High-shielding KaKu coaxial waveguide power amplifier device

Abstract

The invention relates to the field of ground station satellite communication, in particular to a high-shielding KaKu coaxial waveguide power amplifier device. Comprising a top plate, a bottom plate and peripheral side plates; the power amplifier assembly is arranged in the shell; the power amplifier assembly comprises a KaKu coaxial OMT waveguide which comprises a square waveguide and a circular waveguide; the transmission module comprises a receiving module and a transmitting module; a waveguide; a gas-permeable membrane; the radiating module comprises a radiator and a fixing plate of the radiator; the waveguide power amplifier device is used for solving the problems of large size, heavy weight, serious stray leakage of internal modules, difficulty in debugging and poor heat dissipation performance caused by insufficient compact layout in the existing waveguide power amplifier device. Synchronous polarization filtering in a Ka frequency band and a Ku frequency band and compact layout of internal modules are realized through the power amplifier assembly, so that the size and the weight of the power amplifier assembly are reduced, and debugging is facilitated; signal leakage loss and internal stray are reduced through the waveguide; the waterproof performance effect is improved through the breathable film and the waterproof sealing strip; the heat dissipation performance is improved through the heat dissipation module.

Description

Technical Field

[0001] The present invention relates to the field of ground station satellite communication, and more specifically, to a high-shielding KaKu coaxial waveguide power amplifier device. Background Art

[0002] In multiple fields such as satellite communication, military radar, and radio astronomy, there are various requirements for power amplifier types. In order to achieve high power requirements, the product structure is often designed to be large in volume, heavy in weight, with serious stray leakage in internal modules, difficult to debug, and poor heat dissipation performance, which seriously affects the mobility of mobile carriers and the safety and reliability of equipment systems. At the same time, the complex installation and testing lead to many inconveniences during the transportation and use of the product.

[0003] The layout of each module in the product affects the volume and weight, and thus affects the overall heat dissipation effect of the product. How to design a power amplifier device that not only has the characteristics of light weight, small volume, easy to test, and easy to transport, but also can meet the good heat dissipation effect of the whole machine and can work normally even in a high-temperature environment is an urgent problem to be solved in this field. Summary of the Invention

[0004] The present invention aims to overcome at least one defect (shortcoming) of the above-mentioned prior art, and provides a high-shielding KaKu coaxial waveguide power amplifier device for solving the problems of large volume, heavy weight, serious stray leakage in internal modules, difficult debugging, and poor heat dissipation performance caused by the insufficiently compact layout in the existing waveguide power amplifier device.

[0005] The technical solution adopted by the present invention is to provide a high-shielding KaKu coaxial waveguide power amplifier device, which includes: a housing including a top plate, a bottom plate, and side plates around; a power amplifier component disposed inside the housing; the power amplifier component includes: a KaKu coaxial OMT waveguide located on the same central axis as the front and rear side central axes of the housing, including a rectangular waveguide and a circular waveguide; a transmission module including a receiving module and a transmitting module located inside the housing and respectively connected to both sides of the KaKu coaxial OMT waveguide; a waveguide disposed on a through hole of the front side plate of the housing and connected to the KaKu coaxial OMT waveguide; a waterproof component including a breathable film and a waterproof seal strip disposed on the through hole for breathable waterproofing of the KaKu coaxial OMT waveguide; a heat dissipation module including a radiator and its fixing plate, the radiator is disposed on the rear side plate of the housing, and the fixing plate fixes the radiator to the rear side plate.

[0006] It is beneficial to improve the adaptability of the power amplifier component placed in the outdoor environment through the housing; realize the synchronous polarization filtering of the Ka band and the Ku band in the power amplifier component through the KaKu coaxial OMT waveguide; realize the compact layout of the internal modules of the power amplifier component through the connection position of the transmission module, thereby reducing the volume and weight of the power amplifier component; transmit the high power of the power amplifier component to the antenna at the cut-off frequency through the waveguide to reduce the signal leakage loss; realize the waterproof effect of the power amplifier component through the breathable film and the waterproof seal strip; realize the good heat dissipation of the power amplifier component through the heat dissipation module.

[0007] Further, the common end of the KaKu coaxial OMT waveguide includes a circular waveguide and four rectangular waveguides. The circular waveguide is located in the center, and the rectangular waveguides are located around the circular waveguide.

[0008] It is beneficial to limit the propagation mode of electromagnetic waves to the TM mode through the circular waveguide, limit the propagation mode of electromagnetic waves to the TE mode through the rectangular waveguide, and form the complementary characteristics of mode selection, the mechanical flexibility of spatial layout and the frequency band adaptability through the combination of the two waveguides at the common end, so as to significantly improve the system bandwidth, power capacity and anti-interference ability.

[0009] Further, the receiving module includes two enclosed structures connected by cables, the receiving intermediate frequency module located above and the receiving driving module located parallel below it; the transmitting module includes two enclosed structures connected by cables, the transmitting intermediate frequency module located above and the transmitting driving module located parallel below it; both the receiving driving module and the transmitting driving module are connected to the bottom plate.

[0010] It is beneficial to realize the reflection and absorption of radio frequency signals in the complete enclosed metal structure through the enclosed structure, so as to achieve the shielding effect; realize the compact miniaturization of the power amplifier component through the position layout of the receiving intermediate frequency module, the receiving driving module, the transmitting intermediate frequency module and the transmitting driving module in cooperation with the ports of the KaKu coaxial OMT waveguide, thereby reducing the signal leakage effect.

[0011] Further, the receiving intermediate frequency module, the receiving driving module, the transmitting intermediate frequency module and the transmitting driving module are all provided with shielding grooves and through-wall coaxial connectors. The shielding grooves are silver-plated shielding strips for reducing spurious signals. The through-wall coaxial connectors are arranged at both ends of each module, and the through-wall coaxial connectors are tightened in each module by threads, so that each module is in a closed state to prevent electromagnetic signal leakage.

[0012] It is beneficial to restrict the propagation and interference of radio frequency signals through the shielding grooves, causing the radio frequency signals to be reflected, absorbed, and scattered, thereby reducing spurious emissions and maintaining the purity of signal transmission; the good electrical conductivity of the silver-plated shielding strip effectively plays the role of absorbing and reflecting radio frequency signals; the through-wall coaxial connector makes the installation and disassembly tests more convenient, and at the same time avoids the opening of the internal module from damaging the integrity of the whole machine and improves the spurious shielding performance.

[0013] Further, the receiving drive module and the transmitting drive module are respectively connected to their module bottom cases through a conductive adhesive coating, and the conductive adhesive coating is used to closely adhere to the contact of the two planes, so that eddy currents are generated in the module by the high-frequency electromagnetic field to achieve electromagnetic shielding.

[0014] It is beneficial to fill the gaps in the small sizes and complex structures between the drive module and the module bottom case through the good plasticity of the conductive adhesive coating, avoiding leakage during the transmission of radio frequency electromagnetic waves caused by the inability to fully fit to the theoretical plane due to processing accuracy. The filled gaps cause eddy currents to be generated in the module by the internal high-frequency electromagnetic field, thus avoiding the generation of interfering magnetic fields with the external power electromagnetic field and achieving the purpose of electromagnetic shielding.

[0015] Further, the receiving drive module and the transmitting drive module are respectively connected to the bottom plate through indium sheets, and the indium sheets are used to dissipate the heat of the power amplifier component, avoiding the bare chips on the internal PCB of the power amplifier component from being overheated for a long time, which affects the service life and loss of the chips.

[0016] It is beneficial to make the contact surface between the heating element and the heat dissipation element closely fit through the easy integration of the indium sheet, and reduce the conduction thermal resistance to improve the heat dissipation efficiency.

[0017] Further, an electromagnetic wave absorbing component is provided in the shielding groove, and the electromagnetic wave absorbing component is used to absorb electromagnetic waves, thereby achieving the blocking of mutual interference between electromagnetic waves.

[0018] It is beneficial to further reflect, absorb, and scatter radio frequency signals through the cooperation of the electromagnetic wave absorbing material in the shielding groove, thereby reducing spurious emissions and further enhancing the shielding effect of the shielding groove.

[0019] Further, the cross-section of the top plate and / or the bottom plate is trapezoidal, and a plurality of heat dissipation teeth are evenly provided on the upper surface of the top plate and / or the bottom plate, and the heights of the respective heat dissipation teeth are the same; the bottom plate is also provided with a heat dissipation copper pipe for improving the heat dissipation efficiency of the power amplifier component.

[0020] It is beneficial to dissipate the heat released by the power amplifier component along the top plate through the heat dissipation teeth of the top plate, thereby improving the heat dissipation efficiency; the high thermal conductivity of the heat dissipation copper pipe of the bottom plate realizes efficient heat dissipation.

[0021] Furthermore, a waterproof groove is provided at the bottom of the surrounding side plates.

[0022] This is conducive to achieving a waterproof effect during the use of the power amplifier component in an outdoor environment through the waterproof groove.

[0023] Furthermore, the radiator is a fan, and there are two of them, respectively arranged at the rear sides of the receiving module and the transmitting module.

[0024] This is conducive to dissipating the heat of the receiving module and the transmitting module from the housing in a timely manner through the installation positions of the radiators, so as to improve the heat dissipation effect of the power amplifier component.

[0025] Compared with the prior art, the beneficial effects of the present invention are as follows: improving the adaptability of the power amplifier component placed in an outdoor environment through the outer shell; realizing synchronous polarization filtering in the Ka band and the Ku band and the compact layout of its internal modules through the power amplifier component, thereby reducing the volume and weight of the power amplifier component and facilitating debugging; reducing signal leakage loss and internal spurious through the waveguide; improving the waterproof performance through the breathable film; and improving the heat dissipation performance through the heat dissipation module. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is the left axonometric view of the present invention.

[0027] Figure 2 It is the right axonometric view of the present invention.

[0028] Figure 3 It is the schematic diagram of the waterproof groove of the present invention.

[0029] Description of the reference numerals in the drawings: Outer shell 100, Top plate 111, Bottom plate 112, Waterproof groove 120, Power amplifier component 200, KaKu coaxial OMT waveguide 210, Waveguide 220, Cable 230, Transmission module 240, Receive intermediate frequency module 241, Receive drive module 242, Transmit intermediate frequency module 243, Transmit drive module 244, Bent waveguide 245, Breathable film 250, Heat dissipation module 260, Fan 261, Fan fixing plate 262. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0030] The drawings of the present invention are only for illustrative purposes and should not be construed as a limitation to the present invention. For better illustrating the following embodiments, some components in the drawings will be omitted, enlarged or reduced, which do not represent the dimensions of the actual product; for those skilled in the art, it is understandable that some well-known structures and their descriptions in the drawings may be omitted. Embodiment

[0031] As Figures 1-3As shown, this embodiment provides a high-shielding KaKu coaxial waveguide power amplifier device, which includes: a housing 100, including a top plate 111, a bottom plate 112 and surrounding side plates; a power amplifier component 200, which is arranged in the housing 100; the power amplifier component 200 includes: a KaKu coaxial OMT waveguide 210, which is located at the same axis as the front and rear center axes of the housing 100, including a square waveguide and a circular waveguide; a transmission module 240, which is located on the inner side of the housing 100 and is connected to the KaKu coaxial OMT A receiving module and a transmitting module are respectively connected on both sides of the waveguide 210; a waveguide 220 is arranged on the through hole of the front side plate of the housing 100 and is connected to the KaKu coaxial OMT waveguide 210; a waterproof component, including a breathable membrane 250 and a waterproof sealing strip, is arranged on the through hole, and is used for the breathability and waterproofing of the KaKu coaxial OMT waveguide 210; a heat dissipation module 260, including a radiator and a fixing plate thereof, the radiator is arranged on the rear side plate of the housing 100, and the fixing plate fixes the radiator to the rear side plate.

[0032] In this embodiment, the KaKu coaxial waveguide power amplifier device is in the shape of a rectangular parallelepiped, with a top plate 111 located on the upper side, a bottom plate 112 located on the lower side, a waveguide 220 and a breathable membrane 250 located on the front side, a heat dissipation module 260 located on the rear side, a receiving module located on the left side, and a transmitting module located on the right side. The surrounding side panels include a front side panel, a rear side panel, a left side panel, and a right side panel. The KaKu coaxial OMT waveguide 210 is an integrated structure. Designing the square waveguide and the circular waveguide as one can also reduce the design cost. When the whole machine is tested, only one test module needs to be connected to the outside to perform the whole machine performance test, which improves the convenience of the test. At the same time, the design of the internal module can save the internal module space, thereby miniaturizing the whole machine. The transmission module 240 is symmetrically arranged around the KaKu coaxial OMT waveguide 210, and the receiving module and the transmitting module are each arranged on one side, and are respectively connected through two transfer waveguide ports on the KaKu coaxial OMT waveguide 210, so that the layout of the power amplifier component 200 is compact and does not interfere with each other. The waveguide 220 realizes directional guidance of electromagnetic waves, thereby realizing mode switching between the Ka band and the Ku band. The front side of the waveguide 220 is connected to an external interface, and the back side of the waveguide is connected in sequence to a breathable membrane 250 and the housing of the whole machine. The breathable membrane 250 is installed on the waveguide 220 and the housing 100 for waterproofing and dustproofing. It can also be used in a closed module to avoid deformation of the housing caused by excessive heat generation and increased pressure inside the module. The breathable membrane 250 can quickly balance the air pressure, so that it can assist in heat dissipation while being waterproof. At the same time, since the dielectric constant of the breathable membrane 250 is low and close to that of air, it can achieve the effect of reducing signal loss and increasing transmission speed, and avoid the high dielectric constant affecting the performance of the module. The heat dissipation module 260 provides centralized air cooling for the power amplifier component 200, so that the power amplifier component 200 can achieve the effect of rapid heat dissipation.

[0033] In this embodiment, an orthomode transducer (OMT), also known as an orthomode converter, is an important component of the power amplifier system and is used to separate or mix two orthogonally polarized waves. The KaKu coaxial OMT waveguide separates orthogonally polarized signals through an asymmetric structure. When the main waveguide transmits vertically polarized waves, the side waveguide extracts horizontally polarized waves through coupling holes. The electric field of the TE10 mode in the rectangular waveguide is perpendicular to the wide side, while the electric field of the TE01 mode is perpendicular to the narrow side. The TE11 mode in the circular waveguide supports orthogonal linear polarization or circular polarization. During the coupling transformation process, a specific structure of a mode converter or a directional coupler can be used to achieve controllable coupling, and the coupled mode theory can be combined to optimize energy transfer. A mode converter is a tapered waveguide that gradually converts the TE10 mode into the TE01 mode; a directional coupler realizes directional energy transmission through coupling holes in adjacent waveguides, and the coupling degree is determined by the hole size and spacing; the coupled mode theory is based on the coupling equation, and when the phases of two modes match, the energy exchange efficiency is the highest.

[0034] In this embodiment, it further includes a humidity monitoring device provided on the housing 100. The heat dissipation module further includes a control component and an auxiliary heating element. When the humidity inside the housing 100 exceeds a certain threshold, the humidity monitoring device sends a signal to the control component according to the humidity on the housing 100 to determine whether the humidity exceeds the threshold; if it exceeds the threshold, the control component controls the fan 261 in the heat dissipation module 260 to stop operating; the heat accumulated by the power amplifier component 200 inside the housing evaporates the water droplets, which turn into water vapor and then pass through the breathable membrane 250; when necessary, the auxiliary heating element accelerates the heat on the housing 100 and dries and heats it to quickly evaporate the water droplets on the housing 100 to keep the housing 100 dry until the humidity on the housing 100 detected by the humidity monitoring device is within the threshold range.

[0035] The common end of the KaKu coaxial OMT waveguide 210 includes a circular waveguide and four rectangular waveguides. The circular waveguide is located at the center, and the rectangular waveguides are located around the circular waveguide.

[0036] In this embodiment, the circular waveguide is installed at the axis of the KaKu coaxial OMT waveguide 210, and the rectangular waveguide is distributed around the circular waveguide, so that the KaKu coaxial OMT waveguide 210 is more flexible when changing the signal mode. The circular waveguide supports more modes, and the surface current distribution of the TE01 mode in the millimeter wave / terahertz frequency band is uniform, with lower conductor loss. The rectangular waveguide has a narrower cut-off frequency and single-mode bandwidth, and the metal wall structure has better heat dissipation, making it suitable for high-power transmission (such as radar transmitters). When the two are combined, the multi-mode performance of the circular waveguide can be used to expand the bandwidth in a wide-band frequency system, while the rectangular waveguide can ensure mode purity in the key frequency band. In addition, in the scenario where high power and high frequency are required, the rectangular waveguide is used to transmit high-power signals and then the circular waveguide is used to reduce high-frequency loss, so as to achieve the effects of low loss in the high-frequency band and high stability in the low-frequency band.

[0037] In this embodiment, when the KaKu coaxial OMT waveguide 210 is interconnected with the internal modules in the power amplifier assembly 200, a bent waveguide 245 is used and installed by screws. When each module is interconnected, due to the skin effect of the inherent resistance of the conductor being aggravated at high frequencies, the effective resistance of the conductor in each module increases, resulting in signal loss. Using a bent waveguide 245 made of metal material as the interconnection component can reduce the interconnection loss.

[0038] The receiving module includes two enclosed structures connected by a cable 230, the receiving intermediate frequency module 241 located above and the receiving drive module 242 located parallel below it; the transmitting module includes two enclosed structures connected by a cable 230, the transmitting intermediate frequency module 243 located above and the transmitting drive module 244 located parallel below it; both the receiving drive module 242 and the transmitting drive module 244 are connected to the bottom plate 112.

[0039] In this embodiment, the cables 230 connecting the receiving intermediate frequency module 241 and the receiving drive module 242, and the transmitting intermediate frequency module 243 and the transmitting drive module 244 are all high-shielding cables 230. Through the installation and connection of the high-shielding cables 230, not only is the installation and testing between modules more convenient, but also the spurious of each module is reduced. The enclosed and complete receiving module and drive module can reflect and absorb the radio frequency signals inside the module, thus playing a role in restricting the propagation of radio frequency signals. The drive module is connected to the bottom plate 112 of the housing 100. The cross-section of the housing 100 near the bottom plate 112 is trapezoidal, and the surface area of the bottom plate 112 is smaller than the maximum surface area of the top view of the housing 100. The bottom plate 112 is not only used for wind and water protection, but also can form a closed power amplifier device to reduce the spurious of the power amplifier assembly 200 and improve its working performance.

[0040] In this embodiment, the high-shielding cable is mainly used to suppress electromagnetic interference (EMI) and radio frequency interference (RFI) to ensure the stability and security of signal transmission. The high-shielding cable is classified into coaxial cables, twisted pair shielded cables, multi-layer shielded cables, and shielded flat cables according to its structure, and into aluminum foil shielding, braided shielding, combined shielding, and conductive polymer shielding according to the shielding material. It is classified into triaxial cables, armored shielded cables, and EMI / RFI special shielded cables according to special usage scenarios. In this embodiment, a double-layer shielding of aluminum foil and braided mesh is selected, taking into account the advantages of both aluminum foil shielding and braided shielding. It can not only be suitable for high-frequency interference suppression to produce a high coverage effect, but also have high mechanical strength to produce an anti-low-frequency interference effect, thereby improving the overall anti-interference ability.

[0041] The receiving intermediate frequency module 241, the receiving drive module 242, the transmitting intermediate frequency module 243, and the transmitting drive module 244 are all provided with shielding grooves and through-wall coaxial connectors. The shielding grooves are silver-plated shielding strips for reducing spurious signals. The through-wall coaxial connectors are provided at both ends of each module, and the through-wall coaxial connectors are tightened in each module by threads to keep each module in a closed state to prevent electromagnetic signal leakage.

[0042] In this embodiment, during the installation process of the receiving intermediate frequency module 241, the receiving drive module 242, the transmitting intermediate frequency module 243, and the transmitting drive module 244, the shielding grooves and through-wall coaxial connectors need to be connected and installed first, and then the above modules are installed on the KaKu coaxial OMT waveguide 210 through the bent waveguide 245. Then, the connected KaKu coaxial OMT waveguide 210 is installed on the bottom plate 112, and then the top plate 111 is fixedly closed to the bottom plate 112 with screws. The shielding grooves are used for electromagnetic isolation, noise suppression, and signal integrity protection.

[0043] In this embodiment, the shielding groove is a silver-plated shielding strip, and silver-aluminum omnidirectional conductive rubber of model CE5001ZD4 is selected. This model is a material compounded from ordinary silicone rubber as the base material and conductive powder with excellent conductivity through a series of complex processing techniques such as mixing and vulcanization. The flexibility of the silicone rubber itself is combined with the conductive particles, which can not only meet the requirements of conductive grounding and EMI shielding but also achieve environmental sealing. Among them, the types of conductive particles include silver-plated aluminum, silver-plated glass, silver-plated nickel, silver-plated copper, nickel-plated aluminum, and nickel-coated graphite, etc. The elastomeric base material is mainly silicone rubber or fluorosilicone rubber. The silver-plated shielding strip can also be a cable wound in a PFA (a special fluoroplastic) tube. This cable has a special double-insulation structure, which can effectively resist electromagnetic interference. The outer layer is a silver shielding layer, and the main function of this layer is to shield electromagnetic waves. During signal transmission, the silver shielding layer introduces electromagnetic waves into the ground wire, thereby eliminating the interference of electromagnetic waves on the signal wire. At the same time, due to the double-insulation structure of the cable, the cable is more stable and the possibility of the cable itself generating electromagnetic interference is reduced.

[0044] In this embodiment, the shielding groove can also be set as a continuous closed conductive barrier loop surrounding the transmitting module and the driving module. A plurality of grounding vias are evenly distributed on the shielding groove, and the spacing does not exceed λ / 10 (λ is the wavelength of the highest interference frequency), and it is ensured that the shielding groove is directly connected to the system ground plane, avoiding grounding through long traces, so that the shielding groove maintains a low-impedance ground. Thus, the same shielding effect as that of the silver-plated shielding strip is achieved.

[0045] In this embodiment, the through-wall coaxial connector is used to transmit the signal of the coaxial module through the physical barrier, while maintaining signal integrity, shielding external interference, and providing mechanical fixation and sealing protection. The through-wall coaxial connector is installed on the housing 100 to connect the test instrument and the power amplifier component to be measured, so that the test signal remains connected with low loss. The through-wall coaxial connector in this embodiment has a through-wall SMP structure at both ends. Compared with the traditional surface-mount SMP structure that requires through-holes for installation on the housing 100, which destroys the integrity of the module, the through-wall SMP structure at both ends has better stray shielding performance, and at the same time, it can make the power amplifier component 200 fit completely with the bottom plate 112, so that the heat generated by the power amplifier component 200 can be quickly dissipated.

[0046] The receiving driving module 242 and the transmitting driving module 244 are respectively connected to their module bottom cases through a conductive adhesive coating. The conductive adhesive coating is used to closely contact the two planes, so that eddy currents are generated in the module by high-frequency electromagnetic fields to achieve electromagnetic shielding.

[0047] In this embodiment, the conductive adhesive coating is applied between the receiving and driving module 242 and the bottom case of the whole machine, and between the transmitting and driving module 244 and the bottom case of the whole machine. Both the receiving and driving module 242 and the transmitting and driving module 244 are pressed against the bottom case of the whole machine by screws. When two metal surfaces need to be in direct contact, due to processing precision, it is impossible to achieve complete fitting of the two metal surfaces. Therefore, the conductive adhesive coating has good plasticity and can completely fill the gap between the unfitted metal surfaces, so as to form a complete closed structure between the receiving and driving module 242 and the bottom case of the whole machine, thus forming a circuit that can shield the electromagnetic field, making the internal high-frequency electromagnetic field generate eddy currents within the module, avoiding the mutual interference magnetic field between the internal and external power electromagnetic fields of the module, and thus achieving the purpose of electromagnetic shielding.

[0048] In this embodiment, the conductive adhesive coating includes metal-based conductive adhesive and non-metal-based conductive adhesive. The metal-based includes silver-based, copper-based, and nickel-based, and the non-metal-based includes carbon-based and composite fillers. There is a high demand for high conductivity between the driving module and the bottom plate 112. For the need to comprehensively consider costs and improve performance, the conductive adhesive coating in this embodiment selects silver-based adhesive or silver-carbon composite adhesive. The coating process of the conductive adhesive coating can adopt spraying or printing process, combined with high-precision thickness detection equipment to ensure that the coating thickness is uniform and meets the optimal design value. In the coating process, spin coating and ultrasonic-assisted coating technologies are used to improve the uniformity of the coating, and then surface flatness detection is carried out to timely detect and repair uneven parts. After the coating is completed, the curing of the conductive adhesive adopts a combination of ultraviolet curing and thermal curing to ensure that the conductive adhesive can be fully cured, improve its bonding strength and conductivity with the bottom plate, and thus stably realize the electromagnetic shielding function.

[0049] The receiving and driving module 242 and the transmitting and driving module 244 are respectively connected to the bottom plate 112 through indium sheets. The indium sheets are used to dissipate the heat of the power amplifier components, avoiding the bare chips on the internal PCB of the power amplifier components being in an overheated state for a long time, which affects the service life and loss of the chips.

[0050] In this embodiment, the internal PCBs of both the receiving and driving module 242 and the transmitting and driving module 244 are provided with bare chips, and their power is relatively large. In order to achieve rapid heat dissipation to protect the chips from overheating and burning out, it is necessary to connect the receiving and driving module 242 and the bottom case of the whole machine, and the transmitting and driving module 244 and the bottom case of the whole machine through indium sheets. Indium sheets can adapt to special extreme working conditions such as vacuum and low temperature, and at the same time maintain a long-term stable working state. Widely used in the communication field as an interface heat dissipation optimization material, it can not only fill micro gaps but also reduce contact thermal resistance. In the need to protect chips from overheating, it is the most cost-effective choice.

[0051] An absorbing member is provided in the shielding groove, and the absorbing member is used to absorb electromagnetic waves, thereby preventing mutual interference between electromagnetic waves.

[0052] In this embodiment, the absorbing member in the shielding groove converts the electromagnetic wave energy into heat energy through dielectric loss or magnetic loss to reduce the reflection of radio frequency signals, block or weaken the mutual interference of electromagnetic waves inside and outside the magnet. There are many types of materials for the absorbing member, including: carbon-based materials, ferrite materials, metals and their alloys, conductive polymer composites, multi-layer structure materials, absorbing coatings, ceramic matrix composites, nanomaterials, flexible absorbing materials, metamaterials. In the field of communication electronics, nickel-zinc ferrites suitable for high-frequency bands are usually used as shielding materials for electronic devices or magnetic alloy sheets with high magnetic permeability for high-frequency absorption and EMI suppression (electromagnetic interference). Metal powders (aluminum, nickel) can also be incorporated into rubber or coatings to enhance their conductivity and absorbing performance. To further enhance the absorbing effect of the absorbing member, the above materials can be combined with each other.

[0053] The cross-section of the top plate 111 and / or the bottom plate 112 is trapezoidal, and a plurality of heat dissipation teeth are evenly arranged on the upper surface of the top plate 111 and / or the bottom plate 112, and the height of each heat dissipation tooth is the same; the bottom plate 112 is also provided with a heat dissipation copper pipe for improving the heat dissipation efficiency of the power amplifier assembly.

[0054] In this embodiment, the top plate 111 is the upper cover plate of the housing 100 and is fixedly connected by screws. The housing 100 is in a cuboid shape. The cross-section of the top plate 111 is trapezoidal. The heat dissipation teeth are an array formed by a plurality of parallel heat dissipation racks. The cross-section of the array is rectangular, and the cross-section width thereof is smaller than the cross-section width of the upper surface of the top plate 111. To further improve the heat dissipation effect of the heat dissipation teeth, a liquid cooling channel can be embedded in the contact surface between the top plate 111 and the heat dissipation teeth, so that the heat dissipation teeth can combine the effects of air cooling and liquid cooling. In this embodiment, the bottom plate 112, like the top plate 111, is also provided with an integrated heat dissipation tooth structure, so that the heat dissipation direction of the power amplifier assembly 200 can be dissipated along the heat dissipation teeth on the upper and lower sides at the same time.

[0055] A waterproof groove 120 is also provided at the bottom of the surrounding side plates.

[0056] In this embodiment, the cross-section of the bottom of the surrounding side plates is also trapezoidal. The waterproof groove 120 provided thereon includes a U-shaped or V-shaped one, and the depth of the groove body of the waterproof groove 120 is greater than the penetration depth under the expected water pressure. Thus, when the power amplifier device is placed outdoors for work, the water flow is isolated outside the housing 100, keeping the inside of the housing 100 closed and dry.

[0057] In this embodiment, the sealing material of the waterproof groove 120 can be selected from elastic materials such as silicone (high temperature resistant), fluororubber (oil / chemical corrosion resistant), and EPDM (good weather resistance). It is also possible to spray a hydrophobic material (such as a nano - coating) on the surface of the groove body to reduce water adhesion, or to fill the gaps with waterproof glue (such as polyurethane glue, epoxy resin). Drain holes and diversion grooves need to be provided on the waterproof groove 120. The drain holes are arranged at the bottom of the groove body and are paired with a breathable membrane 250 (such as ePTFE) to balance the air pressure. The diversion grooves guide the water flow away from the key areas to avoid water accumulation.

[0058] In this embodiment, the waterproof groove 120 can also be kept in communication with the heat - dissipating teeth through a liquid - cooling pipe. The liquid - cooling pipe includes a horizontal pipe that surrounds the middle of the outer shell in a circle and vertical pipes along the edges of the four side plates of the outer shell. The horizontal pipe is arranged on the outer ring of the waterproof groove 120 to achieve a waterproof isolation state between the coolant and the inside of the outer shell. The coolant is injected from one side of the horizontal pipe and flows along the direction of the vertical pipes to the four vertices of the top plate or the bottom plate of the whole machine outer shell, and then flows out from the other side of the horizontal pipe. Among them, the coolant flowing through the top plate and the coolant flowing through the bottom plate are divided into two branch paths to improve the heat - dissipation efficiency of the top plate and the bottom plate.

[0059] The radiator is a fan 261, and there are two of them, which are respectively arranged at the rear sides of the receiving module and the transmitting module.

[0060] In this embodiment, the radiator is in an air - cooling mode and is arranged at the rear side of the power amplifier assembly 200. Two fans 261 are used to synchronously cool the outer shell. The top plate and the bottom plate of the outer shell are both provided with heat - dissipating teeth. The two fans 261 can be simultaneously aligned with the top plate 111 and the bottom plate 112 to accelerate the air - cooling efficiency of the natural ventilation channels of the heat - dissipating teeth on the top plate 111 and the bottom plate 112. In order to avoid affecting the radio - frequency signal of the power amplifier assembly 200, the two fans 261 are installed on the outside of the outer shell 100 through a fan fixing plate 262, avoiding perforating the sealing structure of the outer shell 100.

[0061] In this embodiment, in order to further enhance the heat dissipation efficiency, liquid cooling pipes are also provided on the top plate 111 and / or the bottom plate 112. When the temperature monitor provided on the housing 100 detects an overheat signal, the coolant in the liquid cooling pipes automatically fills into the liquid cooling pipes built in the top plate 111 and the bottom plate 112. At the same time, the fan 261 continuously operates to combine air cooling and liquid cooling, further accelerating the cooling speed and prolonging the service life of the power amplifier assembly 200. The liquid cooling pipes are arranged at the connection edges of the four surrounding side plates. The flow path of the coolant on the top plate is as follows: The coolant enters the liquid cooling pipe from the middle of the left edge of the front side plate, flows through the left front vertex of the top plate, is divided and flows into the front edge and the left edge of the top plate, converges at the right rear vertex of the top plate, and exits the liquid cooling pipe from the middle of the right edge of the rear side plate. The flow path of the coolant on the bottom plate is as follows: The coolant enters the liquid cooling pipe from the middle of the right edge of the front side plate, flows through the right front vertex of the bottom plate, is divided and flows into the front edge and the right edge of the bottom plate, converges at the left rear vertex of the bottom plate, and exits the liquid cooling pipe from the middle of the left edge of the rear side plate.

[0062] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the technical solutions of the present invention, rather than limitations on the specific implementation manners of the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the claims of the present invention shall be included within the protection scope of the claims of the present invention.

Claims

1. A highly shielded KaKu coaxial waveguide power amplifier device, characterized in that: include: The outer shell includes a top plate, a bottom plate and surrounding side plates; A power amplifier assembly is disposed in the housing; The power amplifier assembly comprises: A KaKu coaxial OMT waveguide is coaxially located with the front and rear central axes of the housing, and includes a square waveguide and a circular waveguide; a transmission module includes a receiving module and a transmitting module located on the inner side of the housing and connected to both sides of the KaKu coaxial OMT waveguide respectively; A waveguide, provided on the through hole of the front side plate of the housing and connected to the KaKu coaxial OMT waveguide; A waterproof component, including a breathable membrane and a waterproof sealing strip, is arranged on the through hole and is used for breathability and waterproofing of the KaKu coaxial OMT waveguide; The heat dissipation module comprises a heat sink and a fixing plate thereof. The heat sink is arranged on the rear side plate of the housing, and the fixing plate fixes the heat sink and the rear side plate.

2. A highly shielded KaKu coaxial waveguide power amplifier device according to claim 1, characterized in that: The common end of the KaKu coaxial OMT waveguide includes a circular waveguide and four square waveguides, wherein the circular waveguide is located at the center and the square waveguides are located around the circular waveguide.

3. A highly shielded KaKu coaxial waveguide power amplifier device according to claim 1, characterized in that: The receiving module includes two closed structures connected by cables, a receiving intermediate frequency module located above and a receiving driving module located parallel to the receiving intermediate frequency module below; the transmitting module includes two closed structures connected by cables, a transmitting intermediate frequency module located above and a transmitting driving module located parallel to the transmitting intermediate frequency module below; The receiving driving module and the transmitting driving module are both connected to the base plate.

4. A highly shielded KaKu coaxial waveguide power amplifier device according to claim 3, characterized in that: The receiving intermediate frequency module, the receiving driving module, the transmitting intermediate frequency module, and the transmitting driving module are all provided with shielding grooves and through-wall coaxial connectors. The shielding grooves are silver-plated shielding strips for reducing stray signals. The through-wall coaxial connectors are provided at both ends of each module, and the through-wall coaxial connectors are screwed into each module through threads, so that each module is in a closed state to prevent leakage of electromagnetic signals.

5. A highly shielded KaKu coaxial waveguide power amplifier device according to claim 3, characterized in that: The receiving driving module and the transmitting driving module are respectively connected to their module bottom shells through conductive adhesive coatings, and the conductive adhesive coatings are used to closely contact two planes, so that high-frequency electromagnetic fields generate eddy currents in the modules to achieve electromagnetic shielding.

6. A highly shielded KaKu coaxial waveguide power amplifier device according to any one of claims 3 to 5, characterized in that: The receiving driving module and the transmitting driving module are respectively connected to the base plate through an indium sheet, and the indium sheet is used to dissipate the heat of the power amplifier component to prevent the bare chip of the PCB inside the power amplifier component from being in a state of overheating for a long time, which affects the service life and loss of the chip.

7. A highly shielded KaKu coaxial waveguide power amplifier device according to claim 4, characterized in that: A wave absorbing member is arranged in the shielding groove, and the wave absorbing member is used to absorb electromagnetic waves, so as to prevent mutual interference between electromagnetic waves.

8. The highly shielded KaKu coaxial waveguide power amplifier device according to claim 1, characterized in that: The cross-section of the top plate and / or the bottom plate is trapezoidal, and a plurality of heat dissipation teeth are evenly arranged on the upper surface of the top plate and / or the bottom plate, and the height of each heat dissipation tooth is consistent; the bottom plate is also provided with a heat dissipation copper tube for improving the heat dissipation efficiency of the power amplifier component.

9. The highly shielded KaKu coaxial waveguide power amplifier device according to claim 1, characterized in that: The bottom of the surrounding side panels is also provided with a waterproof groove.

10. A highly shielded KaKu coaxial waveguide power amplifier device according to claim 1, characterized in that: The heat sink is a fan, including two fans, which are respectively arranged at the rear sides of the receiving module and the transmitting module.

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