Measuring device, semiconductor equipment and method for measuring cleaning efficiency of pipeline

Abstract

The invention provides a measuring device, semiconductor equipment and a method for measuring the cleaning efficiency of pipelines, the measuring device is used for measuring the cleaning efficiency of the pipelines in the semiconductor equipment, the measuring device comprises a support, a bearing part and a test piece, and the support is arranged between flanges of the two pipelines; the bearing piece is arranged on the bracket; the test piece is arranged on the outer surface of the bearing piece. The measuring device is arranged in the semiconductor equipment, the cleaning efficiency of the pipeline of the semiconductor equipment can be detected, the cleaning effect is visually reflected, and the measuring device is easy to disassemble and assemble and beneficial to operation.

Description

Technical Field

[0001] The present application relates to the field of semiconductor equipment, and particularly to a measuring device, a semiconductor equipment, and a method for measuring the cleaning efficiency of a measuring pipeline. Background Art

[0002] In the semiconductor thin film deposition process, during the process of the reaction gas passing through the pipeline into or out of the reaction chamber, part of the gas and reactants will be deposited on the inner wall of the pipeline and the butterfly valve. Over time, it will cause the pipeline to be blocked. In view of the blockage problem, equipment for cleaning the pipeline has been designed, but for the cleaning efficiency, there is currently no means or tool that can intuitively reflect the cleaning efficiency. Summary of the Invention

[0003] In view of this, the present application provides a measuring device, a semiconductor equipment, and a method for measuring the cleaning efficiency of a measuring pipeline to solve the problem in the prior art that the cleaning efficiency cannot be intuitively reflected.

[0004] To solve the above technical problems, a technical solution adopted by the present application is: to provide a measuring device for measuring the cleaning efficiency of a pipeline in a semiconductor equipment. The measuring device includes a bracket, a carrier, and a test piece. The bracket is arranged between the flanges of two pipelines; the carrier is arranged on the bracket; the test piece is arranged on the outer surface of the carrier.

[0005] According to an embodiment of the present application, the carrier includes a first carrier, and the first carrier extends from one side inside the pipeline to the other side inside the pipeline; along the extending direction of the first carrier, at least one test piece is arranged on the outer surface of the first carrier.

[0006] According to an embodiment of the present application, the first carrier has at least a first main plane and a second main plane. The extension plane of the first main plane intersects with the extension plane of the second main plane, and at least one test piece is arranged on the first main plane; and / or, at least one test piece is arranged on the second main plane.

[0007] According to an embodiment of the present application, the first main plane is parallel to the axis direction of the bracket, and the second main plane is perpendicular to the axis direction of the bracket.

[0008] According to an embodiment of the present application, one end of the first carrier is connected to the bracket, and the first carrier extends radially along the pipeline.

[0009] According to an embodiment of the present application, the carrier further includes at least one second carrier. The first end of the second carrier is arranged on the bracket, and the second end of the second carrier extends along the axis direction of the bracket; along the extending direction of the second carrier, the second carrier includes a third main plane, the third main plane faces the center side of the pipeline, and at least one test piece is arranged on the third main plane.

[0010] According to an embodiment of the present application, the measuring device further includes a first fixing member, which is sleeved outside the first carrier member to fix the test piece, and the first fixing member is provided with a hollowed-out area corresponding to the test piece.

[0011] According to an embodiment of the present application, the first fixing member includes a first side plate, a second side plate, and a third side plate that are sequentially connected. Among them, the first side plate and the third side plate are oppositely arranged; the first side plate, the second side plate, and the third side plate enclose an accommodation cavity, and the first carrier member carrying the test piece is arranged in the accommodation cavity; the first side plate and the second side plate are provided with communicating hollowed-out parts to form a hollowed-out area; the first side plate and the first main plane are correspondingly arranged, and the second side plate and the second main plane are correspondingly arranged; the hollowed-out parts are used for the cleaning gas to pass through to contact the test pieces on the first main plane and / or the second main plane respectively.

[0012] According to an embodiment of the present application, the measuring device further includes a second fixing member, which is sleeved outside the second carrier member to fix the test piece. The second fixing member includes a first frame and a second frame that are oppositely arranged, and the first frame and the second frame are respectively pressed on the edges of the test piece to fix the test piece.

[0013] In a second aspect of the embodiments of the present application, a semiconductor device is provided, including a pipeline and the above-mentioned measuring device, and the measuring device is arranged between the flanges of two pipelines.

[0014] In a third aspect of the embodiments of the present application, a method for measuring the cleaning efficiency of a pipeline is provided, which is used for the above-mentioned measuring device or in a semiconductor device. The method includes: recording the first thickness of the test piece before cleaning; installing the measuring device in the pipeline; cleaning the pipeline; recording the second thickness of the test piece after cleaning; calculating the cleaning efficiency according to the first thickness and the second thickness.

[0015] According to an embodiment of the present application, installing the measuring device in the pipeline includes: installing the measuring device at the connection of two pipelines.

[0016] The beneficial effect of the present application is: A measuring device is provided. The measuring device includes a bracket, a carrier member, and a test piece. The bracket is used to be arranged in the pipeline; the carrier member is arranged on the bracket; the test piece is arranged on the outer surface of the carrier member. By setting the measuring device in the semiconductor device in the present application, the cleaning efficiency of the pipeline can be detected by placing the test piece in the pipeline and studying the change in the thickness of the test piece before and after, so as to intuitively reflect the cleaning effect, and the disassembly and assembly of the measuring device are simple and convenient for operation. Description of the Drawings

[0017] To more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the accompanying drawings required for the description of the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can be obtained based on these drawings. Among them:

[0018] Figure 1 is the installation schematic diagram of an embodiment of the measuring device of the present application;

[0019] Figure 2 is the structural schematic diagram of an embodiment of the measuring device of the present application;

[0020] Figure 3 is the structural schematic diagram of another embodiment of the measuring device of the present application;

[0021] Figure 4 is the structural schematic diagram of an embodiment of the measuring device of the present application;

[0022] Figure 5 is the flow schematic diagram of an embodiment of the cleaning efficiency of the measuring pipeline of the present application. Detailed Embodiments

[0023] To make the above objects, features, and advantages of the present application more obvious and understandable, the following will provide a detailed description of the specific embodiments of the present application with reference to the accompanying drawings. It can be understood that the specific embodiments described herein are only used to explain the present application, rather than limiting the present application. Additionally, it should be noted that for the convenience of description, only the parts related to the present application are shown in the accompanying drawings, rather than all the structures. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present application.

[0024] Referring to "embodiments" in this context means that the specific features, structures, or characteristics described in connection with the embodiments can be included in at least one embodiment of the present application. The phrase does not necessarily refer to the same embodiment at all positions in the specification, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. Those skilled in the art explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0025] In the semiconductor thin film deposition process, during the process of the reaction gas passing through the pipeline into or out of the reaction chamber, part of the gas and reactants will deposit on the inner wall of the pipeline and the butterfly valve, which will cause pipeline blockage over a long time. To address the blockage problem, equipment for cleaning the pipeline has been designed, but for the cleaning efficiency, there is currently no means or tool that can intuitively reflect the cleaning efficiency.

[0026] Refer to Figure 1 、Figure 2 and Figure 3 , Figure 1 is an installation schematic diagram of an embodiment of the measuring device of the present application. Figure 2 is a structural schematic diagram of an embodiment of the measuring device of the present application. Figure 3 is a structural schematic diagram of another embodiment of the measuring device of the present application.

[0027] The present application provides a measuring device 10 for measuring the cleaning efficiency of pipelines in semiconductor devices. The measuring device 10 includes a bracket 101, a carrier 102, and a test piece 103. The bracket 101 is arranged between the flanges of two pipelines; the carrier 102 is arranged on the bracket 101; the test piece 103 is arranged on the outer surface of the carrier 102.

[0028] In an embodiment of the present application, the measuring device 10 is arranged in the pipeline of a semiconductor thin film deposition device. Specifically, the bracket 101 of the measuring device 10 is arranged at the connection of the pipeline, the carrier 102 is arranged on the bracket 101, and the test piece 103 is arranged on the outer surface of the carrier 102. After the gas enters the pipeline, it is deposited inside the pipeline, and the gas or some gas free radicals are deposited at positions such as the pipe wall. After the reaction deposition is completed, the measuring device 10 provided in this embodiment is installed at the pipeline connection. The thickness of the test piece 103 is measured for the first time before cleaning, and after cleaning, the thickness of the test piece 103 is measured for the second time. By comparing the change in the thickness of the test piece 103 before and after cleaning, the cleaning efficiency of the pipeline can be detected. If the cleaning is not in place, cleaning can be continued, so as to intuitively reflect the cleaning effect, ensure the cleanliness of the semiconductor surface in the semiconductor thin film deposition device, and then improve the yield and performance of semiconductor chips; and the disassembly and assembly of the measuring device 10 are simple and convenient for operation.

[0029] In some embodiments, the test piece 103 is a wafer slice with a film deposited on its surface. After cleaning, the thickness of the film on the test piece 103 becomes smaller.

[0030] Refer to Figure 4 , Figure 4 is a structural schematic diagram of an embodiment of the measuring device of the present application.

[0031] In some embodiments, the test piece 103 can be arranged on the outer surface of the carrier 102 by being embedded in a groove of the carrier 102 to maintain the stability of the test piece 103. In other embodiments, the test piece 103 can also be directly attached to the outer surface of the carrier 102, and the attachment method can be magnetic attraction or bonding.

[0032] In some embodiments, the number of test pieces 103 on the outer surface of the carrier 102 is at least one, and the number of test pieces 103 can be set according to actual requirements. When the number of test pieces 103 is multiple, the average value of the thicknesses of the multiple test pieces 103 can be taken to represent the thickness before or after cleaning, making the measurement result more accurate.

[0033] According to an embodiment of the present application, continue to refer to Figure 2 , the bracket 101 is located on the inner wall of the pipeline, the carrier 102 includes a first carrier 1021, and the first carrier 1021 extends from one side inside the pipeline to the other side inside the pipeline; along the extension direction of the first carrier 1021, at least one test piece 103 is arranged on the outer surface of the first carrier 1021.

[0034] In the embodiment of the present application, the extension direction of the first carrier 1021 extends along the radial direction y of the pipeline. The first carrier 1021 extends from one side a inside the pipeline to the other side b inside the pipeline. The test piece 103 on the outer surface of the first carrier 1021 is used to measure the cleaning efficiency in the center of the pipeline. After the gas enters the pipeline, it deposits inside the pipeline, and the gas or some gas free radicals deposit at positions such as the pipe wall. The thickness of the test piece 103 is measured for the first time, and the measuring device 10 provided in this embodiment is installed at the pipeline connection. Then, the pipeline is cleaned by using plasma gas or other cleaning media. After cleaning, the thickness of the test piece 103 is measured for the second time. By comparing the change in the thickness of the test piece 103 before and after cleaning, the cleaning efficiency in the center of the pipeline can be detected. If the cleaning is not in place, cleaning can be continued. In this embodiment, the method of disassembling and installing the bracket 101 or the test piece 103 is simple, which is conducive to conveniently removing and testing the thickness before and after cleaning.

[0035] According to an embodiment of the present application, continue to refer to Figure 4 , the first carrier 1021 has at least a first main plane 1021a and a second main plane 1021b. The extension plane of the first main plane 1021a intersects with the extension plane of the second main plane 1021b, and at least one test piece 103 is arranged on the first main plane 1021a; and / or, at least one test piece 103 is arranged on the second main plane 1021b.

[0036] In the embodiment of the present application, the extended plane of the first main plane 1021a intersects with the extended plane of the second main plane 1021b, and the extended first main plane 1021a and the extended second main plane 1021b are arranged at an angle. At least one test piece 103 is arranged on the first main plane 1021a, or at least one test piece 103 is arranged on the second main plane 1021b, or at least one test piece 103 is respectively arranged on the first main plane 1021a and the second main plane 1021b. The test piece 103 on the first main plane 1021a is used to test the cleaning efficiency at the center of the pipeline in the direction perpendicular to the first main plane 1021a. The test piece 103 on the second main plane 1021b is used to test the cleaning efficiency at the center of the pipeline in the direction perpendicular to the second main plane 1021b. When test pieces 103 are arranged on both the first main plane 1021a and the second main plane 1021b, in the embodiment of the present application, by arranging the test pieces 103 on different main planes, the cleaning efficiencies in different directions can be respectively tested, the cleaning result can be intuitively reflected, and the operation is convenient and effective.

[0037] In other embodiments, the first carrier 1021 may further include main planes other than the first main plane 1021a and the second main plane 1021b, and test pieces 103 may be arranged on each main plane, which is not limited herein.

[0038] According to an embodiment of the present application, the first main plane 1021a is parallel to the axis direction of the bracket 101, and the second main plane 1021b is perpendicular to the axis direction of the bracket 101.

[0039] In the embodiment of the present application, the first main plane 1021a is parallel to the passing direction of the reaction gas, and the second main plane 1021b is perpendicular to the passing direction of the reaction gas. Similarly, the first main plane 1021a is parallel to the passing direction of the plasma gas or other cleaning media, and the second main plane 1021b is perpendicular to the passing direction of the plasma gas or other cleaning media. The test piece 103 on the first main plane 1021a is used to test the cleaning efficiency at the center of the pipeline in the radial direction y; the test piece 103 on the second main plane 1021b is used to test the cleaning efficiency at the center of the pipeline in the axial direction x. When test pieces 103 are arranged on both the first main plane 1021a and the second main plane 1021b, in the embodiment of the present application, by arranging the test pieces 103 on different main planes, the cleaning efficiencies in the axial direction x and the radial direction y can be respectively tested, the cleaning result can be intuitively reflected, and the operation is convenient and effective.

[0040] According to an embodiment of the present application, one end of the first carrier 1021 is connected to the bracket 101, and the first carrier 1021 extends along the radial direction of the pipeline.

[0041] In an embodiment of the present application, the bracket 101 is annular. The annular bracket 101 is arranged to be attached to the inner wall of the pipeline, or the annular bracket 101 is arranged between the flanges of two pipelines. The first carrier 1021 is arranged on the bracket 101 along the radial direction y. The test piece 103 on the outer surface of the first carrier 1021 is used to measure the cleaning efficiency in the center of the pipeline.

[0042] In some embodiments, both ends of the first carrier 1021 are respectively connected to the bracket 101.

[0043] According to an embodiment of the present application, continue to refer to Figure 3 , the carrier 102 further includes at least one second carrier 1022. The first end of the second carrier 1022 is arranged on the bracket 101, and the second end of the second carrier 1022 extends along the axial direction of the bracket 101; along the extension direction of the second carrier 1022, the second carrier 1022 includes a third main plane 1022a, the third main plane 1022a faces the center side of the pipeline, and at least one test piece 103 is arranged on the third main plane 1022a.

[0044] In an embodiment of the present application, the extension direction of the second carrier 1022 is along the axial direction x of the bracket 101. The test piece 103 on the third main plane 1022a of the second carrier 1022 is used to measure the cleaning efficiency of the pipe wall. After the gas enters the pipeline, it deposits at the wall surface position of the pipeline. After measuring the thickness of the test piece 103 for the first time before cleaning, the measuring device 10 provided in the embodiment of the present application is installed at the pipeline connection, and then the pipeline is cleaned by using plasma gas or other cleaning media. After cleaning, the thickness of the test piece 103 is measured for the second time. By comparing the change in the thickness of the test piece 103 before and after cleaning, the cleaning efficiency of the pipe wall can be detected. If the cleaning is not in place, cleaning can be continued. In this embodiment, the method of disassembling and assembling the test piece 103 or the bracket 101 is simple, which is conducive to conveniently measuring the thickness before and after cleaning.

[0045] In some embodiments, at least two second carriers 1022 are arranged at intervals along the radial direction y on the annular bracket 101.

[0046] In some embodiments, the carrier 102 can be provided with a first carrier 1021 and a second carrier 1022 on the bracket 101 at the same time. The first carrier 1021 is arranged on the bracket 101 along the radial direction y. The test piece 103 on the outer surface of the first carrier 1021 is used to measure the cleaning efficiency in the center of the pipeline. The second carrier 1022 is arranged on the bracket 101 along the axial direction x of the bracket 101. The test piece 103 on the outer surface of the second carrier 1022 is used to measure the cleaning efficiency of the pipe wall. Thus, the carrier 102 can comprehensively and multi-directionally test the cleaning efficiency of the pipeline, intuitively reflect the cleaning result, and is convenient and effective to operate.

[0047] According to an embodiment of the present application, referring to Figure 2 and Figure 4 , the measuring device 10 further includes a first fixing member 104. The first fixing member 104 is sleeved outside the first carrier 1021 to fix the test piece 103, and the first fixing member 104 is provided with a hollowed-out area corresponding to the test piece 103.

[0048] In the embodiment of the present application, the test piece 103 is arranged on the outer surface of the first carrier 1021. The first fixing member 104 is sleeved outside the first carrier 1021 to fix the test piece 103 so that it does not fall off in the pipeline. The first fixing member 104 is provided with a hollowed-out area corresponding to the test piece 103 to expose the surface of the test piece 103, facilitating the cleaning of the surface of the test piece 103 by the plasma cleaning gas or other cleaning media, so as to facilitate observing and measuring the thickness change of the test piece 103 before and after cleaning.

[0049] According to an embodiment of the present application, referring to Figure 4 , the first fixing member 104 includes a first side plate 1041, a second side plate 1042 and a third side plate 1043 connected in sequence. Among them, the first side plate 1041 and the third side plate 1043 are oppositely arranged. The first side plate 1041, the second side plate 1042 and the third side plate 1043 enclose an accommodating cavity, and the first carrier 1021 carrying the test piece 103 is arranged in the accommodating cavity. The first side plate 1041 and the second side plate 1042 are provided with a communicating hollowed-out portion 1044 to form a hollowed-out area. The first side plate 1041 and the first main plane 1021a are correspondingly arranged, and the second side plate 1042 and the second main plane 1021b are correspondingly arranged. The hollowed-out portion 1044 is used for the cleaning gas to pass through to contact the test piece 103 on the first main plane 1021a and / or the second main plane 1021b respectively.

[0050] In the embodiments of the present application, the first fixing member 104 has a receiving cavity formed by enclosing the first side plate 1041, the second side plate 1042, and the third side plate 1043. The first carrier member 1021 is disposed in the receiving cavity, and the first fixing member 104 is sleeved on the outer surface of the first carrier member 1021 to fix the test piece 103 so as not to fall off in the pipeline. The first side plate 1041 and the second side plate 1042 are provided with a communicating hollow portion 1044. Among them, the first side plate 1041 and the first main plane 1021a are correspondingly arranged, the second side plate 1042 and the second main plane 1021b are correspondingly arranged, and the hollow portion 1044 can expose the test piece 103 located on the first main plane 1021a and / or the second main plane 1021b, facilitating the plasma cleaning gas or other cleaning media to contact the surface of the test piece 103 when passing through the pipeline, so as to facilitate observing and measuring the thickness change of the test piece 103 before and after cleaning.

[0051] In some embodiments, the first side plate 1041, the second side plate 1042, and the third side plate 1043 are provided with a communicating hollow portion 1044. The surface of the first carrier member 1021 opposite to the third side plate 1043 can be provided with the test piece 103. By disposing the test piece 103 on different main planes of the first carrier member 1021, the cleaning results in multiple directions can be intuitively reflected.

[0052] In other embodiments, the first fixing member 104 can be of other shapes, as long as it can fix the test piece 103 so as not to fall off.

[0053] According to an embodiment of the present application, with reference to Figure 3 , the measuring device 10 further includes a second fixing member 105. The second fixing member 105 is sleeved outside the second carrier member 1022 to fix the test piece 103. The second fixing member 105 includes a first frame 1051 and a second frame 1052 which are oppositely arranged. The first frame 1051 and the second frame 1052 are respectively pressed on the edges of the test piece 103 to fix the test piece 103.

[0054] In the embodiments of the present application, the first frame 1051 and the second frame 1052 which are oppositely arranged in the second fixing member 105 are respectively pressed on two sides of the test piece 103 to fix the test piece 103 so as not to fall off.

[0055] In other embodiments, the second fixing member 105 can be of other shapes, as long as it can fix the test piece 103 so as not to fall off.

[0056] In some embodiments, the measuring device 10 further includes a fastener 106. The fastener 106 is used to fix the first fixing member 104 to the first carrier 1021, and the fastener 106 is used to fix the second fixing member 105 to the second carrier 1022. Alternatively, the fastener 106 can also be used to fix the first carrier 1021 and / or the second carrier 1022 to the bracket 101.

[0057] In the second aspect of the embodiments of the present application, a semiconductor device is provided. The semiconductor device includes a pipeline and the above-mentioned measuring device 10, and the measuring device 10 is arranged between the flanges of two pipelines.

[0058] In the embodiments of the present application, the measuring device 10 can be installed between the flanges of two pipelines, or can be installed at the front end or the rear end of the butterfly valve, and can detect the cleaning efficiency at multiple positions of the pipeline.

[0059] In the third aspect of the embodiments of the present application, a method for measuring the cleaning efficiency of a pipeline is provided, which is used for the above-mentioned measuring device 10 or for a semiconductor device. The method includes: recording the first thickness of the test piece 103 before cleaning; installing the measuring device 10 in the pipeline; cleaning the pipeline; recording the second thickness of the test piece 103 after cleaning; and calculating the cleaning efficiency according to the first thickness and the second thickness.

[0060] In the embodiments of the present application, with reference to Figure 5 , the method for measuring the cleaning efficiency of a pipeline includes:

[0061] S100: Record the first thickness of the test piece 103 before cleaning.

[0062] Prepare at least one test piece 103, detect the first thickness of the test piece 103 with a film thickness gauge, and then install and fix the test piece 103 to the measuring device 10.

[0063] Among them, the first thickness can be the average value of the thicknesses of multiple test pieces 103 before cleaning.

[0064] S101: Install the measuring device 10 on the inner wall of the pipeline.

[0065] S102: Clean the pipeline.

[0066] S103: Record the second thickness of the test piece 103 after cleaning.

[0067] After the cleaning time T, remove the test piece 103 and detect the second thickness of the test piece 103 with a film thickness gauge.

[0068] Among them, the second thickness can be the average value of the thicknesses of multiple test pieces 103 after cleaning.

[0069] S104: Calculate the cleaning efficiency based on the first thickness and the second thickness.

[0070] Divide the difference between the first thickness and the second thickness by the time T to obtain the cleaning efficiency.

[0071] The embodiments of the present application can not only test the cleaning efficiency of different cleaning gases, but also obtain the cleaning distance corresponding to the cleaning gas according to the cleaning efficiency at different length positions of the pipeline, and the cleaning distance corresponds to the inactivation distance of the cleaning gas.

[0072] The above are only the embodiments of the present application, and do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present application.

Claims

1. A measuring device, characterized in that: Used to measure the cleaning efficiency of pipelines in semiconductor equipment, including: A bracket, arranged between the flanges of the two pipes; A bearing member, disposed on the bracket; The test piece is arranged on the outer surface of the carrier.

2. The measuring device according to claim 1, characterized in that The carrier includes a first carrier, and the first carrier extends from one side of the pipeline to the other side of the pipeline; along the extension direction of the first carrier, at least one test piece is arranged on the outer surface of the first carrier.

3. The measuring device according to claim 2, characterized in that The first carrier has at least a first main plane and a second main plane, an extension plane of the first main plane intersects with an extension plane of the second main plane, at least one test piece is arranged on the first main plane; and / or at least one test piece is arranged on the second main plane.

4. The measuring device according to claim 3, characterized in that The first principal plane is parallel to the axial direction of the bracket, and the second principal plane is perpendicular to the axial direction of the bracket.

5. The measuring device according to claim 2, characterized in that One end of the first supporting member is connected to the bracket, and the first supporting member extends along the pipeline path.

6. The measuring device according to any one of claims 1 to 5, characterized in that: The carrier also includes at least one second carrier, a first end of the second carrier is arranged on the bracket, and a second end of the second carrier extends along the axial direction of the bracket; along the extension direction of the second carrier, the second carrier includes a third main plane, the third main plane faces the center side of the pipeline, and at least one test piece is arranged on the third main plane.

7. The measuring device according to any one of claims 2 to 5, characterized in that: The measuring device further includes a first fixing member, which is sleeved outside the first supporting member to fix the test piece, and the first fixing member is provided with a hollow area corresponding to the test piece.

8. The measuring device according to claim 7, characterized in that The first fixing member comprises a first side plate, a second side plate and a third side plate which are connected in sequence, wherein the first side plate and the third side plate are arranged opposite to each other; The first side plate, the second side plate and the third side plate are surrounded to form a receiving cavity, and the first carrier carrying the test piece is arranged in the receiving cavity; The first side plate and the second side plate are provided with connected hollow parts to form the hollow area; the first side plate and the first main plane are arranged correspondingly, and the second side plate and the second main plane are arranged correspondingly; the hollow parts are used for cleaning gas to pass through so as to contact the test piece on the first main plane and / or the second main plane respectively.

9. The measuring device according to claim 6, characterized in that The measuring device also includes a second fixing member, which is sleeved outside the second carrier to fix the test piece, and the second fixing member includes a first frame and a second frame arranged opposite to each other, and the first frame and the second frame are respectively pressed on the edge of the test piece to fix the test piece.

10. A semiconductor device, characterized in that: include: Pipeline; The measuring device according to any one of claims 1 to 9 is arranged between the flanges of the two pipelines.

11. A method for measuring pipeline cleaning efficiency, characterized in that: Used in the measuring device according to any one of claims 1 to 9, or used in the semiconductor device according to claim 10, the method comprising: Recording a first thickness of the test piece before cleaning; Installing the measuring device in the pipeline; Cleaning the pipeline; Recording a second thickness of the test piece after cleaning; The cleaning efficiency is calculated based on the first thickness and the second thickness.

Images