Display device of semiconductor light emitting device

Abstract

Embodiments relate to a display device of a semiconductor light emitting device. A display device of a semiconductor light emitting device of an embodiment may include: a substrate of a first display module and a substrate of a second display module disposed adjacent to each other; a plurality of semiconductor light emitting device assemblies respectively disposed on the substrate of the first display module and the substrate of the second display module; a first side surface wiring and a second side surface wiring which are respectively arranged on the side surface of the substrate of the first display module and the side surface of the substrate of the second display module and are respectively electrically connected with the semiconductor light emitting device assembly; and a porous adhesive resin layer disposed between the substrate of the first display module and the substrate of the second display module.

Description

Technical Field

[0001] The embodiment relates to a display device of a semiconductor light-emitting device. Background Art

[0002] In large-area display devices, there are liquid crystal displays (LCDs), OLED (organic light-emitting diode) displays, micro-LED displays (Micro-LED displays), etc.

[0003] A micro-LED display is a display that uses a semiconductor light-emitting device, i.e., a micro-LED, with a diameter or cross-sectional area of 100 μm or less as a display device.

[0004] Since a micro-LED display uses a micro-LED as a semiconductor light-emitting device as a display device, it has excellent performance in many characteristics such as contrast ratio, response speed, color reproduction rate, viewing angle, brightness, resolution, lifespan, luminous efficiency, or luminance.

[0005] In particular, a micro-LED display can separate and combine images in a module manner, thus having the advantages of free adjustment of size or resolution and the ability to implement a flexible display.

[0006] However, a large-sized micro-LED display requires more than several million micro-LEDs, so there is a technical problem of difficulty in quickly and accurately transferring the micro-LEDs to a display panel.

[0007] Recently developed transfer technologies include the pick and place process, the Laser Lift-off method, or the self-assembly method, etc. Among them, the self-assembly method, as a method in which semiconductor light-emitting devices self-find assembly positions in a fluid, is a method beneficial to realizing a large-screen display device.

[0008] On the other hand, in a display device applying an existing semiconductor light-emitting device, it is manufactured by transferring the semiconductor light-emitting device to a substrate such as a thin film transistor (TFT) substrate or a wiring substrate. However, due to the transfer defect rate of the semiconductor light-emitting device, etc., there is a problem of a decrease in productivity, and in particular, the production yield of a large-area display device is extremely low.

[0009] To solve this problem, currently, research and development are underway on a'multi-screen display device' that realizes a large display device by tiling a plurality of semiconductor light-emitting device display modules with relatively small sizes.

[0010] However, in the case of a multi-screen display device, due to the bezel regions existing in the edge regions of each unit display device, a separated gap region is generated between the unit display devices connected to each other. The existence of the bezel region is caused by side electrodes (or side wirings) for electrical connection between the components arranged on the upper part of the substrate and the components arranged on the lower part of the substrate.

[0011] When displaying an image over the entire area of the multi-screen display device, such a gap region, that is, the gap or boundary line between the modules, is recognized as a'seeable' seam, resulting in a sense of image segmentation and disharmony, and reducing the immersion of the image.

[0012] On the other hand, in the prior art, there are studies on improving the seam between modules for a multi-screen display device that tiles a plurality of display modules.

[0013] For example, in the existing patent 1 (Korean Publication No.: 10-2019-0046684), a structure in which a light absorption layer is arranged on the side of each mold is provided, but there are still gaps in the light absorption layers between adjacent plural display modules, so there are limitations in the existence of seams.

[0014] In addition, in the existing patent 2 (Korean Publication No.: 10-2020-0014057), a structure in which a photoresist film (PR) is arranged on the seam region between modules is provided, but there is still an empty space between the modules. In the case of poor attachment of the PR film, visibility problems will occur due to the seam region. In addition, since the seam region is an empty space, it is not only difficult to attach the PR film thereto, but also pixel defects will occur when attaching the PR to the pixels.

[0015] On the other hand, in the prior art, although a plurality of display modules are tiled on a specified window frame or cabinet, separate physical bonding cannot be performed between the side regions of adjacent display modules, resulting in a problem of weak mechanical reliability.

[0016] On the other hand, in the display device of the internal technology, even if the gap between the tiled display modules is physically reduced or eliminated, there is still a problem that the boundary line is optically and visually recognized as a seam.

[0017] Therefore, it is necessary not only to physically eliminate the gap between the display modules, but also not to be recognized as a seam optically.

[0018] In addition, in an internal technology, in a multi-screen display device in which a plurality of display modules are tiled, there is a height difference on the top surfaces of the tiled plurality of display modules, resulting in a surface step between the display modules.

[0019] Thus, even if the gap between the display modules is filled, when there is a surface step between the display modules, there will be a problem that a seam that is optically recognized as obvious exists. Summary of the Invention

[0020] Problems to be Solved by the Invention

[0021] One of the technical problems of the embodiment is to solve the problem that the mechanical reliability between the side regions of adjacent display modules is weak when a plurality of display modules are tiled.

[0022] In addition, one of the technical problems of the embodiment is that it is necessary not only to physically eliminate the gap between the display modules, but also not to be recognized as a seam optically and visually.

[0023] In addition, one of the technical problems of the embodiment is to solve the problem that even if the gap between the display modules is filled, when there is a surface step between the display modules, a seam that is optically recognized as obvious exists.

[0024] The technical problems of the embodiment are not limited to the technical problems described in the summary of the invention, and also include technical problems that can be grasped through the entire specification.

[0025] Technical Solutions for Solving the Problems

[0026] The display device of the semiconductor light-emitting device according to the embodiment may include: substrates of a first display module and a second display module that are adjacently arranged; a plurality of semiconductor light-emitting device components respectively arranged on the substrates of the first display module and the second display module; first side wirings and second side wirings respectively arranged on the sides of the substrates of the first display module and the second display module and electrically connected to the semiconductor light-emitting device components; and a porous adhesive resin layer arranged between the substrates of the first display module and the second display module.

[0027] The porous adhesive resin layer may include: a first porous adhesive resin layer disposed on the first side wiring of the substrate of the first display module; and a second porous adhesive resin layer disposed on the second side wiring of the substrate of the second display module; the first porous adhesive resin layer and the second porous adhesive resin layer may be combined to form a single body.

[0028] In an embodiment, a surface step may exist between the top surface of the substrate of the first display module and the top surface of the substrate of the second display module.

[0029] In addition, the embodiment may further include a planarization film disposed on the first module substrate and the second module substrate.

[0030] In addition, the embodiment may further include an optical adhesive layer and a cover film disposed on the first module substrate and the second module substrate.

[0031] In addition, the display device of the semiconductor light-emitting device according to the embodiment may include: substrates of a first display module and a second display module disposed adjacent to each other; a plurality of semiconductor light-emitting device components respectively disposed on the substrates of the first display module and the second display module; a first side wiring and a second side wiring respectively disposed on the sides of the substrate of the first display module and the substrate of the second display module and electrically connected to the semiconductor light-emitting device components respectively; and a viscoelastic resin layer disposed between the substrates of the first display module and the second display module.

[0032] The viscoelastic resin layer may include: a first viscoelastic resin layer disposed on the first side wiring of the substrate of the first display module; and a second viscoelastic resin layer disposed on the second side wiring of the substrate of the second display module; the first viscoelastic resin layer and the second viscoelastic resin layer may be combined to form a single body.

[0033] In addition, in an embodiment, a surface step may exist between the top surface of the substrate of the first display module and the top surface of the substrate of the second display module.

[0034] In addition, the embodiment may further include a planarization film disposed on the first module substrate and the second module substrate.

[0035] In addition, the embodiment may further include an optical adhesive layer and a cover film disposed on the first module substrate and the second module substrate.

[0036] Advantages of the Invention

[0037] The display device of the semiconductor light-emitting device according to the embodiment has a technical effect of being able to solve the problem of weak mechanical reliability between the side regions of adjacent display modules when a plurality of display modules are tiled.

[0038] For example, according to the embodiment, the modules can be directly bonded to each other with the porous adhesive resin layer 790 as a medium, so that there is no gap between the modules themselves, thus having the technical effect of being able to achieve a perfect seamless state. In addition, according to the embodiment, the modules can be directly bonded to each other with the porous adhesive resin layer 790 as a medium, so that there is no need to separately fix a plurality of modules, and it has an excellent structural reliability technical effect.

[0039] In addition, the display device of the semiconductor light-emitting device according to the embodiment has a technical effect of not only physically eliminating the gap between the display modules, but also not being optically and visually recognized as a seam.

[0040] For example, the porous adhesive resin layer 790 according to the embodiment, as a flexible porous material, functions as a seam light-absorbing layer, diffusingly reflecting and capturing the reflection of external light into the porous space, thus having a special technical effect of being able to reduce seam recognition.

[0041] Specifically, Figure 14 is a surface photo of the third boundary region C1 of the first display module 700a and the second display module 700b. Since the porous adhesive resin layer 790 is disposed between the adjacent first display module 700a and the second display module 700b, the boundary line has a special technical effect of not being optically and visually recognized as a seam.

[0042] In addition, the display device of the semiconductor light-emitting device according to the embodiment has a technical effect of being able to solve the problem of being optically recognized as an obvious seam even when filling the gap between the display modules and generating a surface step between the display modules.

[0043] For example, Figure 15 is a surface photo of the fourth boundary region C4 of the first display module 700a and the second display module 700b. Even when there is a height difference between the top surface 700aT of the first display module and the top surface 700bT of the second display module in the tiled state, due to the arrangement of the porous adhesive resin layer 790, it functions as a seam light-absorbing layer, diffusingly reflecting and capturing the reflection of external light into the porous space, thus having a special technique of not being optically and visually recognized as a seam.

[0044] In addition, in the display device 700B of the second embodiment, a viscoelastic resin layer 795 may be disposed on the first display module 700a and the second display module 700b. This viscoelastic resin layer 795 has the effect of reducing seam recognition by reducing the reflection of external light.

[0045] The technical effects of the embodiments are not limited to the technical effects described in the present invention, and include technical effects that can be grasped through the entire specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figure 1 It is an example diagram showing the living room of a house equipped with a display device according to an embodiment.

[0047] Figure 2 It is a block diagram schematically showing a display device according to an embodiment.

[0048] Figure 3 It shows Figure 2 An example circuit diagram of the pixels.

[0049] Figure 4 It is Figure 1 An enlarged view of the first panel area in the display device.

[0050] Figure 5 It is a cross-sectional view taken along the B1 - B2 line in the A2 area of FIG. Figure 4

[0051] Figure 6 It is an example diagram showing the assembly of light-emitting devices to a substrate using a self-assembly method according to an embodiment.

[0052] Figure 7 It is an example diagram of a multi-screen display device including a plurality of display panels with internal technology.

[0053] Figure 8 It is Figure 7 An example diagram of a surface photograph of the first area of a display device including a plurality of display panels shown in

[0054] Figure 9 It is Figure 7 An example diagram of a surface photograph of the second area C2 of the display device 700 including a plurality of display panels shown in

[0055] Figure 10 It shows Figure 9 3D profile data of each component.

[0056] Figure 11 It is a side view of the boundary area between the display modules of the display device 700 according to the first embodiment.

[0057] ​Figure 12 This is an exemplary diagram of a manufacturing method of the display device 700 according to the first embodiment.

[0058] Figure 13 This is an exemplary diagram of the multi-screen display device 700 including a plurality of display panels according to the embodiment.

[0059] Figure 14 This is Figure 13 an exemplary diagram of a surface photograph of the third region C3 of the display device 700 shown in

[0060] Figure 15 This is Figure 15 an exemplary diagram of a surface photograph of the fourth region C4 of the display device 700 shown in

[0061] Figure 16 This is a side view of a boundary region between display modules of the display device 700B according to the second embodiment.

[0062] Figure 17 This is an exemplary diagram of a manufacturing method of the display device 700B according to the second embodiment. DETAILED DESCRIPTION

[0063] Hereinafter, embodiments disclosed in the present specification will be described in detail with reference to the accompanying drawings. In the following description, the suffixes "module" and "unit" of the components used are given or mixed for ease of writing of the specification, and they do not have meanings or functions that distinguish each other. Also, the accompanying drawings are for facilitating understanding of the embodiments disclosed in the present specification, and the technical idea disclosed in the present specification is not limited by the accompanying drawings. Also, when it is mentioned that an element such as a layer, a region, or a substrate exists "on" another component, it should be understood that it can directly exist on the other component, or there may be other intermediate components between them.

[0064] The display device described in the present specification may include a digital TV (television), a mobile phone, a smartphone, a laptop computer, a digital broadcast terminal, a personal digital assistant (PDA: personal digital assistants), a portable multimedia player (PMP: portable multimedia player), a navigator, a touchscreen slate PC, a tablet PC, an ultra-book, a desktop computer, etc. However, those skilled in the art will easily understand that even for a newly developed product form in the future, the configurations of the embodiments described in the present specification can be applied to a device capable of displaying.

[0065] Hereinafter, the light-emitting device of the embodiment and the display device including the semiconductor light-emitting device will be described.

[0066] Figure 1 The living room of the house equipped with the display device 100 of the embodiment is shown.

[0067] The display device 100 of the embodiment can display the states of various electronic products such as a washing machine 101, a floor cleaning robot 102, and an air purifier 103, can communicate with each electronic product based on IOT (Internet of Things), and can also control each electronic product based on the set data of the user.

[0068] The display device 100 of the embodiment may include a flexible display manufactured on a thin and flexible substrate. The flexible display maintains the characteristics of the existing flat panel display and can be bent or curled like paper.

[0069] In the flexible display, visual information can be realized by independently controlling the light emission of unit pixels arranged in a matrix form. A unit pixel refers to the smallest unit for realizing one color. The unit pixel of the flexible display can be realized by a light-emitting device. In the embodiment, the light-emitting device may be a Micro-LED or a Nano-LED (nano LED), but is not limited thereto.

[0070] Figure 2 It is a block diagram schematically showing the display device of the embodiment, Figure 3 It shows Figure 2 An example circuit diagram of the pixel.

[0071] Referring to Figure 2 and Figure 3 The display device of the embodiment may include a display panel 10, a driving circuit 20, a scan driving unit 30, and a power supply circuit 50.

[0072] The display device 100 of the embodiment can drive the light-emitting device in an active matrix (AM, Active Matrix) manner or a passive matrix (PM, Passive Matrix) manner.

[0073] The driving circuit 20 may include a data driving unit 21 and a timing control unit 22.

[0074] The display panel 10 can be divided into a display area DA and a non-display area NDA disposed around the display area DA. The display area DA is an area for displaying an image by forming a plurality of pixels PX. The display panel 10 may include a plurality of data lines D1 to Dm (m is an integer of 2 or more), a plurality of scan lines S1 to Sn (n is an integer of 2 or more) intersecting the plurality of data lines D1 to Dm, a high potential voltage line for supplying a high potential voltage, a low potential voltage line for supplying a low potential voltage, and a plurality of pixels PX connected to the plurality of data lines D1 to Dm and the plurality of scan lines S1 to Sn.

[0075] Each of the plurality of pixels PX may include a first sub-pixel PX1, a second sub-pixel PX2, and a third sub-pixel PX3. The first sub-pixel PX1 may emit first color light of a first wavelength, the second sub-pixel PX2 may emit second color light of a second wavelength, and the third sub-pixel PX3 may emit third color light of a third wavelength. The first color light may be red light, the second color light may be green light, and the third color light may be blue light, but is not limited thereto. Additionally, Figure 2 it is exemplified that each of the plurality of pixels PX includes three sub-pixels, but is not limited thereto. That is, each of the plurality of pixels PX may include four or more sub-pixels.

[0076] The first sub-pixel PX1, the second sub-pixel PX2, and the third sub-pixel PX3 may be respectively connected to at least one of the plurality of data lines D1 to Dm, at least one of the plurality of scan lines S1 to Sn, and the high potential voltage line. As Figure 3 shown, the first sub-pixel PX1 may include a plurality of light-emitting devices LD, a plurality of transistors for supplying current to the plurality of light-emitting devices LD, and at least one capacitor Cst.

[0077] Although not shown, each of the first sub-pixel PX1, the second sub-pixel PX2, and the third sub-pixel PX3 may also include only one light-emitting device LD and at least one capacitor Cst.

[0078] Each of the plurality of light-emitting devices LD may be a semiconductor light-emitting diode including a first electrode, a plurality of conductive semiconductor layers, and a second electrode. Here, the first electrode may be an anode electrode and the second electrode may be a cathode electrode, but is not limited thereto.

[0079] Refer to Figure 3, a plurality of transistors may include: a driving transistor DT that supplies current to a plurality of light-emitting devices LD; and a scanning transistor ST that supplies a data voltage to a gate electrode of the driving transistor DT. The driving transistor DT may include: a gate electrode connected to a source electrode of the scanning transistor ST; a source electrode connected to a high-potential voltage line to which a high-potential voltage is applied; and a drain electrode connected to a plurality of first electrodes of the plurality of light-emitting devices LD. The scanning transistor ST may include a gate electrode connected to a scanning line Sk (k is an integer satisfying 1 ≤ k ≤ n), a source electrode connected to the gate electrode of the driving transistor DT, and a drain electrode connected to a data line Dj (j is an integer satisfying 1 ≤ j ≤ m).

[0080] A capacitor Cst is formed between the gate electrode and the source electrode of the driving transistor DT. The storage capacitor Cst may charge the difference between the gate voltage and the source voltage of the driving transistor DT.

[0081] The driving transistor DT and the scanning transistor ST may be formed of thin film transistors. Additionally, in Figure 3 , the case where the driving transistor DT and the scanning transistor ST are formed of P-type MOSFETs (Metal Oxide Semiconductor Field Effect Transistors) is mainly described, but the embodiments are not limited thereto. The driving transistor DT and the scanning transistor ST may also be formed of N-type MOSFETs. In this case, the positions of the source electrodes and the drain electrodes of the driving transistor DT and the scanning transistor ST may vary.

[0082] Additionally, in Figure 3 , it is illustrated that each of the first sub-pixel PX1, the second sub-pixel PX2, and the third sub-pixel PX3 includes a 2T1C (2 Transistor-1 capacitor: two transistors and one capacitor) having one driving transistor DT, one scanning transistor ST, and one capacitor Cst, but the embodiments are not limited thereto. Each of the first sub-pixel PX1, the second sub-pixel PX2, and the third sub-pixel PX3 may include a plurality of scanning transistors ST and a plurality of capacitors Cst.

[0083] Referring again to Figure 2 , the driving circuit 20 outputs a plurality of signals and a plurality of voltages for driving the display panel 10. To this end, the driving circuit 20 may include a data driving unit 21 and a timing control unit 22.

[0084] The data driving unit 21 receives digital video data DATA and a source control signal DCS from the timing control unit 22. The data driving unit 21 converts the digital video data DATA into an analog data voltage according to the source control signal DCS and supplies it to a plurality of data lines D1 to Dm of the display panel 10.

[0085] The timing control unit 22 receives digital video data DATA and a plurality of timing signals from a host system. The plurality of timing signals may include a vertical sync signal, a horizontal sync signal, a data enable signal, and a dot clock. The host system may be an application processor of a smart phone or a tablet PC, a monitor, a system on chip of a TV, etc.

[0086] The scan driving unit 30 receives a scan control signal SCS from the timing control unit 22. The scan driving unit 30 generates a plurality of scan signals according to the scan control signal SCS and supplies them to a plurality of scan lines S1 to Sn of the display panel 10. The scan driving unit 30 includes a plurality of transistors and may be formed in a non-display area NDA of the display panel 10. Alternatively, the scan driving unit 30 may be formed of an integrated circuit, and in this case, it may be mounted on a gate flexible film attached to the other side of the display panel 10.

[0087] The power supply circuit 50 generates a high potential voltage VDD and a low potential voltage VSS for driving a plurality of light emitting devices LD of the display panel 10 from a main power supply and may supply them to a high potential voltage line and a low potential voltage line of the display panel 10. In addition, the power supply circuit 50 may generate and supply a driving voltage for driving the driving circuit 20 and the scan driving unit 30 from the main power supply.

[0088] Figure 4 Yes Figure 1 is an enlarged view of the first panel area A1 in the display device.

[0089] According to Figure 4 , the display device 100 of the embodiment may be manufactured by mechanically and electrically connecting a plurality of panel areas such as the first panel area A1 by tiling.

[0090] The first panel area A1 may include a plurality of light emitting devices 150 arranged for each unit pixel ( Figure 2 of PX).

[0091] For example, the unit pixel PX may include a first sub-pixel PX1, a second sub-pixel PX2, and a third sub-pixel PX3. For example, a plurality of red light-emitting devices 150R may be configured in the first sub-pixel PX1, a plurality of green light-emitting devices 150G may be configured in the second sub-pixel PX2, and a plurality of blue light-emitting devices 150B may be configured in the third sub-pixel PX3. The unit pixel PX may also include a fourth sub-pixel not configured with a light-emitting device, but is not limited thereto. On the other hand, the light-emitting device 150 may be a semiconductor light-emitting device.

[0092] then, Figure 5 is along Figure 4 A cross-sectional view of the A2 region taken along line B1-B2.

[0093] Reference Figure 5 The display device 100 of the embodiment may include a substrate 200 , assembly wirings 201 , 202 , a first insulating layer 211 a , a second insulating layer 211 b , a third insulating layer 206 , and a plurality of light emitting devices 150 .

[0094] The assembly wiring may include a first assembly wiring 201 and a second assembly wiring 202 separated from each other. The first assembly wiring 201 and the second assembly wiring 202 may generate a dielectrophoretic force for assembling the light emitting device 150. In addition, the first assembly wiring 201 and the second assembly wiring 202 may also be electrically connected to the electrodes of the light emitting device to function as electrodes of the display panel.

[0095] The assembly wiring 201, 202 may be formed of a light-transmitting electrode ITO or may contain a metal substance having excellent electrical conductivity. For example, the assembly wiring 201, 202 may be formed of at least one of titanium (Ti), chromium (Cr), nickel (Ni), aluminum (Al), platinum (Pt), gold (Au), tungsten (W), molybdenum (Mo), or an alloy thereof.

[0096] A first insulating layer 211a may be disposed between the first assembled wiring 201 and the second assembled wiring 202, and a second insulating layer 211b may be disposed on the first assembled wiring 201 and the second assembled wiring 202. The first insulating layer 211a and the second insulating layer 211b may be oxide films, nitride films, etc., but are not limited thereto.

[0097] In order to realize each unit pixel (sub-pixel), the light emitting device 150 may include a red light emitting device 150, a green light emitting device 150G and a blue light emitting device 150B, but is not limited thereto, and may also have a red phosphor and a green phosphor to realize red and green respectively.

[0098] The substrate 200 can be formed of glass or polyimide. Additionally, the substrate 200 can include flexible materials such as PEN (Polyethylene Naphthalate) and PET (Polyethylene Terephthalate). Additionally, the substrate 200 can be a light-transmissive material, but is not limited thereto.

[0099] The third insulating layer 206 can include insulating and flexible materials such as polyimide, PEN, and PET, and can also be integrally formed with the substrate 200 to form a single substrate.

[0100] The third insulating layer 206 can be a conductive adhesive layer having adhesiveness and conductivity. The conductive adhesive layer has flexibility, thereby enabling the flexible function of the display device. For example, the third insulating layer 206 can be an anisotropic conductive film (ACF), an anisotropic conductive medium, a solution containing conductive particles, or the like. The conductive adhesive layer can be a layer having conductivity in the direction perpendicular to the thickness and electrical insulation in the direction parallel to the thickness.

[0101] The third insulating layer 206 can include an assembly hole 203 (refer to Figure 6 ) for inserting the light-emitting device 150. Therefore, during self-assembly, the light-emitting device 150 can be easily inserted into the assembly hole 203 of the third insulating layer 206. The assembly hole 203 can be referred to as an insertion hole, a fixing hole, an alignment hole, etc.

[0102] The interval between the assembly wirings 201 and 202 is formed to be smaller than the width of the light-emitting device 150 and the width of the assembly hole 203, so that the assembly position of the light-emitting device 150 using an electric field can be fixed more precisely.

[0103] The third insulating layer 206 is formed on the assembly wirings 201 and 202. The third insulating layer 206 can protect the assembly wirings 201 and 202 from the influence of the fluid 1200 and can prevent the leakage of the current flowing through the assembly wirings 201 and 202. The third insulating layer 206 can be formed of an inorganic insulator such as silicon dioxide or aluminum oxide or an organic insulator in a single layer or multiple layers.

[0104] Additionally, the third insulating layer 206 can include insulating and flexible materials such as polyimide, PEN, and PET, and can also be integrally formed with the substrate 200 to form a single substrate.

[0105] The third insulating layer 206 may be an adhesive insulating layer or a conductive adhesive layer having conductivity. The third insulating layer 206 has ductility, so as to be able to function as a flexible function of the display device.

[0106] The third insulating layer 206 may have partition walls, and the assembly holes 203 may be formed by the partition walls. For example, when the substrate 200 is formed, a part of the third insulating layer 206 is removed, so that each of the plurality of light-emitting devices 150 can be assembled into the assembly holes 203 of the third insulating layer 206.

[0107] Assembly holes 203 may be formed in the substrate 200, the plurality of light-emitting devices 150 are combined with the assembly holes 203, and the surface where the assembly holes 203 are formed may be in contact with the fluid 1200. The assembly holes 203 can guide the accurate assembly positions of the light-emitting devices 150.

[0108] On the other hand, the assembly holes 203 may have shapes and sizes corresponding to the shapes of the light-emitting devices 150 to be assembled at corresponding positions. Thus, it is possible to prevent other light-emitting devices or a plurality of light-emitting devices from being assembled in the assembly holes 203.

[0109] Figure 6 FIG. is an example showing an example of assembling a light-emitting device to a substrate by a self-assembly method according to an embodiment. Referring to the accompanying drawings, the self-assembly method of the light-emitting device will be described.

[0110] The substrate 200 may be a panel substrate of a display device. In the following description, the case where the substrate 200 is a panel substrate of a display device will be described, but the embodiment is not limited thereto.

[0111] Refer to Figure 6 , a plurality of light-emitting devices 150 may be put into a chamber 1300 filled with a fluid 1200. The fluid 1200 may be water such as ultrapure water, but is not limited thereto. The chamber may be referred to as a water tank, a storage tank, a container, etc.

[0112] Then, the substrate 200 may be disposed on the chamber 1300. According to an embodiment, the substrate 200 may also be put into the chamber 1300.

[0113] As Figure 5 shown, a pair of assembly wirings 201, 202 corresponding to each of the light-emitting devices 150 to be assembled may be disposed on the substrate 200.

[0114] Refer to Figure 6, after configuring the substrate 200, the assembly device 1100 including a magnetic body can move along the substrate 200. As an example of the magnetic body, a magnet or an electromagnet can be used. To maximize the area of the magnetic field influence within the fluid 1200, the assembly device 1100 can move in a state of being in contact with the substrate 200. According to an embodiment, the assembly device 1100 can include a plurality of magnetic bodies, or can also include a magnetic body having a size corresponding to that of the substrate 200. In this case, the moving distance of the assembly device 1100 can also be limited within a specified range.

[0115] Through the magnetic field generated by the assembly device 1100, the light-emitting device 150 within the chamber 1300 can move toward the assembly device 1100.

[0116] During the process of moving toward the assembly device 1100, the light-emitting device 150 can enter the assembly hole 203 by using dielectrophoretic force (DEP force) and come into contact with the substrate 200.

[0117] Specifically, the assembly wirings 201 and 202 form an electric field by an AC power supply supplied from the outside, and through this electric field, a dielectrophoretic force can be formed between the assembly wirings 201 and 202. By using this dielectrophoretic force, the light-emitting device 150 can be fixed in the assembly hole 203 on the substrate 200.

[0118] Through the electric field applied by the assembly wirings 201 and 202 formed on the substrate 200, it is possible to prevent the light-emitting device 150 in contact with the substrate 200 from detaching due to the movement of the assembly device 1100. According to an embodiment, by using the above-described self-assembly method of the electromagnetic field, it is possible to sharply shorten the time required for each of the plurality of light-emitting devices 150 to be assembled onto the substrate 200, and thus a large-area high-pixel display can be realized more quickly and economically.

[0119] At this time, a predetermined solder layer (not shown) is formed between the light-emitting device 150 assembled in the assembly hole 203 of the substrate 200 and the assembly electrode, thereby improving the bonding force of the light-emitting device 150.

[0120] Next, a molding layer (not shown) can be formed in the assembly hole 203 of the assembly substrate 200. The molding layer can be a light-transmissive resin or a resin containing a reflective substance or a scattering substance.

[0121] Figure 7 A multi-screen display device 600 showing a plurality of display panels including internal technologies is shown.

[0122] Refer to Figure 7, the multi-screen display device 600 can be implemented by a plurality of display panels 600a, 600b, 600c, and 600d in a tiled manner. For example, the multi-screen display device 600 may include a first to a fourth display panel 600a, 600b, 600c, and 600d, but is not limited thereto. Each of the plurality of display panels 600a, 600b, 600c, and 600d may be a display device manufactured by the self-assembly method described above, but is not limited thereto.

[0123] In internal technology, the multi-screen display device 600 can be used as a large-area display device that provides one image through a plurality of display panels 600a, 600b, 600c, and 600d. Each of the plurality of display panels 600a, 600b, 600c, and 600d can reduce the gap area with adjacent display devices by minimizing the border area on the side.

[0124] According to internal technology, as the gap area between a plurality of display devices decreases, it is possible to minimize the dark area caused by the gap area when outputting an image. Thus, it is possible to display an image that minimizes the sense of segmentation on the overall screen of the multi-screen display device 600.

[0125] On the other hand, referring to Figure 7 , although the gap (gap) as a physical interval between a plurality of display panels in internal technology has been reduced, from an optical point of view, there is a problem that this gap (gap) or boundary line is recognized as a seam (seam) S1 that is 'visually recognized'.

[0126] For example, Figure 8 is Figure 7 an example diagram of a surface photograph of a first area C1 of the display device 600 including a plurality of display panels shown in

[0127] Specifically, Figure 8 is a surface photograph of a first boundary area C1 of the first display module 600a and the second display module 600b, showing that there is a predetermined gap G1 between the side member 600am of the adjacent first display panel and the side member 600bm of the second display panel. Figure 8 The 3D contour data P1 of each component is shown in the form of a photograph.

[0128] In the display device of internal technology, it is difficult to physically and mechanically reduce or eliminate the gap G1 between the tiled display modules with the prior art. Even if the gap is reduced or eliminated, there is a problem that this boundary line is regarded as a seam S1 optically and visually.

[0129] Therefore, it is necessary not only to physically eliminate the gap between the display modules, but also to ensure that this gap is not optically recognized as a seam.

[0130] In addition, in internal technologies, although multiple display modules are tiled on a specified window frame or cabinet, there is a problem of weak mechanical reliability because the side regions of adjacent display modules cannot be physically combined separately.

[0131] Next, Figure 9 is Figure 7 an example diagram of a surface photograph of the second region C2 of the display device 600 including multiple display panels shown in Figure 10 is Figure 9 the 3D contour data P2 of each component of

[0132] Specifically, Figure 9 is a surface photograph of the second boundary region C2 of the first display module 600a and the second display module 600b, showing that there is a specified second gap G2 between the side members 600am of the adjacent first display panel and the side members 600bm of the second display panel.

[0133] Figure 10 is Figure 9 the 3D contour data P2 of each component of , showing that there is a height difference between the top surface 600aT of the tiled first display panel and the top surface 600bT of the second display panel, resulting in a surface step SS between the display modules.

[0134] Therefore, according to internal technologies, even if the gap between the display modules is filled and there is a surface step between the display modules, as Figure 9 and Figure 10 shown, there is a problem that this gap is optically and visually recognized as an obvious seam S2.

[0135] Therefore, one of the technical problems of the embodiments is to solve the problem of weak mechanical reliability between the side regions of adjacent display modules when multiple display modules are tiled.

[0136] In addition, one of the technical problems of the embodiments is that it is necessary not only to physically eliminate the gap between the display modules, but also to ensure that this gap is not optically and visually recognized as a seam.

[0137] In addition, one of the technical problems of the embodiment is to solve the problem that even when the gap between display modules is filled, a surface step is generated between the display modules, and the gap is optically recognized as an obvious seam.

[0138] Hereinafter, a display device according to an embodiment for solving the above technical problems will be described in detail.

[0139] Figure 11 It is a side view of a boundary region between display modules of a display device 700 according to a first embodiment (hereinafter, the 'first embodiment' is simply referred to as the 'embodiment'). For example, Figure 11 It is a side view of a boundary region between a first display module 700a and a second display module 700b.

[0140] The display device 700 according to the embodiment may be a display device including a plurality of display modules.

[0141] For example, the display device 700 may be manufactured by tiling a plurality of display modules, and the display device may be manufactured in a tiled manner in which the pitches PX between semiconductor light-emitting device assemblies 710 on adjacent plurality of display modules 700a and 700b are arranged close to each other and then fixed.

[0142] Referring to Figure 11 , the display device 700 according to the embodiment may include one or more of a first module substrate 701, a second module substrate 702, a semiconductor light-emitting device assembly 710, a side wiring 741, a wiring protection layer 742, a porous adhesive resin layer 790, a planarization film 750, a black matrix 720, an optical adhesive layer 760, and a cover film 770.

[0143] For example, the display device 700 according to the embodiment may include a first module substrate 701 and a second module substrate 702 disposed below the first module substrate 701.

[0144] The first module substrate 701 may be a TFT substrate formed of a thin film transistor (TFT) and wirings, and the second module substrate 702 may be a PCB formed of a timing controller, a memory, a voltage source for driving the semiconductor light-emitting device assembly 710, and various wirings.

[0145] In addition, the second module substrate 702 may be a PCB formed with a driving unit that applies signals to the gate wiring and data wiring of the first module substrate 701, respectively. In this case, a plurality of wiring electrodes 721 and 722 may be formed on the first module substrate 701 and the second module substrate 702.

[0146] In addition, according to the embodiment, TFTs, a plurality of wirings, and various circuits may be formed on the second module substrate 702, and the first module substrate 701 may also be implemented by a protective substrate with TFTs and user protection wirings.

[0147] In addition, the display device 700 of the embodiment may also include only one substrate, for example, only the first module substrate 701. In this case, the features related to the bottom surface of the second module substrate 702 described later may be similarly applied to the bottom surface of the first module substrate 701.

[0148] A plurality of semiconductor light-emitting device components 710 may be arranged in an array on the first module substrate 701. For example, a plurality of semiconductor light-emitting device components 710 forming a plurality of rows and columns may be arranged on the first module substrate 701.

[0149] The semiconductor light-emitting device component 710 may adopt the technical features of the aforementioned semiconductor light-emitting device 150.

[0150] A plurality of the semiconductor light-emitting device components 710 may be arranged at a prescribed pitch PX and function as one pixel, and at least one semiconductor light-emitting device may be provided within the semiconductor light-emitting device component 710.

[0151] For example, in the case of the pixel including R (red), G (green), and B (blue) sub-pixels, a first semiconductor light-emitting device 710a that emits red light, a second semiconductor light-emitting device 710b that emits green light, and a third semiconductor light-emitting device 710c that emits blue light may be provided within the semiconductor light-emitting device component 710, but it is not limited thereto.

[0152] For example, all of the first to third semiconductor light-emitting devices 710a, 710b, and 710c may emit one color, for example, a device that emits blue light, and various colors may be achieved by disposing a phosphor or QD (quantum dot) thereon and changing the color.

[0153] The embodiment may include wiring electrodes 721 electrically connected to a plurality of semiconductor light-emitting device components 710 on the first module substrate 701.

[0154] In addition, a plurality of wiring electrodes (not shown) formed in a direction perpendicular to the wiring electrodes 721 may also be formed on the first module substrate 701. For example, in the case where the first module substrate 701 is a TFT substrate, the wiring electrodes 721 may be implemented by data wirings or gate wirings, etc., and the wiring electrodes formed perpendicular to the wiring electrodes 721 may be implemented by wirings different from the wiring electrodes 721.

[0155] According to an embodiment, the wiring electrode 721 may also be equivalent to a common electrode connected to the p-electrode or n-electrode of each of the plurality of semiconductor light-emitting devices 710.

[0156] On the other hand, the wiring electrode 721 formed on the first module substrate 701 may be electrically connected to a voltage source or a circuit of the second module substrate 702, etc., so as to receive signals related to the driving of the plurality of semiconductor light-emitting device assemblies 710 or receive electricity.

[0157] The display device 700 according to the embodiment may further include a plurality of electrode pads (not shown) formed in the edge region of the top surface of the first module substrate 701 and side electrodes 741 formed on the side surface of the display module. The plurality of electrode pads and the side electrodes 741 may be formed of a conductive metal (such as Cu, Ag, etc.).

[0158] The side electrodes 741 may be respectively formed on the side surfaces of the first module substrate 701 and the second module substrate 702. One end of the side electrode 741 may be formed to be connected to the side surface of the electrode pad on the first module substrate 701, and the other end may be connected to the second wiring electrode 722 formed at the lower part of the second module substrate 702.

[0159] In addition, in the display device 700 according to the embodiment, after the semiconductor light-emitting device assembly 710 is formed, the second module substrate 702 may be bonded (such as adhered) to the lower part of the first module substrate 701, and a planarization layer 750 is formed on the first module substrate 701.

[0160] The planarization layer 750 may be formed to a specified thickness to cover the top surface of the first module substrate 701 and the semiconductor light-emitting device assembly 710. The planarization layer 750 may form a flat surface on the upper part of the display device 700 and fix the position of the semiconductor light-emitting device assembly 710.

[0161] The planarization layer 750 may be equivalent to an encapsulation layer for protecting the semiconductor light-emitting device assembly 710.

[0162] Such a planarization layer 750 may be formed by a process such as molding or hot melt. For example, the planarization layer 750 may be realized by an acrylic resin, a polyimide resin, an epoxy resin, a polyurethane resin, etc. as a light-transmissive or fluorescent material.

[0163] Next, the embodiment may include an optical adhesive layer 760 on the planarization layer 750. The optical adhesive layer 760 may be a transparent adhesive such as an Optical Clear Adhesive (OCA), an Optically Clear Resin (OCR), etc., but is not limited thereto.

[0164] Next, the embodiment may include a film layer 770 on the optical adhesive layer 760. The film layer 770, as an electrode existing on the top surface of the first module substrate 701, may include various optical films such as a polarizing film, an Anti-Glare (AG) film, and an Anti-Reflection (AR) film for preventing quality degradation (e.g., a decrease in black contrast, etc.) caused by external incident light irradiating to the outside together with the light emitted from a plurality of semiconductor light-emitting devices.

[0165] On the other hand, according to the internal technology, due to the gap between display modules, there is a problem that the gap between display modules is recognized as a seam. In particular, when the display device is switched to the black state, the seam is more obvious.

[0166] In addition, according to the internal technology, since there is an empty space between the display module and the module, there is a problem that it is difficult to attach an adhesive layer or a front cover using an optical transparent adhesive (OCA), etc.

[0167] In addition, according to the internal technology, when attaching the front cover, due to the step (empty space) at the seam portion, the cover is bent, and there is a problem that the seam is more obvious.

[0168] Thus, in the display device 700 of the embodiment, the above technical problems can be solved by disposing a porous adhesive resin layer 790 on the first display module 700a and the second display module 700b. The porous adhesive resin layer 790 may also be formed on the sides of the first display module 700a and the second display module 700b respectively, and then converted into one body through a pressing process of a plurality of display modules.

[0169] The porous adhesive resin layer 790 may use one or more porous materials such as polyurethane foam, polypropylene (PP), thermoplastic polyurethane (TPU), thermoplastic olefin (TPO), and expanded polystyrene foam (styrofoam).

[0170] In addition, as an adhesive substance, the porous adhesive resin layer 790 may further include polyurethane resin, terpene resin, etc. In addition, the embodiments may further include thermoplastic resins such as polystyrene, polyethylene, polypropylene, methacrylic acid, and acrylic acid, and may be manufactured by mixing a black pigment in the thermoplastic resin.

[0171] As a flexible porous material, the porous adhesive resin layer 790 has the technical effect of being able to reduce seam recognition by applying a seam light-absorbing layer to capture the reflection of external light in the porous space.

[0172] The thickness of the porous adhesive resin layer 790 may be formed to be 200 μm or less, preferably 150 μm or less, but is not limited thereto.

[0173] The density of the porous adhesive resin layer 790 may be 0.15 to 0.4 g / cm 3 , but is not limited thereto.

[0174] In addition, the embodiments may further include absorbent flexible resins such as polyurethane, epoxy resin, and silicone series.

[0175] Hereinafter, a method for manufacturing the display device 700 of the embodiment will be described with reference to Figure 12 the description.

[0176] In the embodiments, the porous adhesive resin layer 790 may be formed on the sides of the first display module 700a and the second display module 700b, respectively.

[0177] On the other hand, the porous adhesive resin layer 790 may be prevented from overflowing onto the light-emitting device assembly 710 by disposing a predetermined resin barrier film (not shown) on the semiconductor light-emitting device assembly 710.

[0178] After that, the porous adhesive resin layer 790 may be formed by coating on the sides of the first display module 700a and the second display module 700b by means of inkjet or the like.

[0179] As a porous material, the porous adhesive resin layer 790 may be a foam series formed with an air layer and may have a black color for light absorption. In addition, the porous adhesive resin layer 790 may be made of a foamed resin or a resin with air dispersion.

[0180] The porous adhesive resin layer 790 includes a flexible resin and has elasticity, so that when it is compressed and fixed at a predetermined interval PX between the first display module 700a and the second display module 700b, mechanical damage can be prevented and the interval can be firmly maintained.

[0181] Thereafter, after removing the resin barrier films on the first display module 700a and the second display module 700b, the module frame 705 attachment process and the alignment process between the modules can be performed.

[0182] The module frame 705 may include a support frame 705c, a connection frame 705a, and a fixing frame 705b. Based on such a module frame 705, a plurality of modules can be fastened to each other and maintain the overall flatness and spacing.

[0183] Thereafter, the optical adhesive layer 760 and the film layer 770 can be attached.

[0184] According to the embodiment, since it is a structure that fills the gaps between the modules, there is a technical effect that it can prevent the phenomenon of bending at the boundary surface when the optical adhesive layer 760 and the film layer 770 are attached to the plurality of aligned modules.

[0185] Hereinafter, Figures 13 to 15 describe the technical effects of the display device 700 of the embodiment.

[0186] Figure 13 Show a multi-screen display device 700 including a plurality of display panels according to the embodiment.

[0187] Referring to Figure 13 , the display device 700 of the embodiment can be implemented in a manner of tiling a plurality of display panels 700a to 700d. For example, the multi-screen display device 700 may include a first display panel to a fourth display panel 700a, 700b, 700c, 700d, but is not limited thereto. Each of the plurality of display panels 700a to 700d may be a display device manufactured by the self-assembly method as described above, but is not limited thereto.

[0188] Referring to Figure 13 , different from the display device 600 of the existing internal technology Figure 7 , there is a technical effect that the boundary regions between the plurality of display panels 700a to 700d are not recognized as seams.

[0189] For example, Figure 14 is Figure 13 An example diagram of a surface photograph of the third region C3 of the display device 700 shown, and the 3D contour data P3 of each component is shown in the form of a photograph.

[0190] Specifically, Figure 14It is a surface photo of the third boundary region C1 of the first display module 700a and the second display module 700b. Since a porous adhesive resin layer 790 is disposed between the adjacent first display module 700a and second display module 700b, it has a special technical effect that the boundary line is not optically and visually recognized as a seam.

[0191] For example, the porous adhesive resin layer 790 of the embodiment functions as a seam light-absorbing layer as a flexible porous material, captures the reflection of external light in the porous space, and thus has a special technical effect of being able to reduce seam recognition.

[0192] Next, according to the embodiment, the modules can be directly bonded with the porous adhesive resin layer 790 as a medium, so that there is no gap between the modules itself, and thus has a technical effect of being able to achieve a perfect seamless.

[0193] In addition, according to the embodiment, the modules can be directly bonded with the porous adhesive resin layer 790 as a medium without separately fixing a plurality of modules, and thus has a technical effect of excellent structural reliability.

[0194] Next, Figure 15 is Figure 15 An example diagram of a surface photo of the fourth region C4 of the display device 700 shown.

[0195] Specifically, Figure 15 It is a surface photo of the fourth boundary region C4 of the first display module 700a and the second display module 700b. Even if there is a height difference between the top surface 700aT of the first display module and the top surface 700bT of the second display module in a tiled state, since the porous adhesive resin layer 790 is disposed, it functions as a seam light-absorbing layer, diffusely reflects and captures the reflection of external light in the porous space, and thus has a special technical effect of not being optically and visually recognized as a seam.

[0196] Next, Figure 16 It is a side view of the boundary region between the display modules of the display device 700B of the second embodiment, Figure 17 It is an example diagram of a manufacturing method of the display device 700B of the second embodiment.

[0197] The second embodiment may adopt the technical features of the first embodiment.

[0198] For example, the display device 700B of the second embodiment may include a first display module 700a and a second display module 700b. The first display module 700a and the second display module 700b may each include one or more of a first module substrate 701, a second module substrate 702, a semiconductor light-emitting device assembly 710, a side wiring 741, a wiring protection layer 742, a planarization film 750, an optical adhesive layer 760, and a cover film 770.

[0199] Hereinafter, the main features of the second embodiment will be described.

[0200] In the display device 700B of the second embodiment, the technical problem can be solved by disposing a viscoelastic resin layer 795 on the first display module 700a and the second display module 700b. The viscoelastic resin layer 795 may also be formed on the sides of the first display module 700a and the second display module 700b respectively, and then converted into a single body through a lamination process of a plurality of display modules.

[0201] The viscoelastic resin layer 795 may include materials such as epoxy resin or rubber.

[0202] In addition, the viscoelastic resin layer 795 may also include polyurethane resin, terpene resin, etc. as an adhesive substance. In addition, the embodiment may further include thermoplastic resins such as polystyrene, polyethylene, polypropylene, methacrylic acid, and acrylic acid, and may be manufactured by mixing a black pigment in the thermoplastic resin.

[0203] The viscoelastic resin layer 795 may use a seam light-absorbing layer to capture the reflection of external light, thereby having the technical effect of being able to reduce seam recognition.

[0204] Hereinafter, with reference to Figure 17 the manufacturing method of the display device 700B of the second embodiment will be described.

[0205] In the embodiment, the viscoelastic resin layer 795 may be formed on the sides of the first display module 700a and the second display module 700b respectively, and a specified resin barrier film (not shown) may be disposed on the semiconductor light-emitting device assembly 710 to prevent the viscoelastic resin layer 795 from overflowing onto the light-emitting device assembly 710.

[0206] The viscoelastic resin layer 795 may be formed by coating on the sides of the first display module 700a and the second display module 700b by means of inkjet or the like.

[0207] The viscoelastic resin layer 795 has viscoelasticity, so that when it is compressed and fixed at a prescribed spacing PX between the first display module 700a and the second display module 700b, mechanical damage can be prevented and the spacing can be firmly maintained.

[0208] In an embodiment, the viscoelastic resin layer 795 has an effect of reducing seam recognition by reducing reflection of external light, and the material of the viscoelastic resin layer 795 can have fluidity within a prescribed temperature range and time before being completely cured.

[0209] The display device 700B of the second embodiment is different from the display device 600 of the prior art Figure 7 and has a technical effect that the boundary regions between the plurality of display panels 700a to 700d are not recognized as seams.

[0210] For example, since the viscoelastic resin layer 795 is disposed between the adjacent first display module 700a and the second display module 700b, there is a special technical effect that the boundary line is not optically and visually recognized as a seam.

[0211] In addition, according to the second embodiment, the modules are directly bonded with the viscoelastic resin layer 795 as a medium, so that there is no gap between the modules itself, and thus there is a technical effect that perfect seamless can be achieved.

[0212] In addition, according to the second embodiment, with the viscoelastic resin layer 795 as a medium, the modules are directly bonded without separately fixing the plurality of modules, and thus there is a technical effect of excellent structural reliability.

[0213] In addition, according to the second embodiment, even if there is a height difference between the top surface 700aT of the first display module laid flat and the top surface 700bT of the second display module, due to the disposition of the viscoelastic resin layer 795, it functions as a seam light-absorbing layer to diffusely reflect and capture the reflection of external light, and thus there is a special technical effect that it is not optically and visually recognized as a seam.

[0214] The above description only exemplarily illustrates the technical idea of the present invention, and those of ordinary skill in the technical field to which the present invention pertains can make various modifications and deformations without departing from the essential features of the present invention.

[0215] Therefore, the embodiments disclosed in the present invention are not used to limit the technical idea of the present invention, but to illustrate it, and the scope of the technical idea of the present invention is not limited by such embodiments.

[0216] The protection scope of the present invention should be interpreted by the scope of rights, and should be interpreted as that all technical ideas within the equivalent scope belong to the scope of the present invention.

[0217] Industrial applicability

[0218] The embodiments can be applied to the display field for displaying images or information.

[0219] The embodiments can be applied to the display field for displaying images or information by using semiconductor light-emitting devices.

[0220] The embodiments can be applied to the display field for displaying images or information by using micron-scale or nanoscale semiconductor light-emitting devices.

Claims

1. A display device of a semiconductor light-emitting device, wherein, comprising: substrates of a first display module and a second display module which are adjacently arranged; a plurality of semiconductor light-emitting device components respectively arranged on the substrate of the first display module and the substrate of the second display module; a first side wiring and a second side wiring respectively arranged on the side surfaces of the substrate of the first display module and the substrate of the second display module and electrically connected to the semiconductor light-emitting device components respectively; and a porous adhesive resin layer arranged between the substrate of the first display module and the substrate of the second display module.

2. The display device of a semiconductor light-emitting device according to claim 1, wherein, the porous adhesive resin layer comprises: a first porous adhesive resin layer arranged on the first side wiring of the substrate of the first display module; and a second porous adhesive resin layer arranged on the second side wiring of the substrate of the second display module; the first porous adhesive resin layer and the second porous adhesive resin layer are combined to form a single body.

3. The display device of a semiconductor light-emitting device according to claim 1, wherein, there is a surface step between the top surface of the substrate of the first display module and the top surface of the substrate of the second display module.

4. The display device of a semiconductor light-emitting device according to claim 1, wherein, it further comprises a planarization film arranged on the substrate of the first module and the substrate of the second module.

5. The display device of a semiconductor light-emitting device according to claim 1, wherein, it further comprises an optical adhesive layer and a cover film arranged on the substrate of the first module and the substrate of the second module.

6. A display device of a semiconductor light-emitting device, wherein, comprising: substrates of a first display module and a second display module which are adjacently arranged; a plurality of semiconductor light-emitting device components respectively arranged on the substrate of the first display module and the substrate of the second display module; a first side wiring and a second side wiring respectively arranged on the side surfaces of the substrate of the first display module and the substrate of the second display module and electrically connected to the semiconductor light-emitting device components respectively; and a viscoelastic resin layer arranged between the substrate of the first display module and the substrate of the second display module.

7. The display device of a semiconductor light-emitting device according to claim 6, wherein, the viscoelastic resin layer comprises: a first viscoelastic resin layer arranged on the first side wiring of the substrate of the first display module; and a second viscoelastic resin layer arranged on the second side wiring of the substrate of the second display module; the first viscoelastic resin layer and the second viscoelastic resin layer are combined to form a single body.

8. The display device of a semiconductor light-emitting device according to claim 6, wherein, there is a surface step between the top surface of the substrate of the first display module and the top surface of the substrate of the second display module.

9. The display device of a semiconductor light-emitting device according to claim 6, wherein, it further comprises a planarization film arranged on the substrate of the first module and the substrate of the second module.

10. The display device of the semiconductor light-emitting device according to claim 6, wherein, it further includes an optical adhesive layer and a cover film disposed on the first module substrate and the second module substrate.

Images