Measuring device, semiconductor equipment and method for measuring cleaning efficiency of pipeline

Abstract

The invention provides a measuring device, semiconductor equipment and a method for measuring the cleaning efficiency of a pipeline, the measuring device is used for measuring the cleaning efficiency of the pipeline in the semiconductor equipment, the measuring device comprises a support, a carrying disc and a test piece, and the support is used for supporting the inner wall of the pipeline; the carrying disc is arranged on the bracket; the test piece is arranged on the carrying disc. According to the invention, the measuring device is arranged in the semiconductor equipment, and the cleaning efficiency of the pipeline of the semiconductor equipment can be detected, so that the cleanliness of the surface of a semiconductor is ensured, and the yield and performance of a semiconductor chip are improved.

Description

Technical Field

[0001] This application relates to the field of coating equipment, and particularly to a measuring device, a semiconductor device, and a method for measuring the cleaning efficiency of a measuring pipeline. Background Art

[0002] In the semiconductor thin film deposition process, reaction gases continuously pass through pipelines and are evacuated by a pump body to maintain a certain reaction pressure. During this process, many unreacted gases or some gas free radicals will deposit on the pipelines or butterfly valves in the pipelines, causing blockages. Therefore, when cleaning the chamber of the equipment, the pipelines also need to be cleaned. Although existing technologies and devices can study the cleaning efficiency at different positions of the chamber, there are few methods or devices to study the cleaning efficiency of pipelines. Summary of the Invention

[0003] In view of this, this application provides a measuring device, a semiconductor device, and a method for measuring the cleaning efficiency of a measuring pipeline to solve the problem in the prior art that the cleaning efficiency cannot be intuitively reflected.

[0004] To solve the above technical problem, one technical solution adopted in this application is: to provide a measuring device for measuring the cleaning efficiency of a pipeline in a semiconductor device, including: a bracket for supporting on the inner wall of the pipeline; a carrier plate disposed on the bracket; and a test piece disposed on the carrier plate.

[0005] According to an embodiment of this application, the carrier plate is detachably disposed on the bracket.

[0006] According to an embodiment of this application, the measuring device further includes a telescopic mechanism. The first end of the telescopic mechanism is connected to the bracket, the second end of the telescopic mechanism is connected to the carrier plate, the telescopic mechanism extends along the axial direction of the pipeline, and the carrier plate moves away from or close to the bracket through the telescopic mechanism.

[0007] According to an embodiment of this application, the measuring device further includes a clamp disposed on the carrier plate for clamping the test piece.

[0008] According to an embodiment of this application, there are at least two carrier plates, at least one clamp and one test piece are disposed on each carrier plate; the main planes of at least two test pieces intersect.

[0009] According to an embodiment of this application, the main plane of one of the test pieces is parallel to the axial direction of the pipeline, and the main plane of the other test piece is parallel to the radial direction of the pipeline.

[0010] According to an embodiment of this application, the clamp clamps the two sides of the test piece, or the clamp presses the test piece on the carrier plate.

[0011] According to an embodiment of the present application, the fixture includes a spring piece or a pressing piece. The spring piece is clamped on both sides of the test piece; or, the pressing piece is used to radially press the test piece on the carrier plate.

[0012] According to an embodiment of the present application, the bracket includes a sealing ring. The sealing ring is used to be arranged at the connection of two pipelines, and the carrier plate is arranged on the sealing ring.

[0013] In the second aspect of the embodiments of the present application, a semiconductor device is provided. The pipeline of the semiconductor device is provided with a measuring device as described in any one of the above.

[0014] In the third aspect of the embodiments of the present application, a method for measuring the cleaning efficiency of a pipeline is provided, which is used for any one of the above measuring devices or for the semiconductor device described above. The method includes: installing the measuring device on the inner wall of the pipeline; recording the initial thickness of the test piece before cleaning; cleaning the pipeline; recording the clean thickness of the test piece after cleaning; and calculating the cleaning efficiency according to the initial thickness and the clean thickness.

[0015] According to an embodiment of the present application, installing the measuring device on the inner wall of the pipeline includes: installing the measuring device at the connection of two pipelines, or installing the measuring device at the front end or the rear end of the butterfly valve in the pipeline.

[0016] According to an embodiment of the present application, the measuring device further includes a telescopic mechanism. The first end of the telescopic mechanism is connected to the bracket along the axial direction of the pipeline, and the second end of the telescopic mechanism is connected to the carrier plate. The carrier plate is far away from or close to the bracket through the telescopic mechanism.

[0017] The beneficial effect of the present application is: a measuring device is provided. The measuring device includes a bracket, a carrier plate and a test piece. The bracket is used to support on the inner wall of the pipeline; the carrier plate is arranged on the bracket; the test piece is arranged on the carrier plate. By setting the measuring device in the semiconductor device, the cleaning efficiency of the pipeline can be detected by placing the test piece in the pipeline and studying the change in the thickness of the test piece before and after, so as to ensure the cleanliness of the semiconductor surface, and further improve the yield and performance of the semiconductor chip. Description of the Drawings

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained according to these drawings without creative efforts. Among them:

[0019] Figure 1 It is an installation schematic diagram of an embodiment of the measuring device of the present application;

[0020] Figure 2It is a schematic structural diagram of an embodiment of the measuring device of the present application;

[0021] Figure 3 It is an installation schematic diagram of an embodiment of the measuring device of the present application;

[0022] Figure 4 It is a schematic diagram of a partial structure of an embodiment of the measuring device of the present application;

[0023] Figure 5 It is a schematic flow diagram of an embodiment of the cleaning efficiency of the measuring pipeline of the present application. Specific embodiments

[0024] To make the above objects, features, and advantages of the present application more obvious and understandable, the following will describe in detail the specific embodiments of the present application with reference to the accompanying drawings. It can be understood that the specific embodiments described herein are only used to explain the present application, rather than limiting the present application. In addition, it should be noted that for the convenience of description, only parts related to the present application are shown in the drawings, rather than all structures. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present application.

[0025] Referring to "embodiment" herein means that the specific features, structures, or characteristics described in connection with the embodiment may be included in at least one embodiment of the present application. The phrase appears in various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art explicitly and implicitly understand that the embodiments described herein may be combined with other embodiments.

[0026] In the semiconductor thin film deposition process, reaction gases will continuously pass through the pipelines in the equipment. Many unreacted gases or some gas radicals will deposit on the pipelines or the butterfly valves in the pipelines, causing blockages. Therefore, while cleaning the chamber of the equipment, the pipelines also need to be cleaned. Existing technologies and devices usually need to study the cleaning efficiency of different positions in the chamber of the coating equipment, but there are few methods or devices to study the cleaning efficiency of the pipelines.

[0027] Therefore, the present application provides a measuring device 10. Referring to Figure 1 and Figure 2 , the measuring device 10 is used to measure the cleaning efficiency of the pipeline 20 in the semiconductor equipment. The measuring device 10 includes a bracket 101, a carrier plate 102, and a test piece 103. The bracket 101 is used to support the inner wall of the pipeline 20; the carrier plate 102 is arranged on the bracket 101; the test piece 103 is arranged on the carrier plate 102.

[0028] In the embodiments of the present application, the measuring device 10 is disposed in the pipeline 20. Specifically, the bracket 101 of the measuring device 10 is supported on the inner wall of the pipeline 20, the test piece 103 is disposed on the carrier plate 102, and the carrier plate 102 is disposed on the bracket 101. After the gas enters the pipeline 20, it deposits inside the pipeline 20, and the gas or some gas free radicals deposit on the pipe wall and the measuring device 10. After the reaction deposition ends and before cleaning, the thickness of the test piece 103 is measured for the first time. After cleaning, the thickness of the test piece 103 is measured for the second time. By comparing the change in the thickness of the test piece 103 before and after cleaning, the cleaning efficiency of the pipeline 20 can be detected. If the cleaning is not in place, cleaning can be continued to ensure the cleanliness of the semiconductor surface, thereby improving the yield and performance of the semiconductor chip.

[0029] In some embodiments, the carrier plate 102 is disposed on the bracket 101, and the shape of the carrier plate 102 is not limited as long as it does not affect the flow of gas or fluid inside the pipeline.

[0030] According to an embodiment of the present application, the carrier plate 102 is detachably disposed on the bracket 101.

[0031] In the embodiments of the present application, the carrier plate 102 is detachably disposed on the bracket 101, which is convenient to disassemble, conducive to multiple measurements, simple to assemble, and convenient for replacement and maintenance. In other embodiments, the carrier plate 102 can also be integrally formed with the bracket 101.

[0032] According to an embodiment of the present application, with reference to Figure 3 , the measuring device 10 further includes a telescopic mechanism 104. The first end of the telescopic mechanism 104 is connected to the bracket 101, the second end of the telescopic mechanism 104 is connected to the carrier plate 102, the telescopic mechanism 104 extends along the axial direction x of the pipeline 20, and the carrier plate 102 moves away from or close to the bracket 101 through the telescopic mechanism 104.

[0033] In the embodiments of the present application, the measuring device 10 further includes a telescopic mechanism 104. One end of the telescopic mechanism 104 is connected to the bracket 101. The connection manner between the telescopic mechanism 104 and the bracket 101 is fixedly connected to the central position of the bracket 101 relative to the pipeline 20. The fixing method can be welding or movably detachably connected to the central position of the bracket 101 relative to the pipeline 20. The end of the telescopic mechanism 104 away from the bracket 101 is connected to the carrier plate 102. The telescopic mechanism 104 drives the carrier plate 102 to move in the axial direction x away from or close to the bracket 101 so as to test the cleaning efficiency at different positions of the pipeline 20. The telescopic mechanism 104 can be a screw or other device that can be lifted.

[0034] According to an embodiment of the present application, the measuring device 10 further includes a fixture 105 disposed on the carrier plate 102 for clamping the test piece 103.

[0035] In the embodiment of the present application, with continued reference to Figure 2 , the fixture 105 is used to fix the test piece 103 on the carrier plate 102, facilitating the stability of the test piece 103 and improving the test efficiency.

[0036] According to an embodiment of the present application, the carrier plate 102 includes at least two, and at least one fixture 105 and one test piece 103 are disposed on each carrier plate 102; the main planes of at least two test pieces 103 intersect.

[0037] In the embodiment of the present application, the fixtures 105 and the test pieces 103 on the carrier plate 102 are arranged in one-to-one correspondence. The carrier plate 102 includes at least two, and the main planes of the test pieces 103 on at least two carrier plates 102 are different. The main planes of the test pieces 103 intersect at a certain angle after extension. This setting method can test the cleaning efficiency of the pipeline 20 in different directions and realize the test of multi-directional cleaning efficiency.

[0038] According to an embodiment of the present application, the test piece 103 includes a first test piece 1031 and a second test piece 1032, wherein the main plane of the first test piece 1031 is parallel to the axial direction x of the pipeline 20, and the main plane of the second test piece 1032 is parallel to the radial direction y of the pipeline 20.

[0039] In the embodiment of the present application, the carrier plate 102 includes at least two, and the carrier plate 102, the fixture 105 and the test piece 103 are arranged in one-to-one correspondence. The test piece 103 includes a first test piece 1031 and a second test piece 1032, and the main planes of the first test piece 1031 and the second test piece 1032 are different. With combined reference to Figure 1 and Figure 2 , wherein the main plane of the first test piece 1031 is parallel to the axial direction x of the pipeline 20, and the main plane of the second test piece 1032 is parallel to the radial direction y of the pipeline 20, for testing the cleaning efficiency of the butterfly valve 201. The setting method of the first test piece 1031 and the second test piece 1032 can respectively test the cleaning efficiency in the axial direction x and the radial direction y of the pipeline 20, realize the test of multi-directional cleaning efficiency, thereby ensuring the cleanliness of the semiconductor surface and further improving the yield and performance of the semiconductor chip.

[0040] In some embodiments, the bracket 101 includes two or more carrier plates 102, and the two or more carrier plates 102 are designed to be spaced apart on the bracket 101, which can be equally spaced or unequally spaced.

[0041] According to an embodiment of the present application, the fixture 105 is clamped on both sides of the test piece 103, or the fixture 105 presses the test piece 103 onto the carrier plate 102.

[0042] In the embodiment of the present application, with reference to Figure 2 and Figure 4 , the test piece 103 includes a first test piece 1031 and a second test piece 1032. The fixture 105 is clamped on both sides of the first test piece 1031, and the main plane of the first test piece 1031 is parallel to the axial direction x of the pipeline 20. Alternatively, with reference to Figure 2 , the fixture 105 presses the second test piece 1032 onto the carrier plate 102, and the main plane of the second test piece 1032 is parallel to the radial direction y of the pipeline 20. Different setting methods of the test piece 103 can respectively test the cleaning efficiency in the axial direction x and the radial direction y of the pipeline 20, realize the multi-directional cleaning efficiency test, thereby ensuring the cleanliness of the semiconductor surface and further improving the yield and performance of the semiconductor chip.

[0043] According to an embodiment of the present application, the fixture 105 includes a spring piece or a pressing piece. The spring piece is clamped on both sides of the test piece 103; alternatively, the pressing piece is used to radially press the test piece 103 onto the carrier plate 102.

[0044] According to an embodiment of the present application, the bracket 101 includes a sealing ring, and the sealing ring is used to be arranged at the connection of two pipelines, and the carrier plate 102 is arranged on the sealing ring.

[0045] In the embodiment of the present application, the bracket 101 may include a sealing ring. The measuring device 10 can be arranged at the connection of two pipelines by squeezing the sealing ring, saving material costs and testing the cleaning efficiency at the pipeline interface while also playing a role in sealing the pipeline.

[0046] In the second aspect of the embodiment of the present application, a semiconductor device is provided, and the pipeline 20 of the semiconductor device is provided with the measuring device 10 as described in any one of the above.

[0047] In the third aspect of the embodiment of the present application, a method for measuring the cleaning efficiency of a pipeline is provided, which is used for the measuring device 10 as described in any one of the above, or for the semiconductor device as described above. The method includes: installing the measuring device 10 on the inner wall of the pipeline 20; recording the initial thickness of the test piece 103 before cleaning; cleaning the pipeline; recording the clean thickness of the test piece after cleaning; calculating the cleaning efficiency according to the initial thickness and the clean thickness.

[0048] In the embodiment of the present application, with reference to Figure 5 , the method for measuring the cleaning efficiency of a pipeline includes:

[0049] S100: Install the measuring device 10 on the inner wall of the pipeline.

[0050] S101: Record the initial thickness of the test piece 103 before cleaning.

[0051] S102: Clean the pipeline 20.

[0052] S103: Record the clean thickness of the test piece 103 after cleaning.

[0053] S104: Calculate the cleaning efficiency based on the initial thickness and the clean thickness.

[0054] In the embodiment of the present application, the measuring device 10 is arranged in the pipeline 20. After the gas enters the pipeline 20, it deposits inside the pipeline 20, and the gas or some gas free radicals deposit on the pipe wall and the measuring device 10. After the reaction deposition ends and before cleaning, record the initial thickness of the test piece 103 before cleaning. After cleaning the pipeline 20, measure the clean thickness of the test piece 103. The cleaning efficiency of the pipeline 20 can be detected by the change in the thickness of the test piece 103 before and after cleaning. If the cleaning is not in place, cleaning can be continued to ensure the cleanliness of the semiconductor surface, thereby improving the yield and performance of the semiconductor chip.

[0055] According to an embodiment of the present application, installing the measuring device 10 on the inner wall of the pipeline 20 includes: installing the measuring device 10 at the connection of two pipelines, or installing the measuring device 10 at the front end or the rear end of the butterfly valve 201 in the pipeline 20.

[0056] In the embodiment of the present application, the measuring device 10 can be installed at the connection of two pipelines, or at the front end or the rear end of the butterfly valve 201, so as to detect the cleaning efficiency at multiple positions of the pipeline 20.

[0057] According to an embodiment of the present application, the measuring device 10 further includes a telescopic mechanism 104. The first end of the telescopic mechanism 104 is connected to the bracket 101 along the axial direction of the pipeline 20, and the second end of the telescopic mechanism 104 is connected to the carrier plate 102. The carrier plate 102 moves away from or close to the bracket 101 through the telescopic mechanism 104.

[0058] In the embodiment of the present application, the measuring device 10 includes a telescopic mechanism 104. The first end of the telescopic mechanism 104 is connected to the bracket 101, and the other end is connected to the carrier plate 102. The carrier plate 102 realizes the cleaning efficiency test at different positions of the pipeline 20 through the telescopic mechanism 104, so as to realize multi-position and multi-direction testing.

[0059] In one embodiment, measuring the clean thickness of the test piece 103 after cleaning the recording pipeline 20 includes: extending the second end of the telescopic mechanism 104 to the first position A to record the first clean thickness of the test piece 103 after cleaning the recording pipeline 20; and / or, extending the second end of the telescopic mechanism 104 to the second position B to record the second clean thickness of the test piece 103 after cleaning the recording pipeline 20, where the second position B is farther from the bracket 101 than the first position A. Next, calculating the cleaning efficiency based on the initial thickness and the clean thickness includes: calculating the cleaning efficiency at the first position A based on the initial thickness and the first clean thickness; or, calculating the cleaning efficiency at the second position B based on the initial thickness and the second clean thickness.

[0060] In other embodiments, the second end of the telescopic mechanism 104 can also be extended to the third position, the fourth position, etc. for testing the clean thickness, which is not limited herein.

[0061] In the embodiments of the present application, the cleaning efficiency at different positions of the pipeline 20 is tested separately, which can more comprehensively detect the cleaning efficiency of the pipeline 20. If the cleaning is not in place, cleaning can be continued to ensure the cleanliness of the semiconductor surface, thereby improving the yield and performance of the semiconductor chip.

[0062] In summary, the present application provides a measuring device 10, which includes a bracket 101, a carrier plate 102 and a test piece 103. The carrier plate 102 is detachably arranged on the bracket 101. The measuring device 10 further includes a telescopic mechanism 104. The carrier plate 102 moves away from or close to the bracket 101 through the telescopic mechanism 104. The telescopic mechanism 104 drives the carrier plate 102 to move away from or close to the bracket 101 in the axial direction x to measure the cleaning efficiency at different positions of the pipeline 20. The main planes of at least two test pieces 103 intersect, so that the cleaning efficiency in different directions of the pipeline 20 can be measured, realizing the measurement of the cleaning efficiency in multiple directions. By setting the measuring device 10 in the semiconductor device in the present application, the cleaning efficiency of the pipeline 20 can be detected by comparing the change in the thickness of the test piece 103 before and after cleaning. If the cleaning is not in place, cleaning can be continued to ensure the cleanliness of the semiconductor surface, thereby improving the yield and performance of the semiconductor chip.

[0063] The above are only the embodiments of the present application, and do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied to other related technical fields, shall be included in the patent protection scope of the present application by the same token.

Claims

1. A measuring device, characterized in that: Used to measure the cleaning efficiency of pipelines in semiconductor equipment, including: A bracket, used for supporting the inner wall of the pipeline; A loading tray, arranged on the bracket; The test piece is arranged on the loading plate.

2. The measuring device according to claim 1, characterized in that The loading tray is detachably arranged on the bracket.

3. The measuring device according to claim 1, characterized in that The measuring device also includes a telescopic mechanism, a first end of which is connected to the bracket, a second end of which is connected to the loading plate, and the telescopic mechanism extends along the axial direction of the pipeline, and the loading plate moves away from or close to the bracket through the telescopic mechanism.

4. The measuring device according to claim 1, characterized in that The measuring device further comprises a clamp, which is arranged on the loading plate and is used for clamping the test piece.

5. The measuring device according to claim 4, characterized in that The carrier plates include at least two, each of which is provided with at least one fixture and one test piece; and the main planes of at least two test pieces intersect.

6. The measuring device according to claim 5, characterized in that A principal plane of one of the test pieces is parallel to the axial direction of the pipeline, and a principal plane of another of the test pieces is parallel to the radial direction of the pipeline.

7. The measuring device according to claim 5, characterized in that The clamp is disposed on both sides of the test piece, or the clamp covers the test piece and presses it onto the object carrier.

8. The measuring device according to claim 6 or 7, characterized in that The clamp comprises a spring sheet or a pressing sheet, and the spring sheet is clamped on both sides of the test sheet; or the pressing sheet is used to radially press the test sheet onto the carrier plate.

9. The measuring device according to claim 1, characterized in that The bracket comprises a sealing ring, and the sealing ring is used to be arranged at the connection of the two pipelines, and the loading tray is arranged on the sealing ring.

10. A semiconductor device, characterized in that: The pipeline of the semiconductor device is provided with the measuring device according to any one of claims 1 to 9.

11. A method for measuring pipeline cleaning efficiency, characterized in that: Used in the measuring device according to any one of claims 1 to 9, or used in the semiconductor device according to claim 10, the method comprising: Installing the measuring device on the inner wall of the pipeline; Recording the initial thickness of the test piece before cleaning; Cleaning the pipeline; Recording the clean thickness of the test piece after cleaning; The cleaning efficiency is calculated according to the initial thickness and the clean thickness.

12. The method for measuring pipeline cleaning efficiency according to claim 11, characterized in that: The step of installing the measuring device on the inner wall of the pipeline comprises: The measuring device is installed at the connection of the two pipelines, or the measuring device is installed at the front end or the rear end of the butterfly valve in the pipeline.

13. The method for measuring pipeline cleaning efficiency according to claim 11, characterized in that: The measuring device further comprises a telescopic mechanism, a first end of which is connected to the bracket along the axial direction of the pipeline, and a second end of which is connected to the loading plate, and the loading plate moves away from or close to the bracket through the telescopic mechanism.

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