Relay board

Abstract

According to an embodiment of the present disclosure, a relay plate for manufacturing a display may include: a transparent plate; a transparent cushioning material disposed below the plate; and a pattern layer disposed between the plate and the buffer material and including a plurality of patterned holes formed so as to face a plurality of pixel chips of the display.

Description

Technical Field

[0001] An embodiment of the present disclosure relates to a relay board. Background Art

[0002] Thanks to the remarkable development of information and communication technology and semiconductor technology, the distribution and use of various electronic devices are rapidly increasing. In particular, recent electronic devices are developing so that the electronic devices can be carried and used for communication.

[0003] In addition, the electronic device can output the stored information as sound or video. As the integration of electronic devices increases and high-speed, large-capacity wireless communications become more common, recently, various functions can be installed in a single electronic device such as a mobile communication terminal. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions for mobile banking, schedule management and electronic wallet functions are also integrated into one electronic device. Such electronic devices are being miniaturized so that users can carry the electronic devices conveniently. Recently, as the miniaturization, thinness and portability of portable electronic devices such as smart phones have been valued, people are continuously conducting research to make the appearance of electronic devices more beautiful in design. Summary of the invention

[0004] Technical Solution

[0005] According to an embodiment of the present disclosure, a relay board is configured to manufacture a display and may include: a transparent board; a transparent buffer material, which is arranged under the board; and a pattern layer, which is arranged between the board and the buffer material and includes a plurality of patterned holes formed to face a plurality of pixel chips of the display.

[0006] According to an embodiment of the present disclosure, a method for manufacturing a display module of an electronic device may include: a first process of preparing a lower substrate and a plurality of pixel chips; a second process of arranging the plurality of pixel chips on a relay board; a third process of aligning a plurality of patterned holes formed in the relay board to face the plurality of pixel chips of a display; a fourth process of temporarily fixing the relay board and the plurality of pixel chips aligned on the relay board on the lower substrate; and a fifth process of using a laser to weld the plurality of pixel chips to the lower substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 is a block diagram of an electronic device in a network environment according to an embodiment disclosed herein.

[0008] Figure 2 is a perspective view showing a front surface of an electronic device according to an embodiment disclosed herein.

[0009] Figure 3 The present invention is a diagram showing an embodiment according to the present invention. Figure 2 A perspective view of the rear surface of the electronic device is shown.

[0010] Figure 4a The present invention is a diagram showing an embodiment according to the present invention. Figure 2 An exploded perspective view of the front surface of the electronic device is shown.

[0011] Figure 4b The present invention is a diagram showing an embodiment according to the present invention. Figure 2 An exploded perspective view of the rear surface of the electronic device is shown.

[0012] Figure 5a and Figure 5b is a cross-sectional view schematically illustrating a display module in an electronic device according to an embodiment disclosed herein.

[0013] Figure 6 is a cross-sectional view illustrating a process for manufacturing a display module using a relay board in an electronic device according to an embodiment disclosed herein.

[0014] Figure 7a , Figure 7b and Figure 7c is a diagram showing a pattern layer of a relay board according to an embodiment disclosed herein. DETAILED DESCRIPTION

[0015] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to those electronic devices described above.

[0016] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalents or alternative forms for corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the noun in the singular form corresponding to the item may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each phrase in the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include any one or all possible combinations of the items listed together with the corresponding phrase in a plurality of phrases. As used herein, terms such as "the 1st" and "the 2nd" or "the first" and "the second" may be used to simply distinguish the corresponding component from another component, and do not limit the component in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “coupled to another element (e.g., the second element)”, “coupled to another element (e.g., the second element)”, “connected to another element (e.g., the second element)”, or “connected to another element (e.g., the second element)” with or without the terms “operably” or “communicatively” being used, it means that the element may be directly (e.g., wired) coupled to the other element, wirelessly connected to the other element, or coupled to the other element via a third element.

[0017] As used in connection with various embodiments of the present disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or a minimum unit or portion of the single integrated component. For example, depending on the embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0018] According to various embodiments, each component (e.g., module or program) in the above-mentioned components may include a single entity or multiple entities, and some entities in the multiple entities may be separately arranged in different components. According to various embodiments, one or more components in the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each component in the multiple components in the same or similar manner as a corresponding component in the multiple components before integration. According to various embodiments, the operations performed by a module, program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more operations in the operations may be run or omitted in different orders, or one or more other operations may be added.

[0019] Figure 1 is a block diagram illustrating electronic devices in a network environment according to an embodiment of the present disclosure.

[0020] refer to Figure 1 , the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with at least one of the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the above components (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the above-described components (eg, sensor module 176, camera module 180, or antenna module 197) may be implemented as a single component (eg, display module 160).

[0021] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 coupled to the processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 120 may store a command or data received from another component (e.g., sensor module 176 or communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resultant data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operationally independent or combined with the main processor 121. For example, when the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or as part of the main processor 121.

[0022] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 (rather than the main processor 121) may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190) together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) that is functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model may be generated by machine learning. For example, such learning can be performed by the electronic device 101 where the artificial intelligence is executed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN) or a deep Q network or a combination of two or more thereof, but is not limited thereto. Additionally or alternatively, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0023] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134.

[0024] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0025] The input module 150 may receive a command or data to be used by another component (e.g., the processor 120) of the electronic device 101 from outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0026] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker may be used for general purposes such as playing multimedia or playing records. The receiver may be used to receive incoming calls. Depending on the embodiment, the receiver may be implemented as a separate part from the speaker, or as part of the speaker.

[0027] The display module 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display module 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display module 160 may include a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the strength of a force caused by a touch.

[0028] The audio module 170 can convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) coupled to the electronic device 101 or wirelessly coupled.

[0029] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a user's state) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0030] The interface 177 may support one or more specific protocols that will be used to couple the electronic device 101 to an external electronic device (e.g., electronic device 102) (e.g., wired) or wirelessly. According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0031] The connection end 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0032] The haptic module 179 may convert the electric signal into mechanical stimulation (eg, vibration or movement) or electric stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electric stimulator.

[0033] The camera module 180 may capture still images or moving images. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0034] The power management module 188 may manage power supply to the electronic device 101. According to one embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0035] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0036] The communication module 190 can support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)), and support direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate via a first network 198 (e.g., a short-range communication network such as Bluetooth TM , Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (for example, a long-distance communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (for example, a LAN or a wide area network (WAN)))) to communicate with an external electronic device. These various types of communication modules can be implemented as a single component (for example, a single chip), or these various types of communication modules can be implemented as multiple components separated from each other (for example, multiple chips). The wireless communication module 192 can use the user information (for example, the International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196 to identify and authenticate the electronic device 101 in the communication network (such as the first network 198 or the second network 199).

[0037] The wireless communication module 192 can support 5G networks after 4G networks and next-generation communication technologies (e.g., new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine type communications (mMTC), or ultra-reliable low-latency communications (URLLC). The wireless communication module 192 can support high-frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 192 can support various technologies for ensuring performance on high-frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 can support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., a second network 199). According to an embodiment, the wireless communication module 192 can support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane latency for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip).

[0038] The antenna module 197 may transmit a signal or power to the outside of the electronic device 101 (e.g., an external electronic device) or receive a signal or power from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiating element, the radiating element being formed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas by, for example, the communication module 190 (e.g., the wireless communication module 192). A signal or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as a part of the antenna module 197.

[0039] According to various embodiments, the antenna module 197 may form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module may include a printed circuit board, an RFIC, and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a specified high frequency band (e.g., millimeter wave band), and the plurality of antennas are disposed on a second surface (e.g., top surface or side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the specified high frequency band.

[0040] At least some of the above components can be coupled to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and transmit signals (e.g., commands or data) therebetween.

[0041] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 coupled to the second network 199. Each of the electronic device 102 or the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type from the electronic device 101. According to an embodiment, all or some operations to be executed in the electronic device 101 may be executed in one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices receiving the request may execute at least part of the function or service requested, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request in the case of further processing the result or in the case of not further processing the result. To this end, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology or client-server computing technology, for example, may be used. The electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars or health care) based on 5G communication technology or IoT-related technologies.

[0042] Figure 2 is a perspective view showing a front surface of an electronic device 101 according to an embodiment disclosed herein.

[0043] Figure 3 The present invention is a diagram showing an embodiment according to the present invention. Figure 3 A perspective view of the rear surface of the electronic device 101 is shown.

[0044] refer to Figure 2 and Figure 3 According to the electronic device 101 (eg, Figure 1The electronic device 101 may include a housing 110 including a first surface (or front surface) 110A, a second surface (or rear surface) 110B, and a side surface 110C surrounding a space between the first surface 110A and the second surface 110B. In an embodiment (not shown), the housing 110 may refer to a housing formed Figure 2 a first surface 110A of Figure 3 The second surface 110B and Figure 3 The structure of a portion of the side surface 110C.

[0045] According to an embodiment, the first surface 110A may be at least partially formed by a substantially transparent front plate 122 (e.g., a polymer plate or a glass plate including various coatings). The second surface 110B may be formed by a substantially opaque rear plate 111. The rear plate 111 may be formed, for example, of coated or tinted glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS) or magnesium), or a combination of at least two of the above materials. The side surface 110C may be formed by a side structure (or "side frame structure") 118 coupled to the front plate 122 and the rear plate 111 and including a metal and / or a polymer. In an embodiment, the rear plate 111 and the side structure 118 may be integrally formed and may include the same material (e.g., a metal material such as aluminum).

[0046] According to an embodiment, the front plate 122 may include an area that is bent from at least a portion of its edge toward the rear plate 111 and extends seamlessly. For example, the front plate 122 (or the rear plate 111) may include only one of the areas that are bent and extended toward the rear plate 111 (or the front plate 122) at one edge of the first surface 110A. According to an embodiment, the front plate 122 or the rear plate 111 may have a substantially flat shape, and in such a case, the bending and extension area may not be included. In the case where the front plate 122 or the rear plate 111 is bent and includes an extension area, the thickness of the electronic device 101 at the portion including the bending and extension area may be less than the thickness of the electronic device at other portions.

[0047] According to an embodiment, the electronic device 101 may include at least one of a display 115, an audio module (e.g., a microphone hole 103, an external speaker hole 107, a phone call receiver hole 114), a sensor module (e.g., a first sensor module 124, a second sensor module (not shown), and a third sensor module 119), a camera module (e.g., a first camera device 105, a second camera device 112, and a flash 113), a key input device 117, a light emitting element 106, and a connector hole (e.g., a first connector hole 128 and a second connector hole 109). In an embodiment, the electronic device 101 may omit at least one component (e.g., a key input device 117 or a light emitting element 106), or may additionally include other components.

[0048] For example, the display 115 may be visually exposed or output a screen through a considerable portion of the first surface 110A (e.g., the front plate 122). In an embodiment, at least a portion of the display 115 may be visually exposed through the front plate 122 forming the first surface 110A or through a portion of the side surface 110C. In an embodiment, the edge of the display 115 may be formed to be substantially the same as the shape adjacent to the front plate 122. In an embodiment (not shown), in order to expand the area where the display 115 is visually exposed, the distance between the outer edge of the display 115 and the outer edge of the front plate 122 may be formed to be substantially consistent.

[0049] According to an embodiment, the display 115 may have a recess or an opening formed at a portion of its screen display area, and may include at least one of an audio module (e.g., a phone call receiver hole 114), a sensor module (e.g., a first sensor module 124), a camera module (e.g., a first camera device 105), and a light emitting element 106 aligned with the recess or the opening. In an embodiment (not shown), the display 115 may include at least one of an audio module (e.g., a phone call receiver hole 114), a sensor module (e.g., a first sensor module 124), a camera module (e.g., a first camera device 105), and a fingerprint sensor (not shown), and the light emitting element 106 located on the rear surface of the screen display area. In an embodiment (not shown), the display 115 may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the strength (pressure) of a touch, and / or a digitizer configured to detect a magnetic field type stylus.

[0050] According to an embodiment, the audio modules 103, 107, and 114 may include a microphone hole 103 and a speaker hole (e.g., an external speaker hole 107 and a phone call receiver hole 114). A microphone configured to acquire external sound may be disposed inside the microphone hole 103, and in an embodiment, a plurality of microphones may be disposed inside the microphone hole to detect the direction of the sound. The speaker hole may include an external speaker hole 107 and a phone call receiver hole 114. In an embodiment, the speaker hole (e.g., the external speaker hole 107 and the phone call receiver hole 114) and the microphone hole 103 may be implemented as one hole, or a speaker (e.g., a piezoelectric speaker) may be included without a speaker hole (e.g., the external speaker hole 107 and the phone call receiver hole 114).

[0051] According to an embodiment, the sensor module may generate an electrical signal or data value corresponding to an internal working state or an external environmental state of the electronic device 101. For example, the sensor module may include a first sensor module 124 (e.g., a proximity sensor) disposed on the first surface 110A of the housing 110 and / or a second sensor module (not shown) (e.g., a fingerprint sensor) and / or a third sensor module 119 disposed on the second surface 110B of the housing 110. The second sensor module (not shown) (e.g., a fingerprint sensor) may be disposed on the second surface 110B or the side surface 110C of the housing 110 as well as on the first surface 110A (e.g., the display 115). The electronic device 101 may further include, for example, at least one of a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor 124.

[0052] According to an embodiment, the camera module may include a first camera device 105 disposed on a first surface 110A of the electronic device 101, a second camera device 112 disposed on a second surface 110B, and / or a flash 113. The camera devices (e.g., the first camera device 105, the second camera device 112) may include one or more lenses, an image sensor, and / or an image signal processor. The flash 113 may include, for example, a light emitting diode or a xenon lamp. In an embodiment, one or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and an image sensor may be arranged on one surface of the electronic device 101. In an embodiment, the flash 113 may emit infrared rays, and the infrared rays emitted by the flash 113 and reflected by the subject may be received by the third sensor module 119. The electronic device 101 or a processor of the electronic device 101 (e.g., Figure 1 The processor 120) can detect depth information of the subject based on the time point when the infrared ray is received by the third sensor module 119.

[0053] According to an embodiment, the key input device 117 may be arranged on the side surface 110C of the housing 110. In an embodiment, the electronic device 101 may not include some or all of the key input devices 117 mentioned above, and the key input device 117 not included may be implemented in another form such as a soft key on the display 115. In an embodiment, the key input device may include a sensor module provided on the second surface 110B of the housing 110.

[0054] According to an embodiment, the light emitting element 106 may be disposed, for example, on the first surface 110A of the housing 110. For example, the light emitting element 106 may provide status information of the electronic device 101 in the form of light. In an embodiment, the light emitting element 106 may provide, for example, a light source associated with the operation of a camera module (e.g., the first camera device 105). The light emitting element 106 may include, for example, an LED, an IR LED, and a xenon lamp.

[0055] According to an embodiment, the connector hole (e.g., the first connector hole 128, the second connector hole 109) may include a first connector hole 128 and / or a second connector hole (e.g., an earphone jack) 109, the first connector hole 128 being capable of accommodating a device configured to connect to an external electronic device (e.g., Figure 1 The second connector hole 109 can accommodate a connector configured to send and receive audio signals with an external electronic device.

[0056] Figure 4a The present invention is a diagram showing an embodiment according to the present invention. Figure 2 An exploded perspective view of the front surface of the electronic device 101 is shown.

[0057] Figure 4b The present invention is a diagram showing an embodiment according to the present invention. Figure 2 An exploded perspective view of the rear surface of the electronic device 101 is shown.

[0058] refer to Figure 4a and Figure 4b The electronic device 101 includes a side structure 210, a first support member 211 (eg, a bracket), a front plate 220 (eg, Figure 2 122) and a display 230 (e.g., Figure 2 and Figure 3 115 in the display), a printed circuit board (or board assembly) 240, a battery 250, a second support member 260 (eg, a rear case), an antenna, a camera assembly 207, and a rear plate 280 (eg, Figure 3 The rear plate 111 in FIG.

[0059] According to an embodiment, the electronic device 101 may omit at least one component (eg, the first support member 211 or the second support member 260) or may additionally include other components. Figure 2 or Figure 3 At least one component of the electronic device 101 is the same or similar, and a repeated description will be omitted below.

[0060] According to an embodiment, the first support member 211 may be disposed inside the electronic device 101 to be connected to the side structure 210, or may be formed integrally with the side structure 210. The first support member 211 may be formed of, for example, a metal material and / or a non-metallic (e.g., polymer) material. When the first support member or the side structure 210 is at least partially formed of a metal material, a portion of the side structure 210 or the first support member 211 may be used as an antenna. The first support member 211 may have one surface coupled to the display 230 and another surface coupled to the printed circuit board 240. A processor (e.g., Figure 1 processor 120 in the processor 120), memory (e.g., Figure 1 130) and / or an interface (e.g., Figure 1 The interface 177 in the embodiment may be embedded on the printed circuit board 240. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0061] According to an embodiment, the first support member 211 and the side structure 210 may be combined and referred to as a front shell or housing 201. According to an embodiment, the housing 201 may be generally considered to be a structure for accommodating, protecting or arranging a printed circuit board 240 or a battery 250. In an embodiment, the housing 201 may be considered to include a structure that can be visually or tactilely recognized by a user on the exterior of the electronic device 101, for example, the side structure 210, the front plate 220 and / or the rear plate 280. In an embodiment, the "front surface or rear surface of the housing 201" may refer to Figure 2 The first surface 110A or Figure 3 In an embodiment, the first support member 211 may be disposed on the front plate 220 (eg, Figure 2 The first surface 110A in the embodiment of the present invention is connected to the rear plate 280 (for example, Figure 3 between the second surface 110B in the middle) and can be used as a structure configured to arrange electrical / electronic components such as a printed circuit board 240 or a camera assembly 207.

[0062] According to an embodiment, the display 230 may include a display panel 231 and a flexible printed circuit board 233 extending from the display panel 231. For example, the flexible printed circuit board 233 may be considered to be at least partially disposed on the rear surface of the display panel 231 and electrically connected to the display panel 231. In an embodiment, the reference numeral "231" may be considered to indicate a protective sheet disposed on the rear surface of the display panel. For example, unless otherwise specified in the detailed description below, the protective sheet may be considered to be a part of the display panel 231. In an embodiment, the protective sheet may be used as a buffer structure (e.g., a low-density elastomer such as a sponge) or an electromagnetic shielding structure (e.g., a copper sheet (CU sheet)) that absorbs external forces. According to an embodiment, the display 230 may be disposed on the inner surface of the front panel 220, and may include a light-emitting layer to transmit light through the front panel 220. Figure 2 The display 230 can be basically realized by using at least a portion of the first surface 110A or the front panel 220 of the display 230. Figure 2 The image is outputted through the entire area of ​​the first surface 110A or the front panel 220.

[0063] Depending on the embodiment, the memory may include, for example, volatile memory or non-volatile memory.

[0064] According to an embodiment, the interface may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. For example, the interface may electrically or physically connect the electronic device 101 to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0065] According to an embodiment, the second support member 260 may include, for example, an upper support member 260a and a lower support member 260b. In an embodiment, the upper support member 260a may be arranged to surround the printed circuit board 240 together with a portion of the first support member 211. Circuit devices (e.g., processors, communication modules, or memories) or various electrical / electronic components implemented in the form of integrated circuit chips may be arranged on the printed circuit board 240, and according to an embodiment, the printed circuit board 240 may be provided with an electromagnetic shielding environment by the upper support member 260a. In an embodiment, the lower support member 260b may be used as a structure capable of arranging electrical / electronic components such as speaker modules and interfaces (e.g., USB connectors, SD card / MMC connectors, or audio connectors). In an embodiment, electrical / electronic components such as speaker modules and interfaces (e.g., USB connectors, SD card / MMC connectors, or audio connectors) may be arranged on an additional printed circuit board (not shown). In this case, the lower support member 260b may be arranged together with other portions of the first support member 211 to surround the additional printed circuit board. The speaker module or interface provided on the lower support member 260b or an additional printed circuit board (not shown) may be provided to correspond to Figure 2 An audio module (e.g., microphone hole 103 or speaker holes (e.g., external speaker hole 107 and phone call receiver hole 114)) or connector holes (e.g., first connector hole 128, second connector hole 109).

[0066] According to an embodiment, a speaker module and an interface may be provided to correspond to the audio module 207 or the connector holes 128 and 109 .

[0067] According to an embodiment, the battery 250 is a device configured to supply power to at least one component of the electronic device 101, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. For example, at least a portion of the battery 250 may be disposed on substantially the same plane as the printed circuit board 240. The battery 250 may be integrally disposed inside the electronic device 101, or may be disposed to be detachable from the electronic device 101.

[0068] Although not shown, the antenna may include a conductor pattern implemented on the surface of the second support member 260, for example, by a laser direct structuring method. In an embodiment, the antenna may include a printed circuit pattern formed on the surface of the film, and the antenna in the form of a film may be provided between the back plate 280 and the battery 250. The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. For example, the antenna may perform short-range communication with an external device or wirelessly send and receive the power required for charging. In an embodiment, another antenna structure may be formed by a portion or combination of the side structure 210 and / or the first support member 211.

[0069] According to an embodiment, the camera assembly 207 may include at least one camera module. Inside the electronic device 101, the camera assembly 207 may receive at least a portion of light incident through the optical holes or camera windows 212, 213, 219. In an embodiment, the camera assembly 207 may be disposed on the first support member 211 at a position adjacent to the printed circuit board 240. In an embodiment, the camera module of the camera assembly 207 may be substantially aligned with any one of the camera windows 212, 213, 219, and may be at least partially surrounded by the second support member 260 (e.g., the upper support member 260a).

[0070] Hereinafter, the structure of the display 230 will be described in detail.

[0071] Figure 5a and Figure 5b is a cross-sectional view schematically illustrating a display module 300 in an electronic device (eg, electronic device 101 ) according to an embodiment disclosed herein.

[0072] refer to Figure 5a and Figure 5b , the display module 300 may include a substrate 310 , a thin film transistor 320 and a plurality of pixel chips 330 . Figure 5a and Figure 5b The configuration of the display module 300 may be partially or entirely related to Figure 4a and Figure 4b The configuration of the display 230 is the same. Figure 5a and Figure 5b The structure can be optionally combined with Figure 4a and Figure 4b Structural coupling.

[0073] according to Figure 5a and Figure 5b , shows a space coordinate system defined by the Z axis. Here, the Z axis may represent a thickness direction of the electronic device 101.

[0074] According to an embodiment, the substrate 310 of the display module 300 may be any circuit board capable of being electrically connected, such as a PCB, PI, glass, or a flexible PCB.

[0075] According to an embodiment, the display module 300 may include an organic light emitting diode (OLED) and a thin film transistor (TFT) 320 for controlling the OLED. The thin film transistor (TFT) 320 may include a switching transistor (switching TFT), a driving transistor (driving TFT), and a sustain capacitor.

[0076] According to an embodiment, the thin film transistor (TFT) 320 may be omitted. The substrate 310 may be, for example, glass, a polyimide (PI) film, or a flexible substrate.

[0077] According to an embodiment, the display module 300 may include a plurality of pixel chips 330. In the embodiments disclosed herein, a pixel may be a single picture element and may be a minimum unit (unit pixel) constituting an image, but is not necessarily limited thereto.

[0078] According to an embodiment, the plurality of pixel chips 330 may include color pixels. A color pixel may be a single point as a minimum unit constituting an image. The plurality of pixel chips 330 may be configured to include a plurality of sub-pixels. For example, Figure 5a and Figure 5b As shown, the color pixel may include various color sub-pixels (e.g., red sub-pixel 330R, green sub-pixel 330G, blue sub-pixel 330B) provided to output various colors. The color sub-pixels (e.g., red sub-pixel 330R, green sub-pixel 330G, blue sub-pixel 330B) may be substantially arranged on the same plane to form a layer. The color sub-pixels (e.g., red sub-pixel 330R, green sub-pixel 330G, blue sub-pixel 330B) may be configured to absorb, reflect, or scatter specific colors (e.g., red, green, or blue).

[0079] According to an embodiment, when referring to Figure 5b When the plurality of pixel chips 330 of the display module 300 are formed, they may have different heights. For example, the height of the green sub-pixel 330G may be intentionally formed to be higher than the height of the blue sub-pixel 330B, or the height of the red sub-pixel 330R may be formed to be relatively higher than the height of the green sub-pixel 330G and the height of the blue sub-pixel 330B ( Figure 5b ).

[0080] According to an embodiment, the plurality of pixel chips 330 may have any suitable size and any suitable shape. For example, each pixel chip constituting the plurality of pixel chips 330 may have a width or height of about 25 μm, 50 μm, 100 μm, 200 μm, or 500 μm. For example, the plurality of pixel chips 330 constituting the uLED may have a height of about 10 μm. For example, the height deviation of the plurality of pixel chips 330 constituting the uLED may be about 1 μm or more and 10 μm or less. For example, the shape of the plurality of pixel chips 330 may be rectangular, square, or circular.

[0081] Figure 6 4 is a cross-sectional view illustrating a process for manufacturing a display module 300 using a relay board 400 in an electronic device (eg, the electronic device 101 ) according to an embodiment disclosed herein.

[0082] refer to Figure 6 , the display module 300 may include a substrate 310 , a thin film transistor 320 and a plurality of pixel chips 330 . Figure 6 The configuration of the substrate 310, the thin film transistor 320 and the plurality of pixel chips 330 of the display module 300 may be partially or entirely the same as Figure 5a and Figure 5b The display module 300 has a substrate 310 , a thin film transistor 320 , and a plurality of pixel chips 330 having the same configuration. Figure 6 The structure can be optionally combined with Figure 5a and Figure 5b Structural coupling.

[0083] according to Figure 6 , shows a space coordinate system defined by the Z axis. Here, the Z axis may represent a thickness direction of the electronic device 101.

[0084] According to an embodiment, the method for manufacturing the display module 300 may include a first process of preparing a substrate 310 and a plurality of pixel chips 330, a second process of arranging the plurality of pixel chips 330 on the relay board 400, a third process of aligning a plurality of patterned holes 421 formed in the relay board 400 to face the plurality of pixel chips 330 of the display module 300, a fourth process of temporarily fixing the relay board 400 and the plurality of pixel chips 330 aligned on the relay board 400 on the substrate 310, and a fifth process of welding the plurality of pixel chips 330 to the substrate 310 using a laser. This may involve a method for fixing the plurality of pixel chips 330 to the thin film transistor 320 in a display manufacturing process.

[0085] According to an embodiment, when following the first process, in order to manufacture the display module 300 , a substrate 310 may be provided and a thin film transistor (TFT) 320 and a plurality of pixel chips 330 may be provided on the substrate 310 .

[0086] According to an embodiment, when following the second process, a plurality of pixel chips 330 may be arranged in a regular or repeated pattern on the relay board 400. For example, a plurality of pixel chips 300 may be arranged at predetermined intervals in the horizontal direction (X-axis direction) and the vertical direction (Y-axis direction). However, among the plurality of pixel chips 330, the order and number of the red sub-pixel 330R, the green sub-pixel 330G, and the blue sub-pixel 330B are not limited.

[0087] In order to fix the plurality of pixel chips 330 on the thin film transistor 320, laser may be used to heat the plurality of pixel chips 330. However, when the entire substrate on which the thin film transistor 320 is mounted is heated, the laser may be emitted even to an area without a chip, and the substrate on which the thin film transistor 320 is mounted may be damaged. In order to prevent damage to the substrate on which the thin film transistor 320 is mounted, a relay board 400 including a pattern layer 420 used as a mask may be used.

[0088] According to an embodiment, when following the third process and the fourth process, the relay (interposer) board 400 may be arranged and aligned on a plurality of pixel chips 330, and the relay board 400 may be temporarily fixed. The relay board 400 including a plurality of patterned holes 421 may be arranged so that the plurality of holes 421 face the plurality of pixel chips 330 of the display module 300. According to an embodiment, after transferring a plurality of chips 430 on the relay board 400 by various transfer techniques such as stamping, laser lift-off (LLO), fluid self-assembly (FSA), and electrostatic micro-electromechanical system (MEMS), the relay board 400 may be aligned on a substrate on which a thin film transistor 320 is mounted. According to an embodiment, the fourth process may include at least one of UV curing, thermal curing, a clamping method, and a bonding method. The bonding method may be a method using an adhesive, for example, at least one of an adhesive tape or an adhesive paste.

[0089] According to an embodiment, when following the fifth process, laser may be locally emitted only to a portion where the plurality of chips 430 are located. Laser may be locally emitted only to a portion of the pattern layer 420 where the plurality of holes 421 are formed. The plurality of chips 430 may be welded to a desired area by laser irradiation. When welding using laser, the relay board 400 may be located on the substrate 310 including the thin film transistor 320, and may be pressed from the bottom to the top (+Z direction).

[0090] Hereinafter, the configuration and structure of the relay board 400 including the pattern layer 420 used as a mask will be described.

[0091] According to an embodiment, the relay board 400 may include a board 410 , a buffer material 430 disposed under the board 410 , and a pattern layer 420 disposed between the board 410 and the buffer material 430 .

[0092] According to an embodiment, the plate 410 may be formed to allow the laser to pass through. The plate 410 may be formed of a transparent material to allow the laser to pass through. The plate 410 may be any transparent substrate through which the laser can pass, such as quartz, sapphire, or EG-XG. The plate 410 may be any transparent substrate through which, for example, more than 90% of the laser can pass.

[0093] According to an embodiment, the plate 410 may be a wafer. A wafer may refer to a round piece of a single crystal metal column that is thinly sliced ​​to have an appropriate thickness. The wafer may include, for example, silicon (Si). The plate 410 may be, for example, a glass wafer. A glass wafer may be thinner and stronger than a silicon wafer.

[0094] According to an embodiment, the pattern layer 420 can be configured to limit the laser irradiation position so that only the desired position can be heated by the laser during laser irradiation. The pattern layer 420 can perform substantially the same role as the mask used in the fine metal mask (FMM) method, which generally deposits organic materials at the desired position by attaching the mask to the substrate. The pattern layer 420 can be used as a reference point for aligning the plurality of chips 330 and the relay board 400.

[0095] According to an embodiment, the pattern layer 420 may be disposed below the board 410 (eg, at Figure 6 The pattern layer 420 may be disposed between the board 410 and the buffer material 430. The relay board 400 may include the pattern layer 420, and thus additional straightness alignment may not be performed between the relay board 400 and the pattern layer 420 used as a mask. Instead of providing a mask on the relay board 400, the pattern layer 420 used as a mask may be provided inside the relay board 400 so that the pattern layer is positioned close to the plurality of pixel chips 430. In this case, during laser irradiation, a diffraction phenomenon between the pattern layer 420 and the plurality of pixel chips 430 may be reduced.

[0096] According to an embodiment, the pattern layer 420 may include a metal. For example, the pattern layer 420 may include chromium (Cr).

[0097] According to an embodiment, the pattern layer may include a plurality of patterned holes 421 formed to face the plurality of pixel chips 330 of the display module 300. According to an embodiment, when referring to FIG. 8 , the positions, number, and / or arrangement method of the plurality of holes 421 may correspond one-to-one to the positions, number, and / or arrangement method of the plurality of pixel chips 330.

[0098] According to an embodiment, the buffer material 430 may be configured to directly contact the plurality of pixel chips 330 and pressurize the plurality of pixel chips 330. The buffer material 430 may serve as a cushion to reduce height deviation of the plurality of pixel chips 330.

[0099] According to an embodiment, the buffer material 430 may be formed to allow the laser to pass through. The buffer material 430 may be formed of a transparent material to allow the laser to pass through. The buffer material 430 may be any transparent substrate made of a material that can transmit laser light, such as quartz, sapphire, or EG-XG. For example, the buffer material 430 may be any transparent substrate that more than 90% of the laser light can pass through.

[0100] According to an embodiment, the buffer material 430 may be formed of a transparent polymer. For example, the buffer material 430 may include polydimethylsiloxane (PDMS, dimethylpolysiloxane). Polydimethylsiloxane (PDMS) is a widely used silicon-based polymer and may be referred to as "silicone". However, according to an embodiment, the buffer material 430 may be excluded from the configuration of the relay board 400.

[0101] According to an embodiment, the buffer material 430 may have a hardness of about 100 or less based on Shore hardness.

[0102] Figure 7a , Figure 7b and Figure 7c is a diagram illustrating a pattern layer 420 of a relay board 400 according to an embodiment disclosed herein.

[0103] refer to Figures 7a to 7c , the pattern layer 420 of the relay board 400 may include a plurality of holes 421 . Figures 7a to 7c The configuration of the pattern layer 420 may be partially or completely related to Figure 6 The configuration of the pattern layer 420 is the same. Figures 7a to 7c The structure can be optionally combined with Figure 6 Structural coupling.

[0104] according to Figures 7a to 7c , shows a spatial coordinate system defined by an X-axis and a Y-axis. Here, the X-axis may represent a horizontal direction of the electronic device 101. The Y-axis may represent a vertical direction of the electronic device 101.

[0105] According to an embodiment, the pattern layer may include a plurality of patterned holes 421 formed to face the plurality of pixel chips 330 of the display module 300 .

[0106] According to an embodiment, when referring to Figure 7a When the positions, quantities and / or arrangements of the plurality of holes 421 are configured, the positions, quantities and / or arrangements of the plurality of pixel chips 330 may correspond one to one.

[0107] According to an embodiment, the shape of the plurality of holes 421 may correspond to the front shape of the plurality of pixel chips 330. For example, the shape of the plurality of holes may be rectangular, square, or circular. For example, in the case where the front shape of the plurality of pixel chips 330 is rectangular, the shape of the plurality of holes 421 may be rectangular.

[0108] According to an embodiment, the size of the plurality of holes 421 may be the same as or different from the size of the plurality of pixel chips 330. For example, the size of the plurality of holes may be smaller or larger than the size of the plurality of pixel chips 330 depending on bonding characteristics.

[0109] According to an embodiment, when referring to Figure 7b When the shapes of the plurality of holes 422 may correspond to the plurality of pixel chips (eg, Figure 6 The plurality of holes may further include holes for position alignment to correspond to the plurality of pixel chips (eg, Figure 6 The position of the plurality of pixel chips 330 in the image sensor 300 is determined. For example, the hole for position alignment may have a cross shape. The cross-shaped hole may be in the form of a slit formed in the horizontal direction (e.g., the X-axis direction in FIG. 9 ) and / or in the vertical direction perpendicular to the horizontal direction (e.g., the Y-axis direction in FIG. 9 ).

[0110] For example, when referring to FIG. 9 , the shape of the plurality of holes 422 may also include thin slit-shaped holes 4221 , 4222 , 4223 , and 4224 vertically extending from the center of each of the four sides of the rectangle.

[0111] According to an embodiment, when referring to Figure 7c When the shapes and positions of the plurality of holes 423 may correspond to the shapes and positions of the plurality of pixel chips (eg, Figure 6 The shapes and positions of the plurality of metal pads on the front surface of the plurality of pixel chips 330 in the embodiment. For example, the plurality of pixel chips (e.g., Figure 6 Each pixel chip of the plurality of pixel chips 330 in the embodiment may include two metal pads on the front surface. The position and shape of each hole 4231 and 4232 constituting the plurality of holes 423 may correspond to the position and shape of the metal pad.

[0112] Display devices may be divided into self-luminous displays in which each pixel emits light by itself and passive light-emitting displays requiring a separate light source.

[0113] The self-luminous display is provided with a light-emitting element for each pixel so that each pixel emits light by itself, and thus does not require components such as a backlight unit, a liquid crystal layer, and a color filter. Therefore, the self-luminous display is structurally simple, can have a high degree of design freedom, and can be implemented with a thin thickness. In addition, the self-luminous display can obtain better contrast, brightness, and viewing angle.

[0114] When using laser to heat each pixel as a method of welding the pixel to the thin film transistor substrate, it is necessary to heat only the area where the pixel is located. For this purpose, when a patterned mask is set on the relay board, it may be difficult to align the straightness between the relay board and the mask, and diffraction between the mask and the pixel may occur.

[0115] The present disclosure relates to a method for manufacturing a display module 300 and a relay plate 400 configured to reduce a straightness error and reduce the occurrence of a diffraction phenomenon in a pixel by using the relay plate 400 including a pattern layer 420 used as a mask.

[0116] The relay board 400 of the present disclosure disclosed above is not limited to the above-mentioned embodiments and drawings, and it will be apparent to those skilled in the art that various substitutions, modifications, and changes are possible within the technical scope of the present disclosure.

[0117] According to an embodiment of the present disclosure, a method for manufacturing a display module ( Figure 6 300) relay board ( Figure 6 400) may include: a transparent plate ( Figure 6 410); transparent buffer material ( Figure 6 430), the transparent buffer material is disposed below the plate; and the pattern layer ( Figure 6 420), the pattern layer is disposed between the board and the buffer material and includes a plurality of pixel chips ( Figure 6 A plurality of patterned holes (330) of Figure 7a 421 in the above).

[0118] According to an embodiment, the pattern layer may include metal.

[0119] According to an embodiment, the pattern layer may include chromium (Cr).

[0120] According to an embodiment, the plurality of holes may be formed to correspond one-to-one to the plurality of pixel chips.

[0121] According to an embodiment, the shapes of the plurality of holes may be formed to correspond to the shapes of the plurality of pixel chips.

[0122] According to an embodiment, the plurality of holes may have at least one of a rectangular shape, a square shape, or a circular shape.

[0123] According to an embodiment, the shape of the plurality of holes may further include a cross shape.

[0124] According to an embodiment, shapes of the plurality of holes may be formed to correspond to shapes of metal pads disposed on the plurality of pixel chips.

[0125] According to an embodiment, the plate may be formed to allow laser light to pass through.

[0126] According to an embodiment, the plate may be a glass wafer.

[0127] According to an embodiment, the buffer material may be formed to allow laser light to pass therethrough.

[0128] According to an embodiment, the buffer material may include polydimethylsiloxane (PDMS, dimethylpolysiloxane).

[0129] According to an embodiment of the present disclosure, a method for manufacturing a display module ( Figure 6 The method of claim 300 may include a first process of preparing a substrate and a plurality of pixel chips, a second process of arranging the plurality of pixel chips on a relay board, a third process of aligning a plurality of patterned holes formed in the relay board to face the plurality of pixel chips of the display, a fourth process of temporarily fixing the relay board and the plurality of pixel chips aligned on the relay board on the substrate, and a fifth process of using a laser to weld the plurality of pixel chips to the substrate.

[0130] According to an embodiment, the fourth process may include at least one of UV curing, thermal curing, a clamping method, and a bonding method.

[0131] According to an embodiment, the pattern layer may include metal.

[0132] According to an embodiment, the pattern layer may include chromium (Cr).

[0133] According to an embodiment, the plurality of holes may be formed to correspond one-to-one to the plurality of pixel chips.

[0134] According to an embodiment, the shapes of the plurality of holes may be formed to correspond to the shapes of the plurality of pixel chips.

[0135] According to an embodiment, the plurality of holes may have at least one of a rectangular shape, a square shape, and a circular shape.

[0136] According to an embodiment, the shape of the plurality of holes may further include a cross shape.

Claims

1. A relay board (400 in FIG. 6 ), the relay board being used to manufacture a display module (300 in FIG. 6 ), the relay board include: A transparent plate (410 in FIG. 6 ); a transparent buffer material (430 in FIG. 6 ), the transparent buffer material being disposed below the plate; as well as A pattern layer (420 in FIG. 6) disposed between the plate and the buffer material and including a plurality of patterned holes (421 in FIG. 7a) formed to face a plurality of pixel chips (330 in FIG. 6) of the display module.

2. The relay board according to claim 1, in, The pattern layer includes metal.

3. The relay board according to one of claims 1 and 2, in, The pattern layer includes chromium (Cr).

4. The relay board according to claim 1, in, The plurality of holes are formed to correspond one-to-one to the plurality of pixel chips.

5. The relay board according to one of claims 1 to 4, in, The shapes of the plurality of holes are formed to correspond to the shapes of the plurality of pixel chips.

6. The relay board according to one of claims 1 to 5, in, The plurality of holes are at least one of a rectangular shape, a square shape, or a circular shape.

7. The relay board according to claim 6, in, The shape of the plurality of holes also includes a cross shape.

8. The relay board according to one of claims 1 to 7, in, The plurality of holes are formed in shapes corresponding to shapes of metal pads disposed on the plurality of pixel chips.

9. The relay board according to one of claims 1 to 8, in, The plate is formed to allow laser light to pass through.

10. The relay board according to one of claims 1 to 9, in, The plate is a glass wafer.

11. The relay board according to one of claims 1 to 10, in, The buffer material is formed to allow laser light to pass therethrough.

12. The relay board according to one of claims 1 to 11, in, The buffer material includes PDMS (polydimethylsiloxane, dimethylpolysiloxane).

13. A method for manufacturing a display module for an electronic device, the method include: A first process of preparing a substrate and a plurality of pixel chips; a second process of arranging the plurality of pixel chips on a relay board; a third process of aligning a plurality of patterned holes formed in the relay plate to face the plurality of pixel chips of a display; a fourth process of temporarily fixing the relay board and the plurality of pixel chips aligned on the relay board on the substrate; as well as A fifth process of welding the plurality of pixel chips to the substrate using a laser.

14. The method according to claim 13, in, The fourth process includes at least one of UV curing, thermal curing, a clamping method, and a bonding method.

15. The method according to one of claims 13 and 14, in, The plurality of holes are formed to correspond one-to-one to the plurality of pixel chips.

Images