Raman detection chip

Abstract

A Raman detection chip comprises a carrier and a metal structure arranged on the carrier, and the metal structure comprises a structured substrate, a metal layer and metal particles; grooves are formed in the upper surface of the structured substrate and are arranged in an array mode in the X direction and the Y direction. The metal layer is arranged on the rectangular bottom surface and four inclined walls of the groove; the metal particles are fully distributed on the metal layer; the bottom edges of the four inclined walls are connected to the four edges of the rectangular bottom face respectively. In the grooves arranged in the X direction, the top edge of the inclined wall of each groove is connected with the top edge of the inclined wall of the adjacent groove, and in the grooves arranged in the Y direction, the top edge of the inclined wall of each groove is connected with the top edge of the inclined wall of the adjacent groove. The Raman detection chip has the advantages that the structural form and the size of the structured substrate can be controlled, and the gain effect of Raman signals is consistent.

Description

Technical Field

[0001] The present invention relates to a Raman detection chip, and more particularly to a Raman detection chip with a high-gain uniform structure design. Background Art

[0002] In recent years, Raman spectroscopy analysis has been widely applied in the fields of biosensing, medical pharmacy, environmental monitoring, forensic science, health monitoring, etc. However, when using Raman spectroscopy for qualitative identification and quantitative analysis, due to the intrinsically weak Raman signal, when detecting trace substances, the signal is too weak and is easily interfered by a large number of complex samples, thus reducing the detection sensitivity and causing difficulties in detection.

[0003] Currently, metal structures such as nanoparticles, nano silver needles or nano rods are formed on the Raman detection chip to generate the local surface plasmon resonance effect (LSPR), thereby achieving the surface-enhanced Raman spectroscopy effect. The fabrication of the metal structure is mainly formed by lithography electroforming and molding (LIGA) process optical lithography technology or oblique deposition technology, and the fabrication process is cumbersome and time-consuming. Moreover, there is no consistency in the shape or particle size of the metal structure, resulting in inconsistent Raman signal enhancement effects. Summary of the Invention

[0004] The present invention provides a Raman detection chip, which has the advantages that the structural form and size of the structured substrate can be controlled, and the Raman signal gain effect is consistent, and it also has the advantage of a simple and fast fabrication process.

[0005] To achieve one or part or all of the above purposes or other purposes, an embodiment of the present invention provides a Raman detection chip, which includes a carrier and a metal structure. The metal structure includes a structured substrate, a metal layer, and metal particles. The structured substrate is disposed on the carrier. The structured substrate has an upper surface, and a plurality of grooves are formed on the upper surface. The grooves are arranged in an array along the X direction and the Y direction. Each groove includes a rectangular bottom surface, opposite first and second inclined walls, and opposite third and fourth inclined walls. The metal layer is disposed on the rectangular bottom surface, the first inclined wall, the second inclined wall, the third inclined wall, and the fourth inclined wall of each groove. The metal particles are densely distributed on the metal layer. Wherein, the rectangular bottom surface of each groove has two opposite first edges and two opposite second edges. The bottom edges of the first inclined wall and the second inclined wall are respectively connected to the two first edges. The first inclined wall has a first top edge, and the second inclined wall has a second top edge. The bottom edges of the third inclined wall and the fourth inclined wall are respectively connected to the two second edges. The third inclined wall has a third top edge, and the fourth inclined wall has a fourth top edge. Wherein, in the grooves arranged along the X direction, the first top edge of each groove is connected to the second top edge of the adjacent groove. In the grooves arranged along the Y direction, the third top edge of each groove is connected to the fourth top edge of the adjacent groove.

[0006] In an embodiment of the present invention, there is a first bottom width between the two first edges of the rectangular bottom surface of each of the above grooves, and the first bottom width is between 1 and 3 micrometers. There is a second bottom width between the two second edges of the rectangular bottom surface of each of the above grooves, and the second bottom width is between 1 and 3 micrometers.

[0007] In an embodiment of the present invention, there is a first opening width between the first top edge and the second top edge of each of the above grooves, and the first opening width is between 2 and 7 micrometers. There is a second opening width between the third top edge and the fourth top edge of each of the above grooves, and the second opening width is between 2 and 7 micrometers.

[0008] In an embodiment of the present invention, the first bottom width and the second bottom width are not equal, and the first opening width and the second opening width are not equal.

[0009] In an embodiment of the present invention, each of the above grooves has a depth, and the depth is between 1 and 2 micrometers.

[0010] In an embodiment of the present invention, the ratio of the depth to the first opening width is between 0.3 and 0.6, and the ratio of the depth to the second opening width is between 0.3 and 0.6.

[0011] In an embodiment of the present invention, a first angle is formed between the first inclined wall of each of the above-mentioned grooves and the second inclined wall of an adjacent groove, and a second angle is formed between the third inclined wall of each of the grooves and the fourth inclined wall of an adjacent groove. The first angle and the second angle are between 60 and 90 degrees.

[0012] In an embodiment of the present invention, the material of the above-mentioned structured substrate is selected from one of polycarbonate (PC), polyethylene terephthalate (PET), and glass.

[0013] In an embodiment of the present invention, a material mold liquid is coated on a structured mold core, and a structured substrate is formed by using an ultraviolet curing mold replication forming process.

[0014] In an embodiment of the present invention, the above-mentioned structured mold core is formed by machining.

[0015] In an embodiment of the present invention, the above-mentioned metal layer is a gold layer or a silver layer.

[0016] In an embodiment of the present invention, the above-mentioned metal particles are nano gold particles or nano silver particles.

[0017] In an embodiment of the present invention, the particle size of the above-mentioned metal particles is between 30 and 100 nanometers.

[0018] The present invention uses a structured substrate with uniformly arranged grooves, wherein the angles formed between the inclined walls of adjacent grooves, the depth of each groove, the first opening width / second opening width of each groove, and the first bottom width / second bottom width of each groove can be adjusted according to requirements, so that the structured substrate has different structural forms, and the particle size of the metal particles is simulated to obtain the parameters for the best Raman signal gain. Therefore, the Raman detection chip has the advantages that the structural form and size of the structured substrate can be controlled, and the Raman signal gain effect is consistent due to the uniform arrangement of the grooves. Moreover, since the structured mold core used in the ultraviolet curing mold replication forming process of the structured substrate is formed by machining and is simple to manufacture, the entire Raman detection chip also has the advantage of a simple and fast manufacturing process.

[0019] To make the above and other objects, features, and advantages of the present invention more obvious and understandable, specific embodiments are hereinafter given, and detailed descriptions are made in conjunction with the accompanying drawings as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic structural diagram of a Raman detection chip according to an embodiment of the present invention.

[0021] Figure 2A And Figure 2B They are respectively schematic cross-sectional views of a metal structure according to an embodiment of the present invention along the X direction and the Y direction.

[0022] Figure 3 It is a partial three-dimensional schematic diagram of a structured substrate of a metal structure according to an embodiment of the present invention.

[0023] Figure 4 It is a partial top-down schematic diagram of a metal structure according to an embodiment of the present invention.

[0024] Among them, reference numerals:

[0025] 10: Raman detection chip

[0026] 12: Carrier

[0027] 14: Metal structure

[0028] 16: Structured substrate

[0029] 161: Upper surface

[0030] 18: Metal layer

[0031] 20: Metal particles

[0032] 22, 22’, 22”: Grooves

[0033] 24: Rectangular bottom surface

[0034] 241, 242: First edge

[0035] 243, 244: Second edge

[0036] 26, 26’: First inclined wall

[0037] 261, 261’: First top edge

[0038] 28, 28’: Second inclined wall

[0039] 281, 281’: Second top edge

[0040] 30, 30’: Third inclined wall

[0041] 301, 301”: Third top edge

[0042] 32, 32”: Fourth inclined wall

[0043] 321, 321”: Fourth top edge

[0044] W1: First bottom surface width

[0045] P1: First opening width

[0046] θ1: First angle

[0047] W2: Second bottom surface width

[0048] P2: Second opening width

[0049] θ2: Second angle

[0050] D: Depth Detailed implementation manner

[0051] Figure 1 is a schematic structural diagram of a Raman detection chip according to an embodiment of the present invention. As Figure 1 shown, the Raman detection chip 10 includes a carrier 12 and a metal structure 14. The metal structure 14 is disposed on the carrier 12 and, for example, is disposed at the middle position of the carrier 12. Figure 2A and Figure 2B are respectively schematic cross-sectional diagrams of the metal structure in the X direction and the Y direction according to an embodiment of the present invention. As Figure 2A and Figure 2B shown, the metal structure 14 includes a structured substrate 16, a metal layer 18, and a plurality of metal particles 20. The structured substrate 16 is disposed on the carrier 12 (labeled in Figure 1 ). Figure 3 is a partial three-dimensional schematic diagram of the structured substrate of the metal structure according to an embodiment of the present invention. Please refer to Figure 2A , Figure 2B and Figure 3 shown. The structured substrate 16 has an upper surface 161. A plurality of grooves 22 are formed on the upper surface 161. The grooves 22 are arranged in an array along the X direction and the Y direction. Each groove 22 includes a rectangular bottom surface 24 and adjacent first inclined walls 26, third inclined walls 30, second inclined walls 28, and fourth inclined walls 32. Figure 4 is a partial top view schematic diagram of the metal structure according to an embodiment of the present invention. As Figure 3 and Figure 4 shown, the metal layer 18 is disposed on the upper surface 161 of the structured substrate 16. Specifically, the metal layer 18 is disposed on the rectangular bottom surface 24, the first inclined wall 26, the second inclined wall 28, the third inclined wall 30, and the fourth inclined wall 32 of each groove 22 (labeled in Figure 3 ). In one embodiment, the metal layer 18 is, for example but not limited to, a gold layer or a silver layer; the metal particles 20 are densely distributed on the metal layer 18. In one embodiment, the metal particles 20 are, for example but not limited to, nano gold particles or nano silver particles, and the particle size of the metal particles 20 is between 30 and 100 nanometers, for example but not limited to 30 nanometers, 35 nanometers, 40 nanometers, 45 nanometers, 50 nanometers, 55 nanometers, 60 nanometers, 65 nanometers, 70 nanometers, 75 nanometers, 80 nanometers, 85 nanometers, 90 nanometers, 95 nanometers, and 100 nanometers.

[0052] Continuing the above description, specifically, as Figure 3As shown, the rectangular bottom surface 24 of each groove 22 has two opposite first edges 241, 242 and two opposite second edges 243, 244; the first inclined wall 26 and the second inclined wall 28 are oppositely arranged, and the bottom edges of the first inclined wall 26 and the second inclined wall 28 are respectively connected to the two first edges 241, 242 of the rectangular bottom surface 24; the third inclined wall 30 and the fourth inclined wall 32 are oppositely arranged, and the bottom edges of the third inclined wall 30 and the fourth inclined wall 32 are respectively connected to the two second edges 243, 244 of the rectangular bottom surface 24. In an embodiment, the first inclined wall 26 has a first top edge 261, the second inclined wall 28 has a second top edge 281, the third inclined wall 30 has a third top edge 301, and the fourth inclined wall 32 has a fourth top edge 321.

[0053] Continue to refer to Figure 2A As shown, in the grooves 22, 22' arranged along the X direction, the first top edge 261 of the first inclined wall 26 of each groove 22 is connected to the second top edge 281' of the second inclined wall 28' of the adjacent groove 22'; the second top edge 281 of the second inclined wall 28 of each groove 22 is connected to the first top edge 261' of the first inclined wall 26' of the adjacent groove 22'. As Figure 2B As shown, in the grooves 22, 22" arranged along the Y direction, the third top edge 301 of the third inclined wall 30 of each groove 22 is connected to the fourth top edge 321" of the fourth inclined wall 32" of the adjacent groove 22"; the fourth top edge 321 of the fourth inclined wall 32 of each groove 22 is connected to the third top edge 301" of the third inclined wall 30" of the adjacent groove 22".

[0054] Among them, as Figure 2AAs shown, in one embodiment, there is a first bottom width W1 between two first edges 241 and 242 of the rectangular bottom surface 24 of each groove 22. The first bottom width W1 is between 1 and 3 microns, such as but not limited to 1 micron, 1.2 microns, 1.4 microns, 1.6 microns, 1.8 microns, 2 microns, 2.2 microns, 2.4 microns, 2.6 microns, 2.8 microns, and 3 microns; there is a first opening width P1 between the first top edge 261 and the second top edge 281 of each groove 22. The first opening width P1 is between 2 and 7 microns, such as but not limited to 2 microns, 2.5 microns, 3 microns, 3.5 microns, 4 microns, 4.5 microns, 5 microns, 5.5 microns, 6 microns, 6.5 microns, and 7 microns; a first angle θ1 is formed between the first inclined wall 26 / second inclined wall 28 of each groove 22 and the second inclined wall 28’ / first inclined wall 26’ of an adjacent groove 22’. The first angle θ1 is between 60 and 90 degrees, such as 60 degrees, 62.5 degrees, 65 degrees, 67.5 degrees, 70 degrees, 72.5 degrees, 75 degrees, 77.5 degrees, 80 degrees, 82.5 degrees, 85 degrees, 87.5 degrees, and 90 degrees, but not limited thereto. Other acute angles or any obtuse angles may be formed between the first inclined walls 26 / 26’ and the second inclined walls 28’ / 28. Also, although Figure 2A it is shown in

[0055] that the connection between the first inclined walls 26 / 26’ and the second inclined walls 28’ / 28 is in a sharp-corner shape, it is not limited thereto. The connection between the first inclined walls 26 / 26 and the second inclined walls 28’ / 28 may also be in an R chamfer shape.

[0055] Correspondingly, as Figure 2BAs shown, in one embodiment, between the second edges 243 and 244 of the rectangular bottom surface 24 of each groove 22, there is a second bottom width W2, and the second bottom width W2 is between 1 and 3 micrometers, such as but not limited to 1 micrometer, 1.2 micrometers, 1.4 micrometers, 1.6 micrometers, 1.8 micrometers, 2 micrometers, 2.2 micrometers, 2.4 micrometers, 2.6 micrometers, 2.8 micrometers, and 3 micrometers; between the third top edge 301 and the fourth top edge 321 of each groove 22, there is a second opening width P2, and the second opening width P2 is between 2 and 7 micrometers, such as but not limited to 2 micrometers, 2.5 micrometers, 3 micrometers, 3.5 micrometers, 4 micrometers, 4.5 micrometers, 5 micrometers, 5.5 micrometers, 6 micrometers, 6.5 micrometers, and 7 micrometers; between the third inclined wall 30 / fourth inclined wall 32 of each groove 22 and the fourth inclined wall 32” / third inclined wall 30” of the adjacent groove 22”, there is a second angle θ2, and the second angle θ2 is between 60 and 90 degrees, such as 60 degrees, 62.5 degrees, 65 degrees, 67.5 degrees, 70 degrees, 72.5 degrees, 75 degrees, 77.5 degrees, 80 degrees, 82.5 degrees, 85 degrees, 87.5 degrees, and 90 degrees, but not limited to this. Other acute angles or any obtuse angles can be formed between the third inclined wall 30 / 30” and the fourth inclined wall 32” / 32. Also, although Figure 2B it is shown in that the connection between the third inclined wall 30 / 30” and the fourth inclined wall 32” / 32 is in a sharp-corner shape, but not limited to this. The connection between the third inclined wall 30 / 30” and the fourth inclined wall 32” / 32 can also be in an R chamfer shape.

[0056] Among them, the above-mentioned rectangular bottom surface 24 can be a square or a rectangle, that is, the first bottom width W1 and the second bottom width W2 can be equal (square) or not equal (rectangle); the first opening width P1 and the second opening width P2 can be equal (when the rectangular bottom surface 24 is a square) or not equal (when the rectangular bottom surface 24 is a rectangle).

[0057] Among them, each groove 22 (or 22' or 22") has a depth D, and the depth is between 1 and 2 micrometers, such as but not limited to 1 micrometer, 1.1 micrometers, 1.2 micrometers, 1.3 micrometers, 1.4 micrometers, 1.5 micrometers, 1.6 micrometers, 1.7 micrometers, 1.8 micrometers, 1.9 micrometers, and 2 micrometers. In one embodiment, the ratio of the depth D to the first opening width P1 (i.e., the depth-to-width ratio) is, for example, between 0.3 and 0.6, such as but not limited to 0.3, 0.325, 0.35, 0.375, 0.4, 0.425, 0.45, 0.475, 0.5, 0.525, 0.55, 0.575, and 0.6. The ratio of the depth D to the second opening width P2 (i.e., the depth-to-width ratio) is, for example, between 0.3 and 0.6, such as but not limited to 0.3, 0.325, 0.35, 0.375, 0.4, 0.425, 0.45, 0.475, 0.5, 0.525, 0.55, 0.575, and 0.6.

[0058] Please continue to refer to Figure 1 As shown, in one embodiment, the material of the carrier 12 is, for example, but not limited to glass. The material of the structured substrate 16 can be selected from one of polycarbonate (PC), polyethylene terephthalate (PET), and glass, but not limited thereto; in an embodiment not shown, the structured substrate 16 can be formed by covering a material mold liquid on a structured mold core and then using an ultraviolet curing mold turning forming process; among them, the structured mold core is, for example, but not limited to being formed by machining.

[0059] According to the above, in a Raman detection chip according to an embodiment of the present invention, the structured substrate has a design with uniformly arranged grooves, and the angle between the inclined walls of adjacent grooves, the depth of the grooves, the first opening width / second opening width of the grooves, and the first bottom width / second bottom width of the grooves can be adjusted according to requirements, so that the structured substrate has different structural forms, and is combined with the particle size simulation of metal particles to obtain the parameters for the best Raman signal gain.

[0060] Specifically, as described above, the preferred depth-to-width ratio is between 0.3 and 0.6. After simulation, relatively speaking, within this range of the depth-to-width ratio, the signal intensity of the Raman signal is, for example, between 100 and 150, while the signal intensity of the Raman signal outside this range of the depth-to-width ratio is, for example, between 10 and 100; also, when the depth-to-width ratio is between 0.3 and 0.6, the greater the depth-to-width ratio, the stronger the signal intensity of the Raman signal. On the other hand, the preferred angle between the inclined walls of adjacent grooves is between 60 degrees and 90 degrees. After simulation, relatively speaking, within this range of the preferred angle, the signal intensity of the Raman signal is, for example, between 100 and 150, while the signal intensity of the Raman signal outside this preferred angle is, for example, between 10 and 100.

[0061] In summary, the Raman detection chip according to the embodiment of the present invention has the advantages that the structural form and size of the structured substrate can be controlled, and the Raman signal gain effect is consistent due to the uniform arrangement of the grooves. Furthermore, since the structured mold core used in the ultraviolet curing and replica molding process of the structured substrate is formed by machining, the manufacturing is simple, so that the entire Raman detection chip also has the advantages of simple and rapid manufacturing process.

[0062] Although the present invention has been disclosed as above by way of embodiments, it is not intended to limit the present invention. Those of ordinary skill in the art to which the present invention pertains can make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to that defined by the appended claims for patent.

Claims

1. A Raman detection chip, characterized in that: Include: A carrier; A metal structure comprises a structured substrate, a metal layer and a plurality of metal particles, wherein: The structured substrate is disposed on the carrier. The structured substrate has an upper surface. A plurality of grooves are formed on the upper surface. The plurality of grooves are arranged in an array along the X direction and the Y direction. Each of the grooves comprises: A rectangular bottom surface having two opposite first edges and two opposite second edges; A first inclined wall and a second inclined wall opposite to each other, the bottom edge of the first inclined wall and the bottom edge of the second inclined wall are respectively connected to the two first edges, the first inclined wall has a first top edge, and the second inclined wall has a second top edge; and A third inclined wall and a fourth inclined wall are opposite to each other, the bottom edge of the third inclined wall and the bottom edge of the fourth inclined wall are respectively connected to the two second edges, the third inclined wall has a third top edge, and the fourth inclined wall has a fourth top edge, Among the plurality of grooves arranged along the X direction, the first top edge of each groove is connected to the second top edge of the adjacent plurality of grooves, and among the plurality of grooves arranged along the Y direction, the third top edge of each groove is connected to the fourth top edge of the adjacent plurality of grooves; The metal layer is disposed on the rectangular bottom surface, a first inclined wall, a second inclined wall, a third inclined wall and a fourth inclined wall of each of the grooves; The plurality of metal particles are fully distributed on the metal layer.

2. The Raman detection chip according to claim 1, characterized in that: Each of the grooves has a first bottom width between the two first edges of the rectangular bottom surface, and the first bottom width is between 1 and 3 microns. Each of the grooves has a second bottom width between the two second edges of the rectangular bottom surface, and the second bottom width is between 1 and 3 microns.

3. The Raman detection chip according to claim 2, characterized in that: There is a first opening width between the first top edge and the second top edge of each groove, and the first opening width is between 2 and 7 microns. There is a second opening width between the third top edge and the fourth top edge of each groove, and the second opening width is between 2 and 7 microns.

4. The Raman detection chip according to claim 3, characterized in that: The first bottom surface width and the second bottom surface width are not equal, and the first opening width and the second opening width are not equal.

5. The Raman detection chip according to claim 3, characterized in that: Each of the grooves has a depth ranging from 1 to 2 micrometers.

6. The Raman detection chip according to claim 4, characterized in that: The ratio of the depth to the first opening width is between 0.3 and 0.6, and the ratio of the depth to the second opening width is between 0.3 and 0.

6.

7. The Raman detection chip according to claim 1, characterized in that: A first angle is set between the first inclined wall of each groove and the second inclined wall of the adjacent multiple grooves, and a second angle is set between the third inclined wall of each groove and the fourth inclined wall of the adjacent multiple grooves. The first angle and the second angle are between 60 and 90 degrees.

8. The Raman detection chip according to claim 1, characterized in that: The material of the structured substrate is selected from one of polycarbonate (PC), polyethylene terephthalate (PET) and glass.

9. The Raman detection chip according to claim 8, characterized in that: The structured substrate is formed by covering a material mold liquid on a structured mold core and utilizing an ultraviolet light curing mold forming process.

10. The Raman detection chip according to claim 9, characterized in that: The structured mold core is formed by mechanical processing.

11. The Raman detection chip according to claim 1, characterized in that: The metal layer is a gold layer or a silver layer.

12. The Raman detection chip according to claim 1, characterized in that: The plurality of metal particles are gold nanoparticles or silver nanoparticles.

13. The Raman detection chip according to claim 12, characterized in that: The particle sizes of the metal particles are between 30 and 100 nanometers.

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