Radio frequency tag, production method, use method, commodity and commodity outer package

Abstract

The invention provides a radio frequency tag, a production method, a use method, a commodity and a commodity outer package, and the radio frequency tag comprises a radio frequency antenna and a chip, and the chip is electrically connected with a bonding pad part on the radio frequency antenna; the radio frequency antenna comprises a base material, a fragile coating, a composite adhesive layer and an etching circuit, the etching circuit part comprises the bonding pad part, the fragile coating is connected to the local position of the surface of the base material, and the etching circuit is connected with the base material and the fragile coating at the same time through the composite adhesive layer; and the fragile coating does not coincide with the projection of the bonding pad part on the etching circuit. The etching label has the conduction point and chip fastness of a traditional etching label, and meanwhile the anti-transfer and fragile functions of the label can be achieved.

Description

Technical Field

[0001] The present application belongs to the field of anti-counterfeiting technology and relates to a method for destroying a radio frequency identification tag structure, and specifically relates to a radio frequency tag and a production method, a use method, a product, and a product outer packaging. Background Art

[0002] Radio Frequency Identification (RFID) technology has a unique global code on its chip, stable information, extremely high cost of imitation, can store a large amount of information, and can be easily read and written. It allows consumers to easily identify the identity of goods through the special identification device provided by the merchant, and can be used to achieve full tracking of goods in circulation. It is often used in the anti-counterfeiting of liquid product packaging such as bottle caps.

[0003] Traditional fragile RFID tags are usually coated on the RFID substrate, and then the RFID antenna is processed. After the processed RFID tag is attached to the product through an adhesive, if the criminals want to peel it off the product, the coating will separate from the substrate, and the RFID structure attached to the coating will separate from the substrate, leaving the RFID structure on the surface of the product, achieving the purpose of preventing transfer.

[0004] However, this structure requires a low peeling force between the coating and the substrate, which needs to be smaller than the bonding force between the adhesive used and the product surface. The adhesive usually used is a pressure-sensitive adhesive, which itself has a low bonding force with the product surface, which requires that the peeling force between the coating and the substrate cannot be too high.

[0005] This results in a very low peeling force between the aluminum foil at the RF chip pad and the substrate. When this position is affected by external force, the aluminum foil at the pad is prone to breakage, resulting in a short circuit between the RF chip and the RF antenna, causing the entire RF tag to fail unexpectedly.

[0006] At the same time, double-sided electronic tags include high-frequency tags and some ultra-high-frequency tags with double-sided structures. Due to their design principles, high-frequency tags must adopt a double-sided structure. The front and back sides of the double-sided electronic tags are electrically connected through conduction points (also called bridge points). Industry tests have shown that if the peeling force between the coating and the substrate is less than 2N / 25mm, the conduction point structure is more likely to form a short circuit, thereby affecting the product yield and weather resistance.

[0007] It can be seen that how to make the coating and the substrate easy to peel off while avoiding the pad position or even the conductive point structure from accidentally breaking due to too low peeling force is a dilemma currently faced. Summary of the invention

[0008] In view of the defects in the prior art, the purpose of the present invention is to provide a radio frequency tag and a production method, a use method, a product, and a product outer packaging.

[0009] A radio frequency tag provided by the present invention includes: a radio frequency antenna and a chip, and the chip is electrically connected to a pad portion on the radio frequency antenna;

[0010] The radio frequency antenna includes a substrate, a fragile coating, a composite adhesive layer, and an etched circuit. The pad portion is included on a part of the etched circuit. The fragile coating is connected to a partial position on the surface of the substrate, and the etched circuit is connected to both the substrate and the fragile coating through the composite adhesive layer;

[0011] The fragile coating does not project and coincide with the pad portion on the etched circuit;

[0012] If the radio frequency tag is a double-sided structure, the radio frequency tag further includes a conduction point, and the fragile coating does not project and coincide with the pad portion and the conduction point.

[0013] Further, the etched circuit is manifested as a coil portion, a bridge portion, and a pad portion on a high-frequency tag. The coil portion is located on one side of the substrate, and the bridge portion is located on the other side of the substrate;

[0014] The pad portion is electrically connected to the coil portion, or the pad portion is electrically connected to the bridge portion;

[0015] The coil portion and the bridge portion are electrically connected through a conduction point.

[0016] Further, the etched circuit is manifested as a matching loop, an antenna arm, and a pad portion on a ultra-high frequency tag. The matching loop is electrically connected to the antenna arm and the pad portion respectively.

[0017] Further, the fragile coating is one layer or more than two layers;

[0018] And / or, the single-layer thickness of the fragile coating is 0.1 to 50 microns;

[0019] And / or, when the fragile coating is more than two layers, the materials of each fragile coating are the same or different.

[0020] Further, the 90-degree peel force between the fragile coating and the substrate is between 0.01 N / 25 mm and 2 N / 25 mm, or the 90-degree peel force between the fragile coating and the composite adhesive layer is between 0.01 N / 25 mm and 2 N / 25 mm.

[0021] Further, if the radio frequency tag is a single-sided structure, the horizontal distance between the fragile coating and the pad portion is greater than 0.5 mm;

[0022] If the radio frequency tag is a double-sided structure, the horizontal distance between the fragile coating and the pad portion and the conduction point is greater than 0.5 mm.

[0023] Further, if the RF tag is of a single-sided structure, the frangible coating is located on the side of the substrate where the chip is located;

[0024] The frangible coating is connected to the substrate, and the part of the etched circuit except the pad part is wholly or partly connected to the frangible coating and / or the substrate through a composite adhesive layer, and the pad part is connected to the substrate through a composite adhesive layer.

[0025] Further, if the RF tag is of a double-sided structure, the frangible coating is located on the side of the substrate where the chip is located, or on the other side of the substrate where the chip is located, or on both sides of the substrate simultaneously;

[0026] The part of the etched circuit except the conduction points and the pad part is wholly or partly connected to the frangible coating through a composite adhesive layer, and the remaining part is connected to the substrate through a composite adhesive layer.

[0027] Further, the material of the substrate includes film materials;

[0028] And / or, the material of the frangible coating is a coatable resin material;

[0029] And / or, the composite adhesive layer is a one-component or multi-component curable glue;

[0030] And / or, the material of the etched circuit is aluminum foil or copper foil;

[0031] And / or, the etched circuit is prepared by an etching process.

[0032] A method for manufacturing an RF tag according to one of the present inventions includes:

[0033] Step 1: Typesetting and plate-making for the frangible coating and the RF antenna;

[0034] When typesetting the frangible coating, leave blanks at the corresponding positions of the conduction points and the pad part, and at the same time reserve a positioning line A1 and / or a positioning mark B1 at the edge of the substrate. The blank size is larger than the corresponding conduction point size and pad part size;

[0035] When plate-making the RF antenna, reserve a positioning line A2 and / or a positioning mark B2 corresponding to the position of the positioning line A1 and / or the positioning mark B1. The pad part and the conduction point position of the RF antenna correspond one by one to the blank position of the frangible coating;

[0036] Step 2: Substrate processing;

[0037] According to the designed thickness, use a printing plate to position-print the frangible coating material on one or both sides of the substrate, and the printing method corresponds to the plate-making method to obtain the frangible coating.

[0038] Step 3: Processing of the RF antenna, including:

[0039] Step 3.1: Lamination of aluminum foil / copper foil;

[0040] Apply the composite adhesive and perform the lamination operation on the aluminum foil / copper foil and the substrate with a fragile coating. If there are etched circuits on both sides of the substrate, the lamination operation is performed on both sides of the substrate. The position where the aluminum foil / copper foil covers the RF antenna does not cover the positioning line A1 and the positioning mark B1;

[0041] Step 3.2: Curing;

[0042] Cure the laminated material according to the usage conditions of the corresponding composite adhesive to completely cure the composite adhesive and obtain a composite adhesive layer;

[0043] Step 3.3: Printing of the RF antenna;

[0044] Print the photosensitive moisture-removable film ink on the aluminum foil / copper foil side of the cured material and perform the curing treatment. The curing conditions are in accordance with the usage requirements of the photosensitive moisture-removable film ink used, and the printing method matches the printing plate used;

[0045] Step 3.4: Etching of the RF antenna;

[0046] Etch the material with the RF antenna printed thereon to obtain the RF antenna;

[0047] Step 4: Chip encapsulation;

[0048] The RF antenna and a matching chip are encapsulated to obtain an RF tag.

[0049] Furthermore, in Step 1:

[0050] The typesetting width of the RF antenna is less than the typesetting width of the fragile coating, and there is a blank space at the positions of the positioning line A1 and the positioning mark B1;

[0051] And / or, the positioning line A2 and the positioning mark B2 are on the side of the positioning line A1 and the positioning mark B1 closer to the RF antenna;

[0052] And / or, the positioning lines A1, A2 and the positioning marks B1, B2 can be of any shape and size;

[0053] And / or, the plate making of the printing plates for the fragile coating and the RF antenna includes one or more of gravure plates, offset plates, flexographic plates, and screen printing plates.

[0054] Furthermore, Step 2 further includes:

[0055] Corona-treat the substrate before printing the material with the fragile coating to obtain a 90-degree peel strength between the fragile coating and the substrate within a preset range;

[0056] And / or, according to the processing dimension requirements, the material with the frangible coating is cut, and the positioning line A1 and the positioning mark B1 are retained during cutting, and the cutting width is L1;

[0057] And / or, if the frangible coating material is printed on both sides of the substrate, a double-sided flipping printing process or a secondary overprinting process is used, including a solidification process for the used frangible coating material, and the solidification process corresponds to the material of the frangible coating.

[0058] Further, in step 3.1:

[0059] Aluminum foil / copper foil with corresponding thickness and width is selected according to the radio frequency antenna design drawing and the layout drawing. The width of the aluminum foil / copper foil is greater than the radio frequency antenna layout width, and the width of the aluminum foil / copper foil is less than the cutting width L1;

[0060] And / or, the composite glue is coated on one side of the aluminum foil / copper foil, and after the solvent is evaporated, it is compounded with the side of the substrate with the frangible coating, or it is coated on the side of the substrate with the frangible coating, and after the solvent is evaporated, it is compounded with the aluminum foil / copper foil.

[0061] Further, in step 3.2:

[0062] The relative position relationship between the blank area of the frangible coating and the pad part and the conduction point on the etched circuit is determined by the positional relationship between the positioning line A2 and / or the positioning mark B2 on the radio frequency antenna printing plate and the positioning line A1 and / or the positioning mark B1;

[0063] By adjusting the above relative position relationship, the blank area of the frangible coating is made to overlap with the pad part and the conduction point position in the printed pattern;

[0064] The horizontal distance between A1 and A2 and the horizontal distance between B1 and B2 are L2, and the vertical distance between B1 and B2 is L3. Among them, the error of L2 is less than or equal to ±2 mm, and the error of L3 is less than or equal to ±2 mm;

[0065] If there are etched circuits on both sides of the substrate, repeat step 3.2 for double-sided overprinting.

[0066] Further, the step 3.4 includes:

[0067] Step 3.4.1: Pickling and etching;

[0068] The material printed with the etched circuit pattern is washed in the pickling tank with acid solution to wash away the aluminum foil / copper foil not covered by the photosensitive and moisture-removable film ink;

[0069] After pickling, wash with water to remove the residual acid solution, and dry and wind up;

[0070] The acid solution is an inorganic acid aqueous solution;

[0071] Step 3.4.2: Alkaline washing for deinking;

[0072] The material for removing the redundant aluminum foil / copper foil is washed in an alkaline washing tank with an acid-base solution to remove the photosensitive and dehumidifiable film ink covering the etched circuit;

[0073] After alkaline washing, the residual alkaline solution is removed by water washing, and then dried and wound up;

[0074] The alkaline solution is an inorganic base aqueous solution.

[0075] Furthermore, Step 3 further includes:

[0076] Step 3.5: Conductivity treatment;

[0077] If the etched circuit is of a double-sided structure, a conductivity operation is performed at the conductivity point;

[0078] Step 3.6: Slitting;

[0079] The etched RF antenna is cut to reach the designed size.

[0080] According to the usage method of an RF tag provided by the present invention, an adhesive is coated on one side of the RF tag, and then it is pasted on the surface of a commodity or the outer packaging of the commodity.

[0081] According to a commodity or the outer packaging of a commodity provided by the present invention, it includes the RF tag described above.

[0082] Compared with the prior art, the present invention has the following beneficial effects:

[0083] By providing a fragile coating in the RF tag and ensuring that the position of the pad portion of the chip on the substrate does not overlap with the projection of the fragile coating, the obtained RF tag has the fastness of a traditional etched tag chip, and at the same time can realize the functions of anti-transfer and fragility of the tag, solves the problem that the mechanical strength of the pad position of the existing fragile RF tag is poor, improves the yield rate in the production process of the fragile RF tag, and reduces the accidental damage rate in the use process of the existing fragile tag.

[0084] Similarly, the conductivity structure can also be designed in the same way as the pad portion of the chip, so that the conductivity structure can also have higher mechanical strength, improves the yield rate in the production process of the fragile RF tag, and reduces the accidental damage rate in the use process of the existing fragile tag. Description of the Drawings

[0085] By reading the following detailed description of the non-restrictive embodiments with reference to the accompanying drawings, other features, purposes and advantages of the present invention will become more obvious:

[0086] Figure 1 Cross-sectional view of a radio frequency tag of one embodiment;

[0087] Figure 2 Cross-sectional view of a radio frequency tag of another embodiment;

[0088] Figure 3 Top view of a radio frequency tag of one embodiment;

[0089] Figure 4 Top view of a radio frequency tag of another embodiment;

[0090] Figure 5 Layout diagram of the frangible coating;

[0091] Figure 6 Layout diagram of the radio frequency antenna;

[0092] Figure 7 Schematic diagram of the covered aluminum foil;

[0093] Figure 8 Flow chart of the method for preparing the radio frequency tag.

[0094] Reference numerals:

[0095] Detailed implementation manners

[0096] The present invention will be described in detail below in conjunction with specific embodiments. The following embodiments will help those skilled in the art to further understand the present invention, but do not limit the present invention in any form. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several changes and improvements can still be made. These all belong to the protection scope of the present invention.

[0097] The present application is achieved through the following technical solutions:

[0098] Such as Figure 1 And Figure 2As shown in the figure, the RF tag includes an RF antenna 1 and a chip 2, and the chip 2 is electrically connected to the pad portion 1031 on the RF antenna 1. The RF antenna 1 includes a substrate 101, a fragile coating 102, a composite adhesive layer 104, and an etched circuit 103. The etched circuit 103 has a pad portion 1031 for encapsulating the RF chip. If the RF tag is a double-sided structure, it also includes a conduction point 3. The fragile coating 102 and the pad portion 1031 on the etched circuit 103 do not project and overlap on the substrate 101. If it is a double-sided structure, the fragile coating 102, the pad portion 1031, and the conduction point 3 do not project and overlap on the substrate 101. The non-projection overlap in this application means that there is no overlapping part between the positive projections of the fragile coating 102 and the pad portion 1031 on the substrate 101. Similarly, there is no overlapping part between the positive projections of the fragile coating 102 and the conduction point 3 on the substrate 101.

[0099] The etched circuit 103 refers to the metal loop that conducts electricity on the RF tag.

[0100] As Figure 4 shown, if the etched circuit 103 is on a high-frequency tag, it is manifested as a coil portion 1035, a bridge portion 1034, and a pad portion 1031. For the sake of clear display, the bridge structure 1034 that was originally not visible because it was on the other side was perspectively processed so that it is shown in Figure 4 it.

[0101] As Figure 4 shown, if it is on a UHF tag, it is manifested as a matching loop 1033, an antenna arm 1032, and a pad portion 1031. The matching loop 1033 and the antenna arm 1032 can be on the same side of the substrate 101 or can be arranged on both sides of the substrate 101 and are electrically connected through the conduction point 3. Similarly, as long as it is ensured that the electrical connection position of the matching loop 1033 and the chip (i.e., the pad portion 1031) and the position of the conduction point 3 do not project and overlap with the fragile coating 102.

[0102] The pad portion 1031 is also called a bonding point and a chip filling point, and it is the position where the chip 2 is connected to the RF tag. The bridge portion 1034 is a structure on the high-frequency RF tag that is located on the back of the coil portion 1035 and serves to connect the coils, and is also called a bridging surface, a bridge-over surface, and a connecting surface. The coil portion 1035 and the bridge portion 1034 are electrically connected through the conduction point 3. The pad portion 1031 can be on the same side as the coil portion 1035 and be electrically connected, or can be on the same side as the bridge portion 1034 and be electrically connected. The conduction point 3 is an electrical connection structure formed through a conduction process and is common knowledge in the field of RF tags, and will not be elaborated in this application.

[0103] The fragile coating 102 can be at least one layer or multiple layers. The thickness of a single layer of the fragile coating is 0.1 - 50 microns. Preferably, the thickness of the composite adhesive layer 104 is greater than that of the fragile coating 102. When the fragile coating 102 has more than one layer, the materials of each fragile coating can be the same or different. The fragile coating 102 is made of a suitable resin material according to the substrate, such that the 90-degree peel strength between the fragile coating 102 and the substrate 101 is between 0.01 N / 25 mm and 2 N / 25 mm. Or the 90-degree peel strength between the fragile coating 102 and the composite adhesive layer 104 is between 0.01 N / 25 mm and 2 N / 25 mm. The measurement method refers to Method 4 in "GB / T 2792-2014 Test Method for Peel Strength of Adhesive Tapes" - Test Method for 180° Peel Strength of Adhesive Tapes and Anti-sticking Materials and Appendix B Test Method for 90° Peel Strength of Adhesive Tapes. The horizontal distance between the fragile coating 102 and the pad portion 1031 and the conduction point 3 is greater than 0.5 MM.

[0104] Figure 1 As shown, if the radio frequency tag is a ultra-high frequency tag, the fragile coating 102 is connected to the substrate 101. According to the fragility requirement, all or part of the etched circuit 103 except the pad portion 1031 is connected to the fragile coating 102 and / or the substrate 101 through the composite adhesive layer 104. The pad portion 1031 is connected to the substrate 101 through the composite adhesive layer 104, and the positions of the fragile coating 102 and the pad portion 1031 do not overlap in projection on the substrate 101.

[0105] As Figure 2 shown, if the radio frequency antenna is a high frequency antenna. The fragile coating 102 can be located on one side of the coil portion 1035 of the etched circuit 103 of the substrate 101, or on one side of the bridge portion 1034 of the etched circuit 103 of the substrate 101, or can be located on both sides of the substrate 101 simultaneously. The fragile coating 102 is connected to the substrate 101. The fragile coating 102 can be at least one layer or multiple layers. The conduction point 3 of the etched circuit 103 is connected to the substrate 101 through the composite adhesive layer 104. The pad portion 1031 of the etched circuit 103 is connected to the substrate 101 through the composite adhesive layer 104. All or part of the etched circuit 103 except the conduction point 3 and the pad portion 1031 is connected to the fragile coating 102 through the composite adhesive layer 104; the remaining part is connected to the substrate 101 through the composite adhesive layer 104.

[0106] As Figure 3 and Figure 4 shown, the positions of the fragile coating 102 and the pad portion 1031 do not overlap in projection on the substrate 101. The positions of the fragile coating 102 and the conduction point 3 do not overlap in projection on the substrate 101.

[0107] The substrate 101 is a commonly used substrate for RF antennas, including but not limited to film materials such as PET and PI.

[0108] The material of the frangible coating 102 is a commonly used coatable resin material, including but not limited to one or a mixture of several of acrylated epoxy resin, polyacrylic acid, polyvinyl alcohol, polyacrylate, polyvinyl butyral, unsaturated polyester, polyurethane, polythiol / polyene resin, polymethacrylate, fluororesin, and silicone resin. The frangible coating can also be composed of a combination of two or more coatings formed by the above coatings.

[0109] The composite adhesive layer 104 is a one-component or multi-component curable glue, generally using polyurethane-based composite glue.

[0110] The material of the etched circuit 103 is aluminum foil or copper foil.

[0111] When the RF tag provided by the present invention is used, an adhesive is coated on one side of the RF tag and then pasted on the surface of the commodity or the outer package of the commodity. When it is desired to peel off the RF tag, the frangible coating 102 is damaged, so it is difficult to reuse it.

[0112] Example 1

[0113] As Figure 1 shown, the RF tag has a single-sided structure, and an example of the single-sided structure RF tag is the Figure 3 ultra-high frequency tag shown.

[0114] The RF tag includes a substrate 101. A frangible coating 102 is provided on a partial side of the substrate 101, and the remaining part of this side is provided with a composite adhesive layer 104, and the composite adhesive layer 104 also covers the frangible coating 102. An etched circuit 103 is provided outside the composite adhesive layer 104, and a pad portion 1031 for connecting a chip is provided on the etched circuit 103.

[0115] Among them, the frangible coating 102 and the pad portion 1031 do not overlap in projection on the substrate 101, that is, the orthographic projections of the frangible coating 102 and the pad portion 1031 on the substrate 101 do not overlap. The purpose is to prevent the connection between the pad portion 1031 and the chip from being poor and open circuit due to accidental breakage of the frangible coating 102. When an illegal person attempts to tear off the RF tag, due to the existence of the frangible coating 102, the frangible coating 102 is easily damaged during the tearing process, making it difficult to reuse.

[0116] Example 2

[0117] As Figure 2 shown, the RF tag has a double-sided structure, and an example of the double-sided structure RF tag is the Figure 4The high-frequency tag shown. The radio frequency tag includes a substrate 101, with a frangible coating 102 provided on one or both sides of the substrate 101. Composite adhesive layers 104 are covered on both sides. An etched circuit 103 is provided on the outer side of the composite adhesive layer 104. The etched circuit 103 has pad portions 1031 for connecting chips. At the same time, the etched circuits 103 on both sides are electrically connected through conduction points 3 passing through the composite adhesive layer 104 and the substrate 101.

[0118] Among them, the frangible coating 102 does not overlap in projection with the pad portions 1031 and the conduction points 3 on the substrate 101, that is, the orthographic projections of the frangible coating 102 and the pad portions 1031 and the conduction points 3 on the substrate 101 have no overlapping parts. The purpose is to prevent poor connection between the pad portions 1031 and the chips and open circuits caused by accidental breakage of the frangible coating 102, and to prevent damage to the conduction points 3 and open circuits. When an illegal person attempts to tear off the radio frequency tag, due to the existence of the frangible coating 102, the frangible coating 102 is easily damaged during the tearing process, making it difficult to reuse.

[0119] Example 3

[0120] The radio frequency tag has a double-sided structure, and the radio frequency tag with a double-sided structure can also be an ultra-high frequency tag.

[0121] An example of an ultra-high frequency tag with a double-sided structure can be: The ultra-high frequency tag with a double-sided structure includes a substrate 101, and a frangible coating 102 is provided on one or both sides of the substrate 101. A matching loop 1033 and an antenna arm 1032 are respectively located on both sides of the substrate 101, and the two are electrically connected through a conduction point 3. The pad portion 1031 can be located on one side of the matching loop 1033 and is directly electrically connected to the matching loop 1033.

[0122] Another example of an ultra-high frequency tag with a double-sided structure can be: The ultra-high frequency tag with a double-sided structure includes a substrate 101, and a frangible coating 102 is provided on one or both sides of the substrate 101. The matching loop 1033 and the antenna arm 1032 are located on the same side of the substrate 101, while the pad portion 1031 is located on the other side of the substrate 101 and is electrically connected to the matching loop 1033 through a conduction point 3.

[0123] Of course, there are many other design methods for the ultra-high frequency tag with a double-sided structure, which will not be elaborated in this embodiment. However, regardless of the design method, the fragile coating 102 does not project and overlap with the pad portion 1031 and the conduction point 3 in the up-and-down positional relationship, that is, the orthographic projection of the fragile coating 102 on the substrate 101 does not overlap with the pad portion 1031 and the conduction point 3. The purpose is to prevent poor connection between the pad portion 1031 and the chip and open circuit caused by accidental breakage of the fragile coating 102, and to avoid open circuit caused by damage to the conduction point 3. When an illegal element attempts to tear off the radio frequency tag, due to the existence of the fragile coating 102, the fragile coating 102 is easily damaged during the tearing process, making it difficult to reuse.

[0124] As Figure 8 shown, to implement the above structure, the present invention provides the following preparation process:

[0125] 1. Plate making.

[0126] According to the design, typesetting is carried out for the fragile coating and the radio frequency antenna.

[0127] As Figure 5 shown, typesetting and plate making are carried out for the fragile coating. When typesetting the fragile coating, blanks are left at the corresponding positions of the conduction points and pads as required. Preferably, the blank size is larger than the corresponding conduction point size and pad size. The position of the fragile coating corresponds one by one to the subsequent antenna position. At the same time, positioning lines A1 and / or positioning marks B1 are reserved at the edge of the substrate.

[0128] As Figure 6 shown, typesetting and plate making are carried out for the radio frequency antenna. When making the plate, positioning lines A2 and / or positioning marks B2 corresponding to the positions of the positioning lines A1 and / or positioning marks are reserved. The pad positions and conduction point positions of the radio frequency antenna correspond one by one to the blank positions of the fragile coating. The typesetting width of the radio frequency antenna is smaller than the typesetting width of the fragile coating, and blanks are left at the positions of the positioning lines A1 and the positioning marks B1. The positioning lines A2 and the positioning marks B2 are on the side of the positioning lines A1 and the positioning marks B1 close to the antenna direction.

[0129] The shapes and sizes of the positioning lines A1A2 and the positioning marks B1B2 can be selected arbitrarily.

[0130] The printing plates for making the fragile coating and the radio frequency antenna can be selected from one or more of gravure plates, offset plates, flexographic plates, and screen printing plates.

[0131] Preferably, the same plate-making method is selected for the fragile coating and the etching circuit of the radio frequency antenna.

[0132] 2. Substrate and fragile coating processing technology:

[0133] 2.1 Substrate pretreatment.

[0134] According to the actual situation, corona treatment of the substrate is selectively carried out to ensure the ideal peel strength between the finally obtained fragile coating and the substrate (as is well known in the industry, a high corona value can increase the peel strength, and a low corona value can reduce the peel strength).

[0135] 2.2 Printing of fragile coating.

[0136] According to the designed thickness, use a printing plate to position and print on one or both sides of the substrate. The fragile printing method corresponds to the plate-making method. If the fragile coating material needs to be printed on both sides of the substrate simultaneously, a double-sided flipping printing process or a secondary overprinting process can be used. The printing process includes a curing process for the used fragile coating material. For the material of the fragile coating, the curing process can correspondingly select methods such as thermal curing, thermal drying, electron beam curing, and UV curing.

[0137] 2.3 Cutting.

[0138] According to the processing size requirements, cut the printed material, and the positioning line A1 and the positioning mark B1 should be retained during cutting. The cutting width is L1.

[0139] 3. Radio frequency antenna processing technology:

[0140] 3.1 Aluminum foil / copper foil lamination.

[0141] As Figure 7 shown, select aluminum foil / copper foil with appropriate thickness and width according to the radio frequency antenna design drawing and the layout drawing. The width of the aluminum foil / copper foil should be greater than the antenna layout width. The width of the aluminum foil / copper foil should be less than the cutting width L1 in 2.3. Use a dry laminator to coat the composite adhesive and perform a lamination operation on the aluminum foil / copper foil and the substrate with the fragile coating. The composite adhesive can be coated on one side of the aluminum foil / copper foil, and after evaporating the solvent, it is laminated with the side of the substrate with the fragile coating; or it can be coated on the side of the substrate with the fragile coating, and after evaporating the solvent, it is laminated with the aluminum foil / copper foil. If etched circuits are required on both sides of the substrate, lamination operations need to be performed on both sides of the substrate. The aluminum foil / copper foil should cover the positions required for the radio frequency antenna. The aluminum foil / copper foil should not cover the positioning line A1 and the positioning mark B1.

[0142] 3.2 Curing.

[0143] Cure the laminated material according to the usage conditions of the corresponding composite adhesive to make the composite adhesive completely cured.

[0144] 3.3 Radio frequency antenna printing.

[0145] Print photosynthetic moisture-removable film ink on the aluminum foil / copper foil side of the cured material and perform a curing treatment. The curing conditions are carried out according to the usage requirements of the photosynthetic moisture-removable film ink used. The printing method matches the printing plate used.

[0146] The photosynthetic dehumidifying film ink is a kind of photocurable ink that is water and acid resistant in the industry but soluble in alkaline aqueous solutions.

[0147] When printing the RF antenna, due to the aluminizing process in 3.1, the fragile coating has been covered by aluminum foil / copper foil, but the positioning line A1 and / or the positioning mark B1 are still visible. The relative position relationship between the positioning line A2 and / or the positioning mark B2 on the RF antenna printing plate and the positioning line A1 and / or the positioning mark B1 can be used to determine the relative position relationship between the blank area of the fragile coating and the pads and conduction points on the etched circuit. For example Figure 6 . By adjusting the above relative position relationship, the blank area of the fragile coating is made to coincide with the positions of the pads and conduction points in the printed pattern.

[0148] The horizontal distance between A1 and A2 and the horizontal distance between B1 and B2 are L2, and the vertical distance between B1 and B2 is L3. For example Figure 6 .

[0149] The error of L2 is less than or equal to ±2 mm, and the error of L3 is less than or equal to ±2 mm.

[0150] If there are etched circuits on both sides of the RF antenna substrate, repeat the above operation and perform double-sided overprinting according to the conventional process.

[0151] 3.4 RF antenna etching;

[0152] 3.4.1 Pickling etching;

[0153] The material printed with the etched circuit pattern is washed in an acid pickling tank with acid solution to remove the aluminum foil / copper foil not covered by the photosynthetic dehumidifying film ink. The specific process is well-known in the industry.

[0154] After pickling, wash with water to remove the residual acid solution, and then dry and wind up.

[0155] The acid solution is an inorganic acid aqueous solution, and hydrochloric acid is commonly used in the industry.

[0156] 3.4.2 Alkaline washing and ink removal;

[0157] The material with the excess aluminum foil / copper foil removed is washed in an alkaline washing tank with alkaline solution to remove the photosynthetic dehumidifying film ink covering the etched circuit. The specific process is well-known in the industry.

[0158] After alkaline washing, wash with water to remove the residual alkaline solution, and then dry and wind up.

[0159] The alkaline solution is an inorganic alkaline aqueous solution, and sodium hydroxide aqueous solution is commonly used in the industry.

[0160] 3.5 Conduction treatment;

[0161] If the etched circuit is a double-sided structure, conduction operations need to be performed at the conduction points, and the specific operations are carried out according to the commonly used methods in the industry.

[0162] 3.6 Slitting;

[0163] Cut the etched RF antenna according to the design drawing to reach the design size.

[0164] 4. Chip packaging;

[0165] The RF tag can be obtained by using the chip and encapsulation glue that match the RF antenna produced according to the above structure and method and performing reverse encapsulation through conventional processes. The specific encapsulation parameters vary depending on the chip model and the encapsulation glue model.

[0166] The self-adhesive label made of the RF tag produced according to the above structure and method has the conduction points and chip fastness of the traditional etched label, and at the same time can achieve the functions of label anti-transfer and fragility, solves the problem that the mechanical strength of the conduction points and pad positions of the existing fragile RF tags is poor, improves the yield rate in the production process of the fragile RF tags, and reduces the accidental damage rate during the use of the existing fragile labels.

[0167] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0168] The specific embodiments of the present invention have been described above. It should be understood that the present invention is not limited to the above specific embodiments, and those skilled in the art can make various changes or modifications within the scope of the claims, which do not affect the essence of the present invention. Without conflict, the embodiments and features in the embodiments of the present application can be combined with each other arbitrarily.

Claims

1. A radio frequency tag, characterized in that: include: A radio frequency antenna (1) and a chip (2), wherein the chip (2) is electrically connected to a pad portion (1031) on the radio frequency antenna (1); The radio frequency antenna (1) comprises a substrate (101), a fragile coating (102), a composite adhesive layer (104) and an etched circuit (103); the etched circuit portion (103) contains the pad portion (1031); the fragile coating (102) is connected to a local position on the surface of the substrate (101); and the etched circuit (103) is connected to the substrate (101) and the fragile coating (102) simultaneously through the composite adhesive layer (104); The fragile coating (102) and the pad portion (1031) on the etched circuit (103) do not overlap in projection; If the radio frequency tag is a double-sided structure, the radio frequency tag further comprises a conducting point (3), and the fragile coating (102) does not overlap with the pad portion (1031) and the conducting point (3).

2. The radio frequency tag according to claim 1, characterized in that: The etching circuit (103) is represented on the high frequency tag as a coil portion (1035), a bridge portion (1034) and a pad portion (1031), wherein the coil portion (1035) is located on one side of the substrate (101), and the bridge portion (1034) is located on the other side of the substrate (101); The pad portion (1031) is electrically connected to the coil portion (1035), or the pad portion (1031) is electrically connected to the bridge portion (1034); The coil part (1035) and the bridge part (1034) are electrically connected via a conduction point (3).

3. The radio frequency tag according to claim 1, characterized in that: The etching circuit (103) is manifested as a matching ring (1033), an antenna arm (1032) and a pad portion (1031) on the UHF tag, and the matching ring (1033) is electrically connected to the antenna arm (1032) and the pad portion (1031) respectively.

4. The radio frequency tag according to claim 1, characterized in that: The fragile coating (102) is one layer or more than two layers; and / or, the single layer thickness of the fragile coating (102) is 0.1 to 50 micrometers; And / or, when the fragile coating (102) comprises two or more layers, the materials of each fragile coating (102) are the same or different.

5. The radio frequency tag according to claim 1, characterized in that: The 90-degree peeling force between the fragile coating (102) and the substrate (101) is between 0.01N / 25mm and 2N / 25mm, or the 90-degree peeling force between the fragile coating (102) and the composite adhesive layer (104) is between 0.01N / 25mm and 2N / 25mm.

6. The radio frequency tag according to claim 2 or 3, characterized in that: If the radio frequency tag is a single-sided structure, the horizontal distance between the fragile coating (102) and the pad portion (1031) is greater than 0.5 mm; If the radio frequency tag is a double-sided structure, the horizontal distance between the fragile coating (102) and the pad portion (1031) and the conducting point (3) is greater than 0.5 mm.

7. The radio frequency tag according to claim 3, characterized in that: If the radio frequency tag is a single-sided structure, the fragile coating (102) is located on the side of the substrate (101) where the chip (2) is located; The etching circuit (103) is connected in whole or in part to the fragile coating (102) and / or the substrate (101) through the composite adhesive layer (104) except for the pad portion (1031), and the pad portion (1031) is connected to the substrate (101) through the composite adhesive layer (104).

8. The radio frequency tag according to claim 2 or 3, characterized in that: If the radio frequency tag is a double-sided structure, the fragile coating (102) is located on the side of the substrate (101) where the chip (2) is located, or on the other side of the substrate (101) where the chip (2) is located, or on both sides of the substrate (101); The etching circuit (103) is connected in whole or in part to the fragile coating (102) via the composite adhesive layer (104) except for the conduction point (3) and the pad portion (1031), and the remaining portion is connected to the substrate (101) via the composite adhesive layer (104).

9. The radio frequency tag according to claim 1, characterized in that: The material of the substrate (101) includes a film material; and / or, the fragile coating (102) is made of a coatable resin material; And / or, the composite adhesive layer (104) is a single-component or multi-component curable adhesive; And / or, the etching circuit (103) is made of aluminum foil or copper foil; And / or, the etching circuit (103) is prepared by an etching process.

10. A method for preparing a radio frequency tag according to any one of claims 1 to 9, characterized in that: include: Step 1: Typesetting and platemaking the fragile coating (102) and the radio frequency antenna (1); When the fragile coating (102) is laid out, blank spaces are left at corresponding positions of the conduction point (3) and the pad portion (1031), and a positioning line A1 and / or a positioning mark B1 are reserved at the edge of the substrate (101), wherein the size of the blank space is larger than the corresponding size of the conduction point (3) and the pad portion (1031); When the radio frequency antenna (1) is plated, a positioning line A2 and / or a positioning mark B2 corresponding to the position of the positioning line A1 and / or the positioning mark B1 are reserved, and the position of the pad portion (1031) and the conducting point (3) of the radio frequency antenna (1) corresponds one-to-one to the blank position of the fragile coating (102); Step 2: substrate processing; According to the designed thickness, a fragile coating material is printed on one or both sides of the substrate (101) using a printing plate, and the printing method corresponds to the plate making method to obtain a fragile coating (102); Step 3: RF antenna processing, including: Step 3.1: aluminum foil / copper foil composite; Applying composite glue, performing a composite operation on the aluminum foil (4) / copper foil and the substrate (101) containing the fragile coating (102), if both sides of the substrate (101) have etched circuits (103), then the composite operation is performed on both sides of the substrate (101), and the aluminum foil (4) / copper foil covers the position of the radio frequency antenna (1), but does not cover the positioning line A1 and the positioning mark B1; Step 3.2: Ripening; The composited materials are subjected to a curing treatment according to the use conditions of the corresponding composite adhesive, so that the composite adhesive is completely cured to obtain a composite adhesive layer (104); Step 3.3: RF antenna printing; Print photosynthetic degradable wet film ink on the aluminum foil / copper foil surface of the cured material using a radio frequency antenna plate, and perform a curing treatment. The curing conditions are in accordance with the use requirements of the photosynthetic degradable wet film ink used, and the printing method matches the printing plate used; Step 3.4: RF antenna etching; Etching the material on which the radio frequency antenna has been printed to obtain a radio frequency antenna (1); Step 4: Chip packaging; The radio frequency antenna (1) is packaged with a chip (2) that matches the radio frequency antenna (1) to obtain a radio frequency tag.

11. The method for preparing a radio frequency tag according to claim 10, characterized in that: In step 1: The layout width of the radio frequency antenna (1) is smaller than the layout width of the fragile coating (102), and blank spaces are left at the positions of the positioning line A1 and the positioning mark B1; and / or, the positioning line A2 and the positioning mark B2 are on a side of the positioning line A1 and the positioning mark B1 that is close to the radio frequency antenna (1); and / or, the positioning lines A1, A2 and positioning marks B1, B2 are of any shape and size; And / or, the printing plate making of the fragile coating (102) and the radio frequency antenna (1) includes: one or more of a gravure printing plate, an offset printing plate, a flexographic printing plate, and a silk-screen printing plate.

12. The method for preparing a radio frequency tag according to claim 10, characterized in that: The step 2 also includes: Before printing the fragile coating material, the substrate (101) is subjected to corona treatment to obtain a 90-degree peeling force between the fragile coating (102) and the substrate (101) within a preset range; and / or, according to the processing size requirements, cutting the material with the fragile coating (102), the cutting retaining the positioning line A1 and the positioning mark B1, and the cutting width is L1; And / or, if the fragile coating material is printed on both sides of the substrate (101) at the same time, a double-sided flip printing process or a secondary overprinting printing process is used, which includes a curing process for the fragile coating material used, and the curing process corresponds to the material of the fragile coating.

13. The method for preparing a radio frequency tag according to claim 12, characterized in that: In step 3.1: According to the RF antenna design drawing and layout drawing, select aluminum foil / copper foil of corresponding thickness and width, wherein the width of the aluminum foil / copper foil is greater than the layout width of the RF antenna, and the width of the aluminum foil / copper foil is less than the cutting width L1; And / or, the composite adhesive is coated on one side of the aluminum foil / copper foil and the solvent is evaporated before being composited with the side of the substrate with the fragile coating, or the composite adhesive is coated on the side of the substrate with the fragile coating and the solvent is evaporated before being composited with the aluminum foil / copper foil.

14. The method for preparing a radio frequency tag according to claim 12, characterized in that: In step 3.2: The relative position relationship between the blank space of the fragile coating and the pad portion (1031) and the conduction point (3) on the etched circuit is determined by the position relationship between the positioning line A2 and / or the positioning mark B2 on the radio frequency antenna printing plate and the positioning line A1 and / or the positioning mark B1; By adjusting the above relative position relationship, the fragile coating blank is located at the position where the pad portion (1031) and the conducting point (3) in the printed pattern overlap; The horizontal distance between A1 and A2 and the horizontal distance between B1 and B2 are L2, and the vertical distance between B1 and B2 are L3, wherein the error of L2 is less than or equal to ±2 mm, and the error of L3 is less than or equal to ±2 mm; If there are etched circuits on both sides of the substrate (101), repeat step 3.2 to perform double-sided overprinting.

15. The method for preparing a radio frequency tag according to claim 10, characterized in that: The step 3.4 comprises: Step 3.4.1: pickling and etching; The printed circuit pattern material is passed through an acid washing tank and uses acid to wash away the aluminum foil / copper foil not covered by the photosynthetic degradable wet film ink; After pickling, wash away the residual acid with water, dry and roll; The acid solution is an aqueous solution of an inorganic acid; Step 3.4.2: Alkaline washing and deinking; The material with excess aluminum foil / copper foil washed away is washed in an alkaline washing tank using acid and alkali solution to remove the photosynthetic degradable wet film ink covering the etched circuit; After alkali washing, the residual alkali solution is washed away with water, and the product is dried and rolled; The alkali solution is an inorganic alkali aqueous solution.

16. The method for preparing a radio frequency tag according to claim 10, characterized in that: The step 3 also includes: Step 3.5: conduction processing; If the etching circuit (103) is a double-sided structure, a conduction operation is performed at the conduction point (3); Step 3.6: Cutting; The etched radio frequency antenna (1) is cut to reach the designed size.

17. A method for using the radio frequency tag according to any one of claims 1 to 9, characterized in that: An adhesive is coated on one side of the radio frequency tag, and then the tag is attached to the surface of the commodity or the outer packaging of the commodity.

18. A commodity or commodity outer packaging, characterized in that: The invention comprises the radio frequency tag as described in any one of claims 1 to 9.

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