Wafer testing device and wafer testing method

Abstract

The invention discloses a wafer testing device and a wafer testing method, and relates to the technical field of wafer testing, the wafer testing device comprises a testing mechanism, the testing mechanism is provided with an auxiliary mechanism, the auxiliary mechanism comprises a support, the top of the support is provided with a driving motor, and the top of the support is provided with an alarm. And a rotating rod is mounted at the output end of the driving motor. According to the wafer testing device, the auxiliary mechanism is arranged, so that the wafer testing device has a function of monitoring the probe on the probe in the device, and when the probe is abraded, a worker can be reminded to replace the probe in time, so that the situation that the wafer resistivity detection accuracy is influenced due to probe abrasion can be avoided, and the wafer resistivity detection accuracy is improved. In addition, the condition that the performance of the chip is reduced or even scrapped due to abrasion of the probe can be avoided, the using effect of the wafer testing device is improved, and meanwhile the using efficiency of the wafer testing device is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer testing, and particularly to a wafer testing device and a wafer testing method. Background Art

[0002] A wafer refers to a silicon wafer used for fabricating silicon semiconductor integrated circuits. Since its shape is circular, it is called a wafer. In the current booming semiconductor industry, the performance and quality of chips are crucial. As the basic carrier for chip manufacturing, the quality inspection of wafers directly determines the quality of the final chips. In order to test wafers, people usually use wafer testing devices.

[0003] In the prior art, when the existing wafer testing device is in use, although it can detect the resistivity of the wafer, thus being able to promptly identify wafers with unqualified resistivity, effectively preventing such defective wafers from flowing into subsequent process steps, and further reducing chip failure problems caused by abnormal wafer resistivity, improving the product quality. However, it does not have the function of monitoring the probes on the probe head of the device. That is, during long-term use, the tip of the probe is prone to wear due to frequent friction with the wafer. After wear, the contact resistance between the probe and the wafer will increase and become unstable, thus easily affecting the accuracy of wafer resistivity detection, easily leading to high-quality wafers being misjudged as unqualified, while unqualified products are not detected. At the same time, the tip of the worn probe is prone to become rough and irregular in shape, and when contacting the wafer subsequently, it is easy to scratch the surface of the wafer, thus easily causing a decline in chip performance or even scrapping, increasing the production cost, reducing both the use effect and the use efficiency of the wafer testing device.

[0004] Therefore, we propose a wafer testing device and a wafer testing method to solve the problems raised above. Summary of the Invention

[0005] The purpose of the present invention is to provide a wafer testing device and a wafer testing method to solve the problem in the above background art that the existing wafer testing device does not have the function of monitoring the probes on the probe head of the device. That is, during long-term use, the tip of the probe is prone to wear due to frequent friction with the wafer. After wear, the contact resistance between the probe and the wafer will increase and become unstable, thus easily affecting the accuracy of wafer resistivity detection, easily leading to high-quality wafers being misjudged as unqualified, while unqualified products are not detected. At the same time, the tip of the worn probe is prone to become rough and irregular in shape, and when contacting the wafer subsequently, it is easy to scratch the surface of the wafer, thus easily causing a decline in chip performance or even scrapping, increasing the production cost, reducing both the use effect and the use efficiency of the wafer testing device.

[0006] To achieve the above object, the present invention provides the following technical solution: a wafer testing device, including a testing mechanism, and an auxiliary mechanism is arranged on the testing mechanism;

[0007] The auxiliary mechanism includes a bracket, a driving motor is installed at the top of the bracket, an alarm is installed at the top of the bracket, a rotating rod is installed at the output end of the driving motor, an L-shaped plate is installed at the bottom end of the rotating rod, a rectangular hole is opened on one side of the L-shaped plate, a housing is fixedly sleeved inside the rectangular hole, a camera is installed inside the housing, a wireless transmitter is arranged on the camera, an auxiliary groove is opened at the top inner wall of the bracket, and a T-shaped rod is slidably connected inside the auxiliary groove.

[0008] Preferably, the bottom end of the rotating rod movably penetrates through the top of the bracket, and the bottom end face of the T-shaped rod is fixed to the top of the L-shaped plate.

[0009] Preferably, the testing mechanism includes a workbench, a testing machine body is placed on the top of the workbench, a detection table is placed on the top of the workbench, a rectangular plate is fixed on the top of the detection table, and a rectangular block is installed on the top of the rectangular plate.

[0010] Preferably, a servo motor is installed on the top of the rectangular block, a sliding groove is opened on the top of the rectangular plate, a sliding plate is slidably connected inside the sliding groove, a threaded rod is installed at the output end of the servo motor, and two symmetrically arranged round rods are fixed on the top of the detection table.

[0011] Preferably, the outer surface of each round rod is rotatably connected with a rotating plate through a bearing, an anti-slip pad is adhesively connected to the bottom of each rotating plate, a grooved block is placed on the top of the detection table, a probe is installed inside the through hole of the sliding plate, and a controller is installed on the top of the workbench.

[0012] Preferably, the bottom end of the threaded rod is rotatably embedded in the bottom inner wall of the sliding groove, the bottom end of the threaded rod movably penetrates through the top of the rectangular block, the servo motor is electrically connected to the controller, and the bottom end of the threaded rod threadedly penetrates through the top of the sliding plate.

[0013] Preferably, the top end of each round rod respectively movably penetrates through the bottom of each anti-slip pad, the bottom of each anti-slip pad is in contact with the top of the grooved block, the testing machine body is electrically connected to the controller, and the probe is electrically connected to the testing machine body.

[0014] Preferably, the bottom of the bracket is fixed to the top of the workbench, the driving motor is electrically connected to the controller, and the alarm is electrically connected to the controller.

[0015] Preferably, the camera is wirelessly connected to the controller through a wireless transmitter. The grooved block is directly below the probe, and the probe is inside the bracket.

[0016] A testing method for a wafer testing device includes the following steps:

[0017] S1. When it is necessary to detect the resistivity of the wafer, first, with the cooperation of two rotating plates, bearings, and two round rods, separate both anti-slip pads from the grooved block. Then place the wafer inside the grooved block. Next, with the cooperation of the detection table, two round rods, bearings, two rotating plates, and two anti-slip pads, fix the grooved block. After that, with the cooperation of the controller, servo motor, rectangular block, chute, slide plate, and threaded rod, drive the probe to move vertically downward. Then, with the cooperation of the controller, probe, and the testing machine body, detect the resistivity of the wafer inside the through-hole of the grooved block. When it is necessary to detect the resistivity of other test points on the wafer on the grooved block;

[0018] S2. At this time, first, with the cooperation of the controller, servo motor, rectangular block, chute, slide plate, and threaded rod, make the probe move for reset. Then, with the cooperation of the above-mentioned components, separate both anti-slip pads from the grooved block. Next, with the cooperation of the grooved block, move the wafer to a suitable position. Then, operate according to the above operation steps to detect the resistivity of other test points on the wafer. When it is necessary to monitor the probe on the probe, first, with the cooperation of the controller, camera, and wireless transmitter, take a picture of the probe on the probe and transmit the picture to the controller. Then, with the cooperation of the controller, bracket, driving motor, rotating rod, L-shaped plate, rectangular hole, and housing, drive the camera and wireless transmitter to rotate;

[0019] S3. Then, with the cooperation of the controller, camera, and wireless transmitter, take a picture of the probe on the probe from another angle and transmit the picture to the controller. After that, with the cooperation of the above-mentioned components, make the camera and wireless transmitter move for reset. Then store the two pictures inside the controller and set the opening and closing times of the driving motor and the camera. When the starting time of the camera arrives, at this time, with the cooperation of the above-mentioned components, take a picture of the probe on the probe and transmit the picture to the controller. When the closing time of the camera arrives and the starting time of the driving motor arrives, at this time, with the cooperation of the controller and the above-mentioned components, turn off the camera and make the camera rotate;

[0020] S4. When the shutdown time of the drive motor arrives and the startup time of the camera arrives, the drive motor is shut down and the camera is started with the cooperation of the controller. Subsequently, with the cooperation of the above-mentioned components, another angle of the probe on the probe head is photographed, and the photo is transmitted to the controller. When the shutdown time of the camera arrives and the startup time of the drive motor arrives, the camera is shut down and reset to its original position with the cooperation of the controller and the above-mentioned components. Subsequently, with the cooperation of the controller, the photo stored inside the controller, and the photo received by the controller, the probe on the probe head can be detected. Then, with the cooperation of the above operation steps, the probe on the probe head can be monitored.

[0021] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0022] 1. By setting up the auxiliary mechanism, the wafer testing device can be equipped with the function of monitoring the probe on the probe head in the device. When the probe wears out, the staff can be reminded to replace the probe in time. This can not only avoid the situation that the detection accuracy of the wafer resistivity is affected due to probe wear, but also avoid the situation that the chip performance deteriorates or even is scrapped due to probe wear, which improves the use effect of the wafer testing device and also improves the use efficiency of the wafer testing device. When it is necessary to detect the resistivity of the wafer, first, with the cooperation of the two rotating plates, bearings, and two round rods, the two anti-slip pads can be separated from the grooved block. Subsequently, the wafer is placed inside the grooved block. Then, with the cooperation of the detection table, two round rods, bearings, two rotating plates, and two anti-slip pads, the grooved block can be fixed.

[0023] 2. After that, with the cooperation of the controller, servo motor, rectangular block, chute, slide plate, and threaded rod, the probe head can be driven to move vertically downward. Then, with the cooperation of the controller, probe head, and the testing machine body, the resistivity of the wafer inside the through hole of the grooved block can be detected. When it is necessary to detect the resistivity of other test points on the wafer on the grooved block, first, with the cooperation of the controller, servo motor, rectangular block, chute, slide plate, and threaded rod, the probe head can be driven to move back to its original position. Subsequently, with the cooperation of the above-mentioned components, the two anti-slip pads can be separated from the grooved block. Then, with the cooperation of the grooved block, the wafer can be moved to a suitable position. Then, operate according to the above operation steps to detect the resistivity of other test points of the wafer.

[0024] 3. By setting up a testing mechanism, the resistivity of the wafer can be detected, so as to promptly identify wafers with unqualified resistivity, effectively prevent such defective wafers from flowing into subsequent process steps, and further reduce chip failure problems caused by abnormal wafer resistivity, improving the product quality. When it is necessary to monitor the probes on the probe head, first, with the cooperation of the controller, camera, and wireless transmitter, a photo of the probes on the probe head can be taken and transmitted to the controller. Subsequently, with the cooperation of the controller, bracket, drive motor, rotating rod, L-shaped plate, rectangular hole, and housing, the camera and wireless transmitter can be driven to rotate. Then, with the cooperation of the controller, camera, and wireless transmitter, a photo of the probes on the probe head from another angle can be taken and transmitted to the controller. After that, with the cooperation of the above-mentioned components, the camera and wireless transmitter can be reset and moved. Then, the two photos are stored inside the controller, and the opening and closing times of the drive motor and camera are set. When the start time of the camera arrives.

[0025] 4. At this time, with the cooperation of the above-mentioned components, the present invention can take a photo of the probes on the probe head and transmit the photo to the controller. When the closing time of the camera arrives and the start time of the drive motor arrives, with the cooperation of the controller and the above-mentioned components, the camera can be closed and made to rotate. When the closing time of the drive motor arrives and the start time of the camera arrives, with the cooperation of the controller, the drive motor can be closed and the camera can be started. Subsequently, with the cooperation of the above-mentioned components, a photo of the probes on the probe head from another angle can be taken and transmitted to the controller. When the closing time of the camera arrives and the start time of the drive motor arrives, with the cooperation of the controller and the above-mentioned components, the camera can be closed and reset to its original position. Subsequently, with the cooperation of the controller, the photos stored inside the controller, and the photos received by the controller, the probes on the probe head can be detected. Then, with the cooperation of the above operation steps, the probes on the probe head can be monitored. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a perspective view of a wafer testing device of the present invention;

[0027] Figure 2 is a structural schematic diagram of a wafer testing device of the present invention;

[0028] Figure 3 is a partial perspective view of the testing mechanism of a wafer testing device of the present invention;

[0029] Figure 4 is a partial perspective view of the auxiliary mechanism of a wafer testing device of the present invention;

[0030] Figure 5Another perspective partial perspective view of the testing mechanism of a wafer testing device according to the present invention;

[0031] Figure 6 Partial cross-sectional perspective view of the auxiliary mechanism of a wafer testing device according to the present invention;

[0032] Figure 7 Another perspective partial cross-sectional perspective view of the auxiliary mechanism of a wafer testing device according to the present invention;

[0033] Figure 8 Schematic perspective view of the three-dimensional structure of a rectangular plate, a chute, and a sliding plate of a wafer testing device according to the present invention.

[0034] In the figure:

[0035] 1. Testing mechanism; 101. Workbench; 102. Testing machine body; 103. Detection table; 104. Rectangular plate; 105. Rectangular block; 106. Servo motor; 107. Chute; 108. Sliding plate; 109. Threaded rod; 110. Round rod; 111. Rotating plate; 112. Anti-slip pad; 113. Grooved block; 114. Probe; 115. Controller; 2. Auxiliary mechanism; 201. Bracket; 202. Driving motor; 203. Alarm; 204. Rotating rod; 205. L-shaped plate; 206. Rectangular hole; 207. Housing; 208. Camera; 209. Wireless transmitter; 210. Auxiliary groove; 211. T-shaped rod. Detailed implementation manners

[0036] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0037] Embodiment 1: Please refer to Figures 1 - 8 As shown, the present invention provides a technical solution: a wafer testing device, including a testing mechanism 1, and an auxiliary mechanism 2 is arranged on the testing mechanism 1;

[0038] The auxiliary mechanism 2 includes a bracket 201. A driving motor 202 is installed at the top of the bracket 201, and an alarm 203 is installed at the top of the bracket 201. The output end of the driving motor 202 is installed with a rotating rod 204. The bottom end of the rotating rod 204 is installed with an L-shaped plate 205. A rectangular hole 206 is formed on one side of the L-shaped plate 205. A housing 207 is fixedly sleeved inside the rectangular hole 206. A camera 208 is installed inside the housing 207. A wireless transmitter 209 is arranged on the camera 208. An auxiliary groove 210 is formed at the top inner wall of the bracket 201. A T-shaped rod 211 is slidably connected inside the auxiliary groove 210. The bottom end of the rotating rod 204 movably penetrates through the top of the bracket 201. The bottom end face of the T-shaped rod 211 is fixed to the top of the L-shaped plate 205. A probe 114 is installed inside the through hole of the sliding plate 108. A controller 115 is installed at the top of the workbench 101. The bottom of the bracket 201 is fixed to the top of the workbench 101. The driving motor 202 is electrically connected to the controller 115. The alarm 203 is electrically connected to the controller 115. The camera 208 is wirelessly connected to the controller 115 through the wireless transmitter 209. The probe 114 is located inside the bracket 201.

[0039] In this embodiment, when it is necessary to monitor the probe on the probe 114, the controller 115 is directly used to start the camera 208 at this time. The started camera 208 will take pictures of the probe (unused) on the probe 114, and through the cooperation of the wireless transmitter 209, wirelessly transmit the taken pictures to the controller 115. Subsequently, the controller 115 first turns off the camera 208 and then starts the drive motor 202. The started drive motor 202 will drive the L-shaped plate 205 to rotate under the cooperation of the bracket 201 and the rotating rod 204. The rotating L-shaped plate 205 will drive the T-shaped rod 211 to slide inside the auxiliary groove 210. At the same time, the rotating L-shaped plate 205 will drive the camera 208 to rotate under the cooperation of the rectangular hole 206 and the housing 207. The rotating camera 208 will also drive the wireless transmitter 209 to rotate. When the camera 208 rotates 180 degrees, the controller 115 first turns off the drive motor 202 and then starts the camera 208. The turned-off drive motor 202 will, under the cooperation of the above-mentioned components, cause the camera 208 to stop rotating. At the same time, the started camera 208 will take pictures of another angle of the probe on the probe 114 and transmit the taken pictures to the controller 115 in the above-mentioned manner. Subsequently, the controller 115 turns off the camera 208, and then, through the cooperation of the controller 115 and the above-mentioned components, makes the camera 208 return to its original position. After that, the controller 115 is turned on, and the two pictures received by the controller 115 are stored inside the storage module of the controller 115. At the same time, the opening and closing times of the drive motor 202 and the opening and closing times of the camera 208 are set. When the start time of the camera 208 arrives, the controller 115 will directly start the camera 208. The started camera 208 will take pictures of the probe on the probe 114 according to the above operations and transmit the pictures to the controller 115. When the camera 208 finishes transmitting the pictures, the closing time of the camera 208 just reaches, and at the same time, the start time of the drive motor 202 also just arrives. At this time, the controller 115 will directly start the drive motor 202. The started drive motor 202 will operate according to the above operation steps, causing the camera 208 to rotate. When the camera 208 finishes rotating 180 degrees, the closing time of the drive motor 202 arrives, and at the same time, the start time of the camera 208 also just arrives. At this time, the controller 115 will turn off the drive motor 202 and start the camera 208. The started camera 208 will take pictures of another angle of the probe on the probe 114 according to the above operations and transmit the taken pictures to the controller 115. When the camera 208 finishes transmitting the pictures, the closing time of the camera 208 just reaches, and at the same time, the driving time of the drive motor 202 also just arrives. At this time, the controller 115 will turn off the camera 208 and start the drive motor 202. The started drive motor 202 will cause the camera 208 to perform a reset movement. When the camera 208 returns to its original position,At this time, the shutdown time of the drive motor 202 just arrives. At this moment, the controller 115 will directly shut down the drive motor 202. Subsequently, the controller 115 will compare the two received photos with the two photos stored in advance. When the two received photos by the controller 115 are the same as the two photos stored in advance, the controller 115 will not activate the alarm 203 at this time. When both of the two received photos by the controller 115 are different from the two photos stored in advance, the controller 115 will directly activate the alarm 203 at this time. When any one of the two received photos by the controller 115 is different from the photo stored in advance, the controller 115 will directly activate the alarm 203 at this time. The activated alarm 203 will perform an alarm operation to remind the staff that the probe on the probe 114 is worn, so as to replace it in time. Then, just operate according to the above operation steps.

[0040] Embodiment 2: According to Figures 1 - 3 、 Figure 5 and Figure 8 As shown in, the testing mechanism 1 includes a workbench 101. A testing machine body 102 is placed on the top of the workbench 101. An inspection table 103 is placed on the top of the workbench 101. A rectangular plate 104 is fixed on the top of the inspection table 103. A rectangular block 105 is installed on the top of the rectangular plate 104. A servo motor 106 is installed on the top of the rectangular block 105. A chute 107 is opened on the top of the rectangular plate 104. A slide plate 108 is slidably connected inside the chute 107. A threaded rod 109 is installed at the output end of the servo motor 106. Two symmetrically arranged round rods 110 are fixed on the top of the inspection table 103. The outer surface of each round rod 110 is rotatably connected with a rotating plate 111 through a bearing. An anti-slip pad 112 is adhesively connected to the bottom of each rotating plate 111. A grooved block 113 is placed on the top of the inspection table 103. A probe 114 is installed inside the through hole of the slide plate 108. A controller 115 is installed on the top of the workbench 101. The bottom end of the threaded rod 109 is rotatably embedded in the inner bottom wall of the chute 107. The bottom end of the threaded rod 109 movably penetrates through the top of the rectangular block 105. The servo motor 106 is electrically connected to the controller 115. The bottom end of the threaded rod 109 threadedly penetrates through the top of the slide plate 108. The top ends of each round rod 110 respectively movably penetrate through the bottom of each anti-slip pad 112. The bottom of each anti-slip pad 112 is in contact with the top of the grooved block 113. The testing machine body 102 is electrically connected to the controller 115. The probe 114 is electrically connected to the testing machine body 102. The grooved block 113 is directly below the probe 114.

[0041] In this embodiment, when it is necessary to detect the resistivity of a wafer, first move the workbench 101 into a clean workshop with constant temperature and humidity. Then connect the controller 115 to an external power supply. Next, place the wafer to be detected inside the groove of the grooved block 113. After that, press the grooved block 113 and apply a force to each of the two rotating plates 111, so that both rotating plates 111 rotate around the corresponding round rod 110 as the center. The two rotating rotating plates 111 will drive the corresponding anti-slip pads 112 to rotate. When both anti-slip pads 112 are separated from the grooved block 113, first stop the rotation of the two rotating plates 111. Then, according to the test points of the wafer to be detected and the tips of the probes on the probe 114, move the grooved block 113 so that the test points of the wafer to be detected are just directly below the probes on the probe 114. Then rotate the two rotating plates 111 until the bottoms of both anti-slip pads 112 are in contact with the top of the grooved block 113. After that, use the controller 115 to start the test machine body 102, and then adjust the parameters of the test machine body 102 according to the various parameters of the wafer. When everything is ready, first use the controller 115 to start the servo motor 106. The started servo motor 106 will drive the threaded rod 109 to rotate with the cooperation of the rectangular block 105. The rotating threaded rod 109 will drive the sliding plate 108 to move vertically downward with the cooperation of the sliding groove 107. At the same time, the vertically moving sliding plate 108 will drive the probe 114 to move vertically downward. When the probe tip on the probe 114 is in full contact with the wafer test point on the grooved block 113, use the controller 115 to turn off the servo motor 106. The turned-off servo motor 106 will, with the cooperation of the rectangular block 105, the sliding groove 107, the threaded rod 109, and the sliding plate 108, make the probe 114 stop moving. Then use the controller 115 to start the test machine body 102. The started test machine body 102 will, with the cooperation of the probe 114, detect the resistivity of the wafer and transmit the detected resistivity data to the controller 115 in the form of an electrical signal. At this time, the controller 115 will analyze, process, and store the received resistivity data. When it is necessary to detect the resistivity of other test points of the wafer on the grooved block 113, first use the controller 115 to start the servo motor 106. The started servo motor 106 will, with the cooperation of the above-mentioned components, make the probe 114 move for reset until the probe 114 resets to its original position. Then directly operate according to the above operation steps. When the resistivity detection of the wafer on the grooved block 113 is completed, the staff can use the resistivity data stored in the controller 115 to determine whether the resistivity of the wafer meets the standard.

[0042] In the present invention, when it is necessary to detect the resistivity of a wafer, first move the workbench 101 to a constant temperature, constant humidity and clean working room. Then connect the controller 115 to an external power supply. Next, place the wafer to be detected inside the groove of the grooved block 113. After that, press the grooved block 113 and apply a force to each of the two rotating plates 111, so that both rotating plates 111 rotate around the corresponding round rod 110 as the center. The two rotating rotating plates 111 will drive the corresponding anti-slip pads 112 to rotate. When both anti-slip pads 112 are separated from the grooved block 113, first stop the rotation of the two rotating plates 111. Then move the grooved block 113 according to the test points to be detected on the wafer and the tips of the probes on the probe 114, so that the test points to be detected on the wafer are just directly below the probes on the probe 114. Then rotate the two rotating plates 111 until the bottoms of both anti-slip pads 112 are in contact with the top of the grooved block 113. After that, use the controller 115 to start the test machine body 102, and then adjust the parameters of the test machine body 102 according to the various parameters of the wafer. When everything is ready, first use the controller 115 to start the servo motor 106. The started servo motor 106 will drive the threaded rod 109 to rotate with the cooperation of the rectangular block 105. The rotating threaded rod 109 will drive the slide plate 108 to move vertically downward with the cooperation of the chute 107. At the same time, the vertically moving slide plate 108 will drive the probe 114 to move vertically downward. When the probe tip on the probe 114 is in full contact with the wafer test point on the grooved block 113, use the controller 115 to turn off the servo motor 106. The turned-off servo motor 106 will, with the cooperation of the rectangular block 105, chute 107, threaded rod 109 and slide plate 108, make the probe 114 stop moving. Then use the controller 115 to start the test machine body 102. The started test machine body 102 will, with the cooperation of the probe 114, detect the resistivity of the wafer and transmit the detected resistivity data to the controller 115 in the form of an electrical signal. At this time, the controller 115 will analyze, process and store the received resistivity data. When it is necessary to detect the resistivity of other test points on the wafer on the grooved block 113, first use the controller 115 to start the servo motor 106. The started servo motor 106 will, with the cooperation of the above-mentioned components, make the probe 114 move for reset until the probe 114 resets to its original position. Then directly operate according to the above operation steps. When the resistivity detection of the wafer on the grooved block 113 is completed, the staff can use the resistivity data stored in the controller 115 to judge whether the resistivity of the wafer meets the standard. When it is necessary to monitor the probes on the probe 114, directly use the controller 115 to start the camera 208. The started camera 208 will take pictures of the probes (unused) on the probe 114 and, with the cooperation of the wireless transmitter 209,Wirelessly transmit to the controller 115. Subsequently, use the controller 115 to first turn off the camera 208 and then start the drive motor 202. At this time, the started drive motor 202 will drive the L-shaped plate 205 to rotate under the cooperation of the bracket 201 and the rotating rod 204. The rotating L-shaped plate 205 will drive the T-shaped rod 211 to slide inside the auxiliary groove 210. At the same time, the rotating L-shaped plate 205 will drive the camera 208 to rotate under the cooperation of the rectangular hole 206 and the housing 207. The rotating camera 208 will also drive the wireless transmitter 209 to rotate. When the camera 208 rotates 180 degrees, at this time, use the controller 115 to first turn off the drive motor 202 and then start the camera 208. At this time, the turned-off drive motor 202 will, under the cooperation of the above-mentioned components, cause the camera 208 to stop rotating. At the same time, the started camera 208 will take a photo of the probe on the probe 114 at another angle and transmit the taken photo to the controller 115 in the above-mentioned manner. Subsequently, use the controller 115 to turn off the camera 208. Then, under the cooperation of the controller 115 and the above-mentioned components, make the camera 208 reset to its original position. After that, turn on the controller 115 and store both photos received by the controller 115 inside the storage module of the controller 115. At the same time, set the opening and closing times of the drive motor 202 and the opening and closing times of the camera 208. When the start time of the camera 208 arrives, at this time, the controller 115 will directly start the camera 208. The started camera 208 will take a photo of the probe on the probe 114 according to the above operation and transmit the photo to the controller 115. When the camera 208 completes the photo transmission, at this time, the closing time of the camera 208 just arrives, and at the same time, the start time of the drive motor 202 also just arrives. At this time, the controller 115 will directly start the drive motor 202. The started drive motor 202 will operate according to the above operation steps to make the camera 208 rotate. When the camera 208 completes a 180-degree rotation, at this time, the closing time of the drive motor 202 arrives, and at the same time, the start time of the camera 208 also just arrives. At this time, the controller 115 will turn off the drive motor 202 and start the camera 208. The started camera 208 will take a photo of the probe on the probe 114 at another angle according to the above operation and transmit the taken photo to the controller 115. When the camera 208 completes the photo transmission, at this time, the closing time of the camera 208 just arrives, and at the same time, the driving time of the drive motor 202 also just arrives. At this time, the controller 115 will turn off the camera 208 and start the drive motor 202. The started drive motor 202 will cause the camera 208 to perform a reset movement. When the camera 208 resets to its original position, at this time, the closing time of the drive motor 202 just arrives. At this time, the controller 115 will directly turn off the drive motor 202. Subsequently, the controller 115 will compare the two photos received with the two photos stored in advance. When the two photos received by the controller 115 are the same as the two photos stored in advance,At this time, the controller 115 will not activate the alarm 203. When both of the two photos received by the controller 115 are different from the two pre-stored photos, the controller 115 will directly activate the alarm 203 at this time. When any one of the two photos received by the controller 115 is different from the pre-stored photo, the controller 115 will directly activate the alarm 203 at this time. The activated alarm 203 will perform an alarm operation to remind the staff that the probe on the probe 114 is worn, so as to replace it in time, and then the operation can be carried out according to the above operation steps.

[0043] Among them, the bearing is a common part in real life.

[0044] Among them, the working principle of the test machine body 102 is as follows: when the probe on the probe 114 is in full contact with the wafer, a reliable electrical connection is formed between the probe 114 and the wafer at this time. Subsequently, the constant current source module inside the test machine body 102 will apply a known constant current to the probe 114, and this current will flow into the wafer through the probe on the probe 114 to form a current path in the wafer. While the current passes through the wafer, the test machine body 102 measures the voltage drop between two specific points on the wafer by using its internal high-precision voltmeter. The positions of these two points are usually determined in advance according to the test requirements and the structure of the wafer to accurately reflect the voltage information related to the resistivity. Then, the test machine body 102 will transmit the measured voltage and current data to its internal microprocessor. After that, the microprocessor will calculate the resistance value of the wafer according to Ohm's law R = V / I, and then convert the resistance value into resistivity through a specific calculation formula based on information such as the geometric parameters of the wafer and the distance between the measurement points, and display the calculated resistivity result in the form of numbers or charts on the display screen of the test machine body 102. At the same time, the calculated resistivity result will also be transmitted to the controller 115 in the form of an electrical signal for storage and subsequent management.

[0045] Among them, the controller 115 (PLC controller), the test machine body 102, the servo motor 106, the probe 114, the drive motor 202, the camera 208 (wireless) and the wireless transmitter 209 are all prior arts, and their working principles are all public technologies. Their models can be selected according to the actual situation and will not be explained in detail here.

[0046] Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A wafer testing device, comprising a testing mechanism (1), characterized in that: The testing mechanism (1) is provided with an auxiliary mechanism (2); The auxiliary mechanism (2) comprises a bracket (201), a driving motor (202) is mounted on the top of the bracket (201), an alarm (203) is mounted on the top of the bracket (201), a rotating rod (204) is mounted on the output end of the driving motor (202), an L-shaped plate (205) is mounted on the bottom end of the rotating rod (204), a rectangular hole (206) is provided on one side of the L-shaped plate (205), a housing (207) is fixedly sleeved inside the rectangular hole (206), a camera (208) is mounted inside the housing (207), a wireless transmitter (209) is arranged on the camera (208), an auxiliary groove (210) is provided on the top of the inner wall of the bracket (201), and a T-shaped rod (211) is slidably connected inside the auxiliary groove (210).

2. The wafer testing device according to claim 1, characterized in that: The bottom end of the rotating rod (204) movably passes through the top of the bracket (201), and the bottom end surface of the T-shaped rod (211) is fixed to the top of the L-shaped plate (205).

3. The wafer testing device according to claim 2, characterized in that: The testing mechanism (1) comprises a workbench (101), a testing machine body (102) is placed on the top of the workbench (101), a testing table (103) is placed on the top of the workbench (101), a rectangular plate (104) is fixed on the top of the testing table (103), and a rectangular block (105) is installed on the top of the rectangular plate (104).

4. The wafer testing device according to claim 3, characterized in that: A servo motor (106) is installed on the top of the rectangular block (105), a slide groove (107) is opened on the top of the rectangular plate (104), a slide plate (108) is slidably connected inside the slide groove (107), a threaded rod (109) is installed on the output end of the servo motor (106), and two symmetrical round rods (110) are fixed on the top of the detection platform (103).

5. The wafer testing device according to claim 4, characterized in that: The outer surface of each round rod (110) is rotatably connected to a rotating plate (111) via a bearing, and the bottom of each rotating plate (111) is bonded to an anti-skid pad (112). A grooved block (113) is placed on the top of the detection platform (103), a probe (114) is installed inside the through hole of the slide plate (108), and a controller (115) is installed on the top of the workbench (101).

6. The wafer testing device according to claim 5, characterized in that: The bottom end of the threaded rod (109) is rotatably embedded in the bottom of the inner wall of the slide groove (107), and the bottom end of the threaded rod (109) movably penetrates the top of the rectangular block (105). The servo motor (106) is electrically connected to the controller (115), and the bottom end of the threaded rod (109) is threadedly penetrated through the top of the slide plate (108).

7. The wafer testing device according to claim 6, characterized in that: The top end of each round rod (110) movably passes through the bottom of each anti-skid pad (112), and the bottom of each anti-skid pad (112) contacts the top of the grooved block (113). The test machine body (102) is electrically connected to the controller (115), and the probe (114) is electrically connected to the test machine body (102).

8. The wafer testing device according to claim 7, characterized in that: The bottom of the bracket (201) is fixed to the top of the workbench (101), the driving motor (202) is electrically connected to the controller (115), and the alarm (203) is electrically connected to the controller (115).

9. The wafer testing device according to claim 8, characterized in that: The camera (208) is wirelessly connected to the controller (115) via a wireless transmitter (209), the slotted block (113) is located directly below the probe (114), and the probe (114) is located inside the bracket (201).

10. A testing method for a wafer testing device, characterized in that: The wafer testing device according to claim 9 is used, comprising the following steps: S1. When the resistivity of the wafer needs to be tested, the two anti-skid pads (112) are separated from the grooved block (113) by using the cooperation of the two rotating plates (111), the bearings and the two round rods (110), and then the wafer is placed inside the grooved block (113). Then, the grooved block (113) is fixed by using the cooperation of the testing platform (103), the two round rods (110), the bearings, the two rotating plates (111) and the two anti-skid pads (112), and then the control The controller (115), the servo motor (106), the rectangular block (105), the slide groove (107), the slide plate (108) and the threaded rod (109) cooperate to drive the probe (114) to move vertically downward, and then the controller (115), the probe (114) and the test machine body (102) cooperate to perform resistivity detection on the wafer inside the through hole of the slot block (113), when it is necessary to perform resistivity detection on other test points of the wafer on the slot block (113); S2. At this time, the controller (115), servo motor (106), rectangular block (105), slide groove (107), slide plate (108) and threaded rod (109) are first used to make the probe (114) reset and move. Then, the two anti-skid pads (112) are separated from the grooved block (113) by the cooperation of the above components. Then, the wafer is moved to a suitable position by the cooperation of the grooved block (113). Then, the above operation steps are followed to perform resistivity detection on other test points of the wafer. When it is necessary to monitor the probe on the probe (114), the controller (115), the camera (208) and the wireless transmitter (209) are used to take a photo of the probe on the probe (114), and the photo is transmitted to the controller (115). Then, the controller (115), the bracket (201), the drive motor (202), the rotating rod (204), the L-shaped plate (205), the rectangular hole (206) and the housing (207) are used to drive the camera (208) and the wireless transmitter (209) to rotate. S3, then using the cooperation of the controller (115), the camera (208) and the wireless transmitter (209), take a photo of another angle of the probe on the probe (114), and transmit the photo to the controller (115), then using the cooperation of the above components, the camera (208) and the wireless transmitter (209) are reset and moved, and then the two photos are stored in the controller (115), and the start and close time of the drive motor (202) and the camera (208) are set. When the start time of the camera (208) arrives, the cooperation of the above components is used to take a photo of the probe on the probe (114), and the photo is transmitted to the controller (115). When the closing time of the camera (208) arrives and the start time of the drive motor (202) arrives, the cooperation of the controller (115) and the above components is used to close the camera (208) and make the camera (208) rotate; S4. When the closing time of the driving motor (202) is reached and the starting time of the camera (208) is reached, the driving motor (202) is turned off and the camera (208) is started with the cooperation of the controller (115). Then, the above-mentioned components are used to take photos of another angle of the probe on the probe (114) and transmit the photos to the controller (115). When the closing time of the camera (208) is reached and the starting time of the driving motor (202) is reached, the controller (115) and the above-mentioned components are used to turn off the camera (208) and reset the camera (208) to its original position. Then, the controller (115), the photos stored in the controller (115) and the photos received by the controller (115) are used to detect the probe on the probe (114). Then, the above-mentioned operation steps are used to monitor the probe on the probe (114).

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