Electronic device and method for controlling data throughput based on heat generation in electronic device

Abstract

The present disclosure provides an electronic device and a method for controlling data throughput based on heat generation in the electronic device. According to an embodiment, an electronic device may include a display, an input unit configured to include at least one biometric sensor, at least one processor, and a memory configured to include instructions. The instructions may be configured, when executed, to cause the at least one processor to: perform user authentication according to biometric sensing information obtained by the at least one biometric sensor in response to an input to the input unit; identifying whether the duration of the input exceeds a first threshold time; performing a first function when the duration is less than or equal to a first threshold time in response to success of the user authentication; and performing a second function when the duration exceeds a first threshold time in response to success of the user authentication.

Description

[0001] This application is a divisional application of a patent application with an application date of July 22, 2020, application number 202080052669.9, and invention name “Electronic device and method for controlling data throughput based on heat generation in an electronic device”. Technical Field

[0002] The present disclosure relates to an electronic device and more particularly to an electronic device and a method for improving heat generation in the electronic device. Background Art

[0003] In order to meet the increasing demand for wireless data services since the commercialization of the fourth generation (4G) communication system, efforts have been made to develop the fifth generation (5G) communication system. In order to achieve a high data transmission rate, it has been considered to try to make the 5G communication system use a new frequency band such as an ultra-high frequency band (e.g., 60 GHz band) in addition to the communication frequency band used in related technologies such as the third generation (3G) and long term evolution (LTE).

[0004] Multiple antenna modules may be installed in an electronic device to support millimeter wave (mmWave), which is an ultra-high frequency band. The wireless channel in the millimeter wave band has high straightness and high path loss due to its high frequency characteristics. In order to solve the problems of high straightness and high path loss, high directional beamforming technology is indispensable, but high directional beamforming technology requires multiple antenna modules. For example, an electronic device may include multiple antenna modules respectively used to radiate signals in different directions.

[0005] The above information is presented as background information only to assist with an understanding of the present disclosure. No determination has been made, and no assertion is made, as to whether any of the above might be applicable as prior art with respect to the present disclosure. Summary of the invention

[0006] Technical issues The fifth generation (5G) communication technology may send a large amount of data and consume a large amount of power, and therefore may potentially increase the temperature of electronic devices. For example, due to the use of high frequency bands and the increase in data throughput, electronic devices inevitably consume a large amount of power. Therefore, as the amount of heat increases, the antenna module in use and the surroundings of the antenna may overheat. When a specific antenna module and its surroundings are overheated, the user of the electronic device may feel uncomfortable and may suffer low-temperature burns. With the additional damage of components (e.g., batteries) arranged around the overheated antenna module, the overall performance of the electronic device may become degraded. In addition, various applications with data transmission / reception functions through 5G communication can be installed and used in electronic devices. For applications in which the amount of data sent / received through 5G communication is too much, when the electronic device executes the application, with the use of high frequency bands and the increase in data throughput, a large amount of heat may be generated.

[0007] Various aspects of the present disclosure are to at least solve the above-mentioned problems and / or disadvantages and to provide at least the advantages described below. Therefore, one aspect of the present disclosure is to provide an electronic device capable of effectively controlling heat generation during 5G communication, and a method for controlling data throughput based on heat generation in an electronic device.

[0008] Additional aspects will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the presented embodiments.

[0009] According to one aspect of the present disclosure, an electronic device is provided. An electronic device includes and is capable of: controlling data throughput of an application that uses a large amount of data related to 5G communication to reduce heat generation, and a method for controlling data throughput based on heat generation in the electronic device.

[0010] According to another aspect of the present disclosure, an electronic device is provided. The electronic device includes controlling the data throughput of an application running in the background among a plurality of applications using a large amount of data related to 5G communication, so that the application can run stably while reducing heat generation, and a method for controlling data throughput based on heat generation in the electronic device.

[0011] Solution to the problem According to another aspect of the present disclosure, an electronic device is provided. The electronic device includes: at least one antenna module, a first communication circuit configured to provide a first communication through the at least one antenna module, a plurality of temperature sensors, at least one processor operably connected to the first communication circuit and the plurality of temperature sensors, and a memory, wherein the memory is configured to store instructions, which, when executed, cause the at least one processor to: obtain a first temperature associated with the electronic device through the plurality of temperature sensors; identify a second temperature associated with the first communication based on the first temperature being equal to or higher than a first threshold; identify the running state of at least one application whose data throughput associated with the first communication is equal to or higher than a specified throughput based on the second temperature being equal to or higher than a second threshold; and adjust the first data throughput of a first application running in a background state among the at least one application.

[0012] According to another aspect of the present disclosure, a method for controlling data throughput based on heat generation in an electronic device is provided, the method comprising: obtaining a first temperature associated with the electronic device through the multiple temperature sensors; identifying a second temperature associated with the first communication based on the first temperature being equal to or higher than a first threshold; identifying a running state of at least one application whose data throughput associated with the first communication is equal to or higher than a specified throughput based on the second temperature being equal to or higher than a second threshold; and adjusting a first data throughput of a first application running in a background state among the at least one application.

[0013] According to various embodiments, in the non-transitory computer recording medium, at least one program including commands is recorded on the non-transitory computer recording medium, and when the commands are executed by a computer, a method is performed, the method comprising: obtaining a first temperature associated with the electronic device through the multiple temperature sensors; identifying a second temperature associated with the first communication based on the first temperature being equal to or higher than a first threshold; identifying a running state of at least one application whose data throughput associated with the first communication is equal to or higher than a specified throughput based on the second temperature being equal to or higher than a second threshold; and adjusting a first data throughput of a first application running in a background state among the at least one application.

[0014] Advantageous Effects of the Invention According to various embodiments, heating of an electronic device may be effectively controlled during 5G communication.

[0015] According to various embodiments, the heat generation of an electronic device may be effectively reduced by controlling the data throughput of an application using a large amount of data related to 5G communication.

[0016] According to various embodiments, by controlling the data throughput of an application running in the background among various applications using a large amount of data related to 5G communication, stable application execution can be performed while reducing heat generation.

[0017] Other aspects, advantages, and salient features of the disclosure will become apparent to those skilled in the art from the following detailed description; the following detailed description, taken in conjunction with the accompanying drawings, discloses various embodiments of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and other aspects, features and advantages of certain embodiments of the present disclosure will become more apparent from the following description in conjunction with the accompanying drawings.

[0019] Figure 1 is a block diagram of an electronic device in a network environment according to an embodiment of the present disclosure.

[0020] Figure 2 An electronic device in a network environment including multiple cellular networks according to an embodiment of the present disclosure is shown.

[0021] Figure 3 is an internal block configuration diagram of an electronic device according to an embodiment of the present disclosure.

[0022] Figure 4 A temperature sensor and an element corresponding to a heat source among elements of an electronic device according to an embodiment of the present disclosure are shown.

[0023] Figure 5 is a view describing a configuration of a processor in an electronic device according to an embodiment of the present disclosure.

[0024] Figure 6 is a flowchart of an operation of controlling data throughput based on heat generation in an electronic device according to an embodiment of the present disclosure.

[0025] Figure 7 is a flowchart illustrating an application data processing operation in an electronic device according to an embodiment of the present disclosure.

[0026] Fig. 8A is a diagram for describing a central processing unit (CPU) operating time according to an embodiment of the present disclosure.

[0027] Figure 8B is a view for describing a state in which a CPU execution time is controlled according to an embodiment of the present disclosure.

[0028] Fig.9A is a view for describing a CPU group according to an embodiment of the present disclosure.

[0029] Fig. 9Bis a view for describing a state in which a CPU group is controlled according to an embodiment of the present disclosure.

[0030] Fig.10 An example of a table showing improvement results of performance and heat generation before and after controlling the data throughput of an application according to an embodiment of the present disclosure is shown.

[0031] Throughout the drawings, like reference numerals will be understood to refer to like parts, components, and structures. DETAILED DESCRIPTION

[0032] The following description with reference to the accompanying drawings is provided to assist in a comprehensive understanding of the various embodiments of the present disclosure as defined by the claims and their equivalents. It includes various specific details to assist in understanding, but these specific details should be regarded as merely exemplary. Therefore, it will be appreciated by those of ordinary skill in the art that various changes and modifications may be made to the various embodiments described herein without departing from the scope and spirit of the present disclosure. In addition, descriptions of well-known functions and structures may be omitted for clarity and conciseness.

[0033] The terms and words used in the following description and claims are not limited to the bibliographical meanings, but are merely used by the inventor to enable a clear and consistent understanding of the present disclosure. Therefore, it should be apparent to those skilled in the art that the following description of various embodiments of the present disclosure is for illustrative purposes only and is not intended to limit the present disclosure as defined by the appended claims and their equivalents.

[0034] It should be understood that the singular forms "a," "an," and "the" include plural references unless the context clearly dictates otherwise. Thus, for example, reference to "a component surface" also includes reference to one or more of such surfaces.

[0035] The terms used herein are only for describing specific embodiments and are not intended to limit the scope of other embodiments. Unless otherwise defined, all terms used herein, including technical terms and scientific terms, have the same meaning as those commonly understood by ordinary technicians in the technical field involved in this disclosure. Terms such as those defined in generally used dictionaries may be interpreted as having the same meaning as the contextual meaning in the relevant technical field; unless clearly defined in this disclosure, they should not be interpreted as having an ideal meaning or an overly formal meaning. In some cases, even the terms defined in this disclosure should not be interpreted as excluding embodiments of the present disclosure.

[0036] Figure 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.

[0037] Reference Figure 1 , the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input device 150, a sound output device 155, a display device 160, an audio module 170, a sensor module 176, an interface 177, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the components (e.g., the display device 160 or the camera module 180) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the components may be implemented as a single integrated circuit.For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illumination sensor) may be implemented to be embedded in the display device 160 (eg, a display).

[0038] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 120 may load a command or data received from another component (e.g., sensor module 176 or communication module 190) into the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resultant data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) and an auxiliary processor 123 (e.g., a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is independent of or combined with the main processor 121 in operation. Additionally or alternatively, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be specifically used for a specified function. The auxiliary processor 123 may be implemented separately from the main processor 121 , or as part of the main processor 121 .

[0039] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 may control at least some of the functions or states related to at least one component (e.g., display device 160, sensor module 176, or communication module 190) among the components of the electronic device 101 (not the main processor 121), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component (e.g., display device 160, sensor module 176, or communication module 190) among the components of the electronic device 101 together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) that is functionally related to the auxiliary processor 123.

[0040] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

[0041] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0042] The input device 150 may receive commands or data to be used by other components (eg, the processor 120) of the electronic device 101 from outside the electronic device 101 (eg, a user). The input device 150 may include, for example, a microphone, a mouse, or a keyboard.

[0043] The sound output device 155 can output a sound signal to the outside of the electronic device 101. The sound output device 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records, and the receiver can be used for incoming calls. Depending on the embodiment, the receiver can be implemented as a separate part from the speaker, or as a part of the speaker.

[0044] The display device 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display device 160 may include a touch circuit adapted to detect a touch or a sensor circuit (e.g., a pressure sensor) adapted to measure the strength of a force caused by a touch.

[0045] The audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 may obtain sound via the input device 150, or output sound via the sound output device 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0046] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) outside the electronic device 101, and then generate an electrical signal or a data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0047] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly with an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0048] The connection end 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0049] The haptic module 179 may convert the electric signal into mechanical stimulation (eg, vibration or motion) or electric stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electric stimulator.

[0050] The camera module 180 may capture still images or moving images. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0051] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0052] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0053] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a cellular network, the Internet, or a computer network (e.g., a LAN or a Wide Area Network (WAN))). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 192 may identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0054] The antenna module 197 may transmit or receive a signal or power to or from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiation element composed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a PCB). According to an embodiment, the antenna module 197 may include one or more antennas. In this case, at least one antenna suitable for a communication scheme used in a communication network, such as the first network 198 or the second network 199, may be selected from a plurality of antennas by, for example, the communication module 190 (e.g., the wireless communication module 192). A signal or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component other than the radiation element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module 197.

[0055] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicatively transfer signals (e.g., commands or data) therebetween.

[0056] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 and the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type from the electronic device 101. According to an embodiment, all or some operations to be executed in the electronic device 101 may be executed in one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices that receive the request may execute the requested at least part of the function or service, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request with or without further processing the result. To this end, for example, cloud computing technology, distributed computing technology, or client-server computing technology may be used.

[0057] Figure 2 is a block diagram 200 of an electronic device 101 in a network environment including multiple cellular networks according to an embodiment of the present disclosure.

[0058] Reference Figure 2 , the electronic device 101 may include a first communication processor 212, a second communication processor 214, a first radio frequency integrated circuit (RFIC) 222, a second RFIC 224, a third RFIC 226, a fourth RFIC 228, a first radio frequency front end (RFFE) 232, a second RFFE 234, a first antenna module 242, a second antenna module 244, and an antenna 248. The electronic device 101 may also include a processor 120 and a memory 130. The second network 199 may include a first cellular network 292 and a second cellular network 294. According to another embodiment, the electronic device 101 may also include Figure 1According to one embodiment, the first communication processor 212, the second communication processor 214, the first RFIC 222, the second RFIC 224, the fourth RFIC 228, the first RFFE 232 and the second RFFE 234 may constitute at least a part of the wireless communication module 192. According to another embodiment, the fourth RFIC 228 may be omitted; or, may be included as a part of the third RFIC 226.

[0059] The first communication processor 212 may establish a communication channel in a frequency band that can be used for wireless communication with the first cellular network 292, and may support traditional network communication through the established communication channel. According to various embodiments, the first cellular network may be a traditional network including a 2G, 3G, 4G, or Long Term Evolution (LTE) network. The second communication processor 214 may establish a communication channel corresponding to a specified frequency band (e.g., from about 6 GHz to about 60 GHz) in a frequency band that can be used for wireless communication with the second cellular network 294, and may support 5G network communication through the established communication channel. According to various embodiments, the second cellular network 294 may be a 5G network defined in 3GPP. In addition, according to one embodiment, the first communication processor 212 or the second communication processor 214 may establish a communication channel corresponding to another specified frequency band (e.g., about 6 GHz or less) in a frequency band that can be used for wireless communication with the second cellular network 294, and may support 5G network communication through the established communication channel. According to one embodiment, the first communication processor 212 and the second communication processor 214 may be implemented in a single chip or a single package. According to various embodiments, the first communication processor 212 or the second communication processor 214 may be provided in the processor 120, the auxiliary processor 123, or the communication module 190, and provided in a single chip or a single package. According to various embodiments, the first communication processor 212 may communicate with the second communication processor 214 using the inter-processor communication 213.

[0060] When transmitting a signal, the first RFIC 222 may convert a baseband signal generated by the first communication processor 212 into a radio frequency (RF) signal of about 700 MHz to about 3 GHz for the first cellular network 292 (e.g., a legacy network). When receiving an RF signal, the RF signal may be obtained from the first cellular network 292 (e.g., a legacy network) through an antenna (e.g., the first antenna module 242), and may be pre-processed by an RFFE (e.g., the first RFFE 232). The first RFIC 222 may convert the pre-processed RF signal into a baseband signal so that the baseband signal may be processed by the first communication processor 212.

[0061] When transmitting a signal, the second RFIC 224 may convert a baseband signal generated by the first communication processor 212 or the second communication processor 214 into an RF signal of a Sub6 frequency band (e.g., about 6 GHz or lower) for a second cellular network 294 (e.g., a 5G network) (hereinafter referred to as a "5G Sub6 RF signal"). When receiving a signal, the 5G Sub6 RF signal may be obtained from the second cellular network 294 (e.g., a 5G network) through an antenna (e.g., the second antenna module 244), and may be pre-processed by an RFFE (e.g., the second RFFE 234). The second RFIC 224 may convert the pre-processed 5G Sub6 RF signal into a baseband signal so that the baseband signal may be processed by a relevant communication processor in the first communication processor 212 or the second communication processor 214.

[0062] The third RFIC 226 may convert the baseband signal generated by the second communication processor 214 into an RF signal (hereinafter referred to as a "5G Above 6 signal") of a 5G Above 6 frequency band (from about 6 GHz to about 60 GHz) for a second cellular network 294 (e.g., a 5G network). When receiving a signal, the 5G Above 6 signal may be obtained from the second cellular network 294 (e.g., a 5G network) through an antenna (e.g., antenna 248) and may be pre-processed by the third RFFE 236. The third RFIC 226 may convert the pre-processed 5G Above 6 signal into a baseband signal so that the baseband signal may be processed by the second communication processor 214. According to an embodiment, the third RFFE 236 may be formed as a part of the third RFIC 226.

[0063] According to one embodiment, the electronic device 101 may include a fourth RFIC 228 that is separate from the third RFIC 226 or at least as a part of the third RFIC 226. The fourth RFIC 228 may convert the baseband signal generated by the second communication processor 214 into an RF signal (hereinafter referred to as an "IF signal") of an intermediate frequency band (e.g., from about 9 GHz to about 11 GHz), and then may send the IF signal to the third RFIC 226. The third RFIC 226 may convert the IF signal into a 5G Above 6 RF signal. When receiving a signal, the 5G Above 6 RF signal may be received from the second cellular network 294 (e.g., a 5G network) through an antenna (e.g., antenna 248), and may be converted into an IF signal by the third RFIC 226. The fourth RFIC 228 may convert the IF signal into a baseband signal that may be processed by the second communication processor 214.

[0064] According to one embodiment, the first RFIC 222 and the second RFIC 224 may be implemented as at least a portion of a single package or a single chip. According to one embodiment, the first RFFE 232 and the second RFFE 234 may be implemented as at least a portion of a single package or a single chip. According to one embodiment, at least one of the first antenna module 242 or the second antenna module 244 may be omitted or may be combined with other antenna modules to process RF signals of multiple frequency bands corresponding thereto.

[0065] According to one embodiment, the third RFIC 226 and the antenna 248 may be arranged on the same substrate to constitute the third antenna module 246. For example, the wireless communication module 192 or the processor 120 may be arranged on a first substrate (e.g., a main PCB). In this case, the third antenna module 246 may be configured by arranging the third RFIC 226 in a partial area (e.g., a lower surface) of a second substrate (e.g., a sub-PCB) independent of the first substrate and arranging the antenna 248 in another partial area (e.g., an upper surface) of the second substrate. Arranging the third RFIC 226 and the antenna 248 on the same substrate may reduce the length of the transmission line therebetween. This arrangement may reduce, for example, signal loss (e.g., attenuation) due to the transmission line for signals in a high frequency band (e.g., from about 6 to about 60 GHz) for 5G network communications. Therefore, the electronic device 101 may improve the quality or speed of communication with the second cellular network 294 (e.g., a 5G network).

[0066] According to one embodiment, the antenna 248 may be formed as an antenna array including a plurality of antenna elements that may be used for beamforming. In this case, for example, the third RFIC 226 may include a plurality of phase shifters 238 corresponding to the plurality of antenna elements (as part of the third RFFE 236). When transmitting a signal, each of the plurality of phase shifters 238 may shift the phase of a 5G Above6 RF signal transmitted from the electronic device 101 to the outside (e.g., a base station of a 5G network) through the antenna element corresponding thereto. When receiving a signal, each of the plurality of phase shifters 238 may shift the phase of a 5G Above6 RF signal received from the outside to the same or substantially the same phase through the antenna element corresponding thereto. This enables transmission or reception between the electronic device 101 and the outside through beamforming.

[0067] The second cellular network 294 (e.g., a 5G network) may operate independently of the first cellular network 292 (e.g., a legacy network) (e.g., standalone networking (SA)), or may operate while connected to the first cellular network (e.g., non-standalone (NSA)). For example, the 5G network may include only an access network (e.g., a 5G radio access network (RAN) or a next generation RAN (NGRAN)) and may not include a core network (e.g., a next generation core (NGC) network). In this case, under the control of a core network of the legacy network (e.g., an evolved packet core (EPC) network), the electronic device 101 may access the access network of the 5G network and may then access an external network (e.g., the Internet). Protocol information for communicating with a legacy network (e.g., LTE protocol information) or protocol information for communicating with a 5G network (e.g., new radio (NR) protocol information) may be stored in the memory 130 and may be accessed by another component (e.g., the processor 120, the first communication processor 212, or the second communication processor 214).

[0068] Figure 3 is an internal block configuration diagram 300 of an electronic device according to an embodiment of the present disclosure.

[0069] For example, the electronic device 301 may include Figure 1 or Figure 2 . The electronic device 301 may include at least one processor 320 (e.g., an application processor (AP)), a memory 330, a charger IC 331, a temperature sensor 376, a camera 380, a power management module 388, a battery 389, a communication circuit 390, and an antenna module 397. According to one embodiment, in the electronic device 301, at least one element may be omitted, or another element may be additionally included.

[0070] Reference Figure 3 , terms such as "module" in the electronic device 301 refer to a unit for processing at least one function or operation. This can be implemented by hardware, software, or a combination of hardware and software. The term "module" is described in a manner related to the electronic device 301, but can be replaced by the terms "circuit", "unit" or "device".

[0071] According to various embodiments, the communication circuit 390 may include a first communication circuit 391 and a second communication circuit 392. According to one embodiment, the first communication circuit 391 may perform communication in a first communication scheme through the antenna module 397, and the second communication circuit 392 may perform communication in a second communication scheme. According to one embodiment, the first communication scheme may be a communication scheme based on a 5G communication protocol, and the second communication scheme may be a communication scheme based on a 4G or LTE communication protocol.

[0072] According to one embodiment, the communication circuit 390 may include a communication processor (CP), a transceiver and / or a power amplifier module (PAM), and the CP, the transceiver and the power amplifier module may be implemented in the form of an integrated module (or chip). For example, the CP may control the communication circuit 390 so as to receive data sent from the network and send data received from the processor 120 (e.g., an AP) to the network. According to one embodiment, the CP may support 4G or LTE communication and / or 5G communication of the electronic device 301. For example, the CP may include: a first CP (e.g., a 4G or LTE modem) for supporting conventional network communication, and a second CP (e.g., a 5G modem) for supporting 5G network communication.

[0073] According to various embodiments, the transceiver may convert a transmitted baseband signal into an RF signal, or may convert an RF signal into a baseband signal. According to one embodiment, the transceiver may convert a baseband signal into an RF signal of various frequency bands. According to one embodiment, the transceiver may include: a first transceiver for supporting 4G or LTE network communication; and a second transceiver for supporting 5G network communication. For example, the first transceiver may convert a signal to be transmitted from a baseband signal into an RF signal based on 5G at a frequency band of 6 GHz or lower, or may convert a received RF signal based on 5G at a frequency band of 6 GHz or lower into a baseband signal. According to one embodiment, by using a heterodyne transceiver with an intermediate frequency (IF), the first transceiver may convert a baseband signal into an RF signal based on 5G at a frequency band of 6 GHz or higher, or into an RF signal based on an ultra-high frequency band (e.g., mmWave frequency band). For example, the second transceiver may convert a signal to be transmitted from a baseband signal into an RF signal based on 4G or LTE, or may convert a received RF signal based on 4G or LTE into a baseband signal.

[0074] According to various embodiments, the power amplifier module may amplify the RF signal transmitted from the transceiver, and may transmit the amplified RF signal to the antenna module 397. For example, the power amplifier module may include a first power amplifier module (e.g., 4G or LTE PAM) and a second power amplifier module (e.g., 5G PAM). The first power amplifier module may amplify the RF signal transmitted from the first transceiver, and may transmit the amplified RF signal to the antenna module 397. The second power amplifier module may amplify the RF signal transmitted from the second transceiver, and may transmit the amplified RF signal to the antenna module 397.

[0075] According to various embodiments, the antenna module 397 may include a plurality of antenna modules 393, 394, 395, and 396. Some of the plurality of antenna modules 393, 394, 395, and 396 may be connected to the first communication circuit 391, and the remaining antenna module 396 may be connected to the second communication circuit 392. According to one embodiment, the case where the number of the plurality of antenna modules 393, 394, 395, and 396 is four has been described. However, the number of the plurality of antenna modules may be less than four, or may exceed four. For example, the antenna modules 393, 394, and 395 connected to the first communication circuit 391 may be formed into an antenna array including a plurality of antenna elements that may be used for beamforming. For example, a fourth antenna module 396 connected to the second communication circuit 392 may be provided for 4G or LTE communication.

[0076] According to various embodiments, the temperature sensor 376 may be a plurality of thermistors arranged inside the electronic device 301. Each temperature sensor 376 may output a temperature value according to a resistance value that changes with temperature, or the processor 320 may identify (e.g., check) the temperature value according to the resistance value. According to various embodiments, each temperature sensor 376 may be arranged at a position corresponding to or adjacent to each element included in the electronic device 301. For example, each of the temperature sensors 376 may be arranged in an area adjacent to each element such as the processor 320, the charger IC 331, the camera 380, the power management module 388, the battery 389, the first communication circuit 391, the second communication circuit 392, the first antenna module 393, the second antenna module 394, the third antenna module 395, and the fourth antenna module 396. According to various embodiments, in addition to the above elements, the electronic device 301 may further include various other elements such as a sub-PCB (not shown) or a Wi-Fi module (not shown), and each temperature sensor 376 may also be arranged near the various other elements.

[0077] According to various embodiments, each temperature sensor 376 may operate under the control of the processor (AP or CP) 320. Each temperature sensor 376 may passively transmit a state corresponding to a temperature value in response to a command of the AP or CP, and thus the AP or CP may obtain a temperature associated with each element from the temperature sensor 376. According to one embodiment, each of the temperature sensors 376 may be arranged at a position corresponding to each heat source among the elements included in the electronic device 301 (e.g., each of the elements designated as heat sources).

[0078] According to various embodiments, the processor 320 may obtain the surface temperature (e.g., referred to as “first temperature”) of the electronic device 301 due to heat generation by using the temperature sensor 376 (or at least one of the temperature sensors 376). For example, the processor 320 may obtain the first temperature of the electronic device 301 by periodically checking a temperature value (or a plurality of temperature values) measured by the temperature sensor 376 (or at least one of the temperature sensors 376 associated with surface heat generation) according to a specified period. Alternatively, the processor 320 may obtain the first temperature by using the temperature value measured by the temperature sensor 376 (or at least one of the temperature sensors 376 associated with surface heat generation) and a stored algorithm (e.g., a linear regression analysis algorithm) to predict the surface temperature due to heat generation. For example, the processor 320 may obtain the first temperature by using the temperature value from at least one temperature sensor disposed near the surface of the electronic device 301, or may obtain the predicted first temperature by learning in which the temperature value from at least one temperature sensor and the operation type of the electronic device 301 are considered.

[0079] According to various embodiments, the processor 320 may check whether the first temperature is equal to or higher than a specified temperature (e.g., a first threshold value or a first threshold temperature value). According to one embodiment, the specified temperature is a surface temperature generated due to the heating of the electronic device 301, and the electronic device 301 (or at least one element of the electronic device 301) may fail at this temperature, or the user feels uncomfortable due to heating during use of the electronic device 301. The specified temperature may be a first threshold value or a first threshold temperature value, and may be stored in the electronic device 301. For example, the first threshold value or the first threshold temperature value may be 38°C. In addition, the first threshold value or the first threshold temperature value may be configured to another value according to the performance of the electronic device 301 and the external environment. When the first temperature is equal to or higher than the specified temperature, the processor 320 may determine that the state of the electronic device 301 is an overheated state.

[0080] According to various embodiments, when the first temperature is equal to or higher than the first threshold, the processor 320 may check a second temperature associated with the first communication (e.g., 5G communication). According to various embodiments, the second temperature associated with the first communication may be a temperature generated by heat generation of at least one element (hereinafter referred to as "first communication-related element") (e.g., 5G modem, 5G PAM, 5G antenna) among the elements included in the electronic device 301 that operates while performing the first communication. According to one embodiment, the processor 320 may obtain the second temperature based on a temperature value obtained by at least one temperature sensor 376 that is adjacent to the element that operates while performing the first communication.

[0081] According to various embodiments, the processor 320 may check the running state of at least one application whose data throughput (e.g., data usage) associated with the first communication is equal to or higher than a specified throughput (e.g., specified usage) based on the second temperature. According to one embodiment, when the second temperature generated by at least one first communication-related element among the elements included in the electronic device 301 is equal to or higher than a second threshold, the processor 320 may determine that the electronic device 301 is in an overheated state due to the first communication. According to one embodiment, the second threshold may be equal to or higher than the first threshold. According to one embodiment, in a state where the first temperature is equal to or higher than the first threshold, when the second temperature generated by at least one first communication-related element is higher than the temperature generated by other elements included in the electronic device 301, the processor 320 may determine that the electronic device 301 is in an overheated state due to the first communication. According to one embodiment, in a state where the first temperature is equal to or higher than the first threshold, when the temperature sensor (whose temperature is the highest among the temperature sensors 376) is the temperature sensor associated with the first communication-related element, the processor 320 may determine that the electronic device 301 is in an overheated state due to the first communication.

[0082] According to various embodiments, when the electronic device is determined to be in an overheat state due to the first communication, the processor 320 may check an execution state of at least one application having a data throughput associated with the first communication equal to or greater than a specified throughput.

[0083] According to various embodiments, when the electronic device is determined to be in an overheated state due to the first communication, the processor 320 may identify at least one application whose data throughput (e.g., data throughput at a predetermined time) associated with the first communication is equal to or exceeds a specified data throughput (e.g., 50 megabits per second), and may determine whether the running state of the at least one identified application is a background running state or a foreground running state. For example, the processor 320 may use network usage history information (e.g., Netstat information) to identify at least one application whose 5G data usage is equal to or exceeds a specified usage, and may determine whether the running state of the at least one identified application is a background running state or a foreground running state. According to one embodiment, the background running state may be an invisible state in which the display function of the application is not executed, and the foreground running state may be a visible state in which the display function of the application is executed. For example, the processor 320 may use a call stack of a window manager to identify whether the running state of at least one application is an invisible state or a visible state.

[0084] According to various embodiments, when the electronic device 301 is in an overheated state due to the first communication, the processor 320 may control the data throughput (or rate) of the first application that is in the background state and whose data throughput associated with the first communication is equal to or exceeds the specified throughput. According to one embodiment, when the electronic device 301 is in an overheated state due to the first communication, the processor 320 may reduce the data throughput (or rate) of the first application that is running in the background state and whose data throughput associated with the first communication (e.g., data throughput for a predetermined time) is equal to or exceeds the specified throughput (e.g., 50 megabits per second), but may not reduce or increase the data throughput (or rate) of the second application that is running in the foreground state and whose data throughput associated with the first communication is equal to or exceeds the specified data throughput (e.g., 50 megabits per second).

[0085] According to various embodiments, the processor 320 may apply a preconfigured control strategy (or control scheme) (e.g., a speed reduction scheme) to control the data throughput (or rate) of the first application. According to various embodiments, the speed reduction scheme may include at least one of a CPU group control scheme or a CPU runtime control scheme (e.g., also referred to as a "CPU bandwidth control scheme").

[0086] According to various embodiments, when the CPU group control scheme is used, the processor 320 can reduce the data throughput (or rate) of the first application by causing a core with low data throughput (or data usage) (e.g., a core with data throughput equal to or less than a threshold value) among different cores of the CPU to process the data of the first application. According to one embodiment, when the CPU runtime control scheme is used, the processor 320 can reduce the data throughput (or rate) of the first application by reducing the runtime associated with processing the data of the first application in the bandwidth of the CPU used to process the data of the first application. For example, as the data throughput (or rate) of the first application is reduced, the data throughput associated with the first communication can be reduced, the load applied to the elements associated with the first communication can be reduced, and thus the heat generated by each element associated with the first communication can be reduced. When the heat generated by each element associated with the first communication is reduced, the surface temperature generated due to the heat generation of the electronic device 301 can also be reduced, so the electronic device 301 can return to a normal state from an overheated state.

[0087] According to various embodiments, the electronic device 301 may include: at least one antenna module 397; a first communication circuit 391, configured to provide a first communication through the at least one antenna module; a plurality of temperature sensors 376; at least one processor 320, which is operably connected to the first communication circuit and the plurality of temperature sensors; and a memory 330, wherein the memory may be configured to store instructions that, when executed, enable the at least one processor to: obtain a first temperature associated with the electronic device through the plurality of temperature sensors; identify (or check) a second temperature associated with the first communication when the first temperature is equal to or higher than a first threshold; identify (or check) a running state of at least one application whose data throughput associated with the first communication is equal to or higher than a specified throughput based on the second temperature; and adjust the first data throughput of a first application running in a background state among the at least one application.

[0088] According to various embodiments, the first temperature is a temperature on the housing surface based on heat generation in the electronic device.

[0089] According to various embodiments, the instruction is configured to cause at least one processor to not adjust a second data throughput of a second application running in a foreground state among the at least one application.

[0090] According to various embodiments, the background state includes a state in which the electronic device does not display a picture on the display of the electronic device, and the foreground state includes a state in which the electronic device displays a picture on the display of the electronic device.

[0091] According to various embodiments, the instructions are configured to cause at least one processor to: adjust a first data throughput of a first application by using a speed reduction scheme.

[0092] According to various embodiments, the instructions are configured to cause at least one processor to: adjust a first data throughput of a first application by using a CPU runtime control scheme in a speed reduction scheme.

[0093] According to various embodiments, the instructions are configured to cause at least one processor to: when using a CPU runtime control scheme, change the time for processing data of a first application within a CPU bandwidth from a first time interval to a second time interval that is smaller than the first time interval.

[0094] According to various embodiments, the instruction is configured to cause at least one processor to: when using a CPU runtime control scheme, modify a quota value for processing data of a first application within a bandwidth from a first time value to a second time value that is less than the first time value.

[0095] According to various embodiments, the instructions are configured to cause at least one processor to: adjust the data throughput of the first application by using a CPU group control scheme of a speed reduction scheme.

[0096] According to various embodiments, the instructions are configured to cause at least one processor to: when using a CPU group control scheme, modify a core for processing data of a first application from a first core to a second core having a processing speed slower than the first core.

[0097] Figure 4 A temperature sensor and an element corresponding to a heat source among elements of an electronic device according to an embodiment of the present disclosure are shown.

[0098] Reference Figure 4 , the electronic device 401 may have various elements installed in the housing 410, and the elements corresponding to the heat source among the elements of the electronic device 401 may include a processor (AP) 420, a battery 489, a first communication circuit (5G modem) 491, a second communication circuit (4G or LTE modem) 492, a first antenna module (ANT1 (mmWave)) 493, a second antenna module (ANT2 (sub6)) 494, a third antenna module (ANT3 (sub6)) 495, and a fourth antenna module (ANT4) 496. According to various embodiments, in addition to the above-mentioned elements, more elements may be included in the housing 410 of the electronic device 401. The element equivalent to the heat source may include a processor (AP) 420, a battery 489, a first communication circuit (5G modem) 491, a second communication circuit (4G or LTE modem) 492, a first antenna module (ANT1 (mmWave)) 493, a second antenna module (ANT2 (sub6)) 494, a third antenna module (ANT3 (sub6)) 495 and a portion of the fourth antenna module (ANT4) 496, or may also include an element equivalent to another heat source.

[0099] According to various embodiments, the electronic device 401 may include temperature sensors 476-1 to 476-8, which are respectively arranged at positions adjacent to elements 420, 489, 491, 492, 493, 494, 495 and 496 corresponding to heat sources, so as to respectively sense the temperatures associated with the elements 420, 489, 491, 492, 493, 494, 495 and 496 corresponding to heat sources.

[0100] According to various embodiments, in 5G communication, since a large amount of data must be processed by using a high frequency band, the first communication circuit (5G modem) 491, the first antenna module (ANT1 (mmWave)) 493, the second antenna module (ANT2 (sub6)) 494, and the third antenna module (ANT3 (sub6)) 495, which are 5G communication-related elements among the elements 420, 489, 491, 492, 493, 494, 495, and 496 equivalent to a heat source, may consume a large amount of power and generate a large amount of heat. Therefore, due to the heat generation of the 5G communication-related elements, the surface temperature caused by the heat generation of the electronic device 401 may become equal to or higher than the first threshold. According to one embodiment, in a state where the surface temperature generated by the heat generation becomes equal to or higher than the first threshold due to the heat generation of the element not associated with the 5G communication equivalent to the heat source, the surface temperature generated by the heat generation may be further increased due to the heat generation of the 5G communication-related elements. If an application requiring high data throughput associated with 5G communication is continuously executed in the electronic device 401, the electronic device 401 may be in an overheated state, and due to the heating of the 5G communication-related components, in the overheated state, the surface temperature caused by the heating becomes equal to or higher than the first threshold. When the electronic device 401 is overheated, the surface of the electronic device 401 becomes very hot, thereby causing discomfort to the user using the electronic device 401. In addition, overheating may damage internal components (e.g., a battery), which may have an impact on the overall performance of the electronic device 401.

[0101] According to various embodiments, when the electronic device 401 overheats due to heating of 5G communication-related elements, the processor (AP) 420 may limit (reduce) the data throughput (or rate) of a first application that is in a background state and whose data throughput associated with 5G communication is equal to or exceeds a specified throughput (e.g., the data throughput (or rate) associated with 5G communication within a predetermined time) to reduce heating of 5G communication-related elements, thereby preventing the performance of the electronic device 401 from being degraded due to heating.

[0102] Figure 5 is a view describing a configuration of a processor in an electronic device according to an embodiment of the present disclosure.

[0103] Reference Figure 5, the electronic device 501 may include a processor 520, a group of temperature sensors 576 including temperature sensors 576-1 to 576-8, and a memory 530. The temperature sensors 576-1 to 576-8 may include a first temperature sensor to an eighth temperature sensor. In addition, the temperature sensors 576-1 to 576-8 may be arranged at positions adjacent to elements corresponding to heat sources (e.g., AP, battery, Wi-Fi module, 4G PAM, 5G modem, 5G antenna module 1, 5G antenna module 2, and / or 5G antenna module 3), respectively, so as to provide respective temperature values ​​(internal temperatures) associated with the elements associated with the heat sources.

[0104] According to various embodiments, the processor 520 may include a temperature checking module 520 - 1 , a main module 520 - 2 , and a control module 520 - 3 .

[0105] According to various embodiments, the temperature check module 520-1 may include a thermal checker 50 and a surface temperature calculator 51. The thermal checker 50 may obtain a temperature value (internal temperature) associated with an element equivalent to a heat source (e.g., AP, battery, Wi-Fi module, 4G PAM, 5G modem, 5G antenna module 1, 5G antenna module 2, and / or 5G antenna module 3) from the temperature sensors 576-1 to 576-8. The surface temperature calculator 51 may check a first temperature (surface temperature generated due to heat generation) of the electronic device 501 based on the temperature value associated with the element equivalent to the heat source, and may check whether the first temperature is equal to or higher than a first threshold value. When the first temperature (surface temperature due to heat generation) of the electronic device 501 is equal to or higher than the first threshold value, the thermal checker 50 may determine that the electronic device 501 is in an overheating state, and may determine whether the overheating state is due to overheating generated by 5G communication based on the temperature value of the 5G communication-related element (e.g., 5G modem, 5G antenna module 1, 5G antenna module 2, and / or 5G antenna module 3) among the elements equivalent to the heat source. When the overheating state is an overheating state caused by 5G communication, the thermal checker 50 may provide information indicating the overheating state caused by 5G communication (5G heating information). According to various embodiments, the thermal checker 50 may determine whether the overheating state is an overheating state caused by 5G communication based on at least one of the following: a temperature value associated with a 5G communication-related element (e.g., 5G modem, 5G antenna module 1, 5G antenna module 2, and / or 5G antenna module 3); a 5G network connection state; a 5G electric field condition; or a 5G data usage amount.

[0106] According to various embodiments, the main module 520-2 may include a Netstat checker 52, a T / P calculator 53, a visible application checker 54, and a main controller 55. The Netstat checker 52 may check the Netstat information stored in the memory 530. The Netstat information may include network usage history information. According to one embodiment, the Netstat information may include information about the communication scheme-specific (network-specific) data usage of each application for each communication scheme. For example, the Netstat information may include information about the 4G communication-related data usage of each application and information about the 5G communication-related data usage of each application. Based on the Netstat information stored in the memory 530, the Netstat checker 52 may provide an ID (e.g., Uid) of at least one application having data usage associated with 5G communication.

[0107] The T / P calculator 53 (throughput calculator) may provide data throughput information (e.g., information about data throughput within a predetermined time) of at least one application being executed in the electronic device 501. For example, the T / P calculator 53 may provide data throughput information of at least one application processing data associated with 5G communication among applications being executed in the electronic device 501.

[0108] The visible application checker 54 may provide information indicating whether the running state of at least one application being executed in the electronic device 501 is in a background (invisible) state or a foreground (visible) state.

[0109] The main controller 55 may use the Netstat checker 52 to monitor at least one ID having data usage associated with 5G communication; the main controller 55 may use the T / P calculator 53 to monitor the data throughput of at least one application processing data associated with 5G communication among the applications being executed in the electronic device 501; the main controller 55 may use the visible application checker 54 to monitor whether the running state of at least one application being executed in the electronic device 501 is a background (invisible) state or a foreground (visible) state. The main controller 55 may provide the control module 520-3 with at least one ID having data usage associated with 5G communication, the data throughput of at least one application, and / or a list of applications, the data throughput of which is to be controlled based on the running state of at least one application in the electronic device 501 and a control level (e.g., a speed reduction level).

[0110] According to various embodiments, the control module 520-3 may include a decelerator (CPUsetter) 56, a deceleration strategy table 57, and a kernel interface 58. According to one embodiment, the decelerator (CPUsetter) 56 may receive an application list and a control level (e.g., deceleration level) for controlling data throughput from the main controller 55, and may obtain a deceleration value from the deceleration strategy table 57 and perform deceleration control. According to one embodiment, the deceleration control scheme may include at least one of a CPU control scheme or a CPU group control scheme in a CPU runtime control scheme. For example, the CPU group control scheme may be a scheme in which, among multiple cores having different processing performances from each other in a CPU, an application task being processed in a first core (e.g., a large core) is moved so as to be processed in a second core (e.g., a small core). The first core having a large data throughput may be a core capable of increasing heat generation. The second core having a smaller data throughput than the first core may be a core capable of further reducing heat generation than when the first core is used. For example, the CPU runtime control scheme may be a scheme for adjusting CPU usage by running an application in a CPU only within a specific time (quota) within a specific cycle. The specific cycle and specific time (quota) value can be calculated and used according to the data throughput of the application for processing 5G data in the main module 520-2 and the overheating degree of the electronic device 501. For example, when a task in a specific process of an application is executed in the first core to the eighth core (core 0 to core 7) of the CPU and executes a running time of 5 to 6 seconds in one cycle (e.g., 10 seconds) in each core, if the quota value is changed to 3 seconds by applying a decelerator, the execution time of the specific process in each core may not exceed 3 seconds. According to one embodiment, the decelerator (CPUsetter) 56 can control the CPU group 58-2 or the CPU running time 58-4 via the kernel interface 58 by using the decelerator control information (limitation policy of the UID) of the application whose data throughput needs to be controlled.

[0111] According to various embodiments, a method for Figure 1 and Figure 2 The electronic device 101, Figure 3 The electronic device 301, Figure 4 The electronic device 401, or Figure 5 A method for controlling data throughput by heating an electronic device 501 in the embodiment of the present invention may include: using a plurality of temperature sensors (eg, Figure 1 Sensor module 176, Figure 3obtaining a first temperature by using a temperature sensor 376 in the communication, or temperature sensors 476-1 to 476-8; when the first temperature is equal to or higher than a first threshold, identifying (or checking) a second temperature associated with the first communication; based on the second temperature, identifying (or checking) an operating state of at least one application whose data throughput associated with the first communication is equal to or exceeds a specified throughput; and adjusting a first data throughput of a first application running in a background state among at least one application.

[0112] According to various embodiments, the first temperature is a temperature on the housing surface based on heat generation in the electronic device.

[0113] According to various embodiments, a second data throughput of a second application running in a foreground state among the at least one application is not adjusted.

[0114] According to various embodiments, the background state includes a state in which the electronic device does not display a picture on the display of the electronic device, and the foreground state includes a state in which the electronic device displays a picture on the display of the electronic device.

[0115] According to various embodiments, a first data throughput of a first application is adjusted by using a CPU runtime control scheme in a speed reduction scheme.

[0116] According to various embodiments, when using a CPU runtime control scheme, the method may modify the time for processing data of the first application within the CPU bandwidth from a first time interval to a second time interval that is smaller than the first time interval.

[0117] According to various embodiments, the method may modify a quota value for processing data of a first application within a bandwidth from a first time value to a second time value that is smaller than the first time value.

[0118] According to various embodiments, the method may adjust the first data throughput of the first application by using a CPU group control scheme in a speed reduction scheme.

[0119] According to various embodiments, when the CPU group control scheme is used, the method may change a core for processing data of a first application from a first core to a second core having a processing speed slower than that of the first core.

[0120] Figure 6 is a flowchart 600 of operations for controlling data throughput based on heat generation in an electronic device according to an embodiment of the present disclosure.

[0121] Reference Figure 6 , an operation method may include operations 610 to 640. Each operation (or each step) of the operation method may be performed by an electronic device (eg, Figure 1 and Figure 2The electronic device 101, Figure 3 The electronic device 301, Figure 4 The electronic device 401, or Figure 5 One or more processors (eg, Figure 1 and Figure 2 The processor 120, Figure 3 The processor 320 in Figure 4 The processor 420 in Figure 5 According to one embodiment, at least one of operations 610 to 640 may be omitted, the order of some operations may be changed, and another operation may be added.

[0122] In operation 610, the electronic device 501 can be configured to generate a temperature signal by using a temperature sensor (eg, Figure 3 The temperature sensor 376 in the heat source is arranged at a position corresponding to the heat source (the element designated as the heat source) (for example, Figure 4 The temperature sensor 476 in, or Figure 5 The processor 520 may obtain a first temperature associated with surface heating of the electronic device 501 (e.g., a surface temperature generated due to heating) by using the temperature sensors 576-1 to 576-8 in the temperature sensors 576-1 to 576-8 (or at least one of the temperature sensors respectively arranged in positions corresponding to the heat sources (elements designated as the heat sources)). For example, the processor 520 may obtain the first temperature of the electronic device 501 by periodically checking a plurality of temperature values ​​(or a temperature value) measured by the temperature sensors (or at least one temperature sensor) associated with surface heating among the temperature sensors 576-1 to 576-8 according to a specified period. Alternatively, the processor 520 may obtain the first temperature by using a plurality of temperature values ​​(or a temperature value) measured by the temperature sensors (or at least one temperature sensor) associated with surface heating and a stored algorithm (e.g., a linear regression analysis algorithm) for predicting the surface temperature generated due to heating. For example, the processor 520 may obtain a first temperature by using multiple temperature values ​​(or one temperature value) from a temperature sensor (at least one temperature sensor) arranged near the surface of the electronic device 501, or the processor 520 may obtain a predicted first temperature by learning that takes into account multiple temperature values ​​(or one temperature value) from the temperature sensor (at least one temperature sensor) and the operation type of the electronic device 501.

[0123] In operation 620, when the first temperature is equal to or higher than a specified temperature (e.g., a first threshold or a first threshold temperature value), the processor 520 may check a second temperature associated with a first communication (e.g., 5G communication). According to various embodiments, the specified temperature is a surface temperature generated due to heat, at which the electronic device 501 (or at least one element of the electronic device 501) may fail, or the user may feel uncomfortable due to heat during use of the electronic device 501. The specified temperature may be a first threshold or a first threshold temperature value, and may be stored in the electronic device 501. For example, the first threshold or the first threshold temperature value may be 38°C. In addition, the first threshold or the first threshold temperature value may be configured to another value according to the performance of the electronic device 501 and the external environment. When the first temperature is equal to or higher than the specified temperature, the processor 520 may determine that the state of the electronic device 501 is an overheated state. According to various embodiments, the second temperature associated with the first communication may be a temperature caused by heat generation of at least one first communication-related element among elements (e.g., 5G modem, 5G PAM, 5G antenna) included in the electronic device 501. According to one embodiment, the processor 520 may check the second temperature according to a temperature value obtained by at least one of the temperature sensors 576 - 1 to 576 - 8 adjacent to the element operating when performing the first communication.

[0124] In operation 630, the processor 520 may check the running state of at least one application whose data throughput (e.g., data usage) associated with the first communication is equal to or exceeds the specified throughput (e.g., specified usage) based on the second temperature. According to one embodiment, when the second temperature is equal to or higher than the second threshold, the processor 520 may determine that the electronic device 501 is in an overheated state due to the first communication. According to one embodiment, the second threshold may be equal to or greater than the first threshold. According to one embodiment, in a state where the first temperature is equal to or higher than the first threshold, when the second temperature is higher than the temperature generated by other elements included in the electronic device 501, the processor 520 may determine that the electronic device 501 is in an overheated state due to the first communication. According to one embodiment, in a state where the first temperature is equal to or higher than the first threshold, when the second temperature is higher than the temperature generated by other elements included in the electronic device 501 and is higher than the first temperature by a specified temperature (10°C) or more, the processor 520 may determine that the electronic device 501 is in an overheated state due to the first communication. According to one embodiment, in a state where the first temperature is equal to or higher than the first threshold, when the temperature sensor (whose temperature is the highest among the temperatures of the temperature sensors 576-1 to 576-8) is the temperature sensor associated with the first communication-related element, the processor 520 may determine that the electronic device 501 is in an overheated state due to the first communication. According to various embodiments, when the electronic device is determined to be in an overheated state due to the first communication, the processor 520 may check the running state of at least one application whose data throughput associated with the first communication is equal to or exceeds the specified throughput. According to one embodiment, when the electronic device is determined to be in an overheated state due to the first communication, the processor 520 may use the network usage history information (Netstat information) to identify at least one application whose 5G data usage is equal to or exceeds the specified usage. For example, when the electronic device is determined to be in an overheated state due to the first communication, the processor 520 may identify at least one application whose data throughput associated with the first communication (e.g., data throughput for a predetermined time) is equal to or exceeds the specified data throughput (e.g., 50 megabits per second).

[0125] In operation 640, the processor 520 may adjust the data throughput of a first application in a background state among the at least one identified application. According to various embodiments, the processor 520 may identify whether the running state of the at least one identified application is a background running state or a foreground running state. For example, the background running state may be an invisible state in which the display function of the application is not executed, and the foreground running state may be a visible state in which the display function of the application is executed. For example, the processor 520 may use a call stack of a window manager to identify whether the running state of at least one application is an invisible state or a visible state. According to various embodiments, when the electronic device 501 is in an overheated state due to a first communication, the processor 520 may control the data throughput (or rate) of the first application in a background state and associated with the first communication to be equal to or exceed a specified throughput. According to one embodiment, when the electronic device 501 is in an overheated state due to the first communication, the processor 520 may reduce the data throughput (or rate) of the first application (running in the background state and the data throughput associated with the first communication (e.g., the data throughput for a predetermined time) is equal to or exceeds the specified data throughput (e.g., 50 megabits per second)), but may not reduce or may increase the data throughput (or rate) of the second application (running in the foreground state and the data throughput associated with the first communication is equal to or exceeds the specified data throughput (e.g., 50 megabits per second)). According to various embodiments, the processor 520 may apply a preconfigured control strategy (or control scheme) (e.g., a speed reduction scheme) to control the data throughput (or rate) of the first application. According to various embodiments, the speed reduction scheme may include at least one of a CPU group control scheme or a CPU runtime control scheme. According to one embodiment, when the CPU group control scheme is used, the processor 520 may reduce the data throughput (or rate) of the first application by causing a core having a low data throughput (or data usage) (e.g., a core having a data throughput equal to or less than a threshold) among a plurality of cores that are different from each other in CPU processing performance to process data of the first application.

[0126] According to various embodiments, the processor 520 may select a CPU runtime control level or a CPU group control level according to the level of heat generated due to the first communication and the size (or amount) of the data throughput of the first application. According to various embodiments, the processor 520 may provide a CPU runtime control value according to the selected CPU runtime control level, or, according to the selected CPU group control level, the processor 520 may provide a CPU group control value. For example, the processor 520 may be configured such that the reduction value of the data throughput increases with the temperature rise caused by the heat generation of the first communication, and the reduction value of the data throughput increases with the size of the data throughput of the first application. For example, the processor 520 may configure the reduction value of the data throughput in consideration of the temperature generated due to the heat generation of the first communication and the size of the data throughput of the first application.

[0127] According to various embodiments, when the CPU runtime control scheme is used, the processor 520 can reduce the data throughput (or rate) of the first application by reducing the runtime associated with processing the data of the first application in the bandwidth of the CPU used to process the data of the first application. For example, as the data throughput (or rate) of the first application is reduced, the data throughput associated with the first communication is also reduced, and therefore, the load applied to the elements associated with the first communication is also reduced. Therefore, the heat generation of each element associated with the first communication can be reduced. The surface temperature generated by the heat generation of the electronic device 501 can also be reduced by reducing the heat generation of each element associated with the first communication, so the heating state of the electronic device 501 can be restored from the overheating state to the normal state. That is, when the first temperature of the electronic device 501 is lower than the first threshold or the second temperature is lower than the second threshold, the electronic device 501 can return from the overheating state to the normal state. According to various embodiments, when the heating state of the electronic device 501 returns from the overheating state to the normal state, the processor 520 can stop controlling the data throughput of the first application, and can process data based on the data throughput in the default state.

[0128] Figure 7 is a flowchart 700 illustrating an application data processing operation in an electronic device according to an embodiment of the present disclosure.

[0129] Reference Figure 7 , an operation method may include operations 710 to 740. Each operation (or each step) of the operation method may be performed by an electronic device (eg, Figure 1 and Figure 2 The electronic device 101, Figure 3 The electronic device 301, Figure 4 The electronic device 401, or Figure 5In one or more processors of the electronic device 501 (eg, Figure 1 and Figure 2 The processor 120, Figure 3 The processor 320 in Figure 4 The processor 420 in Figure 5 According to one embodiment, at least one of operations 710 to 740 may be omitted, the order of some operations may be changed, and another operation may be added.

[0130] In operation 710, the processor 520 may identify that the data throughput associated with the first communication is an application to be controlled based on the overheating state caused by the first communication. According to one embodiment, the processor 520 may obtain the ID of at least one application having the data throughput (or data usage) associated with the 5G communication, the data throughput of the at least one application, and / or a list of applications whose data throughput is to be controlled based on the running state of the at least one application in the electronic device 501.

[0131] In operation 720, the processor 520 may identify a control scheme and a control level for application data throughput. According to various embodiments, the processor 520 may identify in the speed reduction scheme whether the control scheme is a CPU group control scheme or a CPU runtime control scheme. When the control scheme is a CPU group control scheme, the processor 520 may identify the CPU group control level. When the control scheme is a CPU runtime control scheme, the processor 520 may identify the CPU runtime control level. For example, the CPU group control level may indicate which of the multiple cores of the CPU is to be used and the usage level of the core. The CPU runtime control level may be a level indicating how long the runtime of the CPU bandwidth is adjusted.

[0132] In operation 730, based on the CPU group control scheme and the CPU group control level, the processor 520 may move tasks of an application processed in a first core (e.g., a large core) among a plurality of cores having different processing performances from each other in the CPU so as to process the tasks in a second core (e.g., a small core). For example, when the tasks of an application are transferred to and processed by a small core having a small data throughput, the data throughput of the application may be reduced.

[0133] In operation 740, based on the CPU runtime control scheme and the CPU runtime control level, the processor 520 may change the quota value so that the CPU bandwidth allocated to the application is reduced from the first bandwidth (e.g., five to six seconds) to the second bandwidth (e.g., three seconds). For example, when the quota value is changed to three seconds, each bandwidth of the process associated with the application in the CPU (or each core of the CPU) cannot be executed for more than three seconds, and thus the data throughput of the application may be reduced.

[0134] Fig. 8A is a view 801 for describing CPU running time according to various embodiments, Figure 8B 802 is a view for describing a state in which a CPU runtime is controlled according to an embodiment of the present disclosure.

[0135] Reference Fig. 8A and Figure 8B , electronic devices ( Figure 1 and Figure 2 The electronic device 101, Figure 3 The electronic device 301, Figure 4 The electronic device 401, or Figure 5 At least one processor (eg, Figure 1 and Figure 2 The processor 120, Figure 3 The processor 320 in Figure 4 The processor 420 in Figure 5 The processor 520 in the embodiment may include a CPU (or AP), and the CPU may include at least one core.

[0136] Reference Fig. 8A According to various embodiments, the CPU core can operate using a specified cycle 810 (e.g., cycle = 20 milliseconds), and can be configured to: process data of a first application (e.g., a task) for a specified (or default) bandwidth (hereinafter, referred to as a "first bandwidth") cycle 820 (e.g., quota = 17 milliseconds) in each cycle in a default state, and not process data of the first application in a cycle 830 (e.g., 3 milliseconds) outside the first bandwidth cycle 820.

[0137] Reference Figure 8B, when it is identified that the data throughput associated with the first communication is based on the first application controlled due to the overheating state of the first communication and the CPU runtime control level of the first application, the processor 520 according to various embodiments may reduce the first bandwidth cycle 820 associated with the first application. For example, when the quota value corresponding to the CPU runtime control level of the first application is adjusted (limited) to 10 milliseconds, the processor 520 may process the data (task) of the first application in the second bandwidth cycle 825 (e.g., quota=10 milliseconds) of each cycle, and may not process the data of the first application in the cycle 835 (e.g., 10 milliseconds) outside the second bandwidth cycle 825. According to one embodiment, the processor 520 may be configured not to process the data of the first application in the cycle 835 (e.g., 10 milliseconds) outside the second bandwidth cycle 825, but to process the second application or another process. According to various embodiments, when the quota value is changed from 17 milliseconds to 10 milliseconds, the execution time of the process associated with the first application in the core of the CPU per cycle may not exceed 10 milliseconds, and thus the data throughput of the first application may be reduced. Furthermore, when the data throughput of the first application decreases, heat generation associated with the first communication may decrease, and thus the performance of the electronic device 501 may be prevented from being degraded due to heat generation.

[0138] Fig.9A is a diagram 901 for describing a CPU group according to various embodiments, Fig. 9B is a view 902 for describing a state in which a CPU group is controlled according to various embodiments of the present disclosure.

[0139] Reference Fig.9A and Fig. 9B , electronic devices (e.g. Figure 1 and Figure 2 The electronic device 101, Figure 3 The electronic device 301, Figure 4 The electronic device 401, or Figure 5 At least one processor (eg, Figure 1 and Figure 2 The processor 120, Figure 3 The processor 320 in Figure 4 The processor 420 in Figure 5The processor 520 in the embodiment may include a CPU (or AP) 920, and the CPU 920 may include a plurality of cores. According to one embodiment, the plurality of cores may include a first core 922, a second core 924, and a third core 926. In addition, the plurality of cores may further include another core. For example, the first core 922 may be a large core, the second core 924 may be a medium core, and the third core 926 may be a small core. The large core may be a core capable of processing data at a first speed (Hz), the medium core may be a core capable of processing data at a second speed slower than the first speed, and the small core may be a core capable of processing data at a third speed slower than the second speed.

[0140] Reference Fig.9A According to various embodiments, the CPU 920 may process tasks (or data) of applications such as A 91 (e.g., a game application), B 92 (e.g., a photo application), C 93 (e.g., a video application), and D 94 (e.g., a web browser application). According to one embodiment, in a default state (not an overheat state), according to a specified data allocation processing method, the CPU 920 may allocate applications A 91, B 92, C 93, and D 94 to at least one of the multiple cores and process the same content. For example, the CPU 920 may process the data of applications A 91 and C 93 by using a large core 922 among the multiple cores, may process the data of applications B 92 and D 94 by using a medium core 924, and may process the data of application B 92 by using a small core 926.

[0141] Reference Fig. 9B When the first communication causes the electronic device to overheat, if application C 93 having a high data throughput associated with the first communication and being in a background state and the CPU group control level of application C 93 are identified, the CPU 920 according to various embodiments may move the data (e.g., tasks) of application C 93 being processed in the large core 922 so as to be processed in the small core 926.

[0142] According to various embodiments, when application C 93 is processed in the small kernel 926, the processing speed of application C 93 is slow and its throughput is reduced, so the heat generation associated with the first communication is reduced. Therefore, the performance of the electronic device 501 can be prevented from being degraded due to its heat generation. For example, when application C 93 is processed in the small kernel 926, the performance of A 91 (e.g., a game application) being executed in the foreground (e.g., top) can be prevented from being degraded.

[0143] Fig.10 An example of a table showing improvement results of performance and heat generation before and after applying data throughput control according to an embodiment of the present disclosure is shown.

[0144] Reference Fig.10 , when electronic devices (e.g. Figure 1 and Figure 2 The electronic device 101, Figure 3 The electronic device 301, Figure 4 The electronic device 401, or Figure 5 At least one processor (eg, Figure 1 and Figure 2 The processor 120, Figure 3 The processor 320 in Figure 4 The processor 420 in Figure 5 The processor 520 in the embodiment has controlled the data throughput of a first application, the first application is in a background state, and the data throughput of the first application associated with a first communication is equal to or exceeds a threshold value. According to the overheating state caused by the first communication in the process of processing tasks (or data) of the first application and the second application in a default state, at least one processor can display the improvement results of performance and heat generation before and after controlling the data throughput of the first application.

[0145] For example, it can be determined that when the processor 520 has controlled the data throughput of the first application, the CPU occupancy rate (%) and the data throughput (Mbps) after the data throughput control may be lower than the data throughput before the data throughput control. Therefore, due to the relatively improved frames per second (FPS) and stability of the second application and the reduced surface temperature due to the heat generation, the heat generation of the electronic device 501 is improved.

[0146] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to those electronic devices described above.

[0147] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalent forms or alternative forms for the corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the nouns in the singular form corresponding to the term may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include all possible combinations of items listed together with the corresponding one of the multiple phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the corresponding component from another component, and do not limit the component in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “coupled with another element (e.g., the second element)”, “coupled to another element (e.g., the second element)”, “connected with another element (e.g., the second element)”, or “connected to another element (e.g., the second element)” with or without the terms “operably” or “communicatively” being used, it means that the element may be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0148] As used herein, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or a minimum unit or portion of the single integrated component. For example, according to an embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0149] The various embodiments described herein may be implemented as software (e.g., program 140) including one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). For example, under the control of a processor, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) may call at least one of the one or more instructions stored in the storage medium and execute the at least one instruction with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Among them, the term "non-transitory" only means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but the term does not distinguish between data being semi-permanently stored in the storage medium and data being temporarily stored in the storage medium.

[0150] According to an embodiment, the method according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be published in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be published online (e.g., downloaded or uploaded) via an application store (e.g., Play StoreTM), or may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smart phones). If published online, at least part of the computer program product may be temporarily generated, or at least part of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a manufacturer's server, an application store's server, or a memory of a forwarding server).

[0151] According to various embodiments, each of the above-mentioned components (e.g., a module or a program) may include a single entity or multiple entities. According to various embodiments, one or more of the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., a module or a program) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as a corresponding one of the multiple components performing one or more functions before integration. According to various embodiments, the operations performed by a module, a program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more of the operations may be run or omitted in a different order, or one or more other operations may be added.

[0152] According to various embodiments, in a non-transitory computer-readable storage medium storing instructions, the instructions are configured to: when the instructions are executed by at least one processor, cause the at least one processor to perform at least one operation. The at least one operation may include: obtaining a first temperature associated with the electronic device through a temperature sensor; when the first temperature is equal to or higher than a first threshold, identifying (or checking) a second temperature associated with the first communication; when the second temperature is equal to or higher than a second threshold, identifying (or checking) the running state of at least one application whose data throughput associated with the first communication is equal to or higher than a specified throughput; and adjusting the data throughput of a first application running in a background state among the at least one application.

[0153] While the present disclosure has been described with reference to various embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present disclosure as defined by the appended claims and their equivalents.

Claims

1. An electronic device, the electronic device include: at least one antenna module; a first communication circuit configured to provide a first communication via the at least one antenna module; at least one temperature sensor; one or more processors; as well as a memory storing instructions which, when executed individually or collectively by the one or more processors, cause the electronic device to: identifying, via the at least one temperature sensor, a temperature associated with the first communication with the electronic device, Based on the temperature being equal to or greater than a threshold, identifying a first application in at least one application in which a data throughput associated with the first communication is equal to or greater than a specified throughput, and A first data throughput of the first application is adjusted by changing a running time of one or more processors for processing data of the first application.

2. The electronic device according to claim 1, further comprising: include: case, Wherein, when executed by the one or more processors, the instructions cause the electronic device to: obtaining, via the at least one temperature sensor, a temperature on a surface of the housing based on heat generation in the electronic device, Based on a temperature on a surface of the housing being equal to or higher than a threshold, a temperature associated with the first communication is obtained via the at least one temperature sensor.

3. The electronic device according to claim 1, in, When executed by the one or more processors, the instructions cause the electronic device to: identifying whether the first application is running in a background state or a foreground state, and When the first application is running in the background state, the first data throughput of the first application is adjusted, and when the first application is running in the foreground state, the first data throughput of the first application is maintained.

4. The electronic device according to claim 3, wherein the electronic device further comprises: include: monitor, The background state includes a state in which the electronic device does not display a screen of the first application on the display of the electronic device, and The foreground state includes a state in which the electronic device displays the screen of the first application on the display of the electronic device.

5. The electronic device according to claim 1, in, The one or more processors include a plurality of processors, Wherein, when executed by the one or more processors, the instructions cause the electronic device to: use at least one processor among the multiple processors to process data of the first application, and adjust the first data throughput of the first application by changing the running time of the at least one processor used to process data of the first application.

6. The electronic device according to claim 1, in, When executed by the one or more processors, based on the use of a CPU runtime control scheme, the instructions cause the electronic device to: within the CPU bandwidth, change the runtime of at least one of the one or more processors for processing data of the first application from a first time interval to a second time interval that is smaller than the first time interval.

7. The electronic device according to claim 6, in, When executed by the one or more processors, based on the CPU runtime control scheme being used, the instructions cause the electronic device to: change a quota value within the bandwidth of at least one of the one or more processors used to process data of the first application from a first time value to a second time value that is less than the first time value.

8. The electronic device according to claim 1, in, The one or more processors include a first core and a second core, and Wherein, when executed by the one or more processors, a CPU group control scheme is used, and the instructions cause the electronic device to: adjust the first data throughput of the first application by changing the first core used to process data of the first application to the second core having a processing speed slower than the first core.

9. The electronic device according to claim 1, further comprising: include: a second communication circuit configured to provide a second communication via the at least one antenna module, The first communication circuit and the second communication circuit operate in different networks.

10. The electronic device according to claim 9, in, The first communication circuit includes a fifth generation 5G modem, and The second communication circuit includes a fourth generation 4G or long term evolution LTE modem.

11. A method for controlling data throughput based on heat generation in an electronic device, the method include: identifying, via at least one temperature sensor, a temperature associated with the first communication; identifying, based on the temperature being equal to or greater than a threshold, a first application in at least one application in which a data throughput associated with the first communication is equal to or greater than a specified throughput; as well as A first data throughput of the first application is adjusted by changing a running time of one or more processors of the electronic device for processing data of the first application.

12. The method according to claim 11, further comprising: include: obtaining, via the at least one temperature sensor, a temperature on a surface of a housing of the electronic device based on heat generation in the electronic device; as well as Based on a temperature on a surface of the housing being equal to or higher than a threshold, a temperature associated with the first communication is obtained via the at least one temperature sensor.

13. The method according to claim 11, further comprising: include: Identify whether the first application is running in a background state or a foreground state; as well as When the first application is operating in the background state, the first data throughput of the first application is adjusted, or when the first application is running in the foreground state, the first data throughput of the first application is maintained.

14. The method according to claim 13, in, The background state includes a state in which the electronic device does not display a screen of the first application on a display of the electronic device, and The foreground state includes a state in which the electronic device displays the screen of the first application on the display of the electronic device.

15. The method according to claim 13, in, Based on the CPU runtime control scheme being used, the runtime of at least one processor of the one or more processors for processing data of the first application is changed from a first time interval to a second time interval smaller than the first time interval within the CPU bandwidth.

16. The method according to claim 13, in, Based on the CPU runtime control scheme being used, a quota value within a bandwidth of at least one processor of the one or more processors for processing data of the first application is changed from a first time value to a second time value less than the first time value.

17. The method according to claim 13, in, Based on the CPU group control scheme being used, a first core for processing data of the first application is changed to a second core having a processing speed slower than the first core, so that the first data throughput of the first application is adjusted.

18. The method according to claim 11, in, The first communication circuit includes a fifth generation 5G modem.

19. A non-transitory computer-readable recording medium having recorded thereon at least one program including commands, the commands when executed by a computer performing a method, the method include: identifying, via at least one temperature sensor, a temperature associated with the first communication; identifying, based on the temperature being equal to or greater than a threshold, a first application in at least one application in which a data throughput associated with the first communication is equal to or greater than a specified throughput; as well as A first data throughput of the first application is adjusted by changing a running time of one or more processors for processing data of the first application.

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