Vapor deposition device

Abstract

The invention relates to an evaporation device. The evaporation device comprises a seat body, a plurality of carriers, a plurality of locking pieces and a plurality of clamping modules, the carrier is detachably arranged on the seat body. And each locking piece is correspondingly arranged at a central position of each carrier, and the locking pieces penetrate through the seat body to lock the carriers. The clamping module is arranged on the carrier. Wherein, when each carrier carries a wafer and each clamping module clamps the wafer, the wafer is clamped between the local carriers and the clamping module.

Description

Technical Field

[0001] The present invention relates to an evaporation device, especially an evaporation device that fixes a carrier for placing a wafer through a locking member and the carrier has a recessed space. Background Art

[0002] The evaporation process is a semiconductor process technology used to deposit thin film materials on the surface of a wafer. Among them, in the evaporation process, an evaporation device such as an evaporation plating pot is mainly used, and its function is to accommodate solid metals or other evaporation materials for evaporation. The evaporation process is usually carried out in a vacuum environment. The evaporation plating pot is heated to evaporate the evaporation materials inside, and in combination with chemical vapor deposition (CVD) or physical vapor deposition (PVD) methods, vapor is generated by the evaporation of the evaporation materials, so that the thin film materials can be deposited on the surface of the wafer or other substrates in the form of atoms or molecules to form the required thin film layer. However, with the continuous growth of the demand for silicon wafer chips in many industries, how to improve the stability of the chips in the process and the product yield has become one of the most important research topics at present.

[0003] In currently common evaporation devices, specific wafer carriers and turntable seat bodies are usually used. Multiple wafer carriers are provided on the turntable seat body, and these wafer carriers are mainly used to fixedly support the wafers and are placed in the evaporation device. However, such traditional evaporation devices have some drawbacks that cannot be ignored. First, in the traditional evaporation process, the elastic elements used on the evaporation device have a large elastic coefficient because they need to clamp the wafer carriers and wafers at the same time. Therefore, it is easy to exert an external force on the thinned wafer, resulting in cracks on the surface of the wafer. In addition, as the coating process progresses, the vibration of the turntable seat body may cause friction between the wafer and the wafer carrier, thereby causing scratches on the surface of the wafer and affecting the appearance yield loss of the components.

[0004] In view of this, the present invention proposes an evaporation device to solve the problem that the elastic elements in the prior art are likely to cause wafer fragmentation due to too large an elastic coefficient. Summary of the Invention

[0005] The object of the present invention is to provide an evaporation device, aiming to provide an evaporation device that can reduce the degree of wafer fragmentation in the evaporation process and reduce the contact between the wafer and the carrier. The present invention particularly uses a locking member to lock the carrier for placing the wafer on the seat body. By fixing the carrier with the locking member, the elastic element does not need a too high elastic coefficient to clamp the wafer. This structure is less likely to cause cracks on the wafer due to external forces, especially for thinned wafers. On the other hand, there is a recessed space in the middle of the carrier, and there are multiple convex portions on the outer periphery of the carrier. Through the above design, the contact area between the wafer and the carrier can be greatly reduced, which will also reduce the friction between the wafer and the carrier during the coating process, reduce scratches on the surface of the wafer, and further improve the appearance yield of the wafer.

[0006] To achieve the above object, the present invention discloses an evaporation device, including a base body, a plurality of carriers, a plurality of locking members, and a plurality of clamping modules. The carriers are detachably disposed on the base body. Each of the locking members is correspondingly disposed at a central position of each of the carriers, and the locking member penetrates through the base body to lock the carrier. The clamping module is disposed on the carrier. Wherein, when each of the carriers carries a wafer and each of the clamping modules clamps the wafer, the wafer is clamped between some of the carriers and the clamping modules.

[0007] In one embodiment, each of the carriers further has a body and a plurality of protrusions formed on the outer periphery of the body for contacting the wafer.

[0008] In one embodiment, the body further includes a first surface and a second surface. The protrusion and the first surface form a first height difference, and the first surface and the second surface form a second height difference.

[0009] In one embodiment, the first surface and the second surface jointly define a recessed space.

[0010] In one embodiment, the clamping module is elastic and is vertically disposed at a position of the body relative to the protrusion.

[0011] In one embodiment, the clamping module has at least one first elastic member and at least one second elastic member. The first elastic member is fixed to the body, and the second elastic member is detachably disposed on the body.

[0012] In one embodiment, the number of the first elastic members and the second elastic members in each of the clamping modules is at least two respectively.

[0013] In one embodiment, the base body further includes a plurality of hollow holes and a plurality of support pieces. The hollow holes are formed on both sides corresponding to each of the support pieces, and the support pieces are connected to the carrier through the locking members.

[0014] In one embodiment, when the wafer is clamped between some of the carriers and the clamping modules, the wafer is in contact with the protrusion and the clamping module at the same time, and the wafer is not in contact with the first surface and the second surface.

[0015] In one embodiment, the base body is rotatable.

[0016] After referring to the accompanying drawings and the following described embodiments, those of ordinary skill in the art can understand other objects of the present invention, as well as the technical means and implementation aspects of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a front view schematic diagram of the carrier of the evaporation device of the present invention;

[0018] Figure 2 Schematic diagram of the reverse side of the carrier of the evaporation device of the present invention;

[0019] Figure 3 Partial cross-sectional view of the evaporation device of the present invention;

[0020] Figure 4 Front schematic diagram of the evaporation device according to an embodiment of the present invention;

[0021] Figure 5 Reverse schematic diagram of the evaporation device according to an embodiment of the present invention;

[0022] Figure 6 Front schematic diagram of the evaporation device according to another embodiment of the present invention; and

[0023] Figure 7 Reverse schematic diagram of the evaporation device according to another embodiment of the present invention.

[0024] Description of reference numerals

[0025] 1000 Evaporation device

[0026] 2000 Wafer

[0027] 1 Base

[0028] 11 Hollow hole

[0029] 12 Support piece

[0030] 2 Carrier

[0031] 21 Body

[0032] 211 First surface

[0033] 212 Second surface

[0034] 22 Convex part

[0035] 3 Fastening member

[0036] 4 Clamping module

[0037] 41 First elastic member

[0038] 42 Second elastic member

[0039] H1 First height difference

[0040] H2 Second height difference

[0041] S Concave space. Detailed implementation manners

[0042] The content of the present invention will be explained through embodiments below. The embodiments of the present invention are not intended to limit that the present invention must be implemented in any specific environment, application or special manner as described in the embodiments. Therefore, the description of the embodiments is only for the purpose of explaining the present invention and not for limiting the present invention. It should be noted that in the following embodiments and drawings, elements not directly related to the present invention have been omitted and not shown, and the dimensional relationships between the elements in the drawings are only for easy understanding and not for limiting the actual ratio.

[0043] Please refer to Figures 1 to 3 . Figure 1 and Figure 2 The front and back views of each carrier 2 of the evaporation device 1000 provided by the present invention are shown respectively. Figure 3 The partial cross-sectional view of the evaporation device 1000 of the present invention is shown. The evaporation device 1000 can be used to clamp a plurality of wafers 2000 to perform subsequent evaporation processes on the wafers 2000. Among them, as Figure 6 shown, in an embodiment of the present invention, the evaporation device 1000 includes a base body 1, a plurality of carriers 2, a plurality of locking members 3, and a plurality of clamping modules 4. The carrier 2 is detachably disposed on the base body 1, and the carrier 2 is used to place the wafer 2000. The locking members 3 and the clamping modules 4 are correspondingly disposed on each carrier 2.

[0044] To further illustrate the base body 1, please refer to Figure 4 and Figure 5 . Figure 4 is the front view of the evaporation device 1000 in an embodiment of the present invention, Figure 5 is the back view of the evaporation device 1000 in an embodiment of the present invention. The base body 1 includes a plurality of hollow holes 11 and a plurality of support pieces 12. The hollow holes 11 are formed on the corresponding two sides of each support piece 12, and each support piece 12 has a locking hole for each locking member 3 to lock each carrier 2 on each support piece 12. In this embodiment, when the wafer 2000 is placed on the carrier 2, the user can set the clamping module 4 on the carrier 2 through the space of the hollow holes 11, so that the wafer 2000 can be clamped and fixed on the carrier 2. On the contrary, the user can also loosen part of the clamping module 4 from the hollow holes 11, and then remove the wafer 2000 disposed on the carrier 2. It should be noted that the base body 1 of the evaporation device 1000 of the present invention is rotatable to facilitate the user to install and disassemble the wafer 2000.

[0045] Please refer to Figure 1 and Figure 2. The carrier 2 includes a body 21 and four convex portions 22. The convex portions 22 are formed on the outer peripheral edge of the body 21 and can be used to contact the wafer 2000. Specifically, the body 21 further includes a first surface 211 and a second surface 212. Among them, as Figure 3 shown, the convex portions 22 are disposed on the first surface 211 and form a first height difference H1 with the first surface 211. On the other hand, the first surface 211 and the second surface 212 form a second height difference H2. In addition, the first surface 211 and the second surface 212 jointly define a recessed space S. It should be noted that when each of the carriers 2 holds the wafer 2000 and each of the clamping modules 4 clamps the wafer 2000, the wafer 2000 is clamped between each of the local carriers 2 and the clamping module 4, as Figure 3 shown. Then, by forming the convex portions 22 and this recessed space S, the wafer 2000 is clamped between the convex portions 22 and the clamping module 4. In other words, the wafer 2000 only contacts the convex portions 22 and the clamping module 4 at the same time, and the wafer 2000 does not contact the first surface 211 and the second surface 212. Different from the structure of the traditional evaporation device, this design can reduce the area of contact between the wafer 2000 and the surface of the carrier 2, and further avoid possible scratches in the evaporation process. It should be noted that Figure 4 and Figure 5 shown is the evaporation device 1000 of an embodiment of the present invention, Figure 6 and Figure 7 shown is the evaporation device 1000 of another embodiment of the present invention. The difference between the two is only the number of the carriers 2 disposed on the base 1. The positions and numbers of the carriers 2 disposed can be adjusted according to the actual size of the wafer to be clamped, and are not limited herein.

[0046] Next, the locking member 3 and the clamping module 4 will be described in detail. As Figure 3 and Figure 6 shown, each of the locking members 3 is correspondingly disposed at a central position of each of the carriers 2. The locking member 3 penetrates the base 1 and locks the carrier 2. In this embodiment, the combination of a screw and a nut is taken as an example for the locking member 3. The user can adjust and replace it with other types of locking methods according to actual needs, and is not limited herein. It should be noted that the carrier 2 is fixedly disposed on the base 1 through the locking member 3. By this fixing method, the elastic coefficient of the clamping module 4 for clamping the wafer 2000 can be reduced, and the wafer 2000 after thinning can be reduced in cracks when being clamped.

[0047] Continuing from the above, the clamping module 4 is elastic and is vertically disposed at the position of the body 21 relative to the convex portion 22. Specifically, the clamping module 4 has at least one first elastic member 41 and at least one second elastic member 42. The first elastic member 41 is fixed to the body 21, and the second elastic member 42 is detachably disposed on the body 21. In this embodiment, the number of the first elastic members 41 and the second elastic members 42 in each clamping module 4 is at least two. Preferably, the first elastic member 41 and the second elastic member 42 are each two, so that the wafer 2000 can be fixed to the convex portion 22 of the carrier 2 in a four-corner positioning manner. Specifically, in this embodiment, the first elastic member 41 and the second elastic member 42 can be the same spring elements, and the first elastic member 41 is fixedly disposed at the position of the carrier 2 relative to the outer peripheral region of the base 1, and the second elastic member 42 is detachably disposed at the position of the carrier 2 relative to the inner peripheral region of the base 1, as Figure 6 shown. In addition, the steps of clamping the wafer 2000 by the clamping module 4 include first fixing the first elastic member 41, then clamping one side of the wafer 2000 between the first elastic member 41 and a part of the convex portion 22, and finally using the detachable second elastic member 42 to clamp the remaining convex portion 22 of the wafer 2000 and the carrier 2. Conversely, when the wafer 2000 is to be disassembled, the second elastic member 42 can be removed first, and then the wafer 2000 can be taken out.

[0048] In summary, the evaporation device of the present invention includes a combination of a base, a carrier, a locking member, and a clamping module. The difference from the traditional evaporation device is that each carrier is fixed to the base by a corresponding locking member, and there is no need to use an elastic member with a large elastic coefficient to clamp the carrier and the wafer. In addition, the carrier has a recessed space and only needs to contact and support the wafer through the convex portions provided on the carrier, which can greatly reduce the contact area between the wafer and the carrier. Thus, it is possible to reduce scratches and fragmentation of the wafer during the evaporation process and improve the appearance yield of the wafer.

[0049] The above embodiments are only used to illustrate the implementation schemes of the present invention and explain the technical features of the present invention, and are not used to limit the protection scope of the present invention. Any change or equivalent arrangement that can be easily completed by those skilled in the art belongs to the scope claimed by the present invention, and the scope of the right protection of the present invention shall be subject to the claims.

Claims

1. A vapor deposition device, comprising: A building; A plurality of carriers are detachably disposed on the base; A plurality of locking members, each of which is correspondingly disposed at a central position of each of the carriers, and the locking member penetrates the base body to lock the carrier; and A plurality of clamping modules are arranged on the carrier; When each of the carriers carries a wafer and each of the clamping modules clamps the wafer, the wafer is clamped between parts of each of the carriers and the clamping modules.

2. The evaporation device according to claim 1, wherein: Each carrier also has a body and a plurality of convex parts, wherein the convex parts are formed on the outer periphery of the body to contact the wafer.

3. The evaporation device according to claim 2, wherein: The main body further comprises a first surface and a second surface. The protrusion and the first surface form a first height difference, and the first surface and the second surface form a second height difference.

4. The evaporation device according to claim 3, wherein: The first surface and the second surface together define a recessed space.

5. The evaporation device according to claim 2, wherein: The clamping module is elastic and is vertically arranged at a position of the main body relative to the convex portion.

6. The evaporation device according to claim 2, wherein: The clamping module has at least one first elastic member and at least one second elastic member, wherein the first elastic member is fixedly mounted on the body, and the second elastic member is detachably mounted on the body.

7. The evaporation device according to claim 6, wherein: The number of the first elastic members and the second elastic members in each of the clamping modules is at least two.

8. The evaporation device according to claim 1, wherein: The seat body further comprises a plurality of hollow holes and a plurality of support sheets, wherein the hollow holes are formed on two corresponding sides of each of the support sheets, and the support sheets are connected to the carrier via the locking element.

9. The evaporation device according to claim 3, wherein: When the wafer is clamped between the carrier and the clamping module, the wafer contacts the convex portion and the clamping module at the same time, and the wafer does not contact the first surface or the second surface.

10. The evaporation device according to claim 1, wherein: The seat body is rotatable.

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