Semiconductor packaging structure

Abstract

According to the technical scheme, the semiconductor packaging structure is characterized in that the semiconductor packaging structure comprises a shell, an outer shell is arranged on the top face of the shell, an inner frame is fixedly installed in the shell, and a chip body is arranged in the inner frame; during use, heat generated by the pins can be absorbed by surrounding the connecting pins through the top grooves, convection between the heat and the outside can be dissipated by the heat dissipation block through fitting of the heat conduction pad and the chip body, and meanwhile, the contact area between the heat dissipation block and the outside can be enlarged through arrangement of the copper columns, so that the heat dissipation effect is further improved, and the service life of the chip is prolonged. During use, after the outer shell and the shell body are installed, the copper blocks and the clamping grooves are arranged together in a sleeved mode at the moment, heat generated by the pins can be transmitted to the outside through the heat dissipation columns, the heat dissipation effect on the pin portions is achieved, and after the outer shell and the shell body are installed, organic silica gel can be injected into the injection molding grooves to achieve the dustproof and waterproof purposes. And meanwhile, internal pins and other devices can be fixed, and the stability of the equipment is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and particularly relates to a semiconductor packaging structure. Background Art

[0002] A semiconductor refers to a material whose electrical conductivity at room temperature is between that of a conductor and an insulator. Semiconductor packaging means that after the chip is manufactured, in order to protect the chip, achieve electrical connection, and facilitate application, the chip is packaged in a housing. With the continuous development of the semiconductor industry, people have higher and higher requirements for semiconductors, hoping that the electrical performance of semiconductors can be better and the manufacturing cost can be lower. In order to better meet the market demand, the chip design and development end continuously improves the chip design, and at the same time, puts forward higher requirements for the packaging design and development end.

[0003] Traditional semiconductor packaging structures usually directly couple the chip surface with a radiator using a heat-conducting material, and transfer the heat generated by the chip to the outside through a single heat conduction path. For example, during the operation of the device, the packaging pins generate significant heat. However, the existing technology mainly focuses on the heat dissipation of the chip surface and ignores the problem of heat accumulation in the pins, resulting in poor subsequent heat conduction and heat dissipation effects. To solve the above problems, we propose a semiconductor packaging structure. Summary of the Invention

[0004] In view of the deficiencies of the prior art, the present invention provides a semiconductor packaging structure to solve the problems raised in the background art.

[0005] The above technical objectives of the present invention are achieved through the following technical solutions:

[0006] A semiconductor packaging structure, comprising: a housing, an outer shell is provided on the top surface of the housing, an inner frame is fixedly installed inside the housing, and a chip body is provided inside the inner frame; a heat conduction component, which is provided on the bottom surface of the housing for heat conduction; a heat dissipation component, which is provided on the top surface of the outer shell for heat dissipation.

[0007] By adopting the above technical solution, by providing a heat conduction component, it is used to effectively transfer the heat generated by the chip body, and heat dissipation treatment is carried out through the heat dissipation component, avoiding the situation in the prior art that mainly focuses on the heat dissipation of the chip surface and ignores the problem of heat accumulation in the pins.

[0008] Preferably, the heat conduction component includes: a plurality of bottom grooves, all of the plurality of bottom grooves are opened on the bottom surface of the housing, an elastic pin is fixedly installed inside the bottom groove, a plurality of side holes are opened on the outer side of the inner frame, a connection pin is fixedly installed inside the side hole, a plurality of bottom holes are opened inside the housing, the bottom holes communicate with the adjacent bottom grooves, one end of the connection pin is electrically connected to the chip body, and the other end passes through the bottom hole and is fixedly connected to the elastic pin together.

[0009] By adopting the above technical solution, by setting the connection between the connection pin and the elastic pin, the chip body can be connected to achieve the purpose of preliminary encapsulation.

[0010] Preferably, the heat conduction component further includes: four heat conduction plates, all of the four heat conduction plates are fixedly installed inside the housing, a plurality of top grooves are opened on the top surface of the heat conduction plate, the top grooves are sleeved with the adjacent connection pins, a heat conduction block is arranged between every two adjacent heat conduction plates, the heat conduction block is fixedly connected to the housing, a plurality of L-shaped holes are opened on one side of the heat conduction block, a plurality of heat conduction holes are opened on one side of the heat conduction plate, a copper tube is fixedly installed inside the heat conduction hole, and the left and right ends of the copper tube are sleeved with the adjacent L-shaped holes.

[0011] By adopting the above technical solution, by setting the heat conduction plate, during use, the heat generated by the pins can be absorbed by surrounding the connection pins with the top grooves, and through the connection of the copper tubes, a plurality of heat conduction blocks and heat conduction plates can be connected for effective heat conduction, so as to wait for subsequent heat dissipation treatment.

[0012] Preferably, the heat dissipation component includes: a top hole, the top hole is opened on the top surface of the outer shell, a heat dissipation block is fixedly installed inside the top hole, a heat conduction pad is fixedly installed on the bottom surface of the heat dissipation block, the heat conduction pad is attached to the chip body, a heat dissipation groove is opened on the top surface of the heat dissipation block, and a plurality of copper columns are fixedly installed inside the heat dissipation groove.

[0013] By adopting the above technical solution, by setting the copper columns, during use, the heat dissipation block can dissipate heat to the outside through convection with the heat through the attachment of the heat conduction pad and the chip body, and at the same time, through the setting of the copper columns, the contact area between the heat dissipation block and the outside can be enlarged, further increasing the heat dissipation effect.

[0014] Preferably, the heat dissipation component further includes: a plurality of installation holes, all of the plurality of installation holes are opened on the top surface of the outer shell, a heat dissipation column is fixedly installed inside the installation hole, a clamping groove is opened on the bottom surface of the heat dissipation column, a copper block is fixedly installed on the top surface of the heat conduction block, and the copper block is sleeved with the clamping groove.

[0015] By adopting the above technical solution, by setting heat dissipation columns, when the outer shell and the housing are installed during use, at this time the copper block and the card slot are sleeved together, and the heat generated by the pins can be transferred to the outside through the heat dissipation columns, achieving the effect of dissipating heat from the pin part.

[0016] Preferably, a plurality of fixing holes are formed in the top surface of the housing, and a plurality of connecting columns are fixedly installed on the bottom surface of the outer shell, and the fixing holes and the adjacent connecting columns are sleeved together.

[0017] By adopting the above technical solution, by setting fixing holes for sleeving connecting columns, the installation of the outer shell and the housing can be realized.

[0018] Preferably, four support grooves are formed in the bottom surface of the housing, the support grooves communicate with the adjacent fixing holes, a support plate is arranged inside the support grooves, and a spring is fixedly installed on the top surface of the support plate.

[0019] By adopting the above technical solution, by setting a spring, during use, through the installation of the elastic pins and the main board, the effect of raising the housing can be achieved. At the same time, the spring can be pushed by the connecting column to fit the main board by the support plate, so as to stably support the device and avoid direct contact with the main board resulting in heat transfer and affecting the operation of the device.

[0020] Preferably, two sliding grooves are respectively formed on the four sides of the housing, two sliders are fixedly installed on the top surface of the support plate, the sliders and the adjacent sliding grooves are sleeved together, a limiting groove is formed on one side of the sliding groove, and a limiting block is fixedly installed on one side of the slider, and the limiting block and the limiting groove are sleeved together.

[0021] By adopting the above technical solution, by setting a limiting groove for sleeving with the limiting block, the installation of the support plate can be realized, and at the same time, it can move with the expansion and contraction of the spring, increasing the practicability.

[0022] Preferably, a plurality of injection holes are formed in the top surface of the outer shell, an injection pipe is fixedly installed inside the injection holes, a plurality of injection grooves are formed in the housing, an exhaust hole is formed in the top surface of the housing, and a one-way valve is fixedly installed inside the exhaust hole.

[0023] By adopting the above technical solution, by setting an injection pipe, when the outer shell and the housing are installed during use, silicone gel can be injected into the injection grooves to achieve the purpose of dust and water prevention, and at the same time, the internal pins and other devices can be fixed, increasing the stability of the device.

[0024] Preferably, a sealing plug is sleeved inside the injection pipe, and a heat insulation pad is fixedly installed on the bottom surface of the support plate.

[0025] By adopting the above technical solution, a heat insulation pad is provided to cooperate with the support plate to fit the main board and further isolate the heat transfer.

[0026] In summary, the present invention mainly has the following beneficial effects:

[0027] By providing a heat conduction component for effectively transferring the heat generated by the chip body and performing heat dissipation treatment through a heat dissipation component, it avoids the problem that the prior art mainly focuses on the heat dissipation of the chip surface while ignoring the heat accumulation problem of the pins. By providing the connection between the connection pins and the elastic pins, the initial encapsulation purpose can be achieved by connecting the chip body.

[0028] By providing a heat conduction plate, when in use, the heat generated by the pins can be absorbed by surrounding the connection pins through the top groove, and through the connection of the copper pipe, several heat conduction blocks and the heat conduction plate can be connected for effective heat conduction, waiting for subsequent heat dissipation treatment. By providing copper columns, when in use, through the fitting of the heat insulation pad and the chip body, the heat dissipation block can dissipate heat to the outside through convection with the heat, and at the same time, through the setting of the copper columns, the contact area between the heat dissipation block and the outside can be expanded, further increasing the heat dissipation effect.

[0029] By providing heat dissipation columns, when the outer shell and the housing are installed, at this time, the copper block and the card slot are sleeved together, and the heat generated by the pins can be transferred to the outside through the heat dissipation columns, achieving the effect of dissipating heat from the pin part. By providing fixing holes for sleeving connection columns to realize the installation of the outer shell and the housing.

[0030] By providing springs, during use, through the installation of the elastic pins on the main board, the effect of raising the housing can be achieved. At the same time, the spring can be pushed by the connection column to fit the main board by the support plate to stably support the device, avoiding direct contact with the main board to cause heat transfer and affecting the operation of the device. By providing limit grooves for sleeving with limit blocks, the installation of the support plate can be realized, and at the same time, it can move with the expansion and contraction of the spring, increasing the practicality.

[0031] By providing an injection tube, when the outer shell and the housing are installed, silicone gel can be injected into the injection groove for the purpose of dust and water prevention, and at the same time, the internal pins and other components can be fixed, increasing the stability of the device. By providing a heat insulation pad to cooperate with the support plate to fit the main board and further isolate the heat transfer. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 is a three-dimensional structural schematic diagram of the present invention;

[0033] Figure 2 is a schematic diagram of the inner frame structure of the present invention;

[0034] Figure 3 isFigure 2 Schematic diagram of the partial enlarged structure of A

[0035] Figure 4 Schematic diagram of the housing structure of the present invention

[0036] Figure 5 Schematic diagram of the bottom view of the housing of the present invention

[0037] Figure 6 is Figure 2 Schematic diagram of the partial enlarged structure of B

[0038] Reference numerals: 100, housing; 200, outer shell; 300, inner frame; 400, chip body; 500, heat conduction component; 501, bottom groove; 502, elastic pin; 503, side hole; 504, connection pin; 505, bottom hole; 506, heat conduction plate; 507, top groove; 508, heat conduction block; 509, L-shaped hole; 510, heat conduction hole; 511, copper pipe; 600, heat dissipation component; 601, top hole; 602, heat dissipation block; 603, heat conduction pad; 604, heat dissipation groove; 605, copper column; 606, mounting hole; 607, heat dissipation column; 608, card slot; 609, copper block; 700, fixing hole; 701, connection column; 702, support groove; 703, support plate; 704, spring; 705, sliding groove; 706, slider; 707, limiting groove; 708, limiting block; 800, injection hole; 801, injection pipe; 802, injection groove; 803, exhaust hole; 804, one-way valve; 900, sealing plug; 901, heat insulation pad Detailed implementation manners

[0039] In order to make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the following will clearly and completely describe the technical solutions of the embodiments of the present invention with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the described embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the scope of protection of the present invention

[0040] The following embodiments are used to illustrate the present invention, but cannot be used to limit the scope of protection of the present invention. The conditions in the embodiments can be further adjusted according to specific conditions. Any simple improvement to the method of the present invention under the premise of the concept of the present invention shall fall within the scope of protection required by the present invention

[0041] Refer to Figures 1 - 6, a semiconductor package structure, comprising: a housing 100, on the top surface of the housing 100 there is an outer shell 200, inside the housing 100 there is fixedly installed an inner frame 300, inside the inner frame 300 there is a chip body 400, on the bottom surface of the housing 100 there is a heat conduction component 500 for heat conduction, on the top surface of the outer shell 200 there is a heat dissipation component 600 for heat dissipation. By providing the heat conduction component 500, it is used to effectively transfer the heat generated by the chip body 400, and heat dissipation treatment is carried out through the heat dissipation component 600, avoiding the problem that the prior art mainly focuses on the heat dissipation of the chip surface while ignoring the accumulation of heat in the pins. The heat conduction component 500 includes: a plurality of bottom grooves 501, all of the plurality of bottom grooves 501 are opened on the bottom surface of the housing 100, inside the bottom groove 501 there is fixedly installed an elastic pin 502, on the outer side of the inner frame 300 there are a plurality of side holes 503, inside the side hole 503 there is fixedly installed a connection pin 504, inside the housing 100 there are a plurality of bottom holes 505, the bottom holes 505 are communicated with the adjacent bottom grooves 501, one end of the connection pin 504 is electrically connected to the chip body 400, and the other end passes through the bottom hole 505 and is fixedly connected to the elastic pin 502. By providing the connection between the connection pin 504 and the elastic pin 502, the chip body 400 can be connected to achieve the initial packaging purpose.

[0042] Reference Figures 1 - 6, the heat conduction component 500 further includes: four heat conduction plates 506, all four heat conduction plates 506 are fixedly installed inside the housing 100. A plurality of top grooves 507 are formed on the top surface of the heat conduction plate 506, and the top grooves 507 are sleeved with the adjacent connection pins 504. A heat conduction block 508 is arranged between every two adjacent heat conduction plates 506, and the heat conduction block 508 is fixedly connected to the housing 100. A plurality of L-shaped holes 509 are formed on one side of the heat conduction block 508, and a plurality of heat conduction holes 510 are formed on one side of the heat conduction plate 506. A copper tube 511 is fixedly installed inside the heat conduction holes 510, and the left and right ends of the copper tube 511 are sleeved with the adjacent L-shaped holes 509. By providing the heat conduction plate 506, during use, the heat generated by the pins can be absorbed by surrounding the connection pins 504 through the top grooves 507. And through the connection of the copper tubes 511, a plurality of heat conduction blocks 508 and heat conduction plates 506 can be connected to conduct heat effectively for subsequent heat dissipation treatment. The heat dissipation component 600 includes: a top hole 601, the top hole 601 is formed on the top surface of the outer shell 200. A heat dissipation block 602 is fixedly installed inside the top hole 601. A heat conduction pad 603 is fixedly installed on the bottom surface of the heat dissipation block 602, and the heat conduction pad 603 is attached to the chip body 400. A heat dissipation groove 604 is formed on the top surface of the heat dissipation block 602, and a plurality of copper columns 605 are fixedly installed inside the heat dissipation groove 604. By providing the copper columns 605, during use, through the attachment of the heat conduction pad 603 and the chip body 400, the heat dissipation block 602 can dissipate heat to the outside through convection, and at the same time, through the arrangement of the copper columns 605, the contact area between the heat dissipation block 602 and the outside can be enlarged, further increasing the heat dissipation effect.

[0043] Reference Figures 1 - 6 , the heat dissipation component 600 further includes: a plurality of mounting holes 606, all the plurality of mounting holes 606 are formed on the top surface of the outer shell 200. A heat dissipation column 607 is fixedly installed inside the mounting holes 606. A clamping groove 608 is formed on the bottom surface of the heat dissipation column 607. A copper block 609 is fixedly installed on the top surface of the heat conduction block 508, and the copper block 609 is sleeved with the clamping groove 608. By providing the heat dissipation column 607, during use, when the outer shell 200 and the housing 100 are installed, at this time, the copper block 609 and the clamping groove 608 are sleeved together, and the heat generated by the pins can be transferred to the outside through the heat dissipation column 607, achieving the effect of dissipating heat from the pin part. A plurality of fixing holes 700 are formed on the top surface of the housing 100. A plurality of connecting columns 701 are fixedly installed on the bottom surface of the outer shell 200, and the fixing holes 700 are sleeved with the adjacent connecting columns 701. By providing the fixing holes 700, they are used to sleeve the connecting columns 701 to realize the installation of the outer shell 200 and the housing 100.

[0044] Reference Figures 1 - 6, four support grooves 702 are formed in the bottom surface of the housing 100. The support grooves 702 communicate with the adjacent fixing holes 700. A support plate 703 is arranged inside the support grooves 702. A spring 704 is fixedly installed on the top surface of the support plate 703. By arranging the spring 704, during use, through the installation of the elastic pins 502 on the main board, the effect of raising the housing 100 can be achieved. At the same time, the spring 704 can be pushed by the connecting column 701 to fit the main board, so as to stably support the device, avoid direct contact with the main board causing heat transfer and affecting the operation of the device. Two sliding grooves 705 are respectively formed on the four sides of the housing 100. Two sliding blocks 706 are fixedly installed on the top surface of the support plate 703. The sliding blocks 706 are sleeved with the adjacent sliding grooves 705. A limiting groove 707 is formed on one side of the sliding groove 705. A limiting block 708 is fixedly installed on one side of the sliding block 706. The limiting block 708 is sleeved with the limiting groove 707. By arranging the limiting groove 707, which is used to be sleeved with the limiting block 708, the installation of the support plate 703 can be realized, and at the same time, it can move along with the expansion and contraction of the spring 704, increasing the practicability.

[0045] Reference Figures 1 - 6 , a plurality of injection holes 800 are formed in the top surface of the outer shell 200. An injection pipe 801 is fixedly installed inside the injection holes 800. A plurality of injection grooves 802 are formed in the housing 100. An exhaust hole 803 is formed in the top surface of the housing 100. A one-way valve 804 is fixedly installed inside the exhaust hole 803. By arranging the injection pipe 801, when the outer shell 200 and the housing 100 are installed during use, silicone gel can be injected into the injection grooves 802 to achieve the purpose of dust and water protection, and at the same time, the internal pins and other components can be fixed, increasing the stability of the device. A sealing plug 900 is sleeved inside the injection pipe 801. A heat insulation pad 901 is fixedly installed on the bottom surface of the support plate 703. By arranging the heat insulation pad 901, it is used to cooperate with the support plate 703 to fit the main board and further isolate the heat transfer.

[0046] Working principle: Please refer to Figures 1 - 6As shown, during use, the heat generated by the pins can be absorbed by surrounding the connection pins 504 with the top groove 507. Through the connection of the copper pipe 511, several heat conduction blocks 508 and heat conduction plates 506 can be connected for effective heat conduction, awaiting subsequent heat dissipation treatment. By setting the copper posts 605, during use, through the fitting of the heat conduction pads 603 and the chip body 400, the heat dissipation block 602 can dissipate heat to the outside through convection. At the same time, through the setting of the copper posts 605, the contact area between the heat dissipation block 602 and the outside can be expanded, further enhancing the heat dissipation effect. When the outer shell 200 and the housing 100 are installed during use, at this time, the copper block 609 and the card slot 608 are sleeved together, and the heat generated by the pins can be transferred to the outside through the heat dissipation column 607, achieving the effect of dissipating heat from the pin part. By setting the fixing holes 700 for sleeving the connecting columns 701, the installation of the outer shell 200 and the housing 100 can be achieved. During use, through the installation of the elastic pins 502 on the motherboard, the effect of raising the housing 100 can be achieved. At the same time, the connecting column 701 can push the spring 704 to fit the motherboard by the support plate 703 to stably support the device, avoiding heat transfer caused by direct contact with the motherboard and affecting the operation of the device. By setting the limiting groove 707 for sleeving with the limiting block 708, the installation of the support plate 703 can be achieved, and it can move with the expansion and contraction of the spring 704, increasing the practicality. When the outer shell 200 and the housing 100 are installed during use, silicone gel can be injected into the injection groove 802 to achieve the purpose of dust and water protection, and at the same time, the internal pins and other components can be fixed, increasing the stability of the device. By setting the heat insulation pad 901 to fit the motherboard with the support plate 703 and further isolate the heat transfer.

[0047] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that unless otherwise defined, the technical terms or scientific terms used in the present invention should have the ordinary meaning understood by those with ordinary skills in the field to which the present invention belongs. The words such as "including" or "comprising" used in the present invention mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. The words such as "connected" or "linked" are not limited to physical or mechanical connections, and can also include electrical connections, whether direct or indirect. The words such as "up", "down", "left", "right" are only used to represent relative position relationships. When the absolute position of the object being described changes, the relative position relationship may also change accordingly.

[0048] Although embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor packaging structure, characterized in that: include: A housing (100), wherein a shell (200) is disposed on the top surface of the housing (100), an inner frame (300) is fixedly installed inside the housing (100), and a chip body (400) is disposed inside the inner frame (300); A heat conduction component (500), the heat conduction component (500) being arranged on the bottom surface of the housing (100) and used for heat conduction; A heat dissipation component (600) is arranged on the top surface of the housing (200) and is used for heat dissipation.

2. A semiconductor packaging structure according to claim 1, characterized in that: The heat conducting component (500) comprises: A plurality of bottom grooves (501), wherein the plurality of bottom grooves (501) are all provided on the bottom surface of the shell (100), wherein elastic pins (502) are fixedly installed inside the bottom grooves (501), wherein the outer side of the inner frame (300) is provided with a plurality of side holes (503), wherein connecting pins (504) are fixedly installed inside the side holes (503), wherein the shell (100) is provided with a plurality of bottom holes (505), wherein the bottom holes (505) are connected to adjacent bottom grooves (501), wherein one end of the connecting pin (504) is electrically connected to the chip body (400), and the other end passes through the bottom hole (505) and is fixedly connected to the elastic pin (502).

3. A semiconductor packaging structure according to claim 2, characterized in that: The heat conducting component (500) further comprises: Four heat conducting plates (506), the four heat conducting plates (506) are all fixedly installed inside the shell (100), the top surface of the heat conducting plate (506) is provided with a plurality of top grooves (507), the top grooves (507) are sleeved together with the adjacent connecting pins (504), a heat conducting block (508) is arranged between every two adjacent heat conducting plates (506), the heat conducting block (508) is fixedly connected to the shell (100), a plurality of L-shaped holes (509) are opened on one side of the heat conducting block (508), a plurality of heat conducting holes (510) are opened on one side of the heat conducting plate (506), a copper tube (511) is fixedly installed inside the heat conducting hole (510), and the left and right ends of the copper tube (511) are sleeved together with the adjacent L-shaped holes (509).

4. The semiconductor packaging structure according to claim 1, characterized in that: The heat dissipation assembly (600) comprises: A top hole (601), wherein the top hole (601) is provided on the top surface of the housing (200), a heat sink (602) is fixedly installed inside the top hole (601), a thermal pad (603) is fixedly installed on the bottom surface of the heat sink (602), the thermal pad (603) is bonded to the chip body (400), a heat sink (604) is provided on the top surface of the heat sink (602), and a plurality of copper pillars (605) are fixedly installed inside the heat sink (604).

5. The semiconductor packaging structure according to claim 3, characterized in that: The heat dissipation assembly (600) further includes: A plurality of mounting holes (606) are provided on the top surface of the housing (200); a heat dissipation column (607) is fixedly installed inside the mounting hole (606); a card slot (608) is provided on the bottom surface of the heat dissipation column (607); a copper block (609) is fixedly installed on the top surface of the heat conductive block (508); and the copper block (609) is sleeved together with the card slot (608).

6. The semiconductor packaging structure according to claim 1, characterized in that: The top surface of the shell (100) is provided with a plurality of fixing holes (700), and the bottom surface of the housing (200) is fixedly mounted with a plurality of connecting columns (701), wherein the fixing holes (700) and adjacent connecting columns (701) are sleeved together.

7. The semiconductor package structure according to claim 6, characterized in that: The bottom surface of the shell (100) is provided with four support grooves (702), the support grooves (702) are connected with the adjacent fixing holes (700), a support plate (703) is arranged inside the support groove (702), and a spring (704) is fixedly installed on the top surface of the support plate (703).

8. The semiconductor packaging structure according to claim 7, characterized in that: Two slide grooves (705) are respectively provided on the four sides of the shell (100); two sliders (706) are fixedly installed on the top surface of the support plate (703); the sliders (706) are sleeved together with the adjacent slide grooves (705); a limiting groove (707) is provided on one side of the slide groove (705); a limiting block (708) is fixedly installed on one side of the slider (706); and the limiting block (708) is sleeved together with the limiting groove (707).

9. The semiconductor package structure according to claim 8, characterized in that: The top surface of the shell (200) is provided with a plurality of injection holes (800), an injection tube (801) is fixedly installed inside the injection hole (800), the inside of the shell (100) is provided with a plurality of injection grooves (802), the top surface of the shell (100) is provided with an exhaust hole (803), and a one-way valve (804) is fixedly installed inside the exhaust hole (803).

10. The semiconductor package structure according to claim 9, characterized in that: The interior of the injection tube (801) is sleeved with a sealing plug (900), and the bottom surface of the support plate (703) is fixedly mounted with a heat insulation pad (901).

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