An optical transceiver

Abstract

The application discloses an optical transceiver, which comprises a tube base, a tube cap, an optoelectronic chip and an electrical connector. The tube base comprises a first base, a second base, a first side and a second side which are intersected and connected with each other, and the first side and the second side are arranged in a first direction and are connected with the first base and the second base and enclose a receiving cavity with a first opening. The tube cap is connected with the tube base and covers the first opening. The optoelectronic chip is arranged in the receiving cavity and is arranged on the first base. The electrical connector penetrates through the second base and extends into the receiving cavity, one end of the electrical connector is arranged in the receiving cavity and is electrically connected with the optoelectronic chip, and the other end of the electrical connector is located outside the receiving cavity. In the application, the optoelectronic chip is arranged on the first base and is spaced from the electrical connector on the second base, so that the optoelectronic chip has a larger heat dissipation area and the heat dissipation performance is improved, and meanwhile, the first side and the second side can also be used to contact the optoelectronic chip and serve as the heat dissipation surface of the optoelectronic chip, which is favorable for further improving the heat dissipation effect.

Description

Technical Field

[0001] This application belongs to the field of lasers, specifically relating to an optical transceiver. Background Technology

[0002] In a hermetically sealed transistor outer (TO) coaxial package, the cap and socket are usually soldered on the same plane. Since the large surface of the socket needs to connect to the pins, the side of the socket needs to dissipate heat. However, the side area of ​​the socket is small and the distance from the packaged chip is far, so it cannot achieve a good heat dissipation effect. Summary of the Invention

[0003] Purpose of the invention: This application provides an optical transceiver designed to solve the above-mentioned problems.

[0004] Technical solution: An optical transceiver according to an embodiment of this application includes:

[0005] The tube seat includes a first base and a second base that intersect and are connected to each other, and a first side and a second side that are spaced apart in a first direction. The first side and the second side are both connected to the first base and the second base and form a receiving cavity with a first opening.

[0006] A pipe cap, which is connected to the pipe seat and covers the first opening;

[0007] A photoelectric chip, wherein the photoelectric chip is disposed in the receiving cavity and the photoelectric chip is disposed on the first base;

[0008] An electrical connector passes through the second base and extends into the receiving cavity. One end of the electrical connector passes through the receiving cavity and is electrically connected to the optoelectronic chip, while the other end is located outside the receiving cavity.

[0009] In some embodiments, the tube seat has a first welding end face surrounding the first opening, and the tube cap has a second welding end face, the first welding end face and the second welding end face are located in the same plane, and the tube seat and the tube cap are sealed together through the first welding end face and the second welding end face.

[0010] In some embodiments, the first base has a first welding sub-face facing the cap, the second base has a second welding sub-face facing the cap, the first side has a third welding sub-face facing the cap, and the second side has a fourth welding sub-face facing the cap. The first welding sub-face, the second welding sub-face, the third welding sub-face, and the fourth welding sub-face are located in the same plane and are sequentially connected to form the first welding end face.

[0011] In some embodiments, the cap includes a first cap portion, a second cap portion, and a third side portion and a fourth side portion spaced apart in the first direction. The third side portion and the fourth side portion are both connected to the first cap portion and the second cap portion and form an optical path cavity with a second opening. The optical path cavity communicates with the receiving cavity, and the second welding end face surrounds the second opening.

[0012] The first cap portion has a fifth welding sub-face facing the first base portion, the second cap portion has a sixth welding sub-face facing the second base portion, the third side portion has a seventh welding sub-face facing the first side portion, and the fourth side portion has an eighth welding sub-face facing the second side portion. The fifth welding sub-face, the sixth welding sub-face, the seventh welding sub-face and the eighth welding sub-face are located in the same plane and are connected in sequence to form the second welding end face.

[0013] In some embodiments, the first cap portion extends along a side away from the second cap portion and is provided with a first joint portion. The first joint portion has a first joint surface facing the first weld sub-surface and a first extrusion surface away from the first weld sub-surface. The first joint surface and the fifth weld sub-surface are located in the same plane and connected to each other, and the first extrusion surface is parallel to the first weld sub-surface.

[0014] The second cap portion extends along the side away from the first cap portion and is provided with a second joint portion. The second joint portion has a second joint surface facing the second welding sub-surface and a second extrusion surface away from the second welding sub-surface. The second joint surface and the sixth welding sub-surface are located in the same plane and connected to each other, and the second extrusion surface is parallel to the second welding sub-surface.

[0015] In some embodiments, the first base has a corresponding first surface and a second surface in a second direction, and the second base has a corresponding third surface and a fourth surface in a third direction, wherein the second surface is connected to the third surface;

[0016] The first cap portion is opposite the third surface in the third direction, and the second cap portion is opposite the second surface in the second direction. The first direction, the second direction, and the third direction intersect each other.

[0017] In some embodiments, the cap has an optical port facing the photoelectric chip, and the optical port is sealed with a first optical window. The photoelectric chip is used to emit or receive laser light towards the first optical window.

[0018] In some embodiments, the cap has an observation port, and the observation port is sealed with a second light window.

[0019] In some embodiments, the optical transceiver further includes:

[0020] A lens is disposed on the side of the first optical window away from the photoelectric chip, and the lens is used to couple the laser emitted or received by the photoelectric chip.

[0021] In some embodiments, the optical transceiver further includes:

[0022] A monitoring chip is disposed in the receiving cavity and connected to the second base. The monitoring chip is electrically connected to the photoelectric chip and the electrical connector respectively.

[0023] Beneficial effects: The optical transceiver of this application embodiment includes a socket, which includes an intersecting and interconnected first base, a second base, and a first side and a second side spaced apart in a first direction. The first side and the second side are both connected to the first base and the second base and form a receiving cavity with a first opening. A cap is connected to the socket and covers the first opening. A photoelectric chip is disposed in the receiving cavity and is at least connected to the first base. An electrical connector is connected to the second base, and one end of the electrical connector passes through the receiving cavity and is electrically connected to the photoelectric chip. That is, the photoelectric chip is disposed in the first base and spaced apart from the electrical connector on the second base, so that the photoelectric chip has a larger heat dissipation area and improves heat dissipation performance. At the same time, the first side and the second side can also be used to contact the photoelectric chip and serve as heat dissipation surfaces for the photoelectric chip, which is beneficial to further improve the heat dissipation effect. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the structure of the optical transceiver in Embodiment 1 of this application;

[0026] Figure 2 This is a schematic diagram of the internal cross-sectional structure of the optical transceiver in Embodiment 1 of this application;

[0027] Figure 3 This is a schematic diagram of the structure of the socket, optoelectronic chip, electrical connector and monitoring chip in Embodiment 1 of this application;

[0028] Figure 4 This is a schematic diagram of the pipe seat in Embodiment 1 of this application;

[0029] Figure 5 This is a schematic diagram of the pipe cap structure of Embodiment 1 of this application;

[0030] Figure 6 This is a schematic diagram of the optical transceiver with a coupling lens according to Embodiment 1 of this application;

[0031] Figure 7 This is a schematic diagram of the structure of the optical transceiver with a coupling lens in Embodiment 2 of this application;

[0032] Reference numerals: 1. Optical transceiver; 10. Tube base; 100. First base; 1000. First surface; 1001. Second surface; 1002. Extension; 1003. Support; 101. Second base; 1010. Third surface; 1011. Fourth surface; 102. First side; 103. Second side; 104. Receiving cavity; 105. First opening; 106. First welding end face; 1060. First welding sub-face; 1061. Second welding sub-face; 1062. Third welding sub-face; 1063. Fourth welding sub-face; 20. Tube cap; 200. First cap; 2000. First joint; 2001. First joint surface; 2002. First extrusion surface; 201. Second cap; 2010. Second Joint; 2011, Second joint surface; 2012, Second extrusion surface; 202, Third side; 203, Fourth side; 204, Optical cavity; 205, Second opening; 206, Second welding end face; 2060, Fifth welding sub-face; 2061, Sixth welding sub-face; 2062, Seventh welding sub-face; 2063, Eighth welding sub-face; 207, Welding protrusion; 208, Optical port; 209, Observation port; 30, Optoelectronic chip; 300, Laser; 301, Pad; 40, Electrical connector; 400, Insulating part; 401, Connecting part; 50, First optical window; 60, Second optical window; 70, Lens; 80, Monitoring chip; 90, Positioning groove; X, First direction; Y, Second direction; Z, Third direction. Detailed Implementation

[0033] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0034] In the description of this application, it should be understood that the terms "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, and "at least one" can mean one, two, or more, unless otherwise explicitly specified.

[0035] It should also be noted that, in the description of this application, "perpendicular" means completely perpendicular to 90° or almost completely perpendicular. For example, the range of included angles between 80° and 100° is considered perpendicular. Similarly, "parallel" means completely parallel or almost completely parallel. For example, the range of completely parallel angles between 10° and 10° is considered parallel.

[0036] The applicant noted that with the rise in demand for 1550nm LiDAR and the application of silicon photonics technology in optical modules, high-power lasers are being used to achieve better heat dissipation at a low cost, which will positively contribute to the output power of the light source in 1550nm LiDAR and silicon photonics modules. Traditional hermetic transistor outer shells (TOs) are coaxial packages, with the metal cap and header soldered onto the same plane. The relatively large bottom surface of the header is mostly used for pin leads and flexible board soldering, which cannot provide good heat dissipation. Heat dissipation can only be achieved through the sides of the header, but the side area is small and far from the chip, resulting in poor heat dissipation performance.

[0037] In view of this, embodiments of this application disclose an optical transceiver that can solve at least one of the above-mentioned defects.

[0038] Example 1:

[0039] Reference Figures 1 to 5The optical transceiver 1 has a first direction X and includes a socket 10, a cap 20, a photoelectric chip 30, and an electrical connector 40. The socket 10 includes an intersecting and interconnected first base 100, a second base 101, and a first side portion 102 and a second side portion 103 spaced apart in the first direction X. The first side portion 102 and the second side portion 103 are both connected to the first base 100 and the second base 101, forming a receiving cavity 104 with a first opening 105. The cap 20 is connected to the socket 10 and covers the first opening 105. The photoelectric chip 30 is disposed in the receiving cavity 104 and is at least connected to the first base 100. The electrical connector 40 is connected to the second base 101, with one end of the connector passing through the receiving cavity 104 and electrically connected to the photoelectric chip 30, and the other end located outside the receiving cavity 104.

[0040] The photoelectric chip 30 is disposed on the first base 100 and spaced apart from the electrical connector 40 on the second base 101, so that the photoelectric chip 30 has a larger heat dissipation area and improves heat dissipation performance. At the same time, the first side 102 and the second side 103 can also be used to contact the photoelectric chip 30 and serve as heat dissipation surfaces for the photoelectric chip 30, which is conducive to further improving the heat dissipation effect.

[0041] It should be noted that in this embodiment, the intersection of the first base 100 and the second base 101 refers to an angle between the first base 100 and the second base 101 that is not 0° or 180°. This structurally separates the electrical connector 40 and the photoelectric chip 30, preventing the electrical connector 40 from occupying the heat dissipation surface of the photoelectric chip 30. Furthermore, after the connection cap 20 is installed, neither the first side 102 nor the second side 103 is occupied by the electrical connector 40. This means the photoelectric chip 30 can still make thermally conductive contact with the first side 102 and / or the second side 103, further expanding the contact heat dissipation surface and improving the overall heat dissipation effect.

[0042] Furthermore, refer to Figures 1 to 5 In some embodiments, the tube seat 10 has a first welding end face 106 surrounding the first opening 105, and the tube cap 20 has a second welding end face 206. The first welding end face 106 and the second welding end face 206 are parallel to each other and connected to each other. In this embodiment, the tube seat 10 and the tube cap 20 are respectively wedge-shaped structures, and the two can be sealed together by the first welding end face 106 and the second welding end face 206.

[0043] Furthermore, this embodiment takes the installation of a photoelectric chip 30 within the cavity 104 as an example. It can be understood that the photoelectric chip 30 may include a laser 300 and a detector (not shown in the figure) integrated within the cavity 104 to complete the reception and transmission of optical signals. In other embodiments, if this product is only a light transmitter, the photoelectric chip 30 may be set as a laser 300; if this product is only a light receiver, the photoelectric chip 30 may be set as a detector.

[0044] Specifically, refer to Figure 2 , Figure 3 and Figure 4 The optical transceiver 1 also has a second direction Y and a third direction Z, and the first direction X, the second direction Y and the third direction Z intersect each other. The first base 100 has a corresponding first surface 1000 and a second surface 1001 in the second direction Y, and the second base 101 has a corresponding third surface 1010 and a fourth surface 1011 in the third direction Z, with the second surface 1001 connected to the third surface 1010; the first base 100 has a first welding sub-surface 1060 facing the cap 20, the second base 101 has a second welding sub-surface 1061 facing the cap 20, the first side 102 has a third welding sub-surface 1062 facing the cap 20, and the second side 103 has a fourth welding sub-surface 1063 facing the cap 20. The first welding sub-surface 1060, the second welding sub-surface 1061, the third welding sub-surface 1062 and the fourth welding sub-surface 1063 are connected in sequence to form the first welding end face 106.

[0045] Reference Figure 2 and Figure 5 In some embodiments, the cap 20 includes a first cap portion 200, a second cap portion 201, and a third side portion 202 and a fourth side portion 203 spaced apart in a first direction X. The third side portion 202 and the fourth side portion 203 are both connected to the first cap portion 200 and the second cap portion 201 and form an optical path cavity 204. The optical path cavity 204 communicates with the receiving cavity 104. A second welding end face 206 surrounds a second opening 205. The first cap portion 200 is opposite to the third surface 1010 in the third direction Z, and the second cap portion 201 is opposite to the second surface 1001 in the second direction Y.

[0046] Specifically, the first cap portion 200 has a fifth welding sub-face 2060 facing the first base portion 100, the second cap portion 201 has a sixth welding sub-face 2061 facing the second base portion 101, the third side portion 202 has a seventh welding sub-face 2062 facing the first side portion 102, and the fourth side portion 203 has an eighth welding sub-face 2063 facing the second side portion 103. The fifth welding sub-face 2060, the sixth welding sub-face 2061, the seventh welding sub-face 2062 and the eighth welding sub-face 2063 are connected in sequence to form an integral second welding end face 206.

[0047] It should be noted that, referring to Figure 5 In order to increase the contact surface between the first cap 200, the third side 202 and the fourth side 203 and the tube seat 10, the first cap 200, the third side 202 and the fourth side 203 are provided with a first joint 2000 on the plane where the second welding end face 206 is located. The first joint 2000 has a first joint surface 2001 facing the first welding sub-face 1060 and a first extrusion surface 2002 away from the first welding sub-face 1060. The first joint surface 2001 and the fifth welding sub-face 2060 are located in the same plane and connected to each other. The first extrusion surface 2002 is parallel to the first welding sub-face 1060. The aforementioned fifth welding sub-face 2060 actually includes the side of the first joint 2000 facing the tube seat 10.

[0048] Similarly, the second cap portion 201, the third side portion 202, and the fourth side portion 203 extend on the plane where the second welding surface is located to form a second joint portion 2010. The second joint portion 2010 has a second joint surface 2011 facing the second welding sub-surface 1061 and a second extrusion surface 2012 facing away from the second welding sub-surface 1061. The second joint surface 2011 and the sixth welding sub-surface 2061 are located in the same plane and connected to each other. The second extrusion surface 2012 is parallel to the second welding sub-surface 1061. The aforementioned sixth welding sub-surface 2061 actually includes the side of the second joint portion 2010 facing the tube seat 10.

[0049] It should be noted that the integral tube seat 10 can be machined or stamped from a metal material with high thermal conductivity. Specifically, metal materials such as copper, aluminum, silver, and tungsten can be flexibly used according to actual needs. The first base 100, the second base 101, the first side 102, and the second side 103 of the tube seat 10 can actually be integrally formed. In this case, the first welding end face 106 is formed when the tube seat 10 is formed.

[0050] Similarly, the integral cap 20 can also be processed by metal craftsmanship or stamping. Specifically, metal materials such as copper and aluminum can be flexibly used according to actual needs. The first cap 200, the second cap 201, the third side 202, the fourth side 203, the first joint 2000 and the second joint 2010 of the cap 20 can actually be integrally formed. At this time, the second welding end face 206 is formed when the cap 20 is formed. The cap 20 is usually also surface treated, such as tin plating or nickel plating, to improve its corrosion resistance and connection performance.

[0051] In this embodiment, the arrangement of the first side 102, the second side 103, the third side 202 and the fourth side 203 forms a first welding end face 106 and a second welding end face 206 that are parallel and fit together. While being compatible with traditional resistance welding pipe seat 10 and pipe cap 20 equipment, it can achieve higher airtightness and reliability. Compared with only setting the first base 100, the second base 101, the first cap 200 and the second cap 201, it avoids the need for multiple welding surfaces at the same time during welding, reduces the requirements of resistance welding process, and improves welding reliability and production efficiency.

[0052] In order to facilitate the connection of the tube seat 10 and the tube cap 20 by resistance welding, the first extrusion surface 2002 and the second extrusion surface 2012 are used for the resistance welding equipment to abut against each other, which is conducive to the stable abutment of the first bonding surface 2001, the second bonding surface 2011 and the overall second welding end face 206 against the first welding end face 106.

[0053] In addition, refer to Figure 5 In some embodiments, the cap 20 forms an optical path cavity 204 with a second opening 205, and a welding protrusion 207 is provided on the second welding end face 206 facing the first welding end face 106, the welding protrusion 207 surrounding the second opening 205. In this embodiment, the cap 20 and the seat 10 are welded by resistance welding to ensure the airtightness of the receiving cavity 104 and the optical path cavity 204, and the welding protrusion 207 improves the sealing effect when the two are fused together by resistance welding.

[0054] For example, refer to Figure 2 and Figure 3 A support portion 1003 is formed on the second surface 1001 of the tube socket 10. The optoelectronic chip 30 includes a laser diode (LD) 300 and a laser diode submount (LDSM) 301. The submount 301 is fixed to the support portion 1003, and the laser diode 300 is fixed to the submount 301. Specifically, the laser diode 300 can be connected to the submount 301 by soldering, and the submount 301 can be fixed to the support portion 1003 by means of silver paste or soldering.

[0055] The spacer 301 provides mechanical support and protection for the laser 300, preventing it from being affected by external impacts or vibrations, thereby extending its lifespan and stability. Simultaneously, the spacer 301 facilitates heat dissipation for the laser 300 to maintain its stable operating temperature. Furthermore, the spacer 301 has precise dimensions and geometry, providing accurate optical positioning for precisely arranging the laser 300, ensuring accurate alignment between the laser diode and other optical components to achieve high-quality laser output.

[0056] In some embodiments, refer to Figure 1, Figure 2 and Figure 3 The electrical connector 40 is configured as a pin penetrating the second base 101. An insulating portion 400 is provided between the outer side of the pin and the second base 101. The insulating portion 400 can be a glass insulator, which is fixed to the tube seat 10 by high-temperature sintering. In this embodiment, the electrical connector 40 is electrically connected to the pad 301 through the connecting portion 401, thereby electrically connecting the laser 300. The connecting portion 401 can be a gold-tin solder sheet, solder paste, etc. Alternatively, the electrical connector 40 can be directly connected to the pad 301 by gold wire bonding. In other embodiments, the electrical connector 40 can also be a multilayer ceramic substrate, which will not be described in detail here.

[0057] Furthermore, in some embodiments, reference is made to Figure 3 The optical transceiver 1 also includes a monitoring chip 80 (Monitor Photodiode, abbreviated as MPD). The monitoring chip 80 is located in the receiving cavity 104 and connected to the third surface 1010. The monitoring chip 80 can be fixed to the third surface 1010 with silver paste. The monitoring chip 80 can be electrically connected to the photoelectric chip 30 and the electrical connector 40 respectively by soldering. The monitoring chip 80 can monitor the back light intensity output by the laser 300. That is, by being installed on the back of the laser 300, it converts the optical signal into an electrical signal to monitor the back light intensity of the laser 300 in real time, thereby providing feedback signals for controlling and adjusting the output power and stability of the laser 300.

[0058] In addition, to further improve the heat dissipation effect of the laser 300, in other embodiments a thermoelectric cooler (TEC) can be added to the support 1003 for the connection between the laser 300 and the pad 301. Components such as thermistors can also be set to detect the temperature of the laser 300 in real time to improve the stability of use.

[0059] In some embodiments, refer to Figure 1 , Figure 2 and Figure 5 The first cap 200 has an optical port 208 facing the laser 300, and the optical port 208 is sealed with a first optical window 50. The laser 300 can emit laser towards the first optical window 50 so that the laser can be smoothly exited from the optical path cavity 204.

[0060] In addition, the second cap 201 has an observation port 209 facing the laser 300, and the observation port 209 is sealed with a second optical window 60. The observation port 209 and the second optical window 60 can be used to observe the components inside the housing cavity 104, such as the laser 300, which facilitates high-precision mounting with external components and improves the coupling efficiency with external optical components.

[0061] It should be noted that the first light window 50 and the second light window 60 can be made of glass light window material with a coefficient of thermal expansion that intersects with that of the cap 20, and can be sealed with the cap 20 by gold-tin soldering or high-temperature sintering of glass solder.

[0062] In some embodiments, refer to Figure 2 and Figure 6 The optical transceiver 1 also includes a lens 70, which is located on the side of the first optical window 50 away from the laser 300. The lens 70 is used to couple the laser emitted or received by the optoelectronic chip 30. For example, the vertical and horizontal divergence angles of the laser emitted by the laser 300 can be adjusted by the lens 70, thereby enabling coupling and matching with external optical components.

[0063] It should be noted that the included angle between the first base 100 and the second base 101 is limited to between 60° and 135°. Within this angle range, the first base 100 carries the optoelectronic chip 30, and the second base 101 carries the electrical connector 40 without interfering with each other. The first base 100 has sufficient space for heat dissipation of the optoelectronic chip 30. When the included angle between the first base 100 and the second base 101 is less than 60°, the space between the second surface 1001 and the third surface 1010 is narrow, which is not conducive to the installation of the optoelectronic chip 30. When the included angle is greater than 135°, the electrical connector 40 penetrating the second base 101 may affect the installation of the first base 100 and the overall optical transceiver 1. Therefore, it is preferable that the included angle between the first base 100 and the second base 101 is between 60° and 135°.

[0064] In this embodiment, the first direction X, the second direction Y, and the third direction Z are perpendicular to each other, that is, the first base 100 and the second base 101 are perpendicular to each other, and the first cap 200 and the second cap 201 are also perpendicular to each other, so that the optoelectronic chip 30 and the electrical connector 40 are independent of each other, and the internal space layout of the optical transceiver 1 is more reasonable, with better heat dissipation effect and sufficient installation space.

[0065] In addition, refer to Figure 2 The first base 100 and the second base 101 are connected to each other by a positioning groove 90 that penetrates the first surface 1000 and the fourth surface 1011. The positioning groove 90 is designed to be adapted to the coaxial packaging equipment so as to quickly position and install the tube seat 10.

[0066] Furthermore, this embodiment takes a single-channel laser 300 as an example. In other embodiments, it can also be configured as multiple lasers 300 and multiple optical signal channels. At the same time, in other embodiments, an optical receiver can also be configured or the laser 300 and the optical receiver can be integrated and arranged in the receiving cavity 104. These will not be described in detail here.

[0067] Example 2:

[0068] Reference Figure 7 The difference between this embodiment and embodiment 1 is that, for example, the end of the first base 100 away from the second base 101 is connected to an extension 1002 in the third direction Z. Correspondingly, a smaller lens 70 than that in embodiment 1 can be used and directly coupled to the extension 1002 to adapt to different process methods.

[0069] In addition, in other embodiments, the lens 70 may also be directly built into the tube cap 20, which will not be described in detail here.

[0070] The optical transceiver provided in the embodiments of this application has been described in detail above, and specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the technical solutions and core ideas of this application. Those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. An optical transceiver (1), characterized by The application relates to a light transceiver (1), comprising: a tube base (10) comprising a first base (100), a second base (101) and a first side (102) and a second side (103) which are arranged in a first direction (X) and are connected to each other, the first side (102) and the second side (103) are connected to the first base (100) and the second base (101) and enclose a containing cavity (104) with a first opening (105); a tube cap (20) connected to the tube base (10) and covering the first opening (105); an optoelectronic chip (30) arranged in the containing cavity (104) and arranged on the first base (100); an electrical connector (40) penetrating the second base (101) and extending into the containing cavity (104), one end of the electrical connector (40) is arranged in the containing cavity (104) and electrically connected to the optoelectronic chip (30), and the other end is located outside the containing cavity (104); the tube base (10) has a first welding end surface (106) surrounding the first opening (105), the first base (100) has a first welding sub-surface (1060) facing the tube cap (20), the second base (101) has a second welding sub-surface (1061) facing the tube cap (20), the first side (102) has a third welding sub-surface (1062) facing the tube cap (20), the second side (103) has a fourth welding sub-surface (1063) facing the tube cap (20), and the first welding sub-surface (1060), the second welding sub-surface (1061), the third welding sub-surface (1062) and the fourth welding sub-surface (1063) are located in the same plane and sequentially connected to form the first welding end surface (106).

2. The optical transceiver (1) according to claim 1, characterized in that the tube cap (20) has a second welding end surface (206), the first welding end surface (106) and the second welding end surface (206) are located in the same plane, and the tube base (10) and the tube cap (20) are sealingly connected through the first welding end surface (106) and the second welding end surface (206).

3. The light transceiver (1) according to claim 2, wherein the tube cap (20) comprises a first cap (200), a second cap (201) and a third side (202) and a fourth side (203) which are arranged in the first direction (X) and are connected to each other, the third side (202) and the fourth side (203) are connected to the first cap (200) and the second cap (201) and enclose a light path cavity (204) with a second opening (205), the light path cavity (204) communicates with the containing cavity (104), and the second welding end surface (206) surrounds the second opening (205). The first cap portion (200) has a fifth welding sub-face (2060) facing the first base portion (100), the second cap portion (201) has a sixth welding sub-face (2061) facing the second base portion (101), the third side portion (202) has a seventh welding sub-face (2062) facing the first side portion (102), and the fourth side portion (203) has an eighth welding sub-face (2063) facing the second side portion (103), the fifth welding sub-face (2060), the sixth welding sub-face (2061), the seventh welding sub-face (2062), and the eighth welding sub-face (2063) are located in the same plane and are sequentially connected to form the second welding end face (206).

4. The optical transceiver (1) according to claim 3, characterized in that, The first cap portion (200) is provided with a first bonding portion (2000) extending away from the second cap portion (201) on one side, the first bonding portion (2000) has a first bonding face (2001) facing the first welding sub-face (1060) and a first extrusion face (2002) away from the first welding sub-face (1060), the first bonding face (2001) and the fifth welding sub-face (2060) are located in the same plane and are connected, and the first extrusion face (2002) is parallel to the first welding sub-face (1060); The second cap portion (201) is provided with a second bonding portion (2010) extending away from the first cap portion (200) on one side, the second bonding portion (2010) has a second bonding face (2011) facing the second welding sub-face (1061) and a second extrusion face (2012) away from the second welding sub-face (1061), the second bonding face (2011) and the sixth welding sub-face (2061) are located in the same plane and are connected, and the second extrusion face (2012) is parallel to the second welding sub-face (1061).

5. The optical transceiver (1) according to claim 3, characterized in that, The first base portion (100) has a corresponding first face (1000) and a second face (1001) in a second direction (Y), the second base portion (101) has a corresponding third face (1010) and a fourth face (1011) in a third direction (Z), and the second face (1001) connects the third face (1010); The first cap portion (200) is opposite to the third face (1010) in the third direction (Z), the second cap portion (201) is opposite to the second face (1001) in the second direction (Y), and the first direction (X), the second direction (Y), and the third direction (Z) intersect with each other.

6. The optical transceiver (1) according to claim 1, characterized in that, The pipe cap (20) is provided with a light port (208) facing the optoelectronic chip (30), and the light port (208) is provided with a first light window (50), and the optoelectronic chip (30) is used for emitting or receiving laser towards the first light window (50).

7. The optical transceiver (1) according to claim 1, characterized in that, The pipe cap (20) is provided with an observation port (209), and the observation port (209) is provided with a second light window (60).

8. The optical transceiver (1) according to claim 6, characterized in that, The optical transceiver (1) further comprises: A lens (70) is arranged on the side of the first light window (50) away from the optoelectronic chip (30), and the lens (70) is used for coupling the laser emitted or received by the optoelectronic chip (30).

9. The optical transceiver (1) according to claim 1, characterized in that, The optical transceiver (1) further comprises: A monitoring chip (80) is arranged in the accommodating cavity (104), and the monitoring chip (80) is connected to the second base (101), and the monitoring chip (80) is electrically connected to the optoelectronic chip (30) and the electrical connector (40) respectively.

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