Substrate processing apparatus

Abstract

The invention provides a substrate processing apparatus. In order to take out a substrate (W) from one of a plurality of racks (11), a control unit of a substrate processing apparatus causes a hand (13) that does not support the substrate (W) to enter into a carrier, causes the hand (13) to rise in the carrier while monitoring an output from a tactile sensor (19A), and causes the hand (13) to take out the substrate (W) when the tactile sensor (19A) detects contact with the substrate (W). The hand (13) is raised from a contact height position (CNP) at which contact is detected on the basis of a preset upper movement amount (UW), and the hand (13) that supports the substrate (W) is withdrawn from the carrier at a raised position (DUP) at which the hand (13) is raised from the contact height position (CNP) by the upper movement amount (UW).

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus for processing a substrate. Examples of the substrate include a semiconductor substrate, a substrate for an FPD (Flat Panel Display), a glass substrate for a photomask, a substrate for an optical disc, a substrate for a magnetic disk, a ceramic substrate, a substrate for a solar cell, and the like. Examples of the FPD include a liquid crystal display device, an organic EL (electroluminescence) display device, and the like. Background Art

[0002] Conventional substrate processing apparatuses include: a carrier placement unit that places a carrier; and a transfer mechanism that transfers a substrate from the carrier on the carrier placement unit (for example, see Patent Document 1). The carrier includes a container and a plurality of shelves. The plurality of shelves are provided inside the container and are arranged in a vertically aligned manner. The transfer mechanism includes a hand that supports a single substrate in a horizontal posture. The substrates are classified into a plurality of types according to their shapes. The substrate processing apparatus changes the height position of the hand when inserting the hand between two adjacent shelves in the vertical direction of the carrier according to the shape (type) of the substrate.

[0003] Patent Document 2 discloses a substrate transfer robot having a robot hand. The robot hand includes a Y-shaped hand main body portion that serves as a portion for placing a substrate. Three tactile sensors for supporting the lower surface of the substrate in contact therewith are provided on the hand main body portion. The sensor elements of the tactile sensors can detect the force applied from the substrate in three axial directions (X-axis direction, Y-axis direction, and Z-axis direction).

[0004] Prior Art Documents

[0005] Patent Documents

[0006] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2021-048359

[0007] Patent Document 2: Japanese Unexamined Patent Application Publication No. 2022-091240 Summary of the Invention

[0008] However, the conventional substrate processing apparatus has the following problems. The substrate transfer robot (transfer mechanism) performs an operation of taking out the substrate in the carrier by moving the hand upward by an upper movement amount from a taught reference height position. In addition, the substrate transfer robot performs an operation of placing the substrate in the carrier by moving the hand downward by a lower movement amount from its reference height position.

[0009] The taught reference height position is determined by the height position at which the hand contacts the lower surface of the substrate within the carrier. However, there are individual differences in the carriers. Therefore, the taught reference height position often differs from the actual contact height position. As a result, for example, when withdrawing the hand from within the carrier, there is a possibility that the substrate supporting the hand contacts and rubs against the rack portion within the carrier. Additionally, for example, when withdrawing the hand from within the carrier, the hand placed behind the rack portion within the carrier after the substrate may contact and rub against the substrate.

[0010] In the case of substrates with special shapes (thick substrates formed by laminating multiple substrates or warped substrates), the possibility of contact friction becomes even higher.

[0011] The present invention has been proposed in view of the above circumstances, and an object thereof is to provide a substrate processing apparatus capable of avoiding contact with the substrate.

[0012] The present invention adopts the following configuration to achieve the above object. That is, a substrate processing apparatus for processing a substrate according to the present invention is characterized by including: a carrier placement portion for placing a carrier; a substrate transfer robot having a hand for supporting the substrate in a horizontal posture and moving the hand; and a control portion for controlling the substrate transfer robot. The carrier has a plurality of rack portions provided in the vertical direction within the carrier, and the plurality of rack portions can respectively place the substrate in a horizontal posture. The hand includes: a hand main body; a guiding portion provided on the upper surface of the hand main body and bearing the substrate; and a sensor for detecting the contact situation between the guiding portion and the substrate. In order to take out the substrate from one of the plurality of rack portions, the control portion makes the hand not supporting the substrate enter the carrier, and the control portion raises the hand within the carrier while monitoring the output from the sensor. When the sensor detects that the guiding portion contacts the substrate, the control portion raises the hand from the contact height position where the contact is detected by a preset upward movement amount. The control portion withdraws the hand supporting the substrate from the carrier at the rising position after rising by the upward movement amount from the contact height position.

[0013] According to the substrate processing apparatus of the present invention, in order to take out the substrate from the rack portion, the hand rises by an upward movement amount from the actual contact height position where the sensor detects contact with the substrate. Additionally, the hand supporting the substrate withdraws from the carrier at the rising position after rising by the upward movement amount from the actual contact height position. Therefore, when withdrawing the hand holding the substrate from the carrier, even if there are individual differences in the carriers or special-shaped substrates are used, it is possible to avoid, for example, the substrate supported by the hand from contacting the rack portion.

[0014] In addition, preferably, in the above-described substrate processing apparatus, in order to place the substrate on one of the plurality of rack portions, the control unit causes the hand that supports the substrate to enter the carrier. While monitoring the output from the sensor, the control unit lowers the hand in the carrier. When the sensor detects that the hand is separated from the substrate, the control unit lowers the hand from the separation height position where the separation is detected by a preset downward movement amount. At the lowered position after the downward movement amount has been lowered from the separation height position, the control unit causes the hand that does not support the substrate to exit the carrier.

[0015] In order to place the substrate on the rack portion, the hand is lowered by the downward movement amount from the actual separation height position where the sensor detects that the hand is separated from the substrate. In addition, the hand that does not support the substrate exits the carrier at the lowered position after being lowered by the downward movement amount from the actual separation height position. Therefore, when the hand that does not support the substrate exits the carrier, even if there are individual differences in the carrier or a substrate with a special shape is used, it is possible to avoid, for example, contact between the hand and the substrate.

[0016] In addition, preferably, in the above-described substrate processing apparatus, in order to place the substrate on one of the plurality of rack portions, at the raised position after the upward movement amount has been raised from the contact height position, the control unit causes the hand that supports the substrate to enter the carrier.

[0017] In order to place the substrate on the rack portion, the hand enters the carrier at the raised position after being raised by the upward movement amount from the actual contact height position detected when the substrate is placed in the rack portion. Therefore, when the hand that supports the substrate enters the carrier, even if there are individual differences in the carrier or a substrate with a special shape is used, it is possible to avoid, for example, contact between the hand and the substrate.

[0018] In addition, preferably, in the above-described substrate processing apparatus, the control unit lowers the hand in the carrier from the raised position to the lowered position, where the lowered position is a position after being lowered by a preset downward movement amount from the contact height position. At the lowered position, the control unit causes the hand that does not support the substrate to exit the carrier.

[0019] In order to place the substrate on the rack portion, the hand is lowered from the raised position to the lowered position. The raised position and the lowered position are height positions based on the actual contact height position detected when the substrate is placed. In addition, the hand that does not support the substrate exits the carrier at the lowered position after being lowered by the downward movement amount from the actual contact height position. Therefore, when the hand exits the carrier, even if there are individual differences in the carrier or a substrate with a special shape is used, it is possible to avoid, for example, contact between the hand and the substrate.

[0020] Further, preferably, in the above-described substrate processing apparatus, the control unit lowers the hand in the carrier while monitoring the output from the sensor. When the sensor detects that the hand is separated from the substrate, the control unit lowers the hand from the separation height position at which the separation is detected by a preset downward movement amount. At the lowered position after the downward movement amount has been lowered from the separation height position, the control unit withdraws the hand that does not support the substrate from the carrier.

[0021] In order to place the substrate on the rack portion, the hand is lowered by a downward movement amount from the actual separation height position at which the sensor detects that the hand is separated from the substrate. Further, the hand that does not support the substrate is withdrawn from the carrier at the lowered position after being lowered by the downward movement amount from the actual separation height position. Therefore, when withdrawing the hand from the carrier, even if there are individual differences in the carrier or a substrate with a special shape is used, it is possible to avoid, for example, contact between the hand and the substrate. The present invention is effective when the separation height position and the contact height position are different.

[0022] Further, preferably, in the above-described substrate processing apparatus, in order to take out the substrate from one of the plurality of rack portions, the control unit causes the hand that does not support the substrate to enter the carrier at a lower position after being lowered by a preset downward movement amount from a taught height position.

[0023] The hand enters the carrier at a height position based on the taught height position. Therefore, it is possible to relatively avoid a situation where the hand that does not support the substrate comes into contact with the substrate.

[0024] Further, preferably, in the above-described substrate processing apparatus, the hand includes a plurality of guide portions including the guide portion. The plurality of guide portions are provided on the upper surface of the guide portion main body and support the outer edge portion of the substrate. The sensor detects a situation where one of the plurality of guide portions comes into contact with the substrate.

[0025] The plurality of guide portions of the hand can support the outer edge portion of the substrate. Further, the sensor can detect a situation where one of the plurality of guide portions comes into contact with the substrate.

[0026] Further, preferably, in the above-described substrate processing apparatus, the hand includes: a plurality of guide portions including the guide portion; and a plurality of sensors including the sensor. The plurality of guide portions are provided on the upper surface of the guide portion main body and support the outer edge portion of the substrate. The plurality of sensors are respectively provided on each of the plurality of guide portions. The plurality of sensors respectively detect the contact situation between the corresponding guide portion in the plurality of guide portions and the substrate. The control unit raises the hand in the carrier while monitoring the outputs from the plurality of sensors. When at least one of the plurality of sensors detects contact with the substrate, the control unit raises the hand from the contact height position where the contact is detected by a preset upward movement amount.

[0027] The plurality of guide portions of the hand can support the outer edge portion of the substrate. The plurality of sensors can respectively detect the contact situation between the plurality of guide portions and the substrate. Further, when a substrate with a special shape is placed on the hand, there may be a situation where the substrate is not placed on a specified guide portion according to the shape of the substrate. By providing a plurality of sensors, even if, for example, a specified guide portion does not contact the substrate, as long as other guide portions contact the substrate, the contact between the sensor corresponding to the other guide portion and the substrate can be detected.

[0028] Further, in an example of the above-described substrate processing apparatus, when one of the plurality of sensors detects the first contact with the substrate, the control unit raises the hand from the contact height position where the contact is detected by a preset upward movement amount. Further, in the above-described substrate processing apparatus, an example of the sensor is a tactile sensor.

[0029] In addition, the substrate processing apparatus for substrate processing according to the present invention is characterized by including: a carrier placement unit that places a carrier; a substrate transfer robot that includes a hand for supporting the substrate in a horizontal posture and moves the hand; and a control unit that controls the substrate transfer robot. The carrier includes a plurality of rack portions provided in the vertical direction within the carrier, and the plurality of rack portions can respectively place the substrate in a horizontal posture. The hand includes: a hand main body; a guide portion provided on the upper surface of the hand main body and supporting the substrate; and a sensor that detects the contact situation between the guide portion and the substrate. The control unit causes the hand supporting the substrate to enter the carrier in order to place the substrate on one of the plurality of rack portions. The control unit monitors the output from the sensor while lowering the hand within the carrier. When the sensor detects that the hand is separated from the substrate, the control unit lowers the hand from the separation height position where the separation is detected by a preset downward movement amount. At the lowered position after lowering by the downward movement amount from the separation height position, the control unit withdraws the hand not supporting the substrate from within the carrier.

[0030] According to the substrate processing apparatus of the present invention, in order to place the substrate on the rack portion, the hand is lowered by a downward movement amount from the actual separation height position where the sensor detects that the hand is separated from the substrate. In addition, the hand not supporting the substrate withdraws from within the carrier at the lowered position after being lowered by the downward movement amount from the actual separation height position. Therefore, when withdrawing the hand not supporting the substrate from within the carrier, even if there are individual differences in the carrier or a substrate with a special shape is used, it is possible to avoid, for example, contact between the hand and the substrate.

[0031] Advantages of the Invention

[0032] According to the substrate processing apparatus of the present invention, contact with the substrate can be avoided. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 is a top view showing a schematic configuration of the substrate processing apparatus according to Embodiment 1.

[0034] Figure 2 is a cross-sectional view of the carrier taken horizontally.

[0035] Figure 3 is a front view of the carrier.

[0036] Figure 4 is a top view of the hand of the substrate transfer robot.

[0037] Figure 5 is a longitudinal cross-sectional view of the hand of the substrate transfer robot.

[0038] Figure 6It is a side view of a substrate transfer robot.

[0039] Figure 7 It is a flowchart showing the operation of a substrate processing device.

[0040] Figure 8 It is a side view for explaining an existing operation of taking out a substrate from a specified rack portion in a carrier.

[0041] Figure 9 It is a side view for explaining the problem (effect) of the operation of taking out a substrate.

[0042] Figure 10 It is a side view for explaining the operation (taking-out operation) of taking out a substrate from a specified rack portion in a carrier in Embodiment 1.

[0043] Figure 11 It is a flowchart showing the operation of taking out a substrate from a specified rack portion in a carrier.

[0044] Figure 12 It is a side view for explaining an existing operation of placing a substrate on a specified rack portion in a carrier.

[0045] Figure 13 It is a side view for explaining the problem (effect) of the operation of placing a substrate.

[0046] Figure 14 It is a side view for explaining the operation (accommodation operation) of placing a substrate on a specified rack portion in a carrier in Embodiment 1.

[0047] Figure 15 It is a flowchart showing the operation of placing a substrate on a specified rack portion in a carrier.

[0048] Figure 16 It is a front view for explaining the effect of the operation of taking out a substrate with a special shape.

[0049] Figure 17 It is a side view for explaining the operation of placing a substrate on a specified rack portion in a carrier in Embodiment 2.

[0050] Figure 18 It is a flowchart showing the operation of placing a substrate on a specified rack portion in a carrier in Embodiment 2.

[0051] Figure 19 It is a side view for explaining the operation of placing a substrate on a specified rack portion in a carrier in Embodiment 3.

[0052] Figure 20 It is a top view showing the hand of a modified example.

[0053] Figure 21 It is a top view showing the hand of a modified example.

[0054] Figure 22 It is a longitudinal sectional view of the hand showing a modified example.

[0055] Among them, the reference numerals are explained as follows:

[0056] 1 Substrate processing apparatus

[0057] 7 Carrier placement unit

[0058] IR Substrate transfer robot

[0059] C Carrier

[0060] 11 Frame unit

[0061] 13 Hand

[0062] 15, 61 Hand main body

[0063] 17A, 17B, 17C, 17D Guide part

[0064] 19A, 19B, 19C, 19D Tactile sensor

[0065] 28 Guide part wall

[0066] 51 Control unit

[0067] 63 Photoelectric sensor

[0068] TP Teaching height position

[0069] UW Upper side movement amount

[0070] DW Lower side movement amount

[0071] DUP Rising position

[0072] DLP1, DLP2 Lowering position

[0073] CNP (CNP1~CNP4) Contact height position

[0074] SEP (SEP1~SEP4) Separation height position

[0075] W Substrate Detailed implementation manners

[0076] Example 1

[0077] Hereinafter, Example 1 of the present invention will be described with reference to the drawings. Figure 1 It is a top view showing the schematic configuration of the substrate processing apparatus 1 of Example 1. Figure 2 It is a cross-sectional view of the carrier C, Figure 3 It is a front view of the carrier C. Figure 4It is a top view of the hand 13 of the substrate transfer robot IR. Figure 5 It is a longitudinal sectional view of the hand 13.

[0078] <1. Configuration of the substrate processing apparatus>

[0079] Refer to Figure 1 . The substrate processing apparatus 1 processes the substrate W. The substrate processing apparatus 1 includes an indexer module 3 and a processing module 5. The indexer module 3 includes a plurality of (e.g., two) carrier placement parts 7 and a substrate transfer robot IR. It should be noted that the horizontal direction in which the indexer module 3 and the processing module 5 are arranged is the X direction. The horizontal direction in which the plurality of carrier placement parts 7 are arranged is the Y direction. The Y direction is orthogonal to the X direction.

[0080] The two carrier placement parts 7 respectively place the carriers C. The carrier C stores a plurality of (e.g., 25) substrates W at a prescribed interval (e.g., 10 mm) in a horizontal posture. The substrate W is formed in a disc shape. The substrate W may or may not have warpage, and may also be formed by laminating a plurality of substrates. The carrier C uses, for example, a FOUP (Front Opening Unify Pod), but is not limited thereto.

[0081] Refer to Figure 2 , Figure 3 . The carrier C includes a container 9 that houses a plurality of substrates W and a plurality of (e.g., 25) rack parts 11. The container 9 has an extraction port 9A on the front surface. The substrate W in the container 9 of the carrier C is taken out through the extraction port 9A. In addition, the substrate W is stored through the extraction port 9A. When the carrier C is transferred, a lid part (not shown) that blocks the extraction port 9A is attached to the container 9.

[0082] The plurality of rack parts 11 are arranged in the vertical direction (Z direction) inside the carrier C (container 9). In the vertical direction (Z direction), the plurality of rack parts 11 are arranged at equal intervals (e.g., 10 mm intervals). Each of the plurality of rack parts 11 can place one substrate W in a horizontal posture.

[0083] The rack part 11 includes a plurality of (e.g., 25) racks 11A and a plurality of (e.g., 25) racks 11B. The 25 racks 11A are provided on the inner wall 9B on the left side of the container 9, and the 25 racks 11B are provided on the inner wall 9C on the right side of the container 9. The 25 racks 11A respectively face the 25 racks 11B. One substrate W is placed on each pair of racks 11A and 11B.

[0084] Refer to Figure 1 , Figure 4 , Figure 5。The substrate transfer robot IR has a hand 13 that supports a single substrate W in a horizontal posture and moves the hand 13. The substrate transfer robot IR transfers the substrate W between two carriers C of the two carrier placement parts 7 and a substrate placement part PS described later. The hand 13 is as Figure 4 , Figure 5 shown, and includes a hand body 15, four guiding parts 17A, 17B, 17C, 17D, and four tactile sensors 19A, 19B, 19C, 19D.

[0085] The hand body 15 is formed in a Y shape when viewed from above. The hand body 15 includes a single palm part 21 (palm) and two finger parts 23, 24. The two finger parts 23, 24 are both formed to extend from the palm part 21 in a specified horizontal direction HD1. The finger part 23 and the finger part 24 are arranged separately.

[0086] The four guiding parts 17A to 17D are provided on the upper surface of the hand body 15. The four guiding parts 17A to 17D respectively bear the outer edge part of the substrate W. Two guiding parts 17A, 17B are provided on the upper surface of the finger part 23. Two guiding parts 17C, 17D are provided on the upper surface of the finger part 24. The guiding part 17A is arranged on the front end side of the finger part 23. The guiding part 17B is arranged on the side closer to the palm part 21 than the guiding part 17A. The guiding part 17C is arranged on the front end side of the finger part 24. The guiding part 17D is arranged on the side closer to the palm part 21 than the guiding part 17C.

[0087] The guiding parts 17A to 17D respectively include a bearing part 27 and a guiding part wall 28. The four bearing parts 27 respectively bear the outer edge part of the substrate W in a horizontal posture. In each of the guiding parts 17A to 17D, the upper surface of the guiding part wall 28 is formed higher than the upper surface of the bearing part 27. Therefore, the four guiding part walls 28 surround the substrate W placed on the four bearing parts 27 and restrict the movement of the substrate W in the horizontal direction.

[0088] The four tactile sensors 19A, 19B, 19C, 19D are provided between the four guiding parts 17A, 17B, 17C, 17D and the hand body 15. In other words, the four tactile sensors 19A to 19D are respectively provided on the lower side or the lower surface of the four guiding parts 17A to 17D. The four tactile sensors 19A to 19D are embedded in the hand body 15.

[0089] The four tactile sensors 19A to 19D respectively detect the contact of the four guiding portions 17A to 17D with the substrate W. Specifically, the tactile sensor 19A detects the contact of the upper surface of the guiding portion 17A (carrying portion 27) with the substrate W. The tactile sensor 19B detects the contact of the upper surface of the guiding portion 17B with the substrate W. The tactile sensor 19C detects the contact of the upper surface of the guiding portion 17C with the substrate W. The tactile sensor 19D detects the contact of the upper surface of the guiding portion 17D with the substrate W.

[0090] The four tactile sensors 19A to 19D are respectively multi-axis force sensors such as 6-axis or 3-axis force sensors, but may also be single-axis (Z-axis) force sensors (force measuring sensors). It should be noted that a 6-axis force sensor is a sensor capable of measuring the forces of three axes (Fx, Fy, Fz) and the torques of three axes (Mx, My, Mz). The detection method of the force sensor uses, for example, a resistive type, a capacitive type, a piezoelectric type, or an optical type. For example, when the tactile sensor 19A detects a load above a preset upper threshold value in the Z-axis (vertical direction (Z direction)), for example, it detects the contact of the guiding portion 17A with the substrate W. In addition, when the tactile sensor 19A detects a load below the preset lower threshold value of the Z-axis, it detects that the guiding portion 17A is not in contact with the substrate W or the guiding portion 17A is separated from the substrate W. The same applies to the three tactile sensors 19B to 19D.

[0091] Figure 6 It is a side view of the substrate transfer robot IR. The substrate transfer robot IR includes, in addition to the hand 13, a multi-joint arm 31 and a lifting table 33. The multi-joint arm 31 is composed of, for example, a horizontal multi-joint type robot arm. The base end portion (base end part) of the multi-joint arm 31 is mounted on the lifting table 33. In addition, the front end portion (front end part) of the multi-joint arm 31 is connected to the hand 13. The multi-joint arm 31 moves the hand 13 supporting the substrate W in the horizontal direction. The multi-joint arm 31 is driven by a plurality of electric motors including an electric motor of a rotation drive portion 31D described later.

[0092] The multi-joint arm 31 includes, for example, a first arm 31A, a second arm 31B, a third arm 31C, and a rotation drive portion 31D. The base end portion of the first arm 31A is rotatably mounted on the rotation drive portion 31D about a vertical axis AX1. The base end portion of the second arm 31B is rotatably mounted on the front end portion of the first arm 31A about a vertical axis AX2. The base end portion of the third arm 31C is rotatably mounted on the front end portion of the second arm 31B about a vertical axis AX3. In addition, the front end portion of the third arm 31C is connected to the base end portion of the hand 13. The rotation drive portion 31D includes an electric motor. The rotation drive portion 31D rotates the first arm 31A about the vertical axis AX1.

[0093] The lifting table 33 raises and lowers the hand 13 and the multi-joint arm 31. The lifting table 33 includes a slider 33A, a guide rail 33B, a screw shaft 33C, an electric motor 33D, and a rotary encoder 33E. The slider 33A is fixed, for example, to the rotary drive unit 31D of the multi-joint arm 31. The guide rail 33B and the screw shaft 33C are respectively arranged so as to extend in the vertical direction (Z direction). The guide rail 33B penetrates the slider 33A. The screw shaft 33C meshes with the internal thread 33F of the slider 33A. The output shaft of the electric motor 33D is connected to the lower end of the screw shaft 33C.

[0094] When the electric motor 33D rotates the screw shaft 33C in the positive axial direction, the slider 33A, the rotary drive unit 31D, and the hand 13 rise. In addition, when the electric motor 33D rotates the screw shaft 33C in the reverse axial direction, the slider 33A, the rotary drive unit 31D, and the hand 13 descend. The rotary encoder 33E measures the height position of the hand 13 by measuring the rotational movement amount of the output shaft of the electric motor 33D and the screw shaft. It should be noted that the rotary encoder 33E is used as the height position sensor, but a linear encoder can also be used instead of the rotary encoder 33E.

[0095] Refer to Figure 1 The processing module 5 includes a plurality of processing units 37, a central robot CR, and a substrate placement unit PS. The substrate placement unit PS is provided between the substrate transfer robot IR and the central robot CR. The substrate placement unit PS can place one or more substrates W.

[0096] The processing unit 37 performs a preset process on the substrate W. For example, each processing unit 37 includes a holding and rotating unit 39 and a nozzle 41. The holding and rotating unit 39 includes a rotating jig that holds one substrate W in a horizontal posture and an electric motor that rotates the rotating jig around a vertical axis passing through the center of the substrate W. The nozzle 41 sprays a processing liquid onto the upper surface of the substrate W held by the holding and rotating unit 39.

[0097] The central robot CR includes a hand 43 that supports one substrate W in a horizontal posture. The central robot CR can move the hand 43. The central robot CR can transfer the substrate W between the plurality of processing units 37 and the substrate placement unit PS.

[0098] The substrate processing apparatus 1 includes a control unit 51 and a storage unit 53. The control unit 51 controls each component of the substrate processing apparatus 1. The control unit 51 includes, for example, one or more processors such as a central processing unit (CPU). The storage unit includes at least one of, for example, a ROM (Read-Only Memory), a RAM (Random-Access Memory), and an auxiliary storage device (such as a hard disk). The storage unit stores computer programs required to control each component of the substrate processing apparatus 1.

[0099] The four tactile sensors 19A to 19D and the rotary encoder 33E are respectively connected to the control unit 51 via signal lines. Therefore, the control unit 51 can control the substrate transfer robot IR based on the output signals of the four tactile sensors 19A to 19D and the rotary encoder 33E.

[0100] <2. Operations of the Substrate Processing Apparatus>

[0101] Next, the operations of the substrate processing apparatus 1 will be described with reference to Figure 7 the flowchart.

[0102] 〔Step S01〕Teaching Operation

[0103] The substrate transfer robot IR performs operations of picking up (acquiring) the substrate W placed on the rack portion 11 using the hand 13 and placing the substrate W on the rack portion 11 using the hand 13 based on the taught height position (hereinafter appropriately referred to as "taught height position TP"). The taught height position TP is obtained by performing a teaching operation on the substrate transfer robot IR. The teaching operation is performed when the substrate processing apparatus 1 does not process product substrates.

[0104] First, 25 teaching substrates are prepared and stored in the carrier C for qualified products. Each teaching substrate is, for example, a flat substrate with warpage suppressed. The carrier C is placed on one of the two carrier placement portions 7.

[0105] Then, the operator uses an operation panel (not shown) to perform the following operations on the substrate transfer robot IR. First, the hand 13 of the substrate transfer robot IR is inserted into the carrier C so as to be located below the specified (predetermined) substrate W. Then, by raising the hand 13, at least one of the four guide portions 17A to 17D of the hand 13 is brought into contact with the lower surface of the substrate W. Whether or not there is contact can be visually checked by the operator or detected by the tactile sensors 19A to 19D.

[0106] At this time, the rotary encoder 33E of the lift table 33 of the substrate transfer robot IR measures the height position at which at least one of the four guide portions 17A to 17D contacts the substrate W. This height position is stored in the storage unit 53 as the taught height position TP. Such an operation is performed on the 25 taught substrates placed on the 25 rack portions 11. Thus, 25 taught height positions TP are obtained for one carrier C. In addition, a teaching operation is performed for each carrier placement unit 7. After the teaching operation is performed, the substrate processing apparatus 1 processes the substrate W (product substrate).

[0107] [Step S02] Operation of taking out the substrate (product substrate) in the carrier

[0108] An external transfer robot (not shown) transfers the carrier C storing 25 substrates W (product substrates) to one of the two carrier placement units 7. Here, the operation of taking out the substrate W from the existing carrier C and its problems will be described. First, refer to Figure 8 The operation of taking out the substrate W will be described.

[0109] Figure 8 is a side view for explaining the existing operation of taking out the substrate W from a specified rack portion 11 in the carrier C. The substrate transfer robot IR moves the hand 13 to the lower position LP which is lowered by the downward movement amount DW from below the taught height position TP. It should be noted that the downward movement amount DW is a preset fixed value. The downward movement amount DW is also referred to as the downward offset value.

[0110] Then, the substrate transfer robot IR advances the hand 13 located at the lower position LP to move the hand 13 that does not support the substrate W into the carrier C (see arrow YA1) so that the hand 13 is located below the specified substrate W. Then, the substrate transfer robot IR raises the hand 13 from the lower position LP to the upper position UP (see arrow YA2). At this time, the hand 13 takes out the specified substrate W from the rack portion 11. It should be noted that the upper position UP is the position that is raised by the upward movement amount UW from the taught height position TP. The upward movement amount UW is a preset fixed value. The upward movement amount UW (absolute value) may be the same as the downward movement amount DW (absolute value), or may be different from the downward movement amount DW (absolute value). The upward movement amount UW is also referred to as the upward offset value.

[0111] Then, the substrate transfer robot IR retreats the hand 13 located at the upper position UP to move the hand 13 that supports the substrate W out of the carrier C (see arrow YA3). Through the above series of operations, one substrate W is taken out from the carrier C.

[0112] Refer to Figure 9 . In Figure 9In the figure, the solid line indicates the actual frame part 11, and the dashed line indicates the frame part 11E during teaching. As an example where the teaching height position TP is different from the actual contact height position CNP, for example, it is assumed that the frame part 11 is located at a position higher than the frame part 11E during teaching due to individual differences of the carrier C. In this case, when the hand part 13 rises by the upward movement amount UW from above the teaching height position TP, the hand part 13 does not rise sufficiently relative to the frame part 11 on which the substrate W is placed. That is, as shown by the circular frame MR1 in Figure 9 , the gap between the substrate W supported by the hand part 13 and the frame part 11 is small. Therefore, when the hand part 13 is withdrawn from the carrier C, there is a possibility of contact friction between the lower surface of the substrate W and the upper surface of the frame part 11. It should be noted that in the case of a substrate with a special shape (for example, a thick substrate formed by laminating multiple substrates or a warped substrate), the possibility of contact friction becomes higher. Then, it operates as follows.

[0113] Refer to Figure 10 , Figure 11 . Figure 10 is a side view for explaining the operation of taking out the substrate W from the specified frame part 11 in the carrier C in the first embodiment. Figure 11 is a flowchart showing the operation of taking out the substrate W.

[0114] The substrate transfer robot IR moves to the lower position LP which is lowered by the preset downward movement amount DW from the pre-taught teaching height position in order to take out the substrate W from one of the 25 frame parts 11 in the carrier C. Then, the substrate transfer robot IR advances the hand part 13 located at the lower position LP. Thus, the substrate transfer robot IR makes the hand part 13 that does not support the substrate W enter the carrier C (container 9) at the lower position LP (step S11).

[0115] Then, the substrate transfer robot IR raises the hand part 13 in the carrier C while monitoring the outputs of the four tactile sensors 19A to 19D (step S12). At this time, the upward movement amount of the hand part 13 is preset, and it can be the same amount as the upward movement amount UW or a larger amount than the upward movement amount UW. For example, during the upward movement of the hand part 13, when contact with the substrate W is detected by at least one of the four tactile sensors 19A to 19D, the control unit 51 acquires the contact height position CNP at which the contact is detected by using the rotary encoder 33E (steps S13, S14).

[0116] The operation of obtaining the contact height position CNP will be specifically described. For example, when the guide portion 17A is detected to be in contact with the substrate W by the tactile sensor 19A, the control unit 51 obtains the contact height position CNP1 at which this contact is detected using the rotary encoder 33E. Similarly, when the three tactile sensors 19B to 19D detect that the three guide portions 17B to 17D are respectively in contact with the substrate W, the control unit 51 obtains the respective contact height positions CNP2, CNP3, and CNP4 from the rotary encoder 33E. For example, the contact height position CNP1 is the height position at which the guide portion 17A is in contact with the substrate W. The contact height position CNP4 is the height position at which the guide portion 17D is in contact with the substrate W.

[0117] For example, the contact height positions CNP1, CNP2, CNP3, and CNP4 are detected in sequence. That is, the contact height position CNP1 is the lowest position, and the contact height position CNP4 is the highest value. For example, the contact height position CNP1 at the first contact can also be used as the contact height position CNP (representative value). That is, the contact height position CNP1 can also be replaced with the taught height position TP. In addition, the contact height position CNP4 at the last contact can also be used as the contact height position CNP. In addition, the average value of the four contact height positions CNP1 to CNP4 can also be used as the contact height position CNP.

[0118] For example, when one of the four tactile sensors 19A to 19D detects the first contact with the substrate W, the control unit 51 can also obtain the contact height position CNP using the rotary encoder 33E. In addition, when one of the four tactile sensors 19A to 19D detects the last contact with the substrate W, the control unit 51 can also obtain the contact height position CNP using the rotary encoder 33E. Furthermore, when the four tactile sensors 19A to 19D respectively detect the contact with the substrate W, the control unit 51 can obtain the four contact height positions CNP1 to CNP4 at which these contacts are detected using the rotary encoder 33E, and obtain the average value (contact height position CNP) of the four contact height positions CNP1 to CNP4.

[0119] In addition, the substrate transfer robot IR raises the hand 13 by a movement amount UW from above the contact height position CNP (step S15). Thereby, the hand 13 takes out (obtains) the substrate W from the specified rack portion 11. The raised position DUP is the position raised by the movement amount UW from above the contact height position CNP. Then, the substrate transfer robot IR withdraws the hand 13 supporting the substrate W from the carrier C at the raised position DUP (step S16). That is, the substrate transfer robot IR withdraws the hand 13 supporting the substrate W from within the carrier C by retracting the hand 13 located at the raised position DUP.

[0120] The substrate transfer robot IR transfers the substrate W taken out from within the carrier C to the substrate placement unit PS. Similarly, the other 24 substrates W within the carrier C are also sequentially taken out by the substrate transfer robot IR and transferred to the substrate placement unit PS.

[0121] 〔Step S03〕Substrate processing

[0122] The central robot CR uses the hand 43 to transfer the substrate W from the substrate placement unit PS to any one of the plurality of processing units 37. Each processing unit 37 performs a preset process on the substrate W transferred by the central robot CR. The central robot CR takes out the substrate W that has undergone the preset process from one of the plurality of processing units 37, and transfers the substrate W to the substrate placement unit PS.

[0123] 〔Step S04〕Storing the substrate in the carrier (substrate for product)

[0124] Here, the operation of placing the substrate W in the existing carrier C and its problems will be described. First, refer to Figure 12 to describe the existing operation of placing the substrate W.

[0125] Figure 12 is a side view for explaining the existing operation of the specified rack portion 11 for placing the substrate W in the carrier C. The substrate transfer robot IR moves the hand 13 supporting the substrate W to the upper position UP that rises by the movement amount UW from above the teaching height position TP. Then, the substrate transfer robot IR advances the hand 13 located at the upper position UP to make the hand 13 supporting the substrate W enter the carrier C so as to be located above the specified rack portion 11 (see arrow YA4).

[0126] Then, the substrate transfer robot IR lowers the hand 13 from the upper position UP to the lower position LP (see arrow YA5). At this time, the hand 13 places the substrate W on the upper surface of the specified rack portion 11. Then, the substrate transfer robot IR retracts the hand 13 not supporting the substrate W from within the carrier C by retracting the hand 13 located at the lower position LP (see arrow YA6). Through the above series of operations, one substrate W is stored in the carrier C.

[0127] Refer to Figure 13 . In Figure 13 , the solid line represents the actual rack portion 11, and the dashed line represents the rack portion 11E during teaching. As an example where the teaching height position TP is different from the actual contact height position CNP, for example, it is assumed that due to individual differences in the carrier C, there is a case where the rack portion 11 is located lower than the rack portion 11E during teaching. In this case, when the hand 13 descends by the movement amount DW from below the teaching height position TP, the hand 13 does not descend sufficiently with respect to the rack portion 11 supporting the substrate W. That is, asFigure 13 As shown by the circular frame MR2, the gap between the hand 13 (guide portions 17A to 17D) and the substrate W placed on the rack portion 11 is small. Therefore, when the hand 13 is withdrawn from the carrier C, there is a possibility of contact friction between the lower surface of the substrate W and the hand 13 (guide portions 17A to 17D). It should be noted that in the case of a substrate W with a special shape, the possibility of contact friction becomes higher. Thus, the following operations are performed.

[0128] Refer to Figure 14 and Figure 15 . Figure 14 is a side view for explaining the operation of the rack portion 11 that places the substrate W in the carrier C in the first embodiment. Figure 15 is a flowchart showing the operation of placing the substrate W.

[0129] The substrate transfer robot IR takes out the substrate W from the substrate placement portion PS. Then, in order to place the substrate W on one of the 25 rack portions 11, the substrate transfer robot IR moves the hand 13 supporting the substrate W from the taught height position TP to the upper position UP that rises by the upward movement amount UW. Then, the substrate transfer robot IR advances the hand 13 located at the upper position UP. Thereby, the substrate transfer robot IR causes the hand 13 supporting the substrate W to enter the carrier C (step S21).

[0130] Then, the substrate transfer robot IR lowers the hand 13 in the carrier C while monitoring the outputs from the four tactile sensors 19A to 19D (step S22). For example, during the lowering of the hand 13, when at least one of the four tactile sensors 19A to 19D detects the separation of the hand 13 from the substrate W, the control unit 51 obtains the separation height position SEP at which the separation is detected by using the rotary encoder 33E (steps S23, S24). It should be noted that when the separation of the hand 13 from the substrate W is detected, that is, when the separation height position SEP is obtained, the substrate W is placed on the specified rack portion 11.

[0131] Specifically, the operation of obtaining the separation height position SEP will be described. For example, when the tactile sensor 19A detects the separation of the guide portion 17A from the substrate W, the control unit 51 obtains the separation height position SEP1 at which the separation is detected by using the rotary encoder 33E. Similarly, when the three tactile sensors 19B to 19D respectively detect the separation of the three guide portions 17B to 17D from the substrate W, the control unit 51 obtains the respective separation height positions SEP2, SEP3, and SEP4 by using the rotary encoder 33E. For example, the separation height position SEP1 is the height position at which the guide portion 17A is separated from the substrate W. The separation height position SEP4 is the height position at which the guide portion 17D is separated from the substrate W.

[0132] For example, the separation height positions SEP1, SEP2, SEP3, and SEP4 are detected in sequence. That is, the separation height position SEP1 is the highest position, and the separation height position SEP4 is the lowest value. For example, the initially separated separation height position SEP1 can also be used as the reference separation height position SEP (representative value). That is, the separation height position SEP1 can also be replaced with the taught height position TP. In addition, the finally separated separation height position SEP4 can also be used as the separation height position SEP. Moreover, the average value of the four separation height positions SEP1 to SEP4 can also be used as the separation height position SEP.

[0133] For example, the control unit 51 can also operate as follows. When one of the four tactile sensors 19A to 19D detects that the hand 13 is initially separated from the substrate W, the control unit 51 can obtain the separation height position SEP through the rotary encoder 33E. In addition, when one of the four tactile sensors 19A to 19D detects that the hand 13 is finally separated from the substrate W, the control unit 51 can obtain the contact height position CNP through the rotary encoder 33E. Furthermore, when the four tactile sensors 19A to 19D respectively detect that the hand 13 is separated from the substrate W, the control unit 51 can obtain the four separation height positions SEP1 to SEP4 at which these separations are detected through the rotary encoder 33E, and obtain the average value (contact height position CNP) of the four separation height positions SEP1 to SEP4.

[0134] In addition, the substrate transfer robot IR lowers the hand 13 by the movement amount DW from below the separation height position SEP (step S25). The lowering position DLP1 is the position where the hand 13 is lowered by the movement amount DW from below the separation height position SEP. Then, the substrate transfer robot IR withdraws the hand 13 that does not support the substrate W from the carrier C at the lowering position DLP1 (step S26). That is, the substrate transfer robot IR withdraws the hand 13 that does not support the substrate W from the carrier C by retracting the hand 13 located at the lowering position DLP1.

[0135] The remaining 24 substrate Ws sequentially placed on the substrate placement unit PS are also transported in the same manner. That is, the remaining 24 substrate Ws are also transported in the manner of steps S21 to S26. When the 25 processed substrate Ws are stored in the carrier C, an external transfer robot (not shown) transfers the carrier C from the carrier placement unit 7 to the next destination.

[0136] [Step S05] Repeat?

[0137] Then, in the case of processing the product substrate, i.e., the substrate W, stored in other carriers ( Figure 7In the case of "Yes" shown, return to step S02. Additionally, in the case of performing the teaching operation of step S01 again ( Figure 7 the case of "No" shown), Figure 7 end the flowchart shown.

[0138] According to this embodiment, in order to take out the substrate W from the rack portion 11, the hand 13 moves upward by an upward movement amount UW from the actual contact height position CNP where the tactile sensors 19A to 19D detect contact with the substrate W. In addition, the hand 13 that supports the substrate W exits from inside the carrier C at the rising position DUP after rising by the upward movement amount UW from the actual contact height position CNP. Therefore, when the hand 13 holding the substrate W exits from inside the carrier C, even if there are individual differences in the carrier C or a substrate W with a special shape is used, it is possible to avoid, for example, contact between the substrate W supported by the hand 13 and the rack portion 11.

[0139] Figure 16 is a front view for explaining the effect of the operation of taking out a substrate with a special shape. For example, Figure 16 the substrate W shown warps such that the central region of the substrate W protrudes upward. Similarly in this case, when taking out the substrate W from the specified rack portion 11, even if the hand 13 moves upward by the upward movement amount UW from the teaching height position TP, as shown by the circular frame MR3 in Figure 16 it cannot be sufficiently separated from the rack portion 11. Therefore, for example, there is a possibility that the substrate W supported by the hand 13 comes into contact and rubs against the upper surface of the rack portion 11. However, the hand 13 exits from inside the carrier C in a state where it has risen by the upward movement amount UW from the actual contact height position CNP. Therefore, it is possible to avoid the situation where the substrate W supported by the hand 13 comes into contact and rubs against the rack portion 11.

[0140] In order to place the substrate W on the rack portion 11, the hand 13 moves downward by a downward movement amount DW from the actual separation height position SEP where the tactile sensors 19A to 19D detect separation of the hand 13 from the substrate W. In addition, the hand 13 that does not support the substrate W exits from inside the carrier C at the descending position DLP1 after descending by the downward movement amount DW from the actual separation height position SEP. Therefore, when the hand 13 that does not support the substrate W exits from inside the carrier C, even if there are individual differences in the carrier C or a substrate W with a special shape is used, it is possible to avoid, for example, contact between the hand 13 and the substrate W.

[0141] In addition, the hand 13 enters inside the carrier C at the height position based on the teaching height position TP. Therefore, it is possible to relatively avoid contact between the hand 13 that does not support the substrate W and the substrate W.

[0142] The four guiding portions 17A to 17D of the hand 13 can carry the outer edge portion of the substrate W. The four tactile sensors 19A to 19D can respectively detect the contact situation between the four guiding portions 17A to 17D and the substrate W. In addition, when the substrate W with a special shape is placed on the hand 13, there may be a situation where the substrate W is not placed on, for example, the guiding portion 17A due to the shape of the substrate W. By providing the four tactile sensors 19A to 19D, even if, for example, the guiding portion 17A does not contact the substrate W, as long as the other guiding portions 17B to 17D contact the substrate W, the contact with the substrate W can be detected by the tactile sensors 19B to 19D corresponding to the other guiding portions 17B to 17D.

[0143] Embodiment 2

[0144] Next, Embodiment 2 of the present invention will be described with reference to the drawings. It should be noted that the description repeated with Embodiment 1 is omitted. Figure 17 It is a side view for explaining the operation of placing the substrate W in a specified rack portion 11 of the carrier C in Embodiment 2. Figure 18 It is a flowchart for explaining the operation of placing the substrate W in Embodiment 2.

[0145] In Embodiment 1, in Figure 15 the step S21 shown, the substrate transfer robot IR makes the hand 13 supporting the substrate W enter at the upper position UP after rising by the upper movement amount UW from the taught height position TP. In addition, in Figure 15 the steps 23 and 24 shown, when at least one of the four tactile sensors 19A to 19D detects that the hand 13 is separated from the substrate W, the substrate transfer robot IR lowers the hand 13 by the lower movement amount DW from the separation height position SEP.

[0146] In this regard, in Embodiment 2, the substrate transfer robot IR can also make the hand 13 supporting the substrate W enter at the rising position DUP after rising by the upper movement amount UW from the contact height position CNP detected when taking out the substrate W. In addition, the substrate transfer robot IR can also lower the hand 13 from the contact height position CNP to the lower position DLP2 after lowering by the lower movement amount DW.

[0147] In Figure 11 the flowchart, for example, when any one of the four tactile sensors 19A to 19D detects the contact between the hand 13 and the substrate W, the control unit 51 obtains the contact height position CNP (steps S13, S14) where the contact is detected by using the rotary encoder 33E. For example, the control unit 51 makes the storage unit 53 store the difference DF between the contact height position CNP and the taught height position TP. That is, the control unit 51 stores 25 differences DF corresponding to the 25 rack portions 11 in the storage unit 53.

[0148] Reference Figure 17 and Figure 18 . Figure 18 The flowchart of Figure 15 omits steps S23, S24, and S25 compared to the flowchart of

[0149] In order to place the substrate W on one of the 25 rack portions 11, the substrate transfer robot IR moves the hand 13 supporting the substrate W to the rising position DUP after rising by the upward movement amount UW from the contact height position CNP. Then, the substrate transfer robot IR makes the hand 13 supporting the substrate W enter the carrier C at the rising position DUP (step S21).

[0150] Then, the substrate transfer robot IR lowers the hand 13 from the rising position DUP to the lowering position DLP2 inside the carrier C (step S22A). At this time, the hand 13 places the substrate W on the upper surface of the specified rack portion 11. The lowering position DLP2 is the height position after lowering by the downward movement amount DW from below the contact height position CNP. Then, the substrate transfer robot IR withdraws the hand 13 not supporting the substrate W from inside the carrier C at the lowering position DLP2 (step S26).

[0151] According to this embodiment, in order to place the substrate W on the rack portion 11, the hand 13 enters the carrier C at the rising position DUP, where the rising position DUP is the position after rising by the upward movement amount UW from the actual contact height position CNP detected when removing the substrate W from the rack portion 11. Therefore, when the hand 13 supporting the substrate W enters the carrier C, even if there are individual differences in the carrier C or a substrate W with a special shape is used, it is possible to avoid, for example, contact between the hand 13 and the substrate W.

[0152] In addition, in order to place the substrate W on the rack portion 11, the hand portion 13 descends from the ascending position DUP to the descending position DLP2. The ascending position DUP and the descending position DLP2 are height positions based on the actual contact height position CNP detected when taking out the substrate W. In addition, the hand portion 13 that does not support the substrate W exits from the inside of the carrier C at the descending position DLP2 after descending by the movement amount DW from below the actual contact height position CNP. Therefore, when the hand portion 13 exits from the inside of the carrier C, even if there are individual differences in the carrier C or a substrate W with a special shape is used, it is possible to avoid, for example, contact between the hand portion 13 and the substrate W.

[0153] It should be noted that, in the present embodiment, the control unit 51 causes the storage unit 53 to store 25 difference values DF corresponding to the 25 rack portions 11. In this regard, the control unit 51 may also cause the storage unit 53 to store 25 contact height positions CNP corresponding to the 25 rack portions 11. In addition, the control unit 51 may also store 25 ascending positions DUP corresponding to the 25 rack portions 11. The 25 ascending positions DUP are height positions after ascending by the ascending movement amount DW from the contact height position CNP.

[0154] Embodiment 3

[0155] Next, Embodiment 3 of the present invention will be described with reference to the drawings. It should be noted that the description repeated with Embodiments 1 and 2 is omitted. Figure 19 It is a side view for explaining the operation of the specified rack portion 11 for placing the substrate W in the carrier C in Embodiment 3.

[0156] In Embodiment 1, in Figure 15 the step S21 shown, the substrate transfer robot IR causes the hand portion 13 supporting the substrate W to enter at the upper position UP after ascending by the movement amount UW from above the taught height position TP. In this regard, in Embodiment 3, the substrate transfer robot IR causes the hand portion 13 supporting the substrate W to enter at the ascending position DUP after ascending by the movement amount UW from above the contact height position CNP.

[0157] In Figure 11 the flowchart of, the control unit 51 acquires the contact height position CNP (steps S13, S14). For example, the control unit 51 causes the storage unit 53 to store the difference value DF between the contact height position CNP and the taught height position TP. That is, the control unit 51 causes the storage unit 53 to store 25 difference values DF corresponding to the 25 rack portions 11.

[0158] In the present embodiment, the 25 difference values DF stored in the storage unit 53 are also used for the operation of placing the substrate W on the specified rack portion 11 in the carrier C. That is, the control unit 51 corrects the 25 taught height positions TP by using the 25 difference values DF respectively. Thus, 25 contact height positions CNP are acquired.

[0159] Refer to Figure 15 、 Figure 19 。To place the substrate W on the rack portion 11, the substrate transfer robot IR moves the hand 13 that supports the substrate W into the carrier C at the rising position DUP after rising by the movement amount UW from above the contact height position CNP (step S21). The control unit 51 lowers the hand in the carrier C while monitoring the outputs from the four tactile sensors 19A to 19D (step S22).

[0160] For example, when at least one of the four tactile sensors 19A to 19D detects the separation of the hand 13 from the substrate W, the control unit 51 obtains the separation height position SEP at which the separation is detected by using the rotary encoder 33E (steps S23, S24). Then, the substrate transfer robot IR lowers the hand 13 by the movement amount DW from below the separation height position SEP (step S25). Then, the substrate transfer robot IR withdraws the hand 13 that does not support the substrate W from the carrier C at the lowering position DLP1 (step S26). Note that the lowering position DLP1 is the position after lowering by the movement amount DW from below the separation height position SEP.

[0161] According to the present embodiment, to place the substrate W on the rack portion 11, the hand 13 enters the carrier C at the rising position DUP after rising by the movement amount UW from above the actual contact height position CNP detected when taking out the substrate W from the rack portion 11. Therefore, when the hand 13 that supports the substrate W enters the carrier C, even if there are individual differences in the carrier C or a substrate W with a special shape is used, it is possible to avoid, for example, contact between the hand 13 and the substrate W.

[0162] In addition, to place the substrate W on the rack portion 11, the hand 13 is lowered by the movement amount DW from below the actual separation height position SEP at which the tactile sensors 19A to 19D detect the separation of the hand 13 from the substrate W. In addition, the hand 13 that does not support the substrate W withdraws from the carrier C at the lowering position DLP1 after lowering by the movement amount DW from below the actual separation height position SEP. Therefore, when withdrawing the hand 13 from the carrier C, even if there are individual differences in the carrier C or a substrate W with a special shape is used, it is possible to avoid, for example, contact between the hand 13 and the substrate W. This embodiment is effective when the separation height position SEP and the contact height position CNP are different.

[0163] The present invention is not limited to the above-described embodiments and can be modified and implemented as follows.

[0164] (1) In the above-described embodiments, the hand 13 includes four tactile sensors 19A to 19D for the four guide portions 17A to 17D. In this regard, the hand 13 may also include at least one tactile sensor for the four guide portions 17A to 17D. The at least one tactile sensor can detect the contact of at least one of the four guide portions 17A to 17D with the substrate W.

[0165] (2) In the above-described embodiments and the modification (1), Figure 4 the hand 13 shown includes four guide portions 17A to 17D. In this regard, the hand 13 may include three or more guide portions. Additionally, in Figure 4 , the two guide portions 17B and 17D on the palm portion 21 side are provided on the finger portions 23 and 24. In this regard, the two guide portions 17B and 17D may also be provided on the palm portion 21.

[0166] (3) In the above-described embodiments and each modification, the hand 13 includes four guide portions 17A to 17D. In this regard, the hand 13 may also be as Figure 20 shown, including a linear guide portion main body 61 and two guide portions 17A and 17B. The two guide portions 17A and 17B are provided on the upper surface of the guide portion main body 61 along the horizontal direction HD2 in which the guide portion main body 61 extends. In this case, for example, the hand 13 includes two tactile sensors 19A and 19B for the two guide portions 17A and 17B.

[0167] (4) In the above-described embodiments and each modification, the hand 13 includes four guide portions 17A to 17D. In this regard, the hand 13 may also be as Figure 21 shown, including a single guide portion 17A provided on the upper surface of the guide portion main body 61. The hand 13 may also support the central portion of the lower surface of the substrate W through the single guide portion 17A. In this case, the hand 13 includes a single tactile sensor 19A for the single guide portion 17A.

[0168] (5) In the above-described embodiments and each modification, the four tactile sensors 19A to 19D may also be touch sensors respectively. The touch sensor may, for example, also be a mechanical switch that detects contact by pressing a button. Additionally, the touch sensor may also be a capacitive or piezoelectric type.

[0169] (6) In the above-described embodiments and each modification, the hand 13, for example, includes four tactile sensors 19A to 19D. In this regard, the hand 13 may also include four optical sensors 63 instead of the four tactile sensors 19A to 19D. The optical sensors 63 are as Figure 22As shown, it is provided on the upper surface or upper part of the hand main body 15 so as not to contact the lower surface of the substrate W supported by the four guide parts 17A to 17D.

[0170] Each photoelectric sensor 63 has a light projecting element and a light receiving element, and the light emitted from the light projecting element and reflected by the lower surface of the substrate W is detected by the light receiving element. Thereby, the photoelectric sensor 63 measures the distance from the photoelectric sensor to the lower surface of the substrate W. For example, during the teaching operation in step S01, it operates as follows. When the substrate W is placed on the four guide parts 17A to 17D, or when the four guide parts 17A to 17D are in contact with the lower surface of the substrate W, the control unit 51 measures in advance the contact distance from the photoelectric sensor 63 to the lower surface of the substrate W using the photoelectric sensor 63.

[0171] And, for example, in Figure 11 In step S12, the control unit 51 raises the hand 13 while monitoring the outputs of the four photoelectric sensors 63 (the distance from the photoelectric sensors to the lower surface of the substrate W). In step S13, when the distance to the substrate W measured by the photoelectric sensor 63 is within a preset range including the contact distance, the control unit 51 determines that the photoelectric sensor 63 has detected the contact between the hand 13 and the substrate W. Thereby, when at least one of the four photoelectric sensors 63 detects contact with the substrate W, the control unit 51 raises the hand 13 by a movement amount UW from above the contact height position CNP.

[0172] (7) In each of the above embodiments and each modification, the substrate transfer robot IR includes a multi-joint arm 31 and a lifting table 33 in order to move the hand 13. In this regard, the substrate transfer robot IR may also include a forward and backward movement part and a lifting and rotating part. The forward and backward movement part moves the hand 13 forward and backward. The lifting and rotating part rotates the hand and the forward and backward movement part about the vertical axis and raises and lowers the hand and the forward and backward movement part.

[0173] (8) In each of the above embodiments and each modification, during the teaching operation, the teaching height position TP, which is the position where the hand 13 contacts the lower surface of the substrate W, is obtained. In this regard, in addition to this teaching height position TP, the second teaching height position, which is the position where the hand 13 is separated from the lower surface of the substrate W, may also be obtained. The second teaching height position may be based on when the substrate W is placed on the specified rack part 11.

Claims

1. A substrate processing device for processing a substrate, wherein the substrate processing device comprises: a carrier mounting portion for mounting the carrier; a substrate transport robot including a hand that supports the substrate in a horizontal posture and moves the hand; and a control unit that controls the substrate transport robot, The carrier includes a plurality of shelf portions arranged in the vertical direction within the carrier, and the plurality of shelf portions can respectively place the substrate in a horizontal posture. The hand comprises: Hand body; a guide portion, which is disposed on the upper surface of the hand body and carries the substrate; and a sensor for detecting contact between the guide portion and the substrate, The control unit causes the hand that does not support the substrate to enter the carrier in order to take out the substrate from one of the plurality of shelves. The control unit raises the hand in the carrier while monitoring the output from the sensor. When the sensor detects that the guide portion is in contact with the substrate, the control unit causes the hand to rise by a preset upward movement amount from a contact height position at which the contact is detected. The control unit causes the hand supporting the substrate to withdraw from the carrier at a raised position raised from the contact height position by the upward movement amount.

2. The substrate processing device according to claim 1, characterized in that: The control unit causes the hand supporting the substrate to enter the carrier in order to place the substrate on one of the plurality of shelves. The control unit lowers the hand in the carrier while monitoring the output from the sensor. When the sensor detects that the hand is separated from the substrate, the control unit lowers the hand by a preset downward movement amount from a separation height position at which the separation is detected. The control unit causes the hand, which is not supporting the substrate, to withdraw from the carrier at a descending position that is descended from the separation height position by the downward movement amount.

3. The substrate processing device according to claim 1, characterized in that: The control unit causes the hand supporting the substrate to enter the carrier at the raised position raised from the contact height position by the upper movement amount in order to place the substrate on one of the plurality of shelves.

4. The substrate processing device according to claim 3, characterized in that: The control unit lowers the hand from the raised position to a lowered position in the carrier, wherein the lowered position is a position lowered from the contact height position by a preset downward movement amount. The control unit causes the hand that is not supporting the substrate to withdraw from the carrier at the lowered position.

5. The substrate processing device according to claim 3, characterized in that: The control unit lowers the hand in the carrier while monitoring the output from the sensor. When the sensor detects that the hand is separated from the substrate, the control unit lowers the hand by a preset downward movement amount from a separation height position at which the separation is detected. The control unit causes the hand, which is not supporting the substrate, to withdraw from the carrier at a descending position that is descended from the separation height position by the downward movement amount.

6. The substrate processing apparatus according to any one of claims 1 to 5, characterized in that: The control unit causes the hand that does not support the substrate to enter the carrier at a lower position lowered by a preset lower movement amount from a previously taught height position in order to take out the substrate from one of the plurality of shelves.

7. The substrate processing apparatus according to any one of claims 1 to 5, characterized in that: The hand includes a plurality of guide parts including the guide part, The plurality of guide parts are arranged on the upper surface of the guide part body and support the outer edge of the substrate. The sensor detects that one of the plurality of guides is in contact with the substrate.

8. The substrate processing apparatus according to any one of claims 1 to 5, characterized in that: The hand comprises: a plurality of guide portions including the guide portion; and a plurality of sensors including said sensor, The plurality of guide parts are arranged on the upper surface of the guide part body and support the outer edge of the substrate. The plurality of sensors are respectively disposed on each of the plurality of guide parts. The plurality of sensors respectively detect the contact between the corresponding guide portions among the plurality of guide portions and the substrate. The control unit raises the hand in the carrier while monitoring the outputs from the plurality of sensors. When at least one of the plurality of sensors detects contact with the substrate, the control unit causes the hand to rise by the preset upward movement amount from the contact height position at which the contact is detected.

9. The substrate processing device according to claim 8, characterized in that: When one of the plurality of sensors detects the first contact with the substrate, the control unit causes the hand to rise by the preset upward movement amount from a contact height position at which the contact is detected.

10. The substrate processing apparatus according to any one of claims 1 to 5, characterized in that: The sensor is a tactile sensor.

11. A substrate processing device for processing a substrate, wherein the substrate processing device comprises: a carrier mounting portion for mounting the carrier; a substrate transport robot including a hand that supports the substrate in a horizontal posture and moves the hand; and a control unit that controls the substrate transport robot, The carrier includes a plurality of shelf portions arranged in the vertical direction within the carrier, and the plurality of shelf portions can respectively place the substrate in a horizontal posture. The hand comprises: Hand body; a guide portion, which is disposed on the upper surface of the hand body and carries the substrate; and a sensor for detecting contact between the guide portion and the substrate, The control unit causes the hand supporting the substrate to enter the carrier in order to place the substrate on one of the plurality of shelves. The control unit lowers the hand in the carrier while monitoring the output from the sensor. When the sensor detects that the hand is separated from the substrate, the control unit lowers the hand by a preset downward movement amount from a separation height position at which the separation is detected. The control unit causes the hand, which is not supporting the substrate, to withdraw from the carrier at a descending position that is descended from the separation height position by the downward movement amount.

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