Novel color display screen and preparation method thereof

Abstract

The invention discloses a novel color display screen and a preparation method thereof. The novel color display screen is provided with a first glass layer, a first transparent conductive film layer, a first insulating layer, a liquid crystal layer, a second insulating layer, a second transparent conductive film layer and a second glass layer which are sequentially arranged, a metal conducting layer is further arranged on the second layer of glass and located on the periphery of the second layer of transparent conducting film layer, pixel point stacking is made, a conventional equipment process can be used for manufacturing in the process originally needing high-precision equipment, and the production difficulty and cost are reduced.

Description

Technical Field

[0001] The present invention belongs to the technical field of display screens, and particularly relates to a novel color display screen and a preparation method thereof. Background Art

[0002] In the process of implementing the present invention, the inventor found that the prior art has at least the following problems:

[0003] Existing display screens are divided into three types: LCD / LED / OLED. Currently, high-end display screens use OLED, but conventional OLEDs have the problems of high power consumption and strong color saturation, which makes users more prone to visual fatigue; LCDs and LEDs have the problems of poor color saturation and cumbersome processes.

[0004] CN108630115A - An inorganic flexible LED color display screen and a preparation method thereof disclose an inorganic flexible LED color display screen and a preparation method thereof. The preparation includes: using a base layer, multiple insulating layers and multiple electrode layers to form a flexible circuit board. The base layer is the bottom layer, and the insulating layers and electrode layers are alternately arranged on the base layer in sequence; among them, selecting a PET polyester board or a PI polyimide board and coating a conductive film on the board cannot solve the above technical problems. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a novel color display screen and a preparation method thereof, making pixel point stacking so that the process that originally required high-precision equipment can be made using conventional equipment processes, reducing the production difficulty and cost.

[0006] To solve the above technical problems, the technical solution adopted by the present invention is: a novel color display screen, having a first layer of glass, a first layer of transparent conductive film layer, a first layer of insulating layer, a liquid crystal layer, a second layer of insulating layer, a second layer of transparent conductive film layer, and a second layer of glass arranged in sequence; a metal conductive layer is further provided on the second layer of glass, and the metal conductive layer is located on the outer periphery of the second layer of transparent conductive film layer.

[0007] Both the first layer of transparent conductive film layer and the second layer of transparent conductive film layer are provided with routing channels.

[0008] The metal conductive layer is provided with metal lines, and the metal conductive layer is provided with conductive line patterns.

[0009] The preparation method of the above color display screen includes the following steps:

[0010] 1) Using the first layer of glass as a carrier;

[0011] 2) Coating a whole-surface first layer of transparent conductive film layer on the first layer of glass;

[0012] 3) Make a wiring channel on the first-layer transparent conductive film layer;

[0013] 4) Coat a first-layer insulating layer on the wiring channel and generate a pattern by the exposure and development method of a lithography machine;

[0014] 5) Deposit a whole-surface second-layer transparent conductive film layer on the second-layer glass;

[0015] 6) Make a wiring channel on the second-layer transparent conductive film layer;

[0016] 7) Make a metal conductive layer on the second-layer glass and make metal lines;

[0017] 8) By the method of photolithography, make the whole-surface metal conductive layer into a conductive line pattern;

[0018] 9) Bond the first-layer glass and the second-layer glass together and fill with color liquid crystal;

[0019] 10) Make three pairs of bonded glasses in the manner of steps 1) to 9), fill with three different color liquid crystals, and bond them again.

[0020] In the above step 1), considering the thinning of subsequent products and good tension release, the thickness of the first-layer glass is selected to be 0.2 - 0.7 mm, and the flatness ≤ 0.1 mm (ensuring perfect imaging at any angle during use, ensuring uniform propagation and focusing of light, thereby improving the imaging quality and clarity of the device).

[0021] In the above step 2), use magnetron sputtering technology to deposit the whole-surface first transparent conductive film layer; the thickness of the first transparent conductive film layer is controlled within 200 - 1500 Å (ensuring that it can meet the requirements of different customers for corresponding resistance values), and at the same time maintain the temperature at 200 - 400 °C (ensuring that the film layer can be perfectly crystallized and ensuring good adhesion of the film layer).

[0022] In the above step 3), the GAP of the wiring channel of the first-layer transparent conductive film layer is controlled within 10 - 60 um (the requirements of different customers are different, and the adjustable range of GAP is wide, which can be applied to products with different display area requirements. A small GAP can be used for narrow border projects, and a large GAP can be applied to some special touch projects. Because a large GAP allows a larger line width, the conductivity of the large channel is better and the compatibility is stronger);

[0023] In the above step 4), coat an insulating material with a thickness of 1 - 8 um on the wiring channel and generate a specific pattern through the exposure and development process of a lithography machine. The adjustment of the insulation thickness is mainly to meet the requirements of the overall thickness of the product and the capacitance value of the product. The overall capacitance value can be adjusted according to the thickness to match different chips.

[0024] In the above step 5), a second transparent conductive film layer is deposited on the second layer of glass by magnetron sputtering; the thickness of the second transparent conductive film layer is controlled within 200 - 1500 angstroms (ensuring that it can meet the requirements of different customers for corresponding resistance values), and at the same time, the temperature is maintained at 200 - 400 °C (ensuring that the film layer can be perfectly crystallized and the adhesion of the film layer is okay).

[0025] In the above step 6), the GAP of the routing channel of the second transparent conductive film layer is controlled within 10 - 60 um (the requirements of different customers are different, and the wide adjustable range of GAP can be applied to products with different display area requirements. A small GAP can be used for narrow border projects, and a large GAP can be applied to some special touch projects. Because a large GAP allows a larger line width, the conductivity of the large channel is better and the compatibility is stronger).

[0026] In the above step 7), a metal conductive layer is formed by magnetron sputtering, and then metal lines are fabricated through exposure and development of a lithography machine. The thickness of this metal line film is 1000 - 5000 angstroms (ensuring that it can meet the requirements of different customers for corresponding resistance values), and the temperature is controlled at 150 - 300 °C (ensuring that the film layer can be perfectly crystallized and the adhesion of the film layer is okay).

[0027] In the above step 8), the entire metal film layer is processed into a conductive line pattern by lithography technology, and the line width is controlled within 2 - 30 um (the requirements of different customers are different, and the wide adjustable range of GAP can be applied to products with different display area requirements. A small GAP can be used for narrow border projects, and a large GAP can be applied to some special touch projects. Because a large GAP allows a larger line width, the conductivity of the large channel is better and the compatibility is stronger).

[0028] In the above step 9), two pieces of glass are pasted together and filled with a color liquid crystal with a thickness of 3 - 15 um (corresponding to the requirements of different customers, changing the filling thickness can show different color saturations, thus enabling professional customized production).

[0029] One of the technical solutions in the above technical solutions has the following advantages or beneficial effects. Pixel point stacking is made, enabling the process that originally required high-precision equipment to be fabricated using conventional equipment processes, reducing the production difficulty and cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic structural diagram of the novel color display screen provided in the embodiment of the present invention;

[0031] Figure 2 For Figure 1 the schematic structural diagram of the novel color display screen;

[0032] Figure 3 For Figure 1Schematic diagram of the structure of a new type of color display screen; Specific implementation mode

[0033] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0034] Embodiment 1

[0035] See Figures 1 to 3 , a new type of color display screen and its manufacturing method, having a first layer of glass, a first layer of transparent conductive film layer, a first layer of insulating layer, a liquid crystal layer, a second layer of insulating layer, a second layer of transparent conductive film layer, and a second layer of glass arranged in sequence; a metal conductive layer is also provided on the second layer of glass, and the metal conductive layer is located on the outer periphery of the second layer of transparent conductive film layer. Wiring channels are provided on both the first layer of transparent conductive film layer and the second layer of transparent conductive film layer. Metal lines are provided on the metal conductive layer, and a conductive line pattern is provided on the metal conductive layer.

[0036] The original two-dimensional design is changed to a three-dimensional design. Products of the same size can have more pixel combinations, which can improve the brightness and wider viewing angle of higher products and enhance the color saturation; the change in the stack that originally required a complex IC control program can be changed to a more common and general program to control the display effect, reducing the production cost; originally, multiple color pixel points needed to be processed, and now after changing the stack, only single-color pixel points need to be processed, and the response speed will be faster.

[0037] Embodiment 2

[0038] The manufacturing method of the above-mentioned color display screen includes the following steps:

[0039] 1) Use the first layer of glass as a carrier;

[0040] 2) Deposit a whole-surface first layer of transparent conductive film layer on the first layer of glass;

[0041] 3) Make wiring channels on the first layer of transparent conductive film layer;

[0042] 4) Coat the first layer of insulating layer on the wiring channels and generate a pattern by the method of exposure and development of a lithography machine;

[0043] 5) Deposit a whole-surface second layer of transparent conductive film layer on the second layer of glass;

[0044] 6) Make wiring channels on the second layer of transparent conductive film layer;

[0045] 7) Deposit a layer of metal conductive layer on the second layer of glass and make metal circuits.

[0046] 8) By means of photolithography, make the entire metal conductive layer into a conductive circuit pattern.

[0047] 9) Bond the first layer of glass and the second layer of glass together and fill with colored liquid crystal.

[0048] 10) Make three pairs of bonded glasses in the manner of steps 1) to 9), fill with three different colored liquid crystals, and bond them again.

[0049] In the above step 1), considering the thinness and lightness of the subsequent product and the perfect release of tension, the thickness of the first layer of glass is selected to be 0.2 - 0.7 mm, and the flatness ≤ 0.1 mm (ensuring perfect imaging at any angle during use, ensuring uniform propagation and focusing of light, thereby improving the imaging quality and clarity of the device).

[0050] In the above step 2), use magnetron sputtering technology to deposit the entire first transparent conductive film layer; the thickness of the first transparent conductive film layer is controlled within 200 - 1500 angstroms (ensuring that it can meet the requirements of different customers for corresponding resistance values), and at the same time, maintain the temperature at 200 - 400 °C (ensuring that the film layer can be perfectly crystallized and ensuring the good adhesion of the film layer).

[0051] In the above step 3), the GAP of the wire routing channel of the first transparent conductive film layer is controlled within 10 - 60 um (the requirements of different customers are different, and the adjustable range of GAP is wide, which can be applied to products with different display area requirements. A small GAP can be used for narrow border projects, and a large GAP can be applied to some special touch projects. Because a large GAP allows for a larger line width, the conductivity of the large channel is better and the compatibility is stronger).

[0052] In the above step 4), coat a layer of insulating material with a thickness of 1 - 8 um on the wire routing path, and generate a specific pattern through the exposure and development process of a lithography machine. The adjustment of the insulation thickness is mainly to meet the requirements of the overall thickness of the product and the capacitance value of the product. The overall capacitance value can be adjusted according to the thickness to match different chips.

[0053] In the above step 5), use magnetron sputtering technology to deposit the entire second transparent conductive film layer on the second layer of glass; the thickness of the second transparent conductive film layer is controlled within 200 - 1500 angstroms (ensuring that it can meet the requirements of different customers for corresponding resistance values), and at the same time, maintain the temperature at 200 - 400 °C (ensuring that the film layer can be perfectly crystallized and ensuring the good adhesion of the film layer).

[0054] In the above step 6), the GAP of the routing channel of the second-layer transparent conductive film layer is controlled within 10 - 60 um (the requirements of different customers are different, and the adjustable range of GAP is wide, which can be applied to products with different display area requirements. A small GAP can be used for narrow bezel projects, and a large GAP can be applied to some special touch projects. Because a large GAP allows for a larger line width, the conductivity of the large channel is better and the compatibility is stronger).

[0055] In the above step 7), a metal conductive layer is formed by magnetron sputtering, and then metal lines are fabricated through exposure and development of a lithography machine. The thickness of this metal line film is 1000 - 5000 angstroms (ensuring that it can meet the requirements of different customers for corresponding resistance values), and the temperature is controlled at 150 - 300 °C (ensuring that the film layer can be perfectly crystallized and the adhesion of the film layer is okay).

[0056] In the above step 8), using lithography technology, the entire metal film layer is processed into a conductive line pattern, and the line width is controlled within 2 - 30 um (the requirements of different customers are different, and the adjustable range of GAP is wide, which can be applied to products with different display area requirements. A small GAP can be used for narrow bezel projects, and a large GAP can be applied to some special touch projects. Because a large GAP allows for a larger line width, the conductivity of the large channel is better and the compatibility is stronger).

[0057] In the above step 9), two pieces of glass are pasted together and filled with a color liquid crystal with a thickness of 3 - 15 um (corresponding to the requirements of different customers, changing the filling thickness can show different color saturations, thus enabling professional customized production).

[0058] ① Pixel point stacking is made, enabling the process that originally required high-precision equipment to be fabricated using conventional equipment processes, reducing production difficulty and cost.

[0059] ② The original two-dimensional design is changed to a three-dimensional design. For products of the same size, there can be more pixel point combinations, which can improve the brightness and wider viewing angle of the product and enhance the color saturation.

[0060] ③ The change in the stack layer allows the originally complex IC control program to be changed to a more common and general program to manage the display effect, reducing production costs.

[0061] ④ Originally, multiple color pixel points needed to be processed. Now, after changing the stack layer, only single-color pixel points need to be processed, and the response speed will be faster.

[0062] Example 3

[0063] The above method for preparing a color display screen includes the following steps:

[0064] 1. Use glass as a carrier;

[0065] 2. Deposit a full-surface transparent conductive film layer on the glass carrier by magnetron sputtering;

[0066] 3. On the transparent conductive film layer on the glass carrier, make dense routing channels (RX channels) by exposure and development of a lithography machine;

[0067] 4. Coat an insulating material on the dense routing, and generate a pattern by exposure and development of a lithography machine;

[0068] 5. Deposit a full-surface transparent conductive film layer on another piece of glass by magnetron sputtering;

[0069] 6. On the transparent conductive film layer on the glass carrier, make dense routing channels (TX channels) by exposure and development of a lithography machine;

[0070] 7. Deposit a metal conductive layer on the glass by magnetron sputtering, and make metal lines by exposure and development of a lithography machine;

[0071] 8. By lithography, make the full-surface metal film layer into a conductive line pattern,

[0072] 9. Bond the glasses face to face and fill with colored liquid crystal;

[0073] 10. Make three pairs of bonded glasses in the above manner, and fill with three different colored liquid crystals, and bond them again;

[0074] It has the following advantages:

[0075] ① Make pixel point stacking on the basis of the original scheme, so that the process that originally required high-precision equipment can be made using conventional equipment processes, reducing the production difficulty and cost;

[0076] ② Change from the original two-dimensional design to a three-dimensional design. For products of the same size, there can be more pixel point combinations, which can improve the brightness of the product and provide a wider viewing angle, and enhance the color saturation;

[0077] ③ The originally required complex IC control program for the change of the stack can be changed to a more common and general program to control the display effect, reducing the production cost;

[0078] ④ Originally, multiple color pixel points needed to be processed. Now, after changing the stack, only single-color pixel points need to be processed, and the response speed will be faster.

[0079] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by terms such as "coaxial", "bottom", "one end", "top", "middle", "the other end", "upper", "one side", "top", "inner", "front", "center", "both ends", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention.

[0080] In the present invention, unless otherwise clearly defined and limited, terms such as "installed", "set", "connected", "fixed", "swivelly connected", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. Unless otherwise clearly defined, for those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0081] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A new color display screen and a method for preparing the same, characterized in that: The invention comprises a first layer of glass, a first layer of transparent conductive film, a first layer of insulating layer, a liquid crystal layer, a second layer of insulating layer, a second layer of transparent conductive film and a second layer of glass arranged in sequence; a metal conductive layer is also arranged on the second layer of glass, and the metal conductive layer is located on the periphery of the second layer of transparent conductive film.

2. The color display screen according to claim 1, characterized in that: The first transparent conductive film layer and the second transparent conductive film layer are both provided with wiring channels.

3. The color display screen according to claim 2, characterized in that: The metal conductive layer is provided with a metal circuit, and the metal conductive layer is provided with a conductive circuit pattern.

4. The method for preparing a color display screen according to any one of claims 1 to 3, characterized in that: The steps include: 1) Use the first layer of glass as a carrier; 2) coating the entire surface of the first layer of glass with a first transparent conductive film layer; 3) Make a wiring channel on the first transparent conductive film layer; 4) Apply a first insulating layer on the wiring via, and generate a pattern by exposure and development using a photolithography machine; 5) coating a second transparent conductive film layer on the entire surface of the second layer of glass; 6) Make a wiring channel on the second transparent conductive film layer; 7) Make a metal conductive layer on the second layer of glass and make a metal circuit; 8) The entire metal conductive layer is made into a conductive circuit pattern by photolithography; 9) Paste the first layer of glass and the second layer of glass together and fill them with colored liquid crystal; 10) Three pairs of laminated glasses are made according to steps 1) to 9), and filled with three different color liquid crystals, and laminated again.

5. The method for preparing a color display screen according to claim 4, characterized in that: In the above step 1), the thickness of the first layer of glass is 0.2-0.7 mm, and the flatness is ≤ 0.1 mm.

6. The method for preparing a color display screen according to claim 5, characterized in that: In the above step 2), the entire surface of the first transparent conductive film layer is plated by magnetron sputtering technology; the thickness of the first transparent conductive film layer is controlled to be 200-1500 angstroms, and the temperature is maintained at 200-400°C.

7. The method for preparing a color display screen according to claim 6, characterized in that: In the above step 3), the GAP of the routing channel of the first transparent conductive film layer is controlled at 10-60um; in the above step 4), a layer of insulating material with a thickness of 1-8um is coated on the routing channel, and a specific pattern is generated through the exposure and development process of the photolithography machine.

8. The method for preparing a color display screen according to claim 7, characterized in that: In the above step 5), the second transparent conductive film layer is plated on the second layer of glass by magnetron sputtering technology; the thickness of the second transparent conductive film layer is controlled to be 200-1500 angstroms, and the temperature is maintained at 200-400°C.

9. The method for preparing a color display screen according to claim 8, characterized in that: In the above step 6), the GAP of the routing channel of the second transparent conductive film layer is controlled at 10-60um; in the above step 7), a metal conductive layer is formed by magnetron sputtering, and then a metal circuit is produced by exposure and development of a photolithography machine. The film thickness of this metal circuit is 1000-5000 angstroms, and the temperature is controlled at 150-300°C.

10. The method for preparing a color display screen according to claim 9, characterized in that: In the above step 8), the entire metal film layer is processed into a conductive circuit pattern using photolithography technology, and the line width is controlled at 2-30um; in the above step 9), two pieces of glass are pasted together and filled with color liquid crystal with a thickness of 3-15um.

Images