Detection platform and wafer flaw detection method

Abstract

The invention discloses a detection platform and a wafer flaw detection method, and relates to the field of visual detection.The detection platform comprises a detection box, a visual detection sensor is arranged in the detection box, two storage boxes are arranged on the detection box, each storage box comprises a supporting frame and a box cover, and the supporting frame can store a plurality of wafers; a vertical pushing assembly and a horizontal pushing assembly are arranged on the detection box, the vertical pushing assembly can push the box cover and the supporting frame downwards out of the storage box, and the horizontal pushing assembly can push the wafers in the corresponding supporting frame out; a clamping moving assembly is further arranged in the detection box, and the clamping moving assembly clamps the wafer and moves the wafer to the position of the visual detection sensor; and the detection box is closed and is internally provided with an air purifier. In the transferring and detecting process of the wafer, the wafer does not make contact with the external environment, dust and impurities are prevented from making contact with the wafer in the transferring and detecting process, and the quality of the wafer is guaranteed.

Description

Technical Field

[0001] The present invention relates to the field of visual inspection, and particularly to a detection platform and a method for detecting wafer defects. Background Art

[0002] A wafer is the basic material for manufacturing semiconductor chips, usually made of semiconductor materials such as silicon. During the manufacturing process, the wafer surface needs to go through multiple process steps such as lithography, etching, deposition, etc. to form complex circuit patterns and structures. Due to the complexity of the manufacturing process and the influence of environmental factors, various defects and flaws are likely to appear on the wafer surface, such as scratches, particle contamination, open circuit defects, short circuit defects, etc. These defects will affect the performance and reliability of the chips, so strict detection and screening are required.

[0003] Visual inspection is a detection method based on optical imaging and image processing technologies. In wafer manufacturing, visual inspection is mainly used to detect and classify defects and flaws on the wafer surface. A visual inspection system usually includes components such as an optical imaging device, an image processing algorithm, and a computer. The optical imaging device is used to obtain images of the wafer surface, the image processing algorithm is used to process and analyze the images, extract the feature information in the images, and the computer is used to run the algorithm and display the detection results. Visual inspection has the advantages of non-contact, high precision, high efficiency, etc., and can achieve rapid detection and classification of the wafer surface without damaging the wafer, which is an indispensable important link in the wafer manufacturing process.

[0004] Chinese Patent Application CN114384088A discloses a multi-wafer detection device, including a plurality of wafer detection device bodies for detecting wafers, and further including a detection table. The wafer detection device bodies are arranged on the detection table. The detection table is provided with a to-be-detected box for containing wafers to be detected and a detected box for containing wafers that have been detected. The detected box is provided with a partition plate for dividing the inside of the detected box into a qualified product space and an unqualified product space, which improves the detection efficiency of the wafers;

[0005] Chinese Patent Application CN114609148A discloses a wafer detection device, including a camera for taking an optical image of a wafer; a lens barrel connected to the camera; a lens group disposed in the lens barrel and used to form an image transmission optical path between the camera and the wafer; a bright field illumination component connected to the lens barrel and used to form a bright field illumination optical path inside the lens barrel that irradiates the wafer; a dark field illumination component used to form a dark field illumination optical path outside the lens barrel that irradiates the wafer; a switching component disposed in the lens barrel, and the switching component can move to the image transmission optical path so that the camera can take an optical image of the wafer when illuminated by the bright field illumination component, and the switching component can move away from the image transmission optical path so that the camera can take an optical image of the wafer when illuminated by the dark field illumination component. Just using one lens barrel can simultaneously meet the bright field environment detection and dark field environment detection of the wafer, and has a simple structure and high working efficiency.

[0006] The above patent and the prior art also have the following defects:

[0007] The production and manufacturing of wafers are relatively precise. During the detection and transmission of wafers, it is easy to be contaminated with dust, resulting in pollution and unqualified wafer detection. Some detection devices are enclosed, but still cannot solve the problem that the wafers are in contact with the external environment during the processes of transmission, loading, and unloading, and it is impossible to avoid being contaminated with dust and resulting in quality degradation.

[0008] Therefore, the present application provides a detection platform and a method for detecting wafer defects to meet the requirements. Summary of the Invention

[0009] The purpose of the present application is to provide a detection platform and a method for detecting wafer defects. During the transfer and detection of wafer chips, they do not come into contact with the external environment, preventing dust and impurities from contacting the wafer chips during the transfer and detection processes, ensuring the quality of the wafer chips. After the storage box is placed on the detection box, it can push the box cover and the wafer chips down, open the storage box to communicate with the detection box, and push the wafer chips into the detection box for detection, reducing the manual loading and unloading operations and making it more convenient to use. During loading and unloading, the wafer chips also do not come into contact with the external environment, preventing the wafer chips from being contaminated and ensuring the quality.

[0010] To achieve the above object, the present application provides the following technical solution: A detection platform, including a detection box, a vision detection sensor is arranged in the detection box, two storage boxes are arranged on the detection box, the storage box includes a support frame and a box cover, and the support frame can store a plurality of wafer chips;

[0011] A vertical pushing component and a horizontal pushing component are arranged on the detection box, the vertical pushing component can push the box cover and the support frame downward out of the storage box, and the horizontal pushing component can push the wafer chips in the corresponding support frame out;

[0012] A clamping and moving assembly is further arranged in the detection box, and the clamping and moving assembly clamps and moves the wafer to the position of the vision detection sensor;

[0013] The detection box is enclosed and an air purifier is installed inside;

[0014] The storage box further includes a box body and a return spring. The bottom of the box body is open, and the return spring presses the box cover against the box body.

[0015] Preferably, the storage box further includes a fixing block, a fixing frame, a sliding cylinder and a sliding rod. The fixing frame is fixedly installed on the box cover, the fixing block is fixedly installed on the side of the box body near the bottom, one end of the return spring is fixedly installed on the fixing block, the other end of the return spring is fixedly installed on the fixing frame, the sliding cylinder is fixedly installed on the side of the box body, the sliding rod is fixedly installed on the box cover, and the sliding rod is slidably matched in the sliding cylinder.

[0016] Preferably, the horizontal pushing assembly includes a horizontal pushing cylinder and a horizontal pushing block. The horizontal pushing cylinder is fixedly installed in the detection box. The horizontal pushing block is arc-shaped and fixedly installed at the output end of the horizontal pushing cylinder. The horizontal pushing assembly further includes a horizontal transmission motor, a horizontal transmission roller and a horizontal transmission belt. The horizontal transmission motor is fixedly installed in the detection box, the horizontal transmission roller is fixedly installed at the output end of the horizontal transmission motor, and the horizontal transmission belt is connected to the horizontal transmission roller.

[0017] Preferably, the vertical pushing assembly includes a vertical pushing motor, a vertical pushing screw, a vertical pushing block and a vertical limiting plate. A pushing frame is fixedly installed on the detection box. The vertical pushing motor is fixedly installed on the pushing frame. The vertical pushing screw is rotatably connected to the pushing frame. The vertical pushing block is sleeved on the vertical pushing screw and is threadedly connected to the vertical pushing screw. The vertical pushing block corresponds to the fixing frame. The vertical limiting plate is fixedly installed on the pushing frame, and a limiting groove is formed in the vertical limiting plate. The vertical pushing block is slidably matched in the limiting groove.

[0018] Preferably, the clamping and moving assembly includes a moving motor, a moving screw, a moving block, a clamping cylinder, a clamping block, and a moving limit plate. The moving motor is fixedly installed in the detection box. The moving screw is rotatably connected in the detection box and is fixedly installed at the output end of the moving motor. The moving block is sleeved on the moving screw and is threadedly connected to the moving screw. The clamping cylinder is fixedly installed on the moving block. The clamping block is fixedly installed at the output end of the clamping cylinder. The clamping block is arc-shaped. The moving limit plate is fixedly installed in the detection box, and a moving groove is formed in the moving limit plate. The moving block is slidably fitted in the moving groove.

[0019] Preferably, the support frame includes four columns and a plurality of spacers. The box cover is fixedly installed on the columns, and a plurality of spacers are fixedly installed on the columns at equal intervals. Rubber pads are provided on both sides of the spacers.

[0020] Preferably, two sets of vertical pushing assemblies and a storage box are provided on the detection box. A horizontal pushing assembly and a horizontal pushing-in assembly are respectively provided on one side of the two storage boxes. The horizontal pushing-in assembly includes a horizontal pushing-in cylinder, a horizontal pushing-in block, and a horizontal pushing-in plate. The horizontal pushing-in plate is fixedly installed on the detection box. The horizontal pushing-in cylinder is fixedly installed on the detection box. The horizontal pushing-in block is fixedly installed at the output end of the horizontal pushing-in cylinder. The horizontal pushing-in block is arc-shaped.

[0021] Preferably, a recycling box is provided in the detection box. The top of the recycling box is open, and a maintenance door is installed on the detection box.

[0022] Preferably, two guiding strips are fixedly installed on the horizontal pushing-in plate. The guiding strips are inclined. Blocks are fixedly installed on both sides of the box body. A downward movement hole is formed in the detection box corresponding to the position of the storage box. The blocks abut against the detection box.

[0023] A method for wafer defect detection uses the above-mentioned wafer detection platform and includes the following steps:

[0024] Store the wafer in the support frame, close the box body with the box cover to make the storage box in a closed state, and place the storage box at the position corresponding to the vertical pushing assembly of the detection box;

[0025] The vertical pushing assembly drives the box cover and the support frame to push downward, so that the wafer in the support frame moves to the position of the horizontal pushing assembly;

[0026] The horizontal pushing assembly moves the wafer to the position of the clamping and moving assembly. The clamping and moving assembly clamps the wafer and moves the wafer to the position of the vision detection sensor;

[0027] The vision detection sensor detects the wafer;

[0028] After the detection is completed, the vertical pushing component pushes the box cover and the support frame to continue moving downward, aligning the next wafer with the horizontal pushing component position.

[0029] In summary, the technical effects and advantages of the present invention are as follows:

[0030] 1. In the present invention, both the storage box and the detection box are in a closed state. The wafers are placed in the storage box, so that the wafers will not collide with each other during the transfer process. At the same time, during the transfer and detection of the wafers, they do not come into contact with the external environment, preventing dust and impurities from contacting the wafers during the transfer and detection processes, ensuring the quality of the wafers. When the storage box is placed on the detection box, it can push the box cover and the wafers downward, open the storage box to communicate with the detection box, and push the wafers into the detection box for detection, reducing the manual loading and unloading operations and making it more convenient to use. During loading and unloading, the wafers also do not come into contact with the external environment, preventing the wafers from being contaminated and ensuring the quality.

[0031] 2. In the present invention, the clamping block releases the clamping of the wafer, and the wafer falls on the horizontal pushing plate. The horizontal pushing cylinder drives the horizontal pushing block to move, and the horizontal pushing block pushes the wafer into the corresponding storage box, ensuring that the wafers do not come into contact with the external environment when transferring the qualified wafers after detection, and ensuring that the loading and unloading of the wafers during the detection process are not contaminated by the outside world. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present application. For those skilled in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0033] Figure 1 It is a three-dimensional structure schematic diagram of the present invention;

[0034] Figure 2 It is one of the internal structure schematic diagrams of the present invention;

[0035] Figure 3 It is another internal structure schematic diagram of the present invention;

[0036] Figure 4 It is a structure schematic diagram of the vision detection sensor and the storage box in the present invention;

[0037] Figure 5 It is the present invention Figure 4 An enlarged view of part A in;

[0038] Figure 6Schematic diagram of the detection box and the vision detection sensor in the present invention;

[0039] Figure 7 For the present invention Figure 6 Enlarged view of part B therein;

[0040] Figure 8 Schematic diagram of the horizontal pushing cylinder, the horizontal pushing block and the horizontal pushing plate in the present invention;

[0041] Figure 9 For the present invention Figure 8 Enlarged view of part C therein;

[0042] Figure 10 Schematic diagram of the box body and the box cover in the present invention.

[0043] In the figure: 1. Detection box; 2. Vision detection sensor; 3. Storage box; 31. Support frame; 32. Box cover; 33. Box body; 34. Return spring; 35. Fixed frame; 36. Sliding cylinder; 37. Sliding rod; 4. Vertical pushing assembly; 41. Vertical pushing motor; 42. Vertical pushing screw; 43. Vertical pushing block; 44. Vertical limiting plate; 5. Horizontal pushing assembly; 51. Horizontal pushing cylinder; 52. Horizontal pushing block; 53. Horizontal transmission motor; 54. Horizontal transmission belt; 6. Clamping and moving assembly; 61. Moving motor; 62. Moving screw; 63. Moving block; 64. Clamping cylinder; 65. Clamping block; 66. Moving limiting plate; 7. Pushing frame; 8. Horizontal pushing-in assembly; 81. Horizontal pushing-in cylinder; 82. Horizontal pushing-in block; 83. Horizontal pushing-in plate; 9. Recycling box; 10. Guide strip; 11. Block. Detailed implementation manners

[0044] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0045] Embodiment 1: Refer to Figures 1 - 10 A detection platform shown, including a detection box 1, a vision detection sensor 2 is arranged inside the detection box 1, two storage boxes 3 are arranged on the detection box 1, the storage box 3 includes a support frame 31 and a box cover 32, and the support frame 31 can store a plurality of wafers;

[0046] A vertical pushing assembly 4 and a horizontal pushing assembly 5 are arranged on the detection box 1. The vertical pushing assembly 4 can push the box cover 32 and the support frame 31 downward out of the storage box 3, and the horizontal pushing assembly 5 can push the wafers in the corresponding support frame 31 out;

[0047] The detection box 1 is also provided with a clamping and moving assembly 6, and the clamping and moving assembly 6 clamps and moves the wafer to the position of the vision detection sensor 2;

[0048] The detection box 1 is enclosed and an air purifier is installed inside;

[0049] The storage box 3 further includes a box body 33 and a return spring 34. The bottom of the box body 33 is open, and the return spring 34 presses the box cover 32 against the box body 33.

[0050] The wafer is stored in the support frame 31, the box cover 32 closes the box body 33 to make the storage box 3 in a closed state. The storage box 3 is placed at the position corresponding to the vertical pushing assembly 4 in the detection box 1. The vertical pushing assembly 4 drives the box cover 32 and the support frame 31 to move downward, so that the wafer in the support frame 31 moves to the position of the horizontal pushing assembly 5. The horizontal pushing assembly 5 moves the wafer to the position of the clamping and moving assembly 6. The clamping and moving assembly 6 clamps the wafer and moves the wafer to the position of the vision detection sensor 2. The vision detection sensor 2 detects the wafer. After the detection is completed, the vertical pushing assembly 4 pushes the box cover 32 and the support frame 31 to continue moving downward to align the next wafer with the horizontal pushing assembly 5.

[0051] Both the storage box 3 and the detection box 1 are in a closed state. The wafer is arranged in the storage box 3, so that the wafers will not collide with each other during the transfer process. At the same time, during the transfer and detection of the wafers, they do not come into contact with the external environment, preventing dust and impurities from contacting the wafers during the transfer and detection processes, ensuring the quality of the wafers. When the storage box 3 is placed on the detection box 1, it can push the box cover 32 and the wafer downward, open the storage box 3 to communicate with the detection box 1 and push the wafer into the detection box 1 for detection, reducing the operation of manual loading and unloading, making it more convenient to use. During loading and unloading, the wafers also do not come into contact with the external environment, preventing the wafers from being contaminated and ensuring the quality.

[0052] Embodiment 2, referring to Figures 1 - 10 As shown, different from the above embodiment, the storage box 3 further includes a fixing block, a fixing frame 35, a sliding cylinder 36 and a sliding rod 37. The fixing frame 35 is fixedly installed on the box cover 32, the fixing block is fixedly installed on the side of the box body 33 near the bottom, one end of the return spring 34 is fixedly installed on the fixing block, the other end of the return spring 34 is fixedly installed on the fixing frame 35, the sliding cylinder 36 is fixedly installed on the side of the box body 33, the sliding rod 37 is fixedly installed on the box cover 32, and the sliding rod 37 is slidably fitted in the sliding cylinder 36.

[0053] When the vertical pushing component 4 pushes the box cover 32 downward, the box cover 32 drives the sliding rod 37 to move within the sliding cylinder 36, making the box cover 32 more stable and less likely to shake. The box cover 32 and the fixed frame 35 move synchronously, and the fixed frame 35 squeezes the return spring 34 to store energy in the return spring 34. When the storage box 3 is removed from the detection box 1, the return spring 34 resets and drives the fixed frame 35 to move upward, and the fixed frame 35 drives the box cover 32 to move upward, causing the box cover 32 to abut against the box body 33 to close the storage box 3.

[0054] Embodiment 3, referring to Figures 1 - 10 As shown, different from the above embodiment, the horizontal pushing component 5 includes a horizontal pushing cylinder 51 and a horizontal pushing block 52. The horizontal pushing cylinder 51 is fixedly installed inside the detection box 1. The horizontal pushing block 52 is arc-shaped and fixedly installed at the output end of the horizontal pushing cylinder 51. The horizontal pushing component 5 further includes a horizontal transmission motor 53, a horizontal transmission roller, and a horizontal transmission belt 54. The horizontal transmission motor 53 is fixedly installed inside the detection box 1. The horizontal transmission roller is fixedly installed at the output end of the horizontal transmission motor 53. The horizontal transmission belt 54 is connected to the horizontal transmission roller.

[0055] The horizontal pushing cylinder 51 drives the horizontal pushing block 52 to move. The horizontal pushing block 52 pushes the wafer on the support frame 31 onto the horizontal transmission belt 54. The horizontal transmission motor 53 drives the horizontal transmission roller to rotate, the horizontal transmission roller drives the horizontal transmission belt 54 to rotate, and the horizontal transmission belt 54 drives the wafer to move, moving the wafer to the position of the clamping and moving component 6.

[0056] Embodiment 4, referring to Figures 1 - 10 As shown, different from the above embodiment, the vertical pushing component 4 includes a vertical pushing motor 41, a vertical pushing screw 42, a vertical pushing block 43, and a vertical limiting plate 44. A pushing frame 7 is fixedly installed on the detection box 1. The vertical pushing motor 41 is fixedly installed on the pushing frame 7. The vertical pushing screw 42 is rotatably connected to the pushing frame 7. The vertical pushing block 43 is sleeved on the vertical pushing screw 42 and is threadedly connected to the vertical pushing screw 42. The vertical pushing block 43 corresponds to the fixed frame 35. The vertical limiting plate 44 is fixedly installed on the pushing frame 7, and a limiting groove is formed on the vertical limiting plate 44. The vertical pushing block 43 is slidably fitted in the limiting groove.

[0057] The vertical pushing motor 41 drives the vertical pushing screw 42 to rotate, the vertical pushing screw 42 drives the vertical pushing block 43 to move, the vertical limiting plate 44 limits the vertical pushing block 43 from rotating, and the vertical pushing block 43 pushes the fixed frame 35 downward, and the fixed frame 35 drives the box cover 32 downward.

[0058] Embodiment 5, referring to Figures 1 - 10As shown, the difference from the above embodiment is that the clamping and moving assembly 6 includes a moving motor 61, a moving screw 62, a moving block 63, a clamping cylinder 64, a clamping block 65 and a moving limit plate 66. The moving motor 61 is fixedly installed in the detection box 1. The moving screw 62 is rotatably connected in the detection box 1 and is fixedly installed at the output end of the moving motor 61. The moving block 63 is sleeved on the moving screw 62 and is threadedly connected to the moving screw 62. The clamping cylinder 64 is fixedly installed on the moving block 63. The clamping block 65 is fixedly installed at the output end of the clamping cylinder 64. The clamping block 65 is arc-shaped. The moving limit plate 66 is fixedly installed in the detection box 1. A moving groove is formed in the moving limit plate 66, and the moving block 63 is slidably fitted in the moving groove.

[0059] The clamping cylinder 64 drives the clamping block 65 to move. Two sets of clamping and moving assemblies 6 are provided. The two clamping blocks 65 clamp the wafer on the horizontal conveyor belt 54. The moving motor 61 drives the moving screw 62 to move. The moving block 63 moves on the moving screw 62. The moving limit plate 66 limits the moving block 63 from rotating. The moving block 63 drives the clamping cylinder 64 and the clamping block 65 to move. The clamping block 65 drives the wafer to move and moves the wafer to the position of the vision detection sensor 2. The vision detection sensor 2 detects the wafer.

[0060] Embodiment 6, referring to Figures 1 - 10 As shown, the difference from the above embodiment is that the support frame 31 includes four columns and several spacers. The box cover 32 is fixedly installed on the columns. Several spacers are fixedly installed on the columns at equal intervals. Rubber pads are provided on both sides of the spacers.

[0061] When the box cover 32 moves downward, the box cover 32 drives the columns to move, the columns drive the spacers to move, and the spacers drive the wafers therebetween to move downward.

[0062] Embodiment 7, referring to Figures 1 - 10 As shown, the difference from the above embodiment is that two sets of vertical pushing assemblies 4 and storage boxes 3 are provided on the detection box 1. A horizontal pushing assembly 5 and a horizontal pushing-in assembly 8 are respectively provided on one side of the two storage boxes 3. The horizontal pushing-in assembly 8 includes a horizontal pushing-in cylinder 81, a horizontal pushing-in block 82 and a horizontal pushing-in plate 83. The horizontal pushing-in plate 83 is fixedly installed on the detection box 1. The horizontal pushing-in cylinder 81 is fixedly installed on the detection box 1. The horizontal pushing-in block 82 is fixedly installed at the output end of the horizontal pushing-in cylinder 81. The horizontal pushing-in block 82 is arc-shaped.

[0063] One storage box 3 is filled with wafers, and the other storage box 3 is set as an empty box. The vertical pushing component 4 pushes the wafers downward out of the storage box 3. The horizontal pushing component 5 pushes the wafers out of the support frame 31. The clamping and moving component 6 clamps and moves the wafers to the position of the visual inspection sensor 2 for inspection. When the inspection is qualified, the clamping and moving component 6 drives the wafers to move above the horizontal pushing plate 83. The clamping block 65 releases the clamping of the wafers. The wafers fall on the horizontal pushing plate 83. The horizontal pushing cylinder 51 drives the horizontal pushing block 52 to move. The horizontal pushing block 52 pushes the wafers into the corresponding storage box 3. When transferring the qualified wafers, it is ensured that the wafers do not contact the external environment, and it is ensured that the loading and unloading of the wafers during the inspection process will not be contaminated by the outside world.

[0064] Embodiment 8, refer to Figures 1 - 10 As shown, different from the above embodiment, a recycling box 9 is arranged in the inspection box 1. The top of the recycling box 9 is open, and a maintenance door is installed on the inspection box 1.

[0065] When the visual inspection sensor 2 detects that the wafer is unqualified, the clamping and moving component 6 drives the wafer to move above the recycling box 9. The clamping block 65 releases the clamping of the wafer. The wafer drops into the recycling box 9 to collect and recycle the unqualified wafers.

[0066] Embodiment 9, refer to Figures 1 - 10 As shown, different from the above embodiment, two guiding strips 10 are fixedly installed on the horizontal pushing plate 83. The guiding strips 10 are inclined. Blocks 11 are fixedly installed on both sides of the box body 33. A downward moving hole is opened on the inspection box 1 corresponding to the position of the storage box 3. The block 11 abuts against the inspection box 1.

[0067] The guiding strips 10 can prevent the wafers from moving more accurately on the horizontal pushing plate 83 and can accurately enter the corresponding storage box 3. The block 11 abuts against the inspection box 1, so that the box body 33 will not enter the inspection box 1 and the bottom of the abutment is in contact with the inspection box 1 to be closed, and the box cover 32 can descend.

[0068] A method for wafer defect detection uses the above-mentioned wafer detection platform, including the following steps:

[0069] Store the wafers in the support frame 31. The box cover 32 closes the box body 33 to make the storage box 3 in a closed state. Place the storage box 3 at the position corresponding to the vertical pushing component 4 of the inspection box 1;

[0070] The vertical pushing component 4 drives the box cover 32 and the support frame 31 to push downward, so that the wafers in the support frame 31 move to the position of the horizontal pushing component 5;

[0071] The horizontal pushing component 5 moves the wafer to the position of the clamping and moving component 6. The clamping and moving component 6 clamps the wafer and moves the wafer to the position of the vision detection sensor 2;

[0072] The vision detection sensor 2 detects the wafer;

[0073] After the detection is completed, the vertical pushing component 4 pushes the box cover 32 and the support frame 31 to continue moving downward to align the next wafer with the position of the horizontal pushing component 5.

[0074] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A detection platform, comprising a detection box, characterized in that: A visual detection sensor is arranged in the detection box, and two storage boxes are arranged on the detection box. The storage boxes include a support frame and a box cover, and the support frame can store a plurality of objects to be detected; The detection box is provided with a vertical pushing component and a horizontal pushing component, the vertical pushing component can push the box cover and the support frame downward out of the storage box, and the horizontal pushing component can push out the corresponding object to be detected in the support frame; The detection box is also provided with a clamping and moving assembly, which clamps the object to be detected and moves it to the position of the visual detection sensor; The detection box is closed and an air purifier is installed inside; The storage box also includes a box body and a return spring. The bottom of the box body is opened, and the return spring presses the box cover onto the box body.

2. A detection platform according to claim 1, characterized in that: The storage box also includes a fixed block, a fixed frame, a sliding cylinder and a sliding rod. The fixed frame is fixedly installed on the box cover, the fixed block is fixedly installed on the side of the box body near the bottom, one end of the return spring is fixedly installed on the fixed block, the other end of the return spring is fixedly installed on the fixed frame, the sliding cylinder is fixedly installed on the side of the box body, the sliding rod is fixedly installed on the box cover, and the sliding rod is slidably fitted in the sliding cylinder.

3. A detection platform according to claim 1, characterized in that: The horizontal pushing assembly includes a horizontal pushing cylinder and a horizontal pushing block. The horizontal pushing cylinder is fixedly installed in the detection box. The horizontal pushing block is arranged in an arc shape. The horizontal pushing block is fixedly installed at the output end of the horizontal pushing cylinder. The horizontal pushing assembly also includes a horizontal transmission motor, a horizontal transmission roller and a horizontal transmission belt. The horizontal transmission motor is fixedly installed in the detection box. The horizontal transmission roller is fixedly installed at the output end of the horizontal transmission motor. The horizontal transmission belt is connected to the horizontal transmission roller.

4. A detection platform according to claim 2, characterized in that: The vertical pushing assembly includes a vertical pushing motor, a vertical pushing screw, a vertical pushing block and a vertical limiting plate. A pushing frame is fixedly installed on the detection box, the vertical pushing motor is fixedly installed on the pushing frame, the vertical pushing screw is rotatably connected to the pushing frame, the vertical pushing block is sleeved on the vertical pushing screw and is threadedly connected to the vertical pushing screw, the vertical pushing block corresponds to the fixed frame, the vertical limiting plate is fixedly installed on the pushing frame, a limiting groove is provided on the vertical limiting plate, and the vertical pushing block is slidably fitted in the limiting groove.

5. A detection platform according to claim 1, characterized in that: The clamping and moving assembly includes a moving motor, a moving screw, a moving block, a clamping cylinder, a clamping block and a moving limit plate. The moving motor is fixedly installed in the detection box, the moving screw is rotatably connected in the detection box, the moving screw is fixedly installed at the output end of the moving motor, the moving block is sleeved on the moving screw and threadedly connected to the moving screw, the clamping cylinder is fixedly installed on the moving block, the clamping block is fixedly installed at the output end of the clamping cylinder, the clamping block is arranged in an arc shape, the moving limit plate is fixedly installed in the detection box, a moving groove is provided on the moving limit plate, and the moving block is slidably fitted in the moving groove.

6. A detection platform according to claim 1, characterized in that: The support frame comprises four columns and a plurality of spacers, the box cover is fixedly mounted on the columns, a plurality of spacers are fixedly mounted on the columns at equal distances, and rubber pads are arranged on both sides of the spacers.

7. A detection platform according to claim 1, characterized in that: The detection box is provided with two groups of vertical pushing components and storage boxes, and one side of the two groups of storage boxes is respectively provided with a horizontal pushing component and a horizontal pushing component, the horizontal pushing component includes a horizontal pushing cylinder, a horizontal pushing block and a horizontal pushing plate, the horizontal pushing plate is fixedly installed on the detection box, the horizontal pushing cylinder is fixedly installed on the detection box, the horizontal pushing block is fixedly installed on the output end of the horizontal pushing cylinder, and the horizontal pushing block is arranged in an arc shape.

8. A detection platform according to claim 1, characterized in that: A recovery box is arranged in the detection box, the top of the recovery box is opened, and an inspection door is installed on the detection box.

9. A detection platform according to claim 7, characterized in that: Two guide bars are fixedly installed on the horizontal push plate, and the guide bars are inclined. Abutment blocks are fixedly installed on both sides of the box body. A downward hole is opened on the detection box corresponding to the storage box position, and the abutment blocks abut against the detection box.

10. A method for detecting wafer defects, using the wafer detection platform according to any one of claims 1 to 9, characterized in that: The following steps are involved: The wafers are stored in the support frame, the box cover closes the box body, so that the storage box is in a closed state, and the storage box is placed in the position of the vertical push component corresponding to the detection box; The vertical push component drives the box cover and the support frame to move downward, so that the wafer in the support frame moves to the position of the horizontal push component; The horizontal pushing component moves the wafer to the position of the clamping moving component, the clamping moving component clamps the wafer, and moves the wafer to the position of the visual detection sensor; Visual inspection sensors inspect wafers; After the inspection is completed, the vertical push assembly pushes the box cover and the support frame to continue to move downward, and the next wafer is pushed to the corresponding horizontal push assembly position.

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