is used to drive the suction cup frame to rotate. Figure 4As shown, the ear material area of ​​the glass substrate 100 will rotate with the edge of the support plate as the axis under the drive of the suction cup frame, so as to be broken and separated along the pre-breaking line 101. In the embodiment of the present application, since there is no need to intersperse the cutting action, the adsorption action and the breaking action of the breaking component 250 can be more closely connected. In this embodiment, the adsorption and grasping action of the suction cup group and the rotation action of the rotating cylinder are set to be continuous without hysteresis, which can significantly improve the breaking efficiency.

[0053] Figure 5 The working process of the large-size glass substrate breaking method of the present application is schematically shown. Figure 5 It can be seen that, by applying the breaking method of this embodiment, during the cutting process, the ear area of ​​the glass substrate 100 is only scratched by the pressure of the cutting component 240, and its edge is free without the interference of the adsorption force, so the stress is dispersed and no abnormal bending moment is generated, so the probability of breakage during the scratching process is significantly reduced. At the same time, since the cutting action is no longer interspersed between the adsorption action and the breaking action, the retraction action of the cutting component 240 and the adsorption action of the breaking component 250 can be performed almost simultaneously, and the adsorption action and breaking action of the breaking component 250 itself can also be more continuous, thereby shortening the time of the breaking process as a whole and improving production efficiency.

[0054] According to another aspect, the present application also discloses a large-size glass substrate breaking device, wherein the width of the glass substrate 100 is greater than 2.5 mm and the thickness is between 0.4 and 0.7 mm. Figure 6 As shown, the large-size glass substrate breaking device includes: a transmission component 210, which is used to vertically suspend and transport the glass substrate 100. A pressing component 220 and a supporting component 230, which are used to approach the glass substrate 100 from the front and back sides respectively when the glass substrate 100 enters the breaking area, and clamp and position the glass substrate 100 with a preset clamping gap. A cutting component 240, which is used to longitudinally cut the glass substrate 100 on the front side of the glass substrate 100, located on the outside of the pressing component 220 and on the opposite side of the supporting component 230, to form a pre-breaking line 101. A breaking component 250, which is used to approach the glass substrate 100 when the cutting component 240 is removed, grab the two sides of the glass substrate 100, and break the glass substrate 100 toward the back along the pre-breaking line 101. The control component 260 is used to connect the transmission component 210, the pressing component 220, the supporting component 230, the cutting component 240 and the breaking component 250, control the working sequence of each component, and adjust its action parameters.

[0055] In some embodiments of the present application, the transmission component 210 is a conveyor belt, a clamping conveyor roller or other hoisting and transporting mechanism, which is used to realize the vertical suspended transmission of the glass substrate 100 so that it can smoothly enter the breaking area.

[0056] In some embodiments of the present application, the support component 230 is a support plate, and the pressing component 220 is a pressing plate. The surfaces of the support plate and the pressing plate are both provided with silicone rubber, and the edge of the support surface of the support plate is set to be chamfered to protect the safety of the glass substrate.

[0057] In some embodiments of the present application, the dicing assembly 240 is an adaptive elastic cutting knife, which includes a 3.5 mm*0.8 mm cutting wheel, which cuts toward the glass substrate 100 at an angle of 105-120° to form a pre-breaking scribe line 101. The cutting wheel is mounted on a spring or compression cylinder with pre-adjustable pressure to maintain the required elastic force.

[0058] In some embodiments of the present application, the adsorption mechanism includes: a suction cup frame and a rotating cylinder, the suction cup frame is provided with a suction cup group arranged in a vertical direction; the rotating cylinder is connected to the suction cup frame.

[0059] In some embodiments of the present application, the control component 260 sets the elastic force of the adaptive elastic cutter to make the depth of the pre-breaking line 101 1 / 10 to 1 / 9 of the thickness of the glass substrate 100. In addition, the control component 260 is also used to obtain the flatness information of the glass substrate 100, and adjust the preset clamping gap d between the pressing component 220 and the supporting component 230 according to the flatness information: d = 1.7h + t, where h is the thickness of the glass substrate and t is the flatness of the glass substrate. Again, the control component 260 controls the suction and grasping action of the suction cup group and the rotation action of the rotating cylinder to be continuous without hysteresis.

[0060] The present application also discloses a large-size glass substrate production line, in which the width of the glass substrate 100 is above 2.5m and the thickness is between 0.4 and 0.7mm. The large-size glass substrate production line includes: the large-size glass substrate breaking device as described above, which improves the breaking yield of the large-size glass substrate 100 and improves production efficiency by adjusting the breaking process action timing of the glass substrate 100.

[0061] In summary, the large-size glass substrate breaking method of the present application performs the breaking operation when the glass substrate is vertically suspended and transmitted according to the characteristics of the size change of the glass substrate. The gravity action line is colinear with the glass substrate, so it does not affect the curvature of the glass, and it is easy to scribe and break. In addition, the scribing action of the glass substrate in the present application is before the adsorption and grasping action, relying on the large-size self-weight stabilizing effect of the glass substrate to assist in positioning the glass substrate, thereby reducing the amount of external force applied to the glass substrate during cutting, thereby avoiding the problem of abnormal local bending of the glass substrate due to multi-point force, significantly reducing the probability of the glass substrate being broken during the scribe process, and improving the breaking quality. At the same time, since the scribe action of the present method is before the adsorption action, the scribe component does not need to waste time waiting for the breaking component to recover stability after touching the glass substrate, thereby improving the feed speed, and the scribe action is no longer interspersed between the subsequent adsorption action and the breaking action of the breaking component, so it can be performed continuously, saving the overall reaction time of the breaking action, and improving the process beat and production efficiency.

[0062] The above are only preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A method for breaking a large-size glass substrate, wherein the glass substrate (100) has a width of more than 2.5 m and a thickness of 0.4 to 0.7 mm, characterized in that: The method comprises: S10, using a transmission component (210) to vertically transmit the glass substrate (100) in mid-air; S20, when the glass substrate (100) enters the breaking area, using a pressing assembly (220) and a supporting assembly (230) to approach the glass substrate (100) from the front and back sides respectively, and clamping and positioning the glass substrate (100) with a preset clamping gap; S30, on the front side of the glass substrate (100), located on the outside of the pressing assembly (220) and on the opposite side of the supporting assembly (230), use a cutting assembly (240) to longitudinally cut the glass substrate (100) to form a pre-breaking line (101); S40, removing the scribing component (240), and controlling the breaking component (250) to approach the glass substrate (100), grasping both sides of the glass substrate (100), and breaking the glass substrate (100) toward the back side along the pre-breaking scribing line (101); S50, removing the pressing assembly (220) and the supporting assembly (230), and continuing to vertically output the broken glass substrate (100).

2. The method for breaking a large-size glass substrate according to claim 1, characterized in that: The method further comprises: Before step S20, the flatness information of the glass substrate (100) is obtained, and according to the flatness information, the preset clamping gap d between the pressing assembly (220) and the supporting assembly (230) is adjusted: d=1.7h+t, wherein h is the thickness of the glass substrate (100), and t is the flatness parameter of the glass substrate (100).

3. The method for breaking a large-size glass substrate according to claim 1, characterized in that: In step S20, the support component (230) is a support plate, the pressing component (220) is a pressing plate, the surfaces of the support plate and the pressing plate are both provided with silicone rubber, and the edge of the support surface of the support plate is provided in a chamfered form.

4. The method for breaking a large-size glass substrate according to claim 1, characterized in that: In step S30, the cutting component (240) is an adaptive elastic cutting knife, and the elastic force of the adaptive elastic cutting knife is set to ensure that the depth of the pre-breaking line (101) is 1 / 10 to 1 / 9 of the thickness of the glass substrate (100).

5. The method for breaking a large-size glass substrate according to claim 4, characterized in that: The adaptive elastic cutting knife comprises a 3.5 mm*0.8 mm cutting wheel, which cuts toward the glass substrate (100) at an angle of 105-120° to form the pre-breaking scoring line (101).

6. The method for breaking a large-size glass substrate according to claim 5, characterized in that: The cutter wheel is mounted on a spring or a compression cylinder with pre-adjustable pressure to maintain the required elastic force.

7. The method for breaking a large-size glass substrate according to claim 1, characterized in that: In step S40, the breaking component (250) is a suction mechanism, and the suction mechanism approaches, suctions, and breaks the glass substrate (100) from the back side of the glass substrate (100).

8. The method for breaking a large-size glass substrate according to claim 7, characterized in that: The adsorption mechanism comprises: a suction cup frame and a rotating cylinder, wherein the suction cup frame is provided with a suction cup group arranged in a vertical direction; the rotating cylinder is connected to the suction cup frame, and the adsorption and grasping action of the suction cup group and the rotation action of the rotating cylinder are continuous without hysteresis.

9. A large-size glass substrate breaking device, wherein the glass substrate (100) has a width of more than 2.5 m and a thickness of 0.4 to 0.7 mm, characterized in that: The large-size glass substrate breaking device comprises: A transmission component (210) is used to vertically transmit the glass substrate (100) in mid-air; A pressing assembly (220) and a supporting assembly (230) are used to approach the glass substrate (100) from the front and back sides respectively when the glass substrate (100) enters the breaking area, and to clamp and position the glass substrate (100) with a preset clamping gap; A scriber assembly (240) is used to longitudinally scribe the glass substrate (100) on the front side of the glass substrate (100), located on the outside of the pressing assembly (220) and on the opposite side of the supporting assembly (230), to form a pre-breaking scribe line (101); A breaking component (250) is used to approach the glass substrate (100) when the scribe component (240) is removed, grasp the two sides of the glass substrate (100), and break the glass substrate (100) toward the back along the pre-breaking scribe line (101); The control component (260) is used to connect the transmission component (210), the pressing component (220), the supporting component (230), the cutting component (240) and the breaking component (250) to control the working sequence of each component.

10. A large-size glass substrate production line, wherein the glass substrate (100) has a width of more than 2.5 m and a thickness of 0.4 to 0.7 mm, characterized in that: The large-size glass substrate production line comprises: the large-size glass substrate breaking device as claimed in claim 9.

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