Solder paste waste package treatment device after LED lamp strip welding

Abstract

A solder paste waste package treatment device used after LED lamp strip welding comprises a sealing assembly and a removing assembly, and the removing assembly is arranged on the upper portion of the sealing assembly. The removing assembly is used for removing solder paste remaining in the waste solder paste packaging box and comprises a connecting rod assembly and an external hanging plate, and the external hanging plate is arranged outside the connecting rod assembly; an external hanging plate in the removing assembly starts to do radial motion under the action of external power and abuts against the inner wall of the waste solder paste packaging box, residual solder paste in the waste solder paste packaging box can be scratched by the external hanging plate along with rotation of the waste solder paste packaging box, and therefore the interior of the waste solder paste packaging box is removed.

Description

Technical Field

[0001] The present invention belongs to the technical field of LED strip processing and corresponding waste treatment, and specifically refers to a device for treating waste packaging of solder paste after LED strip welding. Background Art

[0002] When LED strips are welded, solder paste is required. Solder paste (also called welding paste) is a substance commonly used in electronic welding, mainly used in surface mount technology (SMT) or ordinary welding processes. Its main components are solder powder (usually composed of tin, lead or lead-free alloys) and flux, and it is in paste form. When used, it can effectively help the welding points in the welding process to form good contact and ensure the welding quality.

[0003] Normally, modern lead-free solder paste (such as Sn-Ag-Cu alloy) is usually more environmentally friendly because it does not contain toxic substances such as lead and has less harm to the environment compared to traditional lead-tin alloys (Sn-Pb). However, the flux in the solder paste (usually composed of resin, solvent and additives) is likely to have an impact on the environment.

[0004] The above impact is mainly caused by the solvent in the flux. The solvent in the flux (such as alcohols, ethers, etc.) may remain on the surface of the circuit board or other electronic components after use. If these solvents are not properly treated, they may seep into the soil and water bodies, causing soil and water pollution. Normally, when the solder paste is used up, the factory will conduct unified centralized cleaning. If the remaining solder paste in the waste solder paste packaging is not cleaned out during the cleaning process, the waste solder paste packaging will pollute the environment. Summary of the Invention

[0005] In view of the above situation, to overcome the defects of the prior art, the present invention provides a device for treating waste packaging of solder paste after LED strip welding, which at least partially solves the above problems.

[0006] The technical solution adopted by the present invention is as follows: The present invention provides a device for treating waste packaging of solder paste after LED strip welding, including a sealing component and a cleaning component, and the cleaning component is arranged on the upper part of the sealing component; The cleaning component includes a connecting rod component and an external hanging plate. A plurality of groups of connecting rod components are arranged in an equidistant circular arrangement inside the cleaning component, and a set of external hanging plates are arranged outside each group of connecting rod components; The sealing component is arranged below the external hanging plate and includes an upper base and a moving ring. The upper base is arranged below the external hanging plate, and the upper base is arranged on the upper part of the moving ring.

[0007] Further, the upper base includes a base chute and a downward extension area. A downward extension area is provided at the center of the upper base. The downward extension area penetrates the upper base. A base chute is provided on the upper base, and the base chute is located outside the downward extension area. The base chute is hexagonal.

[0008] Further, the moving ring includes fixing blocks, moving slots, and a middle fixing ring. Six groups of fixing blocks are fixedly connected inside the moving ring. A moving slot is provided in the middle of each group of fixing blocks. Each moving slot penetrates the fixing block. A fixing ring is fixedly connected among the six groups of fixing blocks. The six groups of fixing blocks are arranged in an equally spaced circular pattern between the middle fixing ring and the moving ring.

[0009] Further, the closing assembly further includes six sealing sliders, positioning pins, and pin shafts. The six sealing sliders are all arranged between the upper base and the moving ring. A positioning pin is fixedly connected to the lower part of each sealing slider, and a pin shaft is fixedly connected to the upper part of each sealing slider.

[0010] Further, the positioning pin is movably connected to the moving slot, and the pin shaft is movably connected to the base chute.

[0011] Further, the closing assembly further includes a first driven gear, a second driven gear, a protection block, a first driving gear, a driving shaft, and a second driving gear. The first driven gear is fixedly connected to the outside of the moving ring. The second driven gear is arranged below the moving ring. Multiple groups of protection blocks are equally spaced and distributed on the upper part of the second driven gear. The first driving gear is movably connected to one side of the second driven gear. The driving shaft is fixedly connected to the center of the first driving gear. The second driving gear is fixedly connected to the upper part of the driving shaft and is rotationally connected to the first driven gear.

[0012] Further, the closing assembly further includes a cylinder, a fixed platform, a fixed collar, an upper sleeve, and a moving shaft. The cylinder is arranged above the cleaning assembly. The fixed platform is arranged below the cylinder. The fixed collar is arranged above the fixed platform. The upper sleeve is arranged above the fixed collar. The moving shaft is arranged between the fixed collar and the upper sleeve. Multiple groups of connecting rod assemblies are equally spaced and arranged in a circular pattern on the moving shaft. An external hanging plate is movably connected to the outside of each group of connecting rod assemblies.

[0013] Further, a lifting assembly is further included. The lifting assembly is arranged above the closing assembly and the cleaning assembly. The lifting assembly includes a motor assembly, a slide rod assembly, a sliding table board, an overall frame, and a connecting frame. The motor assembly is arranged above the overall frame. The slide rod assembly is arranged below the overall frame. The sliding table board is movably connected to the slide rod assembly. The connecting frame is arranged below the sliding table board and is connected to the cylinder.

[0014] The beneficial effects achieved by the present invention with the above structure are as follows: (1) By removing the external hanging plate in the cleaning component, under the action of an external force, it starts to perform a radial movement along the radius of the cleaning component and presses against the inner wall of the used solder paste packaging box. As the used solder paste packaging box rotates, the remaining solder paste inside it will be "scraped" off by the external hanging plate, thus cleaning the inside of the used solder paste packaging box. At this time, under the action of the lifting component, the cleaning component is driven to lift upward. When the entire cleaning component passes through the probing area, multiple sealing sliders close, thus sealing the probing area and preventing the solder paste on the external hanging plate from falling back into the used solder paste packaging box.

[0015] (2) Through the radial movement of the connecting rod component, the external hanging plate connected to it will gradually open. After opening, multiple external hanging plates will come into contact with the circular inner wall of the used solder paste packaging box. When the used solder paste packaging box rotates under the drive of an external force, at this time, multiple solder pastes in the used solder paste packaging box will be cleaned by the external hanging plate, thus ensuring that the processed used solder paste packaging box no longer has solder paste, so that the used solder paste packaging box cannot pollute the environment. Description of the Drawings

[0016] Figure 1 It is a three-dimensional view of a device for treating waste packaging of solder paste after LED strip welding proposed in an embodiment of the present invention; Figure 2 It is a left view of a device for treating waste packaging of solder paste after LED strip welding proposed in an embodiment of the present invention; Figure 3 It is a front view of a device for treating waste packaging of solder paste after LED strip welding proposed in an embodiment of the present invention; Figure 4 It is an exploded view of a closing component proposed in an embodiment of the present invention; Figure 5 It is a partial structural schematic diagram of a closing component proposed in an embodiment of the present invention; Figure 6 It is a three-dimensional view of a cleaning component proposed in an embodiment of the present invention; Figure 7 It is a three-dimensional view of a lifting component proposed in an embodiment of the present invention.

[0017] Among them, 1. Lifting component, 2. Closing component, 3. Cleaning component, 4. Used solder paste packaging box 101. Motor component, 102. Slide rod component, 103. Sliding table board, 104. Overall frame, 105. Connecting frame; 201. Upper base, 202. Base chute, 203. Lower exploration area, 204. Sealing slider, 205. Positioning pin, 206. Pin shaft, 207. Action ring, 208. Fixed block, 209. Action seam, 210. Middle fixed ring, 211. First driven gear, 212. Second driven gear, 213. Protection block, 214. First driving gear, 215. Driving shaft, 216. Second driving gear; 301. Cylinder, 302. Fixed platform, 303. Fixed collar, 304. Upper sleeve, 305. Action shaft, 306. Link assembly, 307. External hanging plate.

[0018] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation to the present invention. Detailed implementation manners

[0019] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts belong to the scope of protection of the present invention.

[0020] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc. indicating the orientation or position relationship are based on the orientation or position relationship shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0021] As Figure 1 、 Figure 2 and Figure 3 shown, the present invention provides a device for treating waste packaging of solder paste after welding of an LED light strip, including a sealing component 2 and a cleaning component 3. The cleaning component 3 is arranged above the sealing component 2; The cleaning component 3 includes a link assembly 306 and an external hanging plate 307. A plurality of groups of link assemblies 306 are arranged in an equally spaced annular manner inside the cleaning component 3, and a group of external hanging plates 307 are arranged outside each group of link assemblies 306; The sealing component 2 is arranged below the external hanging plate 307 and includes an upper base 201 and an action ring 207. The upper base 201 is arranged below the external hanging plate 307, and the upper base 201 is arranged above the action ring 207.

[0022] AsFigure 3 , Figure 4 and Figure 5 As shown in ,

[0023] , the upper base 201 includes a base chute 202 and a probing area 203. A probing area 203 is provided at the center of the upper base 201. The probing area 203 penetrates through the upper base 201. A base chute 202 is provided on the upper base 201, and the base chute 202 is located outside the probing area 203. The base chute 202 is hexagonal.

[0023] As Figure 5 shown, the moving ring 207 includes fixing blocks 208, moving slits 209 and a middle fixing ring 210. Six groups of fixing blocks 208 are fixedly connected inside the moving ring 207. A moving slit 209 is provided in the middle of each group of fixing blocks 208. Each group of moving slits 209 penetrates through the fixing block 208. A fixing ring 210 is fixedly connected in the middle of the six groups of fixing blocks 208. The six groups of fixing blocks 208 are arranged in an equally spaced circular pattern between the middle fixing ring 210 and the moving ring 207.

[0024] As Figure 4 shown, the closing assembly 2 further includes six sealing sliders 204, positioning pins 205 and pin shafts 206. The six sealing sliders 204 are all arranged between the upper base 201 and the moving ring 207. A positioning pin 205 is fixedly connected to the lower part of each group of sealing sliders 204. A pin shaft 206 is fixedly connected to the upper part of each group of sealing sliders 204.

[0025] As Figure 4 and 5 shown, the positioning pin 205 is movably connected to the moving slit 209, and the pin shaft 206 is movably connected to the base chute 202.

[0026] As Figure 4 and 5 shown, the closing assembly 2 further includes a first driven gear 211, a second driven gear 212, a protection block 213, a first driving gear 214, a driving shaft 215 and a second driving gear 216. The first driven gear 211 is fixedly connected to the outside of the moving ring 207. The second driven gear 212 is arranged below the moving ring 207. Multiple groups of protection blocks 213 are equally spaced on the upper part of the second driven gear 212. The first driving gear 214 is movably connected to one side of the second driven gear 212. The driving shaft 215 is fixedly connected to the center of the first driving gear 214. The second driving gear 216 is fixedly connected to the upper part of the driving shaft 215 and is rotatably connected to the first driven gear 211.

[0027] In this embodiment, first, the drive shaft 215 is connected to an external motor. When the external motor starts, it drives the drive shaft 215 to rotate. The second drive gear 216 is fixedly connected to the upper part of the drive shaft 215. At this time, the second drive gear 216 will rotate driven by the drive shaft 215. The second drive gear 216 is rotationally connected to the first driven gear 211. When the second drive gear 216 rotates, it can drive the first driven gear 211 to rotate through the meshing between the gears.

[0028] The first driven gear 211 is fixedly connected to the outside of the action ring 207. At this time, when the first driven gear 211 starts to rotate, it will drive the action ring 207 to rotate. Six fixing blocks 208 are fixedly connected inside the action ring 207. When the action ring 207 starts to rotate, the six fixing blocks 208 inside it will rotate. An action slot 209 is provided in the middle of each fixing block 208. When the six fixing blocks 208 rotate, they will drive the six action slots 209 to rotate.

[0029] The positioning pin 205 is movably connected to the action slot 209. At this time, when the action slot 209 rotates, it will drive the positioning pin 205 to move along the inside of the action slot 209. The positioning pins 205 are fixedly connected to the lower parts of the sealing sliders 204. At this time, when the positioning pins 205 move, the sealing sliders 204 will follow the movement track of the positioning pins 205.

[0030] Also, since the pin shafts 206 are fixedly connected to the upper parts of the sealing sliders 204 and the pin shafts 206 are movably connected to the base chute 202, when the sealing sliders 204 move driven by the positioning pins 205, they will drive the pin shafts 206 to move. The movement track of the pin shafts 206 is restricted by the base chute 202, and the base chute 202 is hexagonal. Therefore, the overall movement track of a single sealing slider 204 is a radial movement towards the center of the action ring 207.

[0031] The closing assembly 2 further includes six sealing sliders 204. At this time, the movement tracks of each sealing slider 204 are as described above. Then, when the action ring 207 rotates, the six sealing sliders 204 will move radially towards the center of the action ring 207 as a whole, or move away from the center of the action ring 207 together, so as to achieve the purpose of opening and closing the probing area 203.

[0032] The drive shaft 215 is fixedly connected to the center of the first drive gear 214. The first drive gear 214 is movably connected to one side of the second driven gear 212. When the drive shaft 215 rotates, it will drive the first drive gear 214 to rotate. Through the meshing of the gears between the first drive gear 214 and the second driven gear 212, the second driven gear 212 will ultimately be driven to rotate. The waste solder paste packaging box 4 is placed on the second driven gear 212, and ultimately the waste solder paste packaging box 4 will be driven to rotate.

[0033] At this time, the outer hanging plate 307 in the cleaning component 3 moves radially along the radius of the cleaning component 3 under the action of external power and abuts against the inner wall of the waste solder paste packaging box 4. As the waste solder paste packaging box 4 rotates, the remaining solder paste inside it will be "scraped off" by the outer hanging plate 307, thus cleaning the inside of the waste solder paste packaging box 4. At this time, under the action of the lifting component 1, the cleaning component 3 is driven to lift upward. When the entire cleaning component 3 passes through the probing area 203, multiple sealing sliders 204 close, which can seal the probing area 203, thereby preventing the solder paste on the outer hanging plate 307 from falling back into the waste solder paste packaging box 4.

[0034] As Figure 6 shown, the closing component 2 further includes a cylinder 301, a fixed platform 302, a fixed collar 303, an upper sleeve 304, and an action shaft 305. The cylinder 301 is arranged above the cleaning component 3. The fixed platform 302 is arranged below the cylinder 301. The fixed collar 303 is arranged above the fixed platform 302. The upper sleeve 304 is arranged above the fixed collar 303. The action shaft 305 is arranged between the fixed collar 303 and the upper sleeve 304. Multiple connecting rod assemblies 306 are arranged in an equally spaced circular pattern on the action shaft 305. Each connecting rod assembly 306 is movably connected to an outer hanging plate 307 on the outside.

[0035] In this embodiment, first, since the fixed platform 302 is arranged below the cylinder 301, the fixed collar 303 is arranged above the fixed platform 302, the upper sleeve 304 is arranged above the fixed collar 303, the action shaft 305 is arranged between the fixed collar 303 and the upper sleeve 304, and at this time the cylinder 301 is connected to the action shaft 305, when the cylinder 301 works, it will drive the action shaft 305 to move up and down between the fixed collar 303 and the upper sleeve 304.

[0036] Then, when the cylinder 301 drives the action shaft 305 to move up and down between the fixed collar 303 and the upper sleeve 304, since multiple connecting rod assemblies 306 are arranged in an equally spaced circular pattern on the action shaft 305 at this time, the connecting rod assemblies 306 will follow the action shaft 305 to move up and down between the fixed collar 303 and the upper sleeve 304 as well.

[0037] An outer hanging plate 307 is movably connected to the outside of each connecting rod assembly 306, and the bottom of the outer hanging plate 307 contacts the upper surface of the fixed table 302. At this time, when the action shaft 305 moves downward under the drive of the cylinder 301, the connecting rod assembly 306 connected to the action shaft 305 will also move downward. Also, since the bottom of the outer hanging plate 307 is blocked by the upper surface of the fixed table 302 at this time, the outer hanging plate 307 connected to the connecting rod assembly 306 cannot move downward, so the connecting rod assembly 306 will perform a radial movement under the drive of the action shaft 305.

[0038] The result of the radial movement of the connecting rod assembly 306 will cause the outer hanging plates 307 connected to it to gradually open. After the multiple outer hanging plates 307 are opened, they will contact the circular inner wall of the waste solder paste packaging box 4. When the waste solder paste packaging box 4 rotates under the drive of an external force, the multiple solder pastes in the waste solder paste packaging box 4 will be scraped off by the outer hanging plates 307, thus ensuring that the processed waste solder paste packaging box 4 no longer has solder paste, and thus preventing the waste solder paste packaging box 4 from polluting the environment.

[0039] As Figure 7 shown, it further includes a lifting assembly 1. The lifting assembly 1 is arranged above the closing assembly 2 and the cleaning assembly 3. The lifting assembly 1 includes a motor assembly 101, a slide rod assembly 102, a sliding table plate 103, an overall frame 104 and a connecting frame 105. The motor assembly 101 is arranged above the overall frame 104, the slide rod assembly 102 is arranged below the overall frame 104, the sliding table plate 103 is movably connected to the slide rod assembly 102, and the connecting frame 105 is arranged below the sliding table plate 103 and is connected to the cylinder 301.

[0040] In this embodiment, first, the motor assembly 101 is arranged above the overall frame 104. When the motor assembly 101 starts to work, the motor in the motor assembly 101 will start to rotate. Then, the screw rod in the motor assembly 101 will start to rotate under the drive of the motor. Then, the screw rod and the sliding table plate 103 are movably connected through the engagement of the threads. Therefore, when the screw rod rotates, the sliding table plate 103 can move up and down on the slide rod assembly 102.

[0041] One end of the sliding table plate 103 is connected to the cylinder 301, and the other end is connected to the sliding table plate 103. When the sliding table plate 103 moves downward under the drive of the motor assembly 101, the cylinder 301 can be moved downward, and then the other components connected to the cylinder 301 can be moved downward, and finally the outer hanging plate 307 in front of the cylinder 301 can pass through the downward exploration area 203 and finally reach the inside of the waste solder paste packaging box 4.

[0042] It should be noted that, in this document, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprising", "including" or any other variant thereof are intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device.

[0043] Although embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

[0044] The above describes the present invention and its implementation manners. Such description is not restrictive. What is shown in the drawings is only one of the implementation manners of the present invention, and the actual structure is not limited thereto. In general, if those of ordinary skill in the art are inspired by it and, without departing from the gist of the present invention, design similar structural modes and embodiments to this technical solution without creative efforts, they shall fall within the protection scope of the present invention.

Claims

1. A device for processing waste packaging of solder paste after soldering of LED light strips, characterized in that: It comprises a closing component (2) and a cleaning component (3), wherein the cleaning component (3) is arranged on the upper part of the closing component (2); The cleaning assembly (3) comprises a connecting rod assembly (306) and an external hanging plate (307); a plurality of groups of connecting rod assemblies (306) are arranged in an annular manner at equal intervals inside the cleaning assembly (3); and a group of external hanging plates (307) are arranged outside each group of connecting rod assemblies (306); The closure assembly (2) is arranged at the lower part of the external hanging plate (307), and comprises an upper base (201) and an action ring (207); the upper base (201) is arranged at the lower part of the external hanging plate (307), and the upper base (201) is arranged at the upper part of the action ring (207).

2. The device for processing waste packaging of solder paste after soldering of LED light strips according to claim 1, characterized in that: The upper base (201) comprises a base slide groove (202) and a downward exploration area (203); the downward exploration area (203) is provided at the center of the upper base (201); the downward exploration area (203) runs through the upper base (201); the upper base (201) is provided with a base slide groove (202); the base slide groove (202) is located outside the downward exploration area (203); and the base slide groove (202) is hexagonal.

3. The device for processing waste packaging of solder paste after soldering of LED light strips according to claim 2, characterized in that: The action ring (207) comprises a fixed block (208), an action slit (209) and a middle fixed ring (210); six groups of fixed blocks (208) are fixedly connected inside the action ring (207); an action slit (209) is provided in the middle of each group of fixed blocks (208); each group of action slits (209) penetrates the fixed block (208); a fixed ring (210) is fixedly connected in the middle of the six groups of fixed blocks (208); and the six groups of fixed blocks (208) are arranged in a ring shape with equal spacing between the middle fixed ring (210) and the action ring (207).

4. The device for processing waste packaging of solder paste after soldering of LED light strips according to claim 3, characterized in that: The sealing assembly (2) further comprises six groups of sealing sliders (204), positioning pins (205) and pin shafts (206). The six groups of sealing sliders (204) are all arranged between the upper base (201) and the action ring (207). The lower part of each group of sealing sliders (204) is fixedly connected to the positioning pin (205), and the upper part of each group of sealing sliders (204) is fixedly connected to the pin shaft (206).

5. The device for processing waste packaging of solder paste after soldering of LED light strips according to claim 4, characterized in that: The positioning pin (205) is movably connected to the movement slit (209), and the pin shaft (206) is movably connected to the base sliding groove (202).

6. The device for processing waste packaging of solder paste after soldering of LED light strips according to claim 1, characterized in that: The closure assembly (2) further comprises a first driven gear (211), a second driven gear (212), a protection block (213), a first driving gear (214), a driving shaft (215) and a second driving gear (216); the first driven gear (211) is fixedly connected to the outside of the action ring (207); the second driven gear (212) is arranged at the lower part of the action ring (207); a plurality of groups of protection blocks (213) are evenly distributed on the upper part of the second driven gear (212); the first driving gear (214) is movably connected to one side of the second driven gear (212); the driving shaft (215) is fixedly connected to the center of the first driving gear (214); the second driving gear (216) is fixedly connected to the upper part of the driving shaft (215) and is rotationally connected to the first driven gear (211).

7. The device for processing waste packaging of solder paste after soldering of LED light strips according to claim 1, characterized in that: The sealing component (2) further comprises a cylinder (301), a fixing platform (302), a fixing collar (303), an upper sleeve (304) and an action shaft (305); the cylinder (301) is arranged at the upper part of the cleaning component (3); the fixing platform (302) is arranged at the lower part of the cylinder (301); the fixing collar (303) is arranged at the upper part of the fixing platform (302); the upper sleeve (304) is arranged at the upper part of the fixing collar (303); the action shaft (305) is arranged between the fixing collar (303) and the upper sleeve (304); and a plurality of groups of connecting rod assemblies (306) are arranged in an annular manner at equal intervals on the action shaft (305); and the outer part of each group of the connecting rod assemblies (306) is movably connected to an outer hanging plate (307).

8. The device for processing waste packaging of solder paste after soldering of LED light strips according to claim 1, characterized in that: The invention also comprises a lifting assembly (1), wherein the lifting assembly (1) is arranged on the upper part of the sealing assembly (2) and the cleaning assembly (3), and the lifting assembly (1) comprises a motor assembly (101), a sliding rod assembly (102), a sliding table (103), an overall frame (104) and a connecting frame (105), wherein the motor assembly (101) is arranged on the upper part of the overall frame (104), the sliding rod assembly (102) is arranged on the lower part of the overall frame (104), the sliding table (103) is movably connected to the sliding rod assembly (102), and the connecting frame (105) is arranged on the lower part of the sliding table (103) and is connected to the cylinder (301).

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