Polishing material removal control method based on pixel statistics

Abstract

The invention provides a grinding and polishing material removal control method based on pixel statistics. The method comprises the steps that structural parameters of a grinding tool and the initial surface shape of a workpiece to be ground and polished are obtained; establishing pixel characterization data of the grinding tool; if the initial surface shape of the to-be-polished workpiece is a convex surface shape, processing parameters are preset, a first eccentric distance is used as a preset eccentric distance, then the removal distribution trend of a polishing material is predicted based on the preset processing parameters in combination with grinding tool pixel characterization data, and the removal distribution trend of the polishing material is predicted; grinding and polishing are completed according to the machining parameters meeting the expected material removal trend; if the initial surface shape of the to-be-polished workpiece is a concave surface shape, processing parameters are preset, a second eccentric distance is used as a preset eccentric distance, the preset processing parameters and pixel characterization data of a grinding tool are combined, and a polishing material removal distribution prediction model is constructed through pixels; and finally, finishing grinding and polishing according to the processing parameters which simultaneously meet the preset condition of pixel distribution of the processing surface and the set threshold value of the variable coefficient.

Description

Technical Field

[0001] The present invention relates to the technical field of material grinding and polishing, and in particular to a grinding and polishing material removal control method based on pixel statistics. Background Art

[0002] Plane polishing technology is an indispensable part of modern industrial production. It is not only suitable for various metal materials, such as stainless steel, tungsten steel, aluminum, alloys, etc., but also for non-metallic materials, such as silicon carbide, stone, etc. This makes plane polishing technology widely used in electronic information, aerospace, national defense and military industry, energy, transportation and materials engineering. It meets the diverse needs of different industries for surface treatment of workpieces to be polished, and is an important means to improve the precision and surface quality of workpieces to be polished.

[0003] For thin-walled parts that are difficult to use on a grinder or cannot withstand high mechanical pressure, flat polishing can obtain a high-quality surface. However, the material removal distribution trend of the machined surface rarely takes into account the groove type of the flat grooved abrasive. In the empty groove of the flat grooved abrasive, there is a lack of mechanical action between the workpiece to be polished and the flat grooved abrasive, and the material removal effect is almost non-existent. Therefore, the groove design of the flat grooved abrasive will also directly affect the material removal distribution trend of the machined surface. The existing technology statistically analyzes the trajectory point density of different flat grooved abrasive groove types. However, it is difficult for the trajectory points to accurately characterize the flat groove abrasive groove profile, and no targeted processing parameter adjustment is performed for workpieces to be polished with different surface shapes combined with the flat grooved abrasive groove type, resulting in poor flat polishing effects.

[0004] Therefore, a polishing material removal control method that accurately characterizes the desired material removal distribution is needed. Summary of the invention

[0005] In view of this, the present invention provides a grinding and polishing material removal control method based on pixel statistics, which constructs a grinding and polishing model in advance by pre-setting processing parameters to simulate the grinding and polishing process, and selects quantifiable evaluation indicators to evaluate the simulated grinding and polishing results; the preset processing parameters are adjusted according to the evaluation results to obtain processing parameters with higher accuracy, thereby improving the accuracy of grinding and polishing.

[0006] To this end, the present invention provides the following technical solutions:

[0007] A grinding and polishing material removal control method based on pixel statistics, comprising:

[0008] Obtaining the structural parameters of the flat grooved abrasive tool, as well as the initial surface shape and structural parameters of the workpiece to be ground and polished;

[0009] The pixels at the drainage groove of the planar grooved abrasive tool are set to zero, the protrusions on the planar grooved abrasive tool are characterized by pixels, and the pixel characterization data of the planar grooved abrasive tool is established in combination with the structural parameters of the planar grooved abrasive tool;

[0010] Select the corresponding polishing strategy according to the initial surface shape and structural parameters of the workpiece to be polished, including:

[0011] When the initial surface shape of the workpiece to be polished is a convex surface, the processing parameters are preset, and the first eccentricity is selected as the preset eccentricity;

[0012] Based on the preset processing parameters and the pixel characterization data of the flat grooved abrasive tool, a material removal distribution trend prediction model of the convex surface workpiece to be polished is constructed with pixels, and the pixel distribution of the machined surface is obtained to simulate the material removal distribution trend of the surface of the workpiece to be polished under the current processing parameters;

[0013] Selecting processing parameters that meet the preset conditions of pixel distribution on the processing surface to complete grinding and polishing;

[0014] When the initial surface shape of the workpiece to be polished is a concave shape, the processing parameters are preset, and the second eccentricity is selected as the preset eccentricity;

[0015] Based on the preset processing parameters and the pixel characterization data of the flat grooved abrasive tool, a material removal distribution trend prediction model of the concave workpiece to be ground and polished is constructed with pixels, and the pixel distribution of the machined surface is obtained to simulate the material removal distribution trend of the surface of the workpiece to be ground and polished under the current processing parameters;

[0016] The machining parameters that meet both the preset conditions of the pixel distribution of the machining surface and the preset threshold of the coefficient of variation are selected to complete the grinding and polishing.

[0017] Furthermore, the first preset eccentricity is greater than the difference between the radius of the flat grooved grinding tool and the radius of the workpiece to be ground and polished.

[0018] Furthermore, the second preset eccentricity is greater than or equal to the radius of the workpiece to be ground and polished, and the second preset eccentricity is less than or equal to the difference between the radius of the flat grooved grinding tool and the radius of the workpiece to be ground and polished.

[0019] Furthermore, the processing parameters include the revolution speed of the flat grooved grinding tool, the rotation speed of the workpiece to be ground and polished, and the position of the center of the workpiece to be ground and polished relative to the center of the flat grooved grinding tool.

[0020] Furthermore, the method of constructing a material removal distribution trend prediction model of a convex workpiece to be ground and polished based on pixels based on preset processing parameters combined with pixel characterization data of a flat grooved abrasive tool, and obtaining pixel distribution of a processing surface to simulate the material removal distribution trend of the workpiece to be ground and polished under current processing parameters includes:

[0021] According to the protrusion shape of the flat grooved abrasive tool, the characteristic points of the protrusion of the flat grooved abrasive tool are selected;

[0022] Combined with the preset processing parameters, the motion equation of the raised feature points of the plane grooved abrasive tool relative to the workpiece to be polished is constructed;

[0023] Filling the characteristic points of the planar grooved abrasive tool protrusions to obtain the motion trajectory of the planar grooved abrasive tool protrusions relative to the workpiece to be ground and polished;

[0024] According to the motion trajectory of each protrusion of the flat grooved abrasive tool relative to the workpiece to be polished, the overlap between the surface of the workpiece to be polished and the protrusion of the flat grooved abrasive tool is processed by the pixel superposition principle;

[0025] The processed surface is meshed, and the pixels in each mesh unit are counted to obtain the pixel distribution of the processed surface.

[0026] Furthermore, the coefficient of variation includes:

[0027] Based on the pixel distribution of the processed surface, the average pixel value and standard deviation in each grid unit are calculated;

[0028] The coefficient of variation is the ratio of the standard deviation of pixels within the grid unit to the average value.

[0029] Furthermore, the initial processing parameters include:

[0030] The revolution speed of the flat grooved abrasive tool, the rotation speed of the workpiece to be ground and polished, and the position of the center of the workpiece to be ground and polished relative to the center of the flat grooved abrasive tool.

[0031] Advantages and positive effects of the present invention:

[0032] This application constructs a concave surface polishing prediction model to simulate the pixel distribution of the machined surface; and introduces the pixel distribution curve and coefficient of variation of the machined surface as evaluation indicators, so that the appropriate processing parameters can be selected before the start of polishing. It does not require a high-precision polishing machine, but only a general single-sided polishing machine is needed to effectively reduce the plane surface shape error of the target part, greatly reducing the equipment cost. By characterizing the material removal distribution trend through pixel superposition, the full-caliber material removal distribution trend of the workpiece to be polished under the selected plane grooved abrasive groove type and processing parameters can be obtained within 20 minutes, which is less time-consuming than the finite element method. According to the initial surface shape of the workpiece to be polished and the existing plane grooved abrasive groove type, the processing parameters can be adjusted in a targeted manner. Compared with the trial and error method, it consumes less time, avoids over-processing, and saves resources. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0034] Figure 1It is a flow chart of a polishing material removal control method based on pixel statistics in an embodiment of the present invention;

[0035] Figure 2 This is a physical picture of a fixed abrasive pad in an embodiment of the present invention;

[0036] Figure 3 It is a schematic diagram of pixel representation data of a physical image of a fixed abrasive pad in an embodiment of the present invention;

[0037] Figure 4 Schematic diagram of a concave pure copper thin plate pixel in Example 1;

[0038] Figure 5 Schematic diagram of the coordinate system of the single-sided swing polishing motion in Example 1;

[0039] Figure 6 The motion trajectory diagram of the protrusion of the flat grooved abrasive tool relative to the workpiece to be polished in Example 1;

[0040] Figure 7 This is a schematic diagram of the pixel superposition principle in Example 1;

[0041] Figure 8 Schematic diagram of the grid division of the workpiece to be polished in Example 1;

[0042] Fig. 9 This is a distribution trend diagram of material removal on the machined surface in Example 1;

[0043] Fig.10 Schematic diagram of the pixel distribution of the processing surface and the corresponding pixel distribution curve of the processing surface in Example 1;

[0044] Fig.11 Schematic diagram of the relationship between surface error and processing time in Example 1;

[0045] Fig.12 This is a schematic diagram of the polishing results of Example 1;

[0046] Fig.13 Schematic diagram of the front shape of a convex workpiece to be polished in Example 2;

[0047] Fig.14 Schematic diagram of the pixel distribution of the processing surface and the corresponding pixel distribution curve of the processing surface in Example 2;

[0048] Fig.15 This is a schematic diagram of the shape of a convex workpiece after polishing in Example 2. DETAILED DESCRIPTION

[0049] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0050] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0051] The present invention provides a grinding and polishing material removal control method based on pixel statistics, combined with Figure 1 The process diagram shown includes the following steps:

[0052] Acquire structural parameters of the planar grooved abrasive tool, set the pixels at the drainage groove of the planar grooved abrasive tool to zero, and establish pixel representation data of the planar grooved abrasive tool according to the structural parameters by using pixels to represent the shape of the protrusions on the planar grooved abrasive tool;

[0053] The polishing strategy of the workpiece to be polished is selected based on the initial surface shape and structural parameters of the workpiece to be polished, including:

[0054] 1) When the initial surface shape of the workpiece to be polished is a convex surface, preset the processing parameters and select the first eccentricity as the preset eccentricity;

[0055] The first preset eccentricity is greater than the difference between the radius of the flat grooved grinding tool and the radius of the workpiece to be ground and polished;

[0056] Based on the preset processing parameters and the pixel characterization data of the flat grooved abrasive tool, a material removal distribution trend prediction model for the convex workpiece to be ground and polished is constructed with blue pixels in the RGB color mode, and the pixel distribution of the machined surface is obtained to simulate the material removal distribution trend of the workpiece surface to be ground and polished under the current processing parameters, including:

[0057] According to the protrusion shape of the flat grooved abrasive tool, the characteristic points of the protrusion of the flat grooved abrasive tool are selected;

[0058] Combined with the preset processing parameters, the motion equation of the raised feature points of the plane grooved abrasive tool relative to the workpiece to be polished is constructed;

[0059] Filling the characteristic points of the planar grooved abrasive tool protrusions to obtain the motion trajectory of the planar grooved abrasive tool protrusions relative to the workpiece to be ground and polished;

[0060] According to the motion trajectory of each protrusion of the flat grooved abrasive tool relative to the workpiece to be polished, the overlap between the surface of the workpiece to be polished and the protrusion of the flat grooved abrasive tool is processed by the pixel superposition principle;

[0061] Specifically: Based on the processing parameters and the pixel characterization data of the flat grooved abrasive tool, the position distribution of the protrusions of the flat grooved abrasive tool relative to the workpiece to be polished is simulated by the pixel statistical method. The more times the protrusions overlap, the higher the pixel, and the greater the material removal. The shape of the protrusions of the flat grooved abrasive tool is characterized by pixels, and the relative position of the protrusions on the processing surface of the workpiece to be polished at different processing times is calculated. If there is a protrusion overlap somewhere on the surface of the workpiece to be polished, pixel superposition is performed. The higher the pixel, the higher the material removal amount of the workpiece to be polished. Finally, the material removal distribution trend of the full-diameter surface of the workpiece to be polished is obtained.

[0062] The processed surface is meshed, and the pixels in each mesh unit are counted to obtain the pixel distribution of the processed surface.

[0063] The preset judgment conditions for surface processing pixel distribution are: pixels are concentrated within a circle of specified diameter;

[0064] If the pixel distribution of the processed surface does not meet the preset judgment condition, the preset processing parameters are adjusted until the pixel distribution of the processed surface meets the preset judgment condition.

[0065] 2) When the initial surface shape of the workpiece to be polished is a concave shape, preset the processing parameters and select the second eccentricity as the preset eccentricity;

[0066] The second preset eccentricity is not less than the radius of the workpiece to be ground and polished, and the second preset eccentricity is not greater than the difference between the radius of the flat grooved grinding tool and the radius of the flat grooved grinding tool.

[0067] Based on the preset processing parameters and the pixel characterization data of the flat grooved abrasive tool, a material removal distribution trend prediction model of the concave workpiece to be polished is constructed with pixels, and the pixel distribution of the machined surface is obtained to simulate the material removal distribution trend of the workpiece surface to be polished under the current processing parameters, including:

[0068] According to the protrusion shape of the flat grooved abrasive tool, the characteristic points of the protrusion of the flat grooved abrasive tool are selected;

[0069] Combined with the preset processing parameters, the motion equation of the raised feature points of the plane grooved abrasive tool relative to the workpiece to be polished is constructed;

[0070] Filling the characteristic points of the planar grooved abrasive tool protrusions to obtain the motion trajectory of the planar grooved abrasive tool protrusions relative to the workpiece to be ground and polished;

[0071] According to the motion trajectory of each protrusion of the flat grooved abrasive tool relative to the workpiece to be polished, the overlap between the surface of the workpiece to be polished and the protrusion of the flat grooved abrasive tool is processed by the pixel superposition principle;

[0072] Specifically: Based on the processing parameters and the pixel characterization data of the flat grooved abrasive tool, the position distribution of the protrusions of the flat grooved abrasive tool relative to the workpiece to be polished is simulated by the pixel statistical method. The more times the protrusions overlap, the higher the pixel, and the greater the material removal. The shape of the protrusions of the flat grooved abrasive tool is characterized by pixels, and the relative position of the protrusions on the processing surface of the workpiece to be polished at different processing times is calculated. If there is a protrusion overlap somewhere on the surface of the workpiece to be polished, pixel superposition is performed. The higher the pixel, the higher the material removal amount of the workpiece to be polished. Finally, the material removal distribution trend of the full-diameter surface of the workpiece to be polished is obtained.

[0073] Divide the machined surface into grids, count the pixels in each grid unit, and obtain the pixel distribution of the machined surface. The pixel distribution of the machined surface is expected to be: pixels are evenly distributed;

[0074] When the pixel distribution of the processed surface meets expectations, the coefficient of variation is calculated based on the pixel distribution of the processed surface; if the pixel distribution of the processed surface does not meet expectations, the processing parameters are adjusted until the pixel distribution of the processed surface meets expectations.

[0075] Through the coefficient of variation method, it is determined whether the processing parameters meet the processing requirements within the preset time;

[0076] After the pixels on the surface of the workpiece to be polished are gridded and the pixels in each cell are counted, the average value μ and standard deviation σ of the pixels in the cell are calculated;

[0077] Calculate the coefficient of variation CV = σ / μ; the lower the coefficient of variation, the more uniform the pixel distribution, and thus the more uniform the material removal in the contact area between the workpiece to be polished and the flat grooved abrasive tool.

[0078] When the coefficient of variation meets the preset threshold, processing is performed with the preset processing parameters; if the coefficient of variation does not reach the preset threshold, the processing parameters are changed to simulate the material removal distribution trend again until the coefficient of variation reaches the preset threshold.

[0079] The beneficial effects of the method of the present invention are further described with specific examples: Specific embodiment 1:

[0081] In this embodiment, the flat grooved abrasive tool is a diamond-bonded abrasive pad (particle size 15-25 μm), the protrusion size of the abrasive pad is 2×2×0.5 mm, and the gap between the protrusions is about 1 mm. Figure 2 As shown. The pixel model of the flat grooved abrasive protrusion is established, as shown Figure 3 shown.

[0082] The workpiece to be polished is a pure copper sheet with a concave surface (Φ100mm×3mm, PV=28.6μm). Its pixel representation is as follows: Figure 4 shown.

[0083] 1. The range of eccentricity is: r2≤e≤r1-r2, the radius of the processing polishing pad r1=100mm, the radius of the workpiece to be polished r2=50mm; therefore, the second eccentricity is e=50mm. And set the initial processing parameters, the schematic diagram of the single-sided swing polishing motion coordinate system is as follows Figure 5 shown.

[0084] 2. The top view contour of the convex is approximately square. Select its four vertices as feature points and establish the motion equation of the convex feature points relative to the workpiece to be polished:

[0085]

[0086] w 1 =30rpm;% polishing pad speed

[0087] w 2 =39rpm;% Rotation speed of the workpiece to be polished

[0088] x s =-150mm;% X-axis coordinate of swing arm axis

[0089] y s =-150mm;% Y-axis coordinate of the swing arm axis

[0090] r 3 =195mm; % Distance between the swing arm axis and the center of the workpiece to be polished

[0091]

[0092] 3. Fill the four vertices to obtain the motion trajectory of the flat grooved abrasive tool protrusion relative to the workpiece to be polished, such as Figure 6 shown.

[0093] 4. Combined with the motion trajectory of each flat grooved abrasive tool protrusion relative to the workpiece to be polished, the overlapping parts of the protrusions on the surface of the workpiece to be polished are processed according to the principle of pixel superposition. That is, the more frequently the flat grooved abrasive tool protrusion appears in a certain area of ​​the workpiece surface to be polished, the more times it is superimposed, and the higher the pixel. Figure 7 shown.

[0094] 5. Grid the surface of the workpiece to be polished, such as Figure 8As shown; the material removal distribution trend within the preset processing time is simulated by the pixel method to obtain the material removal distribution trend diagram of the processing surface, as shown in Fig. 9 shown.

[0095] 6. Count the pixels in the grid and obtain the pixel distribution of the processed surface, such as Fig.10 shown.

[0096] 7. It can be seen that the material removal of the workpiece surface to be polished is uniform in the contact area, which can ensure that the high points on the edge of the concave surface will be removed first. Therefore, in this embodiment, the pixel distribution of the machined surface meets expectations.

[0097] 8. Use the coefficient of variation method to determine whether the processing parameters meet the processing requirements within the preset time;

[0098] After the pixels on the surface of the workpiece to be polished are gridded and the pixels in each cell are counted, the average value μ and standard deviation σ of the pixels in the cell are calculated;

[0099] Calculate the coefficient of variation CV = σ / μ; the lower the coefficient of variation, the more uniform the pixel distribution, and thus the more uniform the material removal in the contact area between the workpiece to be polished and the flat grooved abrasive tool.

[0100] When the coefficient of variation meets the preset threshold, processing is performed with the preset processing parameters; if the coefficient of variation does not reach the preset threshold, the processing parameters are changed to simulate the material removal distribution trend again until the coefficient of variation reaches the preset threshold. Fig.10 μ = 2449.9; σ = 45.4; the coefficient of variation is CV = 0.0185, which is much lower than 0.1

[0101] The polishing results of this embodiment are as follows Fig.11 As shown in the figure, the edge high points are effectively reduced, and the surface error gradually decreases over time. After 300 minutes of processing, the surface error is reduced from PV 28.6μm to PV 13.7μm, a decrease of 52.1%; therefore, the surface error is effectively reduced. Specific embodiment 2:

[0103] The fixed abrasive pad in Example 1 is still used as a flat grooved abrasive tool;

[0104] The workpieces to be polished are three convex pure copper sheets (Φ100mm×3mm);

[0105] For convex shapes, the fixed eccentricity leakage edge grinding and polishing method is used for processing. The preset processing parameters are: the revolution speed of the flat grooved abrasive tool w 1 =30rpm, the rotation speed of the workpiece to be polished w 2 =39rpm;

[0106] Eccentricity range: e>r1 -r 2 (Polishing pad radius r 1 =100mm, radius of workpiece to be polished r 2 =50mm), in order to test the effect of the present invention, in this embodiment, the second eccentric moment is set to e=60 / 70 / 80mm, so that the leakage edge distance l=10 / 20 / 30mm, and the polishing simulation is performed respectively;

[0107] The pixel distribution of the machined surface during polishing simulation and the pixel distribution curve of the machined surface are shown in the figure below. Fig.14 As shown in the figure, the material removal amount is concentrated in the non-edge area. The larger the edge distance, the higher the difference between the material removal amount in the non-edge area and the leaking edge area. Therefore, the judgment condition of the pixel distribution of the processing surface is met. Polishing is performed with the preset processing parameters.

[0108] Then, it was verified through experiments. Fig.13 is a schematic diagram before processing; the result after processing is as follows Fig.15 As shown in the figure, it is proved that the method can effectively reduce the surface error of the workpiece to be polished: when the missing edge distance l = 10mm, the surface error is reduced from PV = 23.3μm to PV = 7.2μm, a reduction of 69.1%; when the missing edge distance l = 20mm, the surface error is reduced from PV = 22.0μm to PV = 3.6μm, a reduction of 83.6%; when the missing edge distance l = 30mm, the surface error is reduced from PV = 17.4μm to PV = 6.5μm, a reduction of 62.6%.

[0109] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A polishing material removal control method based on pixel statistics, characterized in that: include: Obtaining the structural parameters of the flat grooved abrasive tool, as well as the initial surface shape and structural parameters of the workpiece to be ground and polished; The pixels at the drainage groove of the flat grooved abrasive tool are set to zero, the shape of the protrusions on the flat grooved abrasive tool is characterized by the pixels, and the pixel characterization data of the flat grooved abrasive tool is established in combination with the structural parameters of the flat grooved abrasive tool; Select the corresponding polishing strategy according to the initial surface shape and structural parameters of the workpiece to be polished, including: When the initial surface shape of the workpiece to be polished is a convex surface, the processing parameters are preset, and the first eccentricity is selected as the preset eccentricity; Based on the preset processing parameters and the pixel characterization data of the flat grooved abrasive tool, a material removal distribution trend prediction model of the convex surface workpiece to be ground and polished is constructed with pixels, and the pixel distribution of the machined surface is obtained to simulate the material removal distribution trend of the surface of the workpiece to be ground and polished under the current processing parameters; Selecting processing parameters that meet the preset conditions of pixel distribution on the processing surface to complete grinding and polishing; When the initial surface shape of the workpiece to be polished is a concave shape, the processing parameters are preset, and the second eccentricity is selected as the preset eccentricity; Based on the preset processing parameters and the pixel characterization data of the flat grooved abrasive tool, a material removal distribution trend prediction model of the concave workpiece to be ground and polished is constructed with pixels, and the pixel distribution of the machined surface is obtained to simulate the material removal distribution trend of the surface of the workpiece to be ground and polished under the current processing parameters; The machining parameters that meet both the preset conditions of the pixel distribution of the machining surface and the preset threshold of the coefficient of variation are selected to complete the grinding and polishing.

2. According to the pixel statistics-based polishing material removal control method of claim 1, it is characterized in that: The first preset eccentricity is greater than the difference between the radius of the flat grooved grinding tool and the radius of the workpiece to be ground and polished.

3. The method for controlling polishing material removal based on pixel statistics according to claim 1, characterized in that: The second preset eccentricity is greater than or equal to the radius of the workpiece to be ground and polished, and the second preset eccentricity is less than or equal to the difference between the radius of the flat grooved grinding tool and the radius of the workpiece to be ground and polished.

4. The method for controlling polishing material removal based on pixel statistics according to claim 1, characterized in that: The method of constructing a material removal distribution trend prediction model of a convex workpiece to be ground and polished based on pixels based on preset processing parameters combined with pixel characterization data of a flat grooved abrasive tool, and obtaining pixel distribution of a processing surface to simulate the material removal distribution trend of the surface of the workpiece to be ground and polished under current processing parameters includes: According to the protrusion shape of the flat grooved abrasive tool, the characteristic points of the protrusion of the flat grooved abrasive tool are selected; Combined with the preset processing parameters, the motion equation of the raised feature points of the plane grooved abrasive tool relative to the workpiece to be polished is constructed; Filling the characteristic points of the planar grooved abrasive tool protrusions to obtain the motion trajectory of the planar grooved abrasive tool protrusions relative to the workpiece to be ground and polished; According to the motion trajectory of each protrusion of the flat grooved abrasive tool relative to the workpiece to be polished, the overlap between the surface of the workpiece to be polished and the protrusion of the flat grooved abrasive tool is processed by the pixel superposition principle; The processed surface is meshed, and the pixels in each mesh unit are counted to obtain the pixel distribution of the processed surface.

5. The method for controlling polishing material removal based on pixel statistics according to claim 1, characterized in that: The coefficient of variation includes: Based on the pixel distribution of the processed surface, the average pixel value and standard deviation in each grid unit are calculated; The coefficient of variation is the ratio of the standard deviation of pixels within the grid unit to the average value.

6. The method for controlling polishing material removal based on pixel statistics according to claim 1, characterized in that: The initial processing parameters include: The revolution speed of the flat grooved abrasive tool, the rotation speed of the workpiece to be ground and polished, and the position of the center of the workpiece to be ground and polished relative to the center of the flat grooved abrasive tool.

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