A laser cutting device for silicon steel sheets

Abstract

The application relates to the technical field of laser cutting, in particular to a silicon steel sheet laser cutting device which comprises a rack, a cutting mechanism, a supporting mechanism and a collecting mechanism. The cutting mechanism is arranged on the rack; the supporting mechanism comprises an adjusting assembly and multiple supporting assemblies; the adjusting assembly is arranged on the rack; the multiple supporting assemblies are movably connected to the rack respectively and connected to the adjusting assembly respectively; the supporting assemblies are located below the cutting mechanism; the supporting assemblies are used for supporting plates; and the adjusting assembly is used for adjusting the spacing between the multiple supporting assemblies; and the collecting mechanism is arranged below the multiple supporting assemblies. The application has the effect of improving production efficiency.

Description

Technical Field

[0001] This application relates to the field of laser cutting technology, and in particular to a laser cutting device for silicon steel sheets. Background Technology

[0002] Currently, silicon steel sheets, as an important soft magnetic material, are widely used in motors, transformers, and other fields. Their processing quality directly affects the energy efficiency and reliability of electromagnetic devices. For the processing of silicon steel sheets, the industry mainly uses stamping technology, employing customized cemented carbide or high-speed steel dies in conjunction with a press to shape the material, supplemented by CNC wire cutting technology to achieve complex pattern processing. However, the stamping process has significant limitations: long die development cycles and high costs, making it difficult to adapt to small-batch, multi-order needs. Furthermore, repeated stamping causes die wear, leading to burr buildup and dimensional tolerance deviations (typically exceeding ±0.1mm), severely affecting the assembly accuracy of laminated iron cores. Therefore, laser cutting technology is used for processing some silicon steel sheets. Laser cutting is a processing method that uses a high-energy-density laser beam to irradiate the workpiece, melting or vaporizing the irradiated area to achieve cutting. It offers advantages such as high processing accuracy, good cut quality, high flexibility, and high automation.

[0003] Regarding the aforementioned technologies: waste material from laser cutting tends to accumulate on the cutting table, requiring post-processing methods such as mechanical scraping to clean it up. This increases the number of production steps and consequently reduces production efficiency. Summary of the Invention

[0004] To improve production efficiency, this application provides a laser cutting device for silicon steel sheets.

[0005] This application provides a laser cutting device for silicon steel sheets, which adopts the following technical solution: A laser cutting device for silicon steel sheets, comprising: frame; A cutting mechanism is mounted on the frame; The support mechanism includes an adjustment component and multiple support components. The adjustment component is disposed on the frame, and the multiple support components are movably connected to the frame and respectively connected to the adjustment component. The support components are located below the cutting mechanism and are used to support the plate. The adjustment component is used to adjust the spacing between the multiple support components. A collection mechanism is disposed below the plurality of said support components.

[0006] By adopting the above technical solution, efficient and precise cutting of special sheet materials is achieved. Specifically, the frame provides a stable support foundation for the entire device, ensuring stability when all components work together. The cutting mechanism, mounted on the frame, can precisely execute laser cutting actions. The adjustment components can flexibly adjust the spacing between multiple support components according to different sheet material specifications to adapt to diverse cutting needs. Furthermore, the support components continuously and stably support the uncut portion during the cutting process, preventing deformation of the sheet material due to its own weight and ensuring cutting accuracy. In addition, waste material cut from the sheet material falls into the collection mechanism through the gaps between adjacent support components, keeping the worktable clean without additional cleaning steps. This improves overall production efficiency and ensures production continuity and environmental friendliness.

[0007] Optionally, the support assembly includes a support plate and an adsorption element embedded in the support plate. The support plate is slidably disposed on the frame and located below the cutting mechanism. The support plate is connected to the adjustment assembly, which is used to adjust the spacing between the plurality of support plates. The adsorption element is used to attract the sheet material.

[0008] By adopting the above technical solution, the adjustment component can flexibly adjust the spacing between multiple support plates to adapt to the cutting needs of plates of different sizes. Furthermore, the adsorption components embedded in the support plates can firmly hold the plate in place during the cutting process, ensuring its stability and effectively preventing displacement caused by vibration or external forces, thus improving cutting accuracy and stability. At the same time, this design allows the support structure to be dynamically adjusted according to actual needs, ensuring good support in the cutting area while avoiding waste accumulation, thereby improving overall production efficiency and processing quality.

[0009] Optionally, the adjustment assembly includes a lifting drive and an adjustment plate. The lifting drive is mounted on the frame, and the adjustment plate is slidably mounted on the frame and connected to the lifting drive. The adjustment plate has guide grooves, the number of which is equal to the number of support plates. The guide grooves are arranged radially with their lower ends converging and their upper ends diverging, and the groove positions are equidistant on the same cross-section. The support plate has a slider that slides and is inserted into the guide groove.

[0010] By adopting the above technical solution, multiple guide grooves are arranged radially, converging at the lower end and diverging at the upper end. When the lifting drive component moves the adjusting plate up and down, the support plate is acted upon by the inner wall of the guide groove via a slider, allowing the spacing between the multiple support plates to automatically adjust. This design not only effectively supports plates of different widths but also allows for flexible changes in support position as needed, ensuring the stability of the cutting area. Simultaneously, precise control of the support plate spacing helps reduce material vibration and deformation during cutting, further improving cutting accuracy and quality. Furthermore, the automated adjustment function simplifies the operation process, improves production efficiency, and meets the needs of diverse sheet material processing.

[0011] Optionally, a roller is provided at the end of the support plate away from the adjustment component, and a sliding groove is provided on the frame, with multiple rollers respectively disposed in the sliding groove.

[0012] By adopting the above technical solution, rollers are installed at the end of the support plate away from the adjustment components, and grooves are opened on the frame, with multiple rollers respectively positioned within the grooves. This design effectively reduces the frictional resistance when the support plate moves, ensuring smooth and stable operation when adjusting the spacing. Simultaneously, the cooperation between the rollers and the grooves allows for precise control of the support plate's position, improving the accuracy of the spacing adjustment. Furthermore, this structure extends the equipment's service life, reduces maintenance frequency, and thus enhances the overall efficiency and stability of the cutting device.

[0013] Optionally, a receiving groove is provided on the frame, and a limiting component is provided in the receiving groove. The limiting component is located on the side of the support plate away from the adjusting component. When the adsorption component is working, the limiting component limits the multiple support plates.

[0014] By adopting the above technical solution, when the adsorption component is working, the limiting component can effectively restrict the position of multiple support plates, ensuring their stability during the adsorption of the material. This design not only improves the positioning accuracy of the support plates on the material but also prevents the support plates from shifting due to external vibrations or other interference factors. Furthermore, since the limiting component only functions when the adsorption component is working, it does not affect the adjustment function of the support plates in other operating states, thus achieving an organic combination of flexible adjustment and precise fixation, improving the overall reliability and processing quality of the cutting device.

[0015] Optionally, the limiting component includes a limiting plate and an elastic element. One end of the limiting plate is slidably disposed in the receiving groove, and the other end of the limiting plate extends above the plurality of supporting plates and is provided with anti-slip texture. The elastic element is disposed in the receiving groove and connected to the limiting plate. The elastic element is used to push the limiting plate to move away from the supporting plates, and the adsorption element can attract the limiting plate.

[0016] By adopting the above technical solution, when it is necessary to adjust the spacing between multiple support plates, the adsorption component does not work, and the limiting plate can remain away from the support plates under the action of the elastic component. This helps to reduce the possibility of the limiting plate interfering with the movement of the support plates. Furthermore, when the adsorption component is activated, it can adsorb the sheet material and simultaneously overcome the elastic force of the elastic component to pull the limiting plate downwards, thereby ensuring that the limiting plate is tightly fitted to the surfaces of multiple support plates. This improves the stability of the support plates and effectively prevents displacement of the support plates due to external vibrations or other interference factors, ensuring a smooth and reliable cutting process to a certain extent.

[0017] Optionally, it includes a buffer mechanism, a transfer mechanism, and a pusher mechanism. The buffer mechanism, the transfer mechanism, and the pusher mechanism are respectively disposed on the frame. The pusher mechanism is disposed close to the support component. The transfer mechanism is used to transfer the plate between the buffer mechanism and the pusher mechanism. The pusher mechanism is used to push the plate to be processed onto the support component.

[0018] By adopting the above technical solution, the buffer mechanism can temporarily store the sheet metal to be processed, ensuring the continuity and stability of the production process. The transfer mechanism is responsible for efficiently transferring the sheet metal between the buffer mechanism and the pushing mechanism, realizing automated material flow and reducing errors and time waste caused by manual intervention. The pushing mechanism precisely pushes the sheet metal to be processed onto the support components, ensuring the accuracy of sheet metal positioning and providing a good foundation for subsequent laser cutting. The synergistic effect of this series of mechanisms not only improves the automation level of the entire device, but also effectively improves production efficiency and product quality, reduces production costs, and reduces safety hazards and defect rates that may be caused by manual operation.

[0019] Optionally, the pushing mechanism includes a pushing platform, a pushing drive, and a pushing plate. The pushing platform is disposed on the frame and close to the support assembly. A storage area is provided at one end of the pushing platform close to the support assembly. The pushing drive is disposed on the pushing platform. The pushing plate is slidably disposed on the pushing platform and connected to the pushing drive. The pushing drive is used to drive the pushing plate to move closer to or away from the storage area.

[0020] By adopting the above technical solution, the transfer mechanism can transfer the plates to be processed stored on the buffer mechanism to the storage area for temporary storage, and remove the processed plates from the support assembly. At this time, the pusher drive can move the plates to be processed, so as to accurately push the plates in the storage area onto the support assembly for fixing and cutting. This design effectively reduces the downtime of the cutting mechanism, thereby improving production efficiency.

[0021] Optionally, an electromagnet is embedded in the pusher plate.

[0022] By adopting the above technical solution, an electromagnet is embedded in the pusher plate, which can generate an attractive force on the sheet material during the pushing process, ensuring the stability of the sheet material during the pushing process and avoiding positional displacement caused by vibration or external force. In addition, this design eliminates the need for additional physical clamping devices, simplifies the equipment structure, reduces the failure rate, and helps to achieve an efficient and stable sheet material processing flow.

[0023] Optionally, the frame is provided with a vision element for detecting the position of the plate on the support mechanism.

[0024] By adopting the above technical solution and installing vision elements on the frame, the position of the sheet metal on the support mechanism can be accurately detected. This ensures that the sheet metal is accurately identified and positioned before cutting, avoiding processing errors caused by positional deviations. Therefore, this not only improves the accuracy of sheet metal cutting but also enhances the stability and reliability of the entire production process, further guaranteeing high-quality product output. Simultaneously, this precise position detection helps optimize subsequent cutting path planning, improving overall production efficiency.

[0025] In summary, this application includes at least one of the following beneficial technical effects: 1. Through the cooperation of the cutting mechanism, adjusting components, supporting components and collecting mechanism, the spacing between multiple supporting components can be flexibly adjusted according to different specifications of plates to adapt to diverse cutting needs. At the same time, the waste material cut off from the plate can fall into the collecting mechanism from the gap between adjacent supporting components, keeping the workbench clean without additional cleaning steps, thereby improving overall production efficiency. 2. Through the cooperation of the support plate and the adsorption component, the plate can be stably adsorbed during the cutting process, so as to effectively prevent the plate displacement caused by vibration or external force, thereby improving the cutting accuracy and stability. 3. Through the cooperation of the limiting plate and the elastic element, when the adsorption component is working, the limiting plate can fit against the surface of the support plate to limit the support plate, so that the support plate can stably support the material. At the same time, when the adsorption component is not working, the elastic element can push the limiting plate to keep it away from the support plate, so as to adjust the position of the support plate. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the overall structure of a silicon steel sheet laser cutting device according to Embodiment 1 of this application.

[0027] Figure 2 This is a schematic diagram of the structure of the adjustment component in Embodiment 1 of this application.

[0028] Figure 3This is a schematic diagram of the support mechanism in Embodiment 1 of this application.

[0029] Figure 4 This is a side view of a silicon steel sheet laser cutting device according to Embodiment 1 of this application.

[0030] Figure 5 It is along Figure 4 A cross-sectional view along the BB line.

[0031] Figure 6 yes Figure 1 A magnified view of a portion of point A in the middle.

[0032] Figure 7 This is a schematic diagram of the overall structure of a silicon steel sheet laser cutting device according to Embodiment 2 of this application.

[0033] Explanation of reference numerals in the attached figures: 1. Frame; 11. Slide; 12. Receiving slot; 13. Limiting assembly; 131. Limiting plate; 1311. Anti-slip texture; 132. Elastic element; 14. Vision element; 2. Cutting mechanism; 21. Three-axis drive assembly; 22. Laser cutting head; 3. Support mechanism; 31. Adjustment assembly; 311. Lifting drive component; 312. Adjustment plate; 3121. Guide slot; 32. Support assembly; 321. Support plate; 3211. Slider; 3212. Roller; 322. Adsorption component; 4. Collection mechanism; 5. Sheet material; 6. Buffer mechanism; 7. Transfer mechanism; 8. Pushing mechanism; 81. Pushing platform; 811. Storage area; 82. Pushing drive component; 83. Pushing plate; 831. Electromagnet. Detailed Implementation

[0034] The following is in conjunction with the appendix Figure 1-7 This application will be described in further detail.

[0035] This application discloses a laser cutting device for silicon steel sheets.

[0036] It should be noted that, in the description of this invention, the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0037] Example 1 Reference Figure 1A laser cutting device for silicon steel sheets includes a frame 1, a cutting mechanism 2, a support mechanism 3, and a collection mechanism 4. The cutting mechanism 2, support mechanism 3, and collection mechanism 4 are respectively mounted on the frame 1, with the collection mechanism 4 located below the support mechanism 3. The support mechanism 3 supports the sheet metal 5, facilitating the cutting mechanism 2 to cut the sheet metal 5. Waste material cut from the sheet metal 5 falls into the collection mechanism 4, thus eliminating the need for additional cleaning steps to keep the worktable clean and improving overall production efficiency.

[0038] The cutting mechanism 2 includes a three-axis drive assembly 21 and a laser cutting head 22 mounted on the three-axis drive assembly 21. The three-axis drive assembly 21 is mounted on the frame 1 and can drive the laser cutting head 22 to move, so that the laser cutting head 22 can accurately cut the plate 5.

[0039] In this embodiment, a laser cutting head 22 is used to cut the sheet metal 5. Its high energy density laser beam can rapidly melt or vaporize the irradiated area of ​​the silicon steel sheet, thereby forming a high-quality cut. Compared with stamping, it can achieve high processing accuracy, good cut quality, strong flexibility, fast cutting speed, high degree of automation, and is more environmentally friendly.

[0040] It should be noted that the specific structure and working principle of the three-axis drive assembly 21 and the laser cutting head 22 are conventional techniques for those skilled in the art. Therefore, they will not be described in detail in the embodiments of this application.

[0041] Reference Figure 1 The support mechanism 3 includes an adjustment component 31 and multiple support components 32. The adjustment component 31 is mounted on the frame 1, and each support component 32 is movably connected to the frame 1 and connected to the adjustment component 31. The support components 32 are located directly below the cutting mechanism 2 and are responsible for supporting the plate material 5 being cut. The adjustment component 31 is used to dynamically adjust the spacing between the multiple support components 32.

[0042] The adjustment assembly 31 includes a lifting drive component 311 and an adjustment plate 312. The lifting drive component 311 is mounted on the frame 1, and the adjustment plate 312 is slidably disposed on the frame 1 and fixedly connected to the lifting drive component 311. In this embodiment, the lifting drive component 311 is a cylinder, which facilitates the use of the lifting drive component 311 to drive the adjustment plate 312 to move up and down. In other embodiments, the lifting drive component 311 may also be designed as a motor lead screw structure.

[0043] Reference Figure 2 and Figure 3The surface of the adjusting plate 312 is provided with multiple guide grooves 3121. The number of guide grooves 3121 is consistent with the number of support components 32. The multiple guide grooves 3121 are arranged radially with the lower end converging and the upper end diverging. The multiple guide grooves 3121 are equidistant from each other on the same cross-section.

[0044] Reference Figure 1 and Figure 3 The support assembly 32 includes a support plate 321 and an adsorption member 322 embedded in the support plate 321. The support plate 321 is located below the laser cutting head 22, and multiple support plates 321 are parallel to each other. A slider 3211 is fixedly connected to one end of the support plate 321, and a roller 3212 is rotatably connected to the other end of the support plate 321. A slider 3211 is slidably inserted into a guide groove 3121. In this embodiment, the slider 3211 has a circular cross-section, allowing it to slide smoothly within the guide groove 3121.

[0045] The frame 1 has a sliding groove 11 along the arrangement direction of multiple support plates 321, and multiple rollers 3212 are respectively inserted into the sliding groove 11. The rollers 3212 can slide in the sliding groove 11, which facilitates the stable support of the support plate 321 by using the rollers 3212 and the sliders 3211, and effectively reduces the frictional resistance when the support plate 321 moves, ensuring that the support plate 321 runs smoothly and stably when adjusting the spacing.

[0046] In other embodiments, the roller 3212 can be replaced with the slider 3211 to ensure stable support for the support plate 321.

[0047] When it is necessary to adjust the spacing between multiple support plates 321, the lifting drive 311 works to drive the adjustment plate 312 to rise and fall, so that the inner wall of the guide groove 3121 can apply force to the slider 3211 to drive the support plate 321 to move, thereby facilitating the adjustment of the spacing between multiple support plates 321 to achieve effective support for plates 5 of different widths, and can also flexibly change the support position as needed to ensure the stability of the cutting area.

[0048] Reference Figure 1 and Figure 3 In this embodiment, the adsorption element 322 is an electromagnet. When the sheet 5 is placed on multiple support plates 321, the adsorption element 322 is energized to adsorb the sheet 5, making it less likely for the sheet 5 to shift during the cutting process, thereby improving cutting accuracy and stability. After the sheet 5 is cut, the adsorption element 322 is de-energized to facilitate the removal of the sheet 5 from the support plates 321. It should be noted that in this embodiment, the sheet 5 refers to the silicon steel sheet to be processed.

[0049] In other embodiments, the adsorption element 322 can also be configured as a negative pressure fan, and a negative pressure air outlet is provided on the support plate 321 to use the negative pressure generated by the negative pressure fan to adsorb the plate 5.

[0050] Reference Figure 4 and Figure 5 A receiving groove 12 is provided on the frame 1, and a limiting component 13 is provided in the receiving groove 12. When the adsorption component 322 is working, the limiting component 13 limits the multiple support plates 321.

[0051] Reference Figure 5 and Figure 6 The limiting component 13 includes a limiting plate 131 and an elastic element 132. One end of the limiting plate 131 is slidably disposed in the receiving groove 12, and the other end of the limiting plate 131 extends above the plurality of support plates 321. The end of the limiting plate 131 extending above the support plates 321 is provided with anti-slip texture 1311.

[0052] In this embodiment, the limiting plate 131 is T-shaped, and the receiving groove 12 is adapted to the design of the limiting plate 131, so that the limiting plate 131 is not easy to detach from the receiving groove 12. The limiting plate 131 is made of metal material so that the adsorption member 322 can attract the limiting plate 131.

[0053] The elastic element 132 is disposed in the receiving groove 12 and connected to the limiting plate 131. In this embodiment, the elastic element 132 is a spring, which facilitates the use of the elastic element 132 to push the limiting plate 131 to move away from the support plate 321.

[0054] When it is necessary to adjust the spacing between multiple support plates 321, the adsorption member 322 does not work, and the limiting plate 131 can be kept away from the support plate 321 under the action of the elastic member 132, which helps to reduce the possibility of interference caused by the movement of the limiting plate 131 to the support plate 321.

[0055] When the adsorption component 322 is activated, while adsorbing the plate 5, it can also overcome the elastic force of the elastic component 132 to attract the limiting plate 131 to move downward, so that the anti-slip texture 1311 on the limiting plate 131 is tightly attached to the surface of multiple support plates 321, thereby limiting the movement of multiple support plates 321, improving the stability of the support plates 321, and effectively preventing the displacement of the support plates 321 caused by external vibration or other interference factors, thus ensuring the smooth and reliable operation of the entire cutting process to a certain extent.

[0056] Reference Figure 1In this embodiment, the collection mechanism 4 includes a collection box with an opening at the top and located below multiple support plates 321. This allows waste material cut from the plate 5 to fall into the collection box through the gaps between adjacent support plates 321, keeping the work surface clean without additional cleaning steps and thus improving overall production efficiency. In other embodiments, a suction fan may also be installed inside the collection mechanism 4 to better guide waste material into the collection box.

[0057] Reference Figure 1 A vision element 14 is mounted on the frame 1, positioned close to the support plate 321. This facilitates precise detection of the position of the sheet material 5 on the support plate 321, ensuring accurate identification and positioning of the sheet material 5 before cutting and avoiding processing errors caused by positional deviations. In this embodiment, the vision element 14 is a camera.

[0058] The implementation principle of the silicon steel sheet laser cutting device in this application embodiment is as follows: When it is necessary to cut the silicon steel sheet, the lifting drive component 311 is first activated. The lifting drive component 311 drives the adjusting plate 312 to rise and fall, and the adjusting plate 312 drives multiple support plates 321 to move, so as to adjust the spacing between the multiple support plates 321 to a suitable level. Then, the silicon steel sheet is placed on the multiple support plates 321, and the adsorption component 322 is energized. The adsorption component 322 simultaneously adsorbs the silicon steel sheet and the limiting plate 131, so that the anti-slip texture 1311 on the limiting plate 131 is in contact with the multiple support plates 321. At this time, the multiple support plates 321 can stably support the silicon steel sheet. Next, the three-axis drive assembly 21 drives the laser cutting head 22 to move to the designated area, so as to complete the cutting of the silicon steel sheet using the laser cutting head 22. Finally, the adsorption component 322 is de-energized so that the processed silicon steel sheet can be removed from the support plate 321. At the same time, the cut waste will fall into the collection box under gravity, without the need for additional cleaning steps.

[0059] Example 2 Reference Figure 7 The difference between this embodiment and embodiment 1 is that the frame 1 is equipped with a buffer mechanism 6, a transfer mechanism 7 and a pusher mechanism 8.

[0060] The buffer mechanism 6 is located on the side of the three-axis drive assembly 21 away from the support plate 321. The buffer mechanism 6 includes at least two trays, and the multiple trays are used to store silicon steel sheets to be processed and silicon steel sheets that have been processed.

[0061] The transfer mechanism 7 is located between the buffer mechanism 6 and the three-axis drive assembly 21. In this embodiment, the transfer mechanism 7 is a robotic arm, which facilitates the transfer of silicon steel sheets.

[0062] It should be noted that the specific structure and working principle of the buffer mechanism 6 and the transfer mechanism 7 are conventional techniques for those skilled in the art. Therefore, they will not be described in detail in the embodiments of this application.

[0063] Reference Figure 7 The pushing mechanism 8 includes a pushing platform 81, a pushing drive component 82, and a pushing plate 83. The pushing platform 81 is mounted on the frame 1 and is located near the support plate 321, and the pushing platform 81 is located on the side of the three-axis drive assembly 21 away from the transfer mechanism 7.

[0064] The pusher table 81 is provided with a storage area 811 at one end near the support plate 321. The storage area 811 is used to store silicon steel sheets to be processed.

[0065] The pusher drive 82 is mounted on the pusher table 81, and the pusher plate 83 is slidably disposed on the pusher table 81 and fixedly connected to the pusher drive 82. In this embodiment, the pusher drive 82 is a cylinder, which facilitates the use of the pusher drive 82 to drive the pusher plate 83 to move closer to or away from the storage area 811.

[0066] In this embodiment, an electromagnet 831 is embedded in the pusher plate 83, which can generate an adsorption force on the silicon steel sheet during the pushing process, ensuring the stability of the silicon steel sheet during the pushing process and avoiding positional displacement caused by vibration or external force. In addition, this design eliminates the need for additional physical clamping devices, simplifies the equipment structure, reduces the failure rate, and helps to achieve an efficient and stable silicon steel sheet processing flow.

[0067] Reference Figure 7 When silicon steel sheets need to be cut, the pusher drive 82 drives the pusher plate 83 to move. The pusher plate 83 pushes the silicon steel sheet to be processed onto multiple support plates 321 and then returns to its original position. At this time, the transfer mechanism 7 transfers the new silicon steel sheet to be processed from the buffer mechanism 6 to the storage area 811. After the silicon steel sheet is processed, the transfer mechanism 7 transfers the silicon steel sheet from the support plate 321 to the buffer mechanism 6 for storage. This design effectively reduces the downtime of the entire device, thereby improving production efficiency.

[0068] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A laser cutting device for silicon steel sheets, characterized in that, include: Rack (1); A cutting mechanism (2) is mounted on the frame (1); The support mechanism (3) includes an adjustment component (31) and multiple support components (32). The adjustment component (31) is disposed on the frame (1). The multiple support components (32) are movably connected to the frame (1) and connected to the adjustment component (31). The support components (32) are located below the cutting mechanism (2). The support components (32) are used to support the plate (5). The adjustment component (31) is used to adjust the spacing between the multiple support components (32). A collection mechanism (4) is disposed below the plurality of said support components (32); The support assembly (32) includes a support plate (321) and an adsorption member (322) embedded in the support plate (321). The support plate (321) is slidably disposed on the frame (1) and located below the cutting mechanism (2). The support plate (321) is connected to the adjustment assembly (31). The adjustment assembly (31) is used to adjust the spacing between the multiple support plates (321). The adsorption member (322) is an electromagnet and is used to attract the plate (5). The frame (1) has a receiving groove (12) and a limiting component (13) is provided in the receiving groove (12). The limiting component (13) is located on the side of the support plate (321) away from the adjustment component (31). When the adsorption member (322) is working, the limiting component (13) limits the multiple support plates (321). The limiting component (13) includes a limiting plate (131) and an elastic element (132). One end of the limiting plate (131) is slidably disposed in the receiving groove (12), and the other end of the limiting plate (131) extends above the plurality of support plates (321) and is provided with anti-slip texture (1311). The elastic element (132) is disposed in the receiving groove (12) and connected to the limiting plate (131). The elastic element (132) is used to push the limiting plate (131) to move away from the support plate (321). The adsorption element (322) can attract the limiting plate (131).

2. The silicon steel sheet laser cutting device according to claim 1, characterized in that: The adjustment assembly (31) includes a lifting drive (311) and an adjustment plate (312). The lifting drive (311) is mounted on the frame (1). The adjustment plate (312) is slidably mounted on the frame (1) and connected to the lifting drive (311). The adjustment plate (312) has guide grooves (3121). The number of guide grooves (3121) is equal to the number of support plates (321). The multiple guide grooves (3121) are arranged radially with the lower end converging and the upper end diverging. The multiple guide grooves (3121) are equidistant from each other on the same cross-section. The support plate (321) is provided with a slider (3211). The slider (3211) is slidably inserted into the guide groove (3121).

3. The silicon steel sheet laser cutting device according to claim 1, characterized in that: A roller (3212) is provided at one end of the support plate (321) away from the adjustment component (31), and a slide groove (11) is provided on the frame (1), with multiple rollers (3212) respectively disposed in the slide groove (11).

4. The silicon steel sheet laser cutting device according to claim 1, characterized in that: The system includes a buffer mechanism (6), a transfer mechanism (7), and a pusher mechanism (8). The buffer mechanism (6), the transfer mechanism (7), and the pusher mechanism (8) are respectively disposed on the frame (1). The pusher mechanism (8) is disposed close to the support component (32). The transfer mechanism (7) is used to transfer the plate (5) between the buffer mechanism (6) and the pusher mechanism (8). The pusher mechanism (8) is used to push the plate (5) to be processed onto the support component (32).

5. The silicon steel sheet laser cutting device according to claim 4, characterized in that: The pushing mechanism (8) includes a pushing platform (81), a pushing drive (82), and a pushing plate (83). The pushing platform (81) is disposed on the frame (1) and close to the support assembly (32). A storage area (811) is provided at one end of the pushing platform (81) close to the support assembly (32). The pushing drive (82) is disposed on the pushing platform (81). The pushing plate (83) is slidably disposed on the pushing platform (81) and connected to the pushing drive (82). The pushing drive (82) is used to drive the pushing plate (83) to move closer to or away from the storage area (811).

6. The silicon steel sheet laser cutting device according to claim 5, characterized in that: The pusher plate (83) is equipped with an electromagnet (831).

7. The silicon steel sheet laser cutting device according to claim 1, characterized in that: A vision element (14) is provided on the frame (1), and the vision element (14) is used to detect the position of the plate (5) on the support mechanism (3).

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