Cationic polymer with multi-branched chain structure, preparation method of cationic polymer and circuit board charge hole-conditioning agent

Abstract

The invention provides a cationic polymer with a multi-branched chain structure, a preparation method of the cationic polymer and a circuit board charge pore-conditioning agent. The structural general formula of the cationic polymer with the multi-branched-chain structure is shown in the specification, and due to the star-shaped multi-branched-chain structure of the # imgabs0 # cationic polymer with the multi-branched-chain structure, more cationic groups and amido bond groups are distributed on the spatial structure of the cationic polymer with the multi-branched-chain structure; therefore, the cationic polymer with the multi-branched chain structure has the characteristics of high adsorption efficiency, stable structure and difficulty in degradation.

Description

Technical Field

[0001] The present disclosure relates to the technical field of circuit board production, and particularly to a cationic polymer with a multi-branched chain structure, a preparation method thereof, and a circuit board charge hole conditioner. Background Art

[0002] A printed circuit board (PCB) is abbreviated as PCB. Using a copper clad laminate as the raw material, the process generally includes processes such as blanking - routing - drilling - desmearing - hole metallization - pattern transfer - solder mask - electrical test - character - cutting and packaging to produce a qualified product. Among them, the hole metallization process is the basis for realizing the interconnection between layers of a multilayer board circuit. Hole metallization can be divided into two methods: electroless copper plating and direct electroplating. Whether using the method of electroless copper plating or direct electroplating, a cleaning hole conditioner containing a cationic polymer with a quaternary ammonium structure is required to chemically adjust the charge on the surface of the hole wall resin during the hole metallization process.

[0003] The purpose of chemical charge adjustment is to adjust the negative charge carried on the surfaces of the resin and glass fiber themselves to a positive charge as Figure 1 shown, so as to increase the adsorption of negatively charged active substances (palladium, carbon) on the hole wall in subsequent processes, reduce problems such as broken holes and open circuits, and improve the yield and reliability of the product. Common cationic regulators with a quaternary ammonium structure are mainly substances such as cationic polyacrylamide and cationic cellulose containing a quaternary ammonium structure.

[0004] In the charge conditioner, general or traditional commercial cationic high polymer molecules in the range of 0.5% - 10% are used. The hydrophilic - lipophilic balance value (HLB value) of the general polymer is fixed, and the cation density is fixed. There are problems such as a relatively high addition amount (about 2%), being easily washed away by water, and low adsorption efficiency. In addition, the molecular weight of the commercial cationic high polymer molecule is prone to degradation during long - term use in the production process, resulting in a decrease in the effect of adjusting the charge on the hole wall surface to a positive charge by the charge conditioner, and thus a problem that the adsorption effect of the hole wall on negatively charged active substances becomes poor after the hole conditioner adjusts the holes.

[0005] As disclosed in the comparative component CN201710938435.4, a cleaning and adjusting agent for PTH of printed circuit boards, the composition includes: 10 - 25% triethanolamine, 5 - 10% nonyl butyl capped polyoxyethylene ether (C9H19O(C2H4O)nC4H10, n = 10), 3 - 10% coconut oil alkanolamide phosphate salt (detergent 6503), 3 - 10% dimethyldiallylammonium chloride - acrylamide - acrylic acid copolymer (polyquaternium - 39), and the rest is pure water. For the dimethyldiallylammonium chloride - acrylamide - acrylic acid copolymer (polyquaternium - 39) in this solution, the adsorption efficiency is relatively low, the addition amount is relatively high, and its molecular weight degrades after long - term use. The effect of the charge adjusting agent in adjusting the charge on the pore wall surface to positive charge decreases, resulting in a poor effect of the printed circuit board pore wall in adsorbing negatively charged active substances. Summary of the Invention

[0006] The purpose of the present disclosure is to overcome the deficiencies in the prior art and provide a cationic polymer with a novel structure, high adsorption efficiency, stable molecular structure and not easily degradable multi - branched chain structure.

[0007] The purpose of the present disclosure is achieved through the following technical solutions:

[0008] A cationic polymer with a multi - branched chain structure, the structural general formula of the cationic polymer with a multi - branched chain structure is shown as follows,

[0009]

[0010] In one embodiment, M of the cationic polymer with a multi - branched chain structure is an integer from 4 to 6.

[0011] In one embodiment, n of the cationic polymer with a multi - branched chain structure is an integer from 300 to 500.

[0012] A preparation method of a cationic polymer with a multi - branched chain structure, used to prepare the cationic polymer with a multi - branched chain structure in any of the above - mentioned embodiments. The preparation method of the cationic polymer with a multi - branched chain structure includes the following steps:

[0013] Mix a dibasic acid and diethylenetriamine, and heat for reaction to obtain a long - branched chain polymer;

[0014] Add pentaerythritol to the long - branched chain polymer, mix and heat for reaction to obtain a star - branched polymer, and dissolve it in deionized water to obtain a star - branched polymer solution;

[0015] Add 3 - chloro - 2 - propyltrimethylammonium chloride to the star - branched polymer solution, mix and heat for reaction to obtain a cationic polymer with a multi - branched chain structure.

[0016] In one embodiment, a dibasic acid and diethylenetriamine are mixed and heated for reaction to obtain a long-chain branched polymer. The reaction formula is as follows:

[0017]

[0018] Pentaerythritol is added to the long-chain branched polymer and mixed, and then heated for reaction to obtain a star-branched polymer.

[0019]

[0020] 3-Chloro-2-propyltrimethylammonium chloride is added to the star-branched polymer solution and mixed, and then heated for reaction to obtain a cationic polymer with a multi-branched structure. The reaction formula is as follows:

[0021]

[0022] Among them, M of the long-chain branched polymer, the star-branched polymer, and the cationic polymer with a multi-branched structure is 4 - 6, and n is 300 - 500.

[0023] In one embodiment, the dibasic acid includes one of adipic acid, pimelic acid, and suberic acid.

[0024] A circuit board charge hole conditioner is prepared by using the cationic polymer with a multi-branched structure in any of the above embodiments. The circuit board charge hole conditioner includes the following components in parts by mass:

[0025] The cationic polymer with a multi-branched structure: 0.2 parts to 2 parts;

[0026] Water: 90 parts to 95 parts;

[0027] pH regulator: 3 parts to 10 parts.

[0028] In one embodiment, the pH regulator includes one of ethanolamine, diethanolamine, and triethanolamine.

[0029] In one embodiment, the circuit board charge hole conditioner further includes a surfactant.

[0030] In one embodiment, the surfactant includes at least one of OP wetting agent, Tween, and fatty alcohol polyoxyethylene ether.

[0031] Compared with the prior art, the present disclosure has at least the following advantages:

[0032] The above-mentioned cationic polymer with a multi-branched structure, its preparation method, and a circuit board charge hole conditioner. The star-shaped multi-branched structure of the cationic polymer with a multi-branched structure enables the cationic polymer with a multi-branched structure to have a relatively large number of amide bond groups and cationic groups distributed in space, enhancing the adsorption efficiency of the cationic polymer with a multi-branched structure; the molecules of the cationic polymer with a multi-branched structure form a three-dimensional network structure, and each branch of the cationic polymer with a multi-branched structure is distributed with amide bond groups and cationic groups, increasing the stability of the cationic polymer with a multi-branched structure, so that the cationic polymer with a multi-branched structure is not easily degraded.

[0033] The preparation method of the cationic polymer with a multi-branched structure is to synthesize the cationic polymer with a multi-branched structure by a three-step method in an arm-first and core-second manner. The synthesis process of the cationic polymer with a multi-branched structure is simple, and the length of the branches of the cationic polymer with a multi-branched structure is controllable during the synthesis process.

[0034] The functional groups on the branches of the cationic polymer with a multi-branched structure in the circuit board charge hole conditioner are relatively numerous, enabling the cationic polymer with a multi-branched structure to have good adsorption and stability, and reducing the addition amount of the cationic polymer with a multi-branched structure in the circuit board charge hole conditioner; the cationic polymer with a multi-branched structure in the circuit board charge hole conditioner is not easily degraded, making the circuit board charge hole conditioner have strong stability and durability; when the circuit board charge hole conditioner conditions the holes of the circuit board, the cationic polymer with a multi-branched structure has a good effect of adjusting the hole wall to a positive charge, thereby improving the adsorption of the hole wall of the circuit board to negatively charged active substances, reducing problems such as broken holes and open circuits, and further improving the yield and reliability of the circuit board. Description of the Drawings

[0035] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following will briefly introduce the drawings required for use in the embodiments. It should be understood that the following drawings only show some embodiments of the present disclosure, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0036] Figure 1 It is a schematic flow chart of the process of adjusting the negative charge on the circuit board surface to a positive charge;

[0037] Figure 2 It is a step flow chart of the preparation method of the cationic polymer with a multi-branched structure in an embodiment;

[0038] Figure 3 It is the infrared spectrogram and molecular weight distribution diagram of Examples 1-4;

[0039] Figure 4 andFigure 5 Backlight level diagrams for Examples 1-15;

[0040] Figure 6 Backlight level diagrams for Comparative Example 1 and Comparative Example 2;

[0041] Figure 7 Schematic diagram of the circuit board charge hole conditioner for Examples 1-12. Detailed implementation manners

[0042] To facilitate the understanding of the present disclosure, the present disclosure will be described more comprehensively below with reference to the relevant drawings. Preferred embodiments of the present disclosure are shown in the drawings. However, the present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided so that the disclosure of the present disclosure can be understood more thoroughly and comprehensively.

[0043] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there can also be a centered element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be a centered element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for illustrative purposes and do not represent the only embodiments.

[0044] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which this disclosure belongs. The terms used herein in the description of the present disclosure are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0045] To better understand the technical solutions and beneficial effects of the present disclosure, the present disclosure will be further described in detail below with specific embodiments:

[0046] It is a cationic polymer with a multi-branched structure according to an embodiment of the present invention. The structural general formula of the cationic polymer with the multi-branched structure is shown as follows,

[0047]

[0048] The above-mentioned cationic polymer with a multi-branched structure and the star-shaped multi-branched structure of the cationic polymer with a multi-branched structure enable the cationic polymer with a multi-branched structure to have more amide bond groups and cationic groups distributed in space, enhancing the adsorption efficiency of the cationic polymer with a multi-branched structure; the star-shaped multi-branched structure of the cationic polymer with a multi-branched structure enables the molecules to form a three-dimensional network structure, making the structure of the cationic polymer with a multi-branched structure stable. Each branch of the cationic polymer with a multi-branched structure is distributed with amide bond groups and cationic groups, increasing the stability of the cationic polymer with a multi-branched structure, so that the cationic polymer with a multi-branched structure is not easily degraded.

[0049] In one embodiment, M of the cationic polymer with a multi-branched structure is an integer from 4 to 6. In this embodiment, when the M value is greater than 6, the longer the polymerization monomer of the branch of the cationic polymer with a multi-branched structure, the larger the spatial structure of the formed cationic polymer with a multi-branched structure. The aperture of the electroplating plate has a certain size. When the aperture of the electroplating plate is small, the cationic polymer with a large spatial structure is not easily introduced into the small aperture; when the M value is less than 4, the polymerization monomer of the branch of the cationic polymer with a multi-branched structure is short, making the structure of the cationic polymer with a multi-branched structure small, and the amide bond groups and cationic groups are reduced, resulting in a decrease in the adsorption performance of the cationic polymer with a multi-branched structure.

[0050] In one embodiment, n of the cationic polymer with a multi-branched structure is an integer from 300 to 500. In this embodiment, the n value of the cationic polymer with a multi-branched structure also affects the length of the polymerization monomer of the branch of the cationic polymer with a multi-branched structure. When the n value is greater than 500, the polymerization monomer of the branch of the cationic polymer with a multi-branched structure is long, making the spatial structure of the formed cationic polymer with a multi-branched structure large. The aperture of the electroplating plate has a certain size. When the aperture of the electroplating plate is small, the cationic polymer with a large spatial structure is not easily introduced into the small aperture; when the n value is less than 300, the polymerization monomer of the branch of the cationic polymer with a multi-branched structure is short, making the structure of the cationic polymer with a multi-branched structure small, and the amide bond groups and cationic groups are reduced, resulting in a decrease in the adsorption performance of the cationic polymer with a multi-branched structure.

[0051] As Figure 2 shown, the present application also provides a method for preparing the cationic polymer with a multi-branched structure described in any of the above embodiments. The preparation method of the cationic polymer with a multi-branched structure includes the following steps:

[0052] S101 Mix a dibasic acid and diethylenetriamine, and heat for reaction to obtain a long-chain polymer;

[0053] In S103, pentaerythritol is added to the long-chain branched polymer and mixed, and then heated for reaction to obtain a star-branched polymer. Deionized water is added to dissolve it to obtain a star-branched polymer solution. Pentaerythritol is a polyol containing four hydroxyl groups, enabling pentaerythritol to react and connect with the long-chain branched polymer as the core part of the star polymer.

[0054] In S105, 3-chloro-2-propyltrimethylammonium chloride is added to the star-branched polymer solution and mixed, and then heated for reaction to obtain a cationic polymer with a multi-branched structure.

[0055] In this embodiment, a cationic polymer with a multi-branched structure is synthesized by a three-step method in the arm-first and core-second manner. First, a long-chain branched polymer is generated by the condensation reaction of a dibasic acid and diethylenetriamine. Then, the long-chain branched polymer is reacted with pentaerythritol, enabling the long-chain branched polymer to polymerize on pentaerythritol to form a star-branched polymer. The structure of the star-branched polymer is regular and small in volume. The star-branched polymer is reacted with 3-chloro-2-propyltrimethylammonium chloride, introducing 3-chloro-2-propyltrimethylammonium chloride cationic polymer groups onto the star-branched polymer.

[0056] For the above preparation method of the cationic polymer with a multi-branched structure, the cationic polymer with a multi-branched structure is synthesized by a three-step method in the arm-first and core-second manner. The synthesis process of the cationic polymer with a multi-branched structure is simple, and the branch length of the cationic polymer with a multi-branched structure can be controlled during the synthesis process; the cationic polymer with a multi-branched structure has a star-shaped multi-branched structure, enabling the cationic polymer with a multi-branched structure to have more amide bond groups and cationic groups distributed in space. When the amide bonds and cationic groups in one branch break, the amide bonds and cationic groups on other branches still maintain good adsorption properties and charge adjustment effects, thereby making the cationic polymer with a multi-branched structure have good stability and be not easily degraded.

[0057] In one embodiment, the dibasic acid and diethylenetriamine are mixed and heated for reaction to obtain a long-chain branched polymer. The heating temperature is 130°C - 170°C, and the reaction time is 2h - 8h. In this embodiment, by heating the mixed reactants to a temperature range of 130°C - 170°C, the reaction of the dibasic acid and diethylenetriamine can proceed smoothly. The longer reaction time makes the polymer chain of the long-chain branched polymer longer. By controlling the reaction time, the required polymer chain length of the long-chain branched polymer can be controlled.

[0058] In one embodiment, pentaerythritol is added to the long-chain branched polymer and mixed, and then heated for reaction to obtain a star-branched polymer. The heating temperature is 130°C - 170°C, and the reaction time is 1h - 3h. In this embodiment, the heating temperature for the reaction of adding pentaerythritol to the long-chain branched polymer and heating for reaction is the same as that for the reaction of mixing a dibasic acid and diethylenetriamine and heating for reaction, avoiding fluctuations caused by temperature differences in the two reaction processes, thereby making the output of the obtained star-branched polymer stable.

[0059] In one embodiment, 3-chloro-2-propyltrimethylammonium chloride is added to the star-branched polymer solution and mixed, and then heated for reaction. The heating temperature is 30°C - 80°C, and the reaction time is 1h - 3h. In this embodiment, the reaction temperature is relatively low, and the reaction conditions for adding 3-chloro-2-propyltrimethylammonium chloride to the star-branched polymer solution and reacting are simple, making the output of the obtained cationic polymer with a multi-branched structure stable.

[0060] Further, before adding pentaerythritol and continuing the reaction to obtain a star-branched polymer and adding deionized water for dissolution, the following steps are also included:

[0061] Cool down the star-branched polymer. In this embodiment, when the solution temperature of the star-branched polymer is relatively high and water is added, it is easy to boil and release steam, thereby increasing the pressure in the container, which affects the dissolution stability of the star-branched polymer and the operation safety. After cooling down and then adding it to the solution of the star-branched polymer, the star-branched polymer can be smoothly dissolved.

[0062] In one embodiment, a dibasic acid and diethylenetriamine are mixed and heated for reaction to obtain a long-chain branched polymer. The reaction formula is as follows.

[0063]

[0064] Pentaerythritol is added to the long-chain branched polymer and mixed, and then heated for reaction to obtain a star-branched polymer.

[0065]

[0066] 3-chloro-2-propyltrimethylammonium chloride is added to the star-branched polymer solution and mixed, and then heated for reaction to obtain a cationic polymer with a multi-branched structure. The reaction formula is as follows.

[0067]

[0068] Among them, M of the long-chain branched polymer, the star-branched polymer and the cationic polymer with a multi-branched structure is 4 - 6, and n is 300 - 500. In this embodiment, the obtained cationic polymer with a multi-branched structure can easily pass through the pore wall, and the amine bond groups and cationic groups of the cationic polymer with a multi-branched structure have a good effect on adjusting the charge of the pore wall.

[0069] In one embodiment, the dibasic acid includes one of adipic acid, pimelic acid and suberic acid. In this embodiment, adipic acid, pimelic acid and suberic acid all have two carboxyl groups and are all easy to react with diethylenetriamine to form long-chain branched polymers.

[0070] This application also provides a circuit board charge hole conditioner, which includes the following components in parts by mass:

[0071] Cationic polymer with a multi-branched structure 0.2 parts - 2 parts;

[0072] Water 90 parts - 95 parts;

[0073] pH regulator 3 parts - 10 parts.

[0074] For the above-mentioned circuit board charge hole conditioner, the functional groups on the branches of the cationic polymer with a multi-branched structure in the circuit board charge hole conditioner are numerous, so that the cationic polymer with a multi-branched structure has good adsorption and stability, and the addition amount of the cationic polymer with a multi-branched structure in the circuit board charge hole conditioner is small; the cationic polymer with a multi-branched structure in the circuit board charge hole conditioner is not easily degraded, so that the stability and durability of the circuit board charge hole conditioner are strong; when the circuit board charge hole conditioner is used for hole conditioning of the circuit board, the cationic polymer with a multi-branched structure has a good effect on adjusting the pore wall to a positive charge, thereby improving the adsorption of the pore wall of the circuit board to negatively charged active substances, reducing problems such as broken holes and open circuits, and further improving the yield and reliability of the circuit board.

[0075] In one embodiment, the pH regulator includes at least one of ethanolamine, diethanolamine and triethanolamine. In this embodiment, the pH regulator can adjust the solution acidity and alkalinity of the circuit board charge hole conditioner. The pH regulator also promotes the activation of the substrate surface and enhances the hole conditioning effect. Appropriate acidity and alkalinity help to maintain the stability of each component in the charge hole conditioner, prevent the solution from deteriorating or generating precipitation, and thus improve the solution stability.

[0076] In one embodiment, the circuit board charge hole conditioner further includes a surfactant. In this embodiment, due to the different materials of the board, when the wettability of water to the board is poor, a surfactant needs to be added to improve the wettability, so that the circuit board charge hole conditioner can be more evenly distributed on the substrate surface to improve the hole conditioning effect.

[0077] In one embodiment, the surfactant includes at least one of OP wetting agent, Tween, and fatty alcohol polyoxyethylene ether. Non-ionic surfactants do not ionize in water, and their hydrophilic groups are mainly composed of polar bonds such as ether bonds, ester bonds, amide bonds, etc., which increases the wettability between the circuit board charge hole conditioner and the substrate. Moreover, non-ionic surfactants have high stability in solution and are not easily affected by strong electrolytes, acids, and alkalis.

[0078] Compared with the prior art, the present disclosure has at least the following advantages:

[0079] The above-mentioned cationic polymer with a multi-branched structure, its preparation method, and the circuit board charge hole conditioner. The star-shaped multi-branched structure of the cationic polymer with a multi-branched structure enables the cationic polymer with a multi-branched structure to have more amide bond groups and cationic groups distributed in space, enhancing the adsorption efficiency of the cationic polymer with a multi-branched structure; the molecules of the cationic polymer with a multi-branched structure form a three-dimensional network structure, and each branch of the cationic polymer with a multi-branched structure is distributed with amide bond groups and cationic groups, increasing the stability of the cationic polymer with a multi-branched structure, so that the cationic polymer with a multi-branched structure is not easily degraded.

[0080] The preparation method of the cationic polymer with a multi-branched structure synthesizes the cationic polymer with a multi-branched structure by a three-step method in the order of arm first and core later. The synthesis process of the cationic polymer with a multi-branched structure is simple, and the branch length of the cationic polymer with a multi-branched structure is controllable during the synthesis process.

[0081] The cationic polymer with a multi-branched structure in the circuit board charge hole conditioner has many functional groups on its branches, making the cationic polymer with a multi-branched structure have good adsorption and stability, so that the addition amount of the cationic polymer with a multi-branched structure in the circuit board charge hole conditioner is less; the cationic polymer with a multi-branched structure in the circuit board charge hole conditioner is not easily degraded, making the circuit board charge hole conditioner have strong stability and durability; when the circuit board charge hole conditioner conditions the holes of the circuit board, the cationic polymer with a multi-branched structure has a good effect of adjusting the hole wall to a positive charge, thereby improving the adsorption of the hole wall of the circuit board to negatively charged active substances, reducing problems such as broken holes and open circuits, and further improving the yield and reliability of the circuit board.

[0082] The following are some specific examples. If % is mentioned, it means by weight percentage. It should be noted that the following examples do not exhaust all possible situations, and the materials used in the following examples can be obtained from commercial sources without special instructions.

[0083] Table 1 Raw material sources of the cationic polymer with a multi-branched structure

[0084] Raw material Reagent source Diethylenetriamine Macklin Reagent Co., Ltd. Adipic acid Macklin Reagent Co., Ltd. Pimelic acid Sinopharm Chemical Reagent Co., Ltd. Suberic acid Sinopharm Chemical Reagent Co., Ltd. 3-Chloro-2-propyltrimethylammonium chloride Aladdin Reagent Co., Ltd.

[0085] Example 1

[0086] In a 250 - milliliter three - necked flask, 73 g of adipic acid and 74 g of diethylenetriamine were weighed. It was heated to 160 °C and reacted for 5 h. Then, 0.3 g of pentaerythritol was added, and the reaction continued for 2 h. After the reaction ended and the temperature was lowered, 100 milliliters of deionized water was added to dissolve it, and it was fully dissolved for half an hour. It was cooled to 60 degrees Celsius, 70 g of 3 - chloro - 2 - propyltrimethylammonium chloride was added, and the reaction was carried out for 2 h to obtain a cationic polymer with a multi - branched structure. The infrared spectrum, molecular weight, and viscosity of the cationic polymer with a multi - branched structure were tested.

[0087] The cationic polymer with a multi - branched structure, water, and a pH regulator were stirred and mixed in a ratio of 1:92:7 to obtain a circuit board charge hole - forming agent; the storage stability test of the cationic polymer with a multi - branched structure was carried out on the obtained circuit board charge hole - forming agent; the chromatographic detection of the cationic group concentration and amide bond group concentration of the obtained circuit board charge hole - forming agent was carried out; the circuit board was hole - formed with the circuit board charge hole - forming agent, then micro - etched and activated, and the adsorption amount of palladium or carbon during activation was detected; after reduction and electroless copper plating, the backlight level of the circuit board was detected by observing through a backlight microscope.

[0088] Example 2

[0089] In a 250 - milliliter three - necked flask, 85 g of suberic acid and 74 g of diethylenetriamine were weighed. It was heated to 160 °C and reacted for 5 h. Then, 0.3 g of pentaerythritol was added, and the reaction continued for 2 h. After the reaction ended and the temperature was lowered, 100 milliliters of deionized water was added to dissolve it, and it was fully dissolved for half an hour. It was cooled to 60 degrees Celsius, 50 g of 3 - chloro - 2 - propyltrimethylammonium chloride was added, and the reaction was carried out for 2 h to obtain a cationic polymer with a multi - branched structure. The infrared spectrum, molecular weight, and viscosity of the cationic polymer with a multi - branched structure were tested.

[0090] The cationic polymer with a multi - branched structure, water, and a pH regulator were stirred and mixed in a ratio of 1:92:7 to obtain a circuit board charge hole - forming agent; the storage stability test of the cationic polymer with a multi - branched structure was carried out on the obtained circuit board charge hole - forming agent; the chromatographic detection of the cationic group concentration and amide bond group concentration of the obtained circuit board charge hole - forming agent was carried out; the circuit board was hole - formed with the circuit board charge hole - forming agent, then micro - etched and activated, and the adsorption amount of palladium or carbon during activation was detected; after reduction and electroless copper plating, the backlight level of the circuit board was detected by observing through a backlight microscope.

[0091] Example 3

[0092] In a 250 - milliliter three - necked flask, weigh 85 g of pimelic acid and 74 g of diethylenetriamine. Heat to 160 °C and react for 5 h. Then add 0.3 g of pentaerythritol and continue heating and reacting for 2 h. After the reaction ends and the temperature drops, add 100 milliliters of deionized water to dissolve, and fully dissolve for half an hour. Cool to 60 degrees Celsius, add 60 g of 3 - chloro - 2 - propyltrimethylammonium chloride, and react for 2 h to obtain a multi - branched - chain cationic polymer. Test the infrared spectrum, molecular weight, and viscosity of the multi - branched - chain cationic polymer.

[0093] Stir and mix the multi - branched - chain cationic polymer, water, and pH regulator in a ratio of 1:92:7 to obtain a circuit board charge hole - forming agent; conduct a storage stability test of the multi - branched - chain cationic polymer on the obtained circuit board charge hole - forming agent; perform chromatographic detection on the cationic group concentration and amide bond group concentration of the obtained circuit board charge hole - forming agent; use the circuit board charge hole - forming agent to form holes in the circuit board, then perform micro - etching and activation, and detect the adsorption amount of palladium or carbon during activation; after reduction and electroless copper plating, observe and detect the backlight level of the circuit board through a backlight microscope.

[0094] Example 4

[0095] In a 250 - milliliter three - necked flask, weigh 85 g of suberic acid and 74 g of diethylenetriamine. Heat to 160 °C and react for 5 h. Then add 0.5 g of pentaerythritol and continue heating and reacting for 2 h. After the reaction ends and the temperature drops, add 100 milliliters of deionized water to dissolve, and fully dissolve for half an hour. Cool to 60 degrees Celsius, add 80 g of 3 - chloro - 2 - propyltrimethylammonium chloride, and react for 2 h to obtain a multi - branched - chain cationic polymer. Test the infrared spectrum, molecular weight, and viscosity of the multi - branched - chain cationic polymer.

[0096] Stir and mix the multi - branched - chain cationic polymer, water, and pH regulator in a ratio of 1:92:7 to obtain a circuit board charge hole - forming agent; conduct a storage stability test of the multi - branched - chain cationic polymer on the obtained circuit board charge hole - forming agent; perform chromatographic detection on the cationic group concentration and amide bond group concentration of the obtained circuit board charge hole - forming agent; use the circuit board charge hole - forming agent to form holes in the circuit board, then perform micro - etching and activation, and detect the adsorption amount of palladium or carbon during activation; after reduction and electroless copper plating, observe and detect the backlight level of the circuit board through a backlight microscope.

[0097] Example 5

[0098] In a 250 - milliliter three - necked flask, weigh 73 g of adipic acid and 74 g of diethylenetriamine. Heat to 160 °C and react for 2 h. Then add 0.3 g of pentaerythritol and continue heating and reacting for 2 h. After the reaction ends and the temperature drops, add 100 milliliters of deionized water to dissolve and fully dissolve for half an hour. Cool to 60 degrees Celsius, add 70 g of 3 - chloro - 2 - propyltrimethylammonium chloride, react for 2 h to obtain a cationic polymer with a multi - branched structure. Test the infrared spectrum, molecular weight, and viscosity of the cationic polymer with a multi - branched structure.

[0099] Stir - mix the cationic polymer with a multi - branched structure, water, and a pH regulator in a ratio of 1:92:7 to obtain a circuit board charge hole - leveling agent; test the storage stability of the cationic polymer with a multi - branched structure in the obtained circuit board charge hole - leveling agent; conduct chromatographic detection on the concentration of cationic groups and amide - bond groups in the obtained circuit board charge hole - leveling agent; use the circuit board charge hole - leveling agent to level the holes of the circuit board, then perform micro - etching and activation, and detect the adsorption amount of palladium or carbon during activation; after reduction and electroless copper plating, observe and detect the backlight level of the circuit board through a backlight microscope.

[0100] Example 6

[0101] In a 250 - milliliter three - necked flask, weigh 73 g of adipic acid and 74 g of diethylenetriamine. Heat to 160 °C and react for 8 h. Then add 0.3 g of pentaerythritol and continue heating and reacting for 2 h. After the reaction ends and the temperature drops, add 100 milliliters of deionized water to dissolve and fully dissolve for half an hour. Cool to 60 degrees Celsius, add 70 g of 3 - chloro - 2 - propyltrimethylammonium chloride, react for 2 h to obtain a cationic polymer with a multi - branched structure. Test the infrared spectrum, molecular weight, and viscosity of the cationic polymer with a multi - branched structure.

[0102] Stir - mix the cationic polymer with a multi - branched structure, water, and a pH regulator in a ratio of 1:92:7 to obtain a circuit board charge hole - leveling agent; test the storage stability of the cationic polymer with a multi - branched structure in the obtained circuit board charge hole - leveling agent; conduct chromatographic detection on the concentration of cationic groups and amide - bond groups in the obtained circuit board charge hole - leveling agent; use the circuit board charge hole - leveling agent to level the holes of the circuit board, then perform micro - etching and activation, and detect the adsorption amount of palladium or carbon during activation; after reduction and electroless copper plating, observe and detect the backlight level of the circuit board through a backlight microscope.

[0103] Example 7

[0104] In a 250 mL three-necked flask, weigh 85 g of suberic acid and 74 g of diethylenetriamine, heat to 160 °C and react for 2 h. Then add 0.3 g of pentaerythritol and continue heating and reacting for 2 h. After the reaction is completed and cooled, add 100 mL of deionized water to dissolve, and fully dissolve for half an hour. Cool to 60 °C, add 50 g of 3-chloro-2-propyltrimethylammonium chloride, react for 2 h to obtain a multi-branched cationic polymer. Test the infrared spectrum, molecular weight and viscosity of the multi-branched cationic polymer.

[0105] Stir and mix the multi-branched cationic polymer, water and pH regulator in a ratio of 1:92:7 to obtain a circuit board charge hole conditioner; test the storage stability of the multi-branched cationic polymer in the obtained circuit board charge hole conditioner; conduct chromatographic detection on the cationic group concentration and amide bond group concentration of the obtained circuit board charge hole conditioner; use the circuit board charge hole conditioner to hole the circuit board, then perform micro-etching and activation, and detect the adsorption amount of palladium or carbon during activation; after reduction and electroless copper plating, observe and detect the backlight level of the circuit board through a backlight microscope.

[0106] Example 8

[0107] In a 250 mL three-necked flask, weigh 85 g of suberic acid and 74 g of diethylenetriamine, heat to 160 °C and react for 8 h. Then add 0.3 g of pentaerythritol and continue heating and reacting for 2 h. After the reaction is completed and cooled, add 100 mL of deionized water to dissolve, and fully dissolve for half an hour. Cool to 60 °C, add 50 g of 3-chloro-2-propyltrimethylammonium chloride, react for 2 h to obtain a multi-branched cationic polymer. Test the infrared spectrum, molecular weight and viscosity of the multi-branched cationic polymer.

[0108] Stir and mix the multi-branched cationic polymer, water and pH regulator in a ratio of 1:92:7 to obtain a circuit board charge hole conditioner; test the storage stability of the multi-branched cationic polymer in the obtained circuit board charge hole conditioner; conduct chromatographic detection on the cationic group concentration and amide bond group concentration of the obtained circuit board charge hole conditioner; use the circuit board charge hole conditioner to hole the circuit board, then perform micro-etching and activation, and detect the adsorption amount of palladium or carbon during activation; after reduction and electroless copper plating, observe and detect the backlight level of the circuit board through a backlight microscope.

[0109] Example 9

[0110] In a 250 - milliliter three - necked flask, weigh 85 g of pimelic acid and 74 g of diethylenetriamine. Heat to 160 °C and react for 2 h. Then add 0.3 g of pentaerythritol and continue heating and reacting for 2 h. After the reaction ends and the temperature drops, add 100 milliliters of deionized water to dissolve, and fully dissolve for half an hour. Cool to 60 degrees Celsius, add 60 g of 3 - chloro - 2 - propyltrimethylammonium chloride, react for 2 h to obtain a cationic polymer with a multi - branched structure. Test the infrared spectrum, molecular weight, and viscosity of the cationic polymer with a multi - branched structure.

[0111] Stir and mix the cationic polymer with a multi - branched structure, water, and a pH regulator in a ratio of 1:92:7 to obtain a circuit board charge hole - filling agent; conduct a storage stability test of the cationic polymer with a multi - branched structure on the obtained circuit board charge hole - filling agent; perform chromatographic detection on the cationic group concentration and amide bond group concentration of the obtained circuit board charge hole - filling agent; use the circuit board charge hole - filling agent to fill the holes of the circuit board, then perform micro - etching and activation, and detect the adsorption amount of palladium or carbon during activation; after reduction and electroless copper plating, observe and detect the backlight level of the circuit board through a backlight microscope.

[0112] Example 10

[0113] In a 250 - milliliter three - necked flask, weigh 85 g of pimelic acid and 74 g of diethylenetriamine. Heat to 160 °C and react for 8 h. Then add 0.3 g of pentaerythritol and continue heating and reacting for 2 h. After the reaction ends and the temperature drops, add 100 milliliters of deionized water to dissolve, and fully dissolve for half an hour. Cool to 60 degrees Celsius, add 60 g of 3 - chloro - 2 - propyltrimethylammonium chloride, react for 2 h to obtain a cationic polymer with a multi - branched structure. Test the infrared spectrum, molecular weight, and viscosity of the cationic polymer with a multi - branched structure.

[0114] Stir and mix the cationic polymer with a multi - branched structure, water, and a pH regulator in a ratio of 1:92:7 to obtain a circuit board charge hole - filling agent; conduct a storage stability test of the cationic polymer with a multi - branched structure on the obtained circuit board charge hole - filling agent; perform chromatographic detection on the cationic group concentration and amide bond group concentration of the obtained circuit board charge hole - filling agent; use the circuit board charge hole - filling agent to fill the holes of the circuit board, then perform micro - etching and activation, and detect the adsorption amount of palladium or carbon during activation; after reduction and electroless copper plating, observe and detect the backlight level of the circuit board through a backlight microscope.

[0115] Example 11

[0116] In a 250 - milliliter three - necked flask, weigh 73 g of adipic acid and 74 g of diethylenetriamine, heat to 160 °C and react for 5 h. Then add 0.3 g of pentaerythritol and continue heating and reacting for 2 h. After the reaction ends and the temperature drops, add 100 milliliters of deionized water to dissolve, and fully dissolve for half an hour. Cool to 60 °C, add 70 g of 3 - chloro - 2 - propyltrimethylammonium chloride, react for 2 h to obtain a cationic polymer with a multi - branched structure. Test the infrared spectrum, molecular weight and viscosity of the cationic polymer with a multi - branched structure.

[0117] Stir and mix the cationic polymer with a multi - branched structure, water, a pH regulator and surfactant OP - 10 in a ratio of 1:91:7:1 to obtain a circuit board charge hole - forming agent; test the storage stability of the cationic polymer with a multi - branched structure in the obtained circuit board charge hole - forming agent; perform chromatographic detection on the cationic group concentration and amide bond group concentration of the obtained circuit board charge hole - forming agent; use the circuit board charge hole - forming agent to form holes in the circuit board, then perform micro - etching and activation, and detect the adsorption amount of palladium or carbon during activation; after reduction and electroless copper plating, observe and detect the backlight level of the circuit board through a backlight microscope.

[0118] Example 12

[0119] In a 250 - milliliter three - necked flask, weigh 73 g of adipic acid and 74 g of diethylenetriamine, heat to 160 °C and react for 5 h. Then add 0.3 g of pentaerythritol and continue heating and reacting for 2 h. After the reaction ends and the temperature drops, add 100 milliliters of deionized water to dissolve, and fully dissolve for half an hour. Cool to 60 °C, add 70 g of 3 - chloro - 2 - propyltrimethylammonium chloride, react for 2 h to obtain a cationic polymer with a multi - branched structure. Test the infrared spectrum, molecular weight and viscosity of the cationic polymer with a multi - branched structure.

[0120] Stir and mix the cationic polymer with a multi - branched structure, water and a pH regulator in a ratio of 0.1:92.9:7 to obtain a circuit board charge hole - forming agent; test the storage stability of the cationic polymer with a multi - branched structure in the obtained circuit board charge hole - forming agent; perform chromatographic detection on the cationic group concentration and amide bond group concentration of the obtained circuit board charge hole - forming agent; use the circuit board charge hole - forming agent to form holes in the circuit board, then perform micro - etching and activation, and detect the adsorption amount of palladium or carbon during activation; after reduction and electroless copper plating, observe and detect the backlight level of the circuit board through a backlight microscope.

[0121] Example 13

[0122] In a 250 - milliliter three - necked flask, weigh 73 g of adipic acid and 74 g of diethylenetriamine, heat to 160 °C and react for 5 h. Then add 0.3 g of pentaerythritol and continue heating and reacting for 2 h. After the reaction ends and the temperature drops, add 100 milliliters of deionized water to dissolve, and fully dissolve for half an hour. Cool to 60 degrees Celsius, add 70 g of 3 - chloro - 2 - propyltrimethylammonium chloride, react for 2 h to obtain a cationic polymer with a multi - branched structure. Test the infrared spectrum, molecular weight and viscosity of the cationic polymer with a multi - branched structure.

[0123] Stir and mix the cationic polymer with a multi - branched structure, water and a pH regulator in a ratio of 0.2:92.8:7 to obtain a circuit board charge hole - forming agent; test the storage stability of the cationic polymer with a multi - branched structure in the obtained circuit board charge hole - forming agent; conduct chromatographic detection on the concentration of cationic groups and amide - bond groups in the obtained circuit board charge hole - forming agent; use the circuit board charge hole - forming agent to form holes in the circuit board, then perform micro - etching and activation, and detect the adsorption amount of palladium or carbon during activation; after reduction and electroless copper plating, observe and detect the backlight level of the circuit board through a backlight microscope.

[0124] Example 14

[0125] In a 250 - milliliter three - necked flask, weigh 73 g of adipic acid and 74 g of diethylenetriamine, heat to 160 °C and react for 5 h. Then add 0.3 g of pentaerythritol and continue heating and reacting for 2 h. After the reaction ends and the temperature drops, add 100 milliliters of deionized water to dissolve, and fully dissolve for half an hour. Cool to 60 degrees Celsius, add 70 g of 3 - chloro - 2 - propyltrimethylammonium chloride, react for 2 h to obtain a cationic polymer with a multi - branched structure. Test the infrared spectrum, molecular weight and viscosity of the cationic polymer with a multi - branched structure.

[0126] Stir and mix the cationic polymer with a multi - branched structure, water and a pH regulator in a ratio of 2:91:7 to obtain a circuit board charge hole - forming agent; test the storage stability of the cationic polymer with a multi - branched structure in the obtained circuit board charge hole - forming agent; conduct chromatographic detection on the concentration of cationic groups and amide - bond groups in the obtained circuit board charge hole - forming agent; use the circuit board charge hole - forming agent to form holes in the circuit board, then perform micro - etching and activation, and detect the adsorption amount of palladium or carbon during activation; after reduction and electroless copper plating, observe and detect the backlight level of the circuit board through a backlight microscope.

[0127] Example 15

[0128] In a 250 - milliliter three - necked flask, weigh 73 g of adipic acid and 74 g of diethylenetriamine, heat to 160 °C and react for 5 h. Then add 0.3 g of pentaerythritol and continue heating and reacting for 2 h. After the reaction ends and the temperature drops, add 100 milliliters of deionized water to dissolve, and fully dissolve for half an hour. Cool to 60 degrees Celsius, add 70 g of 3 - chloro - 2 - propyltrimethylammonium chloride, react for 2 h to obtain a multi - branched - chain cationic polymer. Test the infrared spectrum, molecular weight and viscosity of the multi - branched - chain cationic polymer.

[0129] Stir and mix the multi - branched - chain cationic polymer, water and pH regulator in a ratio of 3:90:7 to obtain a circuit board charge hole - forming agent; test the storage stability of the multi - branched - chain cationic polymer in the obtained circuit board charge hole - forming agent; conduct chromatographic detection on the cationic group concentration and amide bond group concentration of the obtained circuit board charge hole - forming agent; use the circuit board charge hole - forming agent to form holes in the circuit board, then perform micro - etching and activation, and detect the adsorption amount of palladium or carbon during activation; after reduction and electroless copper plating, observe and detect the backlight level of the circuit board through a backlight microscope.

[0130] Comparative Example 1

[0131] In the comparative example, use the cationic epoxy chloropropane polyimide resin 735 produced by Ashland Inc., USA.

[0132] Stir and mix the cationic epoxy chloropropane polyimide resin 735, water, pH regulator and surfactant OP - 10 in a ratio of 1:91:7:1 to obtain a circuit board charge hole - forming agent; test the storage stability of the multi - branched - chain cationic polymer in the obtained circuit board charge hole - forming agent; conduct chromatographic detection on the cationic group concentration and amide bond group concentration of the obtained circuit board charge hole - forming agent; use the circuit board charge hole - forming agent to form holes in the circuit board, then perform micro - etching and activation, and detect the adsorption amount of palladium or carbon during activation; after reduction and electroless copper plating, observe and detect the backlight level of the circuit board through a backlight microscope.

[0133] Comparative Example 2

[0134] Stir and mix the quaternary ammonium - structured cationic polymer 735, water and pH regulator in a ratio of 1:92:7 to obtain a circuit board charge hole - forming agent; test the storage stability of the multi - branched - chain cationic polymer in the obtained circuit board charge hole - forming agent; conduct chromatographic detection on the cationic group concentration and amide bond group concentration of the obtained circuit board charge hole - forming agent; use the circuit board charge hole - forming agent to form holes in the circuit board, then perform micro - etching and activation, and detect the adsorption amount of palladium or carbon during activation; after reduction and electroless copper plating, observe and detect the backlight level of the circuit board through a backlight microscope.

[0135] Table 2 Viscosity of Cationic Polymers with Multi-branched Structures in Examples 1-4

[0136] Serial number Example 1 Example 2 Example 3 Example 4 Rotation speed (r / min) Viscosity (mPa·S) Viscosity (mPa·S) Viscosity (mPa·S) Viscosity (mPa·S) 15 123 163 225 185 30 98 128 194 152 45 85 115 171 134 60 82 107 156 121

[0137] It can be understood that the viscosities of the cationic polymers with multi-branched structures in different examples are different, and the cationic polymers with multi-branched structures in different examples can be used to prepare hole charge regulators for circuit boards with different requirements.

[0138] Table 3 Formulation of Hole Charge Regulator for Circuit Board

[0139]

[0140] As Figure 3 and Figure 7 shown, among which, infrared spectrum was determined by Fourier transform infrared spectrometer IRSpirit-T of Shimadzu, Japan;

[0141] The determination of molecular weight was carried out by Agilent gel permeation chromatography GPC (1290 Infinity Ⅱ), the mobile phase was a mixture solution of acetonitrile, water and acetic acid, and the reference sample was polyethylene glycol standard sample;

[0142] The determination of viscosity was carried out by NDJ-5S rotational viscometer of MIQINGKE Co., Ltd., and the No. 1 rotor was used for the determination;

[0143] Determination of palladium element adsorption amount: First, dissolve the adsorbed palladium element with strong acid, then make up the volume, and then use the atomic absorption AA machine ICE3000 of Thermo Fisher Scientific, USA to test the palladium content and then calculate the adsorption amount.

[0144] It can be understood that compared with Comparative Example 1 and Comparative Example 2, Example 1 uses a cationic polymer with a multi-branched structure, while Comparative Example 1 and Comparative Example 2 both use cationic linear amide polymers;

[0145] When comparing Example 1, Example 2 and Example 3, in Example 1, a cationic polymer with a multi-branched structure was synthesized through adipic acid, and the value of n of the cationic polymer with a multi-branched structure was 4. In Example 2, a cationic polymer with a multi-branched structure was synthesized through suberic acid, and the value of n of the cationic polymer with a multi-branched structure was 6. In Example 3, a cationic polymer with a branched structure was synthesized through pimelic acid, and the value of n of the cationic polymer with a multi-branched structure was 5;

[0146] When comparing Example 2 and Example 4, both Example 2 and Example 4 synthesized a cationic polymer with a multi-branched structure through suberic acid. The addition amount of pentaerythritol in Example 2 was 0.3 g, and the addition amount of pentaerythritol in Example 4 was 0.5 g;

[0147] Example 5 and Example 6 are compared with Example 1. Example 5, Example 6 and Example 1 are all synthesized from adipic acid and diethylenetriamine. The heating time of Example 1 is 5h. For the cationic polymer with a multi-branched structure in Example 1, M is 4 and the n value is about 466. The heating time of Example 5 is 2h. For the cationic polymer with a multi-branched structure in Example 5, M is 4 and n is about 316. The heating time of Example 6 is 8h. For the cationic polymer with a multi-branched structure in Example 6, M is 4 and n is about 471.

[0148] Example 7 and Example 8 are compared with Example 2. Example 7, Example 8 and Example 2 are all synthesized from suberic acid and diethylenetriamine. The heating time of Example 2 is 5h. For the cationic polymer with a multi-branched structure in Example 2, M is 6 and the n value is about 482. The heating time of Example 7 is 2h. For the cationic polymer with a multi-branched structure in Example 7, M is 6 and n is about 242. The heating time of Example 8 is 8h. For the cationic polymer with a multi-branched structure in Example 8, M is 6 and n is about 492.

[0149] Example 9 and Example 10 are compared with Example 1. Example 9, Example 10 and Example 3 are all synthesized from pimelic acid and diethylenetriamine. The heating time of Example 3 is 5h. For the cationic polymer with a multi-branched structure in Example 3, M is 5 and the n value is about 391. The heating time of Example 9 is 2h. For the cationic polymer with a multi-branched structure in Example 9, M is 5 and n is about 284. The heating time of Example 10 is 8h. For the cationic polymer with a multi-branched structure in Example 10, M is 5 and n is about 401.

[0150] Example 11 is compared with Example 1. 1% surfactant OP-10 is added in Example 11;

[0151] Example 12 is compared with Example 1. The addition amount of the cationic polymer with a multi-branched structure in Example 12 is 0.1%, and the addition amount of the cationic polymer with a multi-branched structure in Example 1 is 1%;

[0152] Example 13 is compared with Example 1. The addition amount of the cationic polymer with a multi-branched structure in Example 13 is 0.2%, and the addition amount of the cationic polymer with a multi-branched structure in Example 1 is 1%;

[0153] Example 14 is compared with Example 1. The addition amount of the cationic polymer with a multi-branched structure in Example 14 is 2%, and the addition amount of the cationic polymer with a multi-branched structure in Example 1 is 1%;

[0154] Example 15 is compared with Example 1. The addition amount of the cationic polymer with a multi-branched structure in Example 15 is 3%, and the addition amount of the cationic polymer with a multi-branched structure in Example 1 is 1%.

[0155] Table 4 Testing of the Charge Adjuster for Circuit Boards

[0156]

[0157] Table 5 Storage Stability of the Cationic Polymer in the Charge Adjuster for Circuit Boards

[0158]

[0159] As can be seen from Examples 1-10 and Comparative Examples 1 and 2 in Table 4 above, the cation group concentration and amide bond group concentration of the cationic polymer with a multi-branched structure in Examples 1-10 are relatively high. After treating the circuit board with the charge adjusting hole agent for the circuit board containing the cationic polymer with a multi-branched structure, the adsorption amount of palladium is relatively large, and its adsorption efficiency is relatively high, making the backlight level in the holes of the circuit board treated with the charge adjusting hole agent for the circuit board higher. This shows that the charge adjusting hole agent for the circuit board containing the cationic polymer with a multi-branched structure has a better charge adjustment effect on the hole wall of the circuit board, reducing problems such as broken holes and open circuits, thereby improving the yield and reliability of the circuit board. Figure 4 Backlight level diagram. From top to bottom, the left pictures are Examples 1-4, and from top to bottom, the right pictures are Examples 5-8; Figure 5 Backlight level diagram. From top to bottom in sequence, the left pictures are Examples 9-12, and from top to bottom in sequence, the right pictures are Examples 13-15.

[0160] As can be seen from Example 11 and Example 1, the adsorption amount of palladium in Example 11 increases. The surfactant OP-10 increases the wetting effect between the cationic polymer with a multi-branched structure and the hole wall, making the charge adjustment of the cationic polymer with a multi-branched structure on the hole wall of the circuit board better, thereby increasing the adsorption amount of palladium.

[0161] As can be seen from Examples 12-15 and Example 1, when the amount of the cationic polymer with a multi-branched structure in Example 12 is relatively small, the effect of adjusting the negative charge on the surface of the circuit board to a positive charge by the cationic polymer with a multi-branched structure is relatively poor, resulting in a decrease in the adsorption amount of the circuit board for negatively charged active substances such as palladium, and thus a decrease in the electroless copper plating effect in the holes, leading to a decrease in the backlight level of the circuit board; when the addition amount of the cationic polymer with a multi-branched structure is greater than 2%, the influence of the charge adjuster for the circuit board on the circuit board is not obvious. Controlling the cationic polymer with a multi-branched structure within the range of 0.2-2% enables the charge adjuster for the circuit board to maintain a good charge adjustment effect on the circuit board, reduces the addition amount of the cationic polymer with a multi-branched structure, thereby reducing the production cost, and enables the charge adjuster for the circuit board to have a better charge adjustment effect on the hole wall of the circuit board, a better electroless copper plating effect in the holes, and a higher backlight level of the circuit board, indicating that the circuit board has a better adsorption property for negatively charged active substances such as palladium, and avoiding problems such as broken holes and open circuits on the hole wall of the circuit board.

[0162] As can be seen from Examples 1-15 and Comparative Example 1 and Comparative Example 2 in Table 5 above, with the increase in storage time for Comparative Example 1 and Comparative Example 2, the molecular weight of the cationic polymer changes significantly, indicating that the linear cationic epichlorohydrin polyimide resin has poor long-term storage stability, while the cationic polymer with a multi-branched structure has good long-term storage stability and is not easily degraded.

[0163] The above-described embodiments merely represent several implementation manners of the present disclosure. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the disclosed patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present disclosure, several modifications and improvements can still be made, and these all belong to the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure patent shall be subject to the appended claims.

Claims

1. A cationic polymer with a multi-branched structure, characterized in that: The general structural formula of the cationic polymer with multi-branched structure is as follows:

2. The cationic polymer with a multi-branched structure according to claim 1, characterized in that: The M of the multi-branched cationic polymer is an integer of 4-6.

3. The cationic polymer with a multi-branched structure according to claim 1, characterized in that: The n of the cationic polymer with a multi-branched structure is an integer of 300-500.

4. A method for preparing a cationic polymer with a multi-branched structure, characterized in that: For preparing the cationic polymer with a multi-branched structure according to claims 1 to 3, the method for preparing the cationic polymer with a multi-branched structure comprises the following steps: Mixing the dibasic acid and diethylenetriamine, heating and reacting to obtain a long-chain branched polymer; Adding pentaerythritol to the long-chain branched polymer, mixing, heating to react, to obtain a star-branched polymer, adding deionized water to dissolve, to obtain a star-branched polymer solution; 3-Chloro-2-propyltrimethylammonium chloride is added to the star-branched polymer solution, mixed, and heated to react to obtain a cationic polymer with a multi-branched structure.

5. The method for preparing a cationic polymer with a multi-branched structure according to claim 4, characterized in that: The dibasic acid and diethylenetriamine are mixed and heated to react to obtain a long-chain branched polymer. The reaction formula is as follows: Pentaerythritol is added to the long-chain branched polymer and mixed, and heated to react to obtain a star-branched polymer. The reaction formula is as follows: 3-Chloro-2-propyltrimethylammonium chloride is added to the star-branched polymer solution, mixed, and heated to react to obtain a cationic polymer with a multi-branched structure. The reaction formula is as follows: Wherein, M of the long-chain branched polymer, the star-shaped branched polymer and the cationic polymer with a multi-branched structure is 4-6, and n is 300-500.

6. The method for preparing a cationic polymer with a multi-branched structure according to claim 4, characterized in that: The dibasic acid includes one of adipic acid, pimelic acid and suberic acid.

7. A circuit board charge pore-regulating agent, characterized in that: The multi-branched cationic polymer according to any one of claims 4 to 6 is used for configuration, and the circuit board charge pore-regulating agent comprises the following components in parts by weight: 0.2 to 2 parts of cationic polymer with multi-branched structure; 90 to 95 parts of water; 3 to 10 parts of pH adjuster 8. The circuit board charge pore-regulating agent according to claim 7, characterized in that: The pH adjuster includes one of ethanolamine, diethanolamine and triethanolamine.

9. The circuit board charge pore-regulating agent according to claim 7, characterized in that: The circuit board charge pore-regulating agent further comprises a surfactant.

10. The circuit board charge pore-regulating agent according to claim 9, characterized in that: The surfactant includes at least one of OP wetting agent, Tween and fatty alcohol polyoxyethylene ether.

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