Conversion circuit and detection device for integrated circuit

Abstract

The invention discloses a conversion circuit and a detection device for an integrated circuit, and the conversion circuit comprises a connection module which is used for being connected with a to-be-detected integrated circuit; the at least one relay matrix module is connected with the connection module and classifies the pin functions of the integrated circuit; and the at least one cross point switch matrix module is connected with the relay matrix module and electrically connects the pins of the to-be-detected integrated circuit to the protocol test module in a one-to-one correspondence manner. According to the conversion circuit and the detection device for the integrated circuit provided by the invention, the conversion circuit can realize the connection between the integrated circuits with different models and different packages and the detection device, so that one detection device can complete the detection of various integrated circuits, and the reuse rate of the device is improved so as to reduce the cost.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuits, and in particular to a conversion circuit and a detection device for integrated circuits. Background Art

[0002] At present, integrated circuits are a common product in the market and have spread to all aspects of life. Every integrated circuit design company will design products of different sizes and packages. After the packaging is completed in the factory, the company needs to do random inspection or batch testing of the products to test the logical function of the integrated circuit under a certain timing. However, due to the various types of packages and different circuit functions, the random inspection environment needs to adapt to various circuits with different packages. For testers, it is a very tedious task to face different test boards and test program development.

[0003] The strategy currently adopted by most companies is to develop a test board for each functional circuit and conduct targeted tests. This method has the following disadvantages: 1) There are a large number of test plates, which are difficult to manage, and random inspections require manual differentiation of test plates; 2) Circuits with the same package but different pin functions require separate design of detection boards, which wastes resources; 3) After the design of the detection board is completed, the chip needs to be redesigned and produced when the line sequence and working voltage need to be switched; 4) The experimental records cannot be bound to the test board, and manual statistics and records are required each time.

[0004] Therefore, there is a need for an efficient and universal detection device for production detection. Summary of the invention

[0005] In view of the above problems, the purpose of the present invention is to provide a conversion circuit and a detection device for integrated circuits. The conversion circuit can realize the connection between integrated circuits of different models and different packages and the detection device, so that one detection device can complete the detection of multiple integrated circuits, thereby improving the device reuse rate and reducing costs.

[0006] According to one aspect of the present invention, there is provided a conversion circuit for an integrated circuit, which includes: a connection module for connecting to an integrated circuit to be tested; at least one relay matrix module connected to the connection module for classifying and connecting the pins of the integrated circuit according to their functions; and at least one crosspoint switch matrix module connected to the relay matrix module for electrically connecting the pins of the integrated circuit to be tested to a protocol test module in a one-to-one correspondence.

[0007] Optionally, the pin functions of the integrated circuit include: power supply, ground or signal.

[0008] Optionally, the connection module includes: a plurality of slots located on the connection module and connected to the relay matrix module. Each slot includes a plurality of pins, and the pins of the integrated circuit to be detected are correspondingly engaged with the pins to realize the connection between the integrated circuit to be detected and the connection module.

[0009] Optionally, the relay matrix module includes: a plurality of relay units. Each relay unit includes a relay, and the relay includes a first end and three second ends. The types of the three second ends correspond one-to-one to the pin function types of the integrated circuit.

[0010] Optionally, the cross-point switch matrix module includes: a plurality of cross-point switch units. Each cross-point switch unit includes a signal line sequence converter.

[0011] Optionally, the signal line sequence converter includes a plurality of first ends and a plurality of second ends. The interface types between the plurality of first ends or the plurality of second ends are different, and different first ends are connected to different second ends to achieve interface compatibility.

[0012] Optionally, the signal line sequence converter includes a plurality of first ends and a plurality of second ends. The interface protocol types between the plurality of first ends or the plurality of second ends are different, and different first ends are connected to different second ends to achieve interface compatibility.

[0013] According to another aspect of the present invention, there is provided a detection device for an integrated circuit, which includes: a conversion circuit connected to the integrated circuit to be detected; a protocol test module connected to the conversion circuit and used for performing tests on the integrated circuit to be detected. Wherein, the conversion circuit connects each pin of the integrated circuit to be detected with different models and different pin functions to the pins with fixed functions in the protocol test module in a one-to-one correspondence.

[0014] Optionally, it further includes: a main control connection module connected to the conversion circuit and used for controlling the operation process of the detection.

[0015] Optionally, it further includes: a power control module connected to the main control connection module, the protocol test module, and the conversion circuit, and used for providing a stable working power supply for the detection device.

[0016] Optionally, it further includes: a human-machine interaction interface connected to the main control connection module and the protocol test module, and used for displaying the detection process and results.

[0017] The conversion circuit and detection device for integrated circuits provided by the present invention. The conversion circuit includes a connection module, multiple relay matrix modules, and at least one cross-point switch matrix module. One end of the connection module is connected to the pins of the integrated circuit, and the other end is connected to the relay matrix module. The type conversion of the pins of the integrated circuit is realized via the relay matrix module, and then it is connected to the protocol test module via the cross-point switch matrix module. Therefore, the connection between integrated circuits of different models and different packages and the detection device can be achieved, so that a detection device can complete the detection of multiple integrated circuits, improving the device reuse rate and reducing costs.

[0018] Further, the relay matrix module in the conversion circuit can independently separate each pin in the integrated circuit and connect it to the corresponding test interface, so that the signal will not be interfered by power supply and ground during testing; and the cross-point switch matrix module includes a signal line sequence converter, which can enable any interface of the integrated circuit to be connected to the corresponding test interface, eliminating the need to repeatedly design the circuit board to adapt to different integrated circuits, thus greatly reducing costs.

[0019] Further, for the conversion circuit and detection device for integrated circuits provided by the present invention, the detection device can import the configuration file of each pin of the integrated circuit to be detected via the human-machine interaction interface to achieve the quick matching between the output end of the relay matrix module and the pin type of the integrated circuit, improving the detection efficiency and reducing the probability of matching errors.

[0020] Further, the protocol test module, power control module, and cross-point switch matrix module in the detection device are all independent modules. Regardless of how the package of the integrated circuit changes, the corresponding module can be upgraded to enable the detection device to complete the detection of the integrated circuit, thereby improving the reuse rate of the detection device. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Through the following description of the embodiments of the present invention with reference to the drawings, the above and other objects, features, and advantages of the present invention will become clearer. In the drawings: Figure 1 The structural schematic diagram of the detection device for integrated circuits according to an embodiment of the present invention is shown; Figure 2 The structural schematic diagram of the cross-point switch matrix module in the conversion circuit of the detection device for integrated circuits according to an embodiment of the present invention is shown; Figure 3 The structural schematic diagram of the cross-point switch unit in the cross-point switch matrix module according to an embodiment of the present invention is shown; Figure 4 The structural schematic diagram of the relay matrix module in the conversion circuit of the detection device for integrated circuits according to an embodiment of the present invention is shown; Figure 5 The structural schematic diagram of the relay unit in the relay matrix module according to an embodiment of the present invention is shown. Detailed implementation manners

[0022] Various embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. In each of the drawings, the same or similar reference numerals are used for the same elements. For the sake of clarity, the various parts in the drawings are not drawn to scale.

[0023] The following will further describe in detail the specific implementation manners of the present invention in conjunction with the accompanying drawings and embodiments.

[0024] Figure 1 The structural schematic diagram of the detection device for an integrated circuit according to an embodiment of the present invention is shown; Figure 2 The structural schematic diagram of the cross-point switch matrix module in the conversion circuit of the detection device for an integrated circuit according to an embodiment of the present invention is shown; Figure 3 The structural schematic diagram of the cross-point switch unit in the cross-point switch matrix module according to an embodiment of the present invention is shown; Figure 4 The structural schematic diagram of the relay matrix module in the conversion circuit of the detection device for an integrated circuit according to an embodiment of the present invention is shown; Figure 5 The structural schematic diagram of the relay unit in the relay matrix module according to an embodiment of the present invention is shown.

[0025] Refer to Figure 1 , the detection device 100 for an integrated circuit includes a conversion circuit 150. The conversion circuit 150 can realize the connection between integrated circuits of different models and different packages and the detection device 100, so that a detection device can complete the detection of multiple integrated circuits, improving the device reuse rate to reduce costs.

[0026] Among them, the conversion circuit 150 includes a connection module 156, at least one relay matrix module 152 and at least one cross-point switch matrix module 151. The relay matrix module 152 is connected to the connection module 156, and the cross-point switch matrix module 151 is connected to the relay matrix module 152. In Figure 1 the shown embodiment, the conversion circuit 150 includes four relay matrix modules 152 and one cross-point switch matrix module 151. In other embodiments, the number of relay matrix modules 152 and cross-point switch matrix modules 151 in the conversion circuit 150 can also be more.

[0027] The connection module 156 is used to connect to the integrated circuit to be detected. The connection module 156 includes a plurality of slots 1561, and each slot 1561 includes a plurality of pins (not shown in the figure). The pins of the integrated circuit to be detected are correspondingly engaged with the pins in the slot 1561 to achieve the connection between the integrated circuit to be detected and the connection module 156. The plurality of slots 1561 on the connection module 156 are evenly distributed near the edge of the connection module 156. In other embodiments, other connection methods may also be adopted to achieve the connection between the integrated circuit and the connection module 156, such as a probe card or a wire.

[0028] The relay matrix module 152 is connected to the connection module 156, specifically to the pins in the slot 1561. Refer to Figure 4 and Figure 5 , the relay matrix module 152 includes a plurality of relay units 1521, and each relay unit 1521 includes at least one relay 15211. The relay 15211 includes a first end and three second ends. The first end of the relay 15211 is correspondingly connected to the pins in the slot 1561 of the connection module 156 one by one. The types of the three second ends are all different, and are respectively a power supply terminal VCC, a ground terminal GND, and a signal terminal, so as to classify and connect the pins of the integrated circuit to be detected according to functions. Among them, the pin function types of the integrated circuit to be detected are also respectively a power supply terminal VCC, a ground terminal GND, and a signal terminal, which correspond one by one to the types of the three second ends of the relay 15211. Furthermore, the pins of the integrated circuit to be detected are correspondingly connected to the second ends of the relay 15211 according to types after passing through the relay matrix module 152, reducing the interference of power supply and ground on the signals during the test process. Among the three second ends of the relay 15211, both the power supply terminal VCC and the ground terminal GND are connected to the power supply part of the detection device 100.

[0029] The cross-point switch matrix module 151, which is connected to the relay matrix module 152, electrically connects the pins of the integrated circuit to be detected one by one to the protocol test module 140 in the detection device 100. Refer to Figure 2 and Figure 3, the cross - point switch matrix module 151 includes a plurality of cross - point switch units 1511, and each cross - point switch unit 1511 includes at least one signal line sequence converter 15111. The signal line sequence converter 15111 includes a plurality of first ends and a plurality of second ends. In one embodiment, the interface types between the plurality of first ends or the plurality of second ends are different, and different first ends are connected to different second ends to achieve interface compatibility; in another embodiment, the interface protocol types between the plurality of first ends or the plurality of second ends are different, and different first ends are connected to different second ends to achieve interface compatibility. Specifically, the first end or the second end of the signal line sequence converter 15111 is connected to the signal end of the second end of the relay 15211 in the relay matrix module 152, so that the signal path of the pin of the integrated circuit to be detected is: connection module 156 - relay matrix module 152 - cross - point switch matrix module 151 or vice versa.

[0030] Among them, the interface type refers to the physical interface form adopted when hardware devices are connected and communicate. It stipulates the appearance, size, number of pins, arrangement method, and electrical characteristics of the interface, etc., to ensure the correct mechanical and electrical connection between devices. Interface types include, for example: USB interface, commonly having different shapes and sizes such as Type - A, Type - B, Type - C, etc., widely used in devices such as computers, mobile phones, printers, etc. for data transmission and charging; HDMI interface, mainly used for the connection between high - definition video devices such as TVs, projectors, computer graphics cards, etc., capable of transmitting high - resolution video signals and multi - channel audio signals; RJ45 interface, usually used for network devices such as computers, routers, switches, etc., for connecting Ethernet network cables to achieve network data transmission.

[0031] The interface protocol type refers to the rules and agreements followed during data transmission and communication on the interface. It defines the data format, transmission rate, signal meaning, handshaking method, error handling, etc., ensuring accurate and reliable data exchange and communication between different devices. Examples of interface protocol types include: USB protocols, including different versions such as USB 1.1, USB 2.0, and USB 3.0, which specify the data transmission speed (e.g., 1.5Mbps and 12Mbps for USB 1.1, 480Mbps for USB 2.0, and 5Gbps for USB 3.0), the data transmission method (e.g., control transfer, bulk transfer, interrupt transfer, isochronous transfer), and the device enumeration process, etc.; HDMI protocol, which defines the encoding method of video and audio data, transmission rate (e.g., HDMI 2.0 supports a transmission rate of 18Gbps), color space, audio format, etc., ensuring the correct transmission and display of high-definition audio and video signals; Ethernet protocol, such as the IEEE 802.3 standard, which specifies the relevant rules for the data link layer and physical layer in a local area network, including the data frame format, definition of MAC address, access control method of CSMA / CD (Carrier Sense Multiple Access / Collision Detection), and physical layer specifications of different-speed Ethernet (e.g., 10Mbps, 100Mbps, 1000Mbps), etc.; and communication protocol types such as SPI, I2C, UART, and CAN.

[0032] In the embodiments of the present application, the relay matrix module 152 and the cross-point switch matrix module 151 may cause some losses during signal transmission. Therefore, for protocol types with high requirements for signal transmission rate, such as USB 3.0 and HDMI, signals with a transmission rate of Gbps like CSMA do not have a very good conversion effect, but a good transmission effect can be achieved by adjusting the circuit structures of the relay 15211 and the signal line sequence converter 15111, etc.

[0033] The conversion circuit and detection device provided by the present application for an integrated circuit. The conversion circuit includes a connection module, multiple relay matrix modules, and at least one cross-point switch matrix module. One end of the connection module is connected to the pins of the integrated circuit, and the other end is connected to the relay matrix module. The type conversion of the pins of the integrated circuit is realized via the relay matrix module, and then it is connected to the protocol test module via the cross-point switch matrix module. Therefore, the connection between integrated circuits of different models and different packages and the detection device can be realized, so that a detection device can complete the detection of multiple integrated circuits, improving the device reuse rate to reduce costs.

[0034] Further, the relay matrix module in the conversion circuit can independently connect each pin in the integrated circuit to the corresponding test interface, so that the signal will not be interfered by power supply and grounding during testing; and the cross-point switch matrix module includes a signal line sequence converter, which enables any interface of the integrated circuit to be connected to the corresponding test interface, eliminating the need to repeatedly design the circuit board to adapt to different integrated circuits, thus greatly reducing the cost.

[0035] Further, referring to Figure 1 , in a simple embodiment, the detection device 100 for integrated circuits of the present application further includes: a protocol test module 140. Among them, the protocol test module 140 is connected to the conversion circuit 150, and the conversion circuit 150 connects each pin of the integrated circuit to be detected with different models and different pin functions to the pins with fixed functions in the protocol test module 140 one by one. Thus, the protocol test module 140 conducts a detailed detection of various functions of the integrated circuit through a preset test protocol to ensure that it meets the design requirements and industry standards.

[0036] Specifically, the protocol test module 140 provides a test signal to the integrated circuit to be detected via the conversion circuit 150, receives the test result, and determines whether the integrated circuit to be detected is qualified according to the test result.

[0037] In addition, the protocol test module 140 can also be used to verify protocol compatibility to ensure that the integrated circuit can communicate correctly with other devices or systems according to a predetermined protocol; detect data transmission accuracy, strictly detect the accuracy and integrity of the integrated circuit during data transmission; evaluate protocol performance indicators, evaluate the protocol-related performance indicators of the integrated circuit, such as data transmission rate, latency, bandwidth utilization, etc.; identify protocol implementation vulnerabilities, help discover possible vulnerabilities or defects in the protocol implementation of the integrated circuit; ensure compliance with industry standards, ensure that the integrated circuit complies with relevant industry standards and specifications. The protocol test module 140 conducts a comprehensive test on the integrated circuit to be detected based on these standards. Only products that pass the test can indicate that they meet the industry standards, thus being competitive in the market and being able to operate stably in various compliant systems.

[0038] Further, the detection device 100 for integrated circuits further includes: a main control connection module 120. The main control connection module 120 is connected to the conversion circuit 150 and is used to control the operation process of the detection.

[0039] The main control connection module 120 is responsible for receiving instructions from the host computer and coordinating the start, end, pause, etc. of the work of the protocol test module 140 according to the instructions to ensure the smooth progress of the entire detection process.

[0040] Furthermore, the detection device 100 for integrated circuits further includes: a power control module 130. The power control module 130 is connected to the main control connection module 120, the protocol test module 140, and the conversion circuit 150, and is used to provide a stable operating power supply for the detection device 100.

[0041] The power control module 130 can provide a stable and standard-compliant power supply according to the specific requirements of the integrated circuit to be detected, ensuring the normal operation of the integrated circuit during the test. In addition, the power control module 130 can also provide power supplies for each module in the conversion circuit 150, the protocol test module 140, the main control connection module 120, etc.

[0042] In one embodiment, the power control module 130 includes a voltage regulator and a current protection circuit, which are used to ensure the power stability and safety of the integrated circuit to be detected during the test.

[0043] Furthermore, the detection device 100 for integrated circuits further includes: a human-machine interface 110. The human-machine interface 110 is connected to the main control connection module 120 and the protocol test module 140, and is used to display the detection process and results.

[0044] The human-machine interface 110 is used to provide an intuitive interaction between the user and the detection device 100, supporting the user to input the model number of the integrated circuit to be detected, test parameters, or pin function comparison table, etc. through a touch screen or keys, and at the same time displaying the test results and status information. In one embodiment, the human-machine interface 110 can include a touch display screen, a keyboard, etc., which are used to implement the interaction operation between the user and the detection device. In addition, the human-machine interface 110 can also support multi-language display to meet the usage needs of different users.

[0045] In Figure 1 In the shown detection device 100, the conversion circuit 150 plays a key bridging role. Through its flexible pin conversion function, different models of integrated circuits can adapt to the same set of test systems, thus greatly improving the versatility and practicality of the detection device 100.

[0046] The detection device 100 for integrated circuits of the present application, during a test process, the detection steps include: 1) Connect the integrated circuit to be detected to the connection module 156 of the conversion circuit 150, where the connection between the conversion circuit 150 and the integrated circuit can be achieved through an adapter board; 2) Import the configuration file: via the human-machine interaction interface 110, import the configuration file of the integrated circuit to be detected into the detection device 100, where the configuration file is, for example, a file representing the functions of each pin of the integrated circuit; 3) Start the protocol test module 140. After starting the protocol test module 140, the functions of the pins of the cross-point switch matrix module 151 and the relay matrix module 152 in the conversion circuit 150 connected to the integrated circuit are configured to be the same as those in the configuration file; 4) Start the test. The protocol test module 140 sends test instructions to the integrated circuit, provides test signals, and receives the signals fed back by the integrated circuit, and determines whether the integrated circuit is qualified based on the feedback signals, and displays it on the human-machine interaction interface 110.

[0047] The following Table 1 shows an embodiment of configuring the detection device 100 according to the configuration file in steps 2) and 3) above.

[0048] Table 1: Configuration File In Table 1, the first row indicates that the operating voltage of the integrated circuit is 3.3V.

[0049] The second row indicates that pin 1 of the integrated circuit is assigned to connect to pin 1 of the cross-point switch matrix module 151. However, since this pin needs to be connected to the power supply VCC, the power supply terminal VCC (one of the three second terminals of the relay) is selected through the relay 15211 and connected to the power control module 130. At the same time, the cross-point switch matrix module 151 is configured as NC (not connected).

[0050] The third row indicates that pin 2 of the integrated circuit is assigned to connect to pin 2 of the cross-point switch matrix module 151. However, since this pin needs to be connected to the ground GND, the ground terminal GND (one of the three second terminals of the relay) is selected through the relay 15211 and connected to the power control module 130. At the same time, the cross-point switch matrix module 151 is configured as NC (not connected) respectively.

[0051] The fourth row indicates that pin 3 of the integrated circuit is assigned to connect to pin 10 of the cross-point switch matrix module 151. This pin needs to be connected to the clock CLK. The signal terminal GPIO (one of the three second terminals of the relay) is selected through the relay 15211, and at the same time, it is connected to the clock signal SPI_CLK through the cross-point switch matrix module 151.

[0052] The fifth line indicates that pin 4 of the integrated circuit is assigned to connect to pin 19 of the cross-point switch matrix module 151. This pin needs to connect to CS (chip select signal). The signal terminal GPIO is selected through the relay 15211, and at the same time, it is connected to the chip select signal SPI_CS through the cross-point switch matrix module 151.

[0053] The seventh line indicates that pin 46 of the integrated circuit is assigned to connect to pin 50 of the cross-point switch matrix module 151. This pin needs to connect to MISO (Master In Slave Out signal). The signal terminal GPIO is selected through the relay 15211, and at the same time, it is connected to the Master In Slave Out signal SPI_MISO through the cross-point switch matrix module 151.

[0054] The eighth line indicates that pin 47 of the integrated circuit is assigned to connect to pin 55 of the cross-point switch matrix module 151. This pin needs to connect to MOSI (Master Out Slave In signal). The signal terminal GPIO is selected through the relay 15211, and at the same time, it is connected to the Master Out Slave In signal SPI_MOSI through the cross-point switch matrix module 151.

[0055] The ninth line indicates that pin 48 of the integrated circuit is assigned to connect to pin 60 of the cross-point switch matrix module 151. However, since this pin needs to connect to the ground GND, the ground terminal GND is selected through the relay 15211 and connected to the power control module 130. At the same time, the cross-point switch matrix module 151 is configured as NC (not connected) respectively.

[0056] During the test process, for example, when using the SPI protocol, the configuration file in Table 1 above is imported into the detection device 100 via the human-machine interface 110. After starting the protocol test module 140, the relay 15211 and the cross-point switch matrix module 151 are directly configured through software to connect the corresponding pins to the corresponding pins of the protocol test module 140 and the power control module 130, and the integrated circuit is powered on to perform the circuit test.

[0057] In practical applications, the detection device 100 not only supports various packaging types of integrated circuits but also can adapt to different physical layer protocol test requirements. The separate design of the power control module 130, the protocol test module 140, and the conversion circuit 150 enables each module to be independently upgraded or replaced according to specific test requirements. For example, when the operating voltage to be tested exceeds the support range of the current power control module 130, the new test requirements can be met by replacing or upgrading the power control module 130. Similarly, if new interface protocol tests need to be supported, it can also be achieved by upgrading the protocol test module 140 without the need for large-scale modification of the entire detection device. This modular design concept not only reduces the cost of integrated circuit detection but also enhances the flexibility and scalability of the detection device, enabling it to better adapt to the rapid development of integrated circuit technology.

[0058] As described above in the embodiments of the present invention, these embodiments do not describe all the details in detail, nor do they limit the invention to the specific embodiments described. Obviously, many modifications and variations can be made according to the above description. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of the present invention, so that those skilled in the art can make good use of the present invention and its modifications based on the present invention. The present invention is only limited by the claims and their full scope and equivalents.

Claims

1. A conversion circuit for an integrated circuit, wherein: include: A connection module, used for connecting to the integrated circuit to be detected; at least one relay matrix module, connected to the connection module, classifying and connecting the pins of the integrated circuit according to their functions; At least one crosspoint switch matrix module is connected to the relay matrix module to electrically connect the pins of the integrated circuit to be tested to the protocol test module in a one-to-one correspondence.

2. The conversion circuit according to claim 1, wherein: The pin functions of the integrated circuit include: power supply, ground or signal.

3. The conversion circuit according to claim 2, wherein: The connection module comprises: A plurality of slots are located on the connection module and connected to the relay matrix module, each of the slots includes a plurality of pins, and the pins of the integrated circuit to be detected are correspondingly engaged with the pins to achieve the connection between the integrated circuit to be detected and the connection module.

4. The conversion circuit according to claim 3, wherein: The relay matrix module includes: a plurality of relay units, each of which includes a relay, and the relay includes a first end and three second ends, and the types of the three second ends correspond to the pin function types of the integrated circuit one by one.

5. The conversion circuit according to claim 4, wherein: The cross-point switch matrix module includes: a plurality of cross-point switch units, each of which includes a signal line sequence converter.

6. The conversion circuit according to claim 5, wherein: The signal line sequence converter includes a plurality of first ends and a plurality of second ends, the interface types between the plurality of first ends or the plurality of second ends are different, and different first ends are connected to different second ends to achieve interface compatibility.

7. The conversion circuit according to claim 5, wherein: The signal line sequence converter includes multiple first ends and multiple second ends. The interface protocol types between the multiple first ends or the multiple second ends are different. Different first ends are connected to different second ends to achieve interface compatibility.

8. A detection device for an integrated circuit, wherein: include: A conversion circuit connected to the integrated circuit to be detected; A protocol test module, connected to the conversion circuit, for performing a test on the integrated circuit to be detected; The conversion circuit connects the pins of the integrated circuit to be tested of different models and different pin functions to the pins of fixed functions in the protocol test module in a one-to-one correspondence.

9. The detection device according to claim 8, wherein: Also includes: The main control connection module is connected to the conversion circuit and is used to control the running process of the detection.

10. The detection device according to claim 9, wherein: Also includes: The power control module is connected to the main control connection module, the protocol test module and the conversion circuit, and is used to provide a stable working power supply for the detection device.

11. The detection device according to claim 10, wherein: Also includes: The human-computer interaction interface is connected to the main control connection module and the protocol test module, and is used to display the detection process and results.

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