A storage component, a storage system, and an electronic device

Abstract

The present application discloses a storage component, a storage system, and an electronic device. The storage component includes a disk array card and a passive hard disk backplane; the disk array card includes a conductive connection part and at least one active drive element; the passive hard disk backplane includes a disk array card connector, a hard disk connector, and a motherboard connector; the disk array card is plugged into the disk array card connector through the conductive connection part; the hard disk connector is used for plugging in a hard disk; the motherboard connector is used for electrically connecting with a motherboard; the disk array card is used for information interaction with the motherboard connected to the motherboard connector through the disk array card connector; the disk array card is also used for information interaction with the hard disk plugged into the hard disk connector through the disk array card connector. In the present application, the active drive element is placed on the disk array card, which can reduce the failure rate of the hard disk backplane. When the active drive element fails, the disk array card can be directly pulled out for maintenance, effectively improving the stability of the system and reducing the maintenance cost.

Description

Technical Field

[0001] This application relates to the field of storage technologies, and in particular, to a storage component, a storage system, and an electronic device. Background Art

[0002] In the server field, hard disks usually need to be used in conjunction with a RAID card (Redundant Array of Independent Disks). In the related art, a RAID card in the form of a PCIe (Peripheral Component Interconnect Express) standard card is connected to the PCIe slot of the motherboard through a gold finger and is connected to the hard disk backplane through a cable. There is also a RAID card that integrates a RAID chip on the motherboard and is also connected to the hard disk backplane through a cable.

[0003] For the above two RAID methods, the hard disk backplane used generally adopts an active board design. The hard disk backplane contains a voltage conversion module inside, and a CPLD (Complex Programmable Logic Device) is used to implement functions such as hard disk presence detection and indicator light lighting. However, this traditional RAID card and cable connection method has many drawbacks. On the one hand, RAID is connected to the hard disk backplane through cables in the chassis, and the plugging and unplugging process is extremely cumbersome. On the other hand, the probability of failure of active devices on the hard disk backplane is relatively high. Once the hard disk backplane fails, it is difficult to troubleshoot and repair the problem, which not only affects the normal operation of the server but also increases the maintenance cost and time cost. If maintenance is required for the hard disk backplane, the hard disk backplane needs to be removed from the chassis, which is extremely inconvenient during maintenance operations. Therefore, there is an urgent need for a new technical solution to solve these problems. Summary of the Invention

[0004] This application provides a storage component, a storage system, and an electronic device to solve the problems of cumbersome cable connection, high failure rate of the hard disk backplane, and inconvenient maintenance in the traditional solution.

[0005] In a first aspect, this application provides a storage component, including:

[0006] A disk array card; the disk array card includes a conductive connection part and at least one active drive element;

[0007] A passive hard disk backplane; the passive hard disk backplane includes a disk array card connector, a hard disk connector, and a motherboard connector;

[0008] The disk array card is plugged into the disk array card connector through the conductive connection part; the hard disk connector is used to plug in a hard disk; the motherboard connector is used to electrically connect to the motherboard;

[0009] The disk array card is used to interact with the motherboard connected to the motherboard connector through the disk array card connector; the disk array card is also used to interact with the hard disk plugged into the hard disk connector through the disk array card connector.

[0010] In a second aspect, the present application further provides a storage system, including any storage component in the first aspect, and at least one hard disk connected to the hard disk connector of the passive hard disk backplane.

[0011] In a third aspect, the present application further provides an electronic device, including the storage system in the second aspect.

[0012] The storage component provided by the present application includes a disk array card and a passive hard disk backplane. The disk array card in the present application includes a conductive connection part, and the disk array card is directly plugged into the disk array card connector of the passive hard disk backplane through the conductive connection part, replacing the traditional cable. The maintenance steps can be simplified from "opening the case → unplugging the cable → removing the card" to "directly pulling out". The hard disk backplane of the storage component in the present application is a passive hard disk backplane, and the active drive element is arranged on the disk array card. The passive hard disk backplane further includes a hard disk connector and a motherboard connector. The hard disk connector is used to plug in the hard disk, and the motherboard connector is used to electrically connect to the motherboard, so as to realize the formation of a signal path of motherboard - passive hard disk backplane - disk array card - hard disk. The passive hard disk backplane retains the mechanical connection and signal transfer functions, and places the active drive element on the disk array card, which can greatly reduce the failure rate of the hard disk backplane. When the active drive element of the disk array card fails, since the disk array card and the passive hard disk backplane are in a direct plug-and-play form, the disk array card can be directly pulled out for maintenance, thereby effectively improving the stability of the system and reducing the maintenance cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0014] Figure 1 It is a schematic structural diagram of a storage component provided by an embodiment of the present application;

[0015] Figure 2 It is a schematic layout diagram of a disk array card provided by an embodiment of the present application;

[0016] Figure 3 It is a schematic layout diagram of the first side of a passive hard disk backplane provided by an embodiment of the present application;

[0017] Figure 4 Schematic diagram of the layout of the second side of a passive hard disk backplane provided by an embodiment of the present application;

[0018] Figure 5 Schematic three-dimensional structure diagram of a tray provided under a disk array card in an embodiment of the present application;

[0019] Figure 6 Schematic three-dimensional structure diagram of a tray provided under a disk array card from another perspective in an embodiment of the present application;

[0020] Figure 7 Enlarged view at the second end of the tray body;

[0021] Figure 8 Schematic top view of a tray provided under a disk array card in an embodiment of the present application;

[0022] Figure 9 Schematic bottom view of a tray provided under a disk array card in an embodiment of the present application;

[0023] Figure 10 Schematic topological structure diagram of a storage component provided by an embodiment of the present application. Detailed implementation manners

[0024] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the protection scope of the present application.

[0025] It should be noted that in the description of the present application, the terms "include", "comprise" or any other variant thereof are intended to cover a non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or further includes elements inherent to such process, method, article or device. The terms "first", "second", etc. in the present application are used to distinguish similar objects, rather than to describe a specific order or sequence.

[0026] In order to enable those skilled in the art of the present technology to better understand the solution of the present application, the present application will be further described in detail below in conjunction with the accompanying drawings and specific implementation manners.

[0027] In a server storage architecture, hard disks usually need to implement data management through a RAID controller. The traditional implementation uses a RAID card in the form of a PCIe standard card, which is connected to the motherboard PCIe slot through a gold finger, and the downstream interface is connected to the hard disk backplane through a cable. In addition, the architecture with the RAID chip integrated on the motherboard is also connected to the hard disk backplane through a cable. In the existing such RAID architecture, the cable is connected to the backplane inside the chassis. To replace the RAID card, all cables need to be disconnected and the chassis needs to be opened. For example, in a 1U / 2U server where a standard PCIe card is vertically inserted into the motherboard slot, the tail of the card is close to the side panel of the chassis. When replacing it, the fan module or other expansion cards need to be removed first, and there is insufficient operating space. A single RAID card usually connects 2-4 Mini-SAS cables (each containing 4-8 channels). When multiple cards are deployed, the cables are intertwined and prone to signal crosstalk. Moreover, when plugging and unplugging, the corresponding relationship of the cables needs to be marked, which is time-consuming and error-prone. In addition, the hard disk backplane in the prior art includes active devices such as a voltage regulation module and a CPLD, and the failure rate of active devices is relatively high. For example, a CPLD logic failure may cause misreporting of the hard disk status (such as abnormal indicator lights), and it is necessary to troubleshoot layer by layer through the server management port or diagnostic tools, increasing the repair time. According to statistics, the failure of the active backplane accounts for 30%-40% of the server storage failures, especially in a high-density rack environment, which is more serious. Once the hard disk backplane fails, it is difficult to troubleshoot and repair the problem, which not only affects the normal operation of the server, but also increases the maintenance cost and time cost. If it is necessary to maintain the hard disk backplane, it is necessary to disassemble and take out the hard disk backplane from the chassis, which is extremely inconvenient during maintenance operations. Therefore, there is an urgent need for a new technical solution to solve these problems.

[0028] In view of the above problems, an embodiment of the present application provides a storage component. Figure 1 The following is a schematic structural diagram of a storage component provided by an embodiment of the present application, as Figure 1 shown, the storage component provided by the present application includes a disk array card 10 and a passive hard disk backplane 20.

[0029] The disk array card is a "bridge" connecting physical disks and the host. It balances data security, performance, and cost through hardware-level RAID technology and is a core component in scenarios such as enterprise storage and servers. When selecting, the RAID level and the specifications of the card (such as interface type, cache size, and supported number of disks) need to be matched according to requirements (such as whether redundancy is required, performance priority, and budget).

[0030] The hard disk backplane is a key component in devices such as servers and storage arrays for connecting and managing multiple hard disks. Essentially, it is a circuit board integrated with various interfaces and control functions. It is located between the hard disk tray and the motherboard / host, and is responsible for realizing the physical installation, signal transfer, power distribution, and status monitoring of the hard disks. It is the core hub of a multi-disk storage system.

[0031] The disk array card 10 in this application includes a conductive connection part 11 and at least one active driving element ( Figure 1 not shown in the figure). The passive hard disk backplane 20 includes a disk array card connector 21, a hard disk connector 22, and a motherboard connector ( Figure 1 not shown in the figure).

[0032] The disk array card 10 is plugged into the disk array card connector 21 through the conductive connection part 11. In this application, the conductive connection part 11 of the disk array card 10 serves as an interface with the passive hard disk backplane 20. By plugging into the disk array card connector 21, for example, it can transmit PCIe signals, SAS signals, power signals, etc. The disk array card 10 in this application can be directly plugged and unplugged with the passive hard disk backplane. The operation steps are simplified from the traditional "unboxing - unplugging wires - removing the card" to "directly pulling out". By inserting the conductive connection part 11 into the disk array card connector 21 of the passive hard disk backplane and removing the traditional cable connection, when maintaining the Raid card, there is no need to disconnect all cables and unbox as in the prior art. In this application, only the Raid card needs to be pulled out, realizing convenient maintenance similar to that of a "hard disk", avoiding the cumbersome process of plugging and unplugging cables, reducing the operation steps and potential impact on other components inside the server, and improving the convenience and efficiency of maintenance.

[0033] This application designs the hard disk backplane as a passive hard disk backplane, which only undertakes the connection function. The passive hard disk backplane 20 also includes a hard disk connector 22 and a motherboard connector. The hard disk connector 22 is used to plug in the hard disk 31; the motherboard connector is used for electrical connection with the motherboard. The disk array card 10 exchanges information with the motherboard connected to the motherboard connector through the disk array card connector 21. The disk array card 10 exchanges information with the hard disk 31 plugged in the hard disk connector 22 through the disk array card connector 21. For example, the motherboard inputs a PCIe 4.0 x4 signal to the passive hard disk backplane 20 through the motherboard connector, which is transmitted to the disk array card 10 through the disk array card connector 21. After being processed by the disk array card 10, a SAS signal is output to the hard disk connector 22 through the disk array card connector 21. This application sets the active drive elements that are prone to failure in the disk array card, that is, the disk array card 10 includes at least one active drive element, reducing the failure points of the passive hard disk backplane. Since there are no complex active drive elements on the passive hard disk backplane, the probability of being affected by factors such as electrical interference and power fluctuations is greatly reduced, thereby effectively reducing the overall failure rate. On the one hand, the reduction of the passive hard disk backplane improves the stability of the entire storage component and reduces the possibility of data loss or system crash caused by the failure of the passive hard disk backplane. On the other hand, since the disk array card can be very conveniently plugged and unplugged directly with the passive hard disk backplane, even if the active drive elements on the disk array card fail, the disk array card can be promptly and quickly pulled out for replacement or repair, shortening the time when the system stops running due to failure. Therefore, this application can also achieve rapid replacement of the faulty card through the plug-and-play design of the disk array card, avoiding the entire cabinet downtime caused by the failure of the hard disk backplane in the traditional solution.

[0034] In some alternative embodiments, the active drive element includes at least one of a controller for hard disk status detection and control, a voltage conversion module for voltage conversion, and a disk array chip for hard disk management.

[0035] Figure 2 It is a layout schematic diagram of a disk array card provided by an embodiment of this application, as Figure 2 shown, the active drive elements set in the disk array card in this application may include a controller 121 for hard disk status detection and control, a voltage conversion module 122 for voltage conversion, and a disk array chip 123 for hard disk management.

[0036] Among them, the controller 121 for hard disk status detection and control can be, for example, a CPLD (Complex Programmable Logic Device). As the core component of hardware logic control, the CPLD (Complex Programmable Logic Device) is used for the efficient cooperation and stable operation between the hard disk and the disk array card. For example, it can detect the insertion / removal status of the hard disk in real time, coordinate the on / off of power and data signals, avoid current surges or signal interference during hot plugging, and ensure system stability (such as triggering the disk array card to update the hard disk list). It collects the operating status of the hard disk (such as temperature, error count, working mode), the status of the backplane fan, the power status, etc., and reports them to the server management controller for use by the monitoring system. It synchronizes the data transfer timing between the disk array card and multiple hard disks, processes logic such as clock synchronization and data strobe in parallel or serial communication, and avoids signal conflicts (such as arbitration during concurrent access of multiple hard disks). It converts the original signals of the hard disk into a format recognizable by the disk array card to ensure cross-device compatibility; parses and forwards the control instructions of the disk array card, and receives and interprets the response signals of the hard disk to play the role of a bridge at the protocol layer, etc.

[0037] The functions of the voltage conversion module 122 mainly include voltage conversion, voltage regulation, power management, protection mechanism, efficiency optimization, and cooperation with other components. These functions ensure that each component can obtain a stable and appropriate power supply, thus guaranteeing the reliable operation of the entire storage component. There are various different electronic components on the disk array card, such as disk array chips, CPLDs, etc. These components each require specific voltages to work properly. Different chips and components may require voltages with different amplitudes. The voltage conversion module converts the input power supply voltage (such as 12V) into the precise voltage values required by these components, ensuring that each component can operate stably in a suitable voltage environment.

[0038] The disk array chip 123 is the core component of the disk array card, mainly responsible for handling various functions of hard disk management. For example, in terms of data processing, the disk array chip can optimize data distribution and improve read / write speed according to the processing of input / output requests. For example, in the striping mode, the data is divided into blocks and distributed to multiple disks for parallel reading and writing to improve the speed. In the redundant mode, such as Raid 5, it calculates parity check information to ensure data security and can recover data when a disk fails.

[0039] The voltage conversion module is prone to failures (such as capacitor aging and MOS transistor damage) due to voltage fluctuations and poor heat dissipation during long-term operation. The CPLD has complex logic, and there may be loopholes in custom logic programming. Moreover, the signal synchronization requirements of the multi-disk hard disk backplane increase the hardware complexity. According to statistics, the failures of the active hard disk backplane account for 30%-40% of the server storage failures. Especially in a high-density rack environment, when the temperature > 30°C, the failure rate doubles. For the above reasons, in the embodiments of the present application, at least one of the active drive components arranged on the hard disk backplane in the prior art, such as a controller for hard disk status detection and control, a voltage conversion module for voltage conversion, and a disk array chip for hard disk management, is arranged on the disk array card, thereby reducing the failure rate of the hard disk backplane. The hard disk backplane is usually fixed inside the chassis, and it is necessary to disassemble the surrounding hardware (such as hard disks and fan modules) to replace it, and it is also necessary to reconfigure the cable connections. In the present application, the easily failed active drive components are arranged on the disk array card. Even if these active drive components fail, they can be replaced or maintained by conveniently pulling out the disk array card, without disassembling the hard disk backplane as in the prior art.

[0040] In some alternative embodiments, the disk array card includes a board body, and the disk array chip is located at the middle position of the board body. A heat dissipation structure is arranged above the disk array chip.

[0041] Since the disk array chip generates more heat during operation, a heat dissipation structure needs to be arranged above it to ensure that the disk array chip can operate stably within a suitable temperature range.

[0042] The middle position of the board body is convenient for configuring a large-area heat dissipation structure, and it is usually on the key path of the internal air flow in the chassis (such as a through-air duct from front to back), which can form an efficient heat dissipation cycle and quickly take away the heat generated during the operation of the disk array chip, avoiding performance degradation or failures caused by overheating.

[0043] The middle position of the board body is far from the interfaces at the edge of the board (such as heat-generating components of the conductive connection part), reducing the thermal interference of peripheral components on the disk array chip, ensuring that the heat dissipation structure can focus on the temperature control of the disk array chip, and improving the heat dissipation efficiency.

[0044] As the data processing core, the disk array chip needs to interact frequently with components such as the conductive connection part and the CPLD. The wiring distance from the middle position of the board body to each component of the board body is shorter and symmetrical, which can reduce signal delay, attenuation and electromagnetic interference, and ensure the stability and rate of data transmission. The middle of the board body is convenient for balanced wiring, reducing the problems of parasitic capacitance / inductance caused by long-distance wiring and optimizing the signal quality.

[0045] The middle position of the board body is the physical center of gravity. The combination of the heavy-duty heat dissipation structure and the disk array chip here can reduce the risk of bending or deformation of the board body and improve the reliability of the hardware structure.

[0046] In some alternative embodiments, the passive hard disk backplane includes a backplane body, and the disk array card connector and the hard disk connector are located on the same side of the backplane body.

[0047] In the embodiments of the present application, the disk array card connector and the hard disk connector are arranged on the same side of the backplane body. Figure 3 FIG. 1 is a schematic diagram of the layout of the first side of a passive hard disk backplane provided by an embodiment of the present application. For example, the disk array card connector 21 and the hard disk connector 22 are located on the first side of the backplane body 200.

[0048] Both the hard disk and the disk array card face one side. During installation, they can be directly inserted from the same direction without the need to operate on both sides of the backplane body, improving the installation efficiency. When it is necessary to replace the hard disk or the disk array card, only operations need to be performed on the same side, avoiding additional disassembly steps caused by scattered connectors, reducing the maintenance time and the risk of misoperation.

[0049] In some alternative embodiments, the motherboard connector and the disk array card connector are located on different sides of the backplane body.

[0050] Figure 4 FIG. 2 is a schematic diagram of the layout of the second side of a passive hard disk backplane provided by an embodiment of the present application. As Figure 3 and Figure 4 shown, the motherboard connector 23 is arranged on the second side opposite to the first side. The first side can be, for example, the front of the backplane body, and the second side can be, for example, the back of the backplane body.

[0051] By arranging the disk array card connector 21 and the hard disk connector 22 on the same side of the backplane body 200, the data transmission lines between the disk array card and the hard disk can be centrally arranged on the first side of the backplane body, while the motherboard connector is located on the other side, enabling the lines of different functional modules to be concentrated separately, avoiding interweaving with each other, reducing the complexity of wiring, and facilitating the installation and maintenance personnel to plan and organize the lines. This layout method makes full use of the two sides of the backplane body, enabling the connection between the disk array card, the hard disk and the motherboard to be more compact, realizing the connection of more devices within a limited space, improving the integration of the devices, and being beneficial to reducing the volume of the entire system.

[0052] The disk array card, hard disk, and motherboard all generate electromagnetic signals during operation. By setting the motherboard connector, disk array card connector, and hard disk connector on different sides of the backplane body, the signal transmission lines between them can be kept as far away as possible, reducing the possibility of electromagnetic interference, improving the stability and reliability of signal transmission, and helping to ensure the accuracy of data transmission and the stability of the system.

[0053] Since the signal lines of different modules are separated, crosstalk between signals is reduced, which can improve the signal quality. Especially for scenarios of high-speed data transmission, such as a large amount of data interaction between the disk array and the motherboard, it helps to improve the overall performance of the system.

[0054] Distributing different connectors on different sides of the backplane body can form a more reasonable heat dissipation channel after the device is installed. For example, the heat generated by the disk array card and the hard disk can be dissipated through the first side of the backplane body, while the heat generated by the motherboard can be dissipated through the other side, avoiding the accumulation of heat in a local area, being conducive to improving the heat dissipation efficiency of the entire system, ensuring that the device operates in a stable temperature environment, and extending the service life of the device.

[0055] When maintenance is required for the disk array card, hard disk, or motherboard, since their connectors are located on different sides respectively, maintenance personnel can more easily find the corresponding connectors without being interfered by other devices, reducing the difficulty and workload of maintenance and improving the maintenance efficiency.

[0056] When upgrading the system, such as replacing a disk array card, hard disk, or motherboard with higher performance, this layout makes the upgrade process simpler. Only operations need to be carried out on the corresponding sides respectively, without the need for large-scale adjustment of the wiring and layout of the entire system.

[0057] In some alternative embodiments, the passive hard disk backplane further includes a power connector. The power connector and the motherboard connector are located on the same side of the backplane body. The power connector transmits the power signal to the disk array card through the disk array card connector.

[0058] For example, refer to Figure 4 , in the embodiment of the present application, the passive hard disk backplane further includes a power connector 24, which is used to receive the power signal and transmit the power signal to the disk array card through the disk array card connector on the passive hard disk backplane. Among them, the power connector 24 and the motherboard connector 23 are both located on the second side of the backplane body 200.

[0059] The power connector and the motherboard connector are both located on the same side (such as the back side of the backplane, close to the motherboard position), which can make the connection directions of the power line and the motherboard signal line (such as MCIO, GenZ, etc.) consistent, avoid the cables from crossing and winding in the chassis, reduce the wiring complexity, and improve the assembly efficiency.

[0060] The power connector 24 and the motherboard connector are concentrated on the same side, and a shorter cable can be used to complete the connection, reducing cable costs and reducing signal attenuation or power loss caused by excessive cable length. Centralized wiring can avoid cables being scattered in different areas of the chassis, improve the cleanliness and heat dissipation effect inside the chassis, reduce obstruction to airflow inside the chassis, and improve heat dissipation efficiency (especially in high-density storage scenarios, heat dissipation is crucial to system stability).

[0061] Placing the power connector and the motherboard connector on the same side can free up space on the other side of the backplane body (such as the front side for hard drive and Raid card installation), making the internal structure of the chassis more compact and allowing more space on the other side to accommodate the hard drive.

[0062] When the backplane body needs to be repaired or replaced, it is only necessary to disconnect the power supply and the mainboard on the same side. There is no need to operate in multiple areas of the chassis, which improves maintenance convenience, shortens maintenance time, and reduces the risk of misoperation.

[0063] In some optional implementations, the passive hard disk backplane includes a plurality of hard disk connectors, which are located on both sides of the disk array card connector and are symmetrically arranged relative to the disk array card connector.

[0064] See for example Figure 3 , two hard disk connectors 22 are exemplarily provided. The two hard disk connectors 22 are respectively located on both sides of the disk array card connector 21 , and the two hard disk connectors 22 are symmetrically arranged relative to the disk array card connector 21 . Figure 3 The two hard disk connectors 22 are merely provided as an example, and are not intended to limit the number of hard disk connectors in the present application. In other embodiments, the number of hard disk connectors may be provided according to actual needs. For example, if four hard disk connectors are included, two hard disk connectors may be provided on both sides of the disk array card connector.

[0065] In the embodiment of the present application, multiple hard disk connectors are arranged on both sides of the disk array card connector and are symmetrically arranged relative to the disk array card connector, which can improve the structural stability from the perspective of physical layout. Figure 3 For example, placing the disk array card connector between two hard disk connectors can make the passive hard disk backplane more balanced in physical structure. This symmetrical layout helps reduce stress concentration caused by uneven distribution of components and reduces the risk of deformation of the passive hard disk backplane during installation, removal or transportation, thereby improving the mechanical stability of the entire storage assembly.

[0066] In the embodiments of the present application, multiple hard disk connectors are arranged on both sides of the disk array card connector and symmetrically arranged with respect to the disk array card connector, which can shorten the signal transmission path. The disk array card needs to interact with multiple hard disks simultaneously. The multiple hard disk connectors are arranged on both sides of the disk array card connector and symmetrically arranged with respect to the disk array card connector, enabling the signal transmission paths between the disk array card connector and the hard disk connectors on both sides to be relatively short and symmetrical. The shorter transmission path can reduce signal attenuation and interference, improving the stability and reliability of data transmission. The symmetrical layout helps to reduce the mutual interference between different signal lines. Since the connection lines between the disk array card connector and the hard disk connectors on both sides are relatively independent and close in distance, the electromagnetic interference between them can be effectively controlled, thus ensuring the accuracy and integrity of data transmission.

[0067] The above-mentioned symmetrical layout makes the connection relationship between the set disk array card and the hard disks clearer. Maintenance personnel can more easily check the connection status between each connector, quickly locate the fault point, and shorten the fault troubleshooting time.

[0068] In some alternative embodiments, for example Figure 2 as shown, the disk array card may further include a temperature sensor 13. The temperature sensor 13 is located on one side of the disk array card far from the conductive connection part.

[0069] The high-power consumption components of the disk array card (such as the disk array chip, voltage conversion module) are usually distributed in the area far from the conductive connection part. The temperature sensor is close to these components, enabling more direct and accurate monitoring of the real-time temperature of the core heat generation area, avoiding temperature monitoring delay or error caused by too long a distance.

[0070] The conductive connection part of the disk array card is mainly responsible for signal transmission, with relatively low heat generation, and is close to the motherboard slot, and may be affected by the air flow in other areas of the chassis (such as fans, power supplies). Being far from the gold finger can avoid interference from external non-related heat sources to the sensor data, ensuring that the temperature monitoring targets the key components of the disk array card itself.

[0071] The high-frequency signals near the conductive connection part of the disk array card may generate electromagnetic interference. As an analog signal component, if the temperature sensor is close to the conductive connection part of the disk array card, the measured data may be distorted due to electromagnetic coupling. Keeping away from the conductive connection part of the disk array card can reduce signal interference, improving the stability and data reliability of the temperature sensor. The temperature sensor cable being far from the high-speed signal lines in the area of the conductive connection part of the disk array card can also avoid the interference risk caused by wiring crossing or parallel arrangement.

[0072] After the conductive connection part of the disk array card is inserted into the disk array card connector, if the temperature sensor is located on the side far from the conductive connection part, it can avoid damage to the temperature sensor or its connecting wire caused by mechanical stress during the insertion and removal of the disk array card, and extend the hardware life.

[0073] In some alternative embodiments, a tray is provided below the disk array card, and the tray is used to carry the disk array card.

[0074] On the one hand, the tray design provides mechanical support for the disk array card, and on the other hand, it can ensure the precise alignment of the conductive connection part (such as the gold finger conductive part) of the disk array card with the disk array card connector, avoiding reverse insertion or poor contact (such as bending of the gold finger conductive part due to uneven force). The tray can provide a guiding function, enabling the conductive connection part of the disk array card to be smoothly inserted into the disk array card connector, reducing physical damage during the insertion and removal process.

[0075] In some alternative embodiments, the tray includes a tray body, and the tray body includes a carrying slot. The carrying slot is used to place the disk array card. A first opening is provided at the first end of the tray body, and the conductive connection part of the disk array card extends out from the first opening.

[0076] A trigger part and a movable part are provided at the second end of the tray body opposite to the first end of the tray body. The trigger part is connected to the first end of the movable part through a snap structure. The second end of the movable part is connected to the second end of the tray body through a rotating shaft. A spring is sleeved on the rotating shaft, and the two ends of the spring respectively abut against the movable part and the tray main body.

[0077] When pulling out the disk array card, pressing the trigger part drives the snap structure to move to pop out the movable part; when inserting the disk array card, pressing the movable part, the movable part is locked with the snap structure.

[0078] Figure 5 It is a three-dimensional structure schematic diagram of a disk array card with a tray provided below according to an embodiment of the present application. Figure 6 It is a three-dimensional structure schematic diagram of a disk array card with a tray provided below from another perspective according to an embodiment of the present application. Figure 7 It is an enlarged view at the second end of the tray body. Figure 8 It is a top view schematic diagram of a disk array card with a tray provided below according to an embodiment of the present application. Figure 9 It is a bottom view schematic diagram of a disk array card with a tray provided below according to an embodiment of the present application.

[0079] As Figure 5 and Figure 6 shown, the tray includes a tray body 41, and the tray body 41 includes a carrying slot. The carrying slot is used to place the disk array card 10. A first opening 411 is provided at the first end of the tray body 41, and the conductive connection part 11 of the disk array card 10 extends out from the first opening 411.

[0080] As shown Figure 7 in the figure, a trigger part 42 and a movable part 43 are provided at the second end of the tray body opposite to the first end of the tray body. The trigger part 42 is connected to the first end of the movable part 43 through a snap structure 44. The second end of the movable part 43 is connected to the second end of the tray body through a rotating shaft 45. A spring 46 is sleeved on the rotating shaft 45, and the two ends of the spring 46 respectively abut against the movable part 43 and the tray body.

[0081] When it is necessary to pull out the disk array card, press the trigger part 42, and the trigger part 42 drives the snap structure 44 to move to eject the movable part 43, and the disk array card can be pulled out by pulling the movable part 43.

[0082] When it is necessary to insert the disk array card, press the movable part 43, and the movable part 43 is locked with the snap structure 44, so that the conductive connection part of the disk array card can be inserted into the disk array card connector more firmly.

[0083] In this application, the design of the bearing slot provides a customized installation space for the disk array card, ensuring the accurate position of the disk array card in the tray, and avoiding the contact deviation or looseness of the conductive connection part and the disk array card connector due to shaking. The first opening allows the conductive connection part to extend out, and the rest of the disk array card is wrapped by the tray body, forming a physical limit, enhancing the alignment accuracy during insertion, and reducing the alignment error during manual insertion and extraction. When inserting, by pressing the movable part, it is locked with the snap structure, forming a mechanical locking force, ensuring the close fit of the conductive connection part and the disk array card connector. Even if the device vibrates or is transported, contact failure can be avoided, especially suitable for scenarios with high stability requirements such as servers. The spring on the rotating shaft provides a reset elastic force when pulling out, and pressing the trigger part can eject the movable part through the snap structure, reducing the operation intensity and being suitable for maintenance in narrow spaces. The locking function of the movable part during insertion is completed through a "press-latch" action, without the need for additional tools, improving the maintenance efficiency. When pulling out, it is necessary to actively press the trigger part to release the lock, preventing the card body from accidentally falling off due to collision or accidental touch. The tray integrates the installation, locking, and connection functions of the disk array card, with a compact structure, suitable for the narrow space layout of high-density chassis (such as rack-mounted servers).

[0084] In some alternative embodiments, the tray includes a tray body, and the tray body includes a bearing slot. The bearing slot is used to place the disk array card. A second opening is provided on the top surface of the tray body, and the top surface is the surface opposite to the active drive element of the disk array card. At least one heat dissipation hole is provided at the second end and / or the bottom surface of the tray body. The bottom surface is the surface opposite to the top surface.

[0085] For example, still taking Figure 5 and Figure 6For example, a second opening 412 is provided on the top surface of the tray body 41, and the top surface is the surface opposite to the active driving element of the disk array card. At least one heat dissipation hole is provided at the second end of the tray body and / or the bottom surface of the tray body. The bottom surface is the surface opposite to the top surface. As Figure 5 shown, a heat dissipation hole 413 is provided at the second end of the tray body. As Figure 9 shown, at least one heat dissipation hole 413 is provided on the bottom surface of the tray body.

[0086] In the embodiment of the present application, a second opening is provided on the top surface of the tray body. For example Figure 5 and Figure 6 the top surface of the tray body in is an open structure, and the second opening on the top surface of the tray body directly corresponds to heat-generating components such as the active driving element of the disk array card, so that the surface of the active driving element is in direct contact with the outside air or the chassis heat dissipation channel, avoiding heat accumulation caused by the tray body being completely wrapped. In the embodiment of the present application, at least one heat dissipation hole can also be provided at the second end of the tray body and / or the bottom surface of the tray body to achieve further heat dissipation in the bottom area. The heat dissipation hole can be, for example, a grid-shaped, strip-shaped or irregularly shaped hollow structure. The present application does not limit the area of the heat dissipation hole, and the area of the heat dissipation hole can be set according to the actual heat dissipation requirements. The convection path formed by the bottom heat dissipation hole and the top opening can strengthen the natural convection or forced convection effect. If the heat dissipation hole is provided at the second end of the tray body (usually close to the rear of the chassis), it can be docked with the air extraction area of the chassis tail fan, and the "thermal siphon effect" can be used to accelerate heat dissipation, which is especially suitable for high-density rack environments, avoiding heat dissipation dead corners caused by narrow space. The tray body releases heat through the second opening and the heat dissipation hole, reducing the accumulation of heat conduction between the disk array card and the tray, and avoiding the deformation of the plate caused by temperature difference (such as warping), protecting the reliability of the component solder joints and the conductive connection parts. The second opening and the heat dissipation hole can reduce the weight of the tray while maintaining the bearing strength through structural design, avoiding the misalignment of the disk array card installation caused by the deformation of the tray. The second opening on the top surface allows the operation and maintenance personnel to directly observe the state of the active driving element without removing the tray, improving the efficiency of troubleshooting.

[0087] In some alternative embodiments, the tray includes a tray body, and the tray body includes a bearing slot. The bearing slot is used to place the disk array card. The tray further includes an insulating layer, and the insulating layer is located between the tray body and the disk array card. The insulating layer is used to prevent the disk array card from directly contacting the tray body and causing a short circuit.

[0088] The insulating layer can cover all or part of the bottom surface of the tray body, and the material of the insulating layer can include, for example, polyester film, polypropylene film or polyimide film, etc.

[0089] The tray body may further include a tray side, and the side and the bottom are smooth and flat, facilitating insertion and extraction. The tray body may also be provided with screw holes (such as the screw hole 414 in Figure 9 ) for fixing the disk array card.

[0090] In some alternative embodiments, for example, in Figures 5 to 8 , a buffer layer 415, such as foam, may also be provided on the tray. When inserting into the tray body, the buffer layer is used to buffer the impact force to prevent damage to the disk array card.

[0091] In some alternative embodiments, such as Figure 5 , Figure 7 and Figure 8 as shown, a light guide structure 47 may also be provided on the tray. The light guide structure 47 is provided at the second end of the tray body and extends from the bearing slot to the outside of the second end of the tray body, for conducting the light of the indicator lamp of the disk array card, so that when the disk array card is set in the rear opening of the chassis through the tray, the status of the disk array card can be observed through the rear opening of the chassis.

[0092] In some alternative embodiments, the conductive connection part of the disk array card may be, for example, a gold finger conductive part. The disk array card is inserted and connected to the disk array card connector of the passive hard disk backplane through its gold finger conductive part. This unique connection method and structural design enable the disk array card to have the pull-out characteristics similar to those of a hard disk and can be directly pulled out from the passive hard disk backplane. Compared with the traditional connection method of disk array cards, it greatly increases the convenience of maintenance and eliminates the need to open the chassis cover and insert and remove complex cables.

[0093] In some alternative embodiments, the disk array card may be, for example, an E1.S specification disk array card. E1.S is a compact hardware form following the EDSFF (Enhanced Data Storage Form Factor) standard and is mainly used in high-density data center scenarios. The EDSFF standard defines various storage device forms (such as E1.L, E1.S, E3, etc.), and the E1.S form takes "small size, high integration, and hot pluggability" as the core design goal. Its shape is usually a cuboid, and its size is significantly smaller than that of traditional PCIe cards (such as standard full-length double-width cards), which is suitable for high-density deployment in limited space. The Raid card in the E1.S form adopts a standardized size (for example, the typical size is 110mm×15mm×80mm, subject to the EDSFF specification), and its volume is only 1 / 3 to 1 / 2 of that of traditional PCIe Raid cards, and can be densely arranged horizontally or vertically in the chassis, significantly improving the utilization rate of the rack space.

[0094] In some alternative embodiments, the disk array card may also be provided with a storage module for storing the configuration information of the disk array card. For example Figure 2 as shown, the storage module may be, for example, a FRU EEPROM (Field Replaceable Unit Electrically Erasable Programmable Read-Only Memory) 14.

[0095] The FRU EEPROM can store configuration information such as relevant asset information of the disk array card, such as device model, serial number, production date, etc. This helps enterprises manage and track the assets of the devices, facilitating the statistics of information such as the number of devices, usage status, maintenance records, etc., and improving the efficiency and accuracy of device management.

[0096] The FRU EEPROM can store configuration information such as the array mode, disk mapping relationship, Raid level, etc. of the disk array card. This information is crucial for the normal operation and management of the system. Storing it in the FRU EEPROM facilitates the administrator to query and modify the configuration at any time, without the need to reset or search for configuration files in other storage locations.

[0097] When replacing the disk array card or reinstalling the system, the configuration information in the FRU EEPROM can be quickly read and applied, greatly reducing the time and workload of system configuration. The administrator does not need to manually reconfigure the array card. Just install the new array card, and the system can automatically obtain the configuration information from the FRU EEPROM and apply it to achieve rapid deployment and recovery.

[0098] For a remotely managed system, the FRU EEPROM enables the administrator to remotely obtain the configuration information and status of the disk array card through the network for remote monitoring and management. Even when it is physically impossible to directly access the device, the operation status of the device can be timely understood, necessary configuration adjustments and troubleshooting can be carried out, reducing the maintenance cost and management difficulty.

[0099] In some alternative embodiments, the sizes of the disk array card connector and the hard disk connector may also be set to be different.

[0100] If the device is forcibly inserted into a mismatched interface, it may cause the gold fingers to bend, the connector pins to deform or short-circuit. The size difference directly prevents such an operation, protecting the precision hardware from physical damage and avoiding unplanned downtime caused by incorrect insertion.

[0101] In the embodiments of the present application, the disk array card connector and the hard disk connector are set to have different sizes (such as length, width, pin layout or shape), for example Figure 1As shown, the hard disk connector is longer than the disk array card connector. The disk array card connector has a unique anti-fooling notch. This design makes it impossible for the gold finger conductive part of the disk array card connector to be inserted into the hard disk connector, and vice versa, eliminating the possibility of "misinsertion" at the physical level. This is especially suitable for maintenance personnel to avoid human errors when quickly replacing equipment (such as operating while wearing gloves or in a low-light environment). Connectors of different sizes have obvious visual differences, and maintenance personnel can quickly identify the interface type without relying on labels or documents. Especially in the scenario of a high-density backplane (such as dozens of interfaces side by side), it significantly improves the operation speed and reduces the time cost of "finding the correct interface".

[0102] In the embodiment of the present application, only the size parameters need to be adjusted in the design stage of the passive hard disk backplane mold and the device interface, and there is no need for complex electronic detection logic (such as incorrect insertion detection at the software level) to achieve a highly reliable anti-error mechanism, which can reduce costs.

[0103] In some alternative embodiments, the passive hard disk backplane may further set a first identifier around the disk array card connector and / or a second identifier around the hard disk connector.

[0104] In the embodiment of the present application, by setting identifiers for the disk array card connector and the hard disk connector, the purpose of quickly positioning the target connector by reducing the risk of human misjudgment through visual cues is achieved. The form of the identifier in the embodiment of the present application is not limited. For example, it can be a color (such as red around the disk array card connector and blue around the hard disk connector), a graphic symbol, a text label, or a tactile identifier such as a physical bump / groove. The graphic symbol and the text label can be formed by silk-screening, for example.

[0105] When the size difference between the two types of connectors is not obvious, relying on size anti-fooling may result in the situation of "finding the error only when trying to insert". The identifier provides a pre-judgment basis, excluding incorrect options through the identifier before contacting the connector, and avoiding ineffective operations (such as repeatedly trying to insert).

[0106] Figure 10 This is a schematic diagram of the topological structure of a storage component provided by the embodiment of the present application. As Figure 10 shown, the upstream PCIE X4 signal expands into 2 SAS signals (supporting SAS / SATA3.0) to perform Raid management on the hard disks on the passive hard disk backplane. The passive hard disk backplane supports 2 SAS / SATA hard disks (corresponding to Figure 10For the two hard disk connectors), a passive design is adopted, only for the connection of the hard disk and the disk array card, and the transfer of the upstream PCIE signal. The motherboard connector uses 1 MCIO X4 connector (supporting PCIE4.0 rate). The SAS signal output by the disk array card (supporting SAS / SATA3.0) is transmitted to the passive hard disk backplane through the disk array card connector, such as the GEN Z connector (Generation Z Connector, a new generation of high-speed connector), and 2 hard disk connectors are sent. An FRU EEPROM is placed on the disk array card to store the configuration information of the disk array card. The disk array card connector of the passive hard disk backplane can also send the hard disk status STATE to the CPLD. The passive hard disk backplane can also include a first indicator light, such as the design of 3 indicator lights: the Active indicator light (activity indicator light), the Locate indicator light (positioning indicator light), and the Error indicator light (fault indicator light) of the hard disk. Other control signals are implemented through the CPLD on the disk array card.

[0107] The Active indicator light can be used to indicate whether the hard disk is performing data read and write operations (i.e., the "active state"). When the hard disk reads data (such as in response to a server request) or writes data (such as storing user files), the Active light usually stays on continuously or blinks; when there is no data operation, the indicator light may go out or stay on constantly (depending on the design). When the server batch-reads the hard disk data, the Active light of the corresponding hard disk blinks rapidly; when the hard disk is idle, the Active light may stay stably dim or go out. The Locate indicator light can be used to help the administrator quickly locate a specific hard disk in a multi-hard disk environment (such as the massive hard disks of a rack-mounted server). When maintenance requires replacing a faulty hard disk, the corresponding slot can be quickly found through the Locate indicator light. In a multi-hard disk cluster, quickly confirm the physical location of a certain hard disk. The Error indicator light can be used to warn that the hard disk has a fault or an abnormal state. Common hardware faults include disk bad sectors, circuit board damage, power supply abnormalities, file system damage, data read and write failures, poor contact between the hard disk and the backplane, cable faults, etc. For example, it can be set to be constantly red or blinking, and some designs can be accompanied by a buzzer alarm.

[0108] The 12V power signal of the passive hard disk backplane gets power from the passive hard disk backplane through the disk array card connector. The voltage conversion module of the disk array card mainly realizes the voltage conversion from 12V to each module on the board, and is used to supply power to the CPLD, the disk array card chip, each indicator light, the temperature sensor, the FRU EEPROM, etc. Exemplary Figure 10It includes multiple voltage conversion modules, such as P1V8 VR (converting voltage to 1.8V), P1V5 VR (converting voltage to 1.5V), P0V85 VR (converting voltage to 0.85V), P5V VR (converting voltage to 5V), P3V3 VR (converting voltage to 3.3V), which are used to supply power to modules with different voltage requirements. Figure 10 It is also provided with multiple fuses (EFUSE) for overcurrent protection. The disk array card connector can also send power control and status indication signals (such as Figure 10 P12V_EN / PG, P3V3_EN / PG in it) to the corresponding voltage conversion modules. CPLD, temperature sensor, FRU EEPROM, etc. communicate with the motherboard through the I2C bus, disk array card connector, passive hard disk backplane, and motherboard connector. The disk array card can also be provided with a second indicator light, which is used to indicate the status information of the disk array card, etc. The disk array card chip can also interact with the PCIE_RST reset signal, PCIE_CLK clock signal, PCIE X4 data signal, and SAS hard disk signal through the disk array card connector. A flash memory module FLASH and an oscillator module (Oscillator, OSC) can also be set in the disk array card. The flash memory module is used to store the firmware information of the disk array card chip; the oscillator module is used to provide a clock signal to the disk array card chip.

[0109] The embodiment of the present application also provides a storage system, including the storage component in any of the above embodiments, and at least one hard disk connected to the hard disk connector of the passive hard disk backplane.

[0110] For the description of the features in the corresponding embodiments of the storage system in the present application, reference can be made to the relevant descriptions of the corresponding embodiments of the storage component, which will not be elaborated here one by one.

[0111] The embodiment of the present application also provides an electronic device, including the storage system in the above embodiment. The electronic device can be, for example, a server.

[0112] In some optional embodiments, the electronic device provided by the embodiment of the present application further includes a chassis. One side of the passive hard disk backplane provided with the disk array card connector faces the rear opening of the chassis.

[0113] The rear of the chassis is usually a maintenance area (such as the rear expansion slot and hot-swap interface of a rack-mounted device). One side of the passive hard disk backplane provided with the disk array card connector faces the rear opening of the chassis, which allows maintenance personnel to directly plug and unplug the disk array card from the rear without disassembling the chassis cover, facilitating maintenance.

[0114] Those skilled in the art may further realize that the modules and algorithm steps of each example described in combination with the embodiments disclosed herein can be implemented by electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described according to functions in the above description. Whether these functions are executed in a hardware or software manner depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods for each specific application to implement the described functions, but such implementation should not be considered to exceed the scope of this application.

[0115] The above has introduced the storage component provided in this application in detail. Specific examples are used herein to elaborate on the principle and implementation manner of this application. The description of the above embodiments is only used to help understand the method and its core idea of this application. It should be noted that for those of ordinary skill in the art in this technical field, without departing from the principle of this application, several improvements and modifications can be made to this application, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A storage component, characterized in that, Including: Disk array card; The disk array card includes a conductive connection part and at least one active driving element; Passive hard disk backplane; The passive hard disk backplane includes a disk array card connector, a hard disk connector, and a motherboard connector; The disk array card is plugged into the disk array card connector through the conductive connection part; the orthographic projection of the disk array card on the passive hard disk backplane overlaps with the passive hard disk backplane; the hard disk connector is used for plugging in a hard disk; the motherboard connector is used for electrically connecting to a motherboard; The disk array card is used for information interaction with the motherboard connected to the motherboard connector through the disk array card connector; the disk array card is also used for information interaction with the hard disk plugged into the hard disk connector through the disk array card connector.

2. The storage component according to claim 1, wherein The active driving element includes at least one of a controller for hard disk status detection and control, a voltage conversion module for voltage conversion, and a disk array chip for hard disk management.

3. The storage component according to claim 2, wherein The disk array card includes a board body, and the disk array chip is located at the middle position of the board body; a heat dissipation structure is arranged above the disk array chip.

4. The storage component according to claim 1, wherein The passive hard disk backplane includes a backplane body, and the disk array card connector and the hard disk connector are located on the same surface of the backplane body.

5. The storage component according to claim 4, characterized in that, The motherboard connector and the disk array card connector are located on different surfaces of the backplane body.

6. The storage component according to claim 4, wherein The passive hard disk backplane further includes a power connector; the power connector and the motherboard connector are located on the same surface of the backplane body; the power connector transmits a power signal to the disk array card through the disk array card connector.

7. The storage component according to claim 4, wherein, The passive hard disk backplane includes a plurality of hard disk connectors; the plurality of hard disk connectors are located on both sides of the disk array card connector and are symmetrically arranged with respect to the disk array card connector.

8. The storage component according to claim 1, characterized in that, A tray is arranged below the disk array card, and the tray is used for carrying the disk array card.

9. The storage component according to claim 8, wherein, The tray includes a tray body, and the tray body includes a carrying groove; the carrying groove is used for placing the disk array card; a first opening is arranged at the first end of the tray body, and the conductive connection part of the disk array card extends out from the first opening; A trigger part and a movable part are arranged at the second end of the tray body opposite to the first end of the tray body; the trigger part is connected to the first end of the movable part through a buckle structure; the second end of the movable part is connected to the second end of the tray body through a rotating shaft; a spring is sleeved on the rotating shaft, and two ends of the spring respectively abut against the movable part and the tray body; When pulling out the disk array card, pressing the trigger part drives the buckle structure to move to pop out the movable part; when inserting the disk array card, pressing the movable part, the movable part is locked with the buckle structure.

10. The storage component according to claim 8, wherein The tray includes a tray body, and the tray body includes a carrying slot; the carrying slot is used for placing the disk array card; a second opening is provided on the top surface of the tray body, and the top surface is the surface opposite to the active driving element of the disk array card; at least one heat dissipation hole is provided at the second end and / or the bottom surface of the tray body; the bottom surface is the surface opposite to the top surface.

11. The storage component according to claim 8, wherein, The tray includes a tray body, and the tray body includes a carrying slot; the carrying slot is used for placing the disk array card; the tray further includes an insulating layer; the insulating layer is located between the tray body and the disk array card.

12. The storage component according to claim 1, wherein The sizes of the disk array card connector and the hard disk connector are different; and / or; the passive hard disk backplane is provided with a first identifier around the disk array card connector and a second identifier around the hard disk connector.

13. A storage system, characterized in that, It includes a storage component according to any one of claims 1-12, and at least one hard disk connected to the hard disk connector of the passive hard disk backplane.

14. An electronic device, characterized in that, It includes a storage system according to claim 13.

15. The electronic device according to claim 14, wherein It includes a chassis; the surface of the passive hard disk backplane provided with the disk array card connector faces the rear opening of the chassis.

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