Pressure sensor

Abstract

The invention discloses a pressure sensor, and relates to the technical field of spring type pressure sensors. The device comprises a spring assembly, a sensing element and a mounting seat, a spring assembly is matched in the mounting base, a supporting column is fixed in the mounting base, a through hole is formed in the top in the mounting base, a movable block is in sliding fit with the inner wall of the through hole, a cylindrical receding cavity is formed in the supporting column, and a supporting circular plate is matched with the inner wall of the cylindrical receding cavity; the spring assembly comprises spring elements with different elastic coefficients; the bottom surface of the movable block is fixedly connected with the top of a spring element; a supporting circular plate is fixed at the bottom of the spring element; a sensing element is assembled between the movable block and the inner top wall of the movable cavity; the sensing element is electrically connected with a microprocessor through a signal processing circuit. According to the invention, through the action of the spring assembly, the sensing element and the mounting seat, the elastic coefficient k of the appropriate spring assembly is adapted according to the measurement requirement, and the functions of increasing the measurement range and improving the measurement precision are realized.

Description

Technical Field

[0001] The present invention belongs to the technical field of spring-type pressure sensors, and particularly relates to a pressure sensor. Background Art

[0002] A pressure sensor is a device or apparatus that can sense a pressure signal and convert the pressure signal into an available output electrical signal according to a certain rule. A pressure sensor usually consists of a pressure-sensitive element and a signal processing unit. A pressure sensor is one of the most widely used sensors. Traditional pressure sensors are mainly mechanical structure-type devices, and the deformation of an elastic element indicates the pressure; among them, a spring-type pressure sensor is a typical mechanical structure-type pressure sensor; its principle is: when pressure acts on the spring, the spring deforms, and the amount of deformation is proportional to the pressure; the measuring element inside the sensor converts the amount of deformation into an electrical signal and outputs a voltage or current signal related to the pressure.

[0003] Since the measurement range of a traditional mechanical structure-type pressure sensor depends on the range of the product of the deformation range of the elastic element and the elastic coefficient k, that is, the elastic coefficient k affects the size of the measurement range; at the same time, the elastic coefficient k of the elastic element also determines the measurement accuracy, that is, the lower the elastic coefficient k, the higher its sensitivity and the greater its measurement accuracy; conversely, its measurement accuracy is lower; therefore, the elastic coefficient k affects both the size of the measurement range and the measurement accuracy; if it is necessary to take into account both the measurement accuracy and the measurement range, an elastic element with a lower elastic coefficient k and a relatively longer length needs to be used, resulting in the problem that the spring-type pressure sensor has a relatively large volume. Aiming at the problem that a relatively large volume will occur when taking into account both the measurement accuracy and the measurement range pointed out above, the present invention designs a pressure sensor. Summary of the Invention

[0004] The purpose of the present invention is to provide a pressure sensor, which, through the functions of a spring assembly, a sensing element, and a mounting seat, will adapt the size of the elastic coefficient k of the spring assembly according to the measurement requirements, so as to achieve the functions of increasing the measurement range and improving the measurement accuracy; and there is no need to increase the length of the elastic element, solving the problem that it is impossible to take into account the measurement accuracy, the measurement range, and the volume pointed out above.

[0005] To solve the above technical problems, the present invention is realized through the following technical solutions:

[0006] The present invention relates to a pressure sensor, which comprises a spring assembly, a sensing element and a mounting base; an activity cavity and a mounting cavity are formed inside the mounting base, a plurality of mounting cavities are formed in the bottom surface of the activity cavity, and a through hole is formed in the top of the activity cavity; the spring assembly is in clearance fit inside the activity cavity, a support column is fixed inside the mounting cavity, and an activity block is in sliding fit with the inner wall of the through hole, and the activity block is of a T-shaped structure; a cylindrical relief cavity is formed inside the support column, and a support circular plate is in sliding fit with the inner wall of each cylindrical relief cavity; the spring assembly comprises at least two spring elements with different elastic coefficients; the bottom surface of the activity block is fixedly connected to the tops of all the spring elements, and a support circular plate is fixedly connected to the bottom of each spring element; a sensing element is assembled between the activity block and the inner top wall of the activity cavity; the sensing element is electrically connected to a microprocessor through a signal processing circuit; wherein, the activity block compresses the spring assembly under the action of force, and the activity block displaces to a certain extent under the action of force, the sensing element collects the displacement amount of the activity block as a measurable electrical signal, and the signal processing circuit processes and converts it into a voltage or current signal and sends it to the microprocessor; wherein, the function of designing a plurality of spring elements with different elastic coefficients in the spring assembly is to increase the measurement range and improve the measurement accuracy by changing the magnitude of the elastic coefficient k of the spring assembly.

[0007] As a preferred technical solution of the present invention, a limiting support ring is fixed to the top of each cylindrical relief cavity, and an electromagnetic lock is assembled between the bottom surface of the limiting support ring and the top surface of the support circular plate; each electromagnetic lock is electrically connected to the microprocessor; the microprocessor can control whether the support circular plate is in a sliding state or a fixed state inside the cylindrical relief cavity through the action of the electromagnetic lock; thereby, the magnitude of the elastic coefficient k of the spring assembly can be controlled.

[0008] As a preferred technical solution of the present invention, the electromagnetic lock comprises an electromagnetic lock module A and an electromagnetic lock module B, the electromagnetic lock module A and the electromagnetic lock module B are respectively electrically connected to the microprocessor, and the electromagnetic lock module A is assembled between the bottom surface of the limiting support ring and the top surface of the support circular plate; a through hole is formed in the limiting support ring; a fixed-distance sliding rod is in sliding fit with the inner wall of the through hole, limiting circular plates are fixed to both ends of the fixed-distance sliding rod, and the electromagnetic lock module B is assembled between the bottom surface of the limiting circular plate at the bottom of the fixed-distance sliding rod and the top surface of the support circular plate; the microprocessor can control whether the support circular plate and the bottom of the fixed-distance sliding rod are in an adsorbed and fixed state or a non-adsorbed state through the action of the electromagnetic lock module B.

[0009] As a preferred technical solution of the present invention, the movable block includes a movable ring and a movable cylinder; a limiting support ring is fixed at the opening at the top of the movable cylinder; a limiting sliding groove is formed in the inner wall of the movable ring; the inner wall of the movable ring is in sliding fit with the peripheral side of the movable cylinder; the inner wall of the limiting sliding groove is in sliding fit with the peripheral side of the limiting support ring; the top of the spring element located at the center of the movable cavity is fixedly connected to the bottom of the movable cylinder; the sensing element includes sensing element A and sensing element B, and the sensing element A is assembled between the movable block and the inner top wall of the movable cavity; a sensing element B is assembled between the inner top wall of the limiting sliding groove and the top surface of the limiting support ring; the sensing element A and the sensing element B are respectively electrically connected to the microprocessor.

[0010] As a preferred technical solution of the present invention, a support circular plate is fixed on the top surface of the movable ring; a micro electric telescopic rod is fixed between the support circular plate and the movable cylinder; the micro electric telescopic rod is electrically connected to the microprocessor.

[0011] As a preferred technical solution of the present invention, the spring element includes spring piece A, spring piece B, spring piece C and spring piece D; the relationship of the elastic coefficient k of the spring piece A, spring piece B, spring piece C and spring piece D is k A >k B >k C >k D ; when the support circular plate fixedly connected to the bottom of the spring element N is in a sliding fit state, that is, the spring element is in a relaxed state during the measurement process, the elastic coefficient k of the spring element N N is not included in the elastic coefficient k of the spring assembly; when the support circular plate fixedly connected to the bottom of the spring element N is in a fixed state, that is, the spring element will be in a compressed state during the measurement process, the elastic coefficient k of the spring element N N will be included in the elastic coefficient k of the spring assembly.

[0012] The technical principle for improving the measurement accuracy in a pressure sensor of the present invention is as follows: the spring element located at the center of the movable cavity is the spring piece D with a smaller elastic coefficient; the functions of the micro electric telescopic rod, the movable cylinder and the sensing element B are to improve the measurement accuracy. When the micro electric telescopic rod is in an extended state, the spring piece D will exert a force F on the movable ring in the opposite direction to the force direction of the force to be measured D , that is, the force F exerted by the spring piece D on the movable ring D will offset a part of the force F to be measured 待 , that is, the force F on the movable ring 1 = the force F to be measured 待 -F D ; therefore, the force F to be measured 待 =F 1 +FD ; among them, the elastic coefficient k of the spring member D as described above D is relatively small, and its measurement accuracy is higher.

[0013] The present invention has the following beneficial effects:

[0014] Through the action of the spring assembly, the sensing element and the mounting seat, the present invention will adapt the magnitude of the elastic coefficient k of the spring assembly according to the measurement requirements, so as to achieve the functions of increasing the measurement range and improving the measurement accuracy without increasing the length of the elastic element; it has the advantages of taking into account the measurement accuracy, the measurement range and the volume.

[0015] Of course, any product implementing the present invention does not necessarily need to achieve all the above-mentioned advantages simultaneously. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0017] Figure 1 is a cross-sectional view of the internal structure of a pressure sensor of the present invention;

[0018] Figure 2 is a transverse cross-sectional view of the internal structure of a pressure sensor of the present invention;

[0019] Figure 3 is a longitudinal cross-sectional view of the internal structure of a pressure sensor of the present invention;

[0020] Figure 4 is a perspective view of the structure of the mounting seat of the present invention;

[0021] Figure 5 is a schematic diagram of the structure of the support column of the present invention;

[0022] Figure 6 is a schematic diagram of the structure of the movable ring of the present invention;

[0023] Figure 7 is a schematic diagram of the structure of the movable cylinder of the present invention;

[0024] Figure 8 is a schematic diagram of the structure of the support circular plate of the present invention;

[0025] Figure 9 is a schematic diagram of the structure of the fixed-distance sliding rod of the present invention;

[0026] In the accompanying drawings, the list of components represented by each reference numeral is as follows:

[0027] 1 - Spring assembly, 2 - Sensing element, 3 - Mounting base, 4 - Support column, 5 - Movable block, 6 - Electromagnetic lock, 101 - Spring piece A, 102 - Spring piece B, 103 - Spring piece C, 104 - Spring piece D, 201 - Sensing element A, 202 - Sensing element B, 301 - Movable cavity, 302 - Mounting cavity, 303 - Through hole, 401 - Cylindrical relief cavity, 402 - Support circular plate, 403 - Limit support ring, 404 - Through hole, 405 - Fixed - distance sliding rod, 406 - Limit circular plate, 501 - Movable ring, 502 - Movable cylinder, 503 - Limit support ring, 504 - Limit sliding groove, 505 - Support circular plate, 506 - Micro electric telescopic rod, 601 - Electromagnetic lock module A, 602 - Electromagnetic lock module B. Detailed implementation manners

[0028] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0029] Embodiment 1

[0030] Please refer to Figures 1-9As shown in the figure, the present invention is a pressure sensor, which includes a spring assembly 1, a sensing element 2, and a mounting base 3. An activity cavity 301 and a mounting cavity 302 are formed inside the mounting base 3. A number of mounting cavities 302 are formed on the bottom surface of the activity cavity 301, and a through hole 303 is formed at the top inside the activity cavity 301. The spring assembly 1 is in clearance fit inside the activity cavity 301. A support column 4 is fixed inside the mounting cavity 302. An activity block 5 is in sliding fit with the inner wall of the through hole 303, and the activity block 5 has a T-shaped structure. A cylindrical relief cavity 401 is formed inside the support column 4, and a support circular plate 402 is in sliding fit with the inner wall of each cylindrical relief cavity 401. The spring assembly 1 includes at least two spring elements with different elastic coefficients. The bottom surface of the activity block 5 is fixedly connected to the tops of all spring elements, and a support circular plate 402 is fixedly connected to the bottom of each spring element. A sensing element 2 is assembled between the activity block 5 and the inner top wall of the activity cavity 301. The sensing element 2 is electrically connected to a microprocessor through a signal processing circuit. Among them, when the activity block 5 is under force, it squeezes the spring assembly 1, and the activity block 5 undergoes a certain degree of displacement under the action of force. The sensing element 2 collects the displacement amount of the activity block 5 as a measurable electrical signal, and the signal processing circuit processes and converts it into a voltage or current signal and sends it to the microprocessor. Among them, the function of designing multiple spring elements with different elastic coefficients in the spring assembly 1 is to increase the measurement range and improve the measurement accuracy by changing the magnitude of the elastic coefficient k of the spring assembly 1.

[0031] Among them, as Figure 5 shown, a limiting support ring 403 is fixed at the top of each cylindrical relief cavity 401, and an electromagnetic lock 6 is assembled between the bottom surface of the limiting support ring 403 and the top surface of the support circular plate 402. Each electromagnetic lock 6 is electrically connected to the microprocessor. The microprocessor can control whether the support circular plate 402 is in a sliding state or a fixed state inside the cylindrical relief cavity 401 through the action of the electromagnetic lock 6, so as to control the magnitude of the elastic coefficient k of the spring assembly 1.

[0032] Among them, as Figures 1-3 shown, the spring elements include a spring piece A101, a spring piece B102, a spring piece C103, and a spring piece D104. The magnitude relationship of the elastic coefficients k of the spring piece A101, the spring piece B102, the spring piece C103, and the spring piece D104 is k A > k B > k C > k D ; when the support circular plate 402 fixedly connected to the bottom of the spring element N is in a sliding fit state, that is, the spring element is in a relaxed state during the measurement process, then the elastic coefficient k of the spring element N NIt is not included in the elastic coefficient k of the spring assembly 1; when the support circular plate 402 fixedly connected to the bottom of the spring element N is in a fixed state, that is, the spring element will be in a compressed state during the measurement, then the elastic coefficient k of the spring element N N will be included in the elastic coefficient k of the spring assembly 1.

[0033] Embodiment 2

[0034] Based on Embodiment 1, a more preferred technical solution is as follows. Please refer to Figures 8-9 As shown, the electromagnetic lock 6 includes an electromagnetic lock module A601 and an electromagnetic lock module B602. The electromagnetic lock module A601 and the electromagnetic lock module B602 are respectively electrically connected to the microprocessor. An electromagnetic lock module A601 is assembled between the bottom surface of the limit support ring 403 and the top surface of the support circular plate 402; a through hole 404 is formed in the limit support ring 403; a fixed-distance sliding rod 405 is slidably fitted on the inner wall of the through hole 404. Limiting circular plates 406 are fixed at both ends of the fixed-distance sliding rod 405. An electromagnetic lock module B602 is assembled between the bottom surface of the limiting circular plate 406 at the bottom of the fixed-distance sliding rod 405 and the top surface of the support circular plate 402; the microprocessor can control whether the support circular plate 402 and the bottom of the fixed-distance sliding rod 405 are in an adsorbed fixed state or a non-adsorbed state through the action of the electromagnetic lock module B602; the function of the fixed-distance sliding rod 405 is to make the spring element on the fixed-distance sliding rod 405 in a sliding state, and the elastic coefficient k of the spring element N N is not included in the elastic coefficient k of the spring assembly 1; when the fixed-distance sliding rod 405 is slid to the longest, at this time the support circular plate 402 at the bottom of the fixed-distance sliding rod 405 is in a downward extrusion state to reach a fixed state, and at this time the elastic coefficient k of the spring element N N will be included in the elastic coefficient k of the spring assembly 1; achieving the function of adjusting the size of the elastic coefficient k of the spring assembly 1.

[0035] Embodiment 3

[0036] Based on Embodiment 1, a more preferred technical solution is as follows. Please refer to Figures 6-7As shown in the figure, the movable block 5 includes a movable ring 501 and a movable cylinder 502; a limiting support ring 503 is fixed at the opening at the top of the movable cylinder 502; a limiting sliding groove 504 is formed on the inner wall of the movable ring 501; the inner wall of the movable ring 501 is in sliding fit with the peripheral side surface of the movable cylinder 502; the inner wall of the limiting sliding groove 504 is in sliding fit with the peripheral side surface of the limiting support ring 503; the top of the spring element located at the center of the movable cavity 301 is fixedly connected to the bottom of the movable cylinder 502. At this time, the elastic coefficient of the spring element located at the center of the movable cavity 301 is not included in the elastic coefficient k of the spring assembly 1; the sensing element 2 includes a sensing element A 201 and a sensing element B 202. The sensing element A 201 is assembled between the movable block 5 and the inner top wall of the movable cavity 301; a sensing element B 202 is assembled between the inner top wall of the limiting sliding groove 504 and the top surface of the limiting support ring 503; the sensing element A 201 and the sensing element B 202 are respectively electrically connected to the microprocessor; a supporting circular plate 505 is fixed on the top surface of the movable ring 501; a micro electric telescopic rod 506 is fixed between the supporting circular plate 505 and the movable cylinder 502; the micro electric telescopic rod 506 is electrically connected to the microprocessor.

[0037] Among them, as Figures 1-3 shown, the spring element includes a spring piece A 101, a spring piece B 102, a spring piece C 103 and a spring piece D 104, and the proportional relationship of the elastic coefficient k among them is k A : k B : k C : k D = 5:3:2:1.

[0038] The technical principle of improving the measurement accuracy in a pressure sensor of this embodiment is as follows: the spring element located at the center of the movable cavity 301 is the spring piece D 104 with a relatively small elastic coefficient; the functions of the micro electric telescopic rod 506, the movable cylinder 502 and the sensing element B 202 are to improve the measurement accuracy. When the micro electric telescopic rod 506 is in the extended state, the spring piece D 104 will exert a force F on the movable ring 501 in the direction opposite to the direction of the force to be measured D , that is, the force F exerted by the spring piece D 104 on the movable ring 501 D will offset a part of the force F to be measured 待 , that is, the force F on the movable ring 501 1 = the force F to be measured 待 - F D ; therefore, the force F to be measured 待 = F 1 + F D ; among them, as mentioned above, the elastic coefficient k of the spring piece D 104 D is relatively small, and its measurement accuracy is higher; for example, when the actual force F to be measured is applied 待When = 10.86N, the elastic coefficient k of the spring assembly 1 is relatively large, and its measurement accuracy is set to 1N. The elastic coefficient k of the spring piece D104 is relatively small, and its measurement accuracy is set to 0.1N. Then the measured value range can be obtained as 10.80 - 10.89N. Otherwise, only relying on the elastic coefficient k of the spring assembly 1 can only measure the value range as 10.0 - 10.9N. When the circumferential side of the movable block 5 is provided with scales, the elastic coefficient k of the spring assembly 1 is relatively large, and its graduation value is set to 1N. The elastic coefficient k of the spring piece D104 is relatively small, and its graduation value is set to 0.1N. The microprocessor controls the scale on the circumferential side of the movable block 5 to be exactly on the 10N scale line through the micro electric telescopic rod 506, F 1 can only measure 10N, while F D can measure 8N, so F D the scale value is 8N, and its estimated value is approximately around 0.06N, thus the value range can be obtained as 10.80 - 10.89N. Otherwise, only relying on the elastic coefficient k of the spring assembly 1 can only measure the value range as 10.0 - 10.9N, and the estimated value can also be obtained as approximately 0.8N according to the estimation. Obviously, the accuracy with a graduation value of 1N is lower than that with a graduation value of 0.1N. Therefore, it has the advantage of improving the measurement accuracy.

[0039] In the description of this specification, the descriptions referring to terms such as "one embodiment", "example", "specific example", etc. mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0040] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not elaborate on all details, nor do they limit the invention to the specific embodiments described. Obviously, many modifications and variations can be made according to the content of this specification. The present specification selects and specifically describes these embodiments to better explain the principle and practical application of the present invention, so that those skilled in the relevant technical field can understand and utilize the present invention well. The present invention is only limited by the claims and their full scope and equivalents.

Claims

1. A pressure sensor, characterized in that: It comprises a spring assembly (1), a sensing element (2) and a mounting seat (3); The mounting seat (3) is provided with an active cavity (301) and an installation cavity (302) inside, the bottom surface of the active cavity (301) is provided with a plurality of installation cavities (302), and the top of the active cavity (301) is provided with a through hole (303); a spring assembly (1) is fitted in the clearance inside the active cavity (301), a support column (4) is fixed inside the installation cavity (302), and an active block (5) is slidably fitted on the inner wall of the through hole (303), and the active block (5) is a T-shaped structure; The spring assembly (1) comprises at least two spring elements with different elastic coefficients; the bottom surface of the movable block (5) is fixedly connected to the tops of all the spring elements; a cylindrical clearance cavity (401) is provided inside the support column (4); the inner wall of each cylindrical clearance cavity (401) is slidably matched with a support circular plate (402); and the bottom of each spring element is fixedly connected to a support circular plate (402); A sensor element (2) is installed between the movable block (5) and the inner top wall of the movable cavity (301); the sensor element (2) is electrically connected to a microprocessor via a signal processing circuit.

2. A pressure sensor according to claim 1, characterized in that: A limit support ring (403) is fixed on the top of each cylindrical clearance cavity (401), and an electromagnetic lock (6) is installed between the bottom surface of the limit support ring (403) and the top surface of the supporting circular plate (402); each electromagnetic lock (6) is electrically connected to a microprocessor.

3. A pressure sensor according to claim 2, characterized in that: The electromagnetic lock (6) comprises an electromagnetic lock module A (601) and an electromagnetic lock module B (602), wherein the electromagnetic lock module A (601) and the electromagnetic lock module B (602) are electrically connected to a microprocessor respectively, and the electromagnetic lock module A (601) is mounted between the bottom surface of the limiting support ring (403) and the top surface of the supporting circular plate (402); a through hole (404) is provided on the limiting support ring (403); a fixed-distance sliding rod (405) is slidably fitted on the inner wall of the through hole (404), and limiting circular plates (406) are fixed at both ends of the limiting sliding rod (405); and the electromagnetic lock module B (602) is mounted between the bottom surface of the limiting circular plate (406) located at the bottom of the limiting circular plate (406) and the top surface of the supporting circular plate (402).

4. A pressure sensor according to claim 1, characterized in that: The movable block (5) comprises a movable ring (501) and a movable cylinder (502); a limit support ring (503) is fixed at the opening at the top of the movable cylinder (502); a limit slide groove (504) is provided on the inner wall of the movable ring (501); the inner wall of the movable ring (501) is slidably matched with the peripheral side surface of the movable cylinder (502); the inner wall of the limit slide groove (504) is slidably matched with the peripheral side surface of the limit support ring (503); the top of the spring element located at the center of the movable cavity (301) is fixedly connected with the bottom of the movable cylinder (502); The sensor element (2) comprises a sensor element A (201) and a sensor element B (202); the sensor element A (201) is mounted between the movable block (5) and the inner top wall of the movable cavity (301); the sensor element B (202) is mounted between the inner top wall of the limiting slide groove (504) and the top surface of the limiting support ring (503); the sensor element A (201) and the sensor element B (202) are respectively electrically connected to a microprocessor.

5. A pressure sensor according to claim 4, characterized in that: A supporting circular plate (505) is fixed on the top surface of the movable ring (501); a micro electric telescopic rod (506) is fixed between the supporting circular plate (505) and the movable cylinder (502); and the micro electric telescopic rod (506) is electrically connected to a microprocessor.

6. A pressure sensor according to claim 1, characterized in that: The spring element comprises a spring member A (101), a spring member B (102), a spring member C (103) and a spring member D (104); the magnitude relationship of the elastic coefficients k of the spring member A (101), the spring member B (102), the spring member C (103) and the spring member D (104) is k A >k B >k C >k D .

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