Multi-frequency phase shifter and multi-frequency antenna
By using multi-layer interlaced elastic conductive sheets and matching medium with changing dielectric constant gradients in the multi-frequency phase shifter, the problems of poor signal integrity, difficulty in impedance matching and low mechanical reliability are solved, and more efficient signal transmission and lower production costs are achieved.
Patent Information
- Application Number
- CN202510528536.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-25
- Publication Date
- 2025-05-30
- Estimated Expiration
- 2045-04-25
AI Technical Summary
The existing multi-frequency phase shifters have problems such as poor signal integrity, difficulty in impedance matching and low mechanical reliability in signal transmission.
A multi-frequency phase shifter is designed, and a pin plate composed of multi-layer elastic conductive sheet stacks is arranged interlaced to form an electromagnetic shielding isolation structure, and a matching medium with a gradient of dielectric constant is embedded on the contact surface. Combined with the deformation compensation of the elastic conductive sheet and the impedance matching of the gradient medium, the phase distortion problem of the high-frequency band pin connection is solved.
It effectively improves the signal integrity and impedance matching of the multi-frequency phase shifter, reduces processing difficulty and cost, and enhances mechanical reliability, and is suitable for use in multi-frequency antennas.
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Figure CN120073256A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of communication equipment, and in particular to a multi-frequency phase shifter and a multi-frequency antenna. Background Art
[0002] With the large-scale deployment of multi-band base stations, multi-frequency antennas need to achieve independent regulation and efficient combining of multi-band signals in a limited space. Traditional multi-frequency phase shifters use a combination of discrete phase-shifting units and combiners, resulting in the following problems: Poor signal integrity: Crosstalk occurs due to the lack of effective isolation of signals in different frequency bands during long-distance transmission. Especially when the length of the phase shifter exceeds 1.2 meters, parasitic coupling intensifies and radiation loss increases; Difficult impedance matching: The impedance of the transmission line of the long-size phase shifter varies significantly with frequency, and it is difficult for traditional homogeneous dielectrics to achieve continuous impedance matching in multiple frequency bands, leading to signal reflection; Low mechanical reliability: The ultra-long phase shifter (>1.2 meters) deforms due to thermal expansion under temperature changes, resulting in uneven contact pressure at the pin joints or even detachment, restricting mass production. Summary of the Invention
[0003] The present invention provides a multi-frequency phase shifter and a multi-frequency antenna to solve the problems of poor signal integrity, difficult impedance matching, and low mechanical reliability of the phase shifter in the prior art.
[0004] In a first aspect, the present invention provides a multi-frequency phase shifter, comprising: A plurality of the phase-shifting plates are arranged in the cavity and connected in sequence along the length direction of the cavity, and adjacent two phase-shifting plates are connected in sequence through a first pin board; The first pin board is composed of a stack of multiple layers of elastic conductive sheets, each layer of the elastic conductive sheets respectively corresponds to a signal transmission channel of a different frequency band, and adjacent elastic conductive sheets are staggered in the horizontal direction to form an electromagnetic shielding isolation structure; The contact surface between the phase-shifting plate and the first pin board is provided with a groove, and a matching medium with a gradient change in dielectric constant is embedded in the groove.
[0005] According to the multi-frequency phase shifter provided by the present invention, the phase-shifting plate includes a combiner and a plurality of band phase shifters of different frequency bands, the cavity includes a first cavity layer and a second cavity layer arranged in parallel up and down, the second cavity layer has a plurality of sub-cavities arranged side by side, the combiner is located in the first cavity layer, and a plurality of band phase shifters of different frequency bands are respectively arranged in the plurality of sub-cavities, and the band phase shifters are connected to the combiner through a second pin board.
[0006] According to the multi-frequency phase shifter provided by the present invention, the first cavity layer and the second cavity layer are separated by a partition board, and the partition board is provided with through holes for the second pin board to pass through.
[0007] A multi-frequency phase shifter provided by the present invention, wherein a cable groove is provided on the outer wall of the cavity, and the cable groove is used to accommodate a coaxial cable electrically connected to the combiner and the frequency band phase shifter.
[0008] A multi-frequency phase shifter provided by the present invention, wherein the first cavity layer and the sub-cavity are respectively provided with clamping grooves, the frequency band phase shifter is inserted into the clamping groove of the sub-cavity, and the combiner is inserted into the clamping groove of the first cavity layer.
[0009] A multi-frequency phase shifter provided by the present invention further includes a main feed network, and the main feed network is integrated on the dielectric substrate of the combiner.
[0010] A multi-frequency phase shifter provided by the present invention, wherein the main feed network uses a strip line.
[0011] A multi-frequency phase shifter provided by the present invention, wherein the main feed network and the combining network on the combiner are arranged on different layer copper tapes of the dielectric substrate.
[0012] A multi-frequency phase shifter provided by the present invention, wherein a power distribution network and a phase compensation network are integrated on the frequency band phase shifters of multiple different frequency bands.
[0013] In a second aspect, the present invention further provides a multi-frequency antenna, including: a radiation unit and the multi-frequency phase shifter as described in the first aspect, and the multi-frequency phase shifter is electrically connected to the radiation unit through a coaxial cable shorter than 1.5 times the wavelength.
[0014] For the multi-frequency phase shifter and the multi-frequency antenna provided by the present invention, multiple phase shift plates are sequentially arranged along the length direction of the cavity, and adjacent two phase shift plates are connected by a first pin board, thereby shortening the length of a single phase shift plate, facilitating processing, being easy for mass production, helping to reduce the processing cost, and combining the deformation compensation of the elastic conductive sheet with the impedance matching of the gradient medium to solve the phase distortion problem of the pin connection in the high frequency band. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.
[0016] Figure 1 is an exploded view of the multi-frequency phase shifter provided by the present invention.
[0017] Figure 2 is a partial structural schematic diagram of the multi-frequency phase shifter provided by the present invention.
[0018] Figure 3 It is a schematic vertical cross-sectional view of the cavity provided by the present invention.
[0019] Figure 4 It is a schematic vertical cross-sectional view of the multi-frequency phase shifter provided by the present invention.
[0020] Figure 5 It is a schematic connection diagram of the second pin board and the main feeding network provided by the present invention.
[0021] Figure 6 It is a schematic setting diagram of the main feeding network provided by the present invention.
[0022] Figure 7 It is a simulation diagram of the return loss of the first frequency band phase shifter provided by the present invention when the displacement of the first dielectric plate is 0 mm, 36 mm, and 72 mm respectively.
[0023] Figure 8 It is a simulation diagram of the return loss of the second frequency band phase shifter provided by the present invention when the displacement of the second dielectric plate is 0 mm, 36 mm, and 72 mm respectively.
[0024] Figure 9 It is a measured diagram of the return loss of the first frequency band phase shifter provided by the present invention when the displacement of the first dielectric plate is 0 mm, 36 mm, and 72 mm respectively.
[0025] Figure 10 It is a measured diagram of the return loss of the second frequency band phase shifter provided by the present invention when the displacement of the second dielectric plate is 0 mm, 36 mm, and 72 mm respectively.
[0026] Figure 11 It is a measured diagram of the cross-frequency isolation of the first frequency band phase shifter provided by the present invention when the displacement of the first dielectric plate is 0 mm, 36 mm, and 72 mm respectively.
[0027] Figure 12 It is a measured diagram of the cross-frequency isolation of the second frequency band phase shifter provided by the present invention when the displacement of the second dielectric plate is 0 mm, 36 mm, and 72 mm respectively.
[0028] Figure 13 It is one of the schematic structural diagrams of the multi-frequency antenna provided by the present invention.
[0029] Figure 14 It is another schematic structural diagram of the multi-frequency antenna provided by the present invention.
[0030] Reference numerals: 100, Multi - frequency phase shifter; 10, Cavity; 11, First cavity layer; 12, Second cavity layer; 121, First sub - cavity; 122, Second sub - cavity; 13, Partition board; 14, Cable slot; 15, Card slot; 20, Combiner; 21, Combining network; 30, Phase - shifting board; 31, First - band phase shifter; 311, First board body; 312, First dielectric board; 32, Second - band phase shifter; 321, Second board body; 322, Second dielectric board; 40, First pin board; 50, Second pin board; 60, Main feed network; 200, Radiation unit; 210, Antenna substrate. Detailed implementation manners
[0031] To make the objectives, technical solutions and advantages of the present invention clearer, the technical solutions in the present invention will be clearly and completely described below with reference to the accompanying drawings in the present invention. Apparently, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present invention without making creative efforts shall fall within the protection scope of the present invention.
[0032] The following combines Figures 1-12 to describe the multi - frequency phase shifter of the present invention.
[0033] An embodiment of the present invention provides a multi - frequency phase shifter 100, as Figure 1 and Figure 2 shown, which includes a cavity 10 and a plurality of phase - shifting boards 30. The plurality of phase - shifting boards 30 are arranged in the cavity 10 and are sequentially connected along the length direction of the cavity 10. Adjacent two phase - shifting boards 30 are sequentially connected through a first pin board 40.
[0034] The multi - frequency phase shifter 100 includes at least two phase - shifting boards 30. The at least two phase - shifting boards 30 are independent of each other and are processed independently. Adjacent two phase - shifting boards 30 are connected by a first pin board 40, thus solving the defect that the processing length of the phase - shifting board 30 is too long, resulting in high processing difficulty and high processing cost, and reducing the processing cost and processing difficulty. Specifically, the first pin board 40 includes a board body and electrical pins arranged on the board body. Some electrical pins are inserted and matched with electrical jacks reserved on one phase - shifting board 30, and other electrical pins are inserted and matched with electrical jacks reserved on another phase - shifting board 30. Alternatively, the opposite ends of the first pin board 40 are welded and connected to the two phase - shifting boards 30 one by one to achieve electrical connection.
[0035] In this embodiment, the first pin board 40 is composed of a stack of multiple layers of elastic conductive sheets. Each layer of elastic conductive sheet corresponds to a signal transmission channel of a different frequency band, and adjacent elastic conductive sheets are staggered in the horizontal direction to form an electromagnetic shielding isolation structure; a groove is provided on the contact surface between the phase - shifting board and the first pin board 40, and a matching medium with a gradient change in dielectric constant is embedded in the groove. The dielectric constant of the matching medium changes along the signal transmission direction according to ; where ε r0 is the initial value, k is the slope, and x is the coordinate in the transmission direction.
[0036] Due to the layered arrangement of the elastic conductive sheets, metal alloy materials with different conductive characteristics are selected for each layer of conductive sheet, and gradient configuration is carried out according to the characteristics of the target frequency band.
[0037] For example: beryllium copper alloy conductive sheets are used in the low frequency band (0.5 - 2 GHz), with a thickness of 0.3 mm and an elastic modulus of 128 GPa. Phosphor bronze conductive sheets are used in the middle frequency band (2 - 6 GHz), with a thickness of 0.2 mm and an elastic modulus of 110 GPa. Nitinol shape memory alloy conductive sheets are used in the high frequency band (6 - 18 GHz), with a thickness of 0.1 mm and an elastic modulus of 83 GPa. The surfaces of each layer of conductive sheets are subjected to micro-arc oxidation treatment to form an Al 2 O 3 insulating layer, and the interlayer dielectric constant is controlled between 2.8 - 3.2 to achieve impedance matching.
[0038] These elastic conductive sheets each correspond to signal transmission channels of different frequency bands, ensuring that the multi-frequency phase shifter 100 can process signals of multiple frequency bands simultaneously without mutual interference. Adjacent elastic conductive sheets are arranged in a staggered manner in the horizontal direction, forming an electromagnetic shielding and isolation structure. This structure effectively suppresses the propagation of electromagnetic interference and noise, and improves the signal transmission quality and stability of the multi-frequency phase shifter 100.
[0039] In addition, the groove is embedded with a matching medium with a gradient change in dielectric constant. The dielectric constant of this matching medium shows a specific change law along the signal transmission direction, that is . represents the change rate of the dielectric constant with respect to the transmission direction coordinate x. This matching medium with a gradient change in dielectric constant can effectively adjust the transmission characteristics of the signal, making the signal transmission smoother and more stable inside the multi-frequency phase shifter 100. Moreover, the combination of the deformation compensation of the elastic conductive sheet and the impedance matching of the gradient medium solves the problem of phase distortion in high-frequency pin connections.
[0040] In the multi-frequency phase shifter 100 provided by the embodiment of the present invention, a plurality of phase shift plates 30 are sequentially arranged along the length direction of the cavity 10, and adjacent two phase shift plates 30 are connected by a first pin board 40, thereby shortening the length of a single phase shift plate 30, facilitating processing, being easy for mass production, and helping to reduce the processing cost. Moreover, the combination of the deformation compensation of the elastic conductive sheet and the impedance matching of the gradient medium solves the problem of phase distortion in high-frequency pin connections.
[0041] Such as Figure 1 、 Figure 3 and Figure 4As shown, the phase shift board 30 includes a combiner 20 and a plurality of band phase shifters of different frequency bands. The cavity 10 includes a first cavity layer 11 and a second cavity layer 12 arranged in parallel up and down. The second cavity layer 12 has a plurality of sub-cavities arranged side by side. The combiner 20 is located in the first cavity layer 11, and the plurality of band phase shifters of different frequency bands are respectively arranged in the plurality of sub-cavities. The band phase shifters are connected to the combiner 20 through a second pin board 50.
[0042] It can be understood that via holes are formed between the plurality of sub-cavities to partially conduct between adjacent two sub-cavities.
[0043] As Figure 3 and Figure 4 As shown, the second cavity layer 12 has two sub-cavities, namely a first sub-cavity 121 and a second sub-cavity 122 arranged side by side; the phase shift board 30 has two band phase shifters of different frequency bands, namely a first band phase shifter 31 and a second band phase shifter 32. The first band phase shifter 31 is arranged in the first sub-cavity 121, and the second band phase shifter 32 is arranged in the second sub-cavity 122.
[0044] By means of the arrangement of the partition board 13 and the sub-cavities, the combiner 20 and the phase shifters of each frequency band are respectively arranged in different cavities 10, reducing the mutual influence and interference between the combiner 20 and the phase shifters of each frequency band, improving the isolation degree between the combiner 20 and the phase shifters of each frequency band, and further enhancing the performance of the multi-band phase shifter 100. At the same time, when the overall size of the cavity 10 remains unchanged, the physical sizes of the respective sub-cavities will relatively decrease, so that the resonant frequency of the cavity 10 can be increased to be far from the operating frequency of the multi-band phase shifter 100, thereby effectively avoiding the occurrence of resonance phenomena, ensuring that the performance of the multi-band phase shifter 100 remains good and stable throughout the operating frequency band, and being suitable for application in multi-band antennas.
[0045] Both the first band phase shifter 31 and the second band phase shifter 32 are formed by sequentially connecting a plurality of phase shift boards 30 through a first pin board 40. Thus, without affecting the performance of the phase shifter, the circuit board length of the band phase shifters of different frequency bands is shortened, thereby reducing the processing cost and processing difficulty, and solving the defect that the processing length of the phase shift board 30 is too long, resulting in high processing difficulty and high processing cost.
[0046] The multi-band phase shifter 100 provided by the embodiment of the present invention arranges the combiner 20 and the band phase shifters of different frequency bands in different cavity layers of the same cavity 10. The band phase shifters are electrically connected to the combiner 20 through a second pin board 50. Thus, while not affecting the electrical performance of the phase shifter, the multi-band, miniaturization and integration of the multi-band phase shifter 100 are improved.
[0047] Specifically, the first cavity layer 11 and the second cavity layer 12 are separated by a partition plate 13, and the partition plate 13 is provided with a through hole for the second pin board 50 to pass through.
[0048] As Figure 3 and Figure 4 shown, the partition plate 13 separates the first cavity layer 11 and the second cavity layer 12, and the combiner 20 and the frequency band phase shifter are respectively arranged on opposite sides of the partition plate 13. Thus, the partition plate 13 is the bottom plate of the first cavity layer 11, the top plate of the second cavity layer 12, and the partition plate 13 forms a common cavity wall between the first cavity layer 11 and the second cavity layer 12.
[0049] The second pin board 50 passes through the through hole, so that one end of the second pin board 50 is accommodated in the first cavity layer 11 and electrically connected to the combiner 20, and the other end is accommodated in the second cavity layer 12 and electrically connected to the frequency band phase shifter. The size of the through hole is equivalent to the size of the second pin board 50, so as to restrict the position of the second pin board 50 by means of the through hole.
[0050] As Figure 3 and Figure 4 shown, a cable groove 14 is provided on the outer wall of the cavity 10, and the cable groove 14 is used to accommodate a coaxial cable electrically connected to the combiner 20 and the frequency band phase shifter. Among them, the coaxial cable is used to feed power to the combiner 20 and the frequency band phase shifter connected thereto.
[0051] Specifically, cable grooves 14 are respectively provided on the outer wall of the cavity 10 corresponding to the first cavity layer 11 and the second cavity layer 12. As Figure 3 shown, the cable groove 14 includes a first cable groove 14 corresponding to the first cavity layer 11 and a second cable groove 14 corresponding to the second cavity layer 12. The coaxial cable connected to the combiner 20 is clamped in the first cable groove 14, and the coaxial cable connected to the frequency band phase shifter is clamped in the second cable groove 14.
[0052] The first cavity layer 11 and the sub-cavity are respectively provided with card slots 15, the frequency band phase shifter is inserted into the card slot 15 of the sub-cavity, and the combiner 20 is inserted into the card slot 15 of the first cavity layer 11. Of course, the frequency band phase shifter can also be fixed in the sub-cavity by means of screws. Similarly, the combiner 20 can be fixed in the first cavity layer 11 by means of screws.
[0053] As Figure 3 and Figure 4 shown, card slots 15 are respectively provided on the opposite side cavity walls of the first cavity layer 11, the two card slots 15 are arranged oppositely, and the opposite sides of the combiner 20 are clamped in the two card slots 15, thereby fixing the frequency band phase shifter in the first cavity layer 11 and forming a gap with the partition plate 13. Similarly, card slots 15 are respectively provided on the opposite side cavity walls of each sub-cavity, the two card slots 15 are arranged oppositely, and the opposite sides of the frequency band phase shifter are clamped in the two card slots 15 in the same sub-cavity.
[0054] Among them, the frequency band phase shifter includes a board body with a phase shift circuit and a dielectric board that can be movably installed in the sub-cavity. The board body is clamped and fixed in the card slot 15. An accommodating space is formed between the upper and lower sides of the board body and the cavity wall of the sub-cavity respectively, and the dielectric board is arranged in the accommodating space on one side. Specifically, the first frequency band phase shifter 31 includes a first board body 311 and a first dielectric board 312, and the second frequency band phase shifter 32 includes a second board body 321 and a second dielectric board 322. The first board body 311 and the second board body 321 are respectively formed by connecting a plurality of phase shift boards 30 through a first pin board 40.
[0055] As Figure 5 and Figure 6 shown, the multi-frequency phase shifter 100 further includes a main feeding network 60, and the main feeding network 60 is integrated on the dielectric substrate of the combiner 20. The main feeding network 60 is arranged in the vacant area of the combiner 20 close to the phase shifter input port. By integrating the main feeding network 60 on the dielectric substrate of the combiner 20, the structure of the multi-frequency phase shifter 100 is further simplified, which helps to achieve miniaturization and integration.
[0056] Optionally, the main feeding network 60 adopts a stripline. Theoretically, at the 2200 MHz frequency band, the loss of the coaxial cable is 0.56 dB / m, and the insertion loss of the stripline is 0.22 dB / m. The insertion loss per meter of the stripline is 0.34 dB / m lower than that of the coaxial cable. Therefore, adopting the stripline for the main feeding network 60 can further reduce the insertion loss of the feeding network.
[0057] Specifically, the main feeding network 60 and the combining network 21 on the combiner 20 are arranged on different layer copper tapes of the dielectric substrate. For example, the main feeding network 60 is arranged on the lower layer copper tape of the dielectric substrate, and the combining network 21 is located on the upper layer copper tape of the dielectric substrate.
[0058] Both the first frequency band phase shifter 31 and the second frequency band phase shifter 32 are integrated with a power dividing network and a phase compensation network.
[0059] When the first frequency band phase shifter 31 is connected to the combiner 20 through the second pin board 50, the combining network 21 on the combiner 20 is electrically connected to the power dividing network and the phase compensation network on the first frequency band phase shifter 31 through the second pin board 50. When the second frequency band phase shifter 32 is connected to the combiner 20 through another second pin board 50, the combining network 21 on the combiner 20 is electrically connected to the power dividing network and the phase compensation network on the second frequency band phase shifter 32 through this pin board.
[0060] In the multi-frequency phase shifter provided by the embodiment of the present invention, the echo loss simulation diagrams of the first frequency band phase shifter 31 and the second frequency band phase shifter 32 are respectively as Figure 7 and Figure 8As shown in the figure. Among them, when the first dielectric plate 312 moves 0 mm, 36 mm, and 72 mm, the first dielectric plate 312 is located at the left, middle, and right positions respectively. At this time, the simulated return loss value of the first frequency band phase shifter 31 is between -20 dB and -40 dB. As Figure 9 shown, the actual return loss value of the first frequency band phase shifter 31 is between -20 dB and -40 dB, and is concentrated between -20 dB and -30 dB, with less reflection and higher propagation speed. Similarly, when the second dielectric plate 322 moves 0 mm, 36 mm, and 72 mm, the second dielectric plate 322 is located at the left, middle, and right positions respectively. At this time, as Figure 8 shown, the simulated return loss value of the second frequency band phase shifter 32 is between -23 dB and -36 dB, as Figure 10 shown, the actual return loss value of the second frequency band phase shifter 32 is between -20 dB and -40 dB, and the reflection and signal loss meet the requirements.
[0061] As Figure 11 shown, when the first dielectric plate 312 moves 0 mm, 36 mm, and 72 mm, the first dielectric plate 312 is located at the left, middle, and right positions respectively. At this time, the measured value of the cross-frequency isolation of the first frequency band phase shifter 31 is between -30 dB and -50 dB. As Figure 12 shown, when the second dielectric plate 322 is located at the left, middle, and right positions respectively, the measured value of the cross-frequency isolation of the second frequency band phase shifter 32 is between -30 dB and -55 dB.
[0062] In addition, as Figure 13 and Figure 14 shown, the embodiment of the present invention also provides a multi-frequency antenna, which includes: a radiation unit 200 and the multi-frequency phase shifter 100 as described above. The multi-frequency phase shifter 100 is fed and connected to the radiation unit 200 through a coaxial cable shorter than 1.5 times the wavelength.
[0063] Specifically, the multi-frequency antenna includes an antenna substrate 210, and a plurality of radiation units 200 are provided on the antenna substrate 210. Among them, fourteen radiation units 200 are in a row, and a plurality of radiation units 200 form four rows, and two multi-frequency phase shifters 100 as described above are arranged in each row. The multi-frequency phase shifter 100 is fed and connected to the radiation unit 200 through a coaxial cable shorter than 1.5 times the wavelength, so that the antenna has higher gain and higher radiation power.
[0064] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention.
Claims
1. A multi-frequency phase shifter, characterized in that: include: A cavity and a plurality of phase shifting plates; A plurality of the phase shifting plates are arranged in the cavity and connected in sequence along the length direction of the cavity, and two adjacent phase shifting plates are connected in sequence through a first pin board; The first pin board is composed of multiple layers of elastic conductive sheets stacked together, each layer of the elastic conductive sheets corresponds to a signal transmission channel of a different frequency band, and adjacent elastic conductive sheets are staggered in the horizontal direction to form an electromagnetic shielding isolation structure; A contact surface between the phase shift plate and the first pin board is provided with a groove, and a matching medium with a gradient dielectric constant is embedded in the groove.
2. The multi-frequency phase shifter according to claim 1, characterized in that: The phase shifter plate includes a combiner and a plurality of frequency band phase shifters of different frequency bands. The cavity includes a first cavity layer and a second cavity layer arranged in parallel up and down. The second cavity layer has a plurality of sub-cavities arranged side by side. The combiner is located in the first cavity layer. The plurality of frequency band phase shifters of different frequency bands are arranged one by one in the plurality of sub-cavities. The frequency band phase shifters are connected to the combiner through a second pin board.
3. The multi-frequency phase shifter according to claim 2, characterized in that: The first cavity layer and the second cavity layer are separated by a partition plate, and the partition plate is provided with a through hole for the second pin board to pass through.
4. The multi-frequency phase shifter according to claim 2, characterized in that: The outer wall of the cavity is provided with a cable groove, and the cable groove is used to accommodate a coaxial cable electrically connected to the combiner and the frequency band phase shifter.
5. The multi-frequency phase shifter according to claim 2, characterized in that: The first cavity layer and the sub-cavity are respectively provided with card slots, the frequency band phase shifter is inserted into the card slot of the sub-cavity, and the combiner is inserted into the card slot of the first cavity layer.
6. The multi-frequency phase shifter according to claim 2, characterized in that: It also includes a main feed network, which is integrated into the dielectric substrate of the combiner.
7. The multi-frequency phase shifter according to claim 6, characterized in that: The main feed network adopts strip lines.
8. The multi-frequency phase shifter according to claim 6, characterized in that: The main feed network and the combining network on the combiner are arranged on different layers of copper tapes on the dielectric substrate.
9. The multi-frequency phase shifter according to claim 2, characterized in that: The frequency band phase shifters of multiple different frequency bands are all integrated with a power division network and a phase compensation network.
10. A multi-frequency antenna, characterized in that: include: A radiating unit and a multi-frequency phase shifter as claimed in any one of claims 1 to 9, wherein the multi-frequency phase shifter is electrically connected to the radiating unit via a coaxial cable shorter than 1.5 times the wavelength.
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